CN114823396A - Bump forming apparatus, bump forming method, solder ball repairing apparatus and solder ball repairing method - Google Patents
Bump forming apparatus, bump forming method, solder ball repairing apparatus and solder ball repairing method Download PDFInfo
- Publication number
- CN114823396A CN114823396A CN202210097119.XA CN202210097119A CN114823396A CN 114823396 A CN114823396 A CN 114823396A CN 202210097119 A CN202210097119 A CN 202210097119A CN 114823396 A CN114823396 A CN 114823396A
- Authority
- CN
- China
- Prior art keywords
- solder ball
- plasma
- laser
- solder
- electrode pad
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 title claims abstract description 598
- 238000000034 method Methods 0.000 title claims abstract description 71
- 239000000758 substrate Substances 0.000 claims abstract description 121
- 230000008439 repair process Effects 0.000 claims description 155
- 239000007789 gas Substances 0.000 claims description 68
- 238000007689 inspection Methods 0.000 claims description 46
- 230000007547 defect Effects 0.000 claims description 45
- 230000001678 irradiating effect Effects 0.000 claims description 36
- 238000005476 soldering Methods 0.000 claims description 28
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 claims description 10
- 238000002844 melting Methods 0.000 claims description 9
- 230000008018 melting Effects 0.000 claims description 9
- 239000001257 hydrogen Substances 0.000 claims description 6
- 229910052739 hydrogen Inorganic materials 0.000 claims description 6
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 5
- 229910052786 argon Inorganic materials 0.000 claims description 5
- 238000012545 processing Methods 0.000 claims description 3
- 239000000155 melt Substances 0.000 abstract description 5
- 238000007639 printing Methods 0.000 description 44
- 230000002950 deficient Effects 0.000 description 38
- 230000004907 flux Effects 0.000 description 35
- 230000007246 mechanism Effects 0.000 description 15
- 230000008569 process Effects 0.000 description 15
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 14
- 238000001179 sorption measurement Methods 0.000 description 14
- 238000004519 manufacturing process Methods 0.000 description 13
- 238000010586 diagram Methods 0.000 description 10
- 238000005219 brazing Methods 0.000 description 9
- 238000006073 displacement reaction Methods 0.000 description 8
- 239000000463 material Substances 0.000 description 8
- 229910052751 metal Inorganic materials 0.000 description 6
- 239000002184 metal Substances 0.000 description 6
- 239000004065 semiconductor Substances 0.000 description 6
- 230000009471 action Effects 0.000 description 5
- 230000015572 biosynthetic process Effects 0.000 description 5
- 238000004140 cleaning Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- 239000000696 magnetic material Substances 0.000 description 5
- 241001417527 Pempheridae Species 0.000 description 4
- 238000000926 separation method Methods 0.000 description 4
- 238000007664 blowing Methods 0.000 description 3
- 230000006870 function Effects 0.000 description 3
- 238000003384 imaging method Methods 0.000 description 3
- 239000011261 inert gas Substances 0.000 description 3
- 230000033116 oxidation-reduction process Effects 0.000 description 3
- 238000003860 storage Methods 0.000 description 3
- 238000003466 welding Methods 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 230000000996 additive effect Effects 0.000 description 2
- 238000004891 communication Methods 0.000 description 2
- 238000001514 detection method Methods 0.000 description 2
- 230000003028 elevating effect Effects 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 229910000765 intermetallic Inorganic materials 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 210000004180 plasmocyte Anatomy 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- 230000003685 thermal hair damage Effects 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 238000005411 Van der Waals force Methods 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000012937 correction Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000006378 damage Effects 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000010295 mobile communication Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 230000001502 supplementing effect Effects 0.000 description 1
- 238000010408 sweeping Methods 0.000 description 1
- 230000008685 targeting Effects 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/10—Bump connectors ; Manufacturing methods related thereto
- H01L24/11—Manufacturing methods
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/005—Soldering by means of radiant energy
- B23K1/0056—Soldering by means of radiant energy soldering by means of beams, e.g. lasers, E.B.
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K10/00—Welding or cutting by means of a plasma
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67288—Monitoring of warpage, curvature, damage, defects or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/75—Apparatus for connecting with bump connectors or layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
- H01L2021/60292—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation involving the use of an electron or laser beam
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/11—Manufacturing methods
- H01L2224/111—Manufacture and pre-treatment of the bump connector preform
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
- H01L2224/7525—Means for applying energy, e.g. heating means
- H01L2224/75261—Laser
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
- H01L2224/7525—Means for applying energy, e.g. heating means
- H01L2224/7528—Resistance welding electrodes, i.e. for ohmic heating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
- H01L2224/81009—Pre-treatment of the bump connector or the bonding area
- H01L2224/81022—Cleaning the bonding area, e.g. oxide removal step, desmearing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
- H01L2224/812—Applying energy for connecting
- H01L2224/81201—Compression bonding
- H01L2224/81203—Thermocompression bonding, e.g. diffusion bonding, pressure joining, thermocompression welding or solid-state welding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
- H01L2224/812—Applying energy for connecting
- H01L2224/8122—Applying energy for connecting with energy being in the form of electromagnetic radiation
- H01L2224/81224—Applying energy for connecting with energy being in the form of electromagnetic radiation using a laser
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Optics & Photonics (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
A bump forming apparatus, a bump forming method, a solder ball repairing apparatus and a solder ball repairing method are provided, which aim to improve the reliability in forming a very small solder bump. The bump forming device of the invention supplies solder balls to electrode pads formed on a substrate, wherein the bump forming device is provided with a plasma generating device and a laser generating device, the plasma generating device irradiates plasma to the supplied solder balls to remove oxide films of the solder balls; the laser generator irradiates laser to the solder ball to melt the solder ball, and the laser irradiation unit melts the solder ball to form solder bump on the electrode pad while the plasma irradiation unit removes the oxide film of the solder ball.
Description
Technical Field
The present invention relates to a bump forming apparatus and a bump forming method for mounting a solder ball on a substrate in an electrode manufacturing process of a package substrate used for a semiconductor device, and also relates to a solder ball repairing apparatus and a solder ball repairing method for repairing (repair) a defective portion by inspecting a formed electrode.
Background
In recent years, a bump formation technique using solder is used for electrical connection of semiconductor devices. For example, there is a solder paste printing method in which solder paste is printed on electrodes of a substrate by using a high-precision screen printing apparatus and reflowed to form solder bump electrodes having a diameter of 80 to 100 μm at a pitch of 150 to 180 μm.
In addition, there is a ball-dispensing method in which solder balls are dispensed into a jig in which fine holes are precisely formed, aligned at a predetermined pitch, and directly mounted on a substrate, and then reflowed, thereby forming solder bump electrodes, along with the miniaturization of electrodes by the miniaturization and the improvement in performance of semiconductor devices.
In such a background art, japanese patent application laid-open No. 2000-049183 (patent document 1) discloses a method in which solder balls are supplied from a gas nozzle onto a mask, the mask is oscillated and vibrated to fill predetermined openings with the solder balls, and the filled solder balls are heated after being moved in parallel by a brush and a squeegee. However, all the solder balls are not necessarily mounted at the respective bump forming positions, and mounting failure may occur in some cases.
Therefore, japanese patent application laid-open No. 2003-309139 (patent document 2) discloses a technique of: a repair device for solder balls is provided, after defective solder balls are sucked and removed by a tube member, the tube member is made to suck new good solder balls, and then the defective portions are carried and mounted again, and a laser beam irradiation unit irradiates laser beams from the inside of the tube member to melt the solder balls for temporary fixing.
Further, japanese patent laid-open nos. 2008-288515 (patent document 3) and 2009-177015 (patent document 4) disclose a solder ball printing apparatus including an inspection and repair section which inspects the state of a substrate on which solder balls are printed, and repairs the substrate in accordance with a defective state.
Further, japanese patent application laid-open No. 2010-010565 (patent document 5) discloses a solder ball inspection and repair device including a repair dispenser that inspects a state of a solder ball mounted on an electrode pad of a substrate and supplies the solder ball to the electrode pad in which a defect is detected.
Further, as a technique for heating the solder ball, there are japanese patent No. 3173338 (patent document 6), japanese patent No. 3822834 (patent document 7), and japanese patent No. 5098648 (patent document 8), and as a technique for removing the oxide film by using plasma, there is japanese patent application laid-open No. 2015 and 103688 (patent document 9), and as a technique for performing heat melting by a laser, there is japanese patent application laid-open No. 2003 and 309139 (patent document 10).
[ Prior Art document ]
[ patent literature ] A
[ patent document 1 ] Japanese patent laid-open No. 2000-049183
[ patent document 2 ] Japanese patent laid-open No. 2003-309139
[ patent document 3 ] Japanese patent application laid-open No. 2008-288515
[ patent document 4 ] Japanese patent laid-open No. 2009-177015
[ patent document 5 ] Japanese patent application laid-open No. 2010-010565
[ patent document 6 ] patent No. 3173338
[ patent document 7 ] Japanese patent No. 3822834
[ patent document 8 ] Japanese patent No. 5098648
[ patent document 9 ] Japanese patent laid-open No. 2015-103688
[ patent document 10 ] Japanese patent laid-open No. 2003-309139
Disclosure of Invention
Problems to be solved by the invention
Currently, the 5G (fifth generation mobile communication system) corresponding technology has been put into practical use. Furthermore, the diameter of the solder ball used for forming the bump electrode is also reduced to an extremely small size from 70 to 80 μm to 30 to 50 μm or less. With the miniaturization of bump electrodes by the miniaturization, high speed, and large capacity of semiconductor devices for 5G, even when reflow is performed by the techniques and devices disclosed in the above patent documents, problems such as solder wettability and intermetallic compound (IMC) layers have been encountered, such as a solder defect, a crack, and the like, and a decrease in reliability of a solder bonding interface, and a defect generation in the solder bump electrode have been problematic.
In addition, in the solder ball inspection and repair device in the solder ball printing apparatus disclosed in patent documents 3 to 5 and the techniques disclosed in patent documents 6 to 10, when the inspection is performed again after the reflow, the solder ball is mounted and the repair is performed, even if the solder ball newly supplied is coated with the flux, the electrode pad portion is damaged (influenced) by the oxidation action of the reflow process performed in advance, and thus the probability of the occurrence of the solder defect is high. In addition, there is a possibility that a problem occurs in brazing reliability as compared with general brazing.
Accordingly, an object of the present invention is to provide a soldering apparatus and method for inspecting a bump defect generated on an electrode pad of a substrate, and performing soldering by resupplying a solder ball to a defective electrode portion and repairing the solder ball. Further, an object of the present invention is to provide a repair soldering apparatus and method which are highly reliable as repair and soldering of a defective portion of a bump electrode after reflow in an extremely small solder bump. Further, an object of the present invention is to provide a soldering apparatus and method which are highly reliable in forming extremely fine solder bumps.
Means for solving the problems
In order to solve the above-mentioned problem, the bump forming apparatus of the present invention supplies solder balls to electrode pads formed on a substrate, and is characterized by comprising a plasma generating device (plasma irradiating means) and a laser generating device (laser irradiating means), wherein the plasma generating device (plasma irradiating means) irradiates plasma to the supplied solder balls to remove oxide films of the solder balls; the laser generating device (laser irradiation unit) irradiates a laser beam to the solder ball to melt the solder ball, removes an oxide film of the solder ball by the plasma irradiated from the plasma irradiation unit, and melts the solder ball by the laser irradiated from the laser irradiation unit to form a solder bump on the electrode pad.
In the bump forming method of the present invention, the solder balls are supplied to the electrode pads formed on the substrate, and after the solder balls are supplied to the electrode pads, the solder balls are irradiated with plasma and laser light to melt the solder balls and solder the solder balls to the electrode pads while removing the oxide films of the solder balls.
