JP2010161293A - Treatment device and method using mask - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a device for shortening a time for positioning a mask and a substrate. <P>SOLUTION: A ball mounting device 2 includes: an observation camera 50a for observing a reference mark 15a on a mask side arranged on the mask 10, and a reference mark 105a on a substrate side arranged on the substrate 100; and an observation camera 50b for observing a reference mark 15b on a mask side arranged on the mask 10 and a reference mark 105b on a substrate side arranged on the substrate 100. The observation camera 50a observes the reference mark 105a on the substrate side through an observation window 17a arranged in a position apart from a plurality of openings 12 of the mask 10. The observation camera 50b observes the reference mark 105b on the substrate side through an observation window 17b arranged in a position apart from the plurality of openings 12 of the mask 10. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a mask (template) having a plurality of openings for a process of mounting (arranging) conductive balls on a substrate or a process of applying (printing) cream solder, flux or the like to the substrate, and the substrate. Relates to an apparatus and a method comprising aligning the two.

  Patent Document 1 describes the following method. When printing cream solder on the substrate, first, the camera is moved above the mask, the reference point provided on the mask is observed, and the position of the mask in the XYθ direction is observed. In this case, the squeegee must be moved upward or sideward by a device (not shown) so that the squeegee does not hinder the observation of the camera. Next, the camera is moved above the substrate, a reference point provided on the substrate is observed, and the position of this reference point in the XYθ direction is detected. If the position of the mask and the substrate is observed in this way, each motor is driven to move the substrate directly under the mask and the actuator is then driven so that the reference point of the substrate coincides with the reference point of the mask. Then, the substrate is raised, the substrate is pressed against the lower surface of the mask, and the squeegee is slid to print cream solder on the substrate.

Patent Document 1 describes the following problems with the above method.
(A) Since two XYZ table devices for the substrate and the camera are required, the size of the device becomes complicated.
(B) When observing a mask with a camera, an apparatus for moving the squeegee upward or sideward is required so that the squeegee does not become an obstacle to the camera.
(C) Since the camera moves between the substrate and the mask, the X-direction stroke becomes long, and the work efficiency decreases accordingly.

  Patent Document 1 describes the following apparatus and method in order to solve the above problems. A screen printing apparatus is composed of an XYZ table device for positioning a substrate, a substrate observation camera for observing a reference point provided on the substrate, and a screen device for printing cream solder on a circuit pattern of the substrate by a mask and a squeegee. Then, a mask observation camera for observing a reference point provided on the mask was integrated with the XYZ table device. According to the above configuration, the reference point of the mask is observed by driving the XYZ table device and moving the camera provided integrally therewith below the mask. Further, the XYZ table device is driven to move the substrate below the substrate observation camera to observe the reference point of the substrate. Next, in order to make the reference point of the substrate coincide with the reference point of the mask, the XYZ table device is driven, the substrate is moved below the mask, then the substrate is lifted and pressed against the lower surface of the mask, and the squeegee is slid. Let the cream solder be printed.

Japanese Patent Laid-Open No. 03-200999

  Also in the above apparatus and method, the XYZ table device is driven to move the camera below the mask, and the XYZ table device is driven to move the substrate below the substrate observation camera away from below the mask. Furthermore, it is necessary to drive the XYZ table device to move the substrate below the mask. That is, it is necessary to move the table device below the mask, then take it out from below the mask, and move it below the mask. Therefore, it cannot be said that the work efficiency has been greatly improved.

  Further, the reference point provided on the mask is observed with a mask observation camera integrally mounted on the XYZ table, and the reference point of the substrate is observed with a substrate observation camera different from the mask observation camera. Therefore, there is a possibility that the measurement accuracy of each camera overlaps and the accuracy of alignment is lowered.

  An equivalent mask that functions as a template with multiple openings is used to mount (mount) conductive balls (conductive fine particles) such as solder balls on a semiconductor device or printed wiring board as a substrate. Can also be used. At present, it is considered to mount a small conductive ball, for example, a conductive ball having a diameter of 1 mm or less, specifically about 10 to 500 μm on the surface of a substrate using a mask. For this purpose, it is desired to further improve the alignment accuracy between the mask and the substrate. There is also a need for an apparatus and method that can reduce the time required to align the mask and the substrate and further reduce the tact time associated with ball mounting.

