JP2001246299A - Paste applying method and mounting device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a paste applying method which shows a function to correctly set a position for the tip of a needle even when a syringe or a needle is replaces and also correctly set a focal position for a camera as wall as a mounting device. SOLUTION: A dispenser 11 is moved to a substrate 3 in each of the axial directions X, Y, Z, together with a camera 41 for photographing an image of the surface of the substrate 3, according to data previously taught to a control part 61.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a paste application method for applying various pastes such as an adhesive and a flux to an application object such as a circuit board, and a mounting apparatus using the same.

[0002]

2. Description of the Related Art In a paste application apparatus for applying various pastes to a circuit board or the like, when a resin having a short pot life is used as a paste, a relatively small volume (for example, about 10 cc) syringe is supplied. In order to prevent troubles due to dirt and clogging, they are usually replaced as disposable. They are exchanged, for example, about once a day. Also, at the time of replacement, a new needle is attached to a new syringe in which resin is sealed, and the syringe is attached to the paste supply device.

Normally, in a conventional paste supply apparatus, the needle height with respect to the substrate is set manually by an operator by manually adjusting a micrometer of the paste supply head. Is set.

[0004] Further, as described in Japanese Patent Application Laid-Open No. 6-106112, when exchanging needles having different lengths, first, before the exchange, a reference needle is attached.
The tip is aligned with the upper surface of the substrate and used as a reference value for the Z-axis coordinate, the difference between the reference needle and the needle to be replaced is used as an offset value, and the Z-axis coordinate value of the Z-axis control program data is automatically corrected. In addition, the removal of the adhesive protruding portion at the needle tip generated in the paste application process was manually cleaned by an operator as needed using a cotton swab or the like.

[0005]

However, in the above-described method, the needle usually has a variation in length and a bend at a level of several tens μm to several hundred μm. After the replacement, there is a problem that the tip position of the needle changes according to the variation, and the application position and the gap change.

Therefore, the application operation can be continued as it is in an application where the variation of the application amount does not cause a problem. However, when precise application is required such as assembling of an electronic component, the needle tip must be replaced every time the needle is replaced. Using a mechanism for adjusting the position using a micrometer head or the like requires a method of finely adjusting the product while trial-coating the product several times, resulting in poor work efficiency. Thus, for example, since this adjustment work is required once per day, not only is the work loss large, but also there is a problem that the product is wasted in trial coating. In addition, when the type is changed to a coating object having a different height, it is necessary to refocus the camera. Conventionally, since the mounting portion of the camera has been adjusted, there is a problem that not only takes a long time for the operation, but also that the position and the optical magnification slightly change, resulting in a change in the application position. The present invention has been made based on these circumstances, and even if the syringe or the needle is replaced, the tip position of the needle can be accurately set,
It is another object of the present invention to provide a paste coating method having a function of accurately setting the focal position of a camera, and an apparatus therefor.

[0007]

According to the first aspect of the present invention, a coating surface height detecting step of detecting a height at which a needle contacts a coating surface of a substrate, and setting a needle height at the time of coating. A needle height setting step, a camera offset setting step of setting an offset amount between the needle and the camera, and a camera height setting step of setting a camera height for setting a height at which a focus of the camera is adjusted to a coating object. A drawing pattern setting step of setting a drawing pattern; a recognition step of recognizing a position of an application target by the camera; and a needle XY positioning step of positioning the needle in the XY directions based on the offset amount and the recognition result. A needle height positioning step of positioning the needle in the height direction based on the application surface height and the needle height set value; While drawing the needle in the XY direction based on the drawing pattern is a paste coating method of wherein there further comprising a coating step of discharging the paste.

