TWI818377B - Bump forming device, bump forming method, solder ball repair device, and solder ball repair method - Google Patents

Bump forming device, bump forming method, solder ball repair device, and solder ball repair method Download PDF

Info

Publication number
TWI818377B
TWI818377B TW110145825A TW110145825A TWI818377B TW I818377 B TWI818377 B TW I818377B TW 110145825 A TW110145825 A TW 110145825A TW 110145825 A TW110145825 A TW 110145825A TW I818377 B TWI818377 B TW I818377B
Authority
TW
Taiwan
Prior art keywords
plasma
solder ball
laser
solder
ball
Prior art date
Application number
TW110145825A
Other languages
Chinese (zh)
Other versions
TW202230551A (en
Inventor
海津拓哉
藤瀬一宏
水越太一
水鳥量介
Original Assignee
日商艾美柯技術股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商艾美柯技術股份有限公司 filed Critical 日商艾美柯技術股份有限公司
Publication of TW202230551A publication Critical patent/TW202230551A/en
Application granted granted Critical
Publication of TWI818377B publication Critical patent/TWI818377B/en

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/11—Manufacturing methods
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/005—Soldering by means of radiant energy
    • B23K1/0056—Soldering by means of radiant energy soldering by means of beams, e.g. lasers, E.B.
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K10/00—Welding or cutting by means of a plasma
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67288—Monitoring of warpage, curvature, damage, defects or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
    • H01L2021/60292—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation involving the use of an electron or laser beam
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/11—Manufacturing methods
    • H01L2224/111—Manufacture and pre-treatment of the bump connector preform
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/7525—Means for applying energy, e.g. heating means
    • H01L2224/75261—Laser
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/7525—Means for applying energy, e.g. heating means
    • H01L2224/7528—Resistance welding electrodes, i.e. for ohmic heating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/81009—Pre-treatment of the bump connector or the bonding area
    • H01L2224/81022—Cleaning the bonding area, e.g. oxide removal step, desmearing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/812—Applying energy for connecting
    • H01L2224/81201—Compression bonding
    • H01L2224/81203—Thermocompression bonding, e.g. diffusion bonding, pressure joining, thermocompression welding or solid-state welding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/812—Applying energy for connecting
    • H01L2224/8122—Applying energy for connecting with energy being in the form of electromagnetic radiation
    • H01L2224/81224—Applying energy for connecting with energy being in the form of electromagnetic radiation using a laser

Abstract

[課題] 本發明的目的為提供在極微細焊接凸塊形成中，信賴性高的焊接裝置及方法。 [解決手段] 本發明的凸塊形成裝置，係在形成於基板上的電極墊片上供應焊接球的凸塊形成裝置，具備：對供應的焊接球照射電漿除去焊接球的氧化膜的電漿產生裝置、及對焊接球照射雷射，熔融焊接球的雷射產生裝置；藉由電漿照射手段除去焊接球的氧化膜，同時藉由雷射照射手段熔融焊接球，在電極墊片形成焊接凸塊。 [Problem] An object of the present invention is to provide a highly reliable soldering device and method for forming extremely fine solder bumps. [Solution] The bump forming device of the present invention is a bump forming device that supplies solder balls on electrode pads formed on a substrate, and is equipped with an electrode that irradiates the supplied solder balls with plasma to remove the oxide film of the solder balls. Plasma generating device, and laser generating device that irradiates the soldering ball with laser and melts the soldering ball; removes the oxide film of the soldering ball by means of plasma irradiation, and simultaneously melts the soldering ball by means of laser irradiation, forming a layer on the electrode pad Solder bumps.

Description

凸塊形成裝置、凸塊形成方法、焊接球修復裝置、及焊接球修復方法Bump forming device, bump forming method, solder ball repair device, and solder ball repair method

本發明係關於在使用於半導體裝置的封裝基板的電極製造工程中，在基板上搭載焊接球的凸塊形成裝置及凸塊形成方法、還有檢查形成的電極並補修(修復)缺陷部分的焊接球修復裝置及焊接球修復方法。The present invention relates to a bump forming device and a bump forming method for mounting solder balls on a substrate in an electrode manufacturing process for a package substrate used in a semiconductor device, and a soldering method for inspecting the formed electrode and repairing (repairing) defective parts. Ball repair device and welding ball repair method.

近年，對於在半導體裝置的電連接，使用利用焊接的凸塊形成技術。例如，有藉由使用高精度網版印刷裝置，在基板的電極上印刷膏狀焊料並進行迴焊，以150～180μm的間距形成直徑80～100μm的焊接凸塊電極的膏狀焊接印刷法。In recent years, bump formation technology using soldering has been used for electrical connection in semiconductor devices. For example, there is a paste solder printing method in which solder bump electrodes with a diameter of 80 to 100 μm are formed at a pitch of 150 to 180 μm by printing cream solder on electrodes of a substrate and reflowing the electrodes using a high-precision screen printing device.

又，隨著半導體裝置的小型化/高性能化所致的電極微細化，在將微細的孔以高精度加工的冶具轉印焊接球並以預定的間距使其整列，在直接基板上搭載後進行迴焊，形成焊接凸塊電極的球轉印法。In addition, with the miniaturization of electrodes due to the miniaturization and improvement of the performance of semiconductor devices, solder balls are transferred to a jig with high-precision processing of fine holes, aligned at a predetermined pitch, and mounted on a direct substrate. A ball transfer method that performs reflow and forms solder bump electrodes.

在這種背景技術中，特開2000-049183號公報(專利文獻1)揭示在遮罩上從空氣噴嘴供應焊接球，使遮罩擺動及振動，同時在預定的開口部填充焊接球，再藉由刷子及刮刀的併進運動進行填充後加熱的方法。不過，並非所有的焊接球都會正確搭載於各凸塊形成位置，根據情形會有搭載不良產生。In this background technology, Japanese Patent Application Laid-Open No. 2000-049183 (Patent Document 1) discloses that solder balls are supplied from an air nozzle to the mask, and the mask is oscillated and vibrated, and at the same time, solder balls are filled in a predetermined opening, and then the solder balls are filled in a predetermined opening. This method uses the parallel movement of brushes and scrapers to perform filling and then heating. However, not all solder balls will be correctly mounted on each bump formation position, and mounting defects may occur depending on the situation.

因此，特開2003-309139號公報(專利文獻2)揭示設置焊接球的修復裝置，將不良焊接球以管構件吸引並除去後，使管構件吸附新的良品焊接球後搬送及再搭載至有缺陷的部分，藉由雷射光照射部，從管構件的內側照射雷射光使焊接球熔融並暫時固定的技術。Therefore, Japanese Patent Application Laid-Open No. 2003-309139 (Patent Document 2) discloses a repair device provided with solder balls. After the defective solder balls are sucked and removed by a pipe member, new good solder balls are adsorbed on the pipe member and then transported and reloaded to an existing place. The defective part is irradiated with laser light from the inside of the pipe member through the laser irradiation part, so that the solder ball is melted and temporarily fixed.

又，特開2008-288515號公報(專利文獻3)及特開2009-177015號公報(專利文獻4)揭示檢查印刷焊接球的基板的狀態，因應不良狀態進行補修的由檢查/修復部構成的焊接球印刷裝置。Furthermore, Japanese Patent Application Laid-Open No. 2008-288515 (Patent Document 3) and Japanese Patent Application Laid-Open No. 2009-177015 (Patent Document 4) disclose an inspection/repair unit that inspects the state of a substrate on which solder balls are printed and performs repairs according to the defective state. Solder ball printing device.

又，特開2010-010565號公報(專利文獻5)揭示具備檢查在基板的電極墊片上搭載的焊接球的狀態，對檢出缺陷的電極墊片供慹焊接球的修復用點膠機的焊接球檢查修復裝置。Furthermore, Japanese Patent Application Laid-Open No. 2010-010565 (Patent Document 5) discloses a dispensing machine for inspecting the state of solder balls mounted on electrode pads of a substrate and repairing solder balls by supplying solder balls to the electrode pads where defects are detected. Solder ball inspection and repair device.

又，作為加熱焊接球者，有特許第3173338號(專利文獻6)、特許第3822834號(專利文獻7)、特許第5098648號(專利文獻8)，作為使用電漿除去氧化膜者，有特開2015-103688號公報(專利文獻9)，作為以雷射進行加熱熔融者，有特開2003-309139號公報(專利文獻10)。 [先前技術文獻] [專利文獻] In addition, there are Patent No. 3173338 (Patent Document 6), Patent No. 3822834 (Patent Document 7), and Patent No. 5098648 (Patent Document 8) for heating solder balls, and there are special patents for using plasma to remove oxide films. Japanese Patent Application Publication No. 2015-103688 (Patent Document 9), and Japanese Patent Application Publication No. 2003-309139 (Patent Document 10) that uses laser heating and melting. [Prior technical literature] [Patent Document]

[專利文獻1]特開2000-049183號公報 [專利文獻2]特開2003-309139號公報 [專利文獻3]特開2008-288515號公報 [專利文獻4]特開2009-177015號公報 [專利文獻5]特開2010-010565號公報 [專利文獻6]特許第3173338號 [專利文獻7]特許第3822834號 [專利文獻8]特許第5098648號 [專利文獻9]特開2015-103688號公報 [專利文獻10]特開2003-309139號公報 [Patent Document 1] Japanese Patent Application Publication No. 2000-049183 [Patent Document 2] Japanese Patent Application Publication No. 2003-309139 [Patent Document 3] Japanese Patent Application Publication No. 2008-288515 [Patent Document 4] Japanese Patent Application Publication No. 2009-177015 [Patent Document 5] Japanese Patent Application Publication No. 2010-010565 [Patent Document 6] Patent No. 3173338 [Patent Document 7] Patent No. 3822834 [Patent Document 8] Patent No. 5098648 [Patent Document 9] Japanese Patent Application Publication No. 2015-103688 [Patent Document 10] Japanese Patent Application Publication No. 2003-309139

[發明所欲解決的問題][Problem to be solved by the invention]

現在，5G(第5世代移動通信系統)對應技術的實用化已開始。又，用於凸塊電極形成的焊接球直徑也從70～80μm進展到30～50μm以下等的極小尺寸。隨著在5G使用的半導體裝置的小型化/高速化/大容量化造成的凸塊電極的極微細化，即便藉由上述專利文獻中揭示的技術及裝置進行迴焊的情形，也因為焊接浸潤性及金屬間化合物(IMC)層等的問題，而會有焊接缺陷及破裂等、焊料接合界面的信賴性降低及焊接凸塊電極中的缺陷產生等的問題。Now, the practical application of technologies corresponding to 5G (fifth generation mobile communication system) has begun. In addition, the diameter of solder balls used for bump electrode formation has also progressed from 70 to 80 μm to extremely small sizes such as 30 to 50 μm or less. As semiconductor devices used in 5G are miniaturized/high-speed/large-capacity, bump electrodes are becoming extremely fine. Even when resoldering is performed using the technology and equipment disclosed in the above-mentioned patent documents, solder wetting will occur. Due to problems such as properties and intermetallic compound (IMC) layers, there may be problems such as welding defects and cracks, reduced reliability of the solder joint interface, and the occurrence of defects in the solder bump electrodes.

專利文獻2揭示的技術中，修復後殘留助焊劑的量變少的機率高，在迴焊時，焊料浸潤性差的情形中，在焊接球溶化時會有對電極墊片部的焊接變得不完全的浸潤不良產生之虞。In the technology disclosed in Patent Document 2, there is a high probability that the amount of residual flux will be reduced after repair. If the solder wettability is poor during reflow, the soldering of the electrode pad portion may become incomplete when the solder ball melts. The risk of poor infiltration.

又，專利文獻3～5揭示的焊接球印刷裝置中的焊接球檢查修復裝置、及專利文獻6～10揭示的技術中，迴焊後進行再檢查，搭載焊接球，實施修復的情形中，即便在新再供應的焊接球塗佈助焊劑，也因為由於先行進行的迴焊工程的氧化作用而使電極墊片部受到破壞(影響)，焊接缺陷產生的機率高。又，與通常的焊接比較，會有在焊接信賴性產生問題的可能性。Furthermore, in the solder ball inspection and repair devices in the solder ball printing apparatus disclosed in Patent Documents 3 to 5, and in the techniques disclosed in Patent Documents 6 to 10, even when re-inspection is performed after reflow, solder balls are mounted, and repair is performed. When flux is applied to newly supplied solder balls, the electrode pad portion is damaged (affected) due to oxidation in the previously performed reflow process, and the probability of welding defects is high. In addition, compared with ordinary welding, there is a possibility of causing problems in welding reliability.

在此，本發明的目的為提供檢查在基板的電極墊片上產生的凸塊缺陷，對缺陷電極部將焊接球進行再供應/修復，進行焊接的裝置。又，目的為提供在極微細焊接凸塊中，作為對迴焊後的凸塊電極的缺陷部位的修復/焊接，信賴性高的修復焊接裝置及方法。又，目的為提供在極微細焊接凸塊形成中，信賴性高的焊接裝置及方法。 [解決問題的手段] Here, an object of the present invention is to provide an apparatus that inspects bump defects produced on electrode pads of a substrate, resupplies/repairs solder balls to the defective electrode portions, and performs soldering. Furthermore, the object is to provide a highly reliable repair welding device and method for repairing/welding defective parts of bump electrodes after reflow in extremely fine solder bumps. Furthermore, the object is to provide a highly reliable soldering device and method for forming extremely fine solder bumps. [Methods to solve problems]

為了解決上述課題，本發明的凸塊形成裝置，係在於基板上形成的電極墊片上供應焊接球的凸塊形成裝置，具備：對供應的焊接球照射電漿，除去焊接球的氧化膜的電漿產生裝置(電漿照射手段)、及對焊接球照射雷射，熔融焊接球的雷射產生裝置(雷射照射手段)；藉由從電漿照射手段照射的電漿除去焊接球的氧化膜，同時藉由從雷射照射手段照射的雷射熔融焊接球，在電極墊片形成焊接凸塊。In order to solve the above problems, a bump forming apparatus of the present invention is a bump forming apparatus that supplies solder balls on electrode pads formed on a substrate, and is provided with a means for irradiating the supplied solder balls with plasma to remove the oxide film of the solder balls. A plasma generating device (plasma irradiation means), and a laser generating device (laser irradiation means) that irradiates a solder ball with laser and melts the solder ball; and removes oxidation of the solder ball by plasma irradiated from the plasma irradiation means film, and at the same time, solder bumps are formed on the electrode pads by melting the solder balls irradiated by laser irradiation means.

又，本發明的凸塊形成方法，係在於基板上形成的電極墊片上，供應焊接球的凸塊形成方法，其中，對電極墊片供應焊接球後，對焊接球照射電漿，一同照射雷射，除去焊接球的氧化膜，同時熔融焊接球，對電極墊片進行焊接。Furthermore, the bump forming method of the present invention is a bump forming method in which solder balls are supplied to electrode pads formed on a substrate. After supplying solder balls to the electrode pads, the solder balls are irradiated with plasma and simultaneously irradiated. The laser removes the oxide film of the solder ball, melts the solder ball, and welds the electrode pad.

又，本發明的焊接球修復裝置，具備檢查形成於基板的電極墊片上的焊接凸塊的狀態，對檢出缺陷的電極墊片供應焊接球的修復用點膠機，該焊接球修復裝置，具備：對藉由修復用點膠機供應的焊接球照射電漿，除去焊接球的氧化膜的電漿產生裝置、及對焊接球照射雷射，熔融焊接球的雷射產生裝置；除去焊接球的氧化膜的同時，熔融焊接球，在電極墊片形成焊接凸塊。Furthermore, the solder ball repair device of the present invention is provided with a repair dispensing machine that checks the state of the solder bumps formed on the electrode pads of the substrate and supplies solder balls to the electrode pads where defects are detected. The solder ball repair device , equipped with: a plasma generator that irradiates the solder balls supplied by the repair dispensing machine with plasma to remove the oxide film of the solder balls; and a laser generator that irradiates the solder balls with laser and melts the solder balls; removes the solder At the same time as the ball's oxide film is formed, the solder ball is melted to form a solder bump on the electrode pad.

又，本發明的焊接球修復方法，係藉由焊接球檢查工程檢查在基板的電極墊片上形成的焊接凸塊的狀態，對藉由焊接球檢查工程檢出缺陷的電極墊片藉由修復用點膠機供應焊接球，對藉由修復用點膠機檢出缺陷的電極墊片供應焊接球後，對焊接球照射電漿，一同照射雷射，除去焊接球的氧化膜，同時熔融焊接球，對前述電極墊片進行焊接。 [發明的效果] Furthermore, the solder ball repair method of the present invention inspects the state of the solder bumps formed on the electrode pads of the substrate through the solder ball inspection process, and repairs the electrode pads with defects detected through the solder ball inspection process. Use a dispensing machine to supply welding balls. After supplying welding balls to the electrode pads whose defects are detected by repairing the dispensing machine, the welding balls are irradiated with plasma and laser at the same time to remove the oxide film of the welding balls and simultaneously melt and weld them. Ball, weld the aforementioned electrode pad. [Effects of the invention]

藉由本發明，能夠提供檢查在基板的電極墊片上產生的凸塊缺陷，對缺陷電極部將焊接球進行再供應/修復，進行焊接的裝置。又，能夠提供在極微細焊接凸塊中，作為對迴焊後的凸塊電極的缺陷部位的修復/焊接，信賴性高的修復焊接裝置及方法。又，能夠提供在極微細焊接凸塊形成中，信賴性高的焊接裝置及方法。According to the present invention, it is possible to provide a device that inspects bump defects generated on electrode pads of a substrate, resupplies/repairs solder balls to the defective electrode portions, and performs soldering. Furthermore, it is possible to provide a highly reliable repair welding device and method for repairing/welding defective parts of bump electrodes after reflow in extremely fine solder bumps. Furthermore, it is possible to provide a highly reliable soldering device and method for forming extremely fine solder bumps.

此外，關於上述以外的課題、構造及效果，藉由實施例的說明更為明瞭。In addition, problems, structures, and effects other than those described above will become clearer through the description of the embodiments.

以下，使用圖式，說明關於本發明的實施例的裝置及方法的適合的實施形態。 [實施例1] Hereinafter, suitable embodiments of the apparatus and method according to the embodiment of the present invention will be described using drawings. [Example 1]

圖1表示助焊劑印刷及焊接球搭載/印刷工程的概略圖。Figure 1 shows a schematic diagram of the flux printing and solder ball mounting/printing process.

如圖1(a)所示，首先，在基板21的電極墊片22上將預定量的助焊劑23藉由網版印刷法進行轉印。本實施例中，在網版20為了能夠保障高精度的圖案位置精度，使用以加成法製作的金屬網版。作為刮刀3使用角刮刀、劍刮刀、及平刮刀的任一者都可以。首先，設定因應助焊劑23的黏度/搖變性的網版間隙、印壓、及刮刀速度等條件。接著，以設定的條件執行助焊劑的印刷。As shown in FIG. 1(a) , first, a predetermined amount of flux 23 is transferred on the electrode pad 22 of the substrate 21 by a screen printing method. In this embodiment, in order to ensure high-precision pattern position accuracy, a metal screen made by an additive method is used in the screen 20 . As the scraper 3, any of a corner scraper, a sword scraper, and a flat scraper may be used. First, set the conditions such as screen gap, printing pressure, and squeegee speed in response to the viscosity/thixotropy of flux 23. Next, flux printing is performed under the set conditions.

印刷的助焊劑23之量少的情形，在焊接球填充時有無法將焊接球附著在電極墊片22上之虞。又，在迴焊時的成為焊接浸潤不良的要因，無法形成漂亮形狀的凸塊，也會成為凸塊高度不良及焊接連接強度不足的要因。When the amount of printed flux 23 is small, the solder balls may not be able to adhere to the electrode pad 22 during filling of the solder balls. In addition, it may cause poor solder wetting during reflow, resulting in the inability to form beautifully shaped bumps, defective bump height, and insufficient solder connection strength.

相反地，若助焊劑之量過多的情形，焊接球搭載/印刷時網版的開口部若附著多餘的助焊劑，焊接球會附著於網版的開口部，焊接球無法轉印至基板上。因此，為了維持焊接球搭載中的品質，助焊劑印刷是非常重要的因子。On the contrary, if the amount of flux is too much and excess flux adheres to the opening of the screen when mounting/printing the solder balls, the solder balls will adhere to the openings of the screen and the solder balls will not be transferred to the substrate. Therefore, in order to maintain the quality of solder ball mounting, flux printing is a very important factor.

接著，如圖1(b)所示，在印刷助焊劑23的基板21的電極墊片22上搭載/印刷焊接球24。本實施例中，使用直徑約30μm的焊接球。此外，焊接球隨著半導體裝置的小型化/高速化/大容量化所致的凸塊電極的極微細化，其直徑也進展至25μm～30μm的極小尺寸。焊接球24的搭載中使用的網版20b，為了能夠保障高精度的圖案位置精度，使用以加成法製作的金屬網版。Next, as shown in FIG. 1( b ), solder balls 24 are mounted/printed on the electrode pads 22 of the substrate 21 on which the flux 23 is printed. In this embodiment, a solder ball with a diameter of about 30 μm is used. In addition, along with the miniaturization of bump electrodes due to the miniaturization, speed increase, and increase in capacity of semiconductor devices, the diameter of solder balls has also progressed to an extremely small size of 25 μm to 30 μm. The screen 20b used for mounting the solder ball 24 uses a metal screen produced by an additive method in order to ensure high-precision pattern position accuracy.

