CN117038471A - Bonding pad repairing method and repairing equipment - Google Patents
Bonding pad repairing method and repairing equipment Download PDFInfo
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- CN117038471A CN117038471A CN202311087823.8A CN202311087823A CN117038471A CN 117038471 A CN117038471 A CN 117038471A CN 202311087823 A CN202311087823 A CN 202311087823A CN 117038471 A CN117038471 A CN 117038471A
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
- H01L21/485—Adaptation of interconnections, e.g. engineering charges, repair techniques
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y10/00—Processes of additive manufacturing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Ceramic Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
The application belongs to the technical field of semiconductor processing, and particularly relates to a bonding pad repairing method and repairing equipment, wherein the bonding pad repairing method comprises the following steps: s-1, positioning a pad to be repaired and positioning a defect part; s-2, printing a surrounding dam around the defect part, wherein the surrounding area of the surrounding dam comprises the defect part and a part of complete part; s-3, curing the dam; s-4, printing filling repair materials at the defect part; s-5, solidifying the repairing material; s-6, adopting etching solution to treat the area surrounded by the surrounding dam so that the protective layer on the surface of the bonding pad is removed; s-7, printing conductive paste in the surrounding area of the dam; s-8, sintering the conductive paste by laser to finish the repair of the bonding pad. The method uses etching solution to remove the protective layer, replaces the traditional physical removal method, improves the removal precision of the protective layer, is particularly suitable for removing an ultra-thin film layer, and removes the dependence on high-precision equipment.
Description
Technical Field
The application belongs to the technical field of semiconductor processing, and particularly relates to a bonding pad repairing method and repairing equipment.
Background
With the development of the display screen LED packaging field in the directions of higher packaging efficiency, better packaging structure, better packaging quality, smaller packaging size and the like, three novel packaging modes of MIP (Micro/Mini in package), COB (Chip on Board) and COG (Chip On Glass) are outstanding, and the three packaging modes have the common point that an LED chip or IC needs to be mounted on a substrate (Board or Glass) full of bonding pads, and in the mounting and repairing processes, the LED bonding pads and the IC bonding pads on the substrate are damaged due to various reasons.
At present, a method and equipment for repairing a bonding pad, such as a method for repairing a bonding pad and a line defect of a printed circuit board disclosed in CN114126284a, comprises the following steps: s1, detecting a bonding pad of a printed circuit board and a circuit defect part; s2, etching the bonding pad of the printed circuit board and the circuit defect part by adopting laser processing equipment; s3, setting a first direct writing parameter of micro-direct writing, and distributing conductive electronic paste to the bonding pad of the printed circuit board and the circuit defect part etched by the laser processing equipment according to the first direct writing parameter; s4, adopting a high-temperature annealing curing mode or a laser sintering curing mode to enable the conductive electronic paste to have conductivity, and finishing repair of the defect bonding pads and circuits. As another example, a pad repair control method, a system, a terminal and a medium based on 3D scanning disclosed in CN115863499a, where the pad repair control method based on 3D scanning is characterized by comprising the following steps: collecting depth data and shape data of a defect part in a target bonding pad by using a 3D scanning method; comparing and analyzing the depth data of the defect part with the layer structure parameters of the target bonding pad, and determining a damaged film layer of the defect part; dividing the shape data according to the distribution condition of the damaged film layers to obtain the plane shape of each damaged film layer; and sequentially coating materials on the corresponding damaged film layers according to the plane shape by controlling the pad repairing assembly, and curing and repairing the coating layers until all the damaged film layers are repaired.
The repairing method and the repairing equipment comprising the prior art can only cope with the lowest thickness of the COB substrate film layer of 50 micrometers; for a substrate with a thinner film layer, for example, a bonding pad with the film layer thickness of 0.5 micrometer grade of the COG substrate in the current market is repaired, the repair precision is poor, and the conditions of incapability of maintenance, low yield and the like exist.