The solder ball repairing apparatus of the present invention is provided with a repairing dispenser for inspecting a state of a solder bump formed on an electrode pad of a substrate and supplying a solder ball to the electrode pad in which a defect is detected, and a plasma generating device for irradiating the solder ball supplied from the repairing dispenser with plasma to remove an oxide film of the solder ball; the laser generating device irradiates laser to the solder ball to melt the solder ball, removes the oxide film of the solder ball, melts the solder ball, and forms solder bump on the electrode pad.
In the solder ball repairing method of the present invention, the state of the solder bump formed on the electrode pad of the substrate is inspected in the solder ball inspection step, the solder ball is supplied to the electrode pad in which the defect is detected in the solder ball inspection step by the repair dispenser, and after the solder ball is supplied to the electrode pad in which the defect is detected by the repair dispenser, the solder ball is irradiated with plasma and laser light, and the solder ball is melted and soldered to the electrode pad while removing the oxide film of the solder ball.
ADVANTAGEOUS EFFECTS OF INVENTION
According to the present invention, it is possible to provide an apparatus for inspecting a bump defect generated on an electrode pad of a substrate, and performing solder ball resupply and repair to a defective electrode portion to perform soldering. Further, the repair soldering apparatus and method can be provided which are highly reliable as repair and soldering of defective portions of the bump electrodes after reflow in the extremely small solder bumps. Further, it is possible to provide a soldering apparatus and method which are highly reliable in forming extremely small solder bumps.
Other problems, structures, and effects than those described above will be apparent from the description of the embodiments.
Drawings
Fig. 1 is a schematic view showing a step of printing solder paste and mounting solder balls.
Fig. 2 is a schematic view illustrating steps from solder printing to solder ball inspection and repair.
Fig. 3 is a flowchart showing a process of forming a bump.
Fig. 4 is a side view showing the entire structure of the solder ball supply head.
Fig. 5 is a schematic view for explaining a printing operation performed by mounting solder balls.
Fig. 6 is a plan view showing an example of a state of the substrate after mounting solder balls and performing printing.
Fig. 7 is a schematic diagram showing a typical defect example after mounting solder balls and performing printing.
Fig. 8 is a schematic diagram illustrating a repair operation after printing of the mounted solder balls.
Fig. 9 is a plan view illustrating a schematic configuration of the inspection and repair device.
Fig. 10 is a side view showing the structure of the dispenser for repair.
Fig. 11 is an enlarged view illustrating an adsorption/separation operation of the solder ball at the tip end portion of the dispenser for repair.
Fig. 12 is an external view showing a plasma laser repair system as an embodiment of the present invention.
Fig. 13 is an explanatory view for explaining the plasma laser repair apparatus.
Fig. 14 is an explanatory view illustrating the plasma laser repair head.
Fig. 15 is a flowchart showing the plasma laser repair operation.
Fig. 16 is an explanatory view illustrating a plasma laser head of example 2.
Fig. 17 is an explanatory diagram for explaining the principle of the plasma laser head of embodiment 2.
Fig. 18 is an explanatory diagram illustrating the structure of the plasma laser head of example 2.
Fig. 19 is an explanatory diagram for explaining the pulse irradiation in example 2.
Detailed Description
[ MEANS FOR CARRYING OUT THE INVENTION ]
Preferred embodiments of the apparatus and method according to the embodiments of the present invention will be described below with reference to the accompanying drawings.
[ example 1 ]
Fig. 1 shows an outline of a solder printing process and a printing process for mounting solder balls.
As shown in fig. 1(a), first, a predetermined amount of flux 23 is transferred onto the electrode pads 22 of the substrate 21 by a screen printing method. In the present embodiment, a metal screen manufactured by an additive method is used as the screen 20 so that the pattern position accuracy with high accuracy can be secured. As the blade 3, any of a corner blade, a sword blade, and a flat blade may be used. First, conditions such as a screen gap, a printing pressure, and a squeegee speed are set in accordance with the viscosity and thixotropy of the flux 23. Then, printing of the solder is performed under the set conditions.
In the case where the amount of the printed flux 23 is small, there is a risk that the solder ball cannot be attached to the electrode pad 22 at the time of filling the solder ball. Moreover, the solder wetting failure at the time of reflow is a factor, and a bump having a beautiful shape cannot be formed, and the bump height failure and the solder connection strength are also factors.
On the other hand, if the amount of flux is too large, if the excessive flux adheres to the opening of the screen when the solder balls are mounted and printed, the solder balls adhere to the opening of the screen, and the solder balls cannot be transferred to the substrate. In this way, flux printing is a very important factor in order to maintain the quality of mounting solder balls.
Next, as shown in fig. 1(b), solder balls 24 are mounted on the electrode pads 22 of the substrate 21 on which the flux 23 is printed, and printing is performed. In this embodiment, solder balls having a diameter of about 30 μm are used. Further, as bump electrodes are miniaturized by miniaturization, high speed, and large capacity of semiconductor devices, solder balls have been miniaturized to a diameter of 25 μm to 30 μm. In mounting the solder balls 24, a metal screen manufactured by an additive method is used as the screen 20b to be used so that the pattern position accuracy with high accuracy can be secured.
As a material of the screen 20b, for example, a magnetic material such as nickel is used. This allows the screen 20b to be attracted by the magnet 10s provided on the stage 10 with a magnetic force, thereby making the gap between the substrate 21 and the screen 20b zero. Therefore, it is possible to prevent a problem that the solder balls 24 intrude between the substrate 21 and the screen 20b and the balls remain.
Further, a minute support column 20a made of resin or metal is provided on the rear surface of the screen 20 b. This constitutes an escape portion in the case where the flux 23 bleeds out. Therefore, when the substrate 21 on which the flux 23 is printed is in close contact with the screen 20b, the flux 23 can be prevented from seeping out and adhering to the opening of the screen.
At the corner 4 of the substrate 21, a positioning mark (not shown) is provided. The positioning marks on the substrate 21 and the positioning marks (not shown) on the screen 20b side are visually recognized by the camera 15f (see fig. 2), and alignment is performed with high accuracy. This allows the solder balls 24 to be supplied to the predetermined electrode pads 22 with high accuracy.
The slit-like body 63 shown on the screen 20b is one element constituting a filling means (see fig. 4) for supplying solder balls. The slit-shaped body 63 is swung by the filling means while moving in the direction of arrow 60V, and the solder ball 24 is pushed and rotated, and is continuously filled into the opening 20d of the screen 20 b.
Fig. 2 is a schematic diagram showing an example of steps from solder printing to solder ball inspection and repair.
The apparatus shown in fig. 2 is configured by integrating a flux printing unit 101, a solder ball mounting printing unit 103, and an inspection and repair unit 104. The respective parts are connected by a belt conveyor 25, and the substrate is conveyed by the belt conveyor 25. The flux printing portion 101 and the solder ball mounting printing portion 103 are provided with a work table 10f and a work table 10 b. The table 10f and the table 10b are moved up and down to transfer and receive the substrate. The tables 10f and 10b are configured to be movable in the horizontal direction (XY θ direction). The alignment of the screen 20, the screen 20b, and the substrate can be performed by imaging alignment marks (not shown) of the screen 20, the screen 20b, and the substrate by the cameras 15f and 15 b. The substrate having passed through the inspection and repair section 104 is sent to a reflow section, not shown, in the next step, and the solder balls carried thereon are melted by heating to solder the electrode pads and form bumps.
Fig. 3 is a flowchart of the bump forming process in this embodiment.
First, the substrate is carried into the flux printing portion (step 1). Then, a predetermined amount of solder is printed on the electrode pad (step 2). Next, the screen opening condition after solder printing is checked (step 3). If the inspection result is NG (failure), the screen is automatically cleaned by the under-plate cleaning device provided in the printing apparatus, and the replenishment flux is supplied as necessary. The NG-ready substrate waits on a conveyor in a subsequent step together with the NG signal so that the subsequent steps after the ball printing are not performed, and is discharged outside the production line. Or may be discharged in a collective packing manner by using an NG substrate stocker or the like in the production line. The NG substrate is cleaned in a process outside the production line and then reused for solder printing (step 4).
Solder ball mounting and printing are performed on the good substrates (step 5). If the printing is finished with the solder balls mounted thereon, the filling state of the solder balls in the screen openings is checked from above the screen before the off-plate process is performed (step 6). As a result, when there is a part with insufficient filling, the mounting solder ball is again carried out and the printing operation is carried out (step 7). This improves the filling rate of the solder balls.
If the result of the inspection in step 6 is good, the mounting state of the solder ball is inspected by the inspection and repair device (step 9) by performing the plate separation (step 8). If the mounting state of the solder ball is NG, the solder ball is supplied to the electrode pad portion of the defective portion again after the flux is supplied (step 10). When the mounting state is good, the solder ball is melted by a reflow apparatus (not shown) disposed in the next step (step 11), and the solder bump is completed.
Fig. 4 is a side view showing the entire structure of the solder ball supply head, and is a diagram showing the structure of the solder ball supply head (filling unit) for mounting solder balls on a substrate in a printing unit for mounting solder balls.
A solder ball supply head 60 having a ball case for accommodating the solder balls 24 in a space formed by the case 61, the cover 64, and the screen 62; and a slit-like body 63 disposed at an interval below the sieve-like body 62. The screen 62 is formed of an extremely thin metal plate having openings such as mesh openings or continuous rectangular slit portions so as to be suitable for the diameter of the solder ball 24 to be supplied. Slit-shaped body 63 is disposed below screen body 62, and slit-shaped body 63 is configured to be in surface contact with screen 20 b.
Further, the degree of contact and the gap of the slit-like body 63 with respect to the screen 20b can be finely adjusted by the print head elevating mechanism 4 provided above the cover 64. The slit-like body 63 is formed of an extremely thin metal plate made of a magnetic material. By using a magnetic material, the slit-shaped body 63 can be attracted with respect to the screen 20b formed of a magnetic material by a magnetic force from the stage 10 provided with a magnet. The slit-like body 63 has, for example, a mesh-like opening or a continuous rectangular slit portion so as to be suitable for the diameter of the solder ball 24 to be tested and the size of the opening 20d of the screen 20 b.
Further, the solder ball supply head 60 includes a horizontal vibration mechanism for horizontally vibrating the screen 62 provided in the ball housing. The horizontal vibration mechanism is configured by attaching the vibration applying unit 65 to a member formed in a parallel position with respect to the side surface of the ball housing, and providing a support member 70 to which the member is attached on the upper surface of the cover 64. According to this structure, the sieve 62 can be vibrated by applying vibration to the ball housing from the side surface side thereof by the vibration applying unit 65. By vibrating the sieve 62, the slit-like openings provided in the sieve 62 can be opened larger than the diameter of the solder balls 24. Thereby, the solder ball 24 stored in the ball case falls from the slit portion of the sieve 62 to the slit 63. The number of solder balls 24 dropped onto the slit-shaped bodies 63, that is, the supply amount of the solder balls 24, can be adjusted by controlling the applied vibration energy generated by the applied vibration unit 65.
The apply vibration assembly 65 can use an air rotary vibrator to control the frequency by fine tuning the compressed air pressure by digital control. Alternatively, the compressed air flow rate may be controlled to vary the frequency. The sieve 62 and the ball housing are vibrated by the vibration applying means 65 to the solder balls 24 housed in the ball housing, and attractive forces generated by van der waals forces acting between the solder balls 24 are cancelled and dispersed. Due to the dispersing effect, the solder ball supply amount can be prevented from varying due to the influence of the material of the solder balls 24, the temperature and humidity in the production environment. Therefore, adjustment in consideration of the production efficiency can be performed.
Further, a horizontal swing mechanism for swinging the ball housing in the horizontal direction is provided to the solder ball supply head 60. The horizontal swing mechanism is constructed as follows. A linear guide 67 is provided on the upper portion of the support member 70, and a filling head support member 71 provided with a linear rail is provided so that the linear guide 67 can move. A driving motor 68 is provided on the filling head support member 71, and an eccentric cam 66 is attached to a shaft of the driving motor 68. When the eccentric cam 66 rotates, the support member 70 moves (swings) in the horizontal direction. The filling head support member 71 is supported by the motor support member 2 and is configured not to move in the left-right direction with respect to the motor support member 2.