網版20b的材質使用例如鎳那種磁性體材料。藉此，網版20b，被來自設於載台10的磁體10s的磁力吸引，能夠使基板21與網版20b之間的間隙成為0。因此，能夠防止焊接球24潛入基板21與網版20b之間使剩餘球產生的不良。The screen plate 20b is made of a magnetic material such as nickel. Thereby, the screen 20b is attracted by the magnetic force from the magnet 10s provided on the stage 10, and the gap between the substrate 21 and the screen 20b can be made zero. Therefore, it is possible to prevent the solder balls 24 from sneaking into the space between the substrate 21 and the screen 20 b and causing defects such as remaining balls.

又，在網版20b的裏面設置樹脂製或金屬製的微小支柱20a。藉此，構成助焊劑23滲出時的逃脫部。因此，印刷助焊劑23的基板21密著至網版20b時，能夠防止滲出的助焊劑23防著至網版的開口部內。Furthermore, resin or metal minute pillars 20a are provided on the back side of the screen plate 20b. This forms an escape portion when the flux 23 oozes out. Therefore, when the substrate 21 on which the flux 23 is printed is in close contact with the screen 20 b, it is possible to prevent the exuded flux 23 from sticking into the opening of the screen.

在基板21的角部4點設置定位標記(圖未示)。藉由攝影機15f(圖2參照)視覺辨識基板21上的定位標記與網版20b側的定位標記(圖未示)，進行高精度對位。藉此，能夠在預定的電極墊片22上將焊接球24高精度供應。Positioning marks (not shown) are provided at four corners of the substrate 21 . The positioning mark on the substrate 21 and the positioning mark (not shown) on the screen plate 20b side are visually recognized by the camera 15f (refer to FIG. 2), thereby performing high-precision alignment. Thereby, the solder ball 24 can be supplied to the predetermined electrode pad 22 with high precision.

網版20b上所示的條狀體63，為構成用來供應焊接球的填充單元(圖4參照)的一要素。藉由使條狀體63擺動同時填充單元在箭頭60V方向移動，推滾焊接球24，向網版20b的開口部20d一個又一個填充。The strip-shaped body 63 shown on the screen 20b is an element constituting a filling unit (see FIG. 4 ) for supplying solder balls. By swinging the strip body 63 and moving the filling unit in the direction of arrow 60V, the solder balls 24 are pushed and rolled to fill the opening 20d of the screen plate 20b one by one.

圖2為表示從助焊劑印刷到焊接球檢查修復的工程的一實施例的概略圖。FIG. 2 is a schematic diagram showing one embodiment of the process from flux printing to solder ball inspection and repair.

圖2所示的裝置，將助焊劑印刷部101、焊接球搭載/印刷部103、及檢查/修復部104作為一體構成。各部以帶輸送器25連結，藉由該帶輸送器25搬送基板。在助焊劑印刷部101及焊接球搭載/印刷部103，設置用來作業的載台10f、載台10b。使該載台10f、載台10b上下移動進行基板的收授及收取。載台10f、載台10b也能在水平方向(XYθ方向)移動。又，藉由以攝影機15f、攝影機15b攝像網版20、網版20b與基板的對位標記(圖未示)，能夠進行網版20、網版20b與基板的對位。通過檢查/修復部104的基板被送至次段的工程的圖未示的迴焊部，藉由進行加熱，搭載的焊接球被熔融，在電極墊片上進行焊接，形成凸塊。The device shown in FIG. 2 has a flux printing unit 101, a solder ball mounting/printing unit 103, and an inspection/repair unit 104 as an integrated structure. Each part is connected by the belt conveyor 25, and the board|substrate is conveyed by this belt conveyor 25. The flux printing section 101 and the solder ball mounting/printing section 103 are provided with stages 10f and 10b for operation. The stages 10f and 10b are moved up and down to receive and receive substrates. The stages 10f and 10b can also move in the horizontal direction (XYθ direction). Furthermore, by using the cameras 15f and 15b to capture the alignment marks (not shown) of the screen 20, the screen 20b, and the substrate, the screen 20, the screen 20b, and the substrate can be aligned. The substrate that has passed the inspection/repair section 104 is sent to a reflow section (not shown) in the next step of the process, and is heated to melt the solder balls mounted thereon and solder them on the electrode pads to form bumps.

圖3表示本實施例的凸塊形成的工程的流程圖。FIG. 3 shows a flow chart of the bump formation process of this embodiment.

首先將基板搬入助焊劑印刷部(STEP1)。之後，在電極墊片上印刷預定量的助焊劑(STEP2)。接著，檢查助焊劑印刷後的網版開口狀況(STEP3)。檢查的結果NG(不良)的情形，以印刷裝置內具備的版下清掃裝置自動實施網版清掃，因應必要供應補充助焊劑。又，成為NG的基板，與NG信號一同使其在後工程的輸送帶上待機並向線外排出，而不實施焊接球印刷以後的工程。藉由使用在線的NG基板置放架等將匣一併排出也可以。NG基板以線外的工程實施洗淨後，能夠再度使用於助焊劑印刷(STEP4)。First, load the substrate into the flux printing section (STEP1). After that, a predetermined amount of flux is printed on the electrode pad (STEP 2). Next, check the screen opening condition after flux printing (STEP3). If the inspection result is NG (defective), the under-plate cleaning device provided in the printing device will automatically clean the screen and supply additional flux as necessary. In addition, the substrate that has become NG is put on standby on the conveyor belt of the post-process along with the NG signal and discharged out of the line, without performing the process after solder ball printing. It is also possible to discharge the cassettes together using an online NG substrate rack or the like. After the NG substrate is cleaned in an off-line process, it can be reused for flux printing (STEP 4).

對良品基板實施焊接球搭載/印刷(STEP5)。焊接球搭載/印刷結束後，使其進行版脫離前，從網版的上方檢查網版開口內的焊接球的填充狀況(STEP6)。其結果，有填充不足的位置存在的情形，再度執行焊接球搭載/印刷動作(STEP7)。藉此能夠提升焊接球的填充率。Implement solder ball mounting/printing (STEP 5) on the good substrate. After the solder ball mounting/printing is completed, and before it is detached from the screen, check the filling status of the solder balls in the screen opening from above the screen (STEP 6). As a result, there may be an insufficiently filled position, and the solder ball mounting/printing operation is performed again (STEP 7). This can improve the filling rate of solder balls.

STEP6的檢查若是OK，則實施版脫離(STEP8)，以檢查/修復裝置檢查焊接球的搭載狀況(STEP9)。經由焊接球搭載狀況的檢查而為NG的情形，在供應助焊劑後，將焊接球再供應至不良位置的電極墊片部(STEP10)。經由搭載狀況的檢查為OK的情形，以配置於次段的工程的圖未示的迴焊裝置熔融焊接球(STEP11)，完成焊接凸塊。If the inspection in STEP 6 is OK, the board is removed (STEP 8), and the mounting status of the solder balls is checked with the inspection/repair device (STEP 9). If the solder ball mounting status is NG after inspection, after flux is supplied, the solder balls are then supplied to the electrode pad portion at the defective position (STEP 10). If the inspection of the mounting status is OK, a reflow device (not shown) arranged in the next step of the process melts the solder balls (STEP 11) to complete the solder bumps.

圖4為表示焊接球供應頭的全體構造的側視圖，為表示焊接球搭載/印刷部中的用來將焊接球搭載於基板上的焊接球供應頭(填充單元)的構造的圖。4 is a side view showing the overall structure of the solder ball supply head, and is a diagram illustrating the structure of the solder ball supply head (filling unit) in the solder ball mounting/printing unit for mounting solder balls on the substrate.

焊接球供應頭60具備在以框體61、蓋64及澀狀體62形成的空間收納焊接球24的球殼、在澀狀體62的下方空著間隔設置的條狀體63。澀狀體62，以具有網目狀的開口或者連續的長方形狀的狹縫部等的開口的極薄金屬板形成，適合於供應對象的焊接球24的直徑。在澀狀體62的下方配置條狀體63，條狀體63與網版20b面接觸。The solder ball supply head 60 includes a ball shell for accommodating the solder balls 24 in a space formed by the frame 61 , the cover 64 and the stem 62 , and a strip body 63 provided with a gap below the stem 62 . The stringy body 62 is formed of an extremely thin metal plate having openings such as mesh-like openings or continuous rectangular slit portions, and is adapted to the diameter of the solder ball 24 to be supplied. A strip-shaped body 63 is arranged below the astringent body 62, and the strip-shaped body 63 is in surface contact with the screen plate 20b.

又，藉由設於蓋64上方的印刷頭升降機構4，能夠將條狀體63對網版20b的接觸程度/間隙進行微調整。條狀體63以由磁性材料形成的極薄金屬板形成。藉由使用磁性材料，經由來自設有磁體的載台10的磁力，條狀體63能夠對以磁性材料形成的網版20b吸附。條狀體63，例如具有網目狀的開口或者連續的長方形狀的狹縫部，以適合對象的焊接球24的直徑及網版20b的開口部20d的尺寸。In addition, the contact degree/gap of the strip 63 to the screen 20b can be finely adjusted by the print head lifting mechanism 4 provided above the cover 64. The strip 63 is formed of an extremely thin metal plate made of magnetic material. By using a magnetic material, the strip-shaped body 63 can be attracted to the screen 20b formed of the magnetic material through the magnetic force from the stage 10 provided with the magnet. The strip-shaped body 63 has, for example, a mesh-shaped opening or a continuous rectangular slit portion, and is adapted to the diameter of the target solder ball 24 and the size of the opening 20d of the screen plate 20b.

再來，焊接球供應頭60，具備使設於球殼的澀狀體62於水平方向振動的水平振動機構。水平振動機構，在對球殼的側面平行的位置形成的構件安裝振動手段65，將安裝該構件的支持構件70設於蓋64的上面。根據該構造，藉由使球殼從其側面側藉由振動手段65振動，使澀狀體62振動。藉由使澀狀體62振動，設於澀狀體62的條狀開口開得比焊接球24的直徑還大。藉此，收納於球殼的焊接球24，從澀狀體62的狹縫部落下至條狀體63上。落下至條狀體63上的焊接球24的數量，亦即焊接球24的供應量，能夠藉由控制振動手段65所致的振動能量進行調整。Furthermore, the solder ball supply head 60 is provided with a horizontal vibration mechanism that vibrates the stick-shaped body 62 provided on the ball case in the horizontal direction. In the horizontal vibration mechanism, a vibration means 65 is mounted on a member formed parallel to the side surface of the spherical shell, and a support member 70 to which this member is mounted is provided on the upper surface of the cover 64 . According to this structure, the spherical shell is vibrated by the vibrating means 65 from the side surface thereof, thereby vibrating the astringent body 62 . By vibrating the stick-shaped body 62, the strip-shaped opening provided in the stick-shaped body 62 is opened larger than the diameter of the solder ball 24. Thereby, the solder ball 24 accommodated in the spherical shell drops from the slit of the stick-shaped body 62 onto the strip-shaped body 63 . The number of solder balls 24 falling onto the strip 63 , that is, the supply amount of the solder balls 24 , can be adjusted by controlling the vibration energy caused by the vibration means 65 .

振動手段65，使用空氣旋轉式振動器，將壓縮空氣壓力藉由數位控制進行微調整而能夠控制振動數。或者控制壓縮空氣流量使振動數為可變也可以。藉由振動手段65，澀狀體62及球殼對收容於球殼內的焊接球24賦予振動，抵消在焊接球24間作用的凡得瓦力造成的吸引力使其分散。藉由該分散效果，能夠防止因焊接球24的材料及生產環境的溫度/濕度的影響造成焊接球供應量的變化。因此，能夠進行考慮生產效率的調整。The vibration means 65 uses an air rotary vibrator, and can control the vibration number by finely adjusting the compressed air pressure through digital control. Or you can control the compressed air flow rate to make the vibration number variable. Through the vibration means 65, the astringent body 62 and the spherical shell impart vibration to the solder balls 24 accommodated in the spherical shell, thereby canceling the attraction caused by the Van der Waals force acting between the solder balls 24 and causing them to disperse. This dispersion effect can prevent the supply amount of solder balls from changing due to the influence of the material of the solder balls 24 and the temperature/humidity of the production environment. Therefore, adjustment considering production efficiency can be performed.

又，在焊接球供應頭60，設置用來使球殼在水平方向擺動的水平擺動機構。水平擺動機構如下述那樣構成。在支持構件70的上部設置線性導引67，以線性導引67能夠移動的方式設置具有線性軌道的填充頭支持構件71。在該填充頭支持構件71設置驅動用馬達68，於該驅動用馬達68的軸安裝偏心凸輪66。偏心凸輪66若旋轉則支持構件70會在水平方向移動(擺動)。填充頭支持構件71支持於馬達支持構件2，相對於馬達支持構件2不會在左右方向移動。Furthermore, the solder ball supply head 60 is provided with a horizontal swing mechanism for swinging the ball shell in the horizontal direction. The horizontal swing mechanism is configured as follows. A linear guide 67 is provided on the upper part of the support member 70, and a filling head support member 71 having a linear track is provided so that the linear guide 67 can move. The filling head support member 71 is provided with a driving motor 68 , and an eccentric cam 66 is attached to the shaft of the driving motor 68 . When the eccentric cam 66 rotates, the support member 70 moves (oscillates) in the horizontal direction. The filling head support member 71 is supported by the motor support member 2 and does not move in the left-right direction relative to the motor support member 2 .

亦即，水平擺動機構，藉由驅動用馬達68使偏心凸輪66旋轉，以任意的行程量對條狀體63賦予在水平方向的擺動動作。條狀體63，因為在藉由磁力吸附於網版20b的狀態下進行擺動動作，在條狀體63與網版20b之間沒有間隙而能夠確實地使焊接球24滾動。又，根據條狀體63的開口尺寸，能夠將焊接球24確實補充至條狀體63的開口同時進行高效率的填充動作。網版20b與擺動動作的循環速度，藉由控制驅動用馬達68的速度能夠任意可變，能夠設定考慮線平衡的焊接球24的填充工時。又，藉由調整焊接球24的材料的種類、網版20b的開口、及適合環境條件的循環速度能夠控制填充率。That is, the horizontal swing mechanism causes the drive motor 68 to rotate the eccentric cam 66 to impart a swing motion in the horizontal direction to the strip body 63 with an arbitrary stroke amount. Since the strip-shaped body 63 swings while being attracted to the screen plate 20b by magnetic force, there is no gap between the strip-shaped body 63 and the screen plate 20b, and the solder ball 24 can be reliably rolled. Furthermore, according to the opening size of the strip-shaped body 63, it is possible to reliably replenish the solder balls 24 to the opening of the strip-shaped body 63 and perform an efficient filling operation. The cycle speed of the screen 20b and the swinging motion can be arbitrarily variable by controlling the speed of the driving motor 68, and the filling process of the solder balls 24 can be set taking line balance into consideration. In addition, the filling rate can be controlled by adjusting the type of material of the solder ball 24, the opening of the screen 20b, and the circulation speed suitable for environmental conditions.

再來，於焊接球供應頭60設有鏟狀體69。藉由焊接球供應頭60對基板21上供應焊接球24後，使網版20b從基板21面離開時，亦即實施版脫離向基板上轉印焊接球時，若在網版20b的版面上有焊接球24殘留，焊接球24會通過網版20b的開口部20d落下至基板21上，成為供應過多焊接球的原因。因此，本實施例中在焊接球供應頭60的進行方向從球殼空出間隔，將鏟狀體69設於與條狀體63略同高度。鏟狀體69的前端極薄且以平坦精度高的狀態研磨，在密著於網版20b的狀態下，使焊接球24不會露出焊接球供應頭60的外部。Next, the solder ball supply head 60 is provided with a shovel-shaped body 69 . After the solder balls 24 are supplied to the substrate 21 by the solder ball supply head 60, when the screen 20b is separated from the surface of the substrate 21, that is, when the implementation screen is separated and the solder balls are transferred to the substrate, if the screen is on the screen 20b If the solder balls 24 remain, the solder balls 24 may fall onto the substrate 21 through the opening 20d of the screen 20b, causing excessive supply of solder balls. Therefore, in this embodiment, the spade-shaped body 69 is provided at approximately the same height as the strip-shaped body 63 with a gap from the ball shell in the direction in which the soldering ball supply head 60 moves. The front end of the shovel-shaped body 69 is extremely thin and ground with high flatness precision, so that the solder balls 24 are not exposed outside the solder ball supply head 60 while being closely adhered to the screen plate 20 b.

又，因為於鏟狀體69使用磁性體材料，與條狀體63同樣以磁力密著於網版20b，能夠防止焊接球24向焊接球供應頭60的外部露出。此外，將鏟狀體69設於球殼的外周部全區域也可以。藉由鏟狀體69能夠極力減少網版20b的版面上的球殘留。In addition, since the shovel-shaped body 69 is made of a magnetic material, it is magnetically adhered to the screen 20 b similarly to the strip-shaped body 63 , thereby preventing the solder balls 24 from being exposed to the outside of the solder ball supply head 60 . In addition, the shovel-shaped body 69 may be provided on the entire outer peripheral area of the spherical shell. The shovel-shaped body 69 can minimize the remaining balls on the screen plate 20b.

但是，又要考慮網版20b的版面的微小變位造成的球殘留的影響。因此，本實施例中，為了再減少過多焊接球造成的不良，在焊接球供應頭60，設置用來形成空氣簾幕的送風機構75。However, the influence of ball residue caused by slight displacement of the layout of the screen plate 20b must also be considered. Therefore, in this embodiment, in order to further reduce defects caused by too many solder balls, the solder ball supply head 60 is provided with an air blowing mechanism 75 for forming an air curtain.

亦即，在支持印刷頭升降機構4的馬達支持構件2設置送風機構75，於填充單元的周圍形成空氣簾幕。在該送風機構75從圖未示的壓縮空氣供應源供應壓縮空氣。使用送風機構75時，焊接球供應頭60在向基板端面方向移動時，將露出的焊接球藉由壓縮空氣向焊接球供應頭60的移動方向側推滾。因此，能夠防止版面上的焊接球殘留。That is, the air blowing mechanism 75 is provided on the motor support member 2 that supports the print head elevating mechanism 4 to form an air curtain around the filling unit. Compressed air is supplied to this air blowing mechanism 75 from a compressed air supply source (not shown). When the air blowing mechanism 75 is used, when the solder ball supply head 60 moves toward the end surface of the substrate, the exposed solder balls are pushed and rolled by the compressed air toward the moving direction of the solder ball supply head 60 . Therefore, it is possible to prevent solder balls from remaining on the layout.

接著，說明關於將焊接球在基板上搭載/印刷後的動作。Next, the operation after mounting/printing the solder balls on the substrate will be described.

圖5為說明焊接球搭載/印刷動作的概略圖。在焊接球搭載/印刷動作主要使用焊接球供應頭60與清掃器130。FIG. 5 is a schematic diagram illustrating the solder ball mounting/printing operation. The solder ball supply head 60 and the cleaner 130 are mainly used in the solder ball loading/printing operation.

首先，如(1)所示，焊接球供應頭60，在基板21的長度方向移動，同時藉由水平振動機構使球殼振動，在網版20b的開口部填充焊接球。又，如(2)所示，焊接球供應頭60，也併用水平擺動機構所致的擺動動作，使焊接球滾動並確實填充至開口部，同時在水平方向(箭頭A方向)往返移動。First, as shown in (1), the solder ball supply head 60 moves in the length direction of the substrate 21 and simultaneously vibrates the ball shell by a horizontal vibration mechanism to fill the opening of the screen 20b with solder balls. Furthermore, as shown in (2), the solder ball supply head 60 reciprocates in the horizontal direction (arrow A direction) while rolling and reliably filling the opening with the solder balls using the swing action of the horizontal swing mechanism.

向網版開口部的焊接球填充動作結束後，焊接球供應頭60如(3)的箭頭B所示上升。之後，如(4)的箭頭C所示使基板21的上方在長度方向移動，返回原來的位置後如箭頭D所示下降至接觸網版20b的位置停止。After the solder ball filling operation into the screen opening is completed, the solder ball supply head 60 rises as shown by arrow B in (3). Thereafter, the upper portion of the substrate 21 is moved in the length direction as shown by arrow C in (4), returns to the original position, and then drops to the position where the screen plate 20b is contacted and stops as shown by arrow D.

接著，說明關於清掃器130的清掃動作。Next, the cleaning operation of the cleaner 130 will be described.

