JPS5756984A - Assembling method for semiconductor light emitting device - Google Patents

Assembling method for semiconductor light emitting device

Info

Publication number
JPS5756984A
JPS5756984A JP55132486A JP13248680A JPS5756984A JP S5756984 A JPS5756984 A JP S5756984A JP 55132486 A JP55132486 A JP 55132486A JP 13248680 A JP13248680 A JP 13248680A JP S5756984 A JPS5756984 A JP S5756984A
Authority
JP
Japan
Prior art keywords
light emitting
sink
chamfering
soldering
front surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP55132486A
Other languages
Japanese (ja)
Inventor
Hideyo Higuchi
Etsuji Omura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP55132486A priority Critical patent/JPS5756984A/en
Publication of JPS5756984A publication Critical patent/JPS5756984A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/023—Mount members, e.g. sub-mount members
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0233—Mounting configuration of laser chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0235—Method for mounting laser chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8338—Bonding interfaces outside the semiconductor or solid-state body
    • H01L2224/83385—Shape, e.g. interlocking features
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0235—Method for mounting laser chips
    • H01S5/02355—Fixing laser chips on mounts
    • H01S5/0237—Fixing laser chips on mounts by soldering

Abstract

PURPOSE:To readily assemble a semiconductor light emitting element by etching the edge lines of two surfaces crossing with one another at the front surface side of a heat sink soldering the element along the edge line, chamfering it and soldering the element so that the light emitting end face of the element and the front surface of the sink become in the same plane. CONSTITUTION:The edge line of two surfaces crossing with one another at the front surface side of a heat sink carrying a semiconductor laser 2 is etched along the edge line, and a chamfering part 7 is formed. The light emitting end face 4 of a laser 2 is diposed at the chamfering part 7, and the light emitting unit 3 and the sink 2 are secured to one another by soldering while maintaining the light emitting unit 3 and the side face of the sink 1 in the same plane. Since the chamfering part 7 is produced with rounded chamfering unit 7' in this manner, solder 5 is sufficiently flowed to eliminate the cavity or the like, and even if the position of the laser 2 is slightly displaced, the fluctuation, shortcircuit and leakage of the emitted light can be remarkably reduced.
JP55132486A 1980-09-23 1980-09-23 Assembling method for semiconductor light emitting device Pending JPS5756984A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP55132486A JPS5756984A (en) 1980-09-23 1980-09-23 Assembling method for semiconductor light emitting device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP55132486A JPS5756984A (en) 1980-09-23 1980-09-23 Assembling method for semiconductor light emitting device

Publications (1)

Publication Number Publication Date
JPS5756984A true JPS5756984A (en) 1982-04-05

Family

ID=15082492

Family Applications (1)

Application Number Title Priority Date Filing Date
JP55132486A Pending JPS5756984A (en) 1980-09-23 1980-09-23 Assembling method for semiconductor light emitting device

Country Status (1)

Country Link
JP (1) JPS5756984A (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4550333A (en) * 1983-09-13 1985-10-29 Xerox Corporation Light emitting semiconductor mount
US4987566A (en) * 1985-07-29 1991-01-22 Mitsubishi Denki Kabushiki Kaisha Optical head apparatus
JPH0468572U (en) * 1990-10-24 1992-06-17
EP0649202A1 (en) * 1993-10-15 1995-04-19 Toyota Jidosha Kabushiki Kaisha Semiconductor laser and method of manufacturing the same
KR20000040031A (en) * 1998-12-17 2000-07-05 구자홍 Solder evaporation method for a laser diode assembling
DE112017003127T5 (en) 2016-06-23 2019-03-07 Smc Corporation speed control
DE112017005825T5 (en) 2016-11-18 2019-08-08 Smc Corporation Composite valve for direct attachment to the connection of a hydraulic device

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4550333A (en) * 1983-09-13 1985-10-29 Xerox Corporation Light emitting semiconductor mount
US4987566A (en) * 1985-07-29 1991-01-22 Mitsubishi Denki Kabushiki Kaisha Optical head apparatus
JPH0468572U (en) * 1990-10-24 1992-06-17
EP0649202A1 (en) * 1993-10-15 1995-04-19 Toyota Jidosha Kabushiki Kaisha Semiconductor laser and method of manufacturing the same
US5604761A (en) * 1993-10-15 1997-02-18 Toyota Jidosha Kabushiki Kaisha Layered semiconductor laser having solder laminations and method of making same
KR20000040031A (en) * 1998-12-17 2000-07-05 구자홍 Solder evaporation method for a laser diode assembling
DE112017003127T5 (en) 2016-06-23 2019-03-07 Smc Corporation speed control
DE112017005825T5 (en) 2016-11-18 2019-08-08 Smc Corporation Composite valve for direct attachment to the connection of a hydraulic device

Similar Documents

Publication Publication Date Title
JPS577989A (en) Mount for semiconductor laser
DE3878377D1 (en) CUTTING INSERT.
ATE64017T1 (en) OPTICALLY INTEGRATED COMPONENT MADE OF GLASS.
DE69509480T2 (en) A parting or grooving insert
DE3676321D1 (en) SEMICONDUCTOR LASER DEVICE WITH PROTECTIVE COATING ON THE SIDE SURFACES.
DE69132730T2 (en) Semiconductor arrangement with improved wiring
JPS5756984A (en) Assembling method for semiconductor light emitting device
DE69007461D1 (en) Surface emitting semiconductor laser with lateral electrode contact.
SE9702345L (en) Alignment of optical building elements
JPS57130490A (en) Semiconductor laser device
KR850006796A (en) Light emitting device
SE9002663D0 (en) MULTILAYER CONVERSOR WITH CONNECTED CONTACTS AND SET FOR AUTHORIZING THE CONTACTS
ATE365890T1 (en) COMPACT LUMINAIRE WITH HOLLOW LIGHT GUIDE
ETSUJI Assembling method for semiconductor light emitting device
JPS57193277A (en) Soldering device by laser
JPS6430034A (en) Semiconductor laser driver
JPS6427286A (en) Semiconductor device
JPS6449247A (en) Semiconductor light emitting device
JPS6453436A (en) Can-sealing for optical semiconductor element
JPS57168206A (en) Photosemiconductor device
JPS54101296A (en) Photo semiconductor device
IT1262369B (en) PLANAR INDUCTOR AND FUNCTIONAL CALIBRATION METHOD OF ITSELF IN RF SYSTEM.
DK305185D0 (en) APPLIANCE WITH A LIGHT THRISTOR
ES2175872T3 (en) BUBBLE LEVEL.
JPS5693389A (en) Semiconductor laser