JPS5581095A - Ultra-fine hole processing method - Google Patents
Ultra-fine hole processing methodInfo
- Publication number
- JPS5581095A JPS5581095A JP15266278A JP15266278A JPS5581095A JP S5581095 A JPS5581095 A JP S5581095A JP 15266278 A JP15266278 A JP 15266278A JP 15266278 A JP15266278 A JP 15266278A JP S5581095 A JPS5581095 A JP S5581095A
- Authority
- JP
- Japan
- Prior art keywords
- work
- plural
- laser beams
- optical element
- acousto
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B43—WRITING OR DRAWING IMPLEMENTS; BUREAU ACCESSORIES
- B43L—ARTICLES FOR WRITING OR DRAWING UPON; WRITING OR DRAWING AIDS; ACCESSORIES FOR WRITING OR DRAWING
- B43L23/00—Sharpeners for pencils or leads
- B43L23/08—Sharpeners for pencils or leads in which the pencils or leads are sharpened mainly by rotational movement against cutting blades
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B43—WRITING OR DRAWING IMPLEMENTS; BUREAU ACCESSORIES
- B43L—ARTICLES FOR WRITING OR DRAWING UPON; WRITING OR DRAWING AIDS; ACCESSORIES FOR WRITING OR DRAWING
- B43L13/00—Drawing instruments, or writing or drawing appliances or accessories not otherwise provided for
- B43L13/02—Draughting machines or drawing devices for keeping parallelism
- B43L13/022—Draughting machines or drawing devices for keeping parallelism automatic
- B43L13/024—Drawing heads therefor
Landscapes
- Engineering & Computer Science (AREA)
- Automation & Control Theory (AREA)
- Laser Beam Processing (AREA)
Abstract
PURPOSE:To form a plurality of ultra-fine holes of accurate pitch simultaneously in the work in a short processing time, by using plural laser beams split by multi- frequency driving acousto-optical element. CONSTITUTION:Laser beams 5 (a flux of parallel lights) from an oscillator 4 are radiated to a multi-frequency driving acousto-optical element 7 through a lens 6, and a work 8 is placed in the focal position of the element 7. On the other hand, plural high frequencies (f1-fn) from a high frequency driving circuit 9 are introduced into the element 7 through mixer 10 and amplifier 11, and the laser beams 5 entering the element 7 are split into plural beams 12 (the 0-order light 13 is shielded from the work 8 by a stopper 14). In said apparatus, a plurality of holes may be worked out simultaneously, and the pitch of holes can be controlled by electrically selecting the high frequency applied to the acousto-optical element 7, so that extreme accuracy and high precision may be achieved.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15266278A JPS5581095A (en) | 1978-12-12 | 1978-12-12 | Ultra-fine hole processing method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15266278A JPS5581095A (en) | 1978-12-12 | 1978-12-12 | Ultra-fine hole processing method |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5581095A true JPS5581095A (en) | 1980-06-18 |
Family
ID=15545334
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP15266278A Pending JPS5581095A (en) | 1978-12-12 | 1978-12-12 | Ultra-fine hole processing method |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5581095A (en) |
Cited By (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003048093A (en) * | 2001-08-03 | 2003-02-18 | Matsushita Electric Ind Co Ltd | Device and method for laser beam machining |
EP1579944A3 (en) * | 1998-09-08 | 2006-06-07 | Hell Gravure Systems GmbH | Laser radiation source |
JP2008049383A (en) * | 2006-08-28 | 2008-03-06 | Sumitomo Heavy Ind Ltd | Beam irradiation method and beam irradiation apparatus |
US7425471B2 (en) | 2004-06-18 | 2008-09-16 | Electro Scientific Industries, Inc. | Semiconductor structure processing using multiple laser beam spots spaced on-axis with cross-axis offset |
US7435927B2 (en) | 2004-06-18 | 2008-10-14 | Electron Scientific Industries, Inc. | Semiconductor link processing using multiple laterally spaced laser beam spots with on-axis offset |
US7629234B2 (en) | 2004-06-18 | 2009-12-08 | Electro Scientific Industries, Inc. | Semiconductor structure processing using multiple laterally spaced laser beam spots with joint velocity profiling |
US7629555B2 (en) | 2001-06-13 | 2009-12-08 | Orbotech Ltd | Multiple beam micro-machining system and method |
US7633034B2 (en) | 2004-06-18 | 2009-12-15 | Electro Scientific Industries, Inc. | Semiconductor structure processing using multiple laser beam spots overlapping lengthwise on a structure |
US7675002B2 (en) * | 2005-12-15 | 2010-03-09 | Disco Corporation | Laser beam processing machine |
US7687740B2 (en) | 2004-06-18 | 2010-03-30 | Electro Scientific Industries, Inc. | Semiconductor structure processing using multiple laterally spaced laser beam spots delivering multiple blows |
