JPS5581095A - Ultra-fine hole processing method - Google Patents

Ultra-fine hole processing method

Info

Publication number
JPS5581095A
JPS5581095A JP15266278A JP15266278A JPS5581095A JP S5581095 A JPS5581095 A JP S5581095A JP 15266278 A JP15266278 A JP 15266278A JP 15266278 A JP15266278 A JP 15266278A JP S5581095 A JPS5581095 A JP S5581095A
Authority
JP
Japan
Prior art keywords
work
plural
laser beams
optical element
acousto
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP15266278A
Other languages
Japanese (ja)
Inventor
Akinori Mizuno
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ricoh Co Ltd
Original Assignee
Ricoh Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ricoh Co Ltd filed Critical Ricoh Co Ltd
Priority to JP15266278A priority Critical patent/JPS5581095A/en
Publication of JPS5581095A publication Critical patent/JPS5581095A/en
Pending legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B43WRITING OR DRAWING IMPLEMENTS; BUREAU ACCESSORIES
    • B43LARTICLES FOR WRITING OR DRAWING UPON; WRITING OR DRAWING AIDS; ACCESSORIES FOR WRITING OR DRAWING
    • B43L23/00Sharpeners for pencils or leads
    • B43L23/08Sharpeners for pencils or leads in which the pencils or leads are sharpened mainly by rotational movement against cutting blades
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B43WRITING OR DRAWING IMPLEMENTS; BUREAU ACCESSORIES
    • B43LARTICLES FOR WRITING OR DRAWING UPON; WRITING OR DRAWING AIDS; ACCESSORIES FOR WRITING OR DRAWING
    • B43L13/00Drawing instruments, or writing or drawing appliances or accessories not otherwise provided for
    • B43L13/02Draughting machines or drawing devices for keeping parallelism
    • B43L13/022Draughting machines or drawing devices for keeping parallelism automatic
    • B43L13/024Drawing heads therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Automation & Control Theory (AREA)
  • Laser Beam Processing (AREA)

Abstract

PURPOSE:To form a plurality of ultra-fine holes of accurate pitch simultaneously in the work in a short processing time, by using plural laser beams split by multi- frequency driving acousto-optical element. CONSTITUTION:Laser beams 5 (a flux of parallel lights) from an oscillator 4 are radiated to a multi-frequency driving acousto-optical element 7 through a lens 6, and a work 8 is placed in the focal position of the element 7. On the other hand, plural high frequencies (f1-fn) from a high frequency driving circuit 9 are introduced into the element 7 through mixer 10 and amplifier 11, and the laser beams 5 entering the element 7 are split into plural beams 12 (the 0-order light 13 is shielded from the work 8 by a stopper 14). In said apparatus, a plurality of holes may be worked out simultaneously, and the pitch of holes can be controlled by electrically selecting the high frequency applied to the acousto-optical element 7, so that extreme accuracy and high precision may be achieved.
JP15266278A 1978-12-12 1978-12-12 Ultra-fine hole processing method Pending JPS5581095A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15266278A JPS5581095A (en) 1978-12-12 1978-12-12 Ultra-fine hole processing method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15266278A JPS5581095A (en) 1978-12-12 1978-12-12 Ultra-fine hole processing method

Publications (1)

Publication Number Publication Date
JPS5581095A true JPS5581095A (en) 1980-06-18

Family

ID=15545334

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15266278A Pending JPS5581095A (en) 1978-12-12 1978-12-12 Ultra-fine hole processing method

Country Status (1)

Country Link
JP (1) JPS5581095A (en)

