JPS5929496A - Method of soldering multileg electronic part - Google Patents
Method of soldering multileg electronic partInfo
- Publication number
- JPS5929496A JPS5929496A JP13940282A JP13940282A JPS5929496A JP S5929496 A JPS5929496 A JP S5929496A JP 13940282 A JP13940282 A JP 13940282A JP 13940282 A JP13940282 A JP 13940282A JP S5929496 A JPS5929496 A JP S5929496A
- Authority
- JP
- Japan
- Prior art keywords
- soldering
- legs
- multileg
- printed circuit
- electronic part
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3494—Heating methods for reflowing of solder
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
産業上の利用分野
本発明は、ＩＣ，ＬＳＩなどの多脚電子部をプリント基
板上にハンダ付けする方法に関するものである。DETAILED DESCRIPTION OF THE INVENTION FIELD OF INDUSTRIAL APPLICATION The present invention relates to a method of soldering a multi-legged electronic part such as an IC or LSI onto a printed circuit board.
従来例の構成とその問題点
従来の例えば、。電子レンジ等においてはエレクトロニ
クスの発達によりＩＣ，ＬＳＩ等の端子の非常に多い、
いわゆる多脚電子部品が多量に使用されてきている。こ
れに伴って市場においてもＩＣ，ＬＳＩ等を取シ替えて
修理しなければならないサービス作業が急増してきてい
る。Conventional configuration and its problems For example, the conventional example. Due to the development of electronics, microwave ovens, etc. have an extremely large number of terminals for ICs, LSIs, etc.
So-called multi-legged electronic components have been used in large quantities. Along with this, the number of service operations that require replacing and repairing ICs, LSIs, etc. is rapidly increasing in the market.
ところがこれらの多脚電子部品をプリント基板に従来の
電熱式ハンダごてでハンダ付けしようとすると次の問題
がある。However, when trying to solder these multi-legged electronic components to a printed circuit board using a conventional electric heating soldering iron, the following problem arises.
（１）一部品に通常４０〜６０本もある脚を一本一本糸
ハンダを用いて・・ンダ付けしなければならず、多くの
作業時間が必要であるとともに、多年の熟練技能が必要
である。(1) Each part usually has 40 to 60 legs, which must be attached one by one using thread solder, which requires a lot of work time and requires many years of skill. It is.
（２）ハンダごての熱で、脚の周辺の他の電子部品ある
いはプリント基板そのものが変質し、場合によってはプ
リント基板全部を取り替えなければならない。(2) The heat from the soldering iron may deteriorate other electronic components around the legs or the printed circuit board itself, and in some cases, the entire printed circuit board must be replaced.
発明の目的
本発明は上記従来の欠点を解消するものて、レーザ光線
などの光エネルギーを用いて、プリント基板上への熱的
悪影響を低減しかつ・・ンダ伺は作業の効率を向上する
ことを目的とする。OBJECT OF THE INVENTION The present invention solves the above-mentioned conventional drawbacks, and aims to reduce adverse thermal effects on printed circuit boards by using light energy such as laser beams, and to improve work efficiency. With the goal.
発明の構成
上記目的を達するため、本発明の多脚電子部品のハンダ
利は方法は、点光源の光を反射板とレンズとにより多脚
電子部品の端子部分に集めその先エネルギーによって・
・ノダ付けを行なうもので、間隔の少ない限られた寸法
内の端子群を素早くハフダイ」けし、かつブリット基板
への熱的悪影響を軽減して作業性を鳩−艮改碧するもの
である。Structure of the Invention In order to achieve the above object, the method for soldering a multi-leg electronic component of the present invention focuses light from a point light source onto the terminal portion of the multi-leg electronic component using a reflector and a lens, and then uses energy to...
・It performs soldering, and quickly dies a group of terminals within a limited dimension with small spacing, and reduces the adverse thermal effect on the bullet board, improving work efficiency.
実施例の説明
以下、本発明の実施例について、図面に基づいて説明す
る。DESCRIPTION OF EMBODIMENTS Hereinafter, embodiments of the present invention will be described based on the drawings.
（第９１実施例）
第１図および第２図において、ＩＣ，ＬＳＩ等の多脚電
子部品１は脚２を有する。この脚２はプリント基板３の
裏面に図のように突出して設けられる。４はハンダがの
るハンダ部である。一般にこの脚２の数は１列で１ｏ〜
２０本であり、各脚の間は敢闘という小さい間隔である
。各列の脚２に対応して、レーザ光線などの高いエネル
ギー光源を発する点光源５と、その点光源５の光線を反
射する反射板６と、必要に応じて焦点を結ぶことができ
る集光し／ズ７とからなる発光装置８を設ける。(91st Embodiment) In FIGS. 1 and 2, a multi-legged electronic component 1 such as an IC or an LSI has legs 2. The legs 2 are provided on the back surface of the printed circuit board 3 so as to protrude as shown in the figure. 4 is a solder part on which solder is applied. Generally, the number of legs 2 in one row is 1o ~
There are 20 legs, and there is a small distance between each leg. Corresponding to each row of legs 2, there is a point light source 5 that emits a high-energy light source such as a laser beam, a reflector plate 6 that reflects the light rays of the point light source 5, and a light condenser that can be focused as necessary. A light emitting device 8 consisting of a lens 7 is provided.
