JPH05226889A - Electronic part connection method - Google Patents

Abstract

PURPOSE:To connect an electronic part onto a substrate by introducing processing beam from a processing beam irradiating means by an optical fiber and by carrying out scanning and irradiation through an attraction nozzle consisting of a light transmitting material. CONSTITUTION:A YAG laser is generated by a laser power supply 54 and a laser optical system 53 and is transmitted to a head part 49 through an optical fiber 1. An electrode part of a part 40 is scanned by laser beam successively at a scanning optical part 27 and laser beam is irradiated to preheat the electrode part of the electronic part 40 to a temperature which is optimum for soldering and transfers it onto a substrate 41 which stands by at a part connection position 44. Furthermore, laser beam scanning and irradiation are performed with the electronic part 40 offset and an electrode part of the electronic part 40 and an electrode part of the substrate 41 can be preheated to a proper temperature for soldering while monitoring them by a temperature measuring sensor 7 within the same visual field. After the electronic part electrode part and the substrate electrode part attain a specified preheating temperature, the electronic part 40 is mounted on a regular position by setting an offset value at zero and laser light scanning and irradiation are performed.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of connecting electronic parts.

[0002]

2. Description of the Related Art Conventionally, when mounting an electronic component on a circuit board, an adhesive is applied to the electronic component mounting position on the circuit board and reflow solder is applied to the electrode. The electronic component supply unit sucks the electronic component to be mounted by the suction nozzle, conveys the electronic component to the electronic component mounting position on the circuit board, mounts the electronic component, and temporarily fixes the electronic component with an adhesive. When the mounting of all electronic components is completed, the circuit board is inserted into a reflow furnace, the reflow solder is reflowed, and the electronic components are permanently fixed with solder and electrical connection is made.

Also, when soldering weakly heat-resistant electronic components that cannot be collectively reflow-soldered as described above, or electronic components that cannot be ultrasonically cleaned, such as a crystal oscillator, from FIG. 23, Soldering was performed according to the flow shown in FIG. 23 is a method for manually soldering a weak heat resistant electronic component, and FIG. 24 is a method for low temperature reflow soldering a weak heat resistant electronic component, which is a composite module component 96 including a plurality of electronic components. In the case of soldering a weak heat resistant electronic component such as the above, if soldering is performed by batch reflow simultaneously with other electronic components, the solder that electrically couples the electronic components on the composite module component 96 will melt. Such a composite module component is usually soldered by low temperature reflow, because the module may be destroyed.

Further, FIG. 25 is a flow chart of soldering an electronic component such as a crystal oscillator, which cannot be ultrasonically cleaned, to a substrate by hand, and FIGS.
The state of the manual soldering work whose flow is shown in FIG.

[0005]

However, in the above-mentioned conventional method for connecting electronic components, since the binding force of the electronic components by the adhesive is small, the handling of the circuit board while the electronic components are temporarily fixed is handled. However, there was a problem that the workability was poor. If the binding force of the adhesive is increased in order to solve this problem, a stringing state occurs when the adhesive is applied to the circuit board, which makes stable application difficult and reduces productivity.

Further, two steps are required: a step of mounting electronic parts on a circuit board and temporarily fixing them with an adhesive, and a step of inserting the circuit board into a reflow furnace and finally fixing the electronic parts to the circuit board. Therefore, there is a problem that the area productivity is low.

Further, when soldering weakly heat-resistant electronic components that cannot be collectively reflow-soldered or electronic components that cannot be cleaned such as a crystal oscillator to a substrate, this is often done as shown in FIG. Since it is carried out manually, the soldering quality is easily influenced by the degree of skill of the operator, and it is difficult to reduce the variation in the soldering quality.
There was a problem that it was not suitable for mass production.