清掃器130，用來集中上述填充動作後無意殘留在網版上的焊接球。在清掃器130的底部，如圖5所示形成複數刮刀131。刮刀131，在與清掃器130的動作進行方向相向的方向以一定角度傾斜安裝(細部未圖示)。藉由刮刀131在網版上移動並梳理表面，能夠將網版上的焊接球如掃帚那樣掃除集中。The cleaner 130 is used to concentrate the solder balls unintentionally remaining on the screen after the above-mentioned filling action. A plurality of scrapers 131 are formed on the bottom of the cleaner 130 as shown in FIG. 5 . The scraper 131 is installed inclined at a certain angle in the direction opposite to the direction in which the cleaner 130 operates (details are not shown). By moving the scraper 131 on the screen and combing the surface, the solder balls on the screen can be swept away and concentrated like a broom.

焊接球供應頭60所致的填充動作結束後，如(5)所示，在清掃器130接觸網版20b的狀態下在箭頭E所示的水平方向移動。亦即，安裝於清掃器130底部的複數刮刀131，沿著網版20b的上面水平方向行進。此時，在網版20b上殘留的焊接球被集中，向網版20b的空出的開口部落下。藉此，能夠使後述圖6、7所示的那種無球不良消失。再來，將網版20b上的焊接球全部掃出，最終成為在網版20b上未有剩餘焊接球殘留的狀態。After the filling operation by the solder ball supply head 60 is completed, as shown in (5), the cleaner 130 moves in the horizontal direction shown by the arrow E while contacting the screen plate 20b. That is, the plurality of scrapers 131 installed at the bottom of the cleaner 130 travel in the horizontal direction along the upper surface of the screen 20b. At this time, the solder balls remaining on the screen plate 20b are concentrated and fall toward the vacant opening of the screen plate 20b. Thereby, the ball-free defect shown in FIGS. 6 and 7 described later can be eliminated. Next, all the solder balls on the screen plate 20b are swept out, and finally there is no remaining solder ball on the screen plate 20b.

清掃器130，移動至網版20b中的開口部存在的端部附近後，如箭頭F所示一時上升。之後，如(6)的箭頭G所示使基板21的上方返回長度方向，如箭頭H所示再下降至接觸網版20b的位置。之後再重複同樣的清掃動作。該清掃動作，在到將網版20b上的焊接球完全掃除為止執行數次。又，根據情況，如(7)的箭頭I所示，使限定於網版20b上的一部分的清掃動作移動至其他部分同時連續執行也可以。The cleaner 130 moves to the vicinity of the end of the screen 20b where the opening exists, and then rises temporarily as shown by arrow F. Thereafter, the upper portion of the substrate 21 is returned to the longitudinal direction as shown by arrow G in (6), and then lowered to a position where it contacts the screen plate 20b as shown by arrow H. Then repeat the same cleaning action. This cleaning operation is performed several times until the solder balls on the screen plate 20b are completely removed. In addition, depending on the situation, as shown by the arrow I in (7), the cleaning operation limited to a part of the screen 20b may be moved to other parts and continuously executed.

藉由以上的清掃動作，因為能夠將焊接球填充至空出的所有開口部，能夠使無球不良消失。又，因為最終掃除全部網版20b上的剩餘焊接球而不殘留，將網版20b從基板21分離時，能夠防止剩餘焊接球進入網版20b的開口部。因此，能夠使後述圖6、7所示的那種雙球不良消失。Through the above cleaning operation, solder balls can be filled into all the vacated openings, and the ball-free defect can be eliminated. In addition, since the remaining solder balls are finally removed from all the screen plates 20b without remaining, when the screen plate 20b is separated from the substrate 21, the remaining solder balls can be prevented from entering the opening of the screen plate 20b. Therefore, the double-ball defect shown in FIGS. 6 and 7 described later can be eliminated.

圖6表示焊接球搭載/印刷後的基板上的焊接球填充狀況之例。FIG. 6 shows an example of solder ball filling conditions on a substrate after solder ball mounting/printing.

將基板21以攝影機攝像時，焊接球對全部的電極部良好填充後，能夠觀察如到(a)所示的狀態。(b)表示焊接球的一部分的填充不完全的狀態(無球不良)。(c)表示焊接球彼此吸附的雙球狀態、及剩餘焊接球從電極部露出的狀態。When the substrate 21 is photographed with a camera, the state shown in (a) can be observed after all the electrode portions are well filled with solder balls. (b) shows a state in which a part of the solder balls is incompletely filled (no-ball defect). (c) shows a double-ball state in which solder balls are adsorbed to each other, and a state in which remaining solder balls are exposed from the electrode portion.

圖7表示焊接球搭載/印刷後的代表的缺陷例。如圖7所示，作為焊接球填充不良之例，例如，能夠舉出焊接球未填充的「無球狀態」、接近的焊接球彼此重疊的「雙球狀態」、及焊接球偏離電極部的助焊劑塗佈位置的「位置偏離球狀態」。Figure 7 shows a representative example of defects after solder ball mounting/printing. As shown in FIG. 7 , examples of poor filling of solder balls include, for example, a “no-ball state” in which the solder balls are not filled, a “double-ball state” in which adjacent solder balls overlap each other, and a situation in which the solder balls are deviated from the electrode portion. The "position deviation ball state" of the flux coating position.

以該等狀態使基板進入後工程(迴焊工程)時，會生產出不合格品。在此檢查基板上的填充狀況，藉由前述填充單元(焊接球供應頭)重試搭載/印刷動作，能夠將不良品修正成良品。在該檢出中，藉由與良品模型比較的圖案匹配能夠進行判定。焊接球搭載/印刷後，藉由安裝於填充單元的光感測器攝影機(圖未示)以區域單位進行總括辨識。若是NG則再度執行焊接球搭載/印刷。若是合格，則執行版脫離動作，將基板向後工程排出。When the substrate is subjected to post-processing (reflow process) in such a state, defective products may be produced. Here, the filling status on the substrate is checked, and the defective product can be corrected into a good product by retrying the mounting/printing operation with the filling unit (solder ball supply head). In this detection, determination can be made by pattern matching compared with a good product model. After the solder balls are mounted/printed, comprehensive identification is performed on an area basis using a photo-sensor camera (not shown) installed in the filling unit. If it is NG, perform solder ball mounting/printing again. If it is qualified, the board disengagement action is performed and the substrate is discharged to the rear process.

圖8為說明關於以焊接球搭載/印刷後的檢查/修復部進行的修復作業的圖。FIG. 8 is a diagram illustrating the repair work performed by the inspection/repair section after solder ball mounting/printing.

檢查/修復部，首先，在焊接球搭載/印刷結束後，將基板上的填充狀況以CCD(Charge Coupled Device)攝影機進行確認。接著，檢出不良後，求出不良位置的位置座標。雙球、位置偏離球、過多球等不良的情形，如(1)所示，除去用點膠機即吸引用的真空吸附噴嘴86向不良焊接球24x的位置移動。接著，將不良焊接球24x進行真空吸附，使其向不良球廢棄站(圖未示)移動。在不良球廢棄站，在廢棄方塊83(圖9參照)使球藉由真空遮斷落下/廢棄。In the inspection/repair department, first, after the solder ball mounting/printing is completed, the filling status on the substrate is confirmed with a CCD (Charge Coupled Device) camera. Next, after the defect is detected, the position coordinates of the defect location are obtained. In the case of defects such as double balls, misaligned balls, and excessive balls, as shown in (1), the vacuum suction nozzle 86 for suction is removed by a dispenser and moved to the position of the defective solder ball 24x. Next, the defective solder balls 24x are vacuum-adsorbed and moved to a defective ball disposal station (not shown). In the defective ball discard station, the ball is dropped/discarded by vacuum shutoff at the discard block 83 (refer to FIG. 9 ).

檢出未供應焊接球24的電極墊片部的情形、及以真空吸附噴嘴86除去不良焊接球的情形，如(2)所示，將收納於焊接球收納部84的正常焊接球24，使用修復用點膠機87藉由負壓吸附。接著如(3)所示，吸附正常焊接球24的修復用點膠機87，從焊接球收納部84移動至助焊劑供應部85。如(4)所示，藉由使吸附焊接球24的修復用點膠機87向儲存在助焊劑供應部85的助焊劑23移動，將焊接球24浸漬(或使助焊劑23附著於焊接球24)於助焊劑23，在焊接球24添加助焊劑23。接著，如(5)所示，將吸附焊接球24的修復用點膠機87，移動至基板上有缺陷的位置。之後如(6)所示，對缺陷部供應焊接球24。以上述(1)～(6)的工程結束修復作業。When it is detected that the solder ball 24 is not supplied to the electrode pad portion and the defective solder ball is removed with the vacuum suction nozzle 86, as shown in (2), the normal solder ball 24 stored in the solder ball storage portion 84 is used. The dispensing machine 87 for repair uses negative pressure adsorption. Next, as shown in (3), the repair dispenser 87 that absorbs the normal solder balls 24 moves from the solder ball storage portion 84 to the flux supply portion 85 . As shown in (4), by moving the repair dispenser 87 that absorbs the solder ball 24 toward the flux 23 stored in the flux supply part 85, the solder ball 24 is immersed (or the flux 23 is attached to the solder ball). 24) Add flux 23 to solder ball 24. Next, as shown in (5), the repair dispensing machine 87 that absorbs the solder balls 24 is moved to the defective position on the substrate. Then, as shown in (6), the solder ball 24 is supplied to the defective part. Complete the repair work with the above-mentioned processes (1) to (6).

以上述工程，能夠將除去用點膠機作為助焊劑供應用點膠機兼用，在除去不良焊接球後，也能夠實施供應助焊劑至缺陷部分的方法。此時，供應新的焊接球時，不進行使助焊劑附著的工程也可以。With the above process, the removal dispenser can be used as a flux supply dispenser, and after the defective solder ball is removed, a method of supplying flux to the defective part can also be implemented. At this time, when supplying new solder balls, it is not necessary to perform the process of attaching flux.

此外，前述檢查中，除去位置偏離球等不良球的情形，能夠以上述修復作業將正常焊接球補給至正確位置修復缺陷。In addition, in the above inspection, except for the case of defective balls such as misaligned balls, the defects can be repaired by supplying normal solder balls to the correct position through the above repair operation.

圖9為說明關於檢查修復裝置的概略構造的圖，為將檢查/修復部作為1個獨立的裝置從上而看的平面圖。9 is a diagram illustrating the schematic structure of the inspection and repair device, and is a plan view from above with the inspection/repair unit as an independent device.

如圖9所示，從搬入輸送帶81搬入檢查對象的基板21後，在檢查部輸送帶82上收授，向箭頭J方向搬送。檢查部輸送帶82的上部設置門型框80。在門型框80的搬入輸送帶81側，相對於基板搬送方向(箭頭J方向)在直角方向配置光感測器79。藉由該光感測器79，檢出在基板21上的電極墊片22印刷的焊接球24的狀態。此外，在這裡作為焊接球的狀態檢出器雖設置光感測器79，但設置攝像用攝影機，在門型框80的長度方向移動，攝像焊接球的狀態檢出缺陷也可以。As shown in FIG. 9 , after the substrate 21 to be inspected is loaded from the carry-in conveyor belt 81 , it is received and transferred on the inspection unit conveyor belt 82 and conveyed in the direction of arrow J. A portal frame 80 is provided on the upper part of the inspection unit conveyor belt 82 . On the loading conveyor belt 81 side of the portal frame 80 , the photo sensor 79 is arranged in a direction perpendicular to the substrate conveyance direction (arrow J direction). This photo sensor 79 detects the state of the solder balls 24 printed on the electrode pads 22 on the substrate 21 . In addition, although the photo sensor 79 is provided as a state detector of the solder balls here, it is also possible to provide a camera for imaging and move in the longitudinal direction of the portal frame 80 to capture the state of the solder balls to detect defects.

在支持門型框80的一腳側，設置收設正常焊接球的焊接球收納部84、及助焊劑供應部85。又，在另一腳側，設置廢棄方塊83。在門型框80，將用來吸引除去不良焊接球的除去用點膠機即真空吸附噴嘴86、及用來修補基板上的缺陷的修復用點膠機87，以能藉由線性馬達在水平方向(箭頭K方向)移動的方式設置。On one leg side of the support portal frame 80, a solder ball storage portion 84 for storing normal solder balls and a flux supply portion 85 are provided. Furthermore, a waste block 83 is provided on the other foot side. In the portal frame 80, a removal dispenser, that is, a vacuum suction nozzle 86 for sucking and removing defective solder balls, and a repair dispenser 87 for repairing defects on the substrate are installed, so that they can be horizontally moved by a linear motor. Set the direction (arrow K direction) movement mode.

檢查部輸送帶82，能夠在箭頭J方向及其逆方向往返移動，因應基板21的缺陷位置，能夠使缺陷位置對位於修復用點膠機87及真空吸附噴嘴86的位置。檢查/修復結束後的基板21藉由搬出輸送帶88搬出，送至迴焊裝置。根據上述構造，能夠以圖8說明的動作進行檢查修復。The inspection unit conveyor belt 82 can move back and forth in the direction of arrow J and its opposite direction, and can align the defective position with the position of the repairing glue dispenser 87 and the vacuum suction nozzle 86 according to the defective position of the substrate 21 . The substrate 21 after inspection/repair is carried out by the unloading conveyor 88 and sent to the reflow device. According to the above-mentioned structure, inspection and repair can be performed by the operation illustrated in FIG. 8 .

圖10為表示修復用點膠機的構造的側視圖、圖11為說明修復用點膠機的前端部的焊接球的吸附分離動作的擴大圖。FIG. 10 is a side view showing the structure of the repair dispenser, and FIG. 11 is an enlarged view illustrating the adsorption and separation operation of the solder ball at the front end of the repair dispenser.

如圖10所示，在修復用點膠機87，形成用來保持焊接球並使其移動的例如塑膠製的吸附噴嘴90(但是材質並非限於塑膠製)。吸附噴嘴90從前端部98向上方呈錐體狀。亦即，吸附噴嘴90成為從前端部98向基端部99寬度擴大的形狀。在吸附噴嘴90內形成貫通孔92。As shown in FIG. 10 , the repair dispensing machine 87 is formed with an adsorption nozzle 90 made of, for example, plastic (but the material is not limited to plastic) for holding and moving the solder ball. The adsorption nozzle 90 has a conical shape upward from the front end 98 . That is, the adsorption nozzle 90 has a shape in which the width expands from the front end portion 98 toward the base end portion 99 . A through hole 92 is formed in the adsorption nozzle 90 .

如圖11所示，貫通孔92也(雖不像吸附噴嘴90的形狀那樣的程度)向上方形成錐體狀。亦即，貫通孔92以越上部越粗，越下部越細的方式形成。此外，詳細為以設於貫通孔92的下端的開口端部92a的內徑，成為與後述芯棒91的外徑略相同的方式，形成貫通孔92。在貫通孔92的內部空間，藉由圖未示的負壓施加機構施加負壓。As shown in FIG. 11 , the through hole 92 is also formed into a conical shape upward (although not to the same extent as the shape of the adsorption nozzle 90 ). That is, the through-hole 92 is formed to be thicker at the upper part and thinner at the lower part. In detail, the through hole 92 is formed so that the inner diameter of the opening end portion 92 a provided at the lower end of the through hole 92 becomes substantially the same as the outer diameter of the mandrel 91 described later. A negative pressure is applied to the inner space of the through hole 92 by a negative pressure applying mechanism (not shown).

吸附噴嘴90藉由螺栓等固定於噴嘴支持框94。噴嘴支持框94連結至驅動部96。因此，吸附噴嘴90能夠與驅動部96一同在上下方向自由移動。The adsorption nozzle 90 is fixed to the nozzle support frame 94 by bolts or the like. The nozzle support frame 94 is connected to the driving part 96 . Therefore, the suction nozzle 90 can move freely in the up-and-down direction together with the driving part 96 .

在吸附噴嘴90內的貫通孔92，芯棒91經由密封構件(圖未示)插入、保持。芯棒91，例如為直徑約10μm的圓柱狀的金屬製的棒，由強度大且難以帶電的材質形成(但是芯棒91的形狀(直徑)與材質不限於上述，比焊接球24的直徑還小較佳)。除了貫通孔92的開口端部92a的部分，芯棒91的外徑比貫通孔92的內徑還小，芯棒91能夠在吸附噴嘴90的軸方向自由上下移動。芯棒91的上端部91a固定於支持構件93。支持構件93連結至馬達95，能夠與芯棒91一同在上下方向自由移動。The core rod 91 is inserted and held in the through hole 92 in the adsorption nozzle 90 via a sealing member (not shown). The core rod 91 is, for example, a cylindrical metal rod with a diameter of about 10 μm, and is made of a material that is strong and difficult to be charged (however, the shape (diameter) and material of the core rod 91 are not limited to the above, and may be smaller than the diameter of the solder ball 24 Smaller is better). The outer diameter of the core rod 91 is smaller than the inner diameter of the through hole 92 except for the opening end 92 a of the through hole 92 , and the core rod 91 can freely move up and down in the axial direction of the adsorption nozzle 90 . The upper end 91a of the core rod 91 is fixed to the support member 93. The support member 93 is connected to the motor 95 and can move freely in the up and down direction together with the mandrel 91 .

因為支持構件93與驅動部96經由線性軌道97連接，支持構件93與驅動部96能夠分別獨立上下移動。亦即，安裝於支持構件93的芯棒91與連結至驅動部96的吸附噴嘴90能夠分別獨立上下移動。Because the supporting member 93 and the driving part 96 are connected via the linear rail 97, the supporting member 93 and the driving part 96 can move up and down independently. That is, the mandrel 91 attached to the support member 93 and the suction nozzle 90 connected to the driving part 96 can move up and down independently.

因此，以上述支持構件93、噴嘴支持框94、馬達95、驅動部96、線性軌道97等構成驅動機構。Therefore, the drive mechanism is constituted by the support member 93, the nozzle support frame 94, the motor 95, the drive unit 96, the linear rail 97, and the like.

支持構件93下降、或吸附噴嘴90上升時，如圖10(b)所示支持構件93的下端面與吸附噴嘴90的上端面抵接。在該抵接狀態下，芯棒91的下端部91b從吸附噴嘴90的前端部98向下方向突出。為了實現上述機能，芯棒91的全長A比吸附噴嘴90的全長B還長。When the support member 93 is lowered or the adsorption nozzle 90 is raised, the lower end surface of the support member 93 comes into contact with the upper end surface of the adsorption nozzle 90 as shown in FIG. 10(b) . In this contact state, the lower end portion 91 b of the core rod 91 protrudes downward from the front end portion 98 of the adsorption nozzle 90 . In order to realize the above function, the total length A of the mandrel 91 is longer than the total length B of the adsorption nozzle 90 .

此外，如圖11擴大所示，吸附噴嘴90的前端部98以容易保持焊接球24的方式，加工成錐體溝的形狀。藉由將吸附噴嘴90的前端部98加工成錐體溝的形狀，將焊接球24進行真空吸附時，焊接球24良好地合身於錐體溝內，焊接球24變得不容易從前端部98偏離。此外，藉由將前端部98的構部的形狀，設為與焊接球24的形狀同樣的球狀，能夠再更良好地吸附。但是，前端部98的形狀不限於上述。In addition, as shown in an enlarged view in FIG. 11 , the front end portion 98 of the adsorption nozzle 90 is processed into a tapered groove shape to easily hold the solder ball 24 . By processing the front end portion 98 of the adsorption nozzle 90 into the shape of a conical groove, when the solder ball 24 is vacuum-adsorbed, the solder ball 24 fits well in the conical groove, and the solder ball 24 becomes less likely to pass from the front end portion 98 Deviation. In addition, by making the shape of the structure of the front end portion 98 into a spherical shape similar to the shape of the solder ball 24, better adsorption can be achieved. However, the shape of the front end portion 98 is not limited to the above.

接著，說明如上述那樣構成的修復用點膠機所致的焊接球的缺陷修復動作。Next, the defect repairing operation of solder balls by the repairing dispensing machine configured as above will be described.

首先，以修復用點膠機87的吸附噴嘴90，吸附用來修補的新焊接球24(直徑約30μm)。此時，因為對吸附噴嘴90內經由貫通孔92供應負壓，焊接球24真空吸附至吸附噴嘴90的前端部98。雖未圖示，但形成不會從插入芯棒91的貫通孔92的上部洩露負壓的構造。又，此時，如圖10(a)所示，芯棒91成為從吸附噴嘴90的前端部98插入內側(上方)的狀態。First, the adsorption nozzle 90 of the repair dispensing machine 87 is used to adsorb the new solder ball 24 (about 30 μm in diameter) used for repair. At this time, since negative pressure is supplied to the inside of the adsorption nozzle 90 through the through hole 92 , the solder ball 24 is vacuum-adsorbed to the front end 98 of the adsorption nozzle 90 . Although not shown in the figure, a structure is formed in which negative pressure does not leak from the upper part of the through hole 92 into which the mandrel 91 is inserted. At this time, as shown in FIG. 10( a ), the mandrel rod 91 is inserted into the inner side (upper side) from the front end portion 98 of the adsorption nozzle 90 .

