WO2014069132A1 - Solder ball, agglomeration limiting device, and agglomeration limiting method - Google Patents
Solder ball, agglomeration limiting device, and agglomeration limiting method Download PDFInfo
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- WO2014069132A1 WO2014069132A1 PCT/JP2013/076307 JP2013076307W WO2014069132A1 WO 2014069132 A1 WO2014069132 A1 WO 2014069132A1 JP 2013076307 W JP2013076307 W JP 2013076307W WO 2014069132 A1 WO2014069132 A1 WO 2014069132A1
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- solder balls
- solder
- aggregation
- ball
- agglomeration
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
- B22F3/003—Apparatus, e.g. furnaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
- B23K1/0016—Brazing of electronic components
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/06—Solder feeding devices; Solder melting pans
- B23K3/0607—Solder feeding devices
- B23K3/0623—Solder feeding devices for shaped solder piece feeding, e.g. preforms, bumps, balls, pellets, droplets
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/08—Auxiliary devices therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
- B23K35/0244—Powders, particles or spheres; Preforms made therefrom
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C13/00—Alloys based on tin
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C13/00—Alloys based on tin
- C22C13/02—Alloys based on tin with antimony or bismuth as the next major constituent
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/10—Bump connectors ; Manufacturing methods related thereto
- H01L24/11—Manufacturing methods
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
- H01L24/742—Apparatus for manufacturing bump connectors
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
- B22F1/05—Metallic powder characterised by the size or surface area of the particles
- B22F1/052—Metallic powder characterised by the size or surface area of the particles characterised by a mixture of particles of different sizes or by the particle size distribution
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F2201/00—Treatment under specific atmosphere
- B22F2201/05—Water or water vapour
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F2203/00—Controlling
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/42—Printed circuits
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/11—Manufacturing methods
- H01L2224/113—Manufacturing methods by local deposition of the material of the bump connector
- H01L2224/1133—Manufacturing methods by local deposition of the material of the bump connector in solid form
- H01L2224/11332—Manufacturing methods by local deposition of the material of the bump connector in solid form using a powder
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
- H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
- H01L2224/13001—Core members of the bump connector
- H01L2224/13099—Material
- H01L2224/131—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
- H01L2224/13101—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of less than 400°C
- H01L2224/13111—Tin [Sn] as principal constituent
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/10—Bump connectors ; Manufacturing methods related thereto
- H01L24/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
- H01L24/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
Definitions
- the present invention relates to a solder ball, an aggregation suppression device, and an aggregation suppression method, and is suitable for application to a small solder ball having a diameter of 10 to 60 [ ⁇ m], for example.
- solder balls that have aggregated during the granulation process are difficult to disperse into individual solder balls, even if, for example, ultrasonic waves are applied or vibration is applied by a parts feeder or the like. This causes a problem that it cannot be used as a mounting material. Therefore, conventionally, as a method of preventing such agglomeration of solder balls, a method of preventing agglomeration of solder balls by using a dispersant in the granulation step and coating the surface of each solder ball with a dispersant. It was common to use (for example, refer patent document 2).
- an object of the present invention is to provide a solder ball capable of suppressing aggregation without using a dispersant, and without using a dispersant.
- An object of the present invention is to provide a coagulation inhibitor and a coagulation inhibition method that can inhibit the coagulation.
- the solder ball according to claim 1 of the present invention is a solder ball made of any Sn-based alloy of Sn-Ag-Cu, Sn-Bi, Sn-Ag, Sn-Cu, and Sn-Zn.
- the average particle size is 100 [ ⁇ m] or less and is controlled in an atmosphere whose humidity is adjusted so that aggregation is suppressed.
- the solder ball according to claim 2 of the present invention is characterized in that, in claim 1, the relative humidity is 20 [% RH] or less.
- solder ball according to claim 3 of the present invention is characterized in that, in claim 1 or 2, the ball surface is exposed to the outside without being coated with a dispersant that suppresses aggregation.
- the aggregation suppressing device is a Sn-Ag-Cu system, a Sn-Bi system, a Sn-Ag system, a Sn-Cu system, a Sn-Zn system, any Sn group alloy,
- An agglomeration suppression apparatus installed in either a manufacturing apparatus for producing solder balls having an average particle size of 100 [ ⁇ m] or less, or a mounting apparatus for mounting the solder balls on a semiconductor device, the manufacturing apparatus or the mounting Humidity adjustment means for adjusting the humidity of a work space for managing the solder balls of the apparatus and suppressing aggregation of the solder balls is provided.
- the aggregation suppressing apparatus is characterized in that, in claim 4, the humidity adjusting means sets the working space to a relative humidity of 20 [% RH] or less.
- the aggregation suppressing method according to claim 6 of the present invention is a Sn-Ag-Cu system, a Sn-Bi system, a Sn-Ag system, a Sn-Cu system, a Sn-Zn system, any Sn group alloy, At least one of a manufacturing apparatus for manufacturing a solder ball having an average particle size of 100 [ ⁇ m] or less and a mounting apparatus for mounting the solder ball on a semiconductor device, a working space for managing the solder ball is controlled by humidity adjusting means. The humidity is adjusted to suppress aggregation of the solder balls.
