JPS5545501A - Soldering tool - Google Patents

Soldering tool

Info

Publication number
JPS5545501A
JPS5545501A JP11651278A JP11651278A JPS5545501A JP S5545501 A JPS5545501 A JP S5545501A JP 11651278 A JP11651278 A JP 11651278A JP 11651278 A JP11651278 A JP 11651278A JP S5545501 A JPS5545501 A JP S5545501A
Authority
JP
Japan
Prior art keywords
circuit substrate
parts
solder
jet
holding plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11651278A
Other languages
Japanese (ja)
Inventor
Masakazu Yajima
Nobuo Inoue
Takeshi Komatsu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP11651278A priority Critical patent/JPS5545501A/en
Publication of JPS5545501A publication Critical patent/JPS5545501A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE: To prevent the solder bump of part leads owing to wavy disturbance of jet solder by providing wave plowing plates to the substrate-holding plate provided with moving rollers.
CONSTITUTION: A circuit substrate mounted with parts on a circuit substrate holding plate 1 is held in a positioning holding groove 5. Next, it is run and moved on the track of a soldering device by rollers 2. At this time, the wavy disturbance of the solder jet of a soldering bath is prevented by wave plowing plates 3, whereby the parts mounted on the circuit substrate are soldered without the production of any solder bump of the lead ends of the parts.
COPYRIGHT: (C)1980,JPO&Japio
JP11651278A 1978-09-25 1978-09-25 Soldering tool Pending JPS5545501A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11651278A JPS5545501A (en) 1978-09-25 1978-09-25 Soldering tool

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11651278A JPS5545501A (en) 1978-09-25 1978-09-25 Soldering tool

Publications (1)

Publication Number Publication Date
JPS5545501A true JPS5545501A (en) 1980-03-31

Family

ID=14688973

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11651278A Pending JPS5545501A (en) 1978-09-25 1978-09-25 Soldering tool

Country Status (1)

Country Link
JP (1) JPS5545501A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11634354B2 (en) 2021-06-18 2023-04-25 Corning Incorporated Colored glass articles having improved mechanical durability
US11655181B1 (en) 2021-06-18 2023-05-23 Corning Incorporated Colored glass articles having improved mechanical durability
US11802072B2 (en) 2021-06-18 2023-10-31 Corning Incorporated Gold containing silicate glass

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11634354B2 (en) 2021-06-18 2023-04-25 Corning Incorporated Colored glass articles having improved mechanical durability
US11655181B1 (en) 2021-06-18 2023-05-23 Corning Incorporated Colored glass articles having improved mechanical durability
US11667562B2 (en) 2021-06-18 2023-06-06 Corning Incorporated Colored glass articles having improved mechanical durability
US11802072B2 (en) 2021-06-18 2023-10-31 Corning Incorporated Gold containing silicate glass
US11834370B2 (en) 2021-06-18 2023-12-05 Corning Incorporated Colored glass articles having improved mechanical durability

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