That is, the horizontal swing mechanism is configured to impart a swing motion in the horizontal direction to the slit-like body 63 by an arbitrary stroke amount by rotating the eccentric cam 66 by the drive motor 68. Since the slit-shaped bodies 63 are swung in a state of being attracted to the screen 20b by magnetic force, the solder balls 24 can be reliably rolled between the slit-shaped bodies 63 and the screen 20b without leaving a gap. Further, the size of the opening of the slit-shaped body 63 allows the solder balls 24 to be reliably replenished to the opening of the slit-shaped body 63, and the filling operation can be performed efficiently. The cycle speed of the screen 20b and the swing operation can be arbitrarily changed by controlling the speed of the driving motor 68, and the filling interval of the solder balls 24 can be set in consideration of the line balance. In addition, the filling rate can be controlled by adjusting the kind of material suitable for the solder balls 24, the opening of the screen 20b, and the circulation rate of the environmental conditions.
Further, a scraper body 69 is provided on the ball supply head 60. After the solder balls 24 are supplied onto the substrate 21 by the solder ball supply head 60, if the solder balls 24 remain on the layout of the screen 20b when the screen 20b is separated from the substrate 21, that is, when the solder balls are transferred onto the substrate by the separation, the solder balls 24 fall onto the substrate 21 through the openings 20d of the screen 20b, which causes the supply of excessive solder balls. Therefore, in the present embodiment, the scraper body 69 is provided at substantially the same height as the slit body 63 at a distance from the ball housing in the traveling direction of the ball supply head 60. The scraper body 69 has an extremely thin tip, is polished to a high flatness accuracy, and is brought into close contact with the screen 20b so that the solder balls 24 are not exposed to the outside of the solder ball supply head 60.
Further, since the scraper body 69 is made of a magnetic material and is in close contact with the screen 20b by magnetic force, similarly to the slit bodies 63, the solder balls 24 can be prevented from being exposed to the outside of the ball supply head 60. Further, the scraper 69 may be provided on the entire outer peripheral portion of the ball housing. The scraper 69 can reduce the ball residue on the surface of the screen 20b as much as possible.
However, the influence of the ball remaining due to the minute displacement of the layout of the screen 20b can be considered. Therefore, in the present embodiment, in order to further reduce the defects caused by the excess solder balls, the solder ball supply head 60 is provided with the air blowing mechanism 75 for forming an air curtain.
That is, the air blowing mechanism 75 is provided on the motor support member 2 supporting the print head elevating mechanism 4, and an air curtain is formed around the filling unit. The air blowing mechanism 75 is configured to supply compressed air from a compressed air supply source, not shown. If the blower mechanism 75 is used, the exposed solder balls are pushed by the compressed air to roll toward the moving direction of the solder ball supply head 60 when the solder ball supply head 60 moves toward the end face of the substrate. Therefore, the solder balls on the layout can be prevented from remaining.
Next, a printing operation performed by mounting solder balls on a substrate will be described.
Fig. 5 is a schematic view for explaining a printing operation performed by mounting solder balls. In the printing operation with solder balls mounted thereon, the solder ball supply head 60 and the sweeper 130 are mainly used.
First, as shown in (1), the ball supply head 60 vibrates the ball housing by the horizontal vibration mechanism while moving in the longitudinal direction of the substrate 21, and fills the opening of the screen 20b with solder balls. As shown in (2), the ball supply head 60 also reciprocates in the horizontal direction (the direction of arrow a) while reliably filling the opening with the solder balls by rolling, using the swing motion by the horizontal swing mechanism.
When the solder ball filling operation to the screen opening is completed, the solder ball supply head 60 rises as indicated by arrow B in (3). Then, the substrate 21 is moved in the longitudinal direction above the substrate as indicated by arrow C in (4), and if the substrate returns to the original position, the substrate is lowered to the position contacting the screen 20b as indicated by arrow D and stopped.
Next, a cleaning operation by the cleaner 130 will be described.
The sweeper 130 is configured to sweep together solder balls that are accidentally left on the screen after the above-described filling operation. At the bottom of the sweeper 130, as shown in fig. 5, a plurality of blades 131 are formed. The blade 131 is attached to the cleaner 130 at a predetermined angle in a direction opposite to the direction in which the cleaner operates (details are not shown). By moving the scraper 131 across the screen and stroking its surface, the solder balls on the screen can be swept together as a sweep.
When the filling operation by the solder ball supply head 60 is completed, the cleaner 130 moves in the horizontal direction indicated by the arrow E while being in contact with the screen 20b as shown in (5). That is, the plurality of blades 131 installed at the bottom of the sweeper 130 travel in a horizontal direction along the upper surface of the screen 20 b. At this time, the solder balls remaining on the screen 20b are swept together and fall into the empty opening portion of the screen 20 b. This eliminates the ball-free defect as shown in fig. 6 and 7 described later. Further, the solder balls on the screen 20b are all swept out, and finally, no solder balls remain on the screen 20 b.
The cleaner 130 moves up temporarily as indicated by an arrow F if it moves to the vicinity of the end of the screen 20b where the opening exists. Then, it returns in the longitudinal direction above the substrate 21 as indicated by an arrow G of (6), and again descends to a position contacting the screen 20b as indicated by an arrow H. Then, the same cleaning operation is repeated. This sweeping action is performed several times until the solder balls on the screen 20b are completely cleared. In addition, in some cases, as indicated by an arrow I in (7), the cleaning operation of a part limited on the screen 20b may be continuously performed while moving to another part.
Since all the empty openings can be filled with solder balls by the above cleaning operation, the no-ball defect can be eliminated. In addition, since the excess solder balls on the screen 20b are eventually swept out without remaining, when the screen 20b is separated from the substrate 21, the excess solder balls can be prevented from entering the openings of the screen 20 b. Therefore, the double-ball failure as shown in fig. 6 and 7 described later can be eliminated.
Fig. 6 shows an example of a state of filling solder balls on a substrate after mounting solder balls and performing printing.
When the substrate 21 is photographed by a camera, if the solder balls are filled in all the electrode portions, the state shown in (a) can be observed. (b) Indicating an incomplete filling of a part of the solder ball (no ball failure). (c) The state of double balls in which the solder balls are attracted to each other and the state in which the remaining solder balls are exposed from the electrode portion are shown.
Fig. 7 shows a typical defect example after mounting solder balls and printing. As shown in fig. 7, examples of the defective solder ball filling include a "no ball state" in which no solder ball is filled, a "double ball state" in which adjacent solder balls overlap each other, and a "ball position off state" in which the solder ball is off from the flux application position of the electrode portion.
In these states, if the substrate is made to flow to a subsequent process (reflow process), a defective product is produced. Therefore, by checking the filling state on the substrate and retrying the mounting and printing operations by the filling unit (solder ball supply head), defective products can be corrected to good products. In this detection, a determination can be made by pattern matching compared with a good product model. After the solder balls are mounted and printed, they are collectively recognized in units of area by a line sensor camera (not shown) mounted on the filling unit. If NG, the solder ball is mounted again for printing. If the substrate is qualified, the plate separating action is executed, and the substrate is discharged to the subsequent process.
Fig. 8 is a diagram illustrating a repair operation at the inspection and repair section after printing of the mounted solder balls.
In the inspection and repair section, first, after the solder balls are mounted and printed, the filling state on the substrate is checked by a CCD (Charge Coupled Device) camera. Then, if a defect is detected, the position coordinates of the defective portion are obtained. When a defect such as double ball, positional deviation of ball, excessive ball, etc. occurs, the vacuum suction nozzle 86 for suction as the dispenser for removal moves to the position of the defective solder ball 24x as shown in (1). Then, the defective solder balls 24x are vacuum-sucked and moved to a defective ball disposal station (not shown). In the defective ball disposal station, the vacuum is turned off, and the balls are dropped and discarded into a disposal cassette 83 (see fig. 9).
When it is detected that the electrode pad portion of the solder ball 24 is not supplied and the defective solder ball is removed by the vacuum suction nozzle 86, as shown in (2), the normal solder ball 24 stored in the solder ball storage portion 84 is sucked by a negative pressure using the repair dispenser 87. Then, as shown in (3), the repair dispenser 87 that has adsorbed the normal solder balls 24 moves from the solder ball storage 84 to the flux supply 85. As shown in (4), the repair dispenser 87, which has adsorbed the solder balls 24, is moved to the flux 23 stored in the flux supply unit 85, and the solder balls 24 are immersed in the flux 23 (or the flux 23 is attached to the solder balls 24), whereby the flux 23 is added to the solder balls 24. Then, as shown in (5), the dispenser for repair 87 having the solder balls 24 adsorbed thereon is moved to a defective portion on the substrate. Finally, as shown in (6), solder balls 24 are supplied to the defective portion. The repair work is completed by the above-described steps (1) to (6).
In the above-described steps, the removing dispenser can be used as a flux supplying dispenser, and a method of supplying flux to the defective portion can be performed even after the defective solder ball is removed. In this case, the step of adhering flux may not be performed when new solder balls are supplied.
In the inspection, when a defective ball such as a ball position deviation is removed, a defect can be repaired by supplementing a normal solder ball to a correct position in the repair work.
Fig. 9 is a diagram illustrating a schematic configuration of the inspection and repair apparatus, and is a plan view of the inspection and repair unit as 1 independent apparatus.
As shown in fig. 9, when the substrate 21 to be inspected is carried in from the carry-in conveyor 81, it is transferred to the inspection section conveyor 82 and conveyed in the direction of arrow J. A gate frame 80 is provided above the inspection section conveyor 82. The line sensor 79 is disposed in a direction perpendicular to the substrate conveying direction (the direction of arrow J) on the carry-in conveyor 81 side of the gate frame 80. The line sensor 79 thus detects the state of the solder balls 24 printed on the electrode pads 22 on the substrate 21. Here, although the line sensor 79 is provided as the state detector of the solder ball, a camera for imaging may be provided, and the defect may be detected by imaging the state of the solder ball while moving in the longitudinal direction of the gate frame 80.
On one leg side of the support gate frame 80, a solder ball storage portion 84 and a flux supply portion 85 are provided, in which normal solder balls are stored. Further, a disposal box 83 is provided on the other leg side. A vacuum suction nozzle 86 as a removing dispenser for sucking and removing defective solder balls and a repairing dispenser 87 for repairing defects on the substrate are provided on the gate frame 80 movably in the horizontal direction (arrow K direction) by a linear motor.
The inspection section conveyor 82 is configured to be capable of reciprocating in the direction of arrow J and in the opposite direction, and is configured to be capable of matching the defect position of the substrate 21 with the positions of the repair dispenser 87 and the vacuum suction nozzle 86. The substrate 21 having been inspected and repaired is carried out by the carrying-out conveyor 88 and sent to the reflow apparatus. With the above-described configuration, inspection and repair can be performed by the operation described in fig. 8.
Fig. 10 is a side view showing the structure of the dispenser for repair, and fig. 11 is an enlarged view for explaining the suction and separation operation of the solder balls at the tip end portion of the dispenser for repair.
As shown in fig. 10, the repair dispenser 87 is provided with, for example, a plastic suction nozzle 90 (the material is not limited to plastic) for holding and moving the solder balls. The adsorption nozzle 90 is tapered upward from a tip end 98. That is, the suction nozzle 90 has a shape in which the width gradually increases from the distal end 98 toward the proximal end 99. A through hole 92 is formed in the adsorption nozzle 90.
As shown in fig. 11, the through hole 92 is also tapered upward (although not to the extent of the shape of the adsorption nozzle 90). That is, the through-hole 92 is formed to be thicker toward the upper portion and thinner toward the lower portion. More specifically, the through hole 92 is formed such that the inner diameter of an opening end portion 92a provided at the lower end of the through hole 92 is substantially equal to the outer diameter of the mandrel 91 described later. Negative pressure is applied to the internal space of the through hole 92 by a negative pressure applying mechanism, not shown.