Further, when manually soldering an electronic component that cannot be cleaned to the substrate, as shown in FIG. 26, the substrate electrode portion and the electronic component are preheated by the soldering iron 98 and then soldered. It is said that 95 is supplied and melted, and the two are electrically connected by being poured into the connection portion, so that when the solder is melted, minute solder balls 99 are scattered and stay on the substrate to impair the function of the electronic circuit. Since there is a potential problem, normal electronic components are collectively cleaned after soldering, but for electronic components that incorporate the crystal oscillator 97, ultrasonic waves may destroy the crystal oscillator. Therefore, there is a problem that cleaning is impossible and there is no way to hit.

Further, when a low heat resistance electronic component such as a composite module component 96 composed of a plurality of electronic components is low temperature reflow soldered, the melting point of the low temperature solder is about 150 ° C., on the other hand, the composite module component is constituted. Since the melting point of the eutectic solder connecting the electronic components is close to 183 ° C., the eutectic solder melts and the module is destroyed unless the temperature is carefully controlled during low temperature reflow. have.

In view of the above-mentioned conventional problems, the present invention stably mounts a variety of electronic components including weak heat resistant electronic components and non-cleanable electronic components on a substrate by an automatic machine without damaging the characteristics. It is intended to provide a method of soldering to.

It is another object of the present invention to provide an electronic component joining method capable of improving productivity by mounting and permanently fixing electronic components in one step.

[0012]

In order to achieve the above object, the present invention comprises a suction nozzle made of a light-transmitting material and a processing light beam scanning means provided on the axis of the suction nozzle. A light beam is guided from a processing light beam irradiation means by an optical fiber, and an electronic component is connected onto a substrate by scanning and irradiating the light beam through an adsorption nozzle made of the light transmitting material.

Further, a dichroic mirror is provided in the optical axis of the processing light beam, and a recognition optical system capable of recognizing the periphery of the suction nozzle coaxially with the processing light beam and a shape detection means capable of detecting the shape at the processing light beam irradiation position are provided. However, the light beam necessary for recognition and the light beam necessary for shape detection can be both scanned by the mirror driving source in the relationship of coaxial reflection with the processing light beam, and the periphery of the irradiation position of the processing light beam can always be recognized and shape detection can be performed. Then, it is possible to connect the electronic component on the substrate by controlling the state of the processing light beam to be emitted based on these information.

[0014]

According to the present invention, by scanning and irradiating the processing light beam to the bonding position of the electronic component through the suction nozzle, it is possible to perform processing and treatment such as soldering during the mounting process of the electronic component. In addition, when mounting the electronic component, while the electrode part of the electronic component is in contact with the board electrode part, each electrode part is sequentially scanned and irradiated with a processing light beam, and the solder applied on the board electrode part in advance. It is also possible to eliminate the reflow process in the reflow furnace by joining the two by reflowing.

Further, conventionally, when soldering an electronic component by using a processing light beam, thermal damage may be given to a substrate or an electronic component. However, a dichroic is performed in the optical axis of the processing light beam. A mirror is provided, and a recognition optical system that can recognize the periphery of the suction nozzle coaxially with the processing light beam and a shape detection unit that can detect the shape at the processing light beam irradiation position are provided. Can be scanned by the mirror drive source in the relationship of the processing light and the coaxial incident light, and the periphery of the processing light irradiation position can always be recognized and the shape can be detected. It is possible to appropriately control and connect the electronic component on the substrate without causing thermal damage to the substrate or the electronic component.

Further, even weakly heat resistant electronic components and electronic components that cannot be washed can be stably soldered on the substrate without impairing their characteristics.

[0017]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to FIGS. FIG. 1 is a perspective view of a head portion of an electronic component connecting device according to the present invention, and FIG. 2 is a perspective view of the entire electronic component connecting device. In FIG. 2, on the body frame 46,
An XY robot 42 is installed, and a head unit 49 for transferring and connecting electronic components onto the substrate and connecting them is locked on the XY robot. The component transfer device 51 transfers the electronic components stored in the component storage unit 50 into the movable range of the XY robot 42. The board 41 is carried to the board preheating section 45 and the component connection position 44 by the board carrying section 48.