在該吸附狀態下，將焊接球24搬送至缺陷位置的電極墊片120上方，使修復用點膠機87在電極墊片120方向降下，如圖11(a)所示，在電極墊片120上的助焊劑121內載置焊接球24。In this adsorbed state, the solder balls 24 are transported above the electrode pad 120 at the defective position, and the repair dispensing machine 87 is lowered in the direction of the electrode pad 120. As shown in FIG. 11(a), on the electrode pad 120 Solder balls 24 are placed in the flux 121 on the substrate.

接著，驅動馬達95，到芯棒91的下端部91b抵接至焊接球24為止，使芯棒91通過吸附噴嘴90的貫通孔92降下。藉此，如圖11(b)所示，芯棒91會將焊接球24相對於電極墊片120壓附。如同前述，因為芯棒91的外徑與貫通孔92的開口端部92a的內徑略相同，在芯棒91的移動過程中，成為芯棒91塞住貫通孔92的開口端部92a的狀態。因此，貫通孔92內的間隙成為狭窄狀態，即便負壓力作用，其所造成的真空吸附(負壓)力會變小，焊接球24從吸附噴嘴90自由分離。Next, the motor 95 is driven until the lower end 91 b of the core rod 91 comes into contact with the solder ball 24 , and the core rod 91 is lowered through the through hole 92 of the adsorption nozzle 90 . Thereby, as shown in FIG. 11( b ), the mandrel 91 presses the solder ball 24 against the electrode pad 120 . As mentioned above, since the outer diameter of the core rod 91 is approximately the same as the inner diameter of the opening end 92a of the through hole 92, during the movement of the core rod 91, the core rod 91 is in a state of blocking the opening end 92a of the through hole 92. . Therefore, the gap in the through hole 92 becomes narrow, and even if negative pressure acts, the vacuum adsorption (negative pressure) force caused by this becomes small, and the solder ball 24 can be freely separated from the adsorption nozzle 90 .

因此，根據上述構造，不需要另外設置用來遮斷負壓的真空泵閥，刪減了成本。Therefore, according to the above structure, there is no need to separately provide a vacuum pump valve for blocking the negative pressure, thereby reducing costs.

接著，如圖10(b)所示在以芯棒91將焊接球24壓附至電極墊片120的狀態下，如圖11(b)所示使吸附噴嘴90上升而從焊接球24分離。Next, as shown in FIG. 10( b ), with the solder ball 24 pressed against the electrode pad 120 by the mandrel 91 , the suction nozzle 90 is raised to separate from the solder ball 24 as shown in FIG. 11( b ).

之後，驅動馬達95，使芯棒91再上升而從焊接球24分離。此時，因為芯棒91與焊接球24的接觸面積非常，即便靜電產生也是小到可無視的程度，芯棒91與焊接球24的分離能沒有問題地平穩進行。Thereafter, the motor 95 is driven to raise the mandrel 91 again and separate it from the solder ball 24 . At this time, because the contact area between the mandrel 91 and the solder ball 24 is very small, the generation of static electricity is so small that it can be ignored, and the separation of the mandrel 91 and the solder ball 24 can be smoothly performed without any problem.

如同以上，本發明的實施例的焊接球檢查修復裝置(以下有為焊接球修復裝置的情形)，在修補用點膠機87內設置能夠上下動的芯棒91，將焊接球24供應至有缺陷的部分時，將焊接球24以芯棒91物理地壓附至電極墊片120側，同時升起吸附噴嘴91從焊接球24分離，能夠將焊接球在電極墊片上有效率且確實搭載。As mentioned above, the solder ball inspection and repair device according to the embodiment of the present invention (hereinafter referred to as a solder ball repair device) is provided with a mandrel 91 that can move up and down in the repair dispensing machine 87 to supply the solder balls 24 to a certain position. When there is a defective part, the solder ball 24 is physically pressed to the electrode pad 120 side with the mandrel 91, and at the same time, the adsorption nozzle 91 is raised to separate the solder ball 24, so that the solder ball can be efficiently and reliably mounted on the electrode pad. .

又，為了焊接球的搭載，例如，不需要使用雷射光照射裝置那種高價的裝置，而以簡單的構造實現前述機能，故能夠將裝置的製造抑制成低成本。In addition, in order to mount the solder ball, it is not necessary to use an expensive device such as a laser irradiation device, and the above-mentioned function can be realized with a simple structure, so that the manufacturing of the device can be suppressed to a low cost.

接著，說明本發明的實施例的電漿雷射修復系統。圖12為表示本發明的實施例的電漿雷射修復系統的外觀圖。Next, the plasma laser repair system according to the embodiment of the present invention will be described. FIG. 12 is an external view of the plasma laser repair system according to the embodiment of the present invention.

伴隨著半導體裝置的小型化/高速化/大容量化所造成的凸塊電極的極微細化，例如，藉由圖2所示的檢查/修復部104，檢出焊接凸塊電極中的缺陷等，進行修復的情形中，在該迴焊後，會有如圖7所示那種存在焊接球不良不良，例如，焊接球未填充的「無球狀態」、接近的焊接球彼此重疊的「雙球狀態」、及焊接球偏離電極部的助焊劑塗佈位置的「球位置偏離狀態」的情形。With the miniaturization of bump electrodes due to the miniaturization, speed increase, and increase in capacity of semiconductor devices, for example, defects in the solder bump electrodes are detected by the inspection/repair unit 104 shown in FIG. 2 , in the case of repair, after the reflow, there may be defective solder balls as shown in Figure 7, such as "no ball state" where the solder balls are not filled, or "double ball state" where the solder balls that are close to each other overlap each other. state", and the "ball position deviation state" in which the solder ball deviates from the flux coating position of the electrode portion.

該等狀態，即便是焊接球填充不良為1個的情形，也因為是不合格品，會再度(第2次)檢查基板上的填充狀況，藉由填充單元(焊接球供應頭)再度嘗試搭載動作，能夠將不良品修復成良品。在該檢出中，藉由與良品模型比較的圖案匹配能夠進行判定。In this state, even if one solder ball filling defect is found, since it is a defective product, the filling status on the substrate will be checked again (for the second time) and mounting will be attempted again using the filling unit (solder ball supply head). Action can repair defective products into good ones. In this detection, determination can be made by pattern matching compared with a good product model.

在此，本實施例所示的電漿雷射修復系統，將通過迴焊裝置的基板進行再度檢查，對在基板的電極墊片上產生的凸塊具有缺陷的缺陷電極部將焊接球進行再供應/再修復，進行焊接。接著，在這種極微細焊接凸塊中，本實施例所示的電漿雷射修復系統，為將迴焊後的凸塊電極的缺陷部位進行修復/焊接的信賴性高的修復焊接裝置。Here, the plasma laser repair system shown in this embodiment will re-inspect the substrate through the reflow device, and re-solder the soldered ball on the defective electrode portion of the bump produced on the electrode pad of the substrate. Supply/re-repair, welding. Next, in such ultra-fine solder bumps, the plasma laser repair system shown in this embodiment is a highly reliable repair welding device that repairs/welds defective parts of the bump electrodes after reflow.

本實施例所示的電漿雷射修復系統，設置於圖2所示的檢查/修復部104的後工程、及圖未示的迴焊裝置的後工程。此外，該電漿雷射修復系統，不限於設置於圖2所示的檢查/修復部104的後工程及迴焊裝置的後工程，以該系統單體設置也可以。此外，有將該電漿雷射修復系統於離線等以系統單體設置的情形方便上稱為凸塊形成裝置，且有將使用該裝置形成凸塊的方法方便上稱為凸塊形成方法的情形。此外，凸塊形成裝置，為在形成於基板的複數電極墊片的各者搭載焊接球，藉由將焊接球進行迴焊，在電極墊片上形成凸塊者。The plasma laser repair system shown in this embodiment is provided in the post-process of the inspection/repair unit 104 shown in FIG. 2 and the post-process of the reflow device (not shown). In addition, the plasma laser repair system is not limited to the post-processing provided in the inspection/repair unit 104 and the post-processing of the reflow device shown in FIG. 2 , and may be provided as a single system. In addition, when the plasma laser repair system is installed as a single system such as offline, it is conveniently called a bump forming device, and a method of forming bumps using this device is conveniently called a bump forming method. situation. In addition, the bump forming device is one that mounts solder balls on each of the plurality of electrode pads formed on the substrate and reflows the solder balls to form bumps on the electrode pads.

此外，本實施例中，作為設置在位於圖2所示的檢查/修復部104的後工程的迴焊部的下段的工程者進行說明。此時，在電漿雷射修復系統的設置時，可以是在線、也可以是離線。也就是說，使迴焊後檢出缺陷部位的凸塊電極存在的基板，在線上流通於電漿雷射修復系統也可以，又，將迴焊後檢出缺陷部位的凸塊電極存在的基板，進行儲存，以離線流通於電漿雷射修復系統也可以。此外，本實施例中說明離線的情形。In addition, in this embodiment, description will be given as an engineer who is located in the lower stage of the reflow section in the subsequent process of the inspection/repair section 104 shown in FIG. 2 . At this time, when setting up the plasma laser repair system, it can be online or offline. In other words, it is also possible to circulate the substrate on which the bump electrode with the defective part is detected after reflow through the plasma laser repair system online. In addition, the substrate on which the bump electrode with the defective part is detected after reflow can be circulated online. , it can also be stored and circulated offline to the plasma laser repair system. In addition, this embodiment describes the offline situation.

此外，電漿雷射修復系統在位於圖2所示的檢查/修復部104的後工程的迴焊部的下段的工程，亦即線上的情形，未檢出缺陷部位的基板，以單通過該電漿雷射修復系統的方式控制各部也可以。此時，能夠使裝置的一連串所謂的製造線構造單純化。In addition, in the process of the plasma laser repair system located at the lower stage of the reflow section after the inspection/repair section 104 shown in FIG. 2, that is, in the online situation, the substrate with no defective parts is detected, and the substrate is passed through the process alone. Plasma laser repair system can also be used to control various parts. In this case, the structure of a series of so-called manufacturing lines of the device can be simplified.

電漿雷射修復系統，具有搬入基板(迴焊後檢出缺陷部位的凸塊電極存在的基板)的搬入載台(BF(LD))、對迴焊後的基板執行檢查/修復作業的檢查/修復單元(IR)、將修復後的焊接球固著於電極墊(焊接或熔接)的雷射修復單元(LR)、及將修復後的基板搬出的搬出載台(BF(ULD))。控制單元(控制部(以下CON)或控制手段)，為將該等搬入載台(BF(LD))、檢查/修復單元(IR)、雷射修復單元(LR)及搬出載台(BF(ULD))全體控制成預定的狀態的控制單元。Plasma laser repair system, equipped with a loading stage (BF (LD)) for loading substrates (substrates with bump electrodes in defective areas detected after reflow), and inspection for performing inspection/repair operations on the substrates after reflow /Repair unit (IR), laser repair unit (LR) that fixes the repaired solder balls to the electrode pads (soldering or welding), and the unloading stage (BF (ULD)) that unloads the repaired substrate. The control unit (control part (hereinafter CON) or control means) is the loading stage (BF (LD)), inspection/repair unit (IR), laser repair unit (LR) and carrying out stage (BF ( A control unit that controls the entire ULD)) into a predetermined state.

此外，圖2所示的裝置，亦即助焊劑印刷部101、焊接球搭載/印刷部103、及檢查/修復部104也一樣以圖3所示的一連串的控制流程進行控制，但該一連串的控制流程與CON，雖將個別的控制裝置以專用的通信手段等連接取得協動也可以，但作為一體的控制裝置構成也可以。(參照一連串的系統的構造圖的圖12)。當然，將圖2所示的助焊劑印刷部101、焊接球搭載/印刷部103、及檢查/修復部104、配置於下段的工程的圖未示的迴焊部、及圖12所示的搬入載台(BF(LD))、檢查/修復單元(IR)、雷射修復單元(LR)、搬出載台(BF(ULD))作為一連中的系統構成的情形，將該等全體以1個控制裝置進行控制也可以。In addition, the device shown in FIG. 2 , that is, the flux printing unit 101 , the solder ball mounting/printing unit 103 , and the inspection/repair unit 104 are also controlled by a series of control flows shown in FIG. 3 , but this series of The control flow and CON may be connected to separate control devices using a dedicated communication means to achieve coordination, or they may be configured as an integrated control device. (Refer to Figure 12 for a series of system structural diagrams). Of course, the flux printing unit 101, the solder ball mounting/printing unit 103, and the inspection/repair unit 104 shown in Fig. 2, the reflow unit (not shown) in the lower process, and the loading unit shown in Fig. 12 are of course arranged. When the carrier (BF (LD)), inspection/repair unit (IR), laser repair unit (LR), and unload carrier (BF (ULD)) are configured as a continuous system, all of them are combined into one It can also be controlled by a control device.

檢查/修復單元(IR)，例如，也具有檢查圖2所示的檢查/修復部104的那種焊接球的狀態的焊接球檢查裝置的機能，檢查焊接球的搭載狀況的結果，藉由焊接球搭載狀況的檢查為NG的情形(檢出缺陷的情形)，對焊接球供應助焊劑後，在不良位置的電極墊片部，例如，使用圖10記載的那種修復用點膠機，再供應焊接球。The inspection/repair unit (IR) also has the function of a solder ball inspection device that checks the state of the solder balls like the inspection/repair unit 104 shown in FIG. If the inspection of the ball mounting condition is NG (when a defect is detected), after supplying flux to the solder ball, use a repair dispensing machine such as the one shown in Figure 10 for the electrode pad portion at the defective position, for example. Supply of solder balls.

接著，作為基本的一例，以圖8所示的(1)～(6)的工程實施修復作業。又，作為裝置構造也一樣，作為基本的一例，適用圖9及圖10所示的裝置構造。此外，此時，取得再供應焊接球的位置資料，該位置資料，以專用於檢查/修復單元(IR)、或雷射修復單元(LR)的通信手段等發送等，取得協動也可以。Next, as a basic example, repair work is performed using processes (1) to (6) shown in Fig. 8 . The same applies to the device structure. As a basic example, the device structure shown in FIGS. 9 and 10 is applied. In addition, at this time, the position data of the resupplied solder balls may be obtained, and the position data may be transmitted by a communication means dedicated to the inspection/repair unit (IR) or the laser repair unit (LR), etc., and the cooperation may be obtained.

接著，使用圖13，說明雷射修復單元(LR)即電漿雷射修復裝置。Next, the laser repair unit (LR), that is, the plasma laser repair device will be described using FIG. 13 .

電漿雷射修復裝置，具有電漿雷射修復頭部200、設置基板215的配向載台216、使配向載台216在水平方向(XYθ方向)移動的載台移動軸218。此外，電漿雷射修復頭部200，能在水平方向(XYθ方向)移動也可以。藉此，能夠在修復後焊接球(焊接球位置)，單點(局部地)照射電漿與雷射。此外，於電漿，雖也能表現出放出、放射，但本實施例中，包含該等稱之為照射。The plasma laser repairing apparatus includes a plasma laser repair head 200, an alignment stage 216 on which a substrate 215 is mounted, and a stage moving axis 218 that moves the alignment stage 216 in the horizontal direction (XYθ direction). In addition, the plasma laser repair head 200 may be movable in the horizontal direction (XYθ direction). Thereby, it is possible to irradiate plasma and laser at a single point (locally) after repairing the soldered ball (soldered ball position). In addition, plasma can also exhibit emission and radiation, but in this embodiment, these are called irradiation.

接著，電漿雷射修復裝置，基於從檢查/修復單元(IR)發送的位置資料，使配向載台216在水平方向(XYθ方向)移動。又，基於該位置資料，也使電漿雷射修復頭部200移動也可以。Next, the plasma laser repair device moves the alignment stage 216 in the horizontal direction (XYθ direction) based on the position data sent from the inspection/repair unit (IR). Furthermore, the plasma laser repair head 200 may be moved based on the position data.

此外，實施例中說明關於使配向載台216在水平方向(XYθ方向)移動的情形，但使電漿雷射修復頭部200能在X方向、Y方向移動，使配向載台216能在θ方向移動也可以。或是修復頭在與設置基板215的載台相對地在X方向、Y方向、θ方向移動也可以。In addition, the embodiment describes the case of moving the alignment stage 216 in the horizontal direction (XYθ direction). However, the plasma laser repair head 200 can be moved in the X direction and the Y direction, and the alignment stage 216 can be moved in the θ direction. Directional movement is also possible. Alternatively, the repair head may move in the X direction, Y direction, and θ direction relative to the stage on which the substrate 215 is installed.

接著，使用圖14，說明電漿雷射修復頭部200。Next, the plasma laser repair head 200 will be described using FIG. 14 .

電漿雷射修復頭部(也有作為凸塊形成裝置的意思)200，移動至修復後的焊接球位置，相對於該焊接球於單點點狀預熱，相對於該焊接球照射電漿除去(氧化還原)焊接球的氧化膜(例如厚度從數nm到數μm程度)，除去氧化膜(氧化被膜)後，照射雷射(雷射光)，進行局部迴焊。The plasma laser repair head (also known as a bump forming device) 200 moves to the position of the repaired solder ball, preheats the solder ball point by point, and irradiates the solder ball with plasma to remove it. (Redox) The oxide film (for example, the thickness is from several nm to several μm) of the solder ball. After removing the oxide film (oxide film), laser (laser light) is irradiated and partial reflow is performed.

焊接球電漿雷射修復頭部200，具有相對於焊接球點狀照射雷射，將焊接球加熱、熔融的雷射單元(有稱為雷射頭或雷射產生裝置(雷射照射手段的意思)的情形)205、相對於焊接球點狀照射電漿的電漿單元(也有稱為微電漿頭或電漿產生裝置(電漿照射手段的意思)的情形)、相對於配置焊接球(焊接球的基板及電極墊片(例如銅墊片))點狀預熱的點加熱器210。接著，具有至少固定雷射單元205與電漿單元的單元固定板219。The solder ball plasma laser repair head 200 has a laser unit (also called a laser head or a laser generating device (laser irradiation means)) that irradiates the solder ball with laser pointwise to heat and melt the solder ball. (meaning)) 205. A plasma unit (also called a micro plasma head or a plasma generating device (meaning a plasma irradiation means)) that irradiates plasma in a point-like manner to the solder ball, relative to the placement of the solder ball (Substrate and electrode pad (such as copper pad) for soldering balls) point heater 210 for spot preheating. Next, there is a unit fixing plate 219 for fixing at least the laser unit 205 and the plasma unit.

此外，本實施例中，例如，利用使用紅外光等的點加熱器210，但以點狀預熱，將基板215事先暖和，使用預加熱至預定溫度(例如150～180℃左右)的熱板也可以。In addition, in this embodiment, for example, a spot heater 210 using infrared light or the like is used, but the substrate 215 is preheated in a spot-like manner, and a hot plate that is preheated to a predetermined temperature (for example, about 150 to 180° C.) is used. That's ok too.

又，取代點加熱器210，使用失焦雷射，對焊接球的周邊預熱也可以。失焦雷射加熱焊接球的周邊，失焦雷射例如能夠使用紅外光雷射。此外，失焦雷射的焦點比從雷射單元205照射的雷射的焦點還大較佳。Alternatively, instead of the spot heater 210, an out-of-focus laser may be used to preheat the periphery of the solder ball. The out-of-focus laser heats the periphery of the soldering ball. For example, the out-of-focus laser can use an infrared laser. In addition, the focus of the out-of-focus laser is preferably larger than the focus of the laser irradiated from the laser unit 205 .

又，從雷射單元205照射的雷射，以脈衝(15～25KHz，例如微波)照射較佳。藉由對焊接球將雷射以脈衝照射，能夠有效率地除去焊接球的氧化膜。這是因為將雷射以脈衝照射，使用熱聲效應，藉由該衝擊，能夠在形成於焊接球表面的氧化膜有效率地產生裂縫。In addition, the laser irradiated from the laser unit 205 is preferably pulsed (15 to 25 KHz, such as microwave). By irradiating the solder ball with laser pulses, the oxide film of the solder ball can be effectively removed. This is because pulse irradiation of the laser uses the thermoacoustic effect, and the impact can efficiently create cracks in the oxide film formed on the surface of the solder ball.

又，電漿雷射修復頭部200具有用以使單元固定板219在上下方向(Z軸方向)移動的致動器202、驅動致動器202的馬達201。藉此，至少雷射單元205與電漿單元在上下方向移動，能夠使雷射的照射方向與電漿的照射方向與搭載的焊接球一致。接著，致動器202固定在頭框203。Furthermore, the plasma laser repair head 200 has an actuator 202 for moving the unit fixing plate 219 in the up and down direction (Z-axis direction), and a motor 201 for driving the actuator 202. Thereby, at least the laser unit 205 and the plasma unit move in the up and down direction, so that the irradiation direction of the laser and the irradiation direction of the plasma can be consistent with the mounted solder balls. Next, the actuator 202 is fixed to the head frame 203 .