The suction nozzle 90 is fixed to a nozzle support frame 94 by bolts or the like. The nozzle support frame 94 is coupled to a drive unit 96. Therefore, the adsorption nozzle 90 can move freely in the vertical direction together with the driving unit 96.
The mandrel 91 is inserted and held in the through hole 92 in the adsorption nozzle 90 via a sealing member (not shown). The mandrel 91 is, for example, a metal rod having a cylindrical shape with a diameter of about 10 μm, and is made of a material having a high strength and not easily charged (however, the shape (diameter) and the material of the mandrel 91 are not limited to the above shape (diameter) and material, and are preferably smaller than the diameter of the solder ball 24). The outside diameter of the mandrel 91 is smaller than the inside diameter of the through hole 92 except for the opening end 92a of the through hole 92, and the mandrel 91 can freely move up and down in the axial direction of the adsorption nozzle 90. The upper end 91a of the mandrel 91 is fixed to the support member 93. The support member 93 is coupled to a motor 95 and is movable in the vertical direction together with the mandrel 91.
Since the support member 93 and the driving portion 96 are connected via the linear rail 97, the support member 93 and the driving portion 96 can move up and down independently. That is, the mandrel 91 attached to the support member 93 and the suction nozzle 90 connected to the driving unit 96 can be moved up and down independently of each other.
Thus, the support member 93, the nozzle support frame 94, the motor 95, the driving portion 96, the linear rail 97, and the like described above constitute a driving mechanism.
If the support member 93 is lowered or the adsorption nozzle 90 is raised, as shown in fig. 10(b), the lower end surface of the support member 93 and the upper end surface of the adsorption nozzle 90 come into contact with each other. In this contact state, the lower end 91b of the mandrel 911 protrudes downward from the tip 98 of the adsorption nozzle 90. In order to achieve the above function, the total length a of the mandrel 91 is configured to be longer than the total length B of the adsorption nozzle 90.
As shown enlarged in fig. 11, the tip portion 98 of the suction nozzle 90 is formed in a tapered groove shape to facilitate holding of the solder ball 24. By forming the tip end portion 98 of the suction nozzle 90 in the shape of a tapered groove, the solder ball 24 fits well into the tapered groove when the solder ball 24 is vacuum-sucked, and the solder ball 24 is less likely to be displaced from the tip end portion 98. Further, by forming the groove portion of the tip portion 98 into a spherical shape similar to the shape of the solder ball 24, it is possible to perform further excellent suction. However, the shape of the distal end portion 98 is not limited to the above shape.
Next, a description will be given of a defect repair operation of the solder balls by the repair dispenser configured as described above.
Initially, new solder balls 24 (about 30 μm in diameter) for repair are sucked by the suction nozzle 90 of the dispenser for repair 87. At this time, since the negative pressure is supplied into the suction nozzle 90 through the through hole 92, the solder ball 24 is vacuum-sucked to the tip portion 98 of the suction nozzle 90. Although not shown, a structure is provided in which a negative pressure is not leaked from the upper portion of the through hole 92 into which the mandrel 91 is inserted. At this time, as shown in fig. 10(a), the mandrel 91 is drawn inward (upward) from the tip end portion 98 of the adsorption nozzle 90.
In this suction state, the solder ball 24 is conveyed to above the electrode pad 120 at the defective portion, and the repair dispenser 87 is lowered toward the electrode pad 120, so that the solder ball 24 is placed in the flux 121 on the electrode pad 120 as shown in fig. 11 (a).
Next, the motor 95 is driven to lower the mandrel 91 through the through hole 92 of the adsorption nozzle 90 until the lower end 91b of the mandrel 91 comes into contact with the solder ball 24. Thereby, as shown in fig. 11(b), the mandrel 91 presses the solder ball 24 against the electrode pad 120. Since the outside diameter of the mandrel 91 is substantially the same as the inside diameter of the opening end 92a of the through-hole 92 as described above, the mandrel 91 is in a state of closing the opening end 92a of the through-hole 92 during the movement of the mandrel 91. Therefore, the gap in the through-hole 92 is narrowed, and even if a negative pressure acts, the vacuum suction (negative pressure) force generated by the negative pressure is reduced, and the solder ball 24 is freely separated from the suction nozzle 90.
Therefore, according to the above configuration, it is not necessary to separately provide a vacuum pump valve for cutting off the negative pressure, and the cost can be reduced.
Next, as shown in fig. 10(b), in a state where the solder balls 24 are pressed against the electrode pads 120 by the mandrels 91, the suction nozzle 90 is raised and separated from the solder balls 24 as shown in fig. 11 (b).
Finally, the motor 95 is driven to lift the mandrel 91 up again to separate it from the solder ball 24. In this case, since the contact area between the mandrel 91 and the solder ball 24 is very small, even if static electricity is generated, the contact area is small enough to be ignored, and therefore, the mandrel 91 and the solder ball 24 can be smoothly separated without any problem.
As described above, in the solder ball inspection and repair apparatus according to the embodiment of the present invention (hereinafter, referred to as a solder ball repair apparatus in some cases), the vertically movable spindle 91 is provided in the repair dispenser 87, so that when the solder ball 24 is supplied to a defective portion, the suction nozzle 91 is pulled up and away from the solder ball 24 while the solder ball 224 is physically pressed against the electrode pad 120 by the spindle 91, whereby the solder ball can be reliably mounted on the electrode pad with high efficiency.
Further, since the above-described functions can be realized with a simple configuration without using an expensive device such as a laser beam irradiation device for mounting the solder ball, the manufacturing cost of the device can be reduced.
Next, a plasma laser repair system as an embodiment of the present invention is explained. Fig. 12 is an external view showing a plasma laser repair system as an embodiment of the present invention.
As the bump electrodes are miniaturized by the miniaturization, the high speed and the large capacity of the semiconductor device, for example, when defects in the solder bump electrodes are inspected and repaired by the inspection and repair unit 104 shown in fig. 2, there are cases where the solder ball filling failure as shown in fig. 7, for example, a "no ball state" where the solder balls are not filled, a "double ball state" where adjacent solder balls are overlapped with each other, and a "ball position off" where the solder balls are off from the flux application position of the electrode portion, may occur even after the reflow.
In these states, even if the number of defective solder ball filling is 1, the defective product is a defective product, and therefore, the filling state on the substrate is checked again (second time), and the defective product can be repaired to a good product by a plurality of test mounting operations by the filling unit (solder ball supply head). In this detection, a determination can be made by pattern matching compared with a good product model.
Therefore, the plasma laser repair system according to the present embodiment inspects the substrate having passed through the reflow apparatus again, supplies the solder balls again to the defective electrode portions where the bumps formed on the electrode pads of the substrate are defective, repairs again, and performs soldering. In such an extremely fine solder bump, the plasma laser repair system shown in the present embodiment is a repair soldering apparatus having high reliability for repairing and soldering a defective portion of a bump electrode after reflow.
The plasma laser repair system according to the present embodiment is provided in the post-process of the inspection and repair unit 104 shown in fig. 2 and the post-process of the reflow apparatus not shown. The plasma laser repair system is not limited to the post-process of the inspection and repair unit 104 and the post-process of the reflow apparatus shown in fig. 2, and may be provided as a single system. For convenience, a case where the plasma laser repair system is provided as a system unit so as to be separated from a production line or the like is referred to as a bump forming apparatus, and for convenience, a method of forming a bump by using the apparatus is referred to as a bump forming method. In the bump forming apparatus, solder balls are mounted on each of the plurality of electrode pads formed on the substrate, and the solder balls are reflowed to form bumps on the electrode pads.
In the present embodiment, a description will be given of a configuration of a step provided at a subsequent stage of the reflow portion in a step subsequent to the inspection and repair portion 104 shown in fig. 2. In this case, the plasma laser repair system may be installed on-line or off-line. That is, the substrate having the bump electrode where the defect portion is detected after reflow may be distributed to the plasma laser repair system on the production line, or the substrate having the bump electrode where the defect portion is detected after reflow may be stored and distributed to the plasma laser repair system off the production line. In this embodiment, the case of the off-line will be described.
In addition, when the plasma laser repair system is located at a step subsequent to the reflow portion in the post-step of the inspection and repair portion 104 shown in fig. 2, that is, in a production line, a substrate in which a defective portion is not detected may be controlled by the plasma laser repair system in a simple manner. In this case, a series of so-called manufacturing line structures of the device can be simplified.
A plasma laser repair system having a carrying-in stage (BF (LD)) for carrying in a substrate (substrate having a bump electrode for detecting a defective portion after reflow); an inspection and repair unit (IR) for performing inspection and repair work with respect to the reflowed substrate; a laser repair unit (LR) for bonding (soldering, welding) the repaired solder ball to the electrode pad; and a delivery stage (bf (uld)) for delivering the repaired substrate. The control unit (hereinafter, referred to as CON) or control module) is a control unit that controls all of the carry-in stage (bf (ld)), the inspection and repair unit (IR), the laser repair unit (LR), and the carry-out stage (bf (uld)) to a predetermined state.
The apparatus shown in fig. 2, that is, the flux printing unit 101, the solder ball mounting printing unit 103, and the inspection and repair unit 104 are also controlled by a series of control flows as shown in fig. 3, but the series of control flows and the CON may be configured as an integrated control apparatus (see fig. 12 of the configuration diagram of a series of systems) in which individual control apparatuses are connected by a dedicated communication means or the like and cooperate with each other. Of course, when the flux printing portion 101, the solder ball mounting printing portion 103, the inspection and repair portion 104, the not-shown reflow portion disposed in the next step, and the carry-in stage (bf (ld)), the inspection and repair unit (IR), the laser repair unit (LR), and the carry-out stage (bf (uld)) shown in fig. 12 are configured as a series of systems, all of them may be controlled by 1 control device.
The inspection and repair unit (IR) also has a function of a solder ball inspection apparatus for inspecting the state of a solder ball, such as the inspection and repair unit 104 shown in fig. 2, for example, and as a result of inspecting the mounting state of the solder ball, supplies flux to the solder ball when the inspection of the mounting state of the solder ball is NG (when a defect is detected), and then supplies the solder ball again to the electrode pad portion at the defective portion, for example, using a dispenser for repair as described in fig. 10.
As a basic example, the repair work is performed by the steps (1) to (6) shown in fig. 8. As a basic example of the device configuration, the device configurations shown in fig. 9 and 10 are also applied. In this case, the position data of the ball resupplied may be acquired, and the position data may be transmitted by a communication means dedicated to the inspection and repair unit (IR) or the laser repair unit (LR) to obtain cooperation.
Next, a plasma laser repair apparatus as a laser repair unit (LR) will be described with reference to fig. 13.
The plasma laser repair device has a plasma laser repair head 200; an alignment stage 216 on which the substrate 215 is disposed; and a stage moving axis 218 for moving the alignment stage 216 in the horizontal direction (XY θ direction). Further, the plasma laser repair head 200 can also be moved in the horizontal direction (XY θ direction). This makes it possible to irradiate the repaired solder ball (solder ball position) with plasma and laser in a pin-point-like gap (locally). In addition, although plasma emission and radiation can be expressed, in the present embodiment, these are included and are referred to as irradiation.
The plasma laser repair apparatus moves the alignment stage 216 in the horizontal direction (XY θ direction) based on the position data transmitted from the inspection and repair unit (IR). In addition, the plasma laser repair head 200 may also be moved based on this position data.
Further, in the embodiment, the case where the alignment stage 216 is moved in the horizontal direction (XY θ direction) is described, but the plasma laser repair head 200 may be configured to be movable in the X direction, the Y direction, and the θ direction, and the alignment stage 216 may be configured to be movable in the θ direction. Alternatively, the repair head may be configured to move in the X direction, the Y direction, and the θ direction relative to a stage on which the substrate 215 is mounted.
