KR20150047817A - Laser soldering apparatus for Semiconductor chip and PCB components - Google Patents

Abstract

The present invention relates to a laser soldering device for a semiconductor chip and a PCB device. The soldering device according to an embodiment of the present invention includes: a base which includes a support stand; a semiconductor chip and PCB device supplying unit which is formed on one side of the upper side of the base, receives a plurality of semiconductor chips and PCB devices on a tray, and transfers the semiconductor chips and the PCB devices; a soldering stage which solders the semiconductor chip and the PCB device with laser; a griper unit which is installed on the front side of the support stand of the base and is composed of a guide rail, a first moving element, and a finger; a laser assembly; and a camera module which monitors location determination control signals of the laser assembly, the gripper unit, and a location determination soldering stage on a control unit. The present invention maximizes productivity.

Description

Technical Field [0001] The present invention relates to a laser soldering apparatus for semiconductor chips and PCB elements,

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a laser soldering apparatus for a semiconductor chip and a PCB element, and more particularly to a laser soldering apparatus for a semiconductor chip and a PCB element, Position control, positioning of soldering stage where semiconductor chips and PCB elements are mounted, and precise position control of solder ball solder part through laser heat source enables laser soldering process of semiconductor chips and PCB devices And to a laser soldering apparatus for a semiconductor chip and a PCB element.

In general, Surface Mounted Technology (SMT) is a technology for mounting surface mount electronic components on a printed circuit board (PCB) surface and soldering them.

Surface mount technology has been widely used today because it has many advantages that can narrow the spacing of electronic components, use both sides of the substrate, and reduce the area of the printed circuit board.

Currently, there are reflow soldering using heat conduction or infrared ray as the soldering technology of the surface mounting type component which is widely used.

The reflow soldering is a SMT method in which solder is supplied in advance to a land of a printed circuit board and the solder is remelted by an external heat source to form a lead on the surface- There is a problem that thermal stress is accumulated in the junction due to different thermal expansion coefficients of the substrate and the components.

Particularly, in an intelligent power semiconductor module in which a plurality of power device chips and control device chips are mounted on one semiconductor package, a power board on which a plurality of power device chips are mounted and a drive board There is a problem that various elements are deteriorated by thermal stress.

Specifically, the reflow soldering is a solder method for soldering a cream-like solder in advance to a portion to be bonded in a manufacturing process of a printed wiring board, and then melting and bonding the solder, The solder used in the apparatus is supplied and the solder is re-melted and connected to the external heat source.

In the case of a semiconductor chip and a PCB element which are soldered with higher precision, the semiconductor chip and the PCB element are held until the stage where soldering is performed, and in transferring the semiconductor chip and the PCB element to the set position, the slope of the semiconductor chip and the PCB element held by the finger There is a problem that soldering failure occurs because the correction and control are not performed properly.

For example, even when the semiconductor chip and the PCB element are correctly seated on the soldering stage, provision of the local heating type heat source for each section in which the soldering is performed is performed slowly, which also provides a variation in deterioration with respect to soldering, There is a high possibility that defects will occur.

That is, in reflow soldering apparatus, preheating is performed by intervals and soldering is performed by melting cream solder. However, the accurate position control where soldering is performed has a deviation due to the position control of a single heat source, Soldering failure occurs.

SUMMARY OF THE INVENTION The present invention has been made in order to solve the above-mentioned conventional problems, and it is an object of the present invention to provide a semiconductor chip and a semiconductor device, Soldering stage positioning control for device placement and precise position control of solder ball solder part through laser heat source enables uniform soldering, automatic control of laser output stability affecting soldering quality reproducibility, real time soldering Temperature automatic control, variation of laser beam size according to soldering terminal size, laser beam irradiation at various soldering sites can be performed, thereby minimizing the defective rate in the soldering process of semiconductor chips and PCB devices and ensuring reproducibility of quality For semiconductor chips and PCB devices And to provide a soldering apparatus.

According to an aspect of the present invention, there is provided a laser soldering apparatus for a semiconductor chip and a PCB element,

The soldering apparatus includes a base having a support parallel to the upper portion; A semiconductor chip and a PCB element supply unit provided on one side of the base to mount and transfer a plurality of semiconductor chips and PCB elements on a tray; A semiconductor chip mounted on the upper surface of the semiconductor chip and having a plurality of semiconductor device mounting holes, and a soldering stage for laser soldering the PCB device; A first movable body horizontally movable on the guide rails, and a finger mounted on the first movable body so as to be capable of rotating and lifting and holding and transferring the semiconductor chip and the PCB element Gripper means; A second moving body installed to be movable in a left and right direction from a support of the base; a semiconductor chip mounted on both sides of the second moving body so as to be angularly adjustable to both sides thereof, A laser assembly for preheating; A camera for monitoring the positioning control signal of the positioning soldering stage, the gripper means, and the laser assembly to the control section by photographing the soldering portion of the semiconductor element and the PCB element mounted on the stage, And a module.