Cited By (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003048093A (en) * 2001-08-03 2003-02-18 Matsushita Electric Ind Co Ltd Device and method for laser beam machining
EP1579944A3 (en) * 1998-09-08 2006-06-07 Hell Gravure Systems GmbH Laser radiation source
JP2008049383A (en) * 2006-08-28 2008-03-06 Sumitomo Heavy Ind Ltd Beam irradiation method and beam irradiation apparatus
US7425471B2 (en) 2004-06-18 2008-09-16 Electro Scientific Industries, Inc. Semiconductor structure processing using multiple laser beam spots spaced on-axis with cross-axis offset
US7435927B2 (en) 2004-06-18 2008-10-14 Electron Scientific Industries, Inc. Semiconductor link processing using multiple laterally spaced laser beam spots with on-axis offset
US7629234B2 (en) 2004-06-18 2009-12-08 Electro Scientific Industries, Inc. Semiconductor structure processing using multiple laterally spaced laser beam spots with joint velocity profiling
US7629555B2 (en) 2001-06-13 2009-12-08 Orbotech Ltd Multiple beam micro-machining system and method
US7633034B2 (en) 2004-06-18 2009-12-15 Electro Scientific Industries, Inc. Semiconductor structure processing using multiple laser beam spots overlapping lengthwise on a structure
US7675002B2 (en) * 2005-12-15 2010-03-09 Disco Corporation Laser beam processing machine
US7687740B2 (en) 2004-06-18 2010-03-30 Electro Scientific Industries, Inc. Semiconductor structure processing using multiple laterally spaced laser beam spots delivering multiple blows
US7767930B2 (en) * 2005-10-03 2010-08-03 Aradigm Corporation Method and system for LASER machining
US7935941B2 (en) 2004-06-18 2011-05-03 Electro Scientific Industries, Inc. Semiconductor structure processing using multiple laser beam spots spaced on-axis on non-adjacent structures
US8148211B2 (en) 2004-06-18 2012-04-03 Electro Scientific Industries, Inc. Semiconductor structure processing using multiple laser beam spots spaced on-axis delivered simultaneously
US8193468B2 (en) 2001-03-29 2012-06-05 Gsi Group Corporation Methods and systems for precisely relatively positioning a waist of a pulsed laser beam and method and system for controlling energy delivered to a target structure
US8238007B2 (en) 2001-02-16 2012-08-07 Electro Scientific Industries, Inc. On-the-fly laser beam path error correction for specimen target location processing
US8383982B2 (en) 2004-06-18 2013-02-26 Electro Scientific Industries, Inc. Methods and systems for semiconductor structure processing using multiple laser beam spots
US8497450B2 (en) 2001-02-16 2013-07-30 Electro Scientific Industries, Inc. On-the fly laser beam path dithering for enhancing throughput

Cited By (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1579944A3 (en) * 1998-09-08 2006-06-07 Hell Gravure Systems GmbH Laser radiation source
EP1623789A3 (en) * 1998-09-08 2006-07-12 Hell Gravure Systems GmbH Source of laser radiation
US8497450B2 (en) 2001-02-16 2013-07-30 Electro Scientific Industries, Inc. On-the fly laser beam path dithering for enhancing throughput
US8238007B2 (en) 2001-02-16 2012-08-07 Electro Scientific Industries, Inc. On-the-fly laser beam path error correction for specimen target location processing
US8193468B2 (en) 2001-03-29 2012-06-05 Gsi Group Corporation Methods and systems for precisely relatively positioning a waist of a pulsed laser beam and method and system for controlling energy delivered to a target structure
US7642484B2 (en) 2001-06-13 2010-01-05 Orbotech Ltd Multiple beam micro-machining system and method
US7629555B2 (en) 2001-06-13 2009-12-08 Orbotech Ltd Multiple beam micro-machining system and method
KR100990300B1 (en) * 2001-06-13 2010-10-26 오르보테크 엘티디. Multi-beam micro-machining system and method
US7633036B2 (en) 2001-06-13 2009-12-15 Orbotech Ltd Micro-machining system employing a two stage beam steering mechanism
JP2003048093A (en) * 2001-08-03 2003-02-18 Matsushita Electric Ind Co Ltd Device and method for laser beam machining
US7435927B2 (en) 2004-06-18 2008-10-14 Electron Scientific Industries, Inc. Semiconductor link processing using multiple laterally spaced laser beam spots with on-axis offset
US7687740B2 (en) 2004-06-18 2010-03-30 Electro Scientific Industries, Inc. Semiconductor structure processing using multiple laterally spaced laser beam spots delivering multiple blows
US7633034B2 (en) 2004-06-18 2009-12-15 Electro Scientific Industries, Inc. Semiconductor structure processing using multiple laser beam spots overlapping lengthwise on a structure
US7923306B2 (en) 2004-06-18 2011-04-12 Electro Scientific Industries, Inc. Semiconductor structure processing using multiple laser beam spots
US7935941B2 (en) 2004-06-18 2011-05-03 Electro Scientific Industries, Inc. Semiconductor structure processing using multiple laser beam spots spaced on-axis on non-adjacent structures
US8148211B2 (en) 2004-06-18 2012-04-03 Electro Scientific Industries, Inc. Semiconductor structure processing using multiple laser beam spots spaced on-axis delivered simultaneously
US7629234B2 (en) 2004-06-18 2009-12-08 Electro Scientific Industries, Inc. Semiconductor structure processing using multiple laterally spaced laser beam spots with joint velocity profiling
US7425471B2 (en) 2004-06-18 2008-09-16 Electro Scientific Industries, Inc. Semiconductor structure processing using multiple laser beam spots spaced on-axis with cross-axis offset
US8383982B2 (en) 2004-06-18 2013-02-26 Electro Scientific Industries, Inc. Methods and systems for semiconductor structure processing using multiple laser beam spots
US7767930B2 (en) * 2005-10-03 2010-08-03 Aradigm Corporation Method and system for LASER machining
US7675002B2 (en) * 2005-12-15 2010-03-09 Disco Corporation Laser beam processing machine
JP2008049383A (en) * 2006-08-28 2008-03-06 Sumitomo Heavy Ind Ltd Beam irradiation method and beam irradiation apparatus

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