JPS5766632A - Semiconductor integrated circuit device - Google Patents
Semiconductor integrated circuit deviceInfo
- Publication number
- JPS5766632A JPS5766632A JP55141740A JP14174080A JPS5766632A JP S5766632 A JPS5766632 A JP S5766632A JP 55141740 A JP55141740 A JP 55141740A JP 14174080 A JP14174080 A JP 14174080A JP S5766632 A JPS5766632 A JP S5766632A
- Authority
- JP
- Japan
- Prior art keywords
- marks
- mask alignment
- integrated circuit
- semiconductor integrated
- circuit device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 title abstract 2
- 238000005530 etching Methods 0.000 abstract 1
- 239000008188 pellet Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Abstract
PURPOSE:To facilitate mask alignment and to shorten the processing time of mask alignment by using two reference marks in a semiconductor integrated circuit device forming a pellet by one wafer. CONSTITUTION:First of all, reference marks 17, 18 forming at least two aligned marks are arranged on the element pattern 15 of a mask 13. And two reference marks 19, 20 are formed on a wafer 12 etching at the initial mask alignment. Furthermore, the marks 19, 20 at the wafer 12 side are coincided with the marks 17, 18 at the mask 13 side on and after the next mask alignment and mask alignment is performed under this state.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP55141740A JPS5766632A (en) | 1980-10-09 | 1980-10-09 | Semiconductor integrated circuit device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP55141740A JPS5766632A (en) | 1980-10-09 | 1980-10-09 | Semiconductor integrated circuit device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5766632A true JPS5766632A (en) | 1982-04-22 |
Family
ID=15299094
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP55141740A Pending JPS5766632A (en) | 1980-10-09 | 1980-10-09 | Semiconductor integrated circuit device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5766632A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101250786B1 (en) | 2006-06-30 | 2013-04-04 | 엘지디스플레이 주식회사 | Method of scan operating in semiconductor equipment |
-
1980
- 1980-10-09 JP JP55141740A patent/JPS5766632A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101250786B1 (en) | 2006-06-30 | 2013-04-04 | 엘지디스플레이 주식회사 | Method of scan operating in semiconductor equipment |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPS53111280A (en) | Mask or wafer for production of semiconductor elements and device for aligning these | |
JPS5766632A (en) | Semiconductor integrated circuit device | |
JPS53114685A (en) | Manufacture for semiconductor device | |
JPS5425169A (en) | Matching method for photo mask against semiconductor wafer | |
JPS56140626A (en) | Manufacture of semiconductor device | |
JPS51117588A (en) | Manufacturing method of semiconductor equipment | |
JPS5290275A (en) | Production of semiconductor device | |
JPS5633841A (en) | Manufacture of semiconductor device | |
JPS52150983A (en) | Production of semiconductor device | |
JPS5345982A (en) | Manufacture of semiconductor device | |
JPS5662318A (en) | Semiconductor device and manufacturing of thereof | |
JPS534476A (en) | Mask alignment method to semiconductor substrate | |
JPS5412268A (en) | Production of semiconductor device | |
JPS52106681A (en) | Etching method | |
JPS55124230A (en) | Forming method of pattern | |
JPS5438772A (en) | Semiconductor element for testing | |
JPS5251872A (en) | Production of semiconductor device | |
JPS539488A (en) | Production of semiconductor device | |
JPS52153668A (en) | Photo mask of semiconductor integrated circuit | |
JPS5267580A (en) | Semiconductor integrated circuit and manufacturing method thereof | |
JPS53112673A (en) | Mask alignment method in semiconductor device manufacturing process and photo mask used for its execution | |
JPS52103963A (en) | Semiconductor device and its manufacturing method | |
JPS52125278A (en) | Preparation of semiconductor device | |
JPS5286087A (en) | Manufacture of semiconductor device | |
JPS5543843A (en) | Semiconductor wafer and exposure mask for process thereof |