  One embodiment of the present invention is an apparatus for performing processing on a substrate through a mask in a state where the mask including a plurality of openings and the substrate are aligned. This apparatus includes a frame for holding a mask, a moving stage for mounting the substrate and positioning the substrate, a mask-side reference mark provided on the mask, and a substrate-side reference mark provided on the substrate. And an observation camera. This observation camera can observe the reference mark on the substrate side through an observation window provided at a position away from the plurality of openings of the mask.

  In this apparatus, the reference mark on the substrate side can be recognized by the observation camera through the observation window provided at a position away from the plurality of openings of the mask. Therefore, it is not necessary to remove the substrate from under the mask in order to confirm the reference mark on the substrate side. For this reason, the movement distance of a board | substrate can be shortened and the time (tact time) required for the process using masks, such as ball mounting, can be improved. Further, the reference mark on the substrate side and the reference mark on the mask side can be recognized by a common observation camera. Therefore, the alignment accuracy between the substrate and the mask can be improved.

  Furthermore, since the observation window is provided away from the multiple openings required for processing, the reference mark can be recognized without retreating the head or squeegee required for processing away from the mask, and alignment is also performed at that point. Can be shortened.

  In addition, since the reference marks on the substrate side can be recognized through the observation window of the mask, the distance between the reference marks on the mask side and the observation window can be made closer, thereby observing these reference marks. Therefore, the moving distance of the observation camera can be shortened. Further, if the observation camera has a wide field of view, both reference marks can be observed without moving, and the alignment accuracy can be further improved.

  In order to align the positions in the XYθ direction, a plurality of substrate side reference marks are provided on the substrate. Therefore, it is preferable that the mask is provided with a plurality of observation windows arranged at intervals corresponding to the reference marks on the plurality of substrates. Further, it is desirable to arrange a plurality of mask side reference marks in the vicinity of each of the plurality of observation windows and provide a plurality of observation cameras capable of observing each of the plurality of windows and the vicinity thereof. The moving distance of the observation camera can be shortened, and recognition of a plurality of reference marks can be executed in parallel, so that the time required for alignment can be further shortened.

  One of the treatments (surface treatment, operation) performed on the surface of the substrate using a mask is ball mounting. Accordingly, the plurality of openings of the mask include a plurality of placement openings for placing the conductive balls at predetermined positions on the surface of the substrate, and the apparatus masks the plurality of conductive balls supplied to the surface of the mask. It is preferable to further include a filling head that moves along the surface of the mask and fills each of the plurality of arrangement openings of the mask.

  One of the other surface treatments of the substrate using the mask is flux application (printing). Thus, the plurality of openings in the mask include a plurality of application openings for applying flux to predetermined positions on the surface of the substrate, and the apparatus moves along the surface of the mask and passes through the application openings. It is preferable to further have a coating head for coating the flux at a predetermined position on the surface.

  Another aspect of the present invention is a mask having a plurality of openings. This mask is for performing processing on the substrate through the mask in a state where the mask and the substrate are aligned. The mask has a mask-side reference mark and an observation window for observing the substrate-side reference mark provided on the substrate, and is provided at a position apart from the plurality of openings.

  In order to align the XYθ directions, the substrate is provided with a plurality of reference marks on the substrate side. Therefore, the mask may have a plurality of observation windows arranged at intervals corresponding to the plurality of substrate-side reference marks, and a plurality of mask-side reference marks arranged in the vicinity of each of the plurality of observation windows. desirable.

  The plurality of openings of the mask may include a plurality of arrangement openings for arranging the conductive balls at predetermined positions on the surface of the substrate. Further, the plurality of openings of the mask may include a plurality of application openings for applying the flux to predetermined positions on the surface of the substrate.

One of further different aspects of the present invention is a method of performing processing on a substrate through a mask in a state where a mask having a plurality of openings and the substrate are aligned. The method includes the following steps.
1. Observe the mask reference mark provided on the mask with an observation camera.
2. Moving the moving stage on which the substrate is mounted to a position where the reference mark on the substrate side provided on the substrate can be seen through an observation window provided at a position away from the plurality of openings of the mask.
3. Observe the reference mark on the substrate side through the observation window with the observation camera.
4). The moving stage is moved to a processing position obtained from the reference mark on the mask side and the reference mark on the substrate side.