The soldering stage according to the present invention is connected to the first table capable of being moved left and right and is rotatably installed. A second table supporting the lower portion of the first table and transferring the soldering stage back and forth together with the front and rear first tables, Is provided.

The laser assembly according to the present invention may further include an irradiation unit electrically connected to the control unit to irradiate the laser beam, an automatic output control unit that measures a part of the laser beam between the irradiation unit and the focusing lens to compensate for the reduction of the laser beam intensity output, A focusing lens for focusing the beam irradiated from the focusing lens to pre-heat the soldering portion, a collimation lens for adjusting the irradiation region of the beam irradiated and provided to be transferred back and forth between the irradiating portion and the focusing lens, And a tilt mirror for setting an irradiation angle of the tilt mirror to each soldering portion.

The laser assembly according to the present invention may further include an infrared ray temperature sensor for detecting a preheating temperature of the beam irradiated to the soldering portion through a focusing lens, a signal electrically connected to the infrared ray temperature sensor for detecting a signal detected by the infrared ray temperature sensor, And the laser power is controlled to control the local preheating temperature of the soldering part.

The semiconductor chip and the laser soldering apparatus for a PCB element of the present invention are fed to a soldering stage along with feeding and feeding of a semiconductor chip and a PCB element and stable holding of a semiconductor chip and a PCB element through the gripper means, It is possible to stabilize the seating of the semiconductor chip and the PCB element by adjusting the inclination of the semiconductor chip and the PCB element by adjusting the rotation of the soldering stage and the longitudinal and transverse directions of the semiconductor chip and the PCB element, The soldering operation of the semiconductor chip and the PCB element can be performed by performing the preheating of the soldering part at a high speed with constant preheating so as to perform the soldering work of the semiconductor chip and the PCB element, Thereby minimizing defects and maximizing productivity.

1 is a perspective view showing a semiconductor chip and a PCB element laser soldering apparatus according to the present invention,
FIG. 2 is a perspective view illustrating a semiconductor chip and a PCB element supply unit according to the present invention,
FIG. 3 is a perspective view showing a soldering stage according to the present invention,
4 is a perspective view illustrating gripper means according to the present invention,
FIG. 5 is a perspective view illustrating the laser assembly according to the present invention,
FIG. 6 is a perspective view illustrating a camera module according to the present invention,
FIG. 7 is a conceptual diagram illustrating irradiation of a laser beam according to the present invention, measurement of a laser beam intensity, and light measurement state at a soldering site,
FIG. 8 is a conceptual diagram illustrating an automatic adjustment of laser beam intensity according to the present invention,
FIG. 9 is a schematic view illustrating a lens focus adjustment state for adjusting the beam size in the irradiation region of the laser beam in FIG. 7;
FIG. 10 is a conceptual view showing an investigation using a tilt mirror capable of two-axis high-speed rotation of soldering sites at various positions in FIG.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, the present invention will be described in detail with reference to the accompanying drawings.

Prior to this, terms and words used in the present specification and claims should not be construed as limited to ordinary or dictionary terms, and the inventor should appropriately interpret the concepts of the terms appropriately It should be interpreted in accordance with the meaning and concept consistent with the technical idea of the present invention based on the principle that it can be defined.

Therefore, the embodiments described in the present specification and the configurations shown in the drawings are only the most preferred embodiments of the present invention, and not all of the technical ideas of the present invention are described. Therefore, It should be understood that various equivalents and modifications may be present.

The semiconductor chip and the laser element soldering apparatus 100 for a PCB element R according to the present invention include a base 110, a semiconductor chip and a PCB element R supply means 200, a soldering stage 300, (400), a laser assembly (500), and a camera module (600).

The base 110 is mounted on a floor, and a support 112, which is parallel to the upper surface, is provided on one side of the upper portion.

The semiconductor chip and the PCB element R supply means 200 are provided on one side of the base 110 to mount a plurality of semiconductor chips S and a PCB element R on the tray T And is installed at one side of the soldering stage 300 to transfer the semiconductor chip and the PCB element R through the gripper means 400. The tray T is mounted on the upper part of the transfer rail and the transfer rail. And is installed so as to be capable of being reciprocally transported to the semiconductor chip and the PCB element R supply line side.