US7767930B2 (en) * | 2005-10-03 | 2010-08-03 | Aradigm Corporation | Method and system for LASER machining |
US7935941B2 (en) | 2004-06-18 | 2011-05-03 | Electro Scientific Industries, Inc. | Semiconductor structure processing using multiple laser beam spots spaced on-axis on non-adjacent structures |
US8148211B2 (en) | 2004-06-18 | 2012-04-03 | Electro Scientific Industries, Inc. | Semiconductor structure processing using multiple laser beam spots spaced on-axis delivered simultaneously |
US8193468B2 (en) | 2001-03-29 | 2012-06-05 | Gsi Group Corporation | Methods and systems for precisely relatively positioning a waist of a pulsed laser beam and method and system for controlling energy delivered to a target structure |
US8238007B2 (en) | 2001-02-16 | 2012-08-07 | Electro Scientific Industries, Inc. | On-the-fly laser beam path error correction for specimen target location processing |
US8383982B2 (en) | 2004-06-18 | 2013-02-26 | Electro Scientific Industries, Inc. | Methods and systems for semiconductor structure processing using multiple laser beam spots |
US8497450B2 (en) | 2001-02-16 | 2013-07-30 | Electro Scientific Industries, Inc. | On-the fly laser beam path dithering for enhancing throughput |
-
1978
- 1978-12-12 JP JP15266278A patent/JPS5581095A/en active Pending
Cited By (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1579944A3 (en) * | 1998-09-08 | 2006-06-07 | Hell Gravure Systems GmbH | Laser radiation source |
EP1623789A3 (en) * | 1998-09-08 | 2006-07-12 | Hell Gravure Systems GmbH | Source of laser radiation |
US8497450B2 (en) | 2001-02-16 | 2013-07-30 | Electro Scientific Industries, Inc. | On-the fly laser beam path dithering for enhancing throughput |
US8238007B2 (en) | 2001-02-16 | 2012-08-07 | Electro Scientific Industries, Inc. | On-the-fly laser beam path error correction for specimen target location processing |
US8193468B2 (en) | 2001-03-29 | 2012-06-05 | Gsi Group Corporation | Methods and systems for precisely relatively positioning a waist of a pulsed laser beam and method and system for controlling energy delivered to a target structure |
US7642484B2 (en) | 2001-06-13 | 2010-01-05 | Orbotech Ltd | Multiple beam micro-machining system and method |
US7629555B2 (en) | 2001-06-13 | 2009-12-08 | Orbotech Ltd | Multiple beam micro-machining system and method |
KR100990300B1 (en) * | 2001-06-13 | 2010-10-26 | 오르보테크 엘티디. | Multi-beam micro-machining system and method |
US7633036B2 (en) | 2001-06-13 | 2009-12-15 | Orbotech Ltd | Micro-machining system employing a two stage beam steering mechanism |
JP2003048093A (en) * | 2001-08-03 | 2003-02-18 | Matsushita Electric Ind Co Ltd | Device and method for laser beam machining |
US7435927B2 (en) | 2004-06-18 | 2008-10-14 | Electron Scientific Industries, Inc. | Semiconductor link processing using multiple laterally spaced laser beam spots with on-axis offset |
US7687740B2 (en) | 2004-06-18 | 2010-03-30 | Electro Scientific Industries, Inc. | Semiconductor structure processing using multiple laterally spaced laser beam spots delivering multiple blows |
US7633034B2 (en) | 2004-06-18 | 2009-12-15 | Electro Scientific Industries, Inc. | Semiconductor structure processing using multiple laser beam spots overlapping lengthwise on a structure |
US7923306B2 (en) | 2004-06-18 | 2011-04-12 | Electro Scientific Industries, Inc. | Semiconductor structure processing using multiple laser beam spots |
US7935941B2 (en) | 2004-06-18 | 2011-05-03 | Electro Scientific Industries, Inc. | Semiconductor structure processing using multiple laser beam spots spaced on-axis on non-adjacent structures |
US8148211B2 (en) | 2004-06-18 | 2012-04-03 | Electro Scientific Industries, Inc. | Semiconductor structure processing using multiple laser beam spots spaced on-axis delivered simultaneously |
US7629234B2 (en) | 2004-06-18 | 2009-12-08 | Electro Scientific Industries, Inc. | Semiconductor structure processing using multiple laterally spaced laser beam spots with joint velocity profiling |
US7425471B2 (en) | 2004-06-18 | 2008-09-16 | Electro Scientific Industries, Inc. | Semiconductor structure processing using multiple laser beam spots spaced on-axis with cross-axis offset |
US8383982B2 (en) | 2004-06-18 | 2013-02-26 | Electro Scientific Industries, Inc. | Methods and systems for semiconductor structure processing using multiple laser beam spots |
US7767930B2 (en) * | 2005-10-03 | 2010-08-03 | Aradigm Corporation | Method and system for LASER machining |
US7675002B2 (en) * | 2005-12-15 | 2010-03-09 | Disco Corporation | Laser beam processing machine |
JP2008049383A (en) * | 2006-08-28 | 2008-03-06 | Sumitomo Heavy Ind Ltd | Beam irradiation method and beam irradiation apparatus |
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