  In this method, the substrate does not have to be removed from under the mask in order to recognize the fiducial mark on the substrate side, so that step can be omitted, and further, the step of returning it under the mask again for processing can be omitted. Furthermore, since the reference marks on the substrate side and the mask side can be recognized by a common observation camera, the alignment accuracy can be improved.

  The plurality of openings in the mask include a plurality of application openings for applying flux to predetermined positions on the surface of the substrate, and the method can be applied at predetermined positions on the surface of the substrate via the application openings at the processing position. You may further have applying a flux to.

  The plurality of openings in the mask include a plurality of placement openings for placing conductive balls at predetermined locations on the surface of the substrate, and the method includes a plurality of conductive openings supplied to the surface of the mask at the processing location. The method may further include moving the ball along the surface of the mask and filling each of the plurality of placement openings in the mask. A substrate having conductive balls mounted on its surface, for example, a semiconductor substrate (wafer) or a printed wiring board can be manufactured.

  In the apparatus of one embodiment of the present invention, since the reference mark on the substrate side can be recognized by the observation camera through the observation window for the mask, the substrate is removed from under the mask in order to confirm the reference mark on the substrate side. There is no need, and the movement distance of the substrate can be shortened, and the time (tact time) required for processing using a mask such as ball mounting can be improved. In addition, since the observation window is provided apart from a plurality of openings required for processing, the reference mark can be recognized without retreating the head or squeegee required for processing away from the mask, and the time required for alignment. Can be shortened.

  Furthermore, since the reference mark on the substrate side and the reference mark on the mask side can be recognized by a common observation camera, the alignment accuracy between the substrate and the mask can be improved. Further, since the reference mark on the substrate side can be recognized through the observation window for the mask, the distance between the reference mark on the mask side and the observation window can be reduced, and the moving distance of the observation camera can be shortened. For this reason, the alignment accuracy can be further improved.

It is a perspective view which shows an example of a ball | bowl mounting apparatus, and shows a mode that the reference mark by the side of a mask is recognized. The figure which shows a mode that the reference mark by the side of a board | substrate is recognized with the ball | bowl mounting apparatus of FIG. The figure which shows a mode that a board | substrate and a mask are aligned with the ball mounting apparatus of FIG. 1, and a conductive ball is mounted.

  Hereinafter, an embodiment of the present invention will be described with reference to the drawings. FIG. 1 is a perspective view showing an example of a substrate processing apparatus. An example of the processing device 1 is a ball mounting device (mounting device, ball mounting system, ball mounter) 2, and another example is a flux application device 3. FIG. 1 is a diagram illustrating a typical configuration common to the ball mounting device 2 and the flux applying device 3 and a head used in each of the devices 2 and 3. The flux application device 3 is a device for applying (printing) a flux such as cream solder to a predetermined position of the substrate 100 with a coating head 4 via a mask 10. This is an apparatus for mounting conductive balls (conductive fine particles) by a filling head 5 through a mask 10 at a predetermined position (position where flux is printed). The mask 10 for applying the flux and the mask 10 for arranging the conductive balls may have a difference in thickness, size of the opening (opening pattern, small hole), and the like. In both apparatuses 2 and 3, the mask 10 functions as a template having a plurality of openings (opening patterns) 12.

  For example, in the ball mounting apparatus 2, the filling head 5 having a configuration suitable for moving a conductive ball such as a squeegee has a plurality of conductive balls (not shown) supplied to the surface 11 of the mask 10. Is moved along the surface 11 of the mask 10 to fill each of the plurality of arrangement openings 12 of the mask 10. As a result, the conductive balls are arranged at predetermined positions on the surface 101 of the substrate 100 defined in the arrangement openings 12 of the mask 10.

  A typical substrate (workpiece, workpiece) 100 is a printed wiring board or a semiconductor substrate. The substrate 100 described below is a printed wiring board, and the ball mounting apparatus 2 uses a predetermined pattern of conductive balls on a plurality of electrodes 102 formed in a predetermined pattern on the surface 101 of the printed circuit board 100. It is mounted according to.

