JPS6453436A - Can-sealing for optical semiconductor element - Google Patents
Can-sealing for optical semiconductor elementInfo
- Publication number
- JPS6453436A JPS6453436A JP62209338A JP20933887A JPS6453436A JP S6453436 A JPS6453436 A JP S6453436A JP 62209338 A JP62209338 A JP 62209338A JP 20933887 A JP20933887 A JP 20933887A JP S6453436 A JPS6453436 A JP S6453436A
- Authority
- JP
- Japan
- Prior art keywords
- sealing
- subjected
- semiconductor element
- optical semiconductor
- flange part
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
- C03C17/22—Surface treatment of glass, not in the form of fibres or filaments, by coating with other inorganic material
- C03C17/23—Oxides
Landscapes
- Chemical & Material Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Geochemistry & Mineralogy (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Semiconductor Lasers (AREA)
Abstract
PURPOSE:To enable can-sealing which can be done without necessity of taking a high position accuracy into consideration, by a method wherein an optical semiconductor element is subjected to a double can-sealing and the width of a part, which is subjected to can-sealing, of a can on the inner side is made wider, on which a can on the outer side is further subjected to a can-sealing. CONSTITUTION:A semiconductor laser 21 is die-bonded to a header 22 and a flange part 26 near the side surface of a can 24 on the inner side is subjected can-sealing. After that, a lens 25 is aligned with the laser 21 and a flange part 29 of a can 27 on the outer side is subjected to can-sealing.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62209338A JPS6453436A (en) | 1987-08-25 | 1987-08-25 | Can-sealing for optical semiconductor element |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62209338A JPS6453436A (en) | 1987-08-25 | 1987-08-25 | Can-sealing for optical semiconductor element |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6453436A true JPS6453436A (en) | 1989-03-01 |
Family
ID=16571295
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP62209338A Pending JPS6453436A (en) | 1987-08-25 | 1987-08-25 | Can-sealing for optical semiconductor element |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6453436A (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002296108A (en) * | 2001-03-30 | 2002-10-09 | Ihi Aerospace Co Ltd | Light detecting element and light transmitting member fixing structure |
JP2010165834A (en) * | 2009-01-15 | 2010-07-29 | Nichia Corp | Light emitting device |
CN102213803A (en) * | 2010-04-09 | 2011-10-12 | 三菱电机株式会社 | Optical semiconductor device module |
CN108535823A (en) * | 2018-04-11 | 2018-09-14 | 中电科技集团重庆声光电有限公司 | Double lens types pipe cap |
CN112864791A (en) * | 2021-01-08 | 2021-05-28 | 东莞市中镓半导体科技有限公司 | Semiconductor laser of combined type TO encapsulation |
-
1987
- 1987-08-25 JP JP62209338A patent/JPS6453436A/en active Pending
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002296108A (en) * | 2001-03-30 | 2002-10-09 | Ihi Aerospace Co Ltd | Light detecting element and light transmitting member fixing structure |
JP2010165834A (en) * | 2009-01-15 | 2010-07-29 | Nichia Corp | Light emitting device |
CN102213803A (en) * | 2010-04-09 | 2011-10-12 | 三菱电机株式会社 | Optical semiconductor device module |
CN108535823A (en) * | 2018-04-11 | 2018-09-14 | 中电科技集团重庆声光电有限公司 | Double lens types pipe cap |
CN112864791A (en) * | 2021-01-08 | 2021-05-28 | 东莞市中镓半导体科技有限公司 | Semiconductor laser of combined type TO encapsulation |
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