電漿單元具有施加使電漿產生的高頻電壓的電漿電極213、施加高頻電壓使電場產生的電漿天線211、導入氣體的電漿放電管即電漿毛細管212、射出產生的電漿的電漿噴嘴214。藉此，能夠對焊接球以點狀照射電漿。此外，本實施例中，電漿電極213、電漿天線211、電漿毛細管212、與電漿噴嘴214以直線狀配置。此外，該等配置為任意，只要是能夠對焊接球以點狀照射電漿的配置，則沒有限定。The plasma unit includes a plasma electrode 213 that applies a high-frequency voltage to generate plasma, a plasma antenna 211 that applies a high-frequency voltage to generate an electric field, a plasma capillary tube 212 that is a plasma discharge tube that introduces gas, and a plasma capillary tube 212 that injects the generated plasma. Plasma nozzle 214. Thereby, the solder ball can be irradiated with plasma in a spot shape. In addition, in this embodiment, the plasma electrode 213, the plasma antenna 211, the plasma capillary 212, and the plasma nozzle 214 are arranged in a straight line. In addition, these arrangements are arbitrary and are not limited as long as the solder balls can be irradiated with plasma in a spot shape.

接著，使用媒介氣體使電漿產生，作為成為電漿的氣體，本實施例中，使用重量%為氬97～97.5%、氫3～2.5%的混合氣體。此外，該等氣體的種類、混合比例為任意，根據裝置構造、或者成為照射對象的電極墊片或焊接球，適當地選擇氣體的種類及其混合比例即可。該氣體，從電漿電極213側導入電漿毛細管212。此外，電漿單元，對電極墊片或/及焊接球，照射具有氬氣的電漿較佳。又，媒介氣體，為包含重量%為1～4%的氫成份的氬氣較佳。Next, a medium gas is used to generate plasma. In this embodiment, a mixed gas containing 97 to 97.5% of argon and 3 to 2.5% of hydrogen is used as the gas that becomes the plasma. In addition, the type and mixing ratio of these gases are arbitrary, and the type and mixing ratio of the gases may be appropriately selected depending on the device structure or the electrode pad or solder ball to be irradiated. This gas is introduced into the plasma capillary 212 from the plasma electrode 213 side. In addition, the plasma unit preferably irradiates the electrode pads and/or the solder balls with plasma containing argon gas. In addition, the medium gas is preferably argon gas containing a hydrogen component of 1 to 4% by weight.

此外，此時，氫會自由基化、活性化，除去在焊接球表面形成的氧化膜。作為原理，氧化膜的氧與該氫耦合，作為水蒸氣，除去氧化膜。In addition, at this time, hydrogen is radicalized and activated, and the oxide film formed on the surface of the solder ball is removed. As a principle, the oxygen in the oxide film couples with the hydrogen and becomes water vapor, thereby removing the oxide film.

又，雷射單元205具有觀察焊接球的狀態的觀察攝影機206、將雷射光導入的雷射導光口207、為了得到雷射光的平行光而進行像差補正的準直透鏡208、將平行光的雷射光集光的集光透鏡209。此外，本實施例中，觀察攝影機206與集光透鏡209以直線狀配置，雷射導光口207與準直透鏡208，相對於觀察攝影機206與集光透鏡209的直線狀的軸垂直配置。Furthermore, the laser unit 205 includes an observation camera 206 for observing the state of the solder ball, a laser light guide port 207 for introducing laser light, a collimator lens 208 for correcting aberration in order to obtain parallel light of the laser light, and a collimator lens 208 for The light collecting lens 209 collects the laser light. In addition, in this embodiment, the observation camera 206 and the collecting lens 209 are arranged linearly, and the laser light guide port 207 and the collimating lens 208 are arranged perpendicularly to the linear axes of the observation camera 206 and the collecting lens 209 .

也就是說，藉由觀察攝影機206直線狀觀察焊接球的狀態，雷射光被90°彎折，照射至焊接球。藉此，能夠對焊接球以點狀照射雷射。此外，該裝置構造為一例，該等配置構造沒有限定。又，作為裝置構造，觀察攝影機206未必是必須的。That is, by observing the state of the solder ball linearly with the observation camera 206, the laser light is bent by 90° and irradiated to the solder ball. Thereby, the solder ball can be irradiated with laser in a spot shape. In addition, this device structure is an example, and the arrangement structure is not limited. In addition, as a device structure, the observation camera 206 is not necessarily necessary.

接著，電漿單元的直線狀的軸、雷射單元205的直線狀的軸、與點加熱器210的軸，以朝向1個焊接球的方式集中於1點較佳。也就是說，以電漿單元的電漿照射軸(電漿單元的直線狀的軸)與雷射單元205的雷射照射軸(雷射單元205的直線狀的軸)的交點(焦點)，成為焊接球的略中心的位置的方式，配置電漿單元與雷射單元205，又，以修復的焊接球配置於該交點的方式，控制基板的配置位置。當然，基板配置位置的控制是相對的，將電漿雷射頭以成為預定的位置的方式進行移動控制也可以。Next, it is preferable that the linear axis of the plasma unit, the linear axis of the laser unit 205, and the axis of the spot heater 210 are concentrated at one point so as to face one solder ball. That is, at the intersection (focus) of the plasma irradiation axis of the plasma unit (the linear axis of the plasma unit) and the laser irradiation axis of the laser unit 205 (the linear axis of the laser unit 205), The plasma unit and the laser unit 205 are arranged so that the position of the solder ball is approximately in the center, and the arrangement position of the substrate is controlled so that the repaired solder ball is arranged at the intersection point. Of course, the control of the substrate placement position is relative, and the plasma laser head may be moved and controlled to reach a predetermined position.

雷射單元205的雷射照射軸與電漿單元的電漿照射軸的夾角，雖沒有特別限定，但若能對修復的焊接球照射雷射、電漿即可，雖也取決於裝置構造或者修復的焊接球的狀態，但大約以0～180度進行調整較佳。也就是說，該角度為0度的情形，雷射照射軸與電漿照射軸為相同方向，例如，表示雷射與電漿從上方照射焊接球，該角度為180度的情形，雷射照射軸與電漿照射軸對向，例如，表示相對於焊接球，從左右方向分別照射雷射與電漿。The angle between the laser irradiation axis of the laser unit 205 and the plasma irradiation axis of the plasma unit is not particularly limited, as long as the repaired solder ball can be irradiated with laser and plasma, although it also depends on the device structure or The condition of the repaired solder ball is better, but it is better to adjust it from 0 to 180 degrees. That is to say, when the angle is 0 degrees, the laser irradiation axis and the plasma irradiation axis are in the same direction. For example, it means that the laser and plasma irradiate the solder ball from above. When the angle is 180 degrees, the laser irradiation axis The axis is opposite to the plasma irradiation axis, which means, for example, that the solder ball is irradiated with laser and plasma from the left and right directions respectively.

此外，本實施例中，電漿單元的直線狀的軸、雷射單元205的直線狀的軸、與點加熱器210的軸，分別相對於Z軸，具有預定的角度配置，分別具有90°的角度配置。也就是說，電漿單元、雷射單元205，相對於供應至電極墊片的焊接球，於略中心照射電漿及雷射。In addition, in this embodiment, the linear axis of the plasma unit, the linear axis of the laser unit 205, and the axis of the spot heater 210 are arranged at a predetermined angle with respect to the Z-axis, and each has an angle of 90°. angle configuration. That is, the plasma unit and the laser unit 205 irradiate plasma and laser at the approximate center of the solder ball supplied to the electrode pad.

又，電漿單元、雷射單元205，對供應至電極墊片的焊接球的略上半分部分，照射電漿及雷射也可以。也就是說，將電漿及雷射，相對於焊接球，從上方照射較佳。Furthermore, the plasma unit and the laser unit 205 may irradiate the upper half of the solder ball supplied to the electrode pad with plasma and laser. In other words, it is better to irradiate the plasma and laser from above the solder ball.

此外，電漿單元的直線狀的軸、雷射單元205的直線狀的軸、與點加熱器210的軸，未必是相對於Z軸具有預定的角度配置也可以，例如，將雷射單元205的直線狀的軸設為與Z軸平行(與Z軸同軸)，相對於此，使電漿單元的直線狀的軸與點加熱器210的軸以具有預定的角度配置也可以。又，電漿單元的直線狀的軸與點加熱器210的軸也設為與Z軸平行也可以。又，雷射單元205的軸與電漿單元的軸也可以是平行，又該等軸為同軸也可以。In addition, the linear axis of the plasma unit, the linear axis of the laser unit 205, and the axis of the spot heater 210 do not necessarily need to be arranged at a predetermined angle with respect to the Z-axis. For example, the laser unit 205 The linear axis of the plasma unit is parallel to the Z-axis (coaxial with the Z-axis). In contrast, the linear axis of the plasma unit and the axis of the spot heater 210 may be arranged at a predetermined angle. In addition, the linear axis of the plasma unit and the axis of the spot heater 210 may be parallel to the Z-axis. In addition, the axis of the laser unit 205 and the axis of the plasma unit may be parallel, or the axes may be coaxial.

再來，電漿雷射修復頭部200，設置測定從雷射單元205的前端(基板側)到基板的高度(GAP高度)的基板高度變位計204及觀測基板的焊接球填充不良的配向攝影機217也可以。此外，基板高度變位計204及配向攝影機217，固定於單元固定板219也可以，點加熱器210也固定於單元固定板219也可以。Next, the plasma laser repair head 200 is provided with a substrate height displacement meter 204 that measures the height (GAP height) from the front end of the laser unit 205 (substrate side) to the substrate and observes the alignment of solder ball filling defects on the substrate. Camera 217 is also available. In addition, the substrate height displacement meter 204 and the alignment camera 217 may be fixed to the unit fixing plate 219, and the spot heater 210 may also be fixed to the unit fixing plate 219.

藉此，相對於配置於配向載台216上的基板215及配置於基板215的焊接球，能夠以點狀照射雷射，以點狀照射電漿，以點狀預熱。Thereby, the substrate 215 disposed on the alignment stage 216 and the solder balls disposed on the substrate 215 can be irradiated with laser in point form, irradiated with plasma in point form, and preheated in point form.

又，藉由使用點加熱器210，以點狀預熱，不需要將基板全體預熱，即能夠抑制對基板的熱破壞。又，藉由使用雷射單元205，以點狀照射雷射，不需要對基板全體進行迴焊，能夠抑制對基板及健全的焊接球的熱破壞。Furthermore, by using the spot heater 210 to perform preheating in a spot pattern, there is no need to preheat the entire substrate, and thus thermal damage to the substrate can be suppressed. Furthermore, by using the laser unit 205 to irradiate the laser in a spot shape, there is no need to reflow the entire substrate, and thermal damage to the substrate and healthy solder balls can be suppressed.

也就是說，本實施例為具備對焊接球照射雷射的雷射單元205及對焊接球照射電漿的電漿單元的焊接球修復裝置及凸塊形成裝置，將電漿與雷射一同或同時照射至特定的焊接球者。其中，「一同」或「同時」照射，指的是包含相對於雷射照射，時間上先照射電漿，相互照射的時間重疊。That is to say, this embodiment is a solder ball repair device and a bump forming device including a laser unit 205 that irradiates the solder ball with laser and a plasma unit that irradiates the solder ball with plasma. Plasma and laser are used together or Simultaneously irradiate specific solder balls. Among them, "together" or "simultaneously" irradiation refers to including that the plasma is irradiated first in time relative to the laser irradiation, and the time of mutual irradiation overlaps.

也就是說，照射電漿除去焊接球的氧化膜，之後照射雷射，因為電漿而焊接球會活性化，由於該時間差，照射雷射的期間，在焊接球會形成氧化膜，但藉由將該等一同或同時照射，能夠抑制這樣對焊接球的氧化膜的產生。因此，焊接球的氧化膜的除去處理，未必要在使氮氣等不活性氣體充滿處理室內，在不活性氣體氛圍下進行。本實施例中，設置電漿雷射修復裝置的環境為大氣環境。此外，本實施例，並非覆蓋電漿雷射修復裝置，妨礙將被包覆的內部作為氮環境者。That is to say, irradiating the plasma to remove the oxide film of the solder ball, and then irradiating the laser will activate the solder ball due to the plasma. Due to this time difference, an oxide film will be formed on the solder ball during the laser irradiation. However, by By irradiating these together or simultaneously, the generation of such an oxide film on the solder ball can be suppressed. Therefore, the removal process of the oxide film of the solder ball does not necessarily have to be performed in an inert gas atmosphere by filling the processing chamber with an inert gas such as nitrogen. In this embodiment, the environment in which the plasma laser repair device is installed is the atmospheric environment. In addition, this embodiment does not cover the plasma laser repair device, which prevents the coated interior from being used as a nitrogen environment.

此外，電漿雷射修復系統，以控制單元(CON)進行控制，使得來自照射至焊接球的電漿單元的電漿與來自照射至焊接球的雷射單元的雷射同時照射。又，該CON控制成在向藉由修復用點膠機供應的焊接球的雷射照射前，對焊接球照射電漿。又，該CON控制成在電漿照射與雷射照射前，藉由將焊接球預熱的點加熱器210，將焊接球預熱。In addition, the plasma laser repair system is controlled by a control unit (CON) so that the plasma from the plasma unit that irradiates the solder balls and the laser from the laser unit that irradiates the solder balls are simultaneously irradiated. Furthermore, the CON is controlled so that the solder ball is irradiated with plasma before laser irradiation is applied to the solder ball supplied by the repair dispensing machine. Furthermore, this CON is controlled so that the solder ball is preheated by the spot heater 210 which preheats the solder ball before plasma irradiation and laser irradiation.

又，CON，在凸塊形成也一樣，為控制電漿單元所致的電漿的照射與雷射單元所致的雷射的照射的控制單元，控制成確保電漿單元所致的電漿的照射與雷射單元所致的雷射的照射同時照射的時間帶(時間帶存在)。又，CON，在凸塊形成也一樣，控制成在雷射單元所致的雷射的照射前，進行電漿單元所致的電漿的照射。再來，CON，在凸塊形成也一樣，控制成在電漿照射與雷射照射前，將焊接球及焊接球的周邊預熱。In addition, CON is the same as in bump formation. It is a control unit that controls the irradiation of plasma by the plasma unit and the irradiation of laser by the laser unit. It is controlled so as to ensure the irradiation of plasma by the plasma unit. The time zone during which the irradiation is simultaneously irradiated with the laser irradiation by the laser unit (the time zone exists). In addition, CON, similarly to the bump formation, is controlled so that the plasma irradiation by the plasma unit is performed before the laser irradiation by the laser unit. Next, CON, the same is true for bump formation, and is controlled so that the solder ball and the periphery of the solder ball are preheated before plasma irradiation and laser irradiation.

圖15表示電漿雷射修復動作的流程圖。CON將各部照該動作的流程圖適當地控制。Figure 15 shows a flow chart of the plasma laser repair operation. CON controls each part appropriately according to the flow chart of the operation.

首先，將基板215搬入電漿雷射修復裝置的搬入載台(STEP1)。之後，從檢查/修復單元(IR)接收位置資料(STEP2)。接著，將基板215配置於配向載台216上(STEP3)。基於接收到的位置資料，例如，使配向載台216移動，將基板215配置於預定的位置(STEP4)。First, the substrate 215 is loaded into the loading stage of the plasma laser repair apparatus (STEP 1). Afterwards, position data is received from the inspection/repair unit (IR) (STEP2). Next, the substrate 215 is placed on the alignment stage 216 (STEP 3). Based on the received position data, for example, the alignment stage 216 is moved to arrange the substrate 215 at a predetermined position (STEP 4).

之後，配置結束後，驅動馬達201，使致動器202向下方向(Z軸方向)移動，以雷射單元205的前端成為設定的GAP高度(間隙高度)的方式移動(STEP5)。以基板高度變位計204確認GAP高度(STEP6)。該GAP高度沒問題時(OK的情形)，進到下個STEP。該GAP高度有問題的情形，使致動器202向下方向移動，以雷射單元205的前端成為設定的GAP高度(間隙高度)的方式移動，再度，以基板高度變位計204確認GAP高度。After the arrangement is completed, the motor 201 is driven to move the actuator 202 in the downward direction (Z-axis direction) so that the front end of the laser unit 205 reaches the set GAP height (STEP 5). Confirm the GAP height with the substrate height displacement meter 204 (STEP 6). When there is no problem with the GAP height (OK situation), proceed to the next STEP. If there is a problem with the GAP height, the actuator 202 is moved downward so that the tip of the laser unit 205 reaches the set GAP height (gap height), and the GAP height is confirmed again with the substrate height displacement meter 204 .

以基板高度變位計204確認GAP高度，沒有問題的情形，藉由點加熱器210，對焊接球(配置焊接球的基板215及電極墊片)以點狀例如預熱至150～180℃左右(STEP7)。接著，例如藉由圖未示的溫度計等確認焊接球(配置焊接球的基板215及電極墊片)的溫度，特別是基板215的溫度，是否到達設定的溫度(STEP8)。此外，該溫度到達設定溫度的情形，進到下個STEP。此外，該溫度未到達設定溫度的情形，藉由點加熱器210持續預熱。或增加點加熱器210的輸出，促進溫度上升。接著，再度確認該溫度是否到達設定溫度。Use the substrate height displacement meter 204 to confirm the GAP height. If there is no problem, use the spot heater 210 to preheat the solder ball (the substrate 215 and the electrode pad on which the solder ball is placed) in a spot pattern, for example, to about 150 to 180°C. (STEP7). Next, it is confirmed whether the temperature of the solder ball (the substrate 215 and the electrode pad on which the solder ball is arranged), especially the temperature of the substrate 215, has reached the set temperature using, for example, a thermometer (not shown) (STEP 8). In addition, when the temperature reaches the set temperature, proceed to the next STEP. In addition, when the temperature has not reached the set temperature, preheating is continued by the spot heater 210 . Or increase the output of the point heater 210 to promote temperature rise. Then, confirm again whether the temperature reaches the set temperature.

又，以基板高度變位計204確認GAP高度，沒有問題的情形，藉由電漿單元，對焊接球以點狀照射電漿(STEP9)。接著，例如，藉由觀察攝影機206確認焊接球及/或電極墊片是否被氧化還原(在焊接球表面的氧化膜被除去)(STEP10)。此時，若在焊接球表面形成的氧化膜被除去，則會看到焊接球發紫色的光。由此也能夠確認氧化膜被除去。此外，氧化還原結束的情形，進到下個STEP。氧化還原未結束的情形，持續照射電漿。接著，再度確認氧化還原是否結束。此外，其中，也包含除去電極墊片的氧化膜，之後除去焊接球的氧化膜的情形。此外，未設置觀察攝影機206的情形，預先設定氧化還原結束的時間，基於該設定時間，進到下個STEP也可以。Furthermore, if the GAP height is confirmed with the substrate height displacement meter 204 and there is no problem, the solder ball is irradiated with plasma in a spot shape through the plasma unit (STEP 9). Next, for example, by observing the camera 206, it is confirmed whether the solder ball and/or the electrode pad is oxidized or reduced (the oxide film on the surface of the solder ball is removed) (STEP 10). At this time, if the oxide film formed on the surface of the solder ball is removed, the solder ball will be seen to emit purple light. This also confirmed that the oxide film was removed. In addition, when the redox is completed, proceed to the next STEP. If the redox is not completed, continue to irradiate the plasma. Next, confirm again whether the oxidation-reduction process is completed. In addition, this also includes the case where the oxide film of the electrode pad is removed, and then the oxide film of the solder ball is removed. In addition, when the observation camera 206 is not installed, the time for completing the oxidation reduction may be set in advance, and the process may proceed to the next STEP based on the set time.

確認到基板215的溫度到達設定的溫度、及焊接球被氧化還原後，藉由雷射單元205，對焊接球照射雷射，使焊接球的溫度例如以2秒左右上升至250℃左右，將焊接球熔融，在電極墊片固著(焊接及熔接)(STEP11)。藉此，能夠使焊接球填充不良消失。After confirming that the temperature of the substrate 215 has reached the set temperature and that the solder ball has been oxidized and reduced, the laser unit 205 irradiates the solder ball with a laser, causing the temperature of the solder ball to rise to about 250°C in about 2 seconds, for example. The solder ball melts and is fixed on the electrode pad (welding and welding) (STEP11). This eliminates solder ball filling defects.

之後，將被修復，焊接球填充不良消失的基板215從搬出載台搬出(STEP12)。Thereafter, the substrate 215 that has been repaired and the defective solder ball filling has disappeared is unloaded from the unloading stage (STEP 12).

藉此，電漿單元對焊接球照射電漿的電漿照射時點，比雷射單元205對焊接球照射雷射的雷射照射時點還早，電漿在照射雷射照射的期間持續照射較佳。也就是說，有將電漿與雷射一同或同時照射的時間帶較佳。又，點加熱器210對焊接球預熱的預熱時點，比雷射單元205對焊接球照射雷射的雷射照射時點還早，預熱在照射雷射的期間持續較佳。Therefore, the plasma irradiation time point when the plasma unit irradiates the soldering ball with plasma is earlier than the laser irradiation time point when the laser unit 205 irradiates the soldering ball with laser. It is better to continue to irradiate the plasma during the laser irradiation period. . In other words, it is preferable to have a time period during which plasma and laser are irradiated together or simultaneously. In addition, the preheating time of the spot heater 210 to preheat the solder ball is earlier than the laser irradiation time of the laser unit 205 to irradiate the solder ball, and it is better to continue the preheating during the laser irradiation.

