JPS51117588A - Manufacturing method of semiconductor equipment - Google Patents

Manufacturing method of semiconductor equipment

Info

Publication number
JPS51117588A
JPS51117588A JP4218475A JP4218475A JPS51117588A JP S51117588 A JPS51117588 A JP S51117588A JP 4218475 A JP4218475 A JP 4218475A JP 4218475 A JP4218475 A JP 4218475A JP S51117588 A JPS51117588 A JP S51117588A
Authority
JP
Japan
Prior art keywords
manufacturing
semiconductor equipment
semiconductor
equipment
accommodate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP4218475A
Other languages
Japanese (ja)
Other versions
JPS5753983B2 (en
Inventor
Yoshinobu Monma
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP4218475A priority Critical patent/JPS51117588A/en
Publication of JPS51117588A publication Critical patent/JPS51117588A/en
Publication of JPS5753983B2 publication Critical patent/JPS5753983B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
    • H01L27/10—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a repetitive configuration
    • H01L27/118—Masterslice integrated circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Design And Manufacture Of Integrated Circuits (AREA)

Abstract

PURPOSE:Manufacturing method of semiconductor equipment that can accommodate more of integrated circuits of different functions on a semiconductor wafer.
JP4218475A 1975-04-09 1975-04-09 Manufacturing method of semiconductor equipment Granted JPS51117588A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4218475A JPS51117588A (en) 1975-04-09 1975-04-09 Manufacturing method of semiconductor equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4218475A JPS51117588A (en) 1975-04-09 1975-04-09 Manufacturing method of semiconductor equipment

Publications (2)

Publication Number Publication Date
JPS51117588A true JPS51117588A (en) 1976-10-15
JPS5753983B2 JPS5753983B2 (en) 1982-11-16

Family

ID=12628903

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4218475A Granted JPS51117588A (en) 1975-04-09 1975-04-09 Manufacturing method of semiconductor equipment

Country Status (1)

Country Link
JP (1) JPS51117588A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0005723A1 (en) * 1978-05-25 1979-12-12 International Business Machines Corporation Large scale integrated circuit and method of fabricating the same
FR2443185A1 (en) * 1978-11-30 1980-06-27 Ibm TOPOLOGY OF INTEGRATED SEMICONDUCTOR CIRCUITS AND METHOD FOR OBTAINING THIS TOPOLOGY
JPH04218943A (en) * 1991-04-19 1992-08-10 Toshiba Corp Manufacture of large-scale integrated circuit device
JPH10150083A (en) * 1988-05-16 1998-06-02 Glenn J Leedy Manufacture of integrated circuit and testing method

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0005723A1 (en) * 1978-05-25 1979-12-12 International Business Machines Corporation Large scale integrated circuit and method of fabricating the same
FR2443185A1 (en) * 1978-11-30 1980-06-27 Ibm TOPOLOGY OF INTEGRATED SEMICONDUCTOR CIRCUITS AND METHOD FOR OBTAINING THIS TOPOLOGY
JPH10150083A (en) * 1988-05-16 1998-06-02 Glenn J Leedy Manufacture of integrated circuit and testing method
JPH04218943A (en) * 1991-04-19 1992-08-10 Toshiba Corp Manufacture of large-scale integrated circuit device

Also Published As

Publication number Publication date
JPS5753983B2 (en) 1982-11-16

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