The soldering stage 300 is mounted on the upper surface of the base 110 so as to be rotatable in the front, rear, left, and right directions, and has a plurality of semiconductor chips and a PCB element R mounting hole 301 And is for laser-soldering the mounted semiconductor chip and the PCB element R.

The soldering stage 300 is connected to the first table 310 that can be moved to the left and right and is rotatably installed. The soldering stage 300 supports the lower portion of the first table 310, 2 table 320 is provided on the base 110. [

The adjustment of the soldering stage 300 can be performed by adjusting the front and rear sides of the first table and the second table, respectively, which are operated in accordance with the rotation of the step motor (not shown).

The gripper means 400 includes a guide rail 401 installed on the front surface of the base 110, a first moving body 410 installed horizontally horizontally on the guide rail, a first moving body 410 And a finger 420 for holding and transferring the semiconductor chip S and the PCB element R.

The laser assembly 500 includes a second moving body 510 installed to be movable left and right from a support of the base 110 and a second moving body 510 installed on both sides of the lower portion of the second moving body 510, To irradiate a soldering portion of the semiconductor chip (S) placed on the soldering stage (300) to preheat the beam.

The camera module 600 is movably mounted on a second moving body 510 constituting a laser assembly 500 so as to photograph the soldered parts of the semiconductor chip and the PCB element R mounted on the stage, And to monitor the positioning control signal of the crystal and soldering stage, the gripper means, and the laser assembly to the control unit 10. [

That is, the soldering position photographing of the semiconductor chip and the PCB element R is established through the camera module 600 and is connected to a monitor (not shown) to determine whether the position is properly positioned or not, So that the operation of each part can be performed.

The laser assembly 500 includes an irradiation unit 501 electrically connected to the controller 10 to irradiate a laser beam, an optical sensor that measures a part of the laser beam, and an optical sensor that is electrically connected to the optical sensor, An automatic power control unit (PD) that feeds back the measured signal from the sensor to the AD converter and the control unit to control the laser power again to the original intensity when the laser power is decreased; a focusing unit that focuses the beam irradiated from the irradiation unit 501 to pre- A collimation lens 503 for adjusting the irradiation area of a beam to be irradiated and installed between the irradiation part and the focusing lens so as to be able to be transferred back and forth and an irradiation angle and various parts of the beam irradiated through the focusing lens And a tilt mirror 504 that can be soldered.

The laser assembly 500 further includes an infrared ray temperature sensor 20 for detecting a preheating temperature of the beam irradiated to the soldering portion through a focusing lens 502, an infrared ray temperature sensor 20 electrically connected to the infrared ray temperature sensor, The signal is fed back to the AD converter 30 and the control unit 10 to control the laser power so as to control the local preheating temperature of the soldering region.

In the drawing, reference character D denotes a dispenser for forming a solder ball at a soldering portion.

The operations of the semiconductor chip and the laser soldering apparatus for a PCB element according to the present invention will be described as follows.

A plurality of semiconductor chips S placed on a tray T through a semiconductor chip and a PCB element R supply means 200 are gripped by gripper means 400 And is mounted on the semiconductor chip S of the soldering stage 300 and the PCB mounting recess 301 of the soldering stage 300 for laser soldering.

A dispenser liquid, that is, a solder ball, which is separately installed on one side of the gripper means 400 before the soldering operation is performed, is embedded in the soldering region via the dispenser D.

The finger 420 for holding the semiconductor chip S and the PCB element R in the tray is provided with right and left grip portions to be movable in the left and right direction and holds the semiconductor chip and the PCB element R at this time, The first moving body 410 and the first moving body 410 which are horizontally movable along the guide rail 401 through the support base 112 can be rotated and lifted and moved from the first moving body 410 to the holding stage 112, The fingers 420 themselves adjust the holding state of the semiconductor chip S and the PCB element R so that the semiconductor chip S and the PCB element R are accurately aligned horizontally with respect to the semiconductor socket 301.

That is, the finger 420 can be adjusted in three axial directions so that the finely tilted semiconductor chip and the PCB element R can be stably held or seated as described above.

In addition, the soldering stage is capable of finely adjusting the front, rear, and left and right directions of the first and second tables as well as the self-rotation.

Therefore, the semiconductor chip can be positioned in a stable state on the soldering stage, thereby achieving a precise retouch soldering operation.

The soldering operation is performed through the laser assembly 500 mounted on the second moving body 510 installed to be movable from the support base 112 of the base 110 to the left and right. Preheating is necessary by irradiating the soldering part of the PCB element (R) with a beam.

7 and 8, the beam irradiated from the irradiating unit 501 constituting the laser assembly 500 to pre-heat the soldering region is essentially as follows.