The operation of the entire electronic component connecting device is performed by the operation panel 47 provided on the front surface of the device. This embodiment is an example in which a YAG laser is used as a heating heat source for connecting electronic parts, and the YAG laser is a laser power source 54.
Also, the laser light is generated by the laser optical system 53 and transmitted to the head unit 49 through the optical fiber 1.
52 is a flux application part.

Next, referring to FIG. 3, a detailed structure of the component transfer device 51, the board transfer section 48, the board preheating section 45 and the flux coating section 52 will be described. The component transfer device 51 includes a component control claw 60 that positions the electronic component 40 with high precision, and the component control section 59 moves the rail 57 on the rail 57.
The electronic component 40 is transferred by being driven by the. The substrate transport unit 48 includes a pair of transport rails 74 having a pulley 63 and a transport belt 73, and moves the substrate 41 by the operation of the transport belt 73.

The substrate preheating section 45 is composed of a duct hose 64a for supplying the hot air generated from the air dryer 61a to the substrate preheating box 75, and controls the heat quantity of the hot air generated from the air dryer 61a, so that the power supply voltage is suitable. The slidac 62a for adjusting to such a state is arranged in series.

On the other hand, a board setting cylinder 65 is provided at the component connecting position 44 to position the board 41 with high accuracy. Further, in order to prevent the temperature of the substrate from decreasing, the warm air from the air dryers 61b, 61c, 61d is guided by the duct hoses 64b, 64c, 64d. Further, in order to control the amount of heat of the warm air generated by the air dryers 61b, 61c, 61d, the slidac 62b, 62d are controlled.
c and 62d are arranged.

The flux applying section 52 includes a hydrometer 66 and a dirt detecting sensor 67. After the flux 71 is poured into the concave portion of the flux block 70, the flux applying upper and lower cylinders 69 pump up the flux, and the tip nozzle 23 holds the electron. Flux is applied to the electrode portion of the component 40 from below.

Next, the structure of the head portion 49 will be described with reference to FIG. The head unit 49 is mounted on the X-axis mount 10 of the XY robot 42 (FIG. 2) on the LM guide 9 and the head frame 1.
The ball screw 8 is slid on the LM guide 9 in the X-axis direction and is driven by a ball screw 8 connected to an X-axis motor (not shown). The head unit 49 is roughly classified into a scanning optical unit 27 that scans a laser beam.
Can be divided into a grip portion 32 that grips and transfers electronic components.

The nozzle 23 at the tip of the grip 32 is an electronic component 4
The tip nozzle 23 is held by the nozzle 21 through the compression spring 39 and the nozzle holder 22 in such a manner that it can be vertically cushioned. The nozzle 21 is inserted and fixed in a hole provided in the center of the light transmitting plate 38, and the light transmitting plate 38 together with the other light transmitting plate 36 that is arranged to face the light transmitting plate holder 20. It is fixed to. On the outer periphery of the transparent plate holder 20,
A large number of ventilation holes 19 are provided, and these ventilation holes 19
Is connected to the vent hole 17 of the inner holder 18 and the port 16 of the outer holder 15 while maintaining a sufficient airtight property, and therefore when vacuum suction is performed from the port 16 of the outer holder 15, A negative pressure is generated on the component suction surface of the nozzle 23, and the component can be suction-held. On the contrary, when compressed air is supplied from the port 16 of the outer holder 15, the suction state of the component at the tip nozzle 23 can be released.

The inner holder 18 and the cross roller bearing 34 together with the outer holder 15
The rotation of the cam follower 12, the pulley 33, and the timing belt 6, which are locked in a rotatable state with respect to the rotation direction, are slidably in contact with the groove portion above the outer holder 15. It is transmitted from a motor (not shown) via. On the other hand, in the vertical direction, the outer holder 15 itself can be moved by driving the nozzle vertical motor 28 via the ball screw 30 and the coupling 29.