Next, the plasma laser repair head 200 will be described with reference to fig. 14.
The plasma laser repair head (also referred to as a bump forming device) 200 moves to the position of a repaired solder ball, preheats the solder ball in a dot shape with a needle-point gap, irradiates the solder ball with plasma, removes (redox) an oxide film (for example, a thickness of about several nm to several μm) of the solder ball, removes the oxide film (oxide film), and irradiates laser light (laser beam) to partially reflow the solder ball.
The plasma laser repair head 200 includes a laser unit (in some cases, referred to as a laser head or a laser generator (laser irradiation means)) 205 that irradiates a laser beam in a spot shape onto a solder ball and heats and melts the solder ball; a plasma unit (also referred to as a microplasma head or a plasma generating device (which means a plasma irradiating unit)) which irradiates plasma in a spot shape with respect to the solder ball; and a spot heater 210 for applying a preheating to a solder ball (a substrate on which the solder ball is disposed, an electrode pad (e.g., a copper pad)) in a spot shape. Further, at least a unit fixing plate 219 for fixing the laser unit 205 and the plasma unit is provided.
In the present embodiment, for example, the spot heater 210 using infrared rays or the like is used to apply the preheating in a spot shape, but a hot plate that heats the substrate 215 in advance to a predetermined temperature (for example, about 150 to 180 ℃) and performs the preheating may be used.
Alternatively, a defocused laser may be used instead of the spot heater 210 to preheat the periphery of the solder ball. The defocused laser is a structure that heats the periphery of the solder ball, and as the defocused laser, for example, an infrared laser can be used. Further, the focal point of the defocused laser light is preferably larger than the focal point of the laser light irradiated from the laser unit 205.
The laser beam emitted from the laser unit 205 is preferably emitted in a pulsed manner (15 to 25KHz, for example, microwave). By irradiating the solder ball with laser light in a pulse manner, the oxide film of the solder ball can be effectively removed. This is because the laser light is irradiated in pulses, and cracks can be effectively added to the oxide film formed on the surface of the solder ball by the impact thereof using the thermo-acoustic effect.
The plasma laser repair head 200 further includes an actuator 202 for moving the unit fixing plate 219 in the vertical direction (Z-axis direction); and a motor 201 that drives the motion actuator 202. Thereby, at least the laser unit 205 and the plasma unit can be moved in the vertical direction, and the irradiation direction of the laser beam and the irradiation direction of the plasma can be made to coincide with the solder balls to be mounted. The actuator 202 is fixed to the head frame 203.
The plasma unit has a plasma electrode 213 to which a high-frequency voltage for generating plasma is added; a plasma antenna 211 for generating an electric field by applying a high frequency voltage; a plasma capillary 212 for introducing a gas as a plasma discharge tube; and a plasma nozzle 214 that emits the generated plasma. This makes it possible to irradiate the plasma in a spot shape with respect to the solder ball. In the present embodiment, the plasma electrode 213, the plasma antenna 211, the plasma capillary 212, and the plasma nozzle 214 are arranged linearly. The arrangement is arbitrary, and is not limited as long as the plasma can be irradiated in a spot shape with respect to the solder ball.
In addition, a dielectric gas is used to generate plasma, and in the present embodiment, a mixed gas of 97 to 97.5% by weight of argon and 3 to 2.5% by weight of hydrogen is used as a gas to be used as the plasma. The kind and mixing ratio of these gases are arbitrary, and the kind and mixing ratio of the gases may be appropriately selected depending on the device configuration or the electrode pads or solder balls to be irradiated. This gas is introduced from the plasma electrode 213 side to the plasma capillary 212. Preferably, the plasma unit irradiates plasma containing argon gas to the electrode pad and/or the solder ball. The medium gas is preferably argon gas containing 1 to 4% by weight of hydrogen component.
In this case, hydrogen is activated and freed, and the oxide film formed on the surface of the solder ball is removed. The oxygen in the oxide film is bonded to the hydrogen to remove the oxide film as water vapor.
In addition, the laser unit 205 has an observation camera 206 that observes the state of the solder ball; a laser light guide port 207 through which laser light is guided; a collimator lens 208 for performing aberration correction to obtain parallel light of the laser beam; and a condensing lens 209 for condensing the parallel laser beam. In the present embodiment, the observation camera 206 and the condenser lens 209 are arranged linearly and perpendicularly to the linear axes of the laser light guide port 207 and the collimator lens 208, and the observation camera 206 and the condenser lens 209.
That is, the observation camera 206 linearly observes the solder ball, and the laser beam is refracted by 90 ° and irradiated to the solder ball. Thereby, the laser beam can be irradiated in a spot shape with respect to the solder ball. In addition, this device structure is an example, and these arrangement structures are not limited. In addition, the observation camera 206 is not necessarily required as a device configuration.
Further, the linear axis of the plasma unit, the linear axis of the laser unit 205, and the axis of the spot heater 210 are preferably concentrated on 1 spot so as to face 1 solder ball. That is, the plasma unit and the laser unit 205 are arranged so that the intersection (focal point) of the plasma irradiation axis of the plasma unit (the linear axis of the plasma unit) and the laser irradiation axis of the laser unit 205 (the linear axis of the laser unit 205) is at the position substantially at the center of the solder ball, and the arrangement position of the substrate is controlled so that the repaired solder ball is arranged at the intersection. Of course, the control of the substrate arrangement position is relative, and the movement of the plasma torch may be controlled so that it becomes a predetermined position.
The angle formed by the laser irradiation axis of the laser unit 205 and the plasma irradiation axis of the plasma unit is not particularly limited as long as the laser and the plasma can be irradiated to the repaired solder ball, and it is preferably adjusted within approximately 0 to 180 degrees, although it depends on the device structure and the state of the repaired solder ball. That is, in the case where the angle is 0 degrees, the laser irradiation axis and the plasma irradiation axis are in the same direction, meaning, for example, that the laser and the plasma are irradiated toward the solder ball from above, and in the case where the angle is 180 degrees, meaning that the laser irradiation axis and the plasma irradiation axis are opposite, meaning, for example, that the laser and the plasma are irradiated from the left and right directions, respectively, with respect to the solder ball.
In the present embodiment, the linear axis of the plasma unit, the linear axis of the laser unit 205, and the axis of the spot heater 210 are arranged at predetermined angles with respect to the Z axis, and are arranged at angles of 90 °. That is, the plasma unit or the laser unit 205 irradiates plasma or laser light substantially at the center of the solder ball supplied to the electrode pad.
The plasma unit or the laser unit 205 preferably irradiates plasma or laser light to a substantially half portion of a solder ball supplied to the electrode pad. That is, it is preferable to irradiate plasma or laser light from above the solder ball.
The linear axis of the plasma unit, the linear axis of the laser unit 205, and the axis of the spot heater 210 are not necessarily arranged at a predetermined angle with respect to the Z axis, and for example, the linear axis of the laser unit 205 may be parallel to the Z axis (coaxial with the Z axis), and the linear axis of the plasma unit and the axis of the spot heater 210 may be arranged at a predetermined angle. Further, the linear axis of the plasma cell and the axis of the spot heater 210 may be parallel to the Z axis. The axis of the laser unit 205 and the axis of the plasma unit may be parallel to each other, or these axes may be coaxial.
Further, the plasma laser repair head 200 may be provided with a substrate height displacement gauge 204 for measuring the height from the tip (substrate side) of the laser unit 205 to the substrate (GAP height), and an alignment camera 217 for observing a solder ball filling failure in the substrate. The substrate height displacement meter 204 and the alignment camera 217 may be fixed to the unit fixing plate 219, and the spot heater 210 may be fixed to the unit fixing plate 219.
This makes it possible to irradiate the substrate 215 provided on the alignment stage 216 and the solder balls disposed on the substrate 215 with laser light in a spot shape, irradiate plasma in a spot shape, and apply preheating in a spot shape.
Further, by applying the preheating in a dot shape by using the dot heater 210, it is not necessary to preheat the entire substrate, and thermal damage to the substrate can be suppressed. Further, by irradiating the laser beam in a spot shape using the laser unit 205, it is not necessary to reflow the entire substrate, and thermal damage to the substrate and the sound solder balls can be suppressed.
That is, the present embodiment is a solder ball repair apparatus and a bump forming apparatus including a laser unit 205 for irradiating a solder ball with laser light, and a plasma unit for irradiating a solder ball with plasma, and is configured to irradiate a specific solder ball with plasma and laser light or to irradiate plasma and laser light simultaneously. Here, "and" or "simultaneous" irradiation means that irradiation times overlap each other including a case where plasma is irradiated temporally first with respect to laser irradiation.
That is, the oxide film of the solder ball is removed by plasma irradiation and then laser light is irradiated, and in this case, since the solder ball is activated by plasma, the oxide film is formed on the ball by the time difference in the process until laser light irradiation, but the generation of the oxide film with respect to such a solder ball can be suppressed by plasma irradiation or simultaneous laser light irradiation. Therefore, the removal process of the oxide film of the solder ball does not necessarily need to be performed in an inert gas atmosphere by filling the processing chamber with an inert gas or other inert gas. In the present embodiment, the environment in which the plasma laser repair apparatus is disposed is an atmospheric environment. Further, the present embodiment is not an embodiment that prevents a case where the plasma laser repair apparatus is covered and the inside of the covering is made an inert atmosphere.
Further, the plasma laser repair system is controlled by a control unit (CON) in such a manner that plasma from a plasma unit irradiated to the solder ball and laser from a laser unit irradiated to the solder ball are simultaneously irradiated. Further, the CON is controlled so that the solder balls are irradiated with plasma before the solder balls supplied from the dispenser for repair are irradiated with laser light. In addition, this CON is controlled in such a manner that the solder balls are preheated by the dot heater 210 that preheats the solder balls before the plasma irradiation and the laser are irradiated.
In addition, CON is also a control unit that controls irradiation of plasma by the plasma unit and irradiation of laser light by the laser unit in bump formation, and controls in such a manner as to ensure a period of time (existence period) during which irradiation of plasma by the plasma unit and irradiation of laser light by the laser unit are simultaneously irradiated. In addition, the CON controls the irradiation of the plasma by the plasma unit before the irradiation of the laser by the laser unit in the bump formation. Further, the CON also performs control to preheat the solder balls and the peripheries of the solder balls before plasma irradiation and laser irradiation in the bump formation.
Fig. 15 is a flowchart showing the plasma laser repair operation. The CON controls the various parts appropriately along the flow chart of this action.
First, the substrate 215 is carried into a carrying-in stage of the plasma laser repair apparatus (step 1). The position data is then received from the inspection and repair unit (IR) (step 2). Then, the substrate 215 is placed on the alignment stage 216 (step 3). Based on the received position data, for example, the alignment stage 216 is moved to place the substrate 215 at a predetermined position (step 4).
Then, if the arrangement is completed, the motor 201 is driven to move the actuator 202 in the downward direction (Z-axis direction) so that the tip of the laser unit 205 becomes the set GAP height (step 5). The GAP height is confirmed by the substrate height displacement meter 204 (step 6). In the case where there is no problem with the GAP height (good case), the next step is performed. When there is a problem with the GAP height, the actuator 202 is moved downward so that the tip of the laser unit 205 becomes the set GAP height (GAP height), and the substrate height displacement meter 204 checks the GAP height again.
When the substrate height displacement meter 204 confirms that there is no problem with the GAP height, the dot heater 210 applies preheating to the solder balls (the substrate 215 on which the solder balls are disposed, the electrode pads) in a dot shape, for example, up to about 150 to 180 ℃ (step 7). Then, it is checked whether the temperature of the solder balls (the substrate 215 on which the solder balls are disposed, the electrode pads), particularly the temperature of the substrate 215 reaches a set temperature, for example, by a thermometer (not shown) (step 8). When the temperature reaches the set temperature, the process proceeds to the next step. When the temperature does not reach the set temperature, the spot heater 210 continues to warm up. Alternatively, the output of the spot heater 210 is increased to promote the temperature rise. Then, it is confirmed again whether or not this temperature has reached the set temperature.
