JPS52155056A - Production of semiconductor device - Google Patents

Production of semiconductor device

Info

Publication number
JPS52155056A
JPS52155056A JP7237176A JP7237176A JPS52155056A JP S52155056 A JPS52155056 A JP S52155056A JP 7237176 A JP7237176 A JP 7237176A JP 7237176 A JP7237176 A JP 7237176A JP S52155056 A JPS52155056 A JP S52155056A
Authority
JP
Japan
Prior art keywords
production
semiconductor device
films
bumps
damaging
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7237176A
Other languages
Japanese (ja)
Inventor
Kenzo Hatada
Kosei Kajiwara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP7237176A priority Critical patent/JPS52155056A/en
Publication of JPS52155056A publication Critical patent/JPS52155056A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/11—Manufacturing methods

Abstract

PURPOSE: To facilitate the production of bumps and prevent the contamination and damaging of circuit elements and metal electrode wiring by removing the photosensitive resin films and unnecessary metal films with an organic solvent such as acetone without using acid and alkali solutions.
COPYRIGHT: (C)1977,JPO&Japio
JP7237176A 1976-06-18 1976-06-18 Production of semiconductor device Pending JPS52155056A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7237176A JPS52155056A (en) 1976-06-18 1976-06-18 Production of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7237176A JPS52155056A (en) 1976-06-18 1976-06-18 Production of semiconductor device

Publications (1)

Publication Number Publication Date
JPS52155056A true JPS52155056A (en) 1977-12-23

Family

ID=13487372

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7237176A Pending JPS52155056A (en) 1976-06-18 1976-06-18 Production of semiconductor device

Country Status (1)

Country Link
JP (1) JPS52155056A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5769761A (en) * 1980-10-17 1982-04-28 Citizen Watch Co Ltd Manufacture of semiconductor device
JPS6158258A (en) * 1984-08-28 1986-03-25 Sharp Corp Manufacture of semiconductor device
US5310699A (en) * 1984-08-28 1994-05-10 Sharp Kabushiki Kaisha Method of manufacturing a bump electrode

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5769761A (en) * 1980-10-17 1982-04-28 Citizen Watch Co Ltd Manufacture of semiconductor device
JPS6158258A (en) * 1984-08-28 1986-03-25 Sharp Corp Manufacture of semiconductor device
US5310699A (en) * 1984-08-28 1994-05-10 Sharp Kabushiki Kaisha Method of manufacturing a bump electrode

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