以下上記構成における作用について説明する。 ″まず
、点光源６より発した光は、反射板６で反射され、集光
レンズ７に集められ、焦線距離を調節されて、ブリット
基板３のＩＣ，ＬＳＩ等の脚２部分に焦点を結ぶ。糸・
・／ダ９は集光された光エネルギーによって溶け、脚２
を・・ンダ部４に固着する。はぼ直線状に並設けられた
脚２に沿って順次発泥装置８は移動し、糸ノ・ンダ９も
あわせて送られ、・・ンダ付は作業が進められる。The operation of the above configuration will be explained below. ``First, the light emitted from the point light source 6 is reflected by the reflection plate 6, collected by the condenser lens 7, and the focal length is adjusted to focus on the 2 legs of the IC, LSI, etc. of the bullet board 3. Tie. Thread.
・／Da9 is melted by the focused light energy, and legs 2
... is fixed to the underside part 4. The sludge removal device 8 is sequentially moved along the legs 2 arranged in a nearly straight line, and the thread nozzle 9 is also sent along with it, and the shading process proceeds.
この実施例によれば非常に限られた点に光を集めること
ができ、小形で破損しやすい脚２を傷めることなく、素
早く・・ノダ付けすることができる。According to this embodiment, light can be focused on a very limited point, and the leg 2, which is small and easily damaged, can be quickly soldered without damaging it.
発明の効果 本発明によれば次の効果を得ることが出来る。Effect of the invention According to the present invention, the following effects can be obtained.
（１）反射板とレンズにより、光を一点の焦点に結ばせ
ることが出来るので、単位面積当り大きな熱量を発生さ
せることが出来る。(1) Since the light can be focused on a single point using the reflector and the lens, a large amount of heat can be generated per unit area.
営）一点に光を絞れるので、微細な部分に、力をかける
ことなく、精密なノ・ンダ作業ができる。Since the light can be focused on one point, it is possible to perform precise cutting work on minute parts without applying force.
（３）他の部品およびプリント基板そのものを熱で損傷
することはない。(3) Other parts and the printed circuit board itself will not be damaged by heat.
（４）対象物に吸収し易い色または反射し易い色を塗る
ことにより差別加熱できる。(4) Differential heating can be achieved by painting the object with a color that is easily absorbed or reflected.
（６）・・ノダごて等を熱しないので、省エネルギーで
ある。(6) It saves energy because it does not heat the nodal iron, etc.
第１図は本発明の一実施例である多脚電子部品の・・／
ダ付は方法を示す概念図、第２図は同要部断面図である
。
１・・・・・・多脚電子部品、２・・・・・・脚、３・
・・・・プリント基板、５・・・・・・点光源、６・・
・・・・反射板、７・・・・・・集光レンズ、８・・・
・・・発光装置、９・・・・・・糸ノ・ノダ。Figure 1 shows a multi-legged electronic component which is an embodiment of the present invention.
The dashed lines are a conceptual diagram showing the method, and FIG. 2 is a sectional view of the same essential parts. 1...Multi-leg electronic components, 2...Legs, 3.
...Printed circuit board, 5...Point light source, 6...
...Reflector, 7... Condensing lens, 8...
...Light-emitting device, 9...Itono Noda.
Claims (1)
、点光源から発する光を集光装置によって集光させ、前
記端子部分をハンダ付けする多脚電子部品のハンダ付は
方法。A method for soldering a multi-leg electronic component, in which light emitted from a point light source is focused by a condensing device on the terminal portion of the multi-leg electronic component disposed on a printed circuit board, and the terminal portion is soldered.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13940282A JPS5929496A (en) | 1982-08-10 | 1982-08-10 | Method of soldering multileg electronic part |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13940282A JPS5929496A (en) | 1982-08-10 | 1982-08-10 | Method of soldering multileg electronic part |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5929496A true JPS5929496A (en) | 1984-02-16 |
Family
ID=15244424
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13940282A Pending JPS5929496A (en) | 1982-08-10 | 1982-08-10 | Method of soldering multileg electronic part |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5929496A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4955523A (en) * | 1986-12-17 | 1990-09-11 | Raychem Corporation | Interconnection of electronic components |
| US5189507A (en) * | 1986-12-17 | 1993-02-23 | Raychem Corporation | Interconnection of electronic components |
| US5196667A (en) * | 1987-04-11 | 1993-03-23 | Peter Gammelin | Soldering and desoldering device |
| JPH0717537U (en) * | 1991-10-02 | 1995-03-28 | 純雄 張 | Container for foods, etc., integrated paper board for molding the container, and mold for molding the container |
| CN102554480A (en) * | 2010-12-28 | 2012-07-11 | 杭州三花研究院有限公司 | Solar welding machine |
-
1982
- 1982-08-10 JP JP13940282A patent/JPS5929496A/en active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4955523A (en) * | 1986-12-17 | 1990-09-11 | Raychem Corporation | Interconnection of electronic components |
| US5189507A (en) * | 1986-12-17 | 1993-02-23 | Raychem Corporation | Interconnection of electronic components |
| US5196667A (en) * | 1987-04-11 | 1993-03-23 | Peter Gammelin | Soldering and desoldering device |
| JPH0717537U (en) * | 1991-10-02 | 1995-03-28 | 純雄 張 | Container for foods, etc., integrated paper board for molding the container, and mold for molding the container |
| CN102554480A (en) * | 2010-12-28 | 2012-07-11 | 杭州三花研究院有限公司 | Solar welding machine |
| CN102554480B (en) * | 2010-12-28 | 2014-05-28 | 杭州三花研究院有限公司 | Solar welding machine |
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