  The printed wiring board 100 is also called a printed wiring board, a printed circuit board, a printed circuit board, a circuit board, or a printed board, and includes a semiconductor mounting board on which a semiconductor is mounted, a build-up board, a multilayer board, and the like. The conductive ball mounted on the electrode 102 of the substrate 100 functions as an electrode (bump) for obtaining an electrical connection, and its diameter is, for example, 1 mm or less, specifically 10 to 10 mm. It is about 500 μm. Such conductive balls are sometimes called microballs, microballs, microparticles, and the like. The conductive balls include solder balls (balls containing silver (Ag), copper (Cu), etc., the main component being tin (Sn)), metal balls such as gold or silver, ceramic balls or plastics. Examples include balls made of conductive balls and the like, and spherical silicon balls used for photoelectric conversion. The conductive ball of this example is a solder ball having a diameter of about 100 μm.

  A plurality of semiconductor chips (semiconductor devices) are mounted on the opposite surface of the printed wiring board 100, and a plurality of electrodes for connecting to the respective semiconductor chips are provided on the other surface 101 of the printed wiring board 100. 102 are distributed (discrete, grouped) in a matrix (array) 103. Therefore, a plurality of openings 12 are similarly formed in the mask 10 in a plurality of groups (opening groups) 13 at positions corresponding to the arrangement of the electrodes of the printed wiring board 100.

  If the processing apparatus 1 is the coating apparatus 3, the mask 10 is a coating mask, and the coating head 4 provided with a squeegee moves along the surface 11 of the mask 10 and is provided at the same position as the arrangement opening 12. The flux is applied to a predetermined position on the surface 101 of the substrate 100, that is, the position of the electrode 102 through the coating opening. In the following, the present invention will be described focusing on the ball mounting device 2.

  As described above, the ball mounting apparatus 2 mounts the conductive ball on a predetermined position of the substrate 100 via the mask 10 in a state where the mask 10 having the plurality of openings 12 and the substrate 100 are aligned. . For this reason, the ball mounting apparatus 2 includes a frame 21 for holding the mask 10, a moving stage 30 for mounting the substrate 100 and positioning the substrate 100, and a mask-side reference mark provided on the mask 10. 15a and 15b, and observation cameras 50a and 50b for observing the substrate side reference marks 105a and 105b provided on the substrate 100.

  One observation camera 50a observes the mask side reference mark 15a and the substrate side reference mark 105a. The observation camera 50a observes the reference mark 105a on the substrate side through the observation window 17a provided in the mask 10. The other observation camera 50b observes the reference mark 15b on the mask side and the reference mark 105b on the substrate side. The observation camera 50b observes the reference mark 105b on the substrate side through the observation window 17b provided in the mask 10. These observation windows 17 a and 17 b are provided at positions away from the plurality of openings 12 of the mask 10.

  The moving stage 30 includes a holding table 31 for mounting and holding the substrate 100, a Z table 32 for controlling the position of the holding table 31 in the height direction with respect to the base 20, and a θ direction (horizontal) of the holding table 31 with respect to the base 20. Direction table) for controlling the angle (rotation angle), the Y table 34 for controlling the position of the holding table 31 relative to the base 20 in the front-rear direction (Y direction), and the holding table 31 relative to the base 20. And an X table 35 for controlling the position in the left-right direction (X direction). Each of the Z table 32, the θ table 33, the Y table 34, and the X table 35 includes a driving motor, and a known method and mechanism such as a ball screw can be used as a moving method. Therefore, the moving stage 30 can freely set the position of the mounted substrate 100 and the horizontal direction θ with respect to the base 20, and can position the substrate 100.

  The substrate 100 includes two reference marks 105a and 105b for positioning at appropriate positions. Therefore, the substrate 100 is mounted on the holding table 31, the substrate 100 is moved to a position where the reference marks 105a and 105b can be observed by the observation cameras 50a and 50b by the moving stage 30, and the substrate 100 is observed by the observation cameras 50a and 50b. By recognizing the reference marks 105a and 105b, the position (X, Y) and posture (rotation angle) of the substrate 100 with respect to the reference position of the moving stage 30 are determined. Once the relative position and orientation of the substrate 100 with respect to the moving stage 30, that is, the differences in the X direction, Y direction, and θ direction, are determined, the substrate 100 is controlled by controlling the X direction, Y direction, and θ direction of the moving stage 30. The X direction, Y direction, and θ direction can be freely controlled.