According to the second aspect of the present invention,
When the substrates are of the same product type and a predetermined pattern is continuously applied thereto, the paste application method is characterized in that control is performed using the data that has been first taught as it is. Further, according to the means of the invention of claim 3, after the focal position of the camera is set, one point application or indentation is not performed by a discarding operation of the needle at an arbitrary position with respect to the substrate. Move to the position of the application point or indentation, and
This is a paste application method characterized in that a moving amount in a direction is registered as an offset amount. Further, according to the means according to the invention of claim 4, the dispenser which moves while discharging paste from a needle to a predetermined location on the substrate and draws a predetermined pattern, and a camera which images the dispenser and the surface of the substrate are provided. In the paste application device, the dispenser and the camera may be integrally moved by the control unit in the X, Y, and Z axis directions with respect to the substrate based on data previously taught to the control unit. This is a mounting device that is a feature.

Further, according to the means of the invention of claim 5,
A mounting apparatus comprising a cleaning mechanism for bringing the needle of the dispenser into contact with a sheet material.

[0010]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of a paste applying method according to the present invention and a mounting apparatus having a paste applying mechanism using the method will be described below with reference to the drawings. FIG.
1 is a cross-sectional side view of a semiconductor package of a photoelectric conversion device showing an example of application by a mounting device of the present invention. This semiconductor package 1 has a substrate 3 with a glass plate 2 bonded on the back side, and an IC chip 4 on the front side with bumps 5a, 5b, 5c.
.. Mounted by flip-chip bonding via 5n, and the joints at the bumps 5a, 5b, 5c... 5n are sealed with a paste 6 (for example, anisotropic conductive paste), and the bumps 5a of the IC chip 4 are formed. , 5b, 5c ... 5n
The circuit is connected to circuit terminals (not shown) of the substrate 3 and the IC chip 4 is sealed to form a packaging. In addition, the substrate 3
Has an opening 7 formed therein. FIG. 2 is a perspective view showing an application state by supplying a paste to a substrate. The substrate 3 having the glass plate 2 bonded to the back surface is placed on a carrier 8 and transported to a coating position of a mounting device (not shown) described later. The carrier 8 is provided with guides 9a, 9b, 9c, 9d for fixing the four corners of the substrate 3, and the substrate 3 fixed by the guides 9a, 9b, 9c, 9d has
Recognition marks 10a, 1 for recognizing positions at diagonal positions
0b is given. Accordingly, at this position, the substrate 3 whose position has been calculated by the detection of the recognition marks 10a and 10b by the camera (not shown) is the circuit terminal 1 around the opening 7.
A predetermined pattern predetermined by the needle 12 of the dispenser 11 is drawn on 4 and the paste 6 is applied. The position of the needle 12 is detected in advance at the position of the needle height detection position 13 of the substrate 3, and the height at the time of application is set. Next, the mounting apparatus of the present invention will be described. FIG. 3 is a schematic perspective view of a paste application mechanism included in the mounting apparatus of the present invention, and FIG. 4 is a side cross-sectional view of a positioning portion of a substrate in the paste application mechanism of the mounting apparatus. The transport path 20 on which the substrate 3 shown in FIG. 1 is transported while being mounted on the carrier 8 shown in FIG.
1a and 21b. At the application position, the substrate 3 is vacuum-sucked on the stage 22 by a vacuum device (not shown) via a vacuum suction hole 23 provided on the upper surface of the stage 22 and a joint 24 on the lower surface of the glass plate 2. The stage 22 is fixed to a block 25, and the block 25 is fixed to a stage vertical drive unit 26,
The stage vertical drive unit 26 is fixed to a base plate 27.

The base plate 2 in the vicinity of the application position of the conveyance path 20
A table 28 is provided on 7, and a sheet material 29 is mounted on the table 28, and the periphery thereof is fixed by a frame-shaped pressing plate 30.

