JPS5686694A - Laser scribe processing method - Google Patents

Laser scribe processing method

Info

Publication number
JPS5686694A
JPS5686694A JP16378279A JP16378279A JPS5686694A JP S5686694 A JPS5686694 A JP S5686694A JP 16378279 A JP16378279 A JP 16378279A JP 16378279 A JP16378279 A JP 16378279A JP S5686694 A JPS5686694 A JP S5686694A
Authority
JP
Japan
Prior art keywords
stage
wafer
laser beam
processing method
scribe processing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP16378279A
Other languages
Japanese (ja)
Inventor
Josuke Nozaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP16378279A priority Critical patent/JPS5686694A/en
Publication of JPS5686694A publication Critical patent/JPS5686694A/en
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/362—Laser etching
    • B23K26/364—Laser etching for making a groove or trench, e.g. for scribing a break initiation groove

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
  • Dicing (AREA)

Abstract

PURPOSE: To prevent deformation and fusion-fixing of the stage due to heat of laser beam by forming a relief groove in a wafer and by performing scribe processing on a transparent stage from the opposite side.
CONSTITUTION: For the purpose of preventing deformation of processed stage (j) and fusion-fixing between the wafer and processed stage (j) due to heat of laser beam (e), stage (j) is made transparent to permeate laser beam (e). In case of complete clipping, relief groove (i) is opened to the clipped position of the wafer itself for the purpose of preventing the clipped position of the wafer from contact with the processed stage directly.
COPYRIGHT: (C)1981,JPO&Japio
JP16378279A 1979-12-17 1979-12-17 Laser scribe processing method Pending JPS5686694A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16378279A JPS5686694A (en) 1979-12-17 1979-12-17 Laser scribe processing method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16378279A JPS5686694A (en) 1979-12-17 1979-12-17 Laser scribe processing method

Publications (1)

Publication Number Publication Date
JPS5686694A true JPS5686694A (en) 1981-07-14

Family

ID=15780604

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16378279A Pending JPS5686694A (en) 1979-12-17 1979-12-17 Laser scribe processing method

Country Status (1)

Country Link
JP (1) JPS5686694A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5753887A (en) * 1995-05-16 1998-05-19 Engraving Technologies, Inc. Apparatus for laser engraving indicia on gemstones
JP2008200694A (en) * 2007-02-19 2008-09-04 Disco Abrasive Syst Ltd Method for machining wafer, and laser beam machining apparatus

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5753887A (en) * 1995-05-16 1998-05-19 Engraving Technologies, Inc. Apparatus for laser engraving indicia on gemstones
JP2008200694A (en) * 2007-02-19 2008-09-04 Disco Abrasive Syst Ltd Method for machining wafer, and laser beam machining apparatus

Similar Documents

Publication Publication Date Title
JPS56160034A (en) Impurity diffusion
JPS5252579A (en) Clearance adjusng method
JPS5288900A (en) Ion beam machine tool
JPS5686694A (en) Laser scribe processing method
JPS5333050A (en) Production of semiconductor element
JPS5236468A (en) Shallow diffusion method
JPS52127762A (en) Etching method
JPS5428590A (en) Laser processing method
ES8305534A1 (en) Semiconductor device passivation.
JPS52131454A (en) Thermal treating method of wafer
JPS559507A (en) Focal plane shutter of blade type
JPS52140348A (en) Optical device for photo-processing
JPS5436695A (en) Laser processing method
JPS5214374A (en) Treatment equpment for ion beam
JPS52140275A (en) Processing method for semiconductor wafer
JPS5233204A (en) Method of calculating distance from chord of rail by means of laser be am
JPS5285444A (en) Information processing system
JPS5234481A (en) Method of manufaceuring blade of scissors
JPS52117578A (en) Electron beam exposing method
JPS5359368A (en) Plasma etching
JPS52135748A (en) Light scanner
JPS5344995A (en) Laser machining apparatus
JPS5295941A (en) Information classification
JPS5378165A (en) Cutting method for semiconductor substrate
JPS5215890A (en) Method for immobilizing fibrinolysokinases