  The mask 10 is a thin plate, for example, a metal thin plate having the same thickness as the diameter of the conductive ball (100 μm in this example), the periphery is reinforced with a reinforcing material (not shown), and is further fixed to the mask frame 19. ing. The mask 10 is held by a frame (mask holder) 21 fixed to a base frame 22 integrated with the base 20. For this reason, once the mask 10 is attached to the mask holder 21, the position (X, Y, Z and θ) with respect to the base 20 is fixed. The mask 10 includes reference marks (target marks) 15a and 15b for positioning the mask 10 in addition to an opening 12 for ball mounting (ball filling). An example of the target marks 15a and 15b is a mark having a diameter of about 1 mm or less. In the mask 10, the opening 12 is disposed on the front side (Y minus direction) of the mask 10, and the target marks 15 a and 15 b are disposed on the rear side (Y plus direction) of the mask 10.

  The mask 10 is further provided with observation windows 17a and 17b for viewing the reference marks 105a and 105b of the substrate 100 through the mask 10, respectively. An example of the observation windows 17a and 17b is a circular hole (through hole) having a diameter of about 10 to 15 mm. The substrate 100 is placed on the moving stage 30 by being taken out of a supply source, for example, a transfer package, by a substrate supply device (not shown) such as a robot arm. At this time, alignment is not performed or pre-alignment (rough positioning) is performed, and a slight positional deviation occurs on the moving stage 30 for each substrate. The sizes of the observation windows 17a and 17b are set in consideration of the positional deviation when the substrate is supplied onto the moving stage 30. In this mask 10, the observation windows 17a and 17b are respectively arranged on the rear side (Y plus direction) of the mask 10 in the vicinity of the target marks 15a and 15b so as to be linearly aligned with the target marks 15a and 15b. Yes. Therefore, by recognizing the target marks 15a and 15b by the observation cameras 50a and 50b, the position (X, Y) and posture (direction, θ) of the mask 10 with respect to the base frame 22 are determined.

  Each of the observation cameras 50a and 50b includes a suitable image sensor such as a CCD, a lens system, and a prism or a mirror when the optical path from the mask 10 to the CCD needs to be bent. The observation cameras 50 a and 50 b are arranged on the base frame 22 integrated with the base 20 so as to move in the X, Y, and Z directions above the mask 10 by the XYZ table 51. These observation cameras 50a and 50b move independently. The XYZ table 51 for each of the cameras 50a and 50b has a common configuration, and a Z table 51z for controlling the vertical position of each camera for focus adjustment, and the Y direction (front and rear direction, width of each camera). Y table 51y for controlling the position in the direction) and an X table 51x for controlling the position in the X direction (left and right direction, longitudinal direction) of each camera.

  In this ball mounting apparatus 2, one process of surface treatment for manufacturing a printed wiring board 100 having conductive balls by arranging conductive balls at predetermined positions on the surface 101 of the substrate 100 is as follows. Done in steps.

  First, as shown in FIG. 1, the left and right observation cameras 50a and 50b are moved by the XYZ table 51 to a position where the left and right reference marks 15a and 15b on the mask 10 provided on the mask 10 can be seen from above. The left and right reference marks 15a and 15b are observed with the observation cameras 50a and 50b, respectively (step ST1). By this step ST1, the position (relative position or difference in the X and Y directions) and direction (relative angle or difference in the θ direction) of the mask 10 with respect to the base frame 22 are determined. Step ST1 may be performed when the mask 10 is attached to the mask holder 21. Thereafter, this step ST1 may be performed to confirm the position and orientation of the mask 10 at an appropriate interval.

  Next, as shown in FIG. 2, the moving stage 30 on which the substrate 100 is mounted is moved to the lower side of the mask 10, and the substrate side reference marks 105 a and 105 b provided on the substrate 100 are changed to the observation window 17 a and the mask 10. It moves to a position that can be seen through 17b (step ST2). Then, the left and right observation cameras 50a and 50b are moved by the XYZ table 51 to positions where the left and right reference marks 105a and 105b on the substrate side provided on the substrate 100 can be seen from above through the observation windows 17a and 17b. The left and right reference marks 105a and 105b are observed through the observation windows 17a and 17b by the left and right observation cameras 50a and 50b (step ST3).