The base plate 2 in the vicinity of the application position of the transport path 20
A table table 31 is provided on the opposite side of the table 7 on which the placing table 28 is provided. An X table 32 is provided on the table table 31, and a Y table 33 is provided on the X table 32. Also, Y table 3
A head up / down driving unit 34 is fixed on 3. The head vertical drive unit 34 has a cam 3
5 is fixed. The cam 35 is rotated by a predetermined angle by a motor (not shown) provided in the head vertical drive unit 34. The head vertical drive unit 34 is provided with a guide surface on the side of the transport path 20, and linearly guides the head vertical unit 37 in the vertical direction. This head upper and lower part 3
7, a roller 38 is provided at an upper portion, and a relief hole 39 through which a rotating shaft (not shown) for rotating the cam 35 penetrates is formed below the roller 38. That is, the roller 38 is set in a state of being in contact with the outer periphery of the cam 35 fixed to the rotating shaft. Therefore, the head upper and lower portions 37 are
5 in the vertical direction by a predetermined amount of displacement in accordance with the rotation of 5. A camera 41 and a slide block 42 are fixed below the head upper and lower portions 37. A height detection sensor 43 of the needle 12 is fixed to the slide block 42 via a holder 44. A constant temperature block 45 is fixed to the slide block 42. The constant temperature block 45 includes a detection plate 4 that engages with the detection sensor 43.
6, a syringe 47 filled with a paste (not shown) is detachably mounted. The needle 12 is fixed to the tip of the syringe 47.
The upper part of the syringe 47 is connected to a pipe 51 communicating with a pressure applying means (not shown). Further, a control unit 61 for controlling these units includes a needle height detection controller 62, a dispenser controller 63, a camera controller 64, and a main controller 65, each of which is connected to a control target unit.

Next, the operation of this mounting apparatus will be described with reference to FIG.
This will be described with reference to the flowcharts shown in FIGS.

First, (a) the main controller 65
Constraint conditions such as application surface height detection condition, (b) needle 12 height setting condition, (c) camera 41 offset setting condition, (d) camera 41 height setting condition, and (e) drawing pattern setting condition are input. (S1). The carrier 8 carrying the substrate 3 is conveyed to the application position and stopped there. At this position, the stage drive unit 26 connected to the stage 22 is raised to vacuum-suction the glass plate 22. Next, the recognition mark 10 on the substrate 3
a and 10b are imaged by the camera 41 and their positions are recognized (S
2).

Based on the position recognition result, the substrate 3 is moved to the position of the height detection position 13 of the needle 12 (S3).
At the position where the needle 12 is moved, the needle 12 is lowered and brought into contact with the needle 12 to detect the height position of the substrate 3. Needle 1
The height detection of 2 is performed by detecting a change position where the detection plate 46 is separated from the detection sensor 43. Based on the height of the needle 12 in contact with the substrate 3, the needle 1
2 Set the height and set the value to the dispenser control 6
3 (S4).

Next, based on the height value of the needle 12, the offset amount between the needle 12 and the camera 41 (the needle 12
And the offset amount of the camera 41 are calculated based on the conditions set in (S1) (S5).
Based on the offset amount of the camera 41, the camera 41 is set to a height at which the focal point of the camera 41 matches the application surface of the substrate 3, and the value is stored in the camera control 64 (S6). In the following, the teaching for the application path ends. Next, the paste 6 of the circuit terminal 14 of the substrate 3 is applied. That is, the needle 12 is moved to the upper surface of the substrate 3 to move the needle 12 in the approaching direction. While controlling so as to separate by the set height, when the height reaches the set height in (S4), the needle 12 is separated from the substrate 3 and the dispenser controller 63 is operated to operate the needle. The paste 6 is discharged from 12 to draw and apply to the circuit terminals 14. At this time, the application speed of the straight or curved line is applied at a preset application speed (S7). Thereafter, by repeating the same operation, application of a predetermined pattern is sequentially performed. When the paste is successively applied to a plurality of application objects of the same type in succession, the conditions set in the first teaching are used as they are. Further, in the camera offset setting process, after a single point application or indentation is performed by a discarding operation of the needle at an arbitrary position, the camera that moves X and Y integrally with the needle is moved to the position of the application point or the indentation. And move to that X,
The Y movement amount is registered as an offset amount.

In addition, the detection of the height of the application surface is not limited to the application surface itself, but may be performed by another surface having a constant height difference from the application surface. For example, the same effect can be obtained by detecting the surface of the stage on which the substrate is mounted and adding the thickness of the substrate as a correction value.

Further, in the above-described embodiment, a dispenser of a type in which a needle is attached to a syringe and ejected by air pressure is used. However, the present invention is not limited to this. For example, a mechanical type dispenser which mechanically sends out a paste may be used. it can.

