JPS52155051A - Production of semiconductor device - Google Patents

Production of semiconductor device

Info

Publication number
JPS52155051A
JPS52155051A JP7236676A JP7236676A JPS52155051A JP S52155051 A JPS52155051 A JP S52155051A JP 7236676 A JP7236676 A JP 7236676A JP 7236676 A JP7236676 A JP 7236676A JP S52155051 A JPS52155051 A JP S52155051A
Authority
JP
Japan
Prior art keywords
semiconductor device
production
evade
damaging
contamination
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP7236676A
Other languages
Japanese (ja)
Other versions
JPS5950095B2 (en
Inventor
Kenzo Hatada
Kosei Kajiwara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP51072366A priority Critical patent/JPS5950095B2/en
Publication of JPS52155051A publication Critical patent/JPS52155051A/en
Publication of JPS5950095B2 publication Critical patent/JPS5950095B2/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/11—Manufacturing methods

Landscapes

  • Electrodes Of Semiconductors (AREA)

Abstract

PURPOSE: To evade the contamination and damaging of the circuit elements and wiring patterns of a semiconductor device having metal bumps by performing lift-off using an organic solvent without using strong acid or strong alkali solutions.
COPYRIGHT: (C)1977,JPO&Japio
JP51072366A 1976-06-18 1976-06-18 Manufacturing method of semiconductor device Expired JPS5950095B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP51072366A JPS5950095B2 (en) 1976-06-18 1976-06-18 Manufacturing method of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP51072366A JPS5950095B2 (en) 1976-06-18 1976-06-18 Manufacturing method of semiconductor device

Publications (2)

Publication Number Publication Date
JPS52155051A true JPS52155051A (en) 1977-12-23
JPS5950095B2 JPS5950095B2 (en) 1984-12-06

Family

ID=13487229

Family Applications (1)

Application Number Title Priority Date Filing Date
JP51072366A Expired JPS5950095B2 (en) 1976-06-18 1976-06-18 Manufacturing method of semiconductor device

Country Status (1)

Country Link
JP (1) JPS5950095B2 (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58102542A (en) * 1981-12-15 1983-06-18 Seiko Instr & Electronics Ltd Manufacture of bump electrode
JPH01132139A (en) * 1987-11-18 1989-05-24 Casio Comput Co Ltd Bump electrode structure of semiconductor device and manufacture thereof
JPH01135046A (en) * 1987-11-20 1989-05-26 Casio Comput Co Ltd Formation of external electrode in electronic part
JPH01135045A (en) * 1987-11-20 1989-05-26 Casio Comput Co Ltd Method of formation of external electrode of electronic part

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58102542A (en) * 1981-12-15 1983-06-18 Seiko Instr & Electronics Ltd Manufacture of bump electrode
JPS628943B2 (en) * 1981-12-15 1987-02-25 Seiko Denshi Kogyo Kk
JPH01132139A (en) * 1987-11-18 1989-05-24 Casio Comput Co Ltd Bump electrode structure of semiconductor device and manufacture thereof
JPH01135046A (en) * 1987-11-20 1989-05-26 Casio Comput Co Ltd Formation of external electrode in electronic part
JPH01135045A (en) * 1987-11-20 1989-05-26 Casio Comput Co Ltd Method of formation of external electrode of electronic part

Also Published As

Publication number Publication date
JPS5950095B2 (en) 1984-12-06

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