A beam that is electrically connected to the control unit 10 and that emits a laser beam passes through the collimation lens 503 and the focusing lens 502 to preheat the soldering region, The preheating can be performed while adjusting the irradiation area of the irradiated beam and the incident angle of the finally irradiated beam can be preheated while quickly controlling the position of the beam irradiated by the tilt mirror 504 to the soldering site.

As shown in FIG. 8, when the intensity of the laser output decreases with time, the intensity of the laser beam irradiated by the automatic output controller PD is measured by measuring the intensity of the laser beam, The laser output is raised again to maintain a constant laser intensity.

The automatic output control unit (PD) uses a grained die.

The infrared ray temperature sensor 20 senses the preheating temperature of the beam irradiated to the soldering region through the focusing lens 502 and is electrically connected to the infrared ray temperature sensor and outputs a signal sensed by the infrared ray temperature sensor to the AD converter 30 and / By controlling the local preheating temperature of the soldering region by controlling the laser power by feeding back to the control unit 10, it is possible to prevent the semiconductor chip S and the PCB element (R) from being damaged by stable thermal soldering .

As described above, the present invention has been described with reference to particular embodiments, such as specific elements, and specific embodiments and drawings. However, it should be understood that the present invention is not limited to the above- And various modifications and changes may be made thereto by those skilled in the art to which the present invention pertains.

Accordingly, the spirit of the present invention should not be construed as being limited to the embodiments described, and all of the equivalents or equivalents of the claims, as well as the following claims, belong to the scope of the present invention .

10: control unit 20: infrared temperature sensor
30: AD converter 100: Soldering device
110: base 112: support
200: semiconductor chip supply means 300: soldering stage
301: semiconductor chip seating hole 310: first table
320: second table 400: gripper means
401: Guide rail 410: First moving body
420: Finger 500: Laser assembly
501: illuminating unit 502: focusing lens
503: collimation lens 504: tilt mirror
510: second moving body 600: camera module
PD: Automatic output control section S: Semiconductor chip
R: PCB element T: Tray

Claims (4)

A laser soldering apparatus for a semiconductor chip and a PCB element,
The soldering apparatus (100)
A base 110 provided with a support 112 parallel to the top;
A semiconductor chip supply means 200 provided on one side of the base 110 for receiving and transporting a plurality of semiconductor chips S and a PCB element R to the tray T;
A plurality of semiconductor chip mounting holes 301 are provided on the upper surface of the base 110 so as to be rotatable in the front, rear, left, and right directions from the upper portion of the base 110. Soldering the semiconductor chip and the PCB element R, A soldering stage 300;
A first moving body 410 installed horizontally and horizontally on the guide rail and a guide rail 401 installed on the front surface of the base 110. The first moving body 410 is installed to be rotatable and liftable from the first moving body 410 Gripper means (400) comprising a finger (420) for holding and transferring the semiconductor chip (S) and the PCB element ruler (R);
A second moving body 510 installed to be movable left and right from a support base 112 of the base 110 and a second moving body 510 installed on both sides of the lower portion of the second moving body 510 to be adjustable in both sides, A laser assembly 500 for irradiating and preheating a soldering portion of the semiconductor chip S and the PCB element R,
The semiconductor chip mounted on the second movable body 510 so as to move up and down and to photograph the soldering portion of the semiconductor element R and the PCB element R to display an image, And a camera module (600) for monitoring the controller module (10).
The method according to claim 1,
The soldering stage 300 is connected to the first table 310 that can be moved to the left and right and is rotatably installed. The soldering stage 300 supports the lower portion of the first table 310, 2. A laser soldering apparatus for a semiconductor chip and a PCB element, wherein a table (320) is provided on a base (110).
The method according to claim 1,
The laser assembly 500 includes an irradiation unit 501 electrically connected to the control unit 10 to irradiate a laser beam, and an automatic control unit 506 for measuring a part of the laser beam between the irradiation unit and the focusing lens, A focusing lens 502 for focusing the beam irradiated from the irradiating unit to pre-heat the soldering region, and a collimating lens 502 for adjusting the irradiation region of the beam to be irradiated, And a high-speed tilt mirror (504) for setting an irradiation angle of the beam irradiated through the focusing lens to each soldering site. 2. The laser soldering apparatus for a semiconductor chip and PCB element according to claim 1,
The method of claim 3,
The laser assembly 500 is provided with an infrared ray temperature sensor 20 for detecting a preheating temperature of a beam irradiated to a soldering portion through a focusing lens 502, Is connected to the AD converter (30) and the control unit (10) to control the laser power to control the local preheating temperature of the soldering region.

Images