Disclosure of Invention
As described above, the repair modes of positioning defect parts, preprocessing, printing defect parts and curing in the prior art cannot meet the requirement of repairing a thinner bonding pad of a substrate film layer on one hand, and cannot repair a large-area drop on the other hand, and the application aims to provide a glass substrate bonding pad repairing method and repairing equipment based on the defect, and repair bonding pad damage occurring in COG packaging, in particular to repair an ultrathin glass substrate (the COG substrate film layer is lower than 50 micrometers), so that the repair precision is high, repair is performed on the condition that the bonding pad structure drops on a large scale, the repair success rate is high, and the condition that adjacent bonding pads are short-circuited cannot occur. The electrical conductivity cannot be affected after repair, and normal functions cannot be ensured after repair.
In a first aspect of the present application, a method for repairing a bonding pad is provided, including the steps of:
s-1, positioning a pad to be repaired and positioning a defect part;
s-2, printing a surrounding dam around the defect part, wherein the surrounding area of the surrounding dam comprises the defect part and a part of complete part;
s-3, curing the dam;
s-4, printing filling repair materials at the defect part;
s-5, solidifying the repairing material;
s-6, adopting etching solution to treat the area surrounded by the surrounding dam so that the protective layer on the surface of the bonding pad is removed;
s-7, printing conductive paste in the surrounding area of the dam;
s-8, sintering the conductive paste by laser to finish the repair of the bonding pad.
Typically, the pad structure is, from bottom to top, a substrate, a first conductive layer, a first protective layer, a resin layer, a second protective layer, and a second conductive layer. The bonding pad needs to be communicated with the second conductive layer to realize conduction, so that the second conductive layer cannot be damaged in the bonding pad repairing process, and the second protective layer above the second conductive layer needs to be removed to reduce the contact resistance between the conductive silver paste (bonding pad) and the second conductive layer.
In the prior art, the second protective layer on the surface of the second conductive layer is usually removed by adopting a physical mode such as milling for the processing mode of the defect part, but the second protective layer is quite thin, so that the high requirement on precision is difficult to meet in the mode, and the requirement on equipment precision is extremely high. It is common that the second conductive layer is damaged by incomplete removal or excessive removal, resulting in failure to function in a normal form after repair.
According to the application, the etching solution is adopted to chemically remove the protective layer, the concentration and the dosage of the etching solution are controlled according to the thickness of the protective layer, the protective layer can be precisely removed, high-precision equipment is not needed, the repair of the ultra-thin film layer bonding pad can be realized, and the removal of the nano-scale film layer can be realized.
On the basis of precisely removing the protective layer by adopting the etching solution, the application sets the retaining dam, and limits the etching range of the etching solution by the retaining dam, thereby preventing the etching solution from overflowing the part except the bonding pad and avoiding damage to other areas.
The dam comprises a complete part of the bonding pad, the protective layer on the surface of the complete part is removed, and the conductive layer below the protective layer is exposed, so that the conductive area is increased, and the normal function of repairing the bonding pad is ensured.
As the preferable choice of the technical proposal, the protective layer is a compact silicon nitride film layer, and the etching solution is hydrofluoric acid. The compact silicon nitride film layer is a common protective layer and is etched by hydrofluoric acid, and the principle is as follows: the compact silicon nitride film layer is Si 3 N 4 The device can react with hydrofluoric acid to generate gas, and is separated from hydrofluoric acid aqueous solution and compact silicon nitride film layer reaction under the condition of heating the substrate: si (Si) 3 N 4 + 12 HF == 3SiF 4 ↑ + 4NH 3 And ≡. The main substances generated by the reaction of the compact silicon nitride film layer and the hydrofluoric acid are all gases, and the main substances are easily separated from the glass-based substrate through organic exhaust treatment, so that the post-treatment mode is simple compared with other repairing treatment schemes.
As a preferable mode of the above-mentioned means, after step S-6, an infrared heat treatment is performed. To ensure the removal effect of the protective layer, the hydrofluoric acid is usually set to be slightly excessive, and the excessive hydrofluoric acid is removed by infrared heat treatment.
Preferably, the material of the dam is resin resistant to etching solution.
As the preferable choice of the technical proposal, the material of the dam is the epoxy resin of the etching-resistant solution.
The height of the retaining dam is determined according to the actual use amount of hydrofluoric acid, the retaining dam ensures that the hydrofluoric acid cannot overflow, and the liquid level of the hydrofluoric acid is level with or slightly lower than the retaining dam. The height of the composite dams is preferably no more than 20 μm, especially no more than 15 μm, and more preferably no more than 10 μm.