When the substrate height displacement meter 204 confirms that there is no problem with the GAP height, plasma is irradiated from the plasma unit in a spot shape with respect to the solder ball (step 9). Then, for example, it is confirmed by the observation camera 206 whether or not the solder balls and/or the electrode pads are redox (the oxide film formed on the surfaces of the solder balls is removed).
In this case, if the oxide film formed on the surface of the solder ball is removed, the solder ball can be seen to have a purple gloss. Therefore, removal of the oxide film was also confirmed. When the oxidation-reduction is completed, the process proceeds to the next step. When the oxidation and reduction are not completed, the plasma is continuously irradiated. Then, it was confirmed again whether or not the oxidation-reduction was completed. Here, the case where the oxide film of the electrode pad is removed and then the oxide film of the solder ball is removed is also included. In addition, when the observation camera 206 is not provided, the time for completion of oxidation-reduction may be set in advance, and the process may proceed to the next step based on the set time.
After confirming that the temperature of the substrate 215 reaches the set temperature and that the solder balls are redox-reduced, the laser unit 205 irradiates the solder balls with laser light to raise the temperature of the solder balls to, for example, about 250 ℃ for about 2 seconds, thereby melting the solder balls and adhering the solder balls to the electrode pads (soldering, welding) (step 11). Thus, the bad filling of the solder ball can be eliminated.
Thereafter, the substrate 215 which has not been repaired to have the solder ball filled therein is carried out from the carry-out stage (step 12).
In this way, the plasma irradiation timing of the plasma unit for irradiating the plasma to the solder ball is preferably earlier than the laser irradiation timing of the laser unit 205 for irradiating the laser to the solder ball, and the plasma is preferably continuously irradiated during the laser irradiation. That is, there is preferably a period of irradiating plasma and irradiating laser or irradiating plasma and laser at the same time. The timing of preheating the spot heater 210 with respect to the solder balls is preferably earlier than the laser irradiation timing of the laser unit 205 with respect to the solder balls, and the preheating is preferably continued during the laser irradiation.
That is, the plasma is irradiated to the solder ball and the laser is irradiated to the solder ball at the same time or simultaneously, the oxide film of the solder ball is removed, the solder ball is melted, and the solder ball is soldered to the electrode pad. Alternatively, or in addition, the solder ball may be preheated, plasma may be irradiated to the solder ball, laser may be irradiated to the solder ball to remove the oxide film of the solder ball, and the solder ball may be melted to be soldered to the electrode pad. That is, and at the same time, means having overlapping time periods.
Alternatively, the electrode pad may be irradiated with plasma to remove the oxide film of the electrode pad before the solder ball is provided, the solder ball may be provided, the plasma may be irradiated to the solder ball to remove the oxide film of the solder ball, and the laser may be irradiated to the solder ball to melt the solder ball and solder the solder ball to the electrode pad.
As described above, the solder ball repairing method or the bump forming method described in the present embodiment is a method of inspecting the state of the solder bumps formed on the electrode pads of the substrate 215 in the solder ball inspection step, and supplying the solder balls to the electrode pads having defects detected in the solder ball inspection step by the repair dispenser.
In the solder ball repairing method or the bump forming method, after the solder ball is supplied from the repair dispenser to the electrode pad in which the defect is detected, the solder ball is irradiated with plasma and laser light to remove the oxide film of the solder ball and melt the solder ball, thereby soldering the solder ball to the electrode pad. In the solder ball repairing method or bump forming method, the repair dispenser irradiates plasma to the electrode pad where the defect is detected to remove the oxide film of the electrode pad, and then supplies the solder ball to the electrode pad, and irradiates plasma and laser to the solder ball to melt the solder ball while removing the oxide film of the solder ball, thereby bonding (soldering, welding) the solder ball to the electrode pad.
In the bump forming apparatus or the bump forming method, it is also conceivable to supply the solder balls 24 onto the electrode pads 22 formed on the substrate 21.
Thus, a bump defect generated on the electrode pad of the substrate can be inspected, and the solder ball can be supplied again to the defective electrode portion for repair and soldering. In addition, in the extremely small solder bump, repair soldering with high reliability can be performed as repair and soldering to a defective portion of the bump electrode after reflow.
As described above, the solder ball repairing apparatus or the bump forming apparatus according to the present embodiment is a solder ball repairing apparatus or a bump forming apparatus targeting the solder balls on the electrode pads 22 of the substrate 215, and includes a repair dispenser for inspecting the state of the solder bumps formed on the electrode pads 22 of the substrate 215 and supplying the solder balls to the electrode pads where the defect is detected.
The solder ball repair apparatus or bump forming apparatus includes a plasma unit (plasma generating device) for irradiating the solder balls supplied from the repair dispenser with plasma to remove the oxide films of the solder balls; and a laser unit (laser generating means) 205 for irradiating laser to the solder ball and melting the solder ball, removing the oxide film of the solder ball and, at the same time or simultaneously, melting the solder ball to form a solder bump on the electrode pad (soldering the solder ball to the electrode pad).
The solder ball repairing apparatus or the bump forming apparatus includes a plasma unit (plasma generating device) for irradiating plasma to the electrode pad where the defect is detected to remove the oxide film, and irradiating plasma to the solder ball supplied from the repairing dispenser to remove the oxide film of the solder ball; and a laser unit (laser generating device) 205 for irradiating the solder ball with laser to melt the solder ball, removing the oxide film of the electrode pad in which the defect is detected, removing the oxide film of the solder ball, and simultaneously or simultaneously melting the solder ball, thereby soldering the solder ball to the electrode pad (forming solder bump on the electrode pad).
In addition, the laser unit 205 preferably irradiates laser light onto the upper portion of the solder ball supplied onto the electrode pad. The laser unit 205 preferably irradiates laser light substantially perpendicular to the surface of the solder ball supplied to the electrode pad. The laser unit 205 preferably irradiates laser light with a spot diameter suitable for the solder ball diameter, and the spot diameter is preferably substantially the same as or smaller than the solder ball diameter.
The plasma unit preferably irradiates plasma to the electrode pad in a range wider than the diameter of the solder ball or the diameter of the electrode pad. This enables efficient removal of the oxide film.
In the above description, the removal of the oxide film of the solder ball by the plasma irradiation and the melting of the solder ball by the laser irradiation at the same time or the like means, of course, that the plasma irradiation and the laser irradiation are performed at the same time over the same period of time, and also means that at least the period of the simultaneous irradiation or at least the period of the simultaneous irradiation is provided. Therefore, the plasma irradiation may be performed before the laser irradiation, or the plasma irradiation may be stopped during the laser irradiation, or the reverse may be performed.
In addition, even if the plasma irradiation and the laser irradiation are switched at one instant or in a short time, as long as the removal of the oxide film by the plasma irradiation is a difference in a short time to the extent that there is no problem in the melting by the laser irradiation, it means that at least a period of the simultaneous irradiation or at least a period of the simultaneous irradiation is provided.
The plasma unit is preferably configured to irradiate the plasma with respect to the electrode pads and/or the solder balls at a plasma irradiation timing earlier than a laser irradiation timing of the laser unit 205 for irradiating the solder balls with the laser light, and the plasma is preferably continuously irradiated during the laser irradiation. That is, the plasma and the laser preferably have a period of simultaneous irradiation.
In particular, the surface of the solder ball irradiated with plasma is activated, and therefore, the solder ball is easily oxidized, and if the plasma irradiation is stopped, the solder ball is immediately oxidized. Therefore, it is important to irradiate the laser beam while irradiating the plasma.
As described above, in the solder ball repair apparatus according to the present embodiment, the solder balls and/or the electrode pads of the substrate 215 are irradiated with the laser while being irradiated with the plasma.
In addition, although the case where the spot heater 210 is provided in the solder ball repairing apparatus described in the present embodiment has been described, this is not always necessary depending on the kind of product, the material, and the like, and may be omitted, but if the spot heater 210 is provided and controlled as in the embodiment, the output of the laser light can be reduced.
According to the present embodiment, the damage of soldering the solder ball to the electrode pad is small, and the repair and soldering can be performed efficiently and reliably.
Further, according to the present embodiment, since only the portion where the defect occurs is irradiated with the laser beam and the plasma is irradiated, the time required for the brazing is short, and the repair can be completed with a simple line structure without using the collective reflow step, so that the manufacturing cost of the apparatus can be suppressed to a low level.
In addition, according to the present embodiment, since only the electrode pad portion where the defect is generated can be repaired by the laser and the plasma and the brazing can be performed, energy consumed for the re-brazing may be small, and a large amount of heat is not generated, so that it is possible to provide a system which is energy-saving and environmentally friendly.
In addition, according to the present embodiment, since only the portion where the defect occurs is repaired by laser or plasma and the brazing can be performed, the re-brazing range is narrow, and the thermal history is not applied to the good product portion after the reflow brazing, and therefore, the repair and the brazing with high reliability can be performed.
[ example 2 ]
Next, a plasma laser head 300 according to example 2 will be described with reference to fig. 16. In the description of embodiment 2, the description will be made of a part different from embodiment 1.
The plasma laser repair head 300 moves to the solder ball position, applies preheating in a dot shape with a needle-dot gap with respect to the solder ball 24, irradiates plasma with respect to the solder ball 24 to remove the oxide film of the solder ball 24, and irradiates laser after removing the oxide film to locally reflow or form a bump.
The plasma laser repair head 300 includes a laser unit (laser generating device (meaning laser irradiation unit)) 305 for irradiating laser in a spot shape with respect to the solder ball 24 to heat and melt the solder ball; a plasma unit (plasma generating means (plasma irradiating means)) 306 for irradiating plasma in a spot shape with respect to the solder ball 24; and a spot heater 210 for applying a preheating in a spot shape with respect to the solder balls 34. Further, at least a unit fixing plate 219 for fixing the laser unit 305 and the plasma unit 306 is provided.
In example 2, the laser irradiation axis of the laser unit 305 and the plasma irradiation axis of the plasma unit 306 are coaxial in the vicinity of the solder ball 24, and plasma and laser are irradiated from above (directly above) the solder ball 24. The axis of the spot heater 210 is set so as to face the 1 solder ball 24 irradiated with the plasma or the laser. Thereby, the laser irradiation axis of the laser unit 305, the plasma irradiation axis of the plasma unit 306, and the axis of the spot heater 210 are concentrated on 1 solder ball 24.
Next, the principle of the plasma laser head 300 of embodiment 2 will be described with reference to fig. 17.
In example 2, the laser beam emitted from the laser unit 305 is introduced in the horizontal direction, reflected in the vertical direction by the half mirror 309, and emitted toward the solder ball 24 from above the solder ball 24.
In example 2, the plasma irradiated from the plasma unit 306 is also irradiated from above the solder ball 24 toward the solder ball 24.
The plasma unit 306 is a unit that generates high-density plasma by using hollow cathode discharge, and has a plasma electrode 313 to which a high-frequency voltage for generating plasma is added. Further, a high frequency voltage for generating plasma is supplied from an electrode power supply 314 for supplying a high frequency voltage to the plasma electrode 313, and a gas to be used as plasma is supplied from a gas supply portion 315, so that plasma is generated in the plasma generation region. In particular, in example 2, the gas was supplied from the horizontal direction so as to be in the same direction as the introduction direction of the laser light. That is, the introduction direction of the laser light and the supply direction of the gas are the same. This makes it possible to make the plasma laser head 300 compact.
In example 2, the laser beam penetrates the plasma generation region, and the plasma and the laser beam are simultaneously irradiated to the solder balls 24. This enables plasma and laser light to be efficiently irradiated to the solder balls 24 at the same time.