  By this step ST3, the position (relative position or difference in the X and Y directions) and direction (relative angle or difference in the θ direction) of the substrate 100 with respect to the moving stage 30 are determined. Since the relationship between the position (movement amount) of the moving stage 30 and the base frame 22 is known in advance, the relationship between the position and direction of the mask 10 and the position and direction of the substrate 100 is determined through steps ST1 and ST3. Accordingly, the moving stage 30 can move the substrate 100 with respect to the mask 10 with high accuracy so as to be in an arbitrary position and orientation. The step ST3 for obtaining the position and orientation of the substrate 100 is desirably performed every time a new substrate 100 arrives by the moving stage 30.

  Next, as shown in FIG. 3, since the relationship between the relative position and direction of the substrate 100 and the mask 10 is known with high accuracy, the moving stage 30 is moved between the mask-side reference marks 15a and 15b and the substrate-side reference. It moves to a predetermined position obtained from the marks 105a and 105b, that is, a position for mounting a conductive ball, and the mask 10 and the substrate 100 are brought into close contact with each other (step ST4). Then, a plurality of conductive balls are supplied to the surface 11 of the mask 10 by the filling head 5 and moved along the surface of the mask (step ST5). As a result, each of the plurality of placement openings 12 of the mask 10 is filled with conductive balls, and the conductive balls are accurately placed (mounted) at predetermined positions (electrode positions) 102 on the surface 101 of the substrate 100. Since flux (cream solder) is applied to the electrode position 102, the printed wiring board 100 on which the conductive balls are mounted is placed in a reflow furnace to be reflowed and solder bumps can be formed on the printed wiring board 100.

  An example of the filling head 5 is an area formed on the surface 11 of the mask 10 by the filling head 5 by rotating a wire squeegee arranged at an appropriate pitch along the circumference by an axis 5 s perpendicular to the mask 10. The conductive ball is held in the moving area. By moving the filling head 5 in an appropriate direction, for example, in the longitudinal direction (X direction), the group of conductive balls is moved under the filling head 5 while keeping it from escaping from the moving area. can do. Therefore, the conductive balls can be concentrated and managed in a limited region (area) where the opening 12 is provided in the surface 11 of the mask 10, and the conductive balls can be efficiently disposed on the substrate 100. The conductive balls in the moving area can be filled or replenished through an appropriate method, for example, from a conductive ball supply device (not shown) via the shaft 5s, and the consumed conductive balls can be replenished. Further, when this type of filling head 5 is employed, the conductive balls can be concentrated on a limited area of the surface 11 of the mask 10, so that the conductive balls are placed on the observation windows 17 a and 17 b provided on the same mask 10. There is no flow.

  In the case of the flux coating apparatus 3, the mask 10 is replaced by a coating mask, and the filling head 5 in the above-described step ST5 is replaced by the coating head (squeegee) 4 and the surface of the substrate 100 through the mask coating opening. A flux is applied to a predetermined position (electrode position) 102 of 101. Other steps ST1 to ST4 are the same processes as described above.

  In this ball mounting apparatus 2, reference marks 105 a and 105 b on the lower substrate side of the mask 10 are passed through the observation windows 17 a and 17 b provided at positions away from the plurality of openings 12 of the mask 10. Can be recognized by the observation cameras 50a and 50b from above. Therefore, it is not necessary to remove the substrate 100 from under the mask 10 in order to confirm the reference marks 105a and 105b on the substrate side. For this reason, the movement distance of the board | substrate 100 can be shortened and the time (tact time) which a ball mounting process requires can be shortened. For example, as shown in FIG. 2, the moving stage 30 first moves the substrate 100 below the observation window 17 a and 17 b on the lower side of the mask 10 (arrow A), and then below the mask 10. On the side, it may be moved below the opening 12 (arrow B). Therefore, as described in Patent Document 1, in order to confirm the reference point of the mask, the XYZ table is once moved under the mask, and then the XYZ table is taken out from under the mask to observe the substrate. Further, it is possible to save time and labor required to move the XYZ table below the mask and perform processing.