As a preferable aspect of the foregoing, the repair material is a resin resistant to an etching solution, and more preferably an epoxy resin resistant to an etching solution.
In a second aspect of the present application, there is provided an apparatus for pad repair, comprising:
a substrate fixing part for fixing a substrate to be repaired;
the positioning system is used for positioning the defect part of the substrate to be repaired;
a dam printing part for printing a dam around the defect part;
a repair material printing unit that prints a repair material to the defective portion;
an etching solution injection unit for injecting an etching solution into the defect portion;
a conductive paste printing unit that prints the conductive paste to the defective portion;
a curing member curing the dam and the repair material;
and sintering the component by laser, and sintering the conductive paste.
As an advantage of the above technical scheme, the repairing apparatus further includes an infrared heat treatment component, and when the etching solution is a hydrofluoric acid solution, after the hydrofluoric acid is injected and reacted with the protective layer, the defect portion is subjected to infrared heat treatment to remove the remaining hydrofluoric acid.
As a preferable mode of the above technical solution, the repairing apparatus further includes an exhaust member for exhausting gas generated during the removal of the protective layer.
As the preference of above-mentioned technical scheme, this repair equipment still includes feeding microscope carrier and ejection of compact microscope carrier, installs in the equipment frame, is located the both sides of motion platform respectively, and feeding microscope carrier is used for sending into the base plate fixed module with waiting to repair the base plate, and ejection of compact microscope carrier is used for sending out the base plate that restores.
By implementing the technical scheme, the application has the following beneficial effects:
1. the part of the whole part around the defect part is increased to be used as a repair area, so that the conductive lap joint area is increased, the lap joint strength is ensured, the conduction section is increased, and the reliability of the repair product is improved.
2. The etching solution is used for removing the protective layer, replaces the traditional physical removal method, improves the removal precision of the protective layer, is particularly suitable for removing an ultra-thin film layer, and removes the dependence on high-precision equipment.
3. The dam is added to assist the etching solution in removing the protective layer, so that the damage of the etching solution to other areas is avoided, meanwhile, the dam is adopted, the structural stability can be further enhanced, the dam can provide additional support and reinforcement, and the whole structure of the bonding pad is more stable. The method can prevent the bonding pad from deforming, loosening or breaking in the subsequent process, thereby improving the reliability of repairing the bonding pad; reducing shorting problems after pad printing and adjacent pads.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for the description of the embodiments will be briefly described below, and it is apparent that the drawings in the following description are only some of the embodiments of the present application, and other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic diagram of a large area landing pad and a good pad according to an embodiment of the present application;
FIG. 2 is a cross-sectional view of a large area landing pad according to one embodiment of the present application;
FIG. 3 is a schematic diagram of a pad repair apparatus according to an embodiment of the present application;
FIG. 4 is a schematic diagram illustrating a pad repair positioning according to an embodiment of the present application;
FIG. 5 is a cross-sectional view of a dam printed by a pad repair method according to an embodiment of the present application;
FIG. 6 is a top view of a dam printed by a pad repair method according to an embodiment of the present application;
FIG. 7 is a cross-sectional view of a pad repair method according to an embodiment of the present application after printing repair material;
FIG. 8 is a top view of a pad repair method according to an embodiment of the present application after printing repair material;
FIG. 9 is a cross-sectional view of a pad repair method according to an embodiment of the application after the protective layer is removed;
FIG. 10 is a top view of a pad repair method according to an embodiment of the present application with a protective layer removed;
FIG. 11 is a cross-sectional view of a bonding pad repairing method according to an embodiment of the present application after bonding pad sintering repair;
fig. 12 is a top view of a bonding pad repairing method according to an embodiment of the present application after bonding pad sintering repair.
In the figure, the A-defect part, the B-perfect bonding pad, the 01-second protective layer, the 02-second conductive layer, the 03-resin layer, the 04-first protective layer, the 05-first conductive layer, the 06-box dam, the 10-equipment rack, the 20-equipment portal frame, the 30-moving platform, the 40-substrate fixing module, the 50-positioning system, the 60-laser ranging sensor, the 70-box dam printing part, the 80-repair material printing part, the 90-etching solution injection part, the 100-conductive paste printing part, the 110-curing part, the 120-laser sintering part and the 130-infrared heat treatment part.