The protruding portion of the needle at the tip of the needle is cleaned by moving the needle down to the upper surface of the sheet material on which the paste is easily transferred, when the number of times of application exceeds a preset number of times. Is pressed against the sheet material, and the protruding paste is brought into contact with the sheet material to be cleaned.

As described above, according to the present invention, when the syringe and the needle are replaced, the height of the needle at the time of coating is corrected by detecting the height at which the needle contacts the coating surface. By setting the offset amount between the tip and the camera, the XY
The position in the direction is corrected. Therefore, the height of the needle and the position in the XY directions can be accurately adjusted with a simple operation.

In addition, these operations are performed only once when the syringe and the needle are replaced, and when the paste is continuously applied to a plurality of objects to be applied, the previous data is used as it is. High productivity.

Further, since the camera is configured to be movable in the Z-axis direction together with the needle, even if the object to be applied is a product having a different height, it is possible to easily focus on the product.

The paste application mechanism shown by the sun according to the present embodiment can be used as a paste application device alone, or can be arranged and used in front of a mount mechanism such as a flip chip bonder or a die bonder.

[0024]

According to the present invention, the position of the needle can be easily adjusted even if the height of the substrate on which the paste is applied changes, so that the paste can always be supplied uniformly and stably. Can be.

Further, by setting the program for cleaning the protrusion of the adhesive at the tip of the needle, the tip of the needle can be easily pressed against the sheet material for automatic cleaning, thereby improving the operability.

[Brief description of the drawings]

FIG. 1 is a cross-sectional side view of a semiconductor package.

FIG. 2 is a perspective view showing a state of applying a paste to a substrate.

FIG. 3 is a schematic perspective view of a mounting device of the present invention.

FIG. 4 is a side sectional view of a positioning portion of a substrate of the mounting apparatus.

FIG. 5 is a flowchart of the mounting apparatus of the present invention.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Semiconductor package, 3 ... Substrate, 6 ... Paste, 11
... Dispenser, 12 ... Needle, 29 ... Sheet material, 3
4 head vertical drive unit, 41 camera, 47 syringe, 61 control unit

Continued on front page F term (reference) 4D075 AC06 AC08 AC93 DC21 EA35 4F041 AA05 AB01 BA21 BA38 4F042 AA06 BA08 5E319 CD22 CD25

Claims (5)

[Claims] 1. A coating surface height detection step for detecting a height at which a needle contacts a coating surface of a substrate, a needle height setting step for setting a needle height at the time of coating, and an offset amount between the needle and a camera. A camera offset setting step of setting a camera height setting step of setting a camera height for setting a height at which the focus of the camera matches an object to be coated; a drawing pattern setting step of setting a drawing pattern; A recognition step of recognizing the position of the application object by
A needle XY positioning step of positioning the needle in the XY directions based on the offset amount and the recognition result, and a needle height for positioning the needle in the height direction based on the application surface height and the needle height set value A paste coating method, comprising: a positioning step; and a coating step of discharging a paste while drawing the needle in the XY directions based on the drawing pattern. 2. The paste application according to claim 1, wherein when the substrate is of the same type and a predetermined pattern is continuously applied to the substrate, control is performed using data that has been initially taught as it is. Method. 3. After the focal position of the camera is set, one-point application or indentation is not performed by a discarding operation of the needle at an arbitrary position on the substrate, and the camera is moved to the position of the application point or indentation. 2. The paste coating method according to claim 1, wherein the moving amount in the X and Y directions is registered as an offset amount. 4. A paste application apparatus comprising: a dispenser that moves while discharging paste from a needle to a predetermined location on a substrate to draw a predetermined pattern; and a dispenser and a camera that images a surface of the substrate. And the camera is moved in the X, Y, and Z axis directions with respect to the board based on data that has been previously taught to the control unit by the control unit. 5. The mounting apparatus according to claim 4, further comprising a cleaning mechanism for bringing said needle of said dispenser into contact with a sheet material.