也就是說，一同或同時對焊接球照射電漿，對焊接球照射雷射，將焊接球的氧化膜除去，將焊接球熔融並將焊接球焊接至電極墊片。此外，一同或同時預熱焊接球，對焊接球照射電漿，對焊接球照射雷射，將焊接球的氧化膜除去，將焊接球熔融並將焊接球焊接至電極墊片。也就是說，一同或同時代表具有重疊的時間帶。That is, the solder ball is irradiated with plasma, the solder ball is irradiated with laser, the oxide film of the solder ball is removed, the solder ball is melted, and the solder ball is welded to the electrode pad at the same time or simultaneously. In addition, the soldering balls are preheated together or simultaneously, the soldering balls are irradiated with plasma, the soldering balls are irradiated with laser, the oxide film of the soldering balls is removed, the soldering balls are melted, and the soldering balls are welded to the electrode pads. That is, together or simultaneously represent overlapping time periods.

又，設置焊接球前，對電極墊片照射電漿，除去電極墊片的氧化膜，之後設置焊接球，對焊接球照射電漿，除去焊接球的氧化膜，同時對焊接球照射雷射，將焊接球熔融並將焊接球焊接至電極墊片也可以。In addition, before setting the solder ball, the electrode pad is irradiated with plasma to remove the oxide film on the electrode pad, and then the solder ball is set, the solder ball is irradiated with plasma to remove the oxide film of the solder ball, and at the same time, the solder ball is irradiated with laser. It is also possible to melt the solder ball and solder the solder ball to the electrode pad.

因此，本實施例記載的焊接球修復方法或凸塊形成方法，係藉由焊接球檢查工程檢查在基板215的電極墊片上形成的焊接凸塊的狀態，對藉由焊接球檢查工程檢出缺陷的電極墊片藉由修復用點膠機供應焊接球的方法。Therefore, the solder ball repair method or the bump forming method described in this embodiment is to check the state of the solder bumps formed on the electrode pads of the substrate 215 through the solder ball inspection process. The defective electrode pad is repaired by supplying solder balls with a dispensing machine.

接著，焊接球修復方法或凸塊形成方法，對藉由修復用點膠機檢出缺陷的電極墊片供應焊接球後，對焊接球照射電漿，一同照射雷射，除去焊接球的氧化膜，同時熔融焊接球，將焊接球焊接至電極墊片。又，焊接球修復方法或凸塊形成方法，對藉由修復用點膠機檢出缺陷的電極墊片照射電漿除去電極墊片的氧化膜，之後對該電極墊片供應焊接球，對焊接球照射電漿及雷射，除去焊接球的氧化膜，同時熔融焊接球，將焊接球固著(焊接或熔接)至電極墊片。Next, in the solder ball repair method or the bump forming method, after supplying solder balls to the electrode pads whose defects were detected by the repair dispensing machine, the solder balls are irradiated with plasma and laser at the same time to remove the oxide film of the solder balls. , while melting the solder ball and soldering the solder ball to the electrode pad. In addition, the solder ball repairing method or the bump forming method irradiates an electrode pad with a defect detected by a repair dispensing machine with plasma to remove the oxide film of the electrode pad, and then supplies solder balls to the electrode pad, and the soldering The ball is irradiated with plasma and laser to remove the oxide film of the solder ball, melt the solder ball at the same time, and fix (weld or weld) the solder ball to the electrode pad.

此外，凸塊形成裝置或凸塊形成方法，也能夠考慮對形成於基板21的電極墊片22上，供應焊接球24。In addition, the bump forming apparatus or the bump forming method may also consider supplying the solder balls 24 to the electrode pads 22 formed on the substrate 21 .

藉此，能夠檢查在基板的電極墊片上產生的凸塊缺陷，對缺陷電極部將焊接球進行再供應/修復，進行焊接。又，能夠在極微細焊接凸塊中，作為對回流後的凸塊電極的缺陷部位的修復/焊接，實施信賴性高的修復焊接。This makes it possible to inspect bump defects produced on the electrode pads of the substrate, resupply/repair solder balls to the defective electrode portions, and perform soldering. In addition, highly reliable repair welding can be performed on extremely fine solder bumps as a repair/welding of defective parts of bump electrodes after reflow.

因此，本實施例記載的焊接球修復裝置或凸塊形成裝置，為將基板215的電極墊片22上的焊接球作為靶材者，具備檢查在基板215的電極墊片22上形成的焊接凸塊的狀態，對檢出缺陷的電極墊片供應焊接球的修復用點膠機。Therefore, the solder ball repair device or bump forming device described in this embodiment uses the solder balls on the electrode pads 22 of the substrate 215 as target materials, and is equipped with the ability to inspect the solder bumps formed on the electrode pads 22 of the substrate 215 . According to the status of the block, a repair dispensing machine is used to supply welding balls to the electrode pads where defects are detected.

接著，焊接球修復裝置或凸塊形成裝置，具備對藉由修復用點膠機供應的焊接球照射電漿，除去焊接球的氧化膜的電漿單元(電漿產生裝置)、對焊接球照射雷射，將焊接球熔融的雷射單元(雷射產生裝置)205，與除去焊接球的氧化膜一同或同時，將焊接球熔融，在電極墊片形成焊接凸塊(將焊接球焊接至電極墊片)。Next, the solder ball repair device or the bump forming device includes a plasma unit (plasma generating device) that irradiates the solder balls supplied by the repair dispensing machine with plasma to remove the oxide film of the solder balls, and irradiates the solder balls with plasma. Laser, a laser unit (laser generating device) 205 that melts the solder ball, melts the solder ball together with or at the same time as removing the oxide film of the solder ball, and forms a solder bump on the electrode pad (welding the solder ball to the electrode gasket).

又，焊接球修復裝置或凸塊形成裝置，具備對檢出缺陷的電極墊片照射電漿，除去氧化膜，一同藉由修復用點膠機對供應的焊接球照射電漿，除去焊接球的氧化膜的電漿單元(電漿產生裝置)、及對焊接球照射雷射，將焊接球熔融的雷射單元(雷射產生裝置)205，除去檢出缺陷的電極墊片的氧化膜，與除去焊接球的氧化膜一同或同時，將焊接球熔融，將焊接球焊接至電極墊片(在電極墊片形成焊接凸塊)。In addition, the solder ball repair device or the bump forming device has the function of irradiating the electrode pad with detected defects with plasma to remove the oxide film, and simultaneously irradiating the supplied solder balls with plasma through a repair dispensing machine to remove the solder balls. The plasma unit (plasma generating device) of the oxide film, and the laser unit (laser generating device) 205 that irradiates the solder ball with laser and melts the solder ball, remove the oxide film of the electrode pad where the defect is detected, and At the same time or simultaneously, the oxide film of the solder ball is removed, the solder ball is melted, and the solder ball is welded to the electrode pad (a solder bump is formed on the electrode pad).

又，雷射單元205，對供應至電極墊片的焊接球的上部照射雷射較佳。又，雷射單元205，對供應至電極墊片的焊接球的表面，略垂直照射雷射較佳。又，雷射單元205，以適於焊接球直徑的點徑照射雷射較佳，該點徑，與焊接球直徑略相同或比焊接球直徑還小較佳。Moreover, it is preferable that the laser unit 205 irradiates the upper part of the solder ball supplied to the electrode pad with laser. Furthermore, it is preferable that the laser unit 205 irradiates the laser slightly perpendicularly to the surface of the solder ball supplied to the electrode pad. In addition, the laser unit 205 preferably irradiates the laser with a spot diameter suitable for the diameter of the solder ball. The spot diameter is preferably approximately the same as the diameter of the solder ball or smaller than the diameter of the solder ball.

又，電漿單元，對電極墊片以比焊接球直徑或電極墊片直徑還廣的範圍照射電漿較佳。藉此，能夠有效率地除去氧化膜。In addition, in the plasma unit, it is preferable to irradiate the electrode pad with plasma in a range wider than the diameter of the solder ball or the diameter of the electrode pad. Thereby, the oxide film can be removed efficiently.

以上的說明中，與藉由電漿照射除去焊接球的氧化膜一同或同時，藉由雷射照射將焊接球熔融，當然表示在同期間、同時間帶，同時進行電漿照射與雷射照射，還有表示至少具有同時照射的期間、或者至少具有同時照射的時間帶。因此，使電漿照射早於雷射照射進行也可以、在進行雷射照射的期間停止電漿照射也可以、又相反也可以。In the above description, the oxide film of the solder ball is removed by plasma irradiation together or at the same time, and the solder ball is melted by laser irradiation. Of course, it means that the plasma irradiation and laser irradiation are performed at the same time and at the same time. , also means at least a period of simultaneous irradiation, or at least a time zone of simultaneous irradiation. Therefore, plasma irradiation may be performed earlier than laser irradiation, plasma irradiation may be stopped while laser irradiation is being performed, or vice versa.

又，即便暫時將電漿照射與雷射照射瞬間、或者短時間切換，電漿照射所致的氧化膜的除去，若是對雷射照射所致的熔融沒有問題的程度的短時間之差，則表示至少具有同時照射的期間、或者至少具有同時照射的時間帶。Furthermore, even if plasma irradiation and laser irradiation are temporarily switched instantaneously or for a short period of time, the removal of the oxide film due to plasma irradiation is only a short time difference that does not pose a problem to melting due to laser irradiation. It means that there is at least a period of simultaneous irradiation, or at least a time zone of simultaneous irradiation.

又，電漿單元對電極墊片或/及焊接球照射電漿的電漿照射時點，比雷射單元205對焊接球照射雷射的雷射照射時點還早，電漿在照射雷射照射的期間持續照射較佳。也就是說，有將電漿與雷射同時照射的時間帶較佳。In addition, the plasma irradiation time point when the plasma unit irradiates the electrode pad and/or the solder ball is earlier than the laser irradiation time point when the laser unit 205 irradiates the solder ball. Continuous irradiation during this period is better. In other words, it is better to have a time period during which plasma and laser are irradiated simultaneously.

特別是照射電漿的焊接球，因為其表面被活性化，容易被氧化，停止電漿的照射後馬上會被氧化。因此，照射電漿，同時照射雷射是重要的。In particular, solder balls irradiated with plasma are easily oxidized because their surfaces are activated. They will be oxidized immediately after the plasma irradiation is stopped. Therefore, it is important to irradiate plasma and simultaneously irradiate laser.

因此，本實施例記載的焊接球修復裝置中，對供應至基板215的電極墊片上的焊接球及/或電極墊片，照射電漿，同時對焊接球照射雷射。Therefore, in the solder ball repair device described in this embodiment, the solder balls and/or the electrode pads supplied to the electrode pads of the substrate 215 are irradiated with plasma and the solder balls are irradiated with laser at the same time.

又，本實施例記載的焊接球修復裝置中，雖說明關於具備點加熱器210的情形，但根據製品的品種及材料等的狀況，未必是必要者，有可以省略的情形，具備該點加熱器210，將其如同實施例那樣控制，能夠減小雷射的輸出。In addition, in the solder ball repair device described in this embodiment, the case where the spot heater 210 is provided is explained. However, depending on the type of product and the conditions of the materials, etc., this may not be necessary and may be omitted. The device 210, controlled as in the embodiment, can reduce the laser output.

根據本實施例，能夠減少將焊接球焊接至電極墊片上的破壞，能夠有效率且確實進行修復、焊接。According to this embodiment, damage caused by welding the solder ball to the electrode pad can be reduced, and repair and welding can be performed efficiently and reliably.

又，根據本實施例，因為只有在缺陷產生的部位，照射雷射，照射電漿，焊接所花的時間短，因為不會使用總括迴焊工程，即能夠以簡單的線構造使修復完結，能夠將裝置的製造成本抑制為低。Furthermore, according to this embodiment, since only the location where the defect occurs is irradiated with laser and plasma, the time required for welding is short, and since a lump-sum reflow process is not used, the repair can be completed with a simple line structure. The manufacturing cost of the device can be kept low.

又，根據本實施例，因為能夠僅將缺陷產生的電極墊片部以雷射及電漿進行修復、焊接，再焊接所花的能量少即可，不會產生大量的熱，因此能夠提供節能且對環境佳的系統。In addition, according to this embodiment, only the electrode pad portion where the defect occurs can be repaired and welded using laser and plasma, and only a small amount of energy is required for re-welding without generating a large amount of heat. Therefore, it is possible to provide energy saving. It is a system that is good for the environment.

又，根據本實施例，因為能夠僅將缺陷產生的部位以雷射及電漿進行修復、焊接，再焊接的範圍小，不會對迴焊焊接完的良品部位施加熱履歷，能夠進行信賴性高的修復、焊接。 [實施例2] Furthermore, according to this embodiment, only the defective parts can be repaired and welded with laser and plasma, and the re-welding range is small. Heat history is not applied to the reflowed good parts, and reliability can be improved. High repair and welding. [Example 2]

接著，使用圖16，說明實施例2的電漿雷射修復頭部300。此外，說明實施例2時，說明關於與實施例1的差異部分。Next, the plasma laser repair head 300 of Example 2 will be described using FIG. 16 . In addition, when describing Example 2, differences from Example 1 will be described.

電漿雷射修復頭部300，移動至焊接球位置，對該焊接球24以單點點狀預熱，對該焊接球24照射電漿除去焊接球24的氧化膜，除去氧化膜後，照射雷射，進行局部迴焊或凸塊形成。The plasma laser repair head 300 moves to the position of the solder ball, preheats the solder ball 24 in a single point manner, irradiates the solder ball 24 with plasma to remove the oxide film of the solder ball 24, and after removing the oxide film, irradiates Laser, for local reflow or bump formation.

電漿雷射修復頭部300，具有對焊接球24點狀照射雷射，加熱、熔融焊接球的雷射單元(雷射產生裝置(雷射照射手段的意思))305、對焊接球24點狀照射電漿的電漿單元(電漿產生裝置(電漿照射手段的意思))306、對焊接球34點狀預熱的點加熱器210。接著，具有至少固定雷射單元305與電漿單元306的單元固定板219。The plasma laser repair head 300 has a laser unit (laser generating device (meaning laser irradiation means)) 305 that irradiates the solder balls with laser at 24 points to heat and melt the solder balls. A plasma unit (plasma generating device (meaning plasma irradiation means)) 306 for irradiating plasma in a spot shape, and a spot heater 210 for preheating the solder ball 34 in a spot shape. Next, there is a unit fixing plate 219 for fixing at least the laser unit 305 and the plasma unit 306.

實施例2中，雷射單元305的雷射照射軸與電漿單元306的電漿照射軸，在焊接球24附近為同軸，將電漿及雷射從上方(正上方)對焊接球24照射。此外，點加熱器210的軸，設定成朝向照射電漿及雷射的1個焊接球24。藉此，雷射單元305的雷射照射軸、電漿單元306的電漿照射軸、點加熱器210的軸集中至1個焊接球24。In Embodiment 2, the laser irradiation axis of the laser unit 305 and the plasma irradiation axis of the plasma unit 306 are coaxial near the solder ball 24, and the plasma and laser are irradiated onto the solder ball 24 from above (directly above). . In addition, the axis of the spot heater 210 is set to face one solder ball 24 to which plasma and laser are irradiated. Thereby, the laser irradiation axis of the laser unit 305 , the plasma irradiation axis of the plasma unit 306 , and the axis of the spot heater 210 are concentrated on one solder ball 24 .

接著，使用圖17，說明實施例2的電漿雷射修復頭部300的原理。Next, the principle of the plasma laser repair head 300 of Example 2 will be described using FIG. 17 .

實施例2中，從雷射單元305照射的雷射，在水平方向導入，藉由半反射鏡309，反射至鉛直方向，從焊接球24的上方照射至焊接球24。In Embodiment 2, the laser irradiated from the laser unit 305 is introduced in the horizontal direction, reflected in the vertical direction by the half mirror 309 , and irradiated from above the solder ball 24 to the solder ball 24 .

又，實施例2中，從電漿單元306照射的電漿，也從焊接球24的上方照射至焊接球24。Furthermore, in Example 2, the plasma irradiated from the plasma unit 306 is also irradiated from above the solder ball 24 to the solder ball 24 .

電漿單元306，為使用中空陰極型放電，使高密度的電漿產生者，具有施加使電漿產生的高頻電壓的電漿電極313。此外，使電漿產生的高頻電壓，從電極電源314向電漿電極313供應高頻電壓，成為電漿的氣體從氣體供應部315供應，在電漿產生區域產生電漿。特別是實施例2中，氣體以與雷射的導入方向相同的方式，從水平方向供應。也就是說，雷射的導入方向與氣體的供應方向相同。藉此，能夠使電漿雷射頭部300緊湊化。The plasma unit 306 generates high-density plasma using a hollow cathode type discharge, and has a plasma electrode 313 that applies a high-frequency voltage to generate plasma. In addition, a high-frequency voltage to generate plasma is supplied from the electrode power supply 314 to the plasma electrode 313, and gas used as plasma is supplied from the gas supply part 315, thereby generating plasma in the plasma generation region. In particular, in Example 2, the gas is supplied from the horizontal direction in the same direction as the introduction direction of the laser. In other words, the laser introduction direction is the same as the gas supply direction. Thereby, the plasma laser head 300 can be made compact.

接著，如此，實施例2中，雷射貫通電漿產生區域，電漿與雷射同時照射至焊接球24。藉此，能夠有效率地同時將電漿與雷射照射至焊接球24。Next, in Example 2, the laser penetrates the plasma generation region, and the plasma and the laser are simultaneously irradiated to the solder balls 24 . Thereby, plasma and laser can be irradiated to the solder ball 24 simultaneously and efficiently.

又，藉由使雷射單元305的雷射照射軸與電漿單元306的電漿照射軸同軸，不需要將雷射單元305的雷射照射軸與電漿單元306的電漿照射軸進行軸對齊，能夠有效率地將電漿與雷射照射至焊接球24。Furthermore, by making the laser irradiation axis of the laser unit 305 and the plasma irradiation axis of the plasma unit 306 coaxial, there is no need to align the laser irradiation axis of the laser unit 305 and the plasma irradiation axis of the plasma unit 306. Alignment can effectively irradiate plasma and laser to the solder balls 24 .

又，實施例2也一樣，例如，設置顯微鏡等觀察攝影機206。觀察攝影機206，透過半反射鏡309，從上方(正上方)觀察焊接球24的狀態。但是，作為裝置構造，觀察攝影機206未必是必須的。In addition, the same applies to Embodiment 2. For example, an observation camera 206 such as a microscope is provided. The camera 206 is used to observe the state of the solder ball 24 from above (directly above) through the half-reflecting mirror 309 . However, as a device structure, the observation camera 206 is not necessarily necessary.

此外，未設置觀察攝影機206的情形中，不設置半反射鏡309，將雷射單元305設置於焊接球24的上方(正上方)，能夠將雷射直接照射至焊接球24。In addition, when the observation camera 206 is not provided, the half mirror 309 is not provided, and the laser unit 305 is provided above (directly above) the solder ball 24, so that the laser can be directly irradiated to the solder ball 24.

又，實施例2也一樣，雖使用對焊接球34點狀預熱的點加熱器210，但取代點加熱器210，使用失焦雷射，對焊接球的周邊預熱也可以。Also in the second embodiment, the spot heater 210 for spot-heating the solder ball 34 is used. However, instead of the spot heater 210, an out-of-focus laser may be used to preheat the periphery of the solder ball.

特別是未設置觀察攝影機206的情形中，使失焦雷射透過半反射鏡309，從焊接球24的上方(正上方)，照射至焊接球24也可以。也就是說，使失焦雷射的照射軸，與雷射單元305的雷射照射軸及電漿單元306的電漿照射軸，在焊接球24的附近同軸。藉此，能夠有效率地將焊接球24的周邊預熱。Especially when the observation camera 206 is not provided, the out-of-focus laser may be transmitted through the half mirror 309 and irradiated to the solder ball 24 from above (directly above) the solder ball 24 . That is, the irradiation axis of the out-of-focus laser, the laser irradiation axis of the laser unit 305 and the plasma irradiation axis of the plasma unit 306 are made coaxial in the vicinity of the solder ball 24 . Thereby, the periphery of the solder ball 24 can be preheated efficiently.

接著，使用圖18，說明實施例2的電漿雷射修復頭部300的構造，特別是電漿單元306的構造。Next, the structure of the plasma laser repair head 300 of Embodiment 2, especially the structure of the plasma unit 306, will be described using FIG. 18 .

對焊接球24點狀照射電漿的電漿單元306，為使用中空陰極型放電，使高密度的電漿產生者。The plasma unit 306 that irradiates the solder ball 24 with plasma in a point-like manner uses a hollow cathode type discharge to generate high-density plasma.

