JPS52127762A - Etching method - Google Patents

Etching method

Info

Publication number
JPS52127762A
JPS52127762A JP4460776A JP4460776A JPS52127762A JP S52127762 A JPS52127762 A JP S52127762A JP 4460776 A JP4460776 A JP 4460776A JP 4460776 A JP4460776 A JP 4460776A JP S52127762 A JPS52127762 A JP S52127762A
Authority
JP
Japan
Prior art keywords
etching method
halogen
etching
ion beam
application
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP4460776A
Other languages
Japanese (ja)
Other versions
JPS6044825B2 (en
Inventor
Junichi Kai
Moritaka Nakamura
Yoshihiko Kitahara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP4460776A priority Critical patent/JPS6044825B2/en
Publication of JPS52127762A publication Critical patent/JPS52127762A/en
Publication of JPS6044825B2 publication Critical patent/JPS6044825B2/en
Expired legal-status Critical Current

Links

Landscapes

  • Drying Of Semiconductors (AREA)

Abstract

PURPOSE: To form the microscopic pattern by etching the processed object deposited in the gas plasma of halogen and/or halogen compound with selective speed in use of application of ion beam.
COPYRIGHT: (C)1977,JPO&Japio
JP4460776A 1976-04-19 1976-04-19 Etching method Expired JPS6044825B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4460776A JPS6044825B2 (en) 1976-04-19 1976-04-19 Etching method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4460776A JPS6044825B2 (en) 1976-04-19 1976-04-19 Etching method

Publications (2)

Publication Number Publication Date
JPS52127762A true JPS52127762A (en) 1977-10-26
JPS6044825B2 JPS6044825B2 (en) 1985-10-05

Family

ID=12696121

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4460776A Expired JPS6044825B2 (en) 1976-04-19 1976-04-19 Etching method

Country Status (1)

Country Link
JP (1) JPS6044825B2 (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5554939U (en) * 1978-10-09 1980-04-14
JPS59165422A (en) * 1983-03-10 1984-09-18 Agency Of Ind Science & Technol Dry process apparatus
JPS61136229A (en) * 1984-12-06 1986-06-24 Toshiba Corp Dry etching device
JPH07193044A (en) * 1992-12-16 1995-07-28 Science & Tech Agency Pattern etching method for sic
US7887665B2 (en) 2002-10-28 2011-02-15 Tokyo Seimitsu Co., Ltd. Expanding method and expanding device
US7886798B2 (en) 2002-10-28 2011-02-15 Tokyo Seimitsu Co., Ltd. Expanding method and expanding device

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0320280U (en) * 1989-07-08 1991-02-27

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5554939U (en) * 1978-10-09 1980-04-14
JPS59165422A (en) * 1983-03-10 1984-09-18 Agency Of Ind Science & Technol Dry process apparatus
JPS61136229A (en) * 1984-12-06 1986-06-24 Toshiba Corp Dry etching device
JPH07193044A (en) * 1992-12-16 1995-07-28 Science & Tech Agency Pattern etching method for sic
US7887665B2 (en) 2002-10-28 2011-02-15 Tokyo Seimitsu Co., Ltd. Expanding method and expanding device
US7886798B2 (en) 2002-10-28 2011-02-15 Tokyo Seimitsu Co., Ltd. Expanding method and expanding device

Also Published As

Publication number Publication date
JPS6044825B2 (en) 1985-10-05

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