Further, by making the laser irradiation axis of the laser unit 305 and the plasma irradiation axis of the plasma unit 306 coaxial, it is not necessary to align the laser irradiation axis of the laser unit 305 and the plasma irradiation axis of the plasma unit 306, and plasma and laser can be efficiently irradiated to the solder balls 24.
In example 2, for example, an observation camera 206 such as a microscope is also provided. The observation camera 206 observes the state of the solder ball 24 from above (directly above) through the half mirror 309. However, the observation camera 206 is not necessarily required as the device configuration.
In the case where the observation camera 206 is not provided, the laser unit 305 may be provided above (directly above) the solder ball 24 without providing the half mirror 309, and the laser beam may be directly irradiated to the solder ball 24 2.
In example 2, the spot heater 210 that applies the preheating to the solder balls 34 in a spot shape is also used, but instead of the spot heater 210, the preheating may be applied to the periphery of the solder balls by using a defocused laser.
In particular, when the observation camera 206 is not provided, the defocused laser beam may be irradiated from above (directly above) the solder ball 24 to the solder ball 24 through the half mirror 309. That is, the irradiation axis of the defocused laser beam is coaxial with the laser irradiation axis of the laser unit 305 and the plasma irradiation axis of the plasma unit 306 in the vicinity of the solder ball 24. This can effectively preheat the periphery of the solder ball 24.
Next, the structure of the plasma laser head 300, particularly the structure of the plasma cell 306, of example 2 will be described with reference to fig. 18.
The plasma unit 306 for irradiating plasma in a dot shape with respect to the solder ball 24 is a plasma unit for generating high-density plasma by using hollow cathode discharge.
In fig. 18, the member 330 is a guide passage structural member constituting a gas guide passage, and is formed in a substantially cylindrical shape. The member 330 is provided with a gas guide path 331 linearly penetrating in the axial direction by appropriate drilling or the like.
The gas guide path 331 has a wide upper end opening and a narrow lower end opening in a nozzle shape. A gas supply port 332 is provided through the side of the gas guide path 331, and the gas supply portion 315 supplies a gas to be a plasma to the gas guide path 331.
A member 320 is provided at one end of the opening of the gas guide path 331 so as to close the opening. The member 320 is not particularly limited as long as it closes one end of the gas guide path 331 and transmits laser light as described below, but generally quartz glass (hereinafter, the member 320 is referred to as a quartz glass plate) is used.
The quartz glass plate 320 is screwed to the member 330 with the lid 316 opened at the center thereof above the member 330 with the O-ring 321 interposed therebetween. Thereby, the quartz glass plate 320 is pressed toward the O-ring 321, and one end of the gas guide path 331 is sealed. (the method is not particularly limited to the screw bonding method as long as the quartz glass plate 320 is sealed).
With this configuration, the gas introduced from the gas supply portion 315 through the gas introduction portion 317 and the gas supply port 332 is guided by the gas guide path 331 and is irradiated downward from a nozzle formed at the lower end of the gas guide path 331.
A quartz glass plate 322 is also provided at the lower end of the gas guide path 331 which opens in a nozzle shape. With the same configuration as described above, the quartz glass plate 322 disposed at the lower end is pressed toward the O-ring 323 by the O-ring 323 and the lid 324, and one end of the gas guide path 331 (except for the first hole portion described below) is sealed.
The quartz glass plate 322 at the lower portion is formed with a first hole portion having a diameter of about 0.5 to 0.8mm, similarly to the nozzle tip which is formed at the lower end of the gas guide path 331 and is open in a nozzle shape. Further, second holes are also formed in the plasma electrode 313 provided on the upper and lower surfaces of the lower quartz glass plate 322. The second hole has a diameter larger than or substantially equal to the diameter of the first hole.
Plasma is generated around the plasma electrode 313 (in the vicinity of the second hole) by supplying a high-voltage and high-frequency voltage from the electrode power supply 314 to the plasma electrode 313, and this becomes a plasma generation region 318. The generated plasma is irradiated from the opening formed in the lower portion of the lid 324 toward the solder ball 24 located below.
This irradiation energy is adjusted by the supply pressure of the gas from the gas supply portion 315. The supply pressure of the gas from the gas supply portion 315 is an appropriate pressure at which the solder balls 24 mounted on the substrate are not scattered by the gas pressure or do not move (shift) from the predetermined electrodes.
The diameter of the opening in the lower portion of the lid 324 is preferably substantially the same as or larger than the diameter of the first hole.
The laser beam emitted from the laser unit 305 is introduced in the horizontal direction, reflected in the vertical direction by the half mirror 309, passes through the upper opening of the lid 316, passes through the upper quartz glass plate 320 on the mounting member 330, passes through the gas guide path 331, passes through the first hole, the second hole, and the lower opening of the lid 324, and is emitted from above the solder ball 24 toward the solder ball 24.
Further, as in example 1, the gas (medium gas) is preferably argon gas containing 1 to 4% by weight of hydrogen component. In this case, the gas is excited by the plasma electrode 313 as a high-frequency power source (for example, 5kV, 50Hz), and the gas is excited and turned into plasma.
Thereby, the laser irradiation axis of the laser unit 305 and the plasma irradiation axis of the plasma unit 306 are coaxial in the vicinity of the solder ball 24, and the laser penetrates the plasma generation region 318, and the plasma and the laser are simultaneously irradiated to the solder ball 24. This enables plasma and laser light to be efficiently irradiated to the solder balls 24 at the same time.
In example 2, a hollow cathode discharge was used and a plasma generation method of generating high-density plasma was used, but the plasma generation method is not limited to this, and for example, a gas may be excited by a high-frequency coil.
In example 2, the hollow cathode discharge was used, and the plasma electrode was provided on the gas outlet side of the gas guide path 331 to generate plasma, but the position of the plasma electrode is not limited to the gas outlet side of the example, and may be provided on any part of the gas flow path.
As described above, if the structure is as in example 2, the bump forming apparatus is obtained which has the gas supply port 332 for supplying the gas for generating plasma on the side where one end is closed by the light transmitting member (for example, the quartz glass plate 320) for transmitting the laser beam, and which is provided with the gas guide path 331 linearly formed so as to introduce the gas supplied from the gas supply port 332 to the solder ball mounted on the substrate; a plasma generating means (for example, a plasma electrode 313) for surrounding a part of the flow path from the gas guide path 331 to the solder ball and converting the gas into plasma by applying a high-voltage and high-frequency power to the gas; and a laser generating means (for example, a laser unit 305) for irradiating the solder ball with the generated laser beam through the light transmitting member and through the gas flow path and the center portion of the plasma generating region, wherein the oxide film of the solder ball is removed by the plasma, and the solder ball is melted by the laser beam to form a bump.
Next, pulse irradiation with the laser applied in example 2 will be described with reference to fig. 19.
The laser beam emitted from the laser unit 305 is preferably emitted in a pulsed manner (15 to 25 kHz). By irradiating the solder ball 24 with laser light in a pulsed manner, the oxide film of the solder ball can be effectively removed. This is because the laser light is irradiated in pulses, and cracks can be effectively added to the oxide film formed on the surface of the solder ball by the impact of the thermal acoustic effect.
As described above, according to example 2, since soldering can be performed by laser and plasma, the soldering range is narrow, and soldering with high reliability can be performed in the formation of extremely fine solder bumps.
As described above, in the present example, the bump forming apparatus, the bump forming method, the solder ball repairing apparatus, and the solder ball repairing method have been described based on the preferred embodiments, but the present invention is not limited to the above examples. That is, the present invention can be implemented in various modifications and various embodiments without departing from the spirit and the main features thereof.
Description of the symbols
1: a printing apparatus, 2: a printing head, 3: a doctor blade, 4: a motor, 10: a printing table, 15: a camera, 20b: a screen, 20d: an opening portion, 21: a substrate, 22: an electrode pad, 23: a flux, 24: a solder ball, 60: a solder ball supply head, 87: a dispenser for repair, 90: an adsorption nozzle, 91: a mandrel, 91a: an upper end portion, 91b: a lower end portion, 92: a through hole, 92a open end portion, 93: a support member, 94: a nozzle support frame, 95: a motor, 96: a driving portion, 97: a linear rail, 98: a front end portion, 99: a base end portion, 120: an electrode pad, 121: a flux, 130: a cleaner, 131: a doctor blade, 200: a plasma laser repair head, 201: a motor, 202: an action actuator, 203: a head frame, 204: a substrate height displacement meter, 205: a laser unit, 206: an observation camera, 207: a laser guide port, 208: a collimating lens, 209: a condensing lens, 210: a point heater, 211: a plasma antenna, 212: a plasma capillary, 213: a plasma electrode, 214: a plasma nozzle, 215: a substrate, 216: an alignment stage, 217: an alignment camera, 218: a stage moving axis, 219: a unit fixing plate, 300: a plasma laser head, 305: a laser unit, 306: a plasma unit, 309: a half mirror, 313: a plasma electrode, 314: an electrode power supply, 315: a gas supply portion, 316: a cover body, 317: a gas introduction portion, 318: a plasma generation region, 320: a member, a quartz glass plate, 321: an O-ring, 322: a quartz glass plate, 323: an O-ring, 324: a cover body, 330: a member, 331: a gas guide path, 332: a gas supply port.
Claims (35)
1. A bump forming apparatus for supplying solder balls to electrode pads formed on a substrate,
the apparatus comprises a plasma generating device and a laser generating device, wherein the plasma generating device irradiates plasma to the supplied solder ball to remove the oxide film of the solder ball; the laser generator irradiates laser to the solder ball to melt the solder ball,
the plasma is irradiated to the solder ball by the plasma generating device to remove an oxide film of the solder ball, and the laser beam is irradiated to the solder ball by the laser generating device to melt the solder ball, thereby forming a solder bump on the electrode pad.
2. The bump forming apparatus according to claim 1,
the plasma processing apparatus includes a control unit that controls irradiation of plasma by the plasma generation device and irradiation of laser light by the laser generation device, and the control unit controls the plasma generation device and the laser generation device so that there is a time period during which the plasma and the laser are simultaneously irradiated.
3. The bump forming apparatus according to claim 2,
the control unit controls the irradiation of the plasma by the plasma generation device prior to the irradiation of the laser by the laser generation device.
4. The bump forming apparatus according to claim 1,
an axis of plasma irradiation by the plasma generation device and an axis of laser irradiation by the laser generation device are coaxial.
5. The bump forming apparatus according to claim 1,
the solder ball and the periphery of the solder ball are preheated before the irradiation of the plasma to the solder ball and the irradiation of the laser to the solder ball.
6. The bump forming apparatus according to claim 5,
the preheating is performed by a spot heater which preheats the solder balls in a spot shape.
7. The bump forming apparatus according to claim 5,
the preheating is performed by defocused laser for preheating the periphery of the solder ball.
8. The bump forming apparatus according to claim 1,
the laser beam emitted from the laser generator is emitted to the solder ball in a pulse manner.
9. The bump forming apparatus according to claim 1,
the plasma generating device generates plasma by using hollow cathode discharge.
10. A bump forming apparatus for supplying solder balls to electrode pads formed on a substrate,
a plasma generating device for irradiating the electrode pad with plasma to remove the oxide film on the electrode pad; a plasma generator for supplying a solder ball to the electrode pad, and irradiating the supplied solder ball with the plasma to remove an oxide film of the solder ball; and a laser generator for irradiating laser to the solder ball to melt the solder ball,
the oxide film of the solder ball is removed and the solder ball is melted to form a solder bump on the electrode pad.
11. A bump forming method for supplying solder balls to electrode pads formed on a substrate,
after the solder ball is supplied to the electrode pad, the solder ball is irradiated with plasma and laser, and the solder ball is melted and soldered to the electrode pad while removing the oxide film of the solder ball.
12. A bump forming method for supplying solder balls to electrode pads formed on a substrate,
the method includes the steps of irradiating the electrode pad with plasma to remove an oxide film of the electrode pad, supplying a solder ball to the electrode pad, irradiating the solder ball with plasma and laser to remove an oxide film of the solder ball, and melting and soldering the solder ball to the electrode pad.