Next, the scanning optical section 27 will be described.
The laser light transmitted from the laser optical system 53 through the optical fiber 1 is guided to the collimator lens system 2 of the scanning optical unit 27 and collimated to a size of about 1 to 3 mm which is optimum for soldering, and then the dichroic. Mirror 3
Is reflected by the galvanometer 24 and is guided to the mirror 25 which can be swung in the X direction by the galvanometer 24 and the mirror 26 which can be swung in the Y direction by the galvanometer 11 and is sequentially reflected.

Next, this laser light is emitted from the fθ lens 31.
The surface of the substrate 41 is irradiated in a telecentric manner by the action of. Since the dichroic mirror 3 has a property of reflecting laser light but transmitting visible light, the optical axis of the dichroic mirror 3 coincides with that of the laser light reflected by the dichroic mirror 3, and the laser irradiation point on the substrate 41 is With the CCD camera 4 arranged so as to form an image on the CCD element, the laser irradiation point on the substrate 41 can be recognized no matter how the galvanometers 24 and 11 scan the laser beam.

Further, a half mirror 5 is provided on the optical axis that connects the CCD camera 4 and the dichroic mirror 3, and a temperature measuring sensor 7 is provided on the side opposite to the CCD camera 4 with the half mirror 5 interposed therebetween. Since the optical axis coincides with the light beam reflected by 5 and the temperature of the laser irradiation point on the substrate 41 is arranged to be measurable, no matter how the galvanometers 24 and 11 scan the laser, The temperature at the laser irradiation point on 41 can be measured.

Further, in the peripheral portion of the transparent plate 38, it is possible to detect the reflected light of the laser light applied to the electrode portion of the electronic component 40 and provide the position information of the point where the reflected light hits. The shape detecting means 37 is provided. Of the above description, FIG. 4 is a diagram showing a simplified outline of the irradiation path of the laser light.

Next, the operation of the component connecting device will be described. 1 to 4, the electronic component 40 stored in the component storage unit 50 is transferred to the component control unit 59 on the component transfer device 51 by transfer means (not shown). On the component regulating part 59, the component regulating claw 60 regulates the position of the electronic component 40, and at the same time, the component regulating part 59 itself moves on the rail 57 by driving the transfer motor 58. Parts storage section 5
The electronic components 40 housed in 0 are sequentially transferred in the movable range of the XY robot 42 in a state where the position is regulated.

Next, the head portion 49 engaged with the XY robot 42 is placed at a predetermined position above the electronic component 40, which has been transferred after completion of position regulation, and the nozzle vertical motor 28 is driven. At the same time when the outer holder 15 is moved down by being transmitted to the ball screw 30, a vacuum pump (not shown) connected to the port 16 of the outer holder 15 is operated to adsorb the electronic component 40 to the tip nozzle 23.

Next, the tip nozzle 23 sucking the electronic component 40 is lifted up together with the outer holder 15 so that the electronic component 40 is positioned above the flux block 70 of the flux applying section 52 at a predetermined position so as to face XY. The robot 42 is moved. In the flux applying section 52, the flux block 70 previously submerged in the flux 71 whose specific gravity, dirt condition and liquid level are controlled by the specific gravity meter 66, the dirt detection sensor 67 and the liquid level sensor 68 is applied to the flux applying unit. It is moved up and down by the up-and-down cylinder 69, and the flux 71 is pumped up into the concave portion and applied to the electrode portion of the electronic component 40 located above and facing the flux 71. After applying flux, flux block 7 again
0 is lowered by the flux applying cylinder 69 to sink into the flux 71, and a series of flux applying operations is completed.

The flux is applied to clean the electrode part of the substrate and the electronic parts, to remove the oxide film adhering to the electrode part, and to reduce the surface tension of the solder at the time of soldering. This is so that the melted solder spreads to every corner of the electrode portion. When the cream solder is applied to the supplied substrate in advance, the flux applying step is unnecessary because the cream solder itself contains the flux.

The position of the electronic component 40 whose flux has been applied to the electrode portion is recognized by the component recognition camera 43, and then, at the component connection position 44, the board setting cylinder 6
The XY robot 42 moves it to a predetermined position above the substrate 41 whose position is regulated by 5. At this time, the board 41 has already been preheated to a temperature suitable for component connection by the upstream board preheating unit 45 and then conveyed to the component connection position, and even when waiting at the component connection position, the air dryers 61b and 61c are also provided. , 61d continue to be preheated by hot air.

This component connecting device is used in the later mounting of an electronic component which may be thermally destroyed or the electrical characteristics thereof may be impaired in a normal mounting process involving reflow. Many electronic components are already soldered to the board that is installed and supplied after. Therefore, if the temperature of the board becomes too high in the board preheating section of this apparatus, the solder of the electronic components that have already been collectively reflow-soldered may melt and the electronic components may be missing. Therefore, the heat quantity of the warm air generated by the air dryer 61a is adjusted to a suitable quantity by the sliderac 62a and supplied to the substrate preheating box 75. Further, also for the air dryers 61b, 61c, 61d supplying the hot air to the component connecting position 44, the slidac 62b, 62c, 62d are arranged for the same reason to maintain the preheating effect.

Further, as shown in FIG. 5, with respect to the electrode part of the component whose position is recognized by the component recognition camera 43,
By sequentially scanning and irradiating the laser light with the scanning optical unit 27, the electrode part of the electronic component is preheated to the optimum temperature for soldering and transferred onto the substrate 41 waiting at the component connection position 44. can do. At this time, needless to say, the temperature of the electrode part of the electronic component can be monitored by the temperature measuring sensor 7 provided in the scanning optical system.

Furthermore, as shown in FIG.
0 is offset by ΔX in the X-axis direction, ΔY in the Y-axis direction, ΔZ in the Z-axis direction, and Δθ in the θ direction with respect to the normal mounting position, and the laser light is scanned and irradiated to obtain the same field of view. Inside the electrode part of the electronic component 40 and the substrate 4
It is possible to preheat while monitoring the temperature measurement sensor 7 until both the first electrode portion and the first electrode portion reach a temperature state suitable for soldering.

The amount of heat applied during preheating is controlled by a method of controlling the scanning speed and the on / off timing of the laser light output while keeping the laser light output constant, and a method of controlling the laser light output and on / off while keeping the scanning speed constant. There is a method of controlling timing.

Subsequently, after the electronic component electrode portion and the substrate electrode portion have reached a predetermined preheating temperature, ΔX, ΔY, Δ
Reset the offset values of Z and Δθ to zero, and
By mounting the electronic component 40 on the regular position on the substrate 1 and subsequently scanning and irradiating with laser light, soldering is performed on all the electrode portions. At this time, the CCD camera 4 installed in the scanning optical unit 27, as shown in FIG. 6, places the substrate electrode portion 81 and the electronic component electrode portion 80 in the same recognition visual field through the light transmitting plates 36 and 38. Since it is captured, the electronic component 40 can be positioned with respect to the substrate 41 with high accuracy.

Next, a data processing method of the scanning optical system and the recognition optical system in this component connecting device will be described.
FIG. 7 shows a state in which the head portion 49 stands by above the component connection position 44, and at this time, the board setting cylinder 6
The CCD camera 4 recognizes the board mark 79 provided on the board 41 whose position is regulated by 5. The recognition screen is shown in FIG. The intersection of the cross lines 82 drawn in the screen is the irradiation position of the laser light, and is the screen center of the scanning optical system. Furthermore, the same board mark 79
However, the head part 49 is moved so as to enter the center of the visual field of the board recognition camera 78, the board recognition camera 78 recognizes the board mark 79 again, and the recognition screen of FIG. 9 is obtained. As described above, the positions of the galvanometers 24 and 11 can be constantly corrected by the obtained recognition image information of FIGS. 8 and 9 and the NC data relating to the position information of the XY robot.

Next, the head portion 49 is moved as it is above the component recognition camera 43, and the electronic component 40 held by the tip nozzle 23 is recognized, and the image on the left side of FIG. 10 can be obtained. In this state, the inner holder 18 is rotated by a predetermined amount in the θ direction by driving a motor (not shown), and the image on the right in FIG. 10 is obtained. From the two image information, the inner holder 18 and the tip nozzle 23
The rotation center position of can be calculated. By adding the correction amount of the galvanometers 24 and 11 previously calculated to this rotation center position, the NC data for driving the XY robot and the position of the scanning optical system can be accurately corrected. ..

Next, the mounting position information for each electronic component,
Of the part data that is the connection condition by laser light,
Especially, regarding the teaching method of the laser beam irradiation condition, FIG.
~ It demonstrates based on FIG. Operation panel 4 for teaching work
7. First, the state for writing data is set, and then the preheating by laser light and the connection are set. Teaching can be performed with or without gripping an electronic component, and it is possible to select whether or not to use laser preheating as well. By inputting the laser light irradiation start position and the irradiation end position, the speed of laser scanning between these two points, the laser light output, the number of repeated executions, etc. according to the flow of FIG. 11, the laser light as shown in FIGS. The irradiation conditions can be set freely.

In the patent specification (Japanese Patent Application No. 3-37198) filed earlier, the applicant of the present invention mounts the electrode parts of electronic parts after remelting the preliminary solder of all the substrate electrode parts by laser light. However, an electronic component connecting method for soldering (a flow chart is shown in FIG. 16) is proposed, but the same can be applied to the electronic component connecting device according to the present invention.

Further, in the above invention, the melting of the solder in the substrate electrode portion was controlled by the time for supplying energy such as laser light, but in the electronic component connecting apparatus according to the present invention, the temperature measuring sensor 7 is used. Since it is possible to control the laser light irradiation conditions while constantly monitoring the temperature of the laser light irradiation position, soldering can be performed with the minimum required energy supply, and excessive thermal shock to both the board and electronic components. The connection time can be greatly reduced without adding.

Further, of the laser light emitted for soldering, the light reflected from the irradiation position is caught by the detection surface of the shape detection means 37 installed in the inner holder 18, and the reflected light hits. Position information and mirrors 25 and 26 swung by the galvanometers 24 and 11.
The angle reflected at the irradiation position can be calculated from the position information of. Further, the shape at the laser light irradiation position can be calculated and obtained by detecting the reflection information of the laser light at the peripheral portion while sequentially scanning the laser light. Then, based on the information from the shape detecting means 37, the irradiation condition of the laser beam is controlled while detecting the remelting condition of the preliminary soldering part and the forming condition of the fillet formed on the electrode part of the electronic component. It is possible to

Further, in the above-mentioned invention, as shown in FIG. 17, laser light is linearly irradiated through the emitting optical section 83 and the cylindrical lens 84, and a plurality of connecting sections are simultaneously heated for soldering. However, in the component connecting device of the present invention, as shown in FIG.
Thus, by irradiating the laser light at high speed a plurality of times, the same state as that in which pseudo linear light is radiated can be created and soldering can be performed.

Further, even when the preliminary solder portion is previously formed by batch reflow, the flux component contained in the cream solder is evaporated by the reflow process and the solder is solidified. Even if a laser beam is scanned and irradiated in the component connecting device to remelt the component and then electronic components are mounted and soldering is performed, solder balls are not generated.

In the above embodiment, the air dryer is used as the heat source for preheating the substrate 41 in the substrate preheating section 45. However, as shown in FIG. 19, a light irradiating means 85 such as a xenon lamp, an ultraviolet lamp, an infrared lamp, or the like. Figure 20
The heater block 87 having the heater 86 shown in is used as a heat source, and the heater block 87 is positioned at a suitable position with respect to the substrate 41 by the heater driving means 88.
Even with the method of preheating No. 1, the same effect can be obtained.

The structure and operation of means for applying flux at a higher speed than the above-described embodiment will be described with reference to FIG. When the bubble generation block 91 is submerged in the flux tank 92 filled with the flux 71, and air is sent into this through the hose 90, flux bubbles 89 are generated on the liquid surface. If the electronic component 40 is gripped by the tip nozzle 23 and moved in this flux bubble 89, the flux 71 can be applied to the electrode portion. According to this method, it is not necessary to position the head portion 49 at a predetermined position above the flux applying portion 52 to stop the head portion 49, and it is possible to apply the flux at a higher speed. However, since it is necessary to wash the flux even after the flux is applied to the peripheral portion of the electrode portion, it cannot be applied to electronic components that cannot be washed.

All of the flux applying means described above apply the flux 71 to the electrode portion of the electronic component 40, but a method of applying the flux 71 to the electrode portion of the substrate 41 will be described. In FIG. 22, the flux 71 filled in the container is brush 93 via a hose 94.
Is supplied to. The tip of the brush 93 is formed by a large number of capillaries, and an appropriate flux is continuously supplied without interruption due to the capillary phenomenon. Since the brush 93 is gripped by a driving unit (not shown) in a state in which it can be arbitrarily moved in the three-dimensional direction, the flux can be applied to an arbitrary portion on the substrate 41. According to this method, a required amount of flux, which is smaller than that using a dispenser, can be stably applied to the preliminary solder portion of the substrate.

[0051]

According to the present invention, a weak heat resistant electronic component and
It is possible to stably solder various types of electronic components including non-cleanable electronic components on a substrate by an automatic machine without damaging the characteristics. Further, since the electronic components can be mounted and permanently fixed in one step to improve the productivity, it is possible to contribute to the improvement of the area productivity of the factory.

[Brief description of drawings]

FIG. 1 is a perspective view of a head portion of a component connecting device of the present invention.

FIG. 2 is a perspective view of the entire component connecting device.

3 is a perspective view showing a detailed configuration of a main part of the electronic component connecting device of FIG.

FIG. 4 is a perspective view showing an outline of an optical system.

FIG. 5 is a perspective view illustrating the operation of the electronic component connecting device.

FIG. 6 is a diagram showing a positional relationship between the electronic component and the substrate when the electronic component is positioned to face the substrate.

FIG. 7 is a diagram in which the head part of the electronic component connecting device is opposed to the positioned substrate.

FIG. 8 is a diagram of an image captured by a scanning optical system.

FIG. 9 is a diagram of an image captured by a substrate recognition optical system.

FIG. 10 is a diagram of an image captured by a component recognition camera.

FIG. 11 is a flowchart illustrating a method of teaching connection conditions.

FIG. 12 is a diagram for explaining how to give a laser light output.

FIG. 13 is a diagram showing an example of laser irradiation.

FIG. 14 is a diagram showing an example of laser irradiation.

FIG. 15 is a diagram showing an example of laser irradiation.

FIG. 16 is a flowchart showing a method of connecting electronic components of the prior application.

FIG. 17 is a diagram showing a method of connecting electronic components using a cylindrical lens.

FIG. 18 is a view showing a method of reciprocating a light beam at high speed and irradiating it pseudo-linearly with the electronic component connecting device of the present application.

FIG. 19 is a diagram showing a light beam irradiation means as a heat source for substrate preheating.

FIG. 20 is a diagram showing a heat block as a heat source for preheating the substrate.

FIG. 21 is a diagram showing a flux application example as a second embodiment of the present application.

FIG. 22 is a diagram showing a flux application example as a third embodiment of the present application.

FIG. 23 is a diagram showing a flow of manually connecting a weak heat resistant component to a board.

FIG. 24 is a diagram showing a flow for connecting a weak heat resistant component to a substrate by low temperature soldering.

FIG. 25 is a diagram showing a flow of manually connecting an electronic component that cannot be cleaned to a board.

FIG. 26 is a diagram showing a method for manually connecting electronic components to a board.

[Explanation of symbols]

 3 Dichroic mirror 4 CCD camera (recognition optical system) 7 Temperature sensor (temperature detection means) 23 Tip nozzle (adsorption nozzle) 27 Scanning optical part (machining beam scanning means) 37 Shape detection means 40 Electronic component 41 Substrate 53 Laser optical system (Processing light irradiation means)

Claims (8)

[Claims] 1. An electronic component connecting device comprising a suction nozzle made of a translucent material and a processing light beam irradiating means for irradiating a processing light beam through the suction nozzle, wherein the suction nozzle transfers and holds the electronic component. An electronic component connecting method for connecting an electronic component onto a substrate by radiating a processing light beam through a suction nozzle made of the light-transmitting material by a processing light beam scanning means provided on the axis of the suction nozzle. 2. The electronic component is connected to the substrate by closely positioning and positioning the electronic component on the electrode portion of the substrate which has been subjected to surface treatment such as preliminary soldering treatment, and sequentially scanning and irradiating the processing light beam. The electronic component connecting method according to claim 1. 3. An electronic component is positioned above an electrode portion of a substrate which has been surface-treated in advance, and a machining light beam is scanned and irradiated on the electronic component electrode portion or the substrate electrode portion to preheat the electronic component, and then the electronic component is attached to the substrate electrode. 2. The electronic component connecting method according to claim 1, further comprising irradiation with a processing light beam before mounting and irradiation with a processing light beam after mounting, which is brought into close contact with the portion and is continuously irradiated with a processing light beam for connection. 4. The processing light beam irradiation before mounting is performed by scanning at high speed by the processing light beam scanning means, after melting the preliminary solder of all the substrate electrode parts, the electronic component gripped by the suction nozzle is mounted. The electronic component connecting method according to claim 3, wherein the electronic components are connected together. 5. A dichroic mirror is provided in the optical axis of the processing light beam, and a recognition optical system for recognizing the periphery of the suction nozzle is provided coaxially with the processing light beam, and the light beam required for recognition is processed by the mirror driving source. 2. The electronic component connecting method according to claim 1, wherein the processing light beam irradiation position is always recognized by scanning together in a relationship of coaxial incident light. 6. A recognition optical system capable of scanning coaxially with a processing light beam to recognize the position of the electronic component while the suction nozzle holds the electronic component, and recognizes the electronic component identically with respect to the mounting position on the substrate. The electronic component connecting method according to claim 5, wherein the electronic component is connected to a predetermined position of the substrate by relatively positioning and mounting in the field of view, scanning and irradiating the bonding portion with the processing light beam. 7. A dichroic mirror is provided midway along the optical axis of the processing light beam, and temperature detecting means for detecting the temperature of the irradiation position of the processing light beam is provided coaxially with the processing light beam, and the light beam required for temperature detection is detected by the scanning means. 2. The electronic component connecting method according to claim 1, wherein both the processing light beam and the coaxial light are capable of scanning, and the electronic component is connected to the substrate while always detecting the temperature information at the processing light beam irradiation position. 8. A dichroic mirror is provided midway along the optical axis of the processing light beam, and shape detection means is provided coaxially with the processing light beam for detecting the shape at the irradiation position of the processing light beam. 2. The scanning can be performed by the processing light beam and the coaxial incident light in relation to each other, and the state of the processing light beam is controlled and irradiated while always detecting the shape at the processing light beam irradiation position, and the electronic component is connected onto the substrate. How to connect electronic components.