  Further, in this ball mounting apparatus 2, the reference mark 105a on the substrate side and the reference mark 15a on the mask side can be recognized by the common observation camera 50a. Similarly, the reference mark 105b on the substrate side and the reference mark on the mask side 15b can be recognized by the common observation camera 50b. That is, the observation camera 50a recognizes the reference mark 105a on the substrate side through the observation window 17a provided at a position away from the plurality of openings 12 of the mask 10 in order to recognize the reference mark 15a on the mask side. Used to do. The observation camera 50b recognizes the reference mark 15b on the mask side, and recognizes the reference mark 105b on the substrate side through the observation window 17b provided at a position away from the plurality of openings 12 of the mask 10. Used for. Therefore, the tolerances of the observation cameras 50a and 50b are common to the position measurement between the substrate 100 and the mask 10, and the tolerances of the cameras 50a and 50b are cancelled. For this reason, the accuracy of alignment between the substrate 100 and the mask 10 can be improved. In the conventional method, an alignment error of the order of 10 μm may occur due to the tolerance or drift of each camera. However, in the method of the present application, the alignment error is reliably set to several μm (for example, 5 μm) or less. I was able to.

  By increasing the movement amount of the camera 50a, it is possible to recognize the reference marks 105a and 105b on the substrate side and the reference marks 15a and 15b on the mask side with one observation camera 50a. However, in this case, since the movement amount of the camera 50a is large, the influence of the measurement error of the movement amount may appear greatly. Further, since the moving amount of the camera becomes large, the effect of shortening the tact time is diminished depending on the time required for the movement. On the other hand, in order to confirm not only the position of the substrate 100 and the mask 10 but also the direction (θ direction), at least two reference marks must be recognized by the camera. Therefore, the above apparatus 2 and method for recognizing the left and right reference points by the left and right cameras 50a and 50b are suitable for accurately detecting the positions and directions of the mask 10 and the substrate 100 in a short time.

  Further, the observation windows 17a and 17b of the mask 10 are provided apart from the plurality of openings 12 required for processing. For this reason, the reference marks 105a and 105b of the substrate 100 can be recognized without having to retract the head 4 or 5 required for the processing (ball mounting, flux printing) of the surface 101 of the substrate 100 away from the mask 10. Therefore, the mechanism required for retracting the head 4 or 5 and the time required for retracting can be omitted, the apparatus can be simplified, and the time required for alignment (tact time) can be shortened. In addition, the reference marks 15a and 15b of the mask 10 can also be provided apart from the opening 12, and in this respect as well, the mechanism required for alignment can be simplified and the time required for alignment can be shortened.

  Further, the reference marks 105a and 105b on the substrate side can be recognized through the observation windows 17a and 17b of the mask 10, respectively. Therefore, the distance between the mask-side reference mark 15a and the observation window 17a and the distance between the mask-side reference mark 15b and the observation window 17b can be reduced. For this reason, the moving distances of the left and right observation cameras 50a and 50b for observing the left and right reference marks 15a and 105a and 15b and 105b, respectively, can be shortened. Therefore, an increase in the amount of movement of the cameras 50a and 50b can suppress the occurrence of errors, and the time for moving the cameras 50a and 50b can also be shortened. For this reason, also in this respect, the alignment accuracy can be improved, and the time required for alignment can be shortened.

  Further, since the cameras 50a and 50b for observation have a wide field of view, the mask side reference mark 15a and the observation window 17a, and the mask side reference mark 15b and the observation window 17b can be included in each field of view. If so, each reference mark can be recognized within one field of view (image) without moving the cameras 50a and 50b. For this reason, the accuracy of alignment can be further improved, and the time required for alignment can be further shortened.

  Therefore, the ball mounting apparatus 2 can improve the alignment accuracy and can shorten the time required for the alignment. For this reason, it is suitable for a device for mounting a small conductive ball, for example, a conductive ball having a diameter of 1 mm or less, specifically about 10 to 500 μm on the surface of the substrate using a mask. Time can be further reduced. Similarly, the tact time relating to the flux application can be further shortened by applying it to the flux application apparatus.

  The above-described embodiments are merely examples for realizing the conductive ball mounting apparatus and method and the flux mounting apparatus and method included in the present invention. For example, the moving stage is not limited to a rail-type moving device extending in the X direction and the Y direction, and may be a moving device using an arm. One of the objects of the present embodiment is to provide an apparatus, an apparatus control method, and a ball mounting method that can reduce the tact time. However, partial changes and variations obvious to those skilled in the art are considered to be within the scope of the present invention.

  The mask (template, mask plate), the method of processing using a mask, and the apparatus for processing using a mask included in the present invention can reduce the error of the printing position to several μm or less (including a submicron meter). Suitable for all required applications. Typical applications (processing) include ball mounting, flux printing, paste solder printing, conductive adhesive printing, conductive anisotropic adhesive printing, insulating adhesive printing, gravure printing, and exposure processing using a mask. Device and method for manufacturing a device, for example, a semiconductor device, a liquid crystal display, a plasma display, a printed wiring board, and an apparatus and method related to manufacturing including a photolithography process of MEMS (Micro Electro Mechanical Systems). The mask, method and apparatus are not limited to these processes and uses.

DESCRIPTION OF SYMBOLS 1 Processing apparatus, 2 Ball mounting apparatus, 3 Coating apparatus 10 Mask, 12 Aperture, 15a, 15b Reference mark 17a, 17b on the mask side Observation window 30 Moving stage, 50a, 50b Observation camera 100 Substrate, 105a, 105b Substrate side Reference mark

Claims (11)

An apparatus for performing processing on the substrate through the mask in a state in which a mask having a plurality of openings and the substrate are aligned.
A frame for holding the mask;
A stage for mounting the substrate and positioning the substrate;
An observation camera for observing a mask-side reference mark provided on the mask and a substrate-side reference mark provided on the substrate, the camera being provided at a position away from the plurality of openings of the mask. And an observation camera capable of observing the reference mark on the substrate side through the observation window. 2. The substrate according to claim 1, wherein a plurality of reference marks on the substrate side are provided on the substrate, and a plurality of the observation windows arranged at intervals corresponding to the plurality of reference marks on the substrate side are provided on the mask. A plurality of mask side reference marks arranged in the vicinity of each of the plurality of observation windows,
An apparatus further comprising a plurality of observation cameras capable of observing each of the plurality of observation windows and the vicinity thereof. In Claim 1 or 2, the plurality of openings of the mask include a plurality of placement openings for placing conductive balls at predetermined positions on the surface of the substrate,
An apparatus further comprising a filling head for moving a plurality of conductive balls supplied to the surface of the mask along the surface of the mask and filling each of the plurality of arrangement openings of the mask. In any one of Claims 1 thru | or 3, The several opening of the said mask contains several application opening for apply | coating a flux to the predetermined position of the surface of the said board | substrate,
The apparatus further comprises an application head that moves along the surface of the mask and applies a flux to a predetermined position on the surface of the substrate through the application opening. A mask having a plurality of openings, in a state where the mask and the substrate are aligned, and performing a process on the substrate through the mask;
A reference mark on the mask side,
A mask having an observation window for observing a reference mark on the substrate side provided on the substrate, the observation window provided at a position apart from the plurality of openings. In claim 5, the substrate is provided with a plurality of reference marks on the substrate side,
A plurality of the observation windows arranged at intervals corresponding to the reference marks on the plurality of substrates;
And a plurality of mask-side reference marks arranged in the vicinity of the plurality of observation windows.   7. The mask according to claim 5, wherein the plurality of openings of the mask include a plurality of arrangement openings for arranging conductive balls at predetermined positions on the surface of the substrate.   7. The mask according to claim 5, wherein the plurality of openings of the mask include a plurality of application openings for applying a flux to a predetermined position on the surface of the substrate. In a state in which a mask having a plurality of openings and a substrate are aligned, a process is performed on the substrate through the mask,
Observing a mask side reference mark provided on the mask with an observation camera;
Moving the moving stage on which the substrate is mounted to a position where a reference mark on the substrate side provided on the substrate can be seen through an observation window provided at a position away from the plurality of openings of the mask;
Observing the reference mark on the substrate side through the observation window with the observation camera;
Moving the moving stage to a processing position obtained from the reference mark on the mask side and the reference mark on the substrate side. In Claim 9, the plurality of openings of the mask include a plurality of application openings for applying a flux to a predetermined position on the surface of the substrate,
The method further comprising applying a flux to a predetermined position on the surface of the substrate through the application opening at the processing position. In Claim 9 or 10, the plurality of openings of the mask include a plurality of placement openings for placing conductive balls at predetermined positions on the surface of the substrate,
The method further comprises moving a plurality of conductive balls supplied to the surface of the mask along the surface of the mask and filling each of the plurality of placement openings of the mask at the processing position.

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