Detailed Description
The application is further described below with reference to the drawings and specific embodiments. Those of ordinary skill in the art will be able to implement the application based on these descriptions. In addition, the embodiments of the present application referred to in the following description are typically only some, but not all, embodiments of the present application. Therefore, all other embodiments, which can be made by one of ordinary skill in the art without undue burden, are intended to be within the scope of the present application, based on the embodiments of the present application.
In the following description, directional or positional relationships such as the terms "inner", "outer", "upper", "lower", "left", "right", etc., are presented for convenience in describing the embodiments and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore should not be construed as limiting the application.
Example 1
Taking one COG product as an example, a schematic top view of a large-area dropped bonding pad is shown in fig. 1, one electrode of bonding pad glass is arranged on the left side, the other electrode of bonding pad is arranged on the right side, in fig. 1, A represents a defect part, and B represents an intact bonding pad. The cross-sectional view of the pad glass corresponding to one pole is shown in fig. 2, and the cross-sectional view is the second protection layer 01, the second conductive layer 02, the resin layer 03, the first protection layer 04, and the first conductive layer 05 sequentially from top to bottom. The first protective layer and the second protective layer adopt compact silicon nitride film layers.
The bonding pad needs to be communicated with the second conductive layer 02 to realize conduction, so that the second conductive layer 02 cannot be damaged in the repairing process, and the second protective layer 01 above the conductive layer 2 needs to be removed to reduce the contact resistance between the conductive silver paste on the repairing print and the second conductive layer 02.
Aiming at the pad with the large-area falling defect in the embodiment, the embodiment provides pad repairing equipment, which mainly comprises: the device comprises a device frame, a device portal frame, a motion platform, a substrate fixing module, a laser ranging sensor, a positioning system, a dam printing component, a repair material printing component, an etching solution injection component, a conductive paste printing component, a curing component and a laser sintering component, and is shown in fig. 3.
The following details the respective parts:
1. the equipment rack 10 is a bearing mechanism of the whole repair equipment and is provided with an installation platform for bearing various structures and systems of the repair equipment; the height of the mounting platform is based on the convenience of repairing operation, and the mounting platform can be designed to be lifting according to the prior art so as to meet the requirements of different operation heights.
2. The equipment portal frame 20 is in a substantially inverted U shape, is installed above the equipment rack 10, and has a working space for performing repair work with the installation platform of the equipment rack 1. The positioning system, the dam printing part, the repair material printing part, the etching solution injection part, the conductive paste printing part, the curing part and the laser sintering part are all arranged on a portal frame of the equipment.
3. The motion stage 30 is mounted on the mounting stage of the equipment rack 10, and may be moved in the horizontal XY axis direction or in the XYZ multi-axis direction, and may be moved in the X direction and/or the Y direction and/or the Z direction by a driving structure (driving motor in this embodiment). The substrate fixing module is arranged on the moving platform 30, and the moving platform 30 drives the substrates to move to the lower part of the corresponding mechanism, so that high-precision bonding pad repairing operation is realized.
In a preferred embodiment, the motion platform 30 may be disposed in a sheet metal housing with better sealing property, and the sheet metal housing is provided with an exhaust hole, which is convenient for the exhaust of gas generated by the reaction of the etching solution and the protective layer, so as to reduce the corrosion of the equipment platform and each functional unit.
4. The substrate fixing module 40 is installed on the motion platform 30 and is used for fixing a substrate to be repaired, and the substrate fixing module 40 can design different clamps according to different substrate varieties, wherein the clamp fixing mode can be designed for different types of substrates, and comprises vacuum adsorption, electromagnetic suction and air cylinder fixing, and specific fixing modes and structures belong to the prior art and are not described herein.
The embodiment is preferably fixed in a vacuum adsorption mode, and is adsorbed by a sucker, so that the fixation of a sample is firm, the adsorption of a processing surface is smooth, and the sucker can be provided with a ceramic sucker, an aluminum sucker, a marble Dan Xipan and the like.