圖18中，構件330，為構成氣體導引路的導引路構成構件，形成略圓筒形。在該構件330中，在軸方向氣體導引路331藉由適宜鑽孔加工等以直線狀穿設。In FIG. 18 , member 330 is a guide path component that constitutes the gas guide path, and is formed in a substantially cylindrical shape. In this member 330, the gas guide path 331 is formed in a straight line in the axial direction by appropriate drilling or the like.

該氣體導引路331，上端變大開口，下端變窄成為噴嘴形狀開放。在氣體導引路331的側方，穿設氣體供應口332，從氣體供應部315對氣體導引路331供應成為電漿的氣體。The gas guide path 331 has a wide opening at the upper end and a narrowed opening at the lower end in the shape of a nozzle. A gas supply port 332 is provided on the side of the gas guide path 331 , and gas that becomes plasma is supplied from the gas supply part 315 to the gas guide path 331 .

在氣體導引路331開口的一端，設置構件320塞住該開口部。構件320，若是封閉氣體導引路331的一端，透過後述雷射光的構件則沒有特別限定，但一般使用石英玻璃(以下構件320稱為石英玻璃板。)。A member 320 is provided at one end of the opening of the gas guide path 331 to close the opening. The member 320 is not particularly limited as long as it is a member that closes one end of the gas guide path 331 and transmits laser light described later, but quartz glass is generally used (hereinafter, the member 320 is referred to as a quartz glass plate).

該石英玻璃板320，在與構件330之間包夾O形環321，在其上方將中央部開口的蓋體316螺合至構件330。藉此，石英玻璃板320被壓附至O形環321側，氣體導引路331的一端會被密閉。(此外，若是密閉石英玻璃板320的方法，則沒有特別限定螺合方式。) 藉由該構造，從氣體供應部315通過氣體導入部317及氣體供應口332被導引的氣體，被氣體導引路331導引，從形成於氣體導引路331下端的噴嘴向下方照射。 The O-ring 321 is sandwiched between the quartz glass plate 320 and the member 330, and a cover 316 with an opening in the center is screwed to the member 330 above the quartz glass plate 320. Thereby, the quartz glass plate 320 is pressed to the O-ring 321 side, and one end of the gas guide path 331 is sealed. (In addition, if the quartz glass plate 320 is sealed, the screwing method is not particularly limited.) With this structure, the gas guided from the gas supply part 315 through the gas introduction part 317 and the gas supply port 332 is guided by the gas guide path 331 and irradiated downward from the nozzle formed at the lower end of the gas guide path 331 .

在成為氣體導引路331的噴嘴形狀並開放的下端也設置石英玻璃板322。藉由與上述一樣的構造，配置於其下端的石英玻璃板322，藉由O形環323、蓋體324，石英玻璃板322被壓附至O形環323側，氣體導引路331的一端(除了以下說明的第1孔部)會被密閉。A quartz glass plate 322 is also provided at the open lower end of the gas guide path 331 in the shape of a nozzle. With the same structure as above, the quartz glass plate 322 arranged at the lower end is pressed to the O-ring 323 side through the O-ring 323 and the cover 324, and one end of the gas guide path 331 (Except for the first hole described below) will be sealed.

在設置於下部的石英玻璃板322的上部面及下部面，設置施加激發氣體生成電漿的高頻電壓的由鎢形成的電漿電極313。接著，在電漿電極313，連接用來從電極電源314供應高壓、高頻電壓的電極電源線。Plasma electrodes 313 made of tungsten are provided on the upper surface and the lower surface of the quartz glass plate 322 provided at the lower part for applying a high-frequency voltage that excites gas to generate plasma. Next, an electrode power supply line for supplying high-voltage and high-frequency voltage from the electrode power supply 314 is connected to the plasma electrode 313 .

在下部的石英玻璃板322，形成與在氣體導引路331的下端構成的呈噴嘴形狀開放的噴嘴前端同樣的直徑0.5～0.8mm左右的第1孔部。再來，於設置於下部的石英玻璃板322的上部面及下部面的電漿電極313也形成第2孔部。第2孔部的直徑，比第1孔部的直徑還大、或與第1孔部的直徑幾乎同等。The lower quartz glass plate 322 is formed with a first hole having a diameter of about 0.5 to 0.8 mm similar to the nozzle front end formed in the lower end of the gas guide path 331 and opening in a nozzle shape. Next, second holes are also formed in the plasma electrodes 313 provided on the upper and lower surfaces of the quartz glass plate 322 at the lower part. The diameter of the second hole is larger than the diameter of the first hole, or is almost the same as the diameter of the first hole.

電漿，藉由從電極電源314將高壓、高頻電壓供應至電漿電極313，在電漿電極313的周邊(第2孔部的附近)生成，在此成為電漿產生區域318。接著，該生成的電漿從形成於蓋體324的下部的開口部，向位於下方的焊接球24照射。Plasma is generated around the plasma electrode 313 (near the second hole) by supplying high-voltage and high-frequency voltage from the electrode power supply 314 to the plasma electrode 313 , and this becomes the plasma generation region 318 . Next, the generated plasma is irradiated toward the solder ball 24 located below from the opening formed in the lower part of the cover 324 .

該照射，能夠根據來自氣體供應部315的氣體的供應壓力調整。來自氣體供應部315的氣體的供應壓力，設為不會因氣體壓而搭載於基板的焊接球24而飛散、或者不會從預定的電極上移動(位置偏移)的適當壓力。This irradiation can be adjusted according to the supply pressure of gas from the gas supply unit 315 . The supply pressure of the gas from the gas supply unit 315 is set to an appropriate pressure that does not cause the solder balls 24 mounted on the substrate to scatter due to the gas pressure or move (position misalignment) from a predetermined electrode.

此外，蓋體324的下部的開口部的直徑，與第1孔部的直徑幾乎同等、或比第1孔部的直徑還大較佳。In addition, the diameter of the opening at the lower part of the cover 324 is preferably almost the same as the diameter of the first hole, or is preferably larger than the diameter of the first hole.

從雷射單元305照射的雷射，被導入水平方向，藉由半反射鏡309，在鉛直方向反射，通過蓋體316上部的開口部，透過設置於構件330的上部的石英玻璃板320，通過氣體導引路331，通過第1孔部、第2孔部、蓋體324的下部的開口部，從焊接球24的上方，照射至焊接球24。The laser irradiated from the laser unit 305 is guided in the horizontal direction, reflected in the vertical direction by the half-reflecting mirror 309, passes through the opening on the upper part of the cover 316, and passes through the quartz glass plate 320 provided on the upper part of the member 330. The gas guide path 331 passes through the first hole, the second hole, and the lower opening of the cover 324 to irradiate the solder ball 24 from above the solder ball 24 .

又，與實施例1一樣，氣體(媒介氣體)，為包含重量%1～4%的氫成份的氬氣較佳。此時也一樣，藉由高頻電源(例如5kV、50Hz)即電漿電極313，激發氣體，氣體會自由基化，氣體會電漿化。In addition, as in Example 1, the gas (media gas) is preferably argon containing 1 to 4% by weight of hydrogen component. At this time as well, the gas is excited by the high-frequency power supply (eg, 5 kV, 50 Hz), that is, the plasma electrode 313, and the gas is radicalized and the gas is transformed into a plasma.

藉此，雷射單元305的雷射照射軸與電漿單元306的電漿照射軸，在焊接球24的附近成為同軸，並且雷射貫通電漿產生區域318，電漿與雷射同時照射至焊接球24。藉此，能夠有效率地同時將電漿與雷射照射至焊接球24。Thereby, the laser irradiation axis of the laser unit 305 and the plasma irradiation axis of the plasma unit 306 become coaxial near the solder ball 24, and the laser penetrates the plasma generation area 318, and the plasma and laser are simultaneously irradiated to Solder ball 24. Thereby, plasma and laser can be irradiated to the solder ball 24 simultaneously and efficiently.

此外，實施例2中，雖使用中空陰極型放電，使用使高密度的電漿產生的電漿的產生方式，但電漿的產生方式不限於此，例如，將氣體藉由高頻線圈激發的構造也可以。In addition, in Example 2, a hollow cathode type discharge was used and a plasma generation method was used to generate high-density plasma. However, the plasma generation method is not limited to this. For example, gas is excited by a high-frequency coil. Construction is also possible.

又，實施例2中，雖使用中空陰極型放電，在氣體導引路331的氣體出口側設置電漿電極，生成電漿，但電漿電極的位置，不限於實施例的氣體出口側，設於氣流通經路的任意的一部分也可以。Furthermore, in Example 2, a hollow cathode type discharge is used and a plasma electrode is provided on the gas outlet side of the gas guide path 331 to generate plasma. However, the position of the plasma electrode is not limited to the gas outlet side of the embodiment. It can also be used in any part of the air flow path.

以上，若如同實施例2那樣，能夠得到凸塊形成裝置，具備在一端以透過雷射光的光透過構件(例如石英玻璃板320)封閉的側方具有供應生成電漿的氣體的氣體供應口332，將從該氣體供應口332供應的氣體以照射至搭載於基板的焊接球的方式導引的形成直線狀的氣體導引路331、包圍從該氣體導引路331至焊接球的流通經路的一部分，對氣體施加高壓/高頻電源將氣體電漿化的電漿生成手段(例如電漿電極313)、將生成的雷射光，透過光透過構件，通過氣體的流通經路及電漿生成區域的中央部照射至焊接球的雷射產生手段(例如雷射單元305)，到以電漿除去焊接球的氧化膜，一同以雷射光將焊接球熔融形成凸塊。As described above, as in Embodiment 2, a bump forming device can be obtained, including a gas supply port 332 for supplying a gas for generating plasma, one end of which is closed with a light-transmitting member (for example, a quartz glass plate 320) that transmits laser light. A linear gas guide path 331 is formed to guide the gas supplied from the gas supply port 332 to the solder balls mounted on the substrate, and surrounds a circulation path from the gas guide path 331 to the solder balls. A part of the plasma generating means (such as the plasma electrode 313) that applies a high-voltage/high-frequency power supply to the gas to plasmaize the gas. The generated laser light is transmitted through the light-transmitting member through the gas circulation path and plasma generation. The central part of the area is irradiated to a laser generating means (such as the laser unit 305) of the solder ball, and the oxide film of the solder ball is removed with plasma, and the solder ball is melted with laser light to form a bump.

接著，使用圖19，說明關於應用實施例2的雷射的脈衝照射。Next, pulse irradiation using the laser of Example 2 will be described using FIG. 19 .

從雷射單元305照射的雷射，以脈衝(15～25kHz)照射較佳。藉由對焊接球24將雷射以脈衝照射，能夠將焊接球的氧化膜有效率地除去。這是因為將雷射以脈衝照射，使用熱聲效應，藉由該衝擊，能夠在形成於焊接球表面的氧化膜有效率地產生裂縫。The laser irradiated from the laser unit 305 is preferably pulsed (15 to 25 kHz). By irradiating the solder ball 24 with laser pulses, the oxide film of the solder ball can be effectively removed. This is because pulse irradiation of the laser uses the thermoacoustic effect, and the impact can efficiently create cracks in the oxide film formed on the surface of the solder ball.

因此，根據實施例2，因為能夠以雷射及電漿進行焊接，焊接的範圍小，在極微細焊接凸塊形成中，能夠進行信賴性高的焊接。Therefore, according to Embodiment 2, since welding can be performed using laser and plasma, the welding range is small, and highly reliable welding can be performed in forming extremely fine solder bumps.

如同以上，根據本實施例，雖將凸塊形成裝置、凸塊形成方法、焊接球修復裝置、焊接球修復方法基於適合的實施形態進行說明，但本發明非由上述實施例限定解釋者。亦即，本發明在不脫離要旨、主要特徵的範圍內，可以進行各種變更及各種形態的實施。As mentioned above, according to this embodiment, although the bump forming device, the bump forming method, the solder ball repairing device, and the solder ball repairing method are described based on suitable embodiments, the present invention is not limited to the above embodiments. That is, the present invention can be variously modified and implemented in various forms within the scope that does not deviate from the gist and main features.

1:印刷裝置 2:印刷頭 3:刮刀 4:馬達 10:印刷載台 15:攝影機 20,20b:網版 20d:開口部 21:基板 22:電極墊片 23:助焊劑 24:焊接球 60:焊接球供應頭 87:修復用點膠機 90:吸附噴嘴 91:芯棒 91a:上端部 91b:下端部 92:貫通孔 92a:開口端部 93:支持構件 94:噴嘴支持框 95:馬達 96:驅動部 97:線性軌道 98:前端部 99:基端部 120:電極墊片 121:助焊劑 130:清掃器 131:刮刀 200:電漿雷射修復頭部 201:馬達 202:致動器 203:頭框 204:基板高度變位計 205:雷射單元 206:觀察攝影機 207:雷射導光口 208:準直透鏡 209:集光透鏡 210:點加熱器 211:電漿天線 212:電漿毛細管 213:電漿電極 214:電漿噴嘴 215:基板 216:配向載台 217:配向攝影機 218:載台移動軸 219:單元固定板 300:電漿雷射頭部 305:雷射單元 306:電漿單元 309:半反射鏡 313:電漿電極 314:電極電源 315:氣體供應部 316:蓋體 317:氣體導入部 318:電漿產生區域 320:構件、石英玻璃板 321:O環 322:石英玻璃板 323:O環 324:蓋體 330:構件 331:氣體導引路 332:氣體供應口 1: Printing device 2: Print head 3:Scraper 4: Motor 10: Printing stage 15:Camera 20,20b:Screen version 20d: opening 21:Substrate 22:Electrode pad 23:Flux 24: Solder ball 60: Solder ball supply head 87:Repair dispensing machine 90:Adsorption nozzle 91:Mandrel 91a: Upper end 91b: Lower end 92:Through hole 92a: Open end 93: Support components 94:Nozzle support frame 95: Motor 96:Drive Department 97: Linear track 98: Front end 99: Base end 120:Electrode pad 121:Flux 130:Cleaner 131:Scraper 200: Plasma laser head repair 201:Motor 202: Actuator 203:Head frame 204:Substrate height displacement meter 205:Laser unit 206:Observation camera 207:Laser light guide port 208:Collimating lens 209: Concentrating lens 210: Spot heater 211: Plasma Antenna 212: Plasma capillary 213: Plasma electrode 214: Plasma nozzle 215:Substrate 216: Orientation carrier 217:Alignment camera 218: Carrier moving axis 219:Unit fixing plate 300: Plasma laser head 305:Laser unit 306: Plasma unit 309: Half mirror 313: Plasma electrode 314:Electrode power supply 315:Gas Supply Department 316: Cover 317:Gas introduction part 318: Plasma generation area 320: Components, quartz glass plates 321:O ring 322: Quartz glass plate 323:O ring 324: Cover 330:Component 331:Gas guide path 332:Gas supply port

[圖1]表示助焊劑印刷及焊接球搭載/印刷工程的概略圖。 [圖2]說明從助焊劑印刷到焊接球檢查修復的工程的概略圖。 [圖3]表示凸塊形成的工程的流程圖。 [圖4]表示焊接球供應頭的全體構造的側視圖。 [圖5]說明焊接球搭載/印刷動作的概略圖。 [圖6]表示焊接球搭載/印刷後的基板的狀態例的平面圖。 [圖7]表示焊接球搭載/印刷後的代表的缺陷例的概略圖。 [圖8]說明關於焊接球搭載/印刷後的修復作業的概略圖。 [圖9]說明關於檢查修復裝置的概略構造的平面圖。 [圖10]表示修復用點膠機的構造的側視圖。 [圖11]說明修復用點膠機的前端部的焊接球的吸附分離動作的擴大圖。 [圖12]表示本發明的實施例的電漿雷射修復系統的外觀圖。 [圖13]說明電漿雷射修復裝置的說明圖。 [圖14]說明電漿雷射修復頭部的說明圖。 [圖15]表示電漿雷射修復動作的流程圖。 [圖16]說明實施例2的電漿雷射頭部的說明圖。 [圖17]說明實施例2的電漿雷射頭部的原理的說明圖。 [圖18]說明實施例2的電漿雷射頭部的構造的說明圖。 [圖19]說明實施例2的脈衝照射的說明圖。 [Fig. 1] A schematic diagram showing the flux printing and solder ball mounting/printing process. [Fig. 2] A schematic diagram illustrating the process from flux printing to solder ball inspection and repair. [Fig. 3] A flowchart showing a bump formation process. [Fig. 4] A side view showing the overall structure of the solder ball supply head. [Fig. 5] A schematic diagram illustrating the solder ball mounting/printing operation. [Fig. 6] A plan view showing an example of the state of the substrate after solder ball mounting/printing. [Fig. 7] A schematic diagram showing typical defect examples after solder ball mounting/printing. [Fig. 8] A schematic diagram illustrating repair work after solder ball mounting/printing. [Fig. 9] A plan view illustrating the schematic structure of the inspection and repair device. [Fig. 10] A side view showing the structure of a repair glue dispenser. [Fig. 11] An enlarged view illustrating the adsorption and separation operation of the solder ball at the front end of the repair dispensing machine. [Fig. 12] Fig. 12 is an external view showing the plasma laser repair system according to the embodiment of the present invention. [Fig. 13] An explanatory diagram illustrating the plasma laser repair device. [Fig. 14] An explanatory diagram illustrating plasma laser repair of the head. [Fig. 15] A flow chart showing the plasma laser repair operation. [Fig. 16] An explanatory diagram illustrating the plasma laser head of Example 2. [Fig. 17] An explanatory diagram illustrating the principle of the plasma laser head of Embodiment 2. [Fig. 18] An explanatory diagram illustrating the structure of the plasma laser head of Example 2. [Fig. [Fig. 19] An explanatory diagram illustrating pulse irradiation in Example 2. [Fig.

200:電漿雷射修復頭部 200: Plasma laser head repair

201:馬達 201:Motor

202:致動器 202: Actuator

203:頭框 203:Head frame

204:基板高度變位計 204:Substrate height displacement meter

205:雷射單元 205:Laser unit

206:觀察攝影機 206:Observation camera

207:雷射導光口 207:Laser light guide port

208:準直透鏡 208:Collimating lens

209:集光透鏡 209: Concentrating lens

210:點加熱器 210: Spot heater

211:電漿天線 211: Plasma Antenna

212:電漿毛細管 212: Plasma capillary

213:電漿電極 213: Plasma electrode

214:電漿噴嘴 214: Plasma nozzle

215:基板 215:Substrate

216:配向載台 216: Orientation carrier

217:配向攝影機 217:Alignment camera

219:單元固定板 219:Unit fixing plate

Claims (35)

一種凸塊形成裝置，係對在基板上形成的電極墊片供應焊接球的凸塊形成裝置，具備：對供應的焊接球照射電漿，除去前述焊接球的氧化膜的電漿產生裝置、及對前述焊接球照射雷射，熔融前述焊接球的雷射產生裝置；藉由前述電漿產生裝置對前述焊接球照射前述電漿，除去前述焊接球的氧化膜，一同藉由前述雷射產生裝置對前述焊接球照射前述雷射，熔融前述焊接球，在前述電極墊片形成焊接凸塊。 A bump forming device that supplies solder balls to electrode pads formed on a substrate, and includes: a plasma generating device that irradiates the supplied solder balls with plasma to remove the oxide film of the solder balls; and A laser generating device that irradiates the soldering ball with laser and melts the soldering ball; irradiates the soldering ball with the plasma through the plasma generating device to remove the oxide film of the soldering ball, and simultaneously uses the laser generating device The solder balls are irradiated with the laser to melt the solder balls and form solder bumps on the electrode pads. 如請求項1記載的凸塊形成裝置，具備：控制前述電漿產生裝置所致的電漿照射與前述雷射產生裝置所致的雷射照射的控制部；前述控制部，控制成存在前述電漿產生裝置所致的電漿照射與前述雷射產生裝置所致的雷射照射同時進行的時間帶。 The bump forming apparatus according to Claim 1, further comprising: a control unit for controlling plasma irradiation by the plasma generating device and laser irradiation by the laser generating device; and the control unit controls the presence of the plasma irradiation device. A time period in which plasma irradiation by the plasma generating device and laser irradiation by the laser generating device are performed simultaneously. 如請求項2記載的凸塊形成裝置，其中，前述控制部，控制成在前述雷射產生裝置所致的雷射照射前，進行前述電漿產生裝置所致的電漿照射。 The bump forming apparatus according to claim 2, wherein the control unit controls the plasma irradiation by the plasma generating device before the laser irradiation by the laser generating device. 如請求項1記載的凸塊形成裝置，其中，前述電漿產生裝置所致的電漿照射軸與前述雷射產生裝置所致的雷射照射軸為同軸。 The bump forming apparatus according to claim 1, wherein the plasma irradiation axis of the plasma generating device and the laser irradiation axis of the laser generating device are coaxial. 如請求項1記載的凸塊形成裝置，其中，在對前述焊接球的電漿照射與雷射照射前，將前述焊接球及焊接球的周邊預熱。 The bump forming apparatus according to claim 1, wherein the solder ball and the periphery of the solder ball are preheated before plasma irradiation and laser irradiation of the solder ball. 如請求項5記載的凸塊形成裝置，其中，前述預熱，藉由對前述焊接球以點狀預熱的點加熱器進行。 The bump forming apparatus according to claim 5, wherein the preheating is performed by a spot heater that preheats the solder balls in a spot shape. 如請求項5記載的凸塊形成裝置，其中，前述預熱，藉由對前述焊接球的周邊預熱的失焦雷射進行。 The bump forming apparatus according to claim 5, wherein the preheating is performed by an out-of-focus laser that preheats the periphery of the solder ball. 如請求項1記載的凸塊形成裝置，其中，從前述雷射產生裝置照射的雷射，以脈衝對前述焊接球照射。 The bump forming apparatus according to claim 1, wherein the laser irradiated from the laser generating device irradiates the solder ball with a pulse. 如請求項1記載的凸塊形成裝置，其中，前述電漿產生裝置，使用中空陰極型放電，使電漿產生。 The bump forming apparatus according to claim 1, wherein the plasma generating device generates plasma using a hollow cathode type discharge. 一種凸塊形成裝置，係對在基板上形成的電極墊片供應焊接球的凸塊形成裝置，具備：對前述電極墊片照射電漿除去前述電極墊片的氧化被膜的電漿產生裝置、其後對前述電極墊片供應焊接球，對供應的焊接球照射前述電漿，除去前述焊接球的氧化膜的前述電漿產生裝置、及對前述焊接球照射雷射，熔融前述焊接球的雷射產生裝置；除去前述焊接球的氧化膜的同時，熔融前述焊接球，在前述電極墊片形成焊接凸塊。 A bump forming device that supplies solder balls to electrode pads formed on a substrate, including: a plasma generating device that irradiates the electrode pads with plasma to remove an oxide film on the electrode pads; and Then, welding balls are supplied to the electrode pad, and the supplied welding balls are irradiated with the plasma to remove the oxide film of the welding balls; and the laser is irradiated to the welding balls to melt the welding balls. The generating device removes the oxide film of the solder ball and melts the solder ball to form a solder bump on the electrode pad. 一種凸塊形成方法，係對在基板上形成的電極墊片供應焊接球的凸塊形成方法，其中，對前述電極墊片供應焊接球後，對前述焊接球照射電 漿，一同照射雷射，除去前述焊接球的氧化膜，同時熔融前述焊接球，對前述電極墊片進行焊接。 A bump forming method that supplies solder balls to electrode pads formed on a substrate, wherein after supplying solder balls to the electrode pads, the solder balls are irradiated with electricity The slurry is irradiated with laser at the same time to remove the oxide film of the solder ball, and at the same time, the solder ball is melted to weld the electrode pad. 一種凸塊形成方法，係對在基板上形成的電極墊片供應焊接球的凸塊形成方法，其中，對前述電極墊片照射電漿除去前述電極墊片的氧化被膜，對前述電極墊片供應焊接球後，對前述焊接球照射電漿，一同照射雷射，除去前述焊接球的氧化膜，同時熔融前述焊接球，對前述電極墊片進行焊接。 A bump forming method in which solder balls are supplied to electrode pads formed on a substrate, wherein the electrode pads are irradiated with plasma to remove the oxide film of the electrode pads, and the electrode pads are supplied with solder balls. After soldering the balls, the soldering balls are irradiated with plasma and laser simultaneously to remove the oxide film of the soldering balls and simultaneously melt the soldering balls to weld the electrode pads. 一種焊接球修復裝置，具備檢查在基板的電極墊片上形成的焊接凸塊的狀態，對檢出缺陷的電極墊片供應焊接球的修復用點膠機，該焊接球修復裝置，具備：對藉由前述修復用點膠機供應的焊接球照射電漿，除去前述焊接球的氧化膜的電漿產生裝置、及對前述焊接球照射雷射，熔融前述焊接球的雷射產生裝置；除去前述焊接球的氧化膜的同時，熔融前述焊接球，在前述電極墊片形成焊接凸塊。 A soldering ball repairing device is provided with a dispensing machine for inspecting the status of soldering bumps formed on an electrode pad of a substrate and supplying repairing solder balls to electrode pads where defects are detected. The soldering ball repairing device is provided with: A plasma generating device that removes the oxide film of the soldered ball by irradiating the solder ball supplied by the repair dispensing machine with plasma, and a laser generating device that irradiates the soldered ball with laser to melt the soldered ball; removing the aforementioned While the oxide film of the solder ball is melted, the solder ball is melted to form a solder bump on the electrode pad. 如請求項13記載的焊接球修復裝置，具備：控制部；前述控制部，控制成存在前述電漿產生裝置所致的電漿照射與前述雷射產生裝置所致的雷射照射同時進行的時間帶。 The solder ball repairing device according to Claim 13, further comprising: a control unit; and the control unit controls the timing so that the plasma irradiation by the plasma generation device and the laser irradiation by the laser generation device are performed simultaneously. belt. 如請求項13或14記載的焊接球修復裝置，其中， 電漿照射在雷射照射前進行。 The solder ball repair device as described in claim 13 or 14, wherein, Plasma irradiation is performed before laser irradiation. 如請求項13或14記載的焊接球修復裝置，其中，在對藉由前述修復用點膠機檢出缺陷的電極墊片供應焊接球前，藉由前述電漿產生裝置除去前述電極墊片的氧化膜。 The solder ball repair device according to claim 13 or 14, wherein before supplying solder balls to the electrode pads whose defects are detected by the repair dispensing machine, the plasma generating device removes the electrode pads Oxide film. 一種焊接球修復裝置，具備檢查在基板的電極墊片上形成的焊接凸塊的狀態，對檢出缺陷的電極墊片供應焊接球的修復用點膠機，該焊接球修復裝置，具備：對檢出前述缺陷的電極墊片照射電漿，除去氧化膜，一同對藉由前述修復用點膠機供應的焊接球照射電漿，除去前述焊接球的氧化膜的電漿產生裝置、及對前述焊接球照射雷射，熔融前述焊接球的雷射產生裝置；除去檢出前述缺陷的電極墊片的氧化膜，除去前述焊接球的氧化膜的同時，熔融前述焊接球，將前述焊接球焊接至前述電極墊片。 A soldering ball repairing device is provided with a dispensing machine for inspecting the status of soldering bumps formed on an electrode pad of a substrate and supplying repairing solder balls to electrode pads where defects are detected. The soldering ball repairing device is provided with: The electrode pad in which the aforementioned defect is detected is irradiated with plasma to remove the oxide film, and the solder ball supplied by the aforementioned repair dispensing machine is irradiated with plasma to remove the oxide film of the aforementioned solder ball, and a plasma generating device for the aforementioned A laser generating device that irradiates the welding ball with laser and melts the welding ball; removes the oxide film of the electrode pad where the aforementioned defect is detected; while removing the oxide film of the aforementioned welding ball, melts the aforementioned welding ball and welds the aforementioned welding ball to The aforementioned electrode pad. 如請求項13或14記載的焊接球修復裝置，其中，前述雷射產生裝置，以與焊接球的直徑略相同的點徑，對前述焊接球照射雷射。 The solder ball repairing device according to claim 13 or 14, wherein the laser generating device irradiates the laser to the solder ball with a spot diameter that is approximately the same as the diameter of the solder ball. 如請求項13或14記載的焊接球修復裝置，其中，前述電漿產生裝置，對供應至前述電極墊片的焊接 球，於略中心照射電漿。 The solder ball repair device according to claim 13 or 14, wherein the plasma generating device is used to repair the solder ball supplied to the electrode pad. The ball is irradiated with plasma at the approximate center. 如請求項13或14記載的焊接球修復裝置，其中，前述電漿產生裝置，對供應至前述電極墊片的焊接球的略上半部照射電漿。 The solder ball repair device according to claim 13 or 14, wherein the plasma generating device irradiates plasma to a substantially upper half of the solder ball supplied to the electrode pad. 如請求項13或14記載的焊接球修復裝置，其中，前述雷射產生裝置，對供應至前述電極墊片的焊接球，於略中心照射雷射。 The solder ball repair device according to claim 13 or 14, wherein the laser generating device irradiates the solder ball supplied to the electrode pad with a laser at a substantially center. 如請求項13或14記載的焊接球修復裝置，其中，前述雷射產生裝置，對供應至前述電極墊片的焊接球的略上半部照射雷射。 The solder ball repairing device according to Claim 13 or 14, wherein the laser generating device irradiates a substantially upper half of the solder ball supplied to the electrode pad with the laser. 如請求項13或14記載的焊接球修復裝置，其中，前述電漿產生裝置，對前述電極墊片，以比焊接球的直徑或電極墊片的直徑還廣的範圍，照射電漿。 The solder ball repair device according to claim 13 or 14, wherein the plasma generating device irradiates the electrode pad with plasma in a range wider than the diameter of the solder ball or the diameter of the electrode pad. 如請求項13或14記載的焊接球修復裝置，其中，前述電漿產生裝置，使用媒介氣體使電漿產生。 The solder ball repair device according to Claim 13 or 14, wherein the plasma generating device uses a medium gas to generate plasma. 如請求項24記載的焊接球修復裝置，其中，前述媒介氣體，為包含重量%為1~4%的氫成份的氬氣。 The solder ball repair device according to claim 24, wherein the medium gas is argon gas containing 1 to 4% by weight of hydrogen. 如請求項13或14記載的焊接球修復裝置，其中，前述雷射產生裝置的照射軸與前述電漿產生裝置的照射軸的夾角，以0~180度進行調整。 The solder ball repair device according to claim 13 or 14, wherein the angle between the irradiation axis of the laser generating device and the irradiating axis of the plasma generating device is adjusted from 0 to 180 degrees. 一種焊接球修復裝置，具備檢查在基板的電極墊片上形成的焊接凸塊的狀態，對檢出缺陷的電極墊片供應焊接球的修復用點膠機，該焊接球修復裝置，具備：對藉由前述修復用點膠機供應的焊接球照射電漿，除去前述焊接球的氧化膜的電漿產生裝置、及與除去前述焊接球的氧化膜一同或同時對前述焊接球照射雷射，熔融前述焊接球的雷射產生裝置。 A soldering ball repairing device is provided with a dispensing machine for inspecting the status of soldering bumps formed on an electrode pad of a substrate and supplying repairing solder balls to electrode pads where defects are detected. The soldering ball repairing device is provided with: A plasma generating device that removes the oxide film of the solder ball by irradiating the solder ball supplied from the repair dispensing machine with plasma, and irradiating the laser with or simultaneously with the removal of the oxide film of the solder ball to melt the solder ball The aforementioned laser generating device for welding balls. 一種焊接球修復方法，係藉由焊接球檢查工程檢查在基板的電極墊片上形成的焊接凸塊的狀態，對藉由前述焊接球檢查工程檢出缺陷的電極墊片藉由修復用點膠機供應焊接球的焊接球修復方法，其中，對藉由前述修復用點膠機檢出前述缺陷的電極墊片供應焊接球後，對前述焊接球照射電漿，一同照射雷射，除去前述焊接球的氧化膜，同時熔融前述焊接球，對前述電極墊片進行焊接。 A method for repairing solder balls, which involves checking the state of solder bumps formed on electrode pads of a substrate through a solder ball inspection process, and repairing the electrode pads with defects detected by the solder ball inspection process by dispensing glue A soldering ball repair method in which soldering balls are supplied by a machine, wherein, after supplying soldering balls to the electrode pads whose defects are detected by the repairing dispensing machine, the soldering balls are irradiated with plasma and laser irradiated together to remove the soldering balls. The oxide film of the ball is melted at the same time, and the aforementioned electrode pad is welded. 一種焊接球修復方法，係藉由焊接球檢查工程檢查在基板的電極墊片上形成的焊接凸塊的狀態，對藉由前述焊接球檢查工程檢出缺陷的電極墊片藉由修復用點膠機供應焊接球的焊接球修復方法，其中， 對藉由前述修復用點膠機檢出前述缺陷的電極墊片照射電漿除去前述電極墊片的氧化被膜，其後，對前述電極墊片供應焊接球，對前述焊接球一同或同時照射電漿及雷射，使前述焊接球固著於前述電極墊片。 A method for repairing solder balls, which involves checking the state of solder bumps formed on electrode pads of a substrate through a solder ball inspection process, and repairing the electrode pads with defects detected by the solder ball inspection process by dispensing glue The machine supplies welding ball repair methods for welding balls, among which, The electrode pads with the aforementioned defects detected by the aforementioned repair dispensing machine are irradiated with plasma to remove the oxide film of the aforementioned electrode pads. Thereafter, solder balls are supplied to the aforementioned electrode pads, and the aforementioned soldered balls are irradiated with electricity simultaneously or simultaneously. Slurry and laser are used to fix the solder ball on the electrode pad. 如請求項13記載的焊接球修復裝置，其中，前述電漿產生裝置所致的電漿照射軸與前述雷射產生裝置所致的雷射照射軸為同軸。 The solder ball repair device according to claim 13, wherein the plasma irradiation axis of the plasma generating device and the laser irradiation axis of the laser generating device are coaxial. 如請求項13記載的焊接球修復裝置，其中，在對前述焊接球的電漿照射與雷射照射前，將前述焊接球及焊接球的周邊預熱。 The solder ball repair device according to claim 13, wherein the solder ball and the periphery of the solder ball are preheated before plasma irradiation and laser irradiation of the solder ball. 如請求項31記載的焊接球修復裝置，其中，前述預熱，藉由對前述焊接球以點狀預熱的點加熱器進行。 The solder ball repair device according to claim 31, wherein the preheating is performed by a spot heater that preheats the solder ball in a spot shape. 如請求項31記載的焊接球修復裝置，其中，前述預熱，藉由對前述焊接球的周邊預熱的失焦雷射進行。 The solder ball repair device according to claim 31, wherein the preheating is performed by an out-of-focus laser that preheats the periphery of the solder ball. 如請求項31記載的焊接球修復裝置，其中，從前述雷射產生裝置照射的雷射，以脈衝對前述焊接球照射。 The solder ball repairing device according to Claim 31, wherein the laser irradiated from the laser generating device irradiates the solder ball with a pulse. 如請求項31記載的焊接球修復裝置，其中，前述電漿產生裝置，使用中空陰極型放電，使電漿產生。 The solder ball repairing device according to claim 31, wherein the plasma generating device uses a hollow cathode type discharge to generate plasma.
TW110145825A 2021-01-27 2021-12-08 Bump forming device, bump forming method, solder ball repair device, and solder ball repair method TWI818377B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021-011141 2021-01-27
JP2021011141A JP7107601B1 (en) 2021-01-27 2021-01-27 Bump forming apparatus, bump forming method, solder ball repair apparatus, and solder ball repair method

Publications (2)

Publication Number Publication Date
TW202230551A TW202230551A (en) 2022-08-01
TWI818377B true TWI818377B (en) 2023-10-11

Family

ID=82527549

Family Applications (1)

Application Number Title Priority Date Filing Date
TW110145825A TWI818377B (en) 2021-01-27 2021-12-08 Bump forming device, bump forming method, solder ball repair device, and solder ball repair method

Country Status (4)

Country Link
JP (2) JP7107601B1 (en)
KR (1) KR20220108737A (en)
CN (1) CN114823396A (en)
TW (1) TWI818377B (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115488074B (en) * 2022-09-29 2023-11-03 西安微电子技术研究所 Pretreatment method for bulb-to-bulb column implantation of tube shell package
CN115635155B (en) * 2022-10-20 2023-05-05 安徽钜芯半导体科技有限公司 Processing technology of heat sink conducting strip of power device

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6712260B1 (en) * 2002-04-18 2004-03-30 Taiwan Semiconductor Manufacturing Company Bump reflow method by inert gas plasma
US6742701B2 (en) * 1998-09-17 2004-06-01 Kabushiki Kaisha Tamura Seisakusho Bump forming method, presoldering treatment method, soldering method, bump forming apparatus, presoldering treatment device and soldering apparatus
US6849477B2 (en) * 2002-10-12 2005-02-01 Samsung Electronics Co., Ltd. Method of fabricating and mounting flip chips
TW200709313A (en) * 2005-08-31 2007-03-01 Advanced Semiconductor Eng Packaging substrate and menufactiring method thereof; chip package and packaging process thereof
US20170062369A1 (en) * 2013-11-12 2017-03-02 Taiwan Semiconductor Manufacturing Company Ltd. Semiconductor packaging and manufacturing method thereof

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3779490B2 (en) 1998-05-29 2006-05-31 株式会社ルネサステクノロジ Bump formation method
JP2000138260A (en) 1998-10-30 2000-05-16 Sony Corp Manufacture of semiconductor device
JP2002076043A (en) 2000-08-28 2002-03-15 Mitsubishi Electric Corp Bump forming method, semiconductor device, and bump forming device
JP3822834B2 (en) 2002-04-12 2006-09-20 新日本製鐵株式会社 Repair method and apparatus
JP2007287888A (en) 2006-04-14 2007-11-01 Nippon Steel Materials Co Ltd Bump forming method
US7823762B2 (en) 2006-09-28 2010-11-02 Ibiden Co., Ltd. Manufacturing method and manufacturing apparatus of printed wiring board
JP2008235471A (en) 2007-03-19 2008-10-02 Nippon Steel Materials Co Ltd Method and apparatus for recovering poorly mounted solder ball, and bump forming method
JP5098434B2 (en) 2007-05-21 2012-12-12 株式会社日立プラントテクノロジー Solder ball printing device
JP5076922B2 (en) 2008-01-25 2012-11-21 株式会社日立プラントテクノロジー Solder ball printing device
JP4983737B2 (en) 2008-06-30 2012-07-25 株式会社日立プラントテクノロジー Solder ball inspection repair device and solder ball inspection repair method
JP2013038302A (en) 2011-08-10 2013-02-21 Panasonic Corp Semiconductor device
JP3173338U (en) 2011-11-18 2012-02-02 株式会社イチーナ Cool arm bag
JP5941814B2 (en) 2012-10-03 2016-06-29 ファスフォードテクノロジ株式会社 Die bonder apparatus and die bonding method
JP2015103688A (en) 2013-11-26 2015-06-04 インターナショナル・ビジネス・マシーンズ・コーポレーションＩｎｔｅｒｎａｔｉｏｎａｌ Ｂｕｓｉｎｅｓｓ Ｍａｃｈｉｎｅｓ Ｃｏｒｐｏｒａｔｉｏｎ Bonding method, semiconductor device, manufacturing system and oxide film removal device (chip bonding process using no-clean flux)

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6742701B2 (en) * 1998-09-17 2004-06-01 Kabushiki Kaisha Tamura Seisakusho Bump forming method, presoldering treatment method, soldering method, bump forming apparatus, presoldering treatment device and soldering apparatus
US6712260B1 (en) * 2002-04-18 2004-03-30 Taiwan Semiconductor Manufacturing Company Bump reflow method by inert gas plasma
US6849477B2 (en) * 2002-10-12 2005-02-01 Samsung Electronics Co., Ltd. Method of fabricating and mounting flip chips
TW200709313A (en) * 2005-08-31 2007-03-01 Advanced Semiconductor Eng Packaging substrate and menufactiring method thereof; chip package and packaging process thereof
US20170062369A1 (en) * 2013-11-12 2017-03-02 Taiwan Semiconductor Manufacturing Company Ltd. Semiconductor packaging and manufacturing method thereof

Also Published As

Publication number Publication date
CN114823396A (en) 2022-07-29
JP2022115105A (en) 2022-08-08
TW202230551A (en) 2022-08-01
JP7107601B1 (en) 2022-07-27
KR20220108737A (en) 2022-08-03
JP2022114729A (en) 2022-08-08

Similar Documents

Publication Publication Date Title
TWI818377B (en) Bump forming device, bump forming method, solder ball repair device, and solder ball repair method
JP4983737B2 (en) Solder ball inspection repair device and solder ball inspection repair method
JP5098434B2 (en) Solder ball printing device
JP5076922B2 (en) Solder ball printing device
US6471115B1 (en) Process for manufacturing electronic circuit devices
JP3271461B2 (en) Solder ball mounting device and mounting method
US6460755B1 (en) Bump forming method and apparatus therefor
JP4935743B2 (en) Flux forming device
JPH09298356A (en) Method for forming bumps and its apparatus and electronic device formed thereby
JP2024008161A (en) Bump forming device, bump forming method, solder ball repair device, and solder ball repair method
KR101045673B1 (en) Apparatus for formationing flux and method for formationing flux
JPH05235535A (en) Electronic parts correction equipment
JP2003303854A (en) Chip mounting method and apparatus using it
KR20210092422A (en) Laser bonding system
JPH05235536A (en) Electronic parts correction equipment
JPH0964521A (en) Solder feeder and feeding method
JP5055491B2 (en) Part suction nozzle, fixed head, and part fixing method
JPH04320091A (en) Method of modifying electronic parts
KR20230151390A (en) Method of manufacturing heating plate
JP2003303851A (en) Chip mounting method and apparatus using the same
JP2009259910A (en) Mounting device and method of electronic device
JP2004241574A (en) Repair equipment and repair method of electronic component
JPH09326466A (en) Soldering method for stacked semiconductor device, fabrication thereof and stacked semiconductor module