13. A solder ball repairing apparatus having a repairing dispenser for inspecting a state of a solder bump formed on an electrode pad of a substrate and supplying a solder ball to the electrode pad where a defect is detected,
a plasma generating device for irradiating the solder ball supplied from the repair dispenser with plasma to remove an oxide film of the solder ball; the laser generator irradiates laser to the solder ball to melt the solder ball,
the oxide film of the solder ball is removed and the solder ball is melted to form a solder bump on the electrode pad.
14. The solder ball repair apparatus of claim 13,
the plasma processing apparatus includes a control unit that controls the plasma generation device so that there is a time period during which the plasma and the laser are simultaneously irradiated.
15. The solder ball repair apparatus of claim 13 or 14,
the plasma irradiation is performed before the laser irradiation.
16. The solder ball repair apparatus of claim 13, 14 or 15,
before the repair dispenser supplies the solder balls to the electrode pads where the defects are detected, the oxide films of the electrode pads are removed by the plasma generation device.
17. A solder ball repair device having a repair dispenser for inspecting a state of a solder bump formed on an electrode pad of a substrate and supplying a solder ball to the electrode pad where a defect is detected,
a plasma generating device for removing an oxide film by irradiating plasma to the electrode pad on which the defect is detected, and removing the oxide film by irradiating plasma to the solder ball supplied from the dispenser for repair; the laser generator irradiates laser to the solder ball to melt the solder ball,
removing the oxide film of the electrode pad with the detected defect and removing the oxide film of the solder ball, and simultaneously melting the solder ball to solder the solder ball to the electrode pad.
18. The solder ball repair apparatus of claim 13 or 14,
the laser generator irradiates laser to the solder ball at a point substantially equal to the diameter of the solder ball.
19. The solder ball repair apparatus of claim 13 or 14,
the plasma generating device irradiates plasma to the approximate center of the solder ball supplied to the electrode pad.
20. The solder ball repair apparatus of claim 13 or 14,
the plasma generating device irradiates plasma to a substantially half portion of the solder ball supplied to the electrode pad.
21. The solder ball repair device of claim 13 or 14,
the laser generator irradiates laser light to the approximate center of the solder ball supplied to the electrode pad.
22. The solder ball repair apparatus of claim 13 or 14,
the laser generator irradiates a laser beam to a substantially half portion of the solder ball supplied to the electrode pad.
23. The solder ball repair apparatus of claim 13 or 14,
the plasma generating device irradiates plasma to the electrode pad in a range wider than the diameter of the solder ball or the diameter of the electrode pad.
24. The solder ball repair device of claim 13 or 14,
the plasma generating device generates plasma using a dielectric gas.
25. The solder ball repair apparatus of claim 24,
the medium gas is argon gas containing 1 to 4% by weight of hydrogen component.
26. The solder ball repair apparatus of claim 13 or 14,
the angle formed by the irradiation axis of the laser generator and the irradiation axis of the plasma generator is adjusted within 0 to 180 degrees.
27. A solder ball repairing apparatus having a repairing dispenser for inspecting a state of a solder bump formed on an electrode pad of a substrate and supplying a solder ball to the electrode pad where a defect is detected,
a plasma generating device for irradiating the solder ball supplied from the repair dispenser with plasma to remove an oxide film of the solder ball; the laser generator irradiates laser to the solder ball to melt the solder ball.
28. A solder ball repairing method for inspecting the state of a solder bump formed on an electrode pad of a substrate by a solder ball inspecting step and supplying a solder ball to the electrode pad having a defect detected by the solder ball inspecting step by a repairing dispenser,
after the repair dispenser supplies solder balls to the electrode pads where defects are detected, the solder balls are irradiated with plasma and laser light to remove oxide films of the solder balls and melt the solder balls for soldering to the electrode pads.
29. A method for repairing solder balls, which comprises inspecting the state of solder bumps formed on electrode pads of a substrate in a solder ball inspection step, and supplying the solder balls to the electrode pads with defects detected in the solder ball inspection step by a repair dispenser,
the repair dispenser irradiates plasma to the electrode pad on which the defect is detected to remove the oxide film of the electrode pad, and then supplies a solder ball to the electrode pad, and irradiates plasma and laser to the solder ball to bond the solder ball to the electrode pad.
30. The solder ball repair apparatus of claim 13,
an axis of plasma irradiation by the plasma generation device and an axis of laser irradiation by the laser generation device are coaxial.
31. The solder ball repair apparatus of claim 13,
the solder ball and the periphery of the solder ball are preheated before the irradiation of the plasma to the solder ball and the irradiation of the laser to the solder ball.
32. The solder ball repair apparatus of claim 31,
the preheating is performed by a spot heater which preheats the solder balls in a spot shape.
33. The solder ball repair apparatus of claim 31,
the preheating is performed by a defocused laser that preheats the periphery of the solder ball.
34. The solder ball repair apparatus of claim 31,
the laser beam emitted from the laser generator is emitted to the solder ball in a pulse manner.
35. The solder ball repair apparatus of claim 31,
the plasma generating device generates plasma by using hollow cathode discharge.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021011141A JP7107601B1 (en) | 2021-01-27 | 2021-01-27 | Bump forming apparatus, bump forming method, solder ball repair apparatus, and solder ball repair method |
| JP2021-011141 | 2021-01-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN114823396A true CN114823396A (en) | 2022-07-29 |
Family
ID=82527549
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210097119.XA Pending CN114823396A (en) | 2021-01-27 | 2022-01-26 | Bump forming apparatus, bump forming method, solder ball repairing apparatus and solder ball repairing method |
Country Status (4)
| Country | Link |
|---|---|
| JP (2) | JP7107601B1 (en) |
| KR (1) | KR20220108737A (en) |
| CN (1) | CN114823396A (en) |
| TW (1) | TWI818377B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115488074B (en) * | 2022-09-29 | 2023-11-03 | 西安微电子技术研究所 | Pretreatment method for bulb-to-bulb column implantation of tube shell package |
| CN115635155B (en) * | 2022-10-20 | 2023-05-05 | 安徽钜芯半导体科技有限公司 | Processing technology of heat sink conducting strip of power device |
Family Cites Families (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3779490B2 (en) | 1998-05-29 | 2006-05-31 | 株式会社ルネサステクノロジ | Bump formation method |
| US6742701B2 (en) * | 1998-09-17 | 2004-06-01 | Kabushiki Kaisha Tamura Seisakusho | Bump forming method, presoldering treatment method, soldering method, bump forming apparatus, presoldering treatment device and soldering apparatus |
| JP2000138260A (en) * | 1998-10-30 | 2000-05-16 | Sony Corp | Manufacture of semiconductor device |
| JP2002076043A (en) * | 2000-08-28 | 2002-03-15 | Mitsubishi Electric Corp | Bump forming method, semiconductor device, and bump forming device |
| JP3822834B2 (en) * | 2002-04-12 | 2006-09-20 | 新日本製鐵株式会社 | Repair method and apparatus |
| US6712260B1 (en) * | 2002-04-18 | 2004-03-30 | Taiwan Semiconductor Manufacturing Company | Bump reflow method by inert gas plasma |
| KR100521081B1 (en) * | 2002-10-12 | 2005-10-14 | 삼성전자주식회사 | Fabrication and installation method of flip chip |
| TWI274390B (en) * | 2005-08-31 | 2007-02-21 | Advanced Semiconductor Eng | Packaging substrate and manufacturing method thereof; chip package and packaging process thereof |
| JP2007287888A (en) * | 2006-04-14 | 2007-11-01 | Nippon Steel Materials Co Ltd | Bump forming method |
| US7823762B2 (en) | 2006-09-28 | 2010-11-02 | Ibiden Co., Ltd. | Manufacturing method and manufacturing apparatus of printed wiring board |
| JP2008235471A (en) * | 2007-03-19 | 2008-10-02 | Nippon Steel Materials Co Ltd | Method and apparatus for recovering poorly mounted solder ball, and bump forming method |
| JP5098434B2 (en) | 2007-05-21 | 2012-12-12 | 株式会社日立プラントテクノロジー | Solder ball printing device |
| JP5076922B2 (en) | 2008-01-25 | 2012-11-21 | 株式会社日立プラントテクノロジー | Solder ball printing device |
| JP4983737B2 (en) | 2008-06-30 | 2012-07-25 | 株式会社日立プラントテクノロジー | Solder ball inspection repair device and solder ball inspection repair method |
| JP2013038302A (en) * | 2011-08-10 | 2013-02-21 | Panasonic Corp | Semiconductor device |
| JP3173338U (en) | 2011-11-18 | 2012-02-02 | 株式会社イチーナ | Cool arm bag |
| JP5941814B2 (en) * | 2012-10-03 | 2016-06-29 | ファスフォードテクノロジ株式会社 | Die bonder apparatus and die bonding method |
| US9543263B2 (en) * | 2013-11-12 | 2017-01-10 | Taiwan Semiconductor Manufacturing Company Ltd. | Semiconductor packaging and manufacturing method thereof |
| JP2015103688A (en) | 2013-11-26 | 2015-06-04 | インターナショナル・ビジネス・マシーンズ・コーポレーションＩｎｔｅｒｎａｔｉｏｎａｌ Ｂｕｓｉｎｅｓｓ Ｍａｃｈｉｎｅｓ Ｃｏｒｐｏｒａｔｉｏｎ | Bonding method, semiconductor device, manufacturing system and oxide film removal device (chip bonding process using no-clean flux) |
-
2021
- 2021-01-27 JP JP2021011141A patent/JP7107601B1/en active Active
- 2021-12-08 TW TW110145825A patent/TWI818377B/en active
-
2022
- 2022-01-26 CN CN202210097119.XA patent/CN114823396A/en active Pending
- 2022-01-26 KR KR1020220011291A patent/KR20220108737A/en active IP Right Grant
- 2022-03-28 JP JP2022051062A patent/JP2022115105A/en active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| TW202230551A (en) | 2022-08-01 |
| TWI818377B (en) | 2023-10-11 |
| KR20220108737A (en) | 2022-08-03 |
| JP2022114729A (en) | 2022-08-08 |
| JP7107601B1 (en) | 2022-07-27 |
| JP2022115105A (en) | 2022-08-08 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP5098434B2 (en) | Solder ball printing device | |
| CN114823396A (en) | Bump forming apparatus, bump forming method, solder ball repairing apparatus and solder ball repairing method | |
| JP4983737B2 (en) | Solder ball inspection repair device and solder ball inspection repair method | |
| JP5076922B2 (en) | Solder ball printing device | |
| JP6448656B2 (en) | Substrate bonding method and substrate bonding apparatus | |
| JP2020068379A (en) | Component mounting system and component mounting method | |
| KR100268632B1 (en) | Method and apparatus for forming bump | |
| US6276599B1 (en) | Method and apparatus for forming solder bumps | |
| US6441339B1 (en) | Apparatus for manufacturing circuit modules | |
| TW201004520A (en) | A device and a method of scaling powder forming | |
| JP2010258132A (en) | Solder ball printing apparatus and solder ball printing method | |
| KR100910217B1 (en) | Probe bonding apparatus and method using the same | |
| JPH09298356A (en) | Method for forming bumps and its apparatus and electronic device formed thereby | |
| JP2024008161A (en) | Bump forming device, bump forming method, solder ball repair device, and solder ball repair method | |
| CN117038471A (en) | Bonding pad repairing method and repairing equipment | |
| JP2006234691A (en) | Repair method and repair device for integrated probe card | |
| KR101045673B1 (en) | Apparatus for formationing flux and method for formationing flux | |
| JP2000117213A (en) | Plasma washing method and device | |
| JP2003303854A (en) | Chip mounting method and apparatus using it | |
| CN113130346A (en) | Electronic component repairing device and method | |
| JP2003023026A (en) | Method and device for forming electrode | |
| JP2004228346A (en) | Device and method for mounting electronic component |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |