JP2000183404A - Light emitting element array and method and apparatus for bonding it - Google Patents

Abstract

PROBLEM TO BE SOLVED: To suppress the increase in temperature due to generation of heat by a light emitting element to prevent irregular luminance by temperature and emit light stably by bonding a plurality of light emitting elements on respective heat radiation submount members and then bonding the submount members at intervals on a substrate. SOLUTION: A light emitting element array 10 is made by bonding a plurality of LED chips 12 (light emitting elements) on respective heat radiation submount members 14 made of copper, etc., and then bonding the submount members 14 at specified intervals on a substrate 16. Each of the LED chips 12 has a lower electrode and an upper electrode, with the lower electrode fastened on the submount member 14 through silver paste which is a thermosetting conductive adhesive. The submount member 14 constitutes a non-light emitting section of the light emitting element and is provided on its upper face with a chucking section. The LED chip 12 constitutes a light emitting section of the light emitting element and has a gold wire 26 connected to its upper electrode. On the substrate 16, silver paste 28 is applied to bond each submount member 14.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a light emitting element array for bonding a light emitting element to a predetermined position on a substrate, and a bonding method and apparatus therefor.

[0002]

2. Description of the Related Art In general, a light emitting element array in which a plurality of LDs or LEDs are arranged is employed as a light source for reading or outputting (recording) an image. For example, FIG.
As shown in FIG. 7, the LED array 1 is configured by arranging a plurality of LED chips (light emitting elements) 3 on a substrate 2 at equal intervals in one direction. In addition, the LED chip 3
The gold wire 4 is led out from each LED chip 3 by being bonded onto the substrate 2 via a silver paste.

In this type of LED array 1, each LE chip is so arranged that the distance between the light emitting centers of the LED chips 3 is equal.
It is necessary to align the D chip 3 on the substrate 2 with high precision. For this reason, for example, an automatic diponder disclosed in JP-A-6-216170 is employed. In this conventional technique, a solid-state imaging device is moved between a semiconductor device and a work to which the semiconductor device is joined, and an upper solid-state imaging device captures a mark of a semiconductor device, while a lower solid-state imaging device marks a work mark. I'm shooting. Then
After the processing control unit calculates the relative positional relationship between the semiconductor element and the work, the bonding is performed by adjusting the relative positional relationship between the semiconductor element and the work based on the calculation result.

[0004]

SUMMARY OF THE INVENTION However, LEDs
In a chip, usually, a position shift occurs between the emission center and the center of the outer shape in many cases. For this reason, even if the alignment between the LED chip and the substrate is performed by aligning the alignment marks provided respectively, it is not possible to effectively cope with the variation in the emission center of the LED chip. is there.

[0005] In addition, the LED chip has a large variation particularly in its outer shape, and the LED chip is likely to shift when recognizing the center position of the outer shape. This allows
It is difficult to accurately position the emission center of each LED chip, and it has been pointed out that a high-precision LED array cannot be formed.

The present invention is intended to solve this kind of problem, and is not affected by variations in the light emission centers and outer shapes of the light emitting elements. It is an object of the present invention to provide a light emitting element array that can be easily positioned, and a bonding method and device therefor.

[0007]

In the light emitting element array according to the present invention, the light emitting element is bonded to a submount member, and the submount member is bonded to the substrate at predetermined intervals. Therefore, in particular, by using a material having excellent heat dissipation for the submount member, it is possible to suppress a temperature rise due to heat generation of the light emitting element, prevent luminance unevenness due to temperature, and allow the light emitting element to emit light stably. .

In the method and apparatus for bonding a light emitting element according to the present invention, before the bonding, the light emitting part of the light emitting element is caused to emit light in a state where the non-light emitting part of the light emitting element is held by the holding means. Recognize the emission center of Next, the light emitting element held by the holding means is positioned at the bonding position on the substrate based on the recognized coordinates of the light emission center.

Thus, the center of light emission can be reliably recognized for each light emitting element, and the center of light emission of the light emitting element can be determined on the substrate without being affected by the variation of the light emitting center or the variation of the outer shape. Position can be positioned with high accuracy. Therefore, the distance between the light emission centers of the respective light emitting elements can be positioned at equal intervals and with high accuracy, and a high quality light emitting element array can be efficiently manufactured.

In addition, since the center of light emission of the light emitting element is recognized in a state where the light emitting element is held by the holding means, it is possible to surely prevent the displacement when the light emitting element is held by the holding means. Can be reliably positioned at a desired position on the substrate.

Here, the light emitting portion is a light emitting chip, and the non-light emitting portion is a mount member joined to the light emitting chip. For this reason, the work of positioning the light emitting element can be easily performed by holding and holding the submount member by the holding means, for example. The light emitting element has a plurality of chips connected to each other. One chip is a light emitting portion, and the other chip is a non-light emitting portion. Therefore, the non-light emitting portion is held by the holding means, for example, by suction, whereby the light emitting element positioning operation is smoothly performed.

[0012]

FIG. 1 is a schematic perspective explanatory view of a light emitting element array 10 according to a first embodiment of the present invention. The light emitting element array 10 includes a plurality of LED chips (light emitting elements)
12, a plurality of submount members 14 bonded to each LED chip 12, and a plurality of the submount members 14
And a substrate 16 to be bonded at predetermined intervals.

As shown in FIG. 2, the LED chip 12
A lower electrode 18 and an upper electrode 20 are provided.
8 is fixed on the submount member 14 via a silver paste 22 which is a thermosetting conductive adhesive. The submount 14 is made of a material having excellent conductivity and heat dissipation, for example, a copper material.

The sub-mount member 14 constitutes a non-light-emitting portion of the light-emitting element, and has a suction portion 24a,
4b is provided. The LED chip 12 constitutes a light emitting portion of the light emitting element, and as shown in FIG.
0 is connected to a gold wire 26. On the substrate 16,
A silver paste 28 is provided for bonding each submount member 14.

FIG. 3 is a schematic perspective view of a bonding apparatus 30 for performing the method of bonding a light emitting element according to the embodiment of the present invention, and FIG. 4 is a side view of the bonding apparatus 30. Hereinafter, a part in which the LED chip 12 and the submount member 14 are joined is referred to as a chip unit 32.

The bonding apparatus 30 holds the sub-mount member 14 of the chip unit 32 and positions the chip unit 32 at a bonding position on the substrate 16 with light emitting element holding means 34. A probe 36, which is a light emitting unit for emitting light from the LED chip 12 of the chip unit 32 held by the holding unit 34, recognizes the light emission center of the LED chip 12, and recognizes the coordinates of the recognized light emission center. Imaging means 38 for

A platen 42 constituting the bonding apparatus 30
A moving mechanism 46 is provided on the upper surface 44 of the device. The moving mechanism 46 includes a first moving stage 50 that can move in the Y-axis direction of a rectangular coordinate system via a first motor 48, and a second motor 52
And a second moving stage 54 that can move in the X-axis direction of the orthogonal coordinate system with respect to the first moving stage 50 through the first moving stage 50.

The first moving stage 50 has a pair of guide rails 56a and 56b extending in the Y-axis direction,
A ball screw 58 disposed between the guide rails 56a and 56b and extending in the Y-axis direction. An output shaft of the first motor 48 is connected to one end of the ball screw 58.
A nut member (not shown) provided on the Y-axis movable table 60 is screwed to the ball screw 58, and the Y-axis movable table 60 is supported by guide rails 56a and 56b.

The Y-axis movable table 60 is configured to be long in the X-axis direction.
A pair of guide rails 6 constituting the second moving stage 54
2a and 62b and a ball screw 64 arranged between the guide rails 62a and 62b are arranged to extend in the X-axis direction. The output shaft of the second motor 52 is connected to one end of the ball screw 64, and the ball screw 64 is screwed to a nut member (not shown) provided on the X-axis movable table 66.

On an upper surface 68 of the X-axis movable table 66, a chip placement table 72 on which a plurality of chip units 32 are placed.
And a θ stage 74 for correcting the rotational position for each chip unit 32 and a substrate suction table 76 for suction holding the substrate 16. stage 74 is provided with a rotary table 78 rotatable around the Z axis via an actuator (not shown).

A column 80 is provided upright on one end of the surface plate 42. The column 80 is provided with a third moving stage 82 capable of moving the light-emitting element holding means 34 incorporating the probe 36 in the Z-axis direction. In the third moving stage 82,
A frame 84 fixed to the vertical surface of the column 80 is provided, and a third motor 86 is fixed to the upper end of the frame 84. A ball screw 88 connected to the output shaft of the third motor 86 has a Z-axis direction. And engages with the elevating table 90.

The light emitting element holding means 34 is mounted on the elevating table 90 via a pressing means 92. As shown in FIG.
The light emitting element holding means 34 includes a collet member 94, and a ceramic member 96 is provided on the tip side of the collet member 94. The collet member 94 is provided with an ultra-hard conductive coating, and a suction port 98 is formed at the tip thereof. The suction port 98 is connected to a negative pressure source (not shown) through a suction passage 100. Communicating. Ceramic member 96
Similarly, a suction port 102 is provided at the end of the suction port 102, and the suction port 102 communicates with a negative pressure source (not shown) via a suction passage 104.

The probe 36 is supported through the ceramic member 96, and the probe 36 is mounted on the ceramic member 96 via a spring 106 so as to be able to move forward and backward. The tip 36a of the probe 36 is L
The collet member 94 contacts the sub-mount member 14 and is connected to the plus electrode while the upper electrode 20 of the ED chip 12 is in contact with the minus electrode.

As shown in FIG. 3, the column 80 is provided with an arm 110 constituting the imaging means 38. CCD cameras 112 and 114 are provided at the tip of the arm 110 in the Z-axis direction and the X-axis direction, respectively. It is mounted facing.
A bifocal optical system 116 is provided on the optical axes of the CCD cameras 112 and 114. CC on the side of surface plate 42
Images taken by the D cameras 112 and 114 are input, and an image processing unit 118 for performing image processing and recognizing the coordinates of the light emission center of the LED chip 12 is provided in parallel.

The bonding apparatus 3 configured as described above
The operation of 0 will be described below with reference to the flowcharts shown in FIGS.

First, as shown in FIG. 2, the LED chip 1 is placed on the upper surface of the submount member 14 with a silver paste 22 interposed therebetween.
The chip unit 32 is formed in advance by fixing 2. And this chip unit 32
A plurality of chips are arranged on the chip placement table 72 (see FIG. 3). On the other hand, the substrate 16 is set on the substrate suction table 76. The substrate 16 is positioned so that an edge in the X-axis direction is aligned with a station reference plane (not shown), and is sucked from a suction hole (not shown) provided in the substrate suction table 76 so as to be positioned on the substrate suction table 76. Is held by suction.

Then, the moving mechanism 46 is driven, and the chip placement table 72 is placed at the position corresponding to the camera center of the image pickup means 38, that is, at the chip take-out position (step S1). In the moving mechanism 46, by driving the first motor 48, the Y-axis movable table 60 moves in the Y-axis direction under the rotation of the ball screw 58, and
The X-axis movable table 66 moves in the X-axis direction by rotating the ball screw 64 under the driving action of the motor 52. Accordingly, by controlling the driving of the first and second motors 48 and 52, the chip unit 32 arranged at a predetermined position of the chip placement table 72 is arranged corresponding to the chip take-out position.

Next, a predetermined LED chip 12 on the chip placement table 72 is imaged via the CCD camera 112 constituting the image pickup means 38 (step S).
2). LED chip 1 imaged by CCD camera 112
The image signal of No. 2 is sent to the image processing unit 118 and subjected to image processing, the center of the outer shape of the LED chip 12 is recognized, and the correction amount (△ X and △ Y) of the LED chip 12 is calculated ( Step S3).

The correction amount obtained from the image signal is compared with a preset reference value (step S4). If it is determined that the correction amount is larger than the reference value, the process proceeds to step S5. The movement correction corresponding to the correction amount is performed. Specifically, the movement of the correction amount ΔY is performed via the first motor 48, and the movement of the correction amount ΔX is performed via the second motor 52.

On the other hand, if it is determined in step S4 that the correction amount is equal to or less than the reference value, the process proceeds to step S6, where the collet member 94 holds the chip unit 32 by suction. That is, the lifting platform 90 is lowered by the action of the third motor 86, and the collet member 94 provided on the lifting platform 90 contacts the positioned chip unit 32 (see FIG. 8).

More specifically, as shown in FIG. 5, a suction port 98 provided on the distal end side of the collet member 94 is disposed in the suction section 24a of the submount member 14, while a suction port 98 of the ceramic member 96 is provided. The sub-mount member 14 is disposed on the suction portion 24b of the sub-mount member 14, and the sub-mount member 14 is sucked through the suction passages 100 and 104 under the action of a negative pressure source (not shown). Further, when the third motor 86 rotates in the opposite direction to the above, and the elevating table 90 moves upward, the chip unit 32 moves up integrally with the collet member 94 (see FIG. 9).

Then, under the driving action of the moving mechanism 46, θ
After the stage 74 has been moved to the camera center of the imaging means 38 (see step S7 and FIG. 10), the collet member 94 descends integrally with the elevator 90. Therefore, the chip unit 32 sucked and held by the collet member 94
Is transferred onto a rotary table 78 constituting the θ stage 74 (step S8). After releasing the suction of the chip unit 32, the collet member 94 rises integrally with the elevating table 90, while the LED chip 12 on the rotary table 78 is moved by the CCD camera 112 constituting the imaging means 38.
Is imaged (step S9).

The photographed image of the LED chip 12 is subjected to image processing by the image processing section 118, and the outer edge of the LED chip 12 is recognized, and the correction amount Δθ is calculated (step S10). This correction amount △ θ is compared with a preset reference value (step S11), and if it is determined that the correction amount △ θ is larger than the reference value, the process proceeds to step S12, where the correction amount △ θ corresponds to the correction amount △ θ. Then, the rotation of the turntable 78 is corrected.

After the correction in the θ stage 74 is completed, the collet member 94 is lowered integrally with the lift table 90 under the action of the third motor 86 (step S13), and the collet member 9 is moved.
4 is a submount member 1 constituting the chip unit 32
4 is held by suction (step S14). The collet member 94 rises integrally with the elevating table 90 in a state where the chip unit 32 is suction-held, while the driving mechanism of the moving mechanism 46 moves the collet member 94 on the substrate 16 suction-held by the substrate suction table 76. The bonding position is arranged corresponding to the camera center of the imaging means 38 (step S15 and FIG.
1).

Next, under the action of the third motor 86, the lift 9
0, the collet member 94 is lowered, and the space between the chip unit 32 and the substrate 16 sucked and held by the collet member 94 is lowered to, for example, a position at which the distance becomes 100 μm (step S16). In this case, as shown in FIG. 5, the tip 36a of the probe 36 contacts the upper electrode 20 of the LED chip 12 in a state where the submount member 14 of the chip unit 32 is suction-held by the collet member 94 and the ceramic member 96. ing.

Then, when the probe 36 is connected to the minus electrode and the collet member 94 is connected to the plus electrode to supply a current to the probe 36, LE
The D chip 12 emits light (step S17). that time,
As shown in FIG. 12, a CCD camera 112 constituting the imaging means 38 captures an image of the light emission center of the LED chip 12, and a video signal of the CCD camera 112 is transmitted to an image processing section 118.
And the light emission center point L is recognized (see FIG. 13).
The light emission center point L is set at the center of the LED light emission area, that is, at the intersection of two diagonal lines.

The image processing unit 118 calculates a correction amount (ΔX, ΔY) based on the positional deviation amount between the recognized light emission center point L and the bonding center (camera center) (step S20). Then, the process proceeds to step S21, and if it is determined that the correction amount is larger than the preset reference value, the process proceeds to step S22, where the bonding position on the substrate 16 is corrected, and the probe power is turned off ( In step S23, the chip unit 32 is bonded onto the substrate 16 (step S24 and FIG. 1).
4). On the other hand, in step S21, the correction amount ({X, △
If Y) is determined to be less than or equal to the reference value, step S2
From 3, the process proceeds to step S 24, where the chip unit 32 is bonded onto the substrate 16.

Steps S6 to S14 are performed for the next chip unit 32 placed on the chip placement table 72 in the same manner as described above. Then, in step S15, after the substrate suction table 76 is moved in the X-axis direction at a constant pitch so that the distance from the chip unit 32 placed last time becomes a predetermined value, a new bonding position on the substrate 16 is set. Is set. Further, by sequentially performing the processes after step S16, the next chip unit 32 becomes the chip unit 3 placed on the substrate 16 last time.
Bonding is performed in such a manner that the pitch between the light emission center points 2 and the light emission center points L is constant.

Similarly, a predetermined number of chip units 32
Are sequentially bonded on the substrate 16 so that the pitch between the light emission center points L is constant. Next, after a predetermined number of chip units 32 are aligned on the substrate 16, in another step, the silver paste 28 is heated and cured using, for example, an electric oven.

In this case, in the first embodiment, before bonding the chip unit 32 on the substrate 16, the LED chips 12 constituting the chip unit 32 emit light via the probe 36, and The emission center is imaged. Then, the coordinates of the light emission center point L of the LED chip 12 are recognized (calculated), and this light emission center point L
The chip unit 32 is positioned at a bonding position on the substrate 16 by calculating a correction amount which is a deviation amount of the chip unit 32.

Therefore, the light emission center point L can be reliably and accurately positioned at a predetermined position on the substrate 16 without being affected by variations in the outer shape of the LED chip 12 and a positional shift of the light emission center point L. Can be positioned. As a result, a high-precision light-emitting element array 10 in which a plurality of chip units 32 are bonded to each other is obtained by positioning the intervals between the light-emitting center points L on the substrate 16 at a constant pitch. Therefore, the effect that the writing accuracy and the reading accuracy by the light emitting element array 10 are greatly improved can be obtained.

Further, in the first embodiment, a chip unit 32 in which the LED chip 12 as a light emitting portion and the submount member 14 as a non-light emitting portion are used.
Then, it is possible to cause the LED 36 to emit light by the probe 36 in a state where the sub-mount member 14 is sucked and held by the collet member 94 and the ceramic member 96. As a result, while the chip unit 32 is suction-held by the collet member 94 and the ceramic member 96,
It is possible to correct the position of the light emission center point L of the LED chip 12, and it is possible to reliably prevent the displacement when the chip unit 32 is sucked by the collet member 94 and the ceramic member 96. .

Further, the chip unit 32 is
The submount 14 is bonded to the D chip 12 and the submount 14 is bonded to the substrate 16. For this reason, by using a material having good heat dissipation properties, for example, a copper material, for the submount member 14, it is possible to effectively suppress a temperature rise due to heat generation of the LED chip 12, and stabilize light emission of the LED chip 12. It becomes possible to do.

FIG. 15 is an explanatory perspective view of an LED chip 12a constituting a light emitting element array according to a second embodiment of the present invention. In the second embodiment, a submount member is not required, and the LED chip 12a itself has a suction portion (lower electrode of a non-light emitting portion) 18. Thus, light emission and bonding can be performed in a state where the LED chip 12a is sucked by the collet member 94, similarly to the first embodiment, without using a submount member.

FIG. 16 is an explanatory perspective view of a chip unit 130 constituting a light emitting element array according to the third embodiment of the present invention. The chip unit 130 is configured as a triple chip, and integrally includes collet suction LED chips (non-light emitting portions) 132a and 132b and a light emitting LED chip (light emitting portion) 134.

In the chip unit 130, while one light emitting LED chip 134 emits light, the other collet sucking LED chips 132a and 132b are sucked and held without emitting light. Therefore, by using the chip unit 130, the bonding apparatus 30 shown in FIG.
Then, at the θ stage 74, the LED chip 1 for collet suction
In a state where 32a and 132b are adsorbed by the collet member 94 and the like, the light emitting LED chip 13 is
4 can emit light. Accordingly, there is an effect that the occurrence of a positional shift when the chip unit 130 is sucked by the collet member 94 or the like can be reliably prevented.

In the first to third embodiments of the present invention, the LED chips 12, 12a, 132
Although a, 132b, and 134 are used, the present invention is not limited to the LED, but is applicable to bonding of all microchip arrays in which the position accuracy of the emission center is a problem. Further, the chip unit 130 employs a triple chip structure, but may employ a double chip structure or a four or more chip structure.

[0048]

In the light emitting element array according to the present invention, a submount member is bonded to each light emitting element, and the submount members are bonded to the substrate at predetermined intervals. The light emitting element can emit light in a state where is held by the holding member. Further, by using a material having good heat dissipation for the submount member, it becomes possible to suppress a temperature rise of the light emitting element and perform stable light emission.

In the method and the apparatus for bonding a light emitting element according to the present invention, the light emitting element is caused to emit light before bonding, the center of the light emission is recognized, and the position of the light emitting element and the substrate is determined based on the coordinates of the light emission center. The adjustment is performed with high precision. Therefore, the light emission center of each light emitting element can be easily and accurately positioned at a predetermined position on the substrate without being affected by variations in external dimensions. Moreover, it is possible to cause the light emitting portion of the light emitting element to emit light in a state where the non-light emitting portion of the light emitting element is held by the holding means, and it is effective to cause a positional shift or the like when holding the light emitting element by the holding means. Is blocked.

[Brief description of the drawings]

FIG. 1 is a schematic perspective explanatory view of a light emitting element array according to a first embodiment of the present invention.

FIG. 2 is an explanatory perspective view of a chip unit constituting the light emitting element array.

FIG. 3 is a schematic perspective explanatory view of a bonding apparatus for performing the light emitting element bonding method according to the first embodiment of the present invention.

FIG. 4 is an explanatory side view of the bonding apparatus.

FIG. 5 is a vertical sectional view of a main part of a component holding means constituting the bonding apparatus.

FIG. 6 is a first part of a flowchart illustrating the bonding method.

FIG. 7 is a latter part of the flowchart.

FIG. 8 is an explanatory front view when positioning the chip mounting table.

FIG. 9 is an explanatory front view when the chip unit is taken out from the chip mounting table.

FIG. 10 is an explanatory front view when positioning the θ stage.

FIG. 11 is an explanatory front view when positioning the substrate suction table.

FIG. 12 is an explanatory diagram of an imaging screen when an LED chip emits light.

FIG. 13 is an explanatory diagram of a recognition screen of a light emission center point of the LED chip.

FIG. 14 is an explanatory front view when the chip unit is bonded on a substrate.

FIG. 15 is an explanatory perspective view of an LED chip constituting a light emitting element array according to a second embodiment of the present invention.

FIG. 16 is an explanatory perspective view of a chip unit constituting a light emitting element array according to a third embodiment of the present invention.

FIG. 17 is an explanatory perspective view of a normal LED array.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 10 ... Light emitting element array 12, 12a, 132a, 132b, 134 ... LED chip 14 ... Submount member 16 ... Substrate 18 ... Lower electrode 20 ... Upper electrode 32, 130 ... Chip unit 30 ... Bonding device 36 ... Probe 38 ... Imaging means 46 moving mechanism 50, 54, 82 ...
Moving stage 60 ... Y-axis movable table 66 ... X-axis movable table 72 ... Chip placement table 74 ... θ stage 76 ... Substrate suction table 78 ... Rotating table 90 ... Elevating table 94 ... Collet member 96 ... Ceramic member 98, 102 ... Suction port 106: Spring 112, 114: C
CD camera 116: bifocal optical system

 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Satoshi Mino 210 Fuji Naka Photo Film Co., Ltd., Fuji Photo Film Co., Ltd. (Reference) 5F041 AA38 AA39 DA02 DA06 DA13 DA20 DA91 DB07 5F047 AA19 CA08 FA15 FA16 FA73

Claims (7)

[Claims] 1. A light emitting device comprising: a plurality of light emitting elements; a plurality of submount members joined to each light emitting element; and a substrate to which the plurality of submount members are bonded at predetermined intervals. Light emitting element array. 2. A light emitting element bonding method for bonding a light emitting element to a predetermined position on a substrate, wherein the non-light emitting portion of the light emitting element is held by holding means before bonding. A step of recognizing a light emission center of the light emitting element by causing the light emitting portion to emit light; and bonding the light emitting element held by the holding means on the substrate based on the coordinates of the recognized light emission center. A method for bonding a light emitting device, comprising: positioning the light emitting device on a position; and bonding the light emitting device on the substrate. 3. The bonding method according to claim 2, wherein said light emitting portion is a light emitting chip, and said non-light emitting portion is a submount member joined to said light emitting chip. . 4. The bonding method according to claim 2, wherein the light emitting element is formed by connecting a plurality of chips, and one of the chips is used as the light emitting unit, and the other chip holds the light emitting element. A method for bonding a light emitting element, wherein the non-light emitting portion is used as the light emitting element. 5. A bonding apparatus for a light emitting element for bonding a light emitting element to a predetermined position on a substrate, the apparatus holding a non-light emitting portion of the light emitting element, and bonding the light emitting element to a bonding position on the substrate. A light emitting element holding means for positioning the light emitting element; a light emitting means for causing a light emitting portion of the light emitting element held by the light emitting element holding means to emit light before bonding; An image pickup means for image-recognizing the coordinates of the light-emitting center thus obtained. 6. The bonding apparatus according to claim 5, wherein said light emitting portion is a light emitting chip, and said non-light emitting portion is a submount member joined to said light emitting chip. . 7. The bonding apparatus according to claim 5, wherein the light emitting element is connected to a plurality of chips, and one of the chips is used as the light emitting unit, and the other chip holds the light emitting element. A bonding device for a light-emitting element, wherein the non-light-emitting portion is a non-light-emitting portion.