And a voice coil motor supporting module is disposed below the substrate fixing module 40 to move up and down.
5. A positioning system 50 for positioning the defective portion of the substrate pad, the positioning system 50 including a vertical camera.
6. A laser ranging sensor 60 for measuring the print head height of each of the printing and injection members and the tape repair substrate height.
7. And a dam printing part 70 for printing a dam around the located defect part, wherein the dam printing part 70 comprises a dam printing head and a dispensing controller communicated with the dam printing head, and the dispensing controller is positioned behind the dam printing head.
8. And a repair material printing part 80 for printing the repair material in the defective portion area, wherein the repair material printing part 80 comprises a repair printing head and a dispensing controller communicated with the repair printing head, and the dispensing controller is positioned behind the repair printing head.
9. And the etching solution injection part 90 is used for injecting etching solution above the printed repair material in the area surrounded by the dam, and the etching solution injection part 90 comprises an injection printing head and a dispensing controller communicated with the injection printing head, and the dispensing controller is positioned behind the repair printing head. Because the size of the bonding pad is small, the size of the defect part is smaller, and the etching solution is injected in a printing head mode, so that the etching solution can be more accurately injected into the area surrounded by the dam.
10. The conductive paste printing component 100 is used for printing conductive paste in an area surrounded by the dam, and the conductive paste printing component 100 comprises a paste printing head and a dispensing controller communicated with the paste printing head, wherein the dispensing controller is positioned behind the repairing printing head.
11. And a curing part 110 for curing the dam printed by the dam printing part 70 and the repair material printed by the repair material printing part 80. The curing component can be one, and the moving platform moves to a position corresponding to the position to be cured to perform the curing function. The curing means may be two, and the dam printed by the dam printing means 70 and the repair material printed by the repair material printing means 80 are cured.
12. The laser sintering part 120 sinters the conductive paste printed by the conductive paste printing part 100.
In a preferred embodiment, the repairing apparatus further includes a feeding stage and a discharging stage (not shown) mounted on the apparatus frame at both sides of the moving stage, respectively, for feeding or discharging the substrate to or from the substrate fixing module. And a two-dimensional code scanner is arranged on the feeding carrier, acquires the two-dimensional code information recorded on the substrate, and transmits the two-dimensional code information to the identification and positioning system.
In a preferred embodiment, the repair apparatus further includes an infrared heat treatment part 130 for performing an infrared heat treatment on the defect portion after the reaction between the hydrofluoric acid injection and the protective layer to remove the remaining hydrofluoric acid when the etching solution is a hydrofluoric acid solution.
In a preferred embodiment, the repair apparatus further includes a venting member (not shown) for venting gases generated during the removal of the protective layer. The scheme for exhausting air is as follows: the motion platform 30 can be arranged in a sheet metal shell with good sealing performance, and the sheet metal shell is provided with an exhaust hole, so that the exhaust of gas generated by the reaction of etching solution and the protective layer is facilitated, and the corrosion of the equipment platform and each functional unit is reduced. In the preferred embodiment, the exhaust component is a separate component, such as an exhaust fan, mounted on the equipment rack on the side of the etching solution injection component, and can timely exhaust the generated gas.
Aiming at the bonding pad with the large-area falling defect in the embodiment, the embodiment also provides a bonding pad repairing method, which adopts the repairing equipment to repair the bonding pad, and comprises the following specific steps:
first, locating defect locations
Placing the substrate to be repaired on a sucker of a repair platform, and positioning a defect part by means of a positioning system and the motion function of the repair platform:
capturing the glass substrate by a vertical camera, calibrating the alignment, and correcting the rotation;
the vertical camera captures the abnormal point positions of the bonding pads.
(II) printing dams
1. Obtaining the maximum inscribed circle center coordinate and radius data of the glass substrate position through a visual algorithm, planning a dam repair path to be a circumscribed rectangle of the circle, wherein circumscribed points a, b and c are shown in fig. 4, the rectangle is 3 radii long, and the rectangle is 2 radii wide;
( And (3) injection: 1. the size set value of the tangential rectangular surrounding dam is not limited to the above description, and is specifically based on actual products; 2. for a plurality of damaged peripheral bonding pads and all the damaged positions are adhered together, acquiring the central point position of the design position of the bonding pad according to the product information, and setting the position and the size of the dam 06 according to the central point position (the specific size depends on the product specification); 3. the conductive layer 2 is required to be within the rectangular shape of the dam. )
2. The dam printing head XY direction of the dam printing component moves to the position above one corner d of the rectangular dam, and the Z direction moves to the designated height H1;
3. for dam printing anticlockwise, the dam material needs to resist corrosion of the etching solution, and at the same time, the dam material needs to be easy to print to form a dam, the viscosity of the dam material is defined according to the required height-width ratio of the dam, for example, but not limited to, when the required height-width ratio of the dam is a, the viscosity of the corresponding dam material can be controlled to be 2a. It is understood that the viscosity of the dam material may be, but is not limited to, between 10w cPs and 100w cPs to meet different printing requirements. (the specific process parameters of the product in the specific embodiment are that the printing head of the box dam is a 20 mu m ceramic dispensing needle head, the viscosity of the material of the box dam is 40 ten thousand cps UV epoxy resin, the glue supply pressure of the printing head of the box dam is 50psi, and the printing speed is 0.05 mm/s); the height of the dam is not more than 20 μm, and the height of the dam is 20 μm in the embodiment; in another preferred embodiment, 15 μm; in another preferred embodiment, 10 μm.
4. The curing part UV lamp is moved to the dam, the power and curing time of the UV lamp are specifically set according to the height and width of the dam material and the dam (in this embodiment, the power is 10W/cm) 2 Curing for 10 s). The sectional view and the plan view of the dam 06 after being manufactured are respectively shown in fig. 5 and 6.
(III) printing repair Material
1. The repair print head XY direction of the repair material printing section 70 moves to the center position O, and the Z direction moves to the specified height H2;
2. performing dispensing printing at the corresponding position, according to the sectional view 5, obtaining the maximum volume of the repairing material (epoxy resin is adopted in the embodiment), namely the volume corresponding to the area of the printing surrounding dam and the corresponding dotted line rectangular position, obtaining printing process parameters (20 mu m ceramic printing needle head, filling resin material viscosity 5000cps UV epoxy resin, repairing the printing head glue supply pressure of 30psi, and dispensing time of 500 ms), and performing printing;
3. the UV lamp of the cured part was moved to the position of the underfill resin at a power of 80W/cm 2 Curing for 10s. The cross section and the top view of the repair material after the epoxy resin is filled are respectively shown in fig. 7 and 8.
(IV) removal of the protective layer
1. The etching solution injection part 80 (in this embodiment, a dispenser) moves in the XY direction of the injection print head into the rectangular shape of the dam, and moves in the Z direction to a specified height H3 at the center position e outside the largest inscribed circle;
2. the back suction pressure of the etching solution injection part 80 is canceled, and after standing for 2 seconds, the back suction pressure is opened to maintain-1 psi;
3. the infrared heat treatment part is moved to the dam and heated for 20s, so that on one hand, generated gas is separated from the solution to reduce secondary hydrolysis, and on the other hand, the excessive hydrofluoric acid solution is ensured to be completely gasified and separated from the substrate, and the sectional view and the top view after the second protective layer is removed are respectively shown in fig. 9 and 10.
In this embodiment, the second protection layer is a dense silicon nitride film layer, and the etching solution is hydrofluoric acid. The compact silicon nitride film layer is a compact silicon nitride film layer, is a common protective layer, and is etched by hydrofluoric acid, and the principle is that: the compact silicon nitride film layer is Si 3 N 4 The device can be used for discharging gas generated by reaction with hydrofluoric acid, and the reaction between the hydrofluoric acid aqueous solution and the compact silicon nitride film layer is separated from the substrate under the heating condition: si (Si) 3 N 4 + 12 HF == 3SiF 4 ↑ + 4NH 3 ↑。
Hydrofluoric acid concentration and amount: 10mol/L hydrofluoric acid, with the hydrofluoric acid level and the dam level being flush or slightly below the dam (this volume of hydrofluoric acid is excessive for this product);
the injection printing head is made of hydrofluoric acid corrosion resistant plastics such as tetrafluoroethylene and the like, and the aperture is 30 mu m;
if the exhaust component is arranged, the exhaust component is opened while etching solution is injected, and gas generated in the process of removing the protective layer is timely discharged.
Fifth, printing conductive paste
The conductive paste can be one or a combination of a plurality of silver paste, copper paste, jin Jiangliao, platinum paste and tungsten paste. Depending on the actual pads to be repaired.
1. The slurry printing head of the printing conductive slurry part moves to the rectangular shape of the surrounding dam in the XY direction, and moves to the designated height H4 in the Z direction at the center position E outside the largest inscribed circle;
2. the paste printing head moves from E point to O point at the appointed height H4, the paste is always discharged in the process, the final silver paste height is flush with the surrounding dam (the specific technological parameters of the product related in the text are 30 mu m ceramic dispensing needle heads, the silver paste viscosity is 30 ten thousand cps, the glue supply pressure of the dispensing printing head is 40psi, the single-point dispensing time is 200ms, and the printing speed is 0.01 mm/s);
3. the laser spot of the laser sintering part moves to the surface of the conductive paste, laser sintering and curing are carried out, the repairing of the bonding pad is completed after curing, and the sectional view and the top view of the bonding pad after sintering are respectively shown in fig. 11 and 12.
The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present application. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the application; thus, the present application is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Although the terms corresponding to the reference numerals in the drawings are used more herein, the possibility of using other terms is not excluded; these terms are used merely for convenience in describing and explaining the nature of the application; they are to be interpreted as any additional limitation that is not inconsistent with the spirit of the present application.
Claims (10)
1. A bonding pad repairing method is characterized by at least comprising the following steps:
s-1, positioning a pad to be repaired and positioning a defect part;
s-2, printing a surrounding dam around the defect part, wherein the surrounding area of the surrounding dam comprises the defect part and a part of complete part;
s-3, curing the dam;
s-4, printing filling repair materials at the defect part;
s-5, solidifying the repairing material;
s-6, adopting etching solution to treat the area surrounded by the surrounding dam so that the protective layer on the surface of the bonding pad is removed;
s-7, printing conductive paste in the surrounding area of the dam;
s-8, sintering the conductive paste by laser to finish the repair of the bonding pad.
2. The method of repairing a bonding pad according to claim 1, wherein the protective layer is a dense silicon nitride film, and the etching solution is hydrofluoric acid.
3. A pad repair method according to claim 2, characterized in that after step S-6 an infrared heat treatment is performed.
4. The bonding pad repairing method according to claim 1, wherein the material of the dam is a resin resistant to etching solution.
5. The bonding pad repairing method according to claim 1, wherein the material of the dam is an epoxy resin resistant to etching solution.
6. The bonding pad repair method according to claim 1, wherein the repair material is an etching solution-resistant resin.
7. The bonding pad repair method according to claim 1, wherein the height of the dam is not more than 20.
8. An apparatus for pad repair, comprising at least:
a substrate fixing part for fixing a substrate to be repaired;
the positioning system is used for positioning the defect part of the substrate to be repaired;
a dam printing part for printing a dam around the defect part;
a repair material printing unit that prints a repair material to the defective portion;
an etching solution injection unit for injecting an etching solution into the defect portion;
a conductive paste printing unit that prints the conductive paste to the defective portion;
a curing member curing the dam and the repair material;
and sintering the component by laser, and sintering the conductive paste.
9. The pad repair apparatus of claim 8 further comprising an infrared heat treatment component.
10. The pad repair apparatus of claim 8 further comprising an exhaust means for exhausting gas generated during the removal of the protective layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311087823.8A CN117038471A (en) | 2023-08-28 | 2023-08-28 | Bonding pad repairing method and repairing equipment |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202311087823.8A CN117038471A (en) | 2023-08-28 | 2023-08-28 | Bonding pad repairing method and repairing equipment |
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| CN117038471A true CN117038471A (en) | 2023-11-10 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117766669A (en) * | 2024-02-20 | 2024-03-26 | 瀚思科技发展(北京)有限公司 | Miniature LED bonding pad repairing method |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117766669A (en) * | 2024-02-20 | 2024-03-26 | 瀚思科技发展(北京)有限公司 | Miniature LED bonding pad repairing method |
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