- solder ball of the present invention it is possible to provide a solder ball in which agglomeration is suppressed without using a dispersant by being managed in an atmosphere in which the relative humidity is adjusted even if the particle size is small. obtain. Further, according to the aggregation suppressing device and the aggregation suppressing method of the present invention, even a small solder ball that easily aggregates can be suppressed without using a dispersant.
- the present invention is, for example, a fine solder having an average particle size of 100 [ ⁇ m] or less, preferably applied to a flip chip mounting or TSV (Through-Silicon Via: Si through electrode) structure.
- TSV Three-Silicon Via: Si through electrode
- the humidity of the work space where the solder balls are handled in each process from granulation of the solder balls to mounting of the solder balls on the TSV device is adjusted, and the solder balls are placed under an atmosphere with a relative humidity of 20% or less. It is characterized in that it is managed.
- the average particle diameter of the solder balls is, for example, that the solder balls are observed with an optical microscope, and the individual particle diameters are measured.
- the average value of the particle diameters of about 100 to 200 solder balls is defined as the average particle diameter. To do.
- solder balls of the present invention are Sn-Ag-Cu-based, Sn-Bi-based, Sn-Ag-based, Sn-Cu-based, Sn-Zn-based Sn-based alloys (Sn content is 40% or more). Is preferable).
- this type of solder ball has the property of being easily agglomerated in normal outside air by being miniaturized, in the present invention, the relative humidity is reduced from the outside air in each step from manufacture to mounting of the solder ball. By managing the solder balls in an atmosphere, the dispersed state can be maintained by suppressing the aggregation of the solder balls.
- the relative humidity that can suppress the agglomeration of solder balls is 20 [% RH] or less, preferably 15 [% RH] or less. Aggregation can be suppressed by placing the solder ball in an atmosphere in which the relative humidity is kept at 20% RH or less continuously from granulation to mounting. When the relative humidity is 15 [% RH] or less, aggregation can be reliably suppressed even with a small solder ball having an average particle diameter of 40 [ ⁇ m] or less. On the other hand, when the relative humidity exceeds 20 [% RH], the solder balls gradually aggregate, and a plurality of solder balls stick together to increase the aggregate, and the solder balls easily adhere to peripheral members. Become.
- FIG. 1 schematically shows a series of steps from granulation to mounting for a fine solder ball having an average particle diameter of 10 to 60 [ ⁇ m] used for TSV, for example.
- An example is shown in which a small solder ball is manufactured using the apparatus 1, and a trader mounts the solder ball on a TSV device using the mounting apparatus 18.
- the manufacturing apparatus 1 is classified by the granulating apparatus 3 for granulating the fine solder balls, the classifying apparatus 4 for classifying the solder balls granulated by the granulating apparatus 3, and the classifying apparatus 4.
- a packing device 5 that encloses the solder balls in a container and packs them in a box, and the classifying device 4 is provided with a ball removing device 11 and an irregular shape removing device 12.
- the manufacturing apparatus 1 includes conveying devices 14a and 14b between the granulating device 3 and the ball removing device 11, between the ball removing device 11 and the irregular shape removing device 12, and between the irregular shape removing device 12 and the packing device 5.
- 14c, and the apparatuses are connected by transfer apparatuses 14a, 14b, 14c.
- the conveying device 14a conveys the solder balls granulated by the granulating device 3 to the ball removing device 11 in the next process
- the conveying device 14b performs the solder balls selected by the ball removing device 11 next. It can be conveyed to the process irregularity removing device 12.
- the transfer device 14c can transfer the solder ball, which is obtained by removing the defective shape with the deformed ball shape by the deformed shape removing device 12, to the packing device 5 in the next process.
- the manufacturing apparatus 1 includes an agglomeration suppressing device 7 in each of the granulating device 3, the ball removing device 11, and the deformed shape removing device 12, and the packing device 5 also includes an agglomeration suppressing device 8.
- the working space for handling the solder balls in each device can be adjusted to a relative humidity of 20% or less by the aggregation suppression devices 7 and 8.
- the manufacturing apparatus 1 by managing the solder balls in an atmosphere having a relative humidity of 20 [% RH] or less by the aggregation suppression apparatuses 7 and 8 in each apparatus, the solder balls are not removed during the work processing performed in each apparatus. The dispersed state can be maintained without agglomeration.
- the granulating apparatus 3 granulates a small solder ball by, for example, a wire cut method, a UDS (Uniform Droplet Spray method), or an atomizing method (paste powder only), and an agglomeration suppressing device 7 has a relative humidity of 20 [% RH]
- the solder ball can be managed under the following atmosphere.
- the coagulation suppression device 7 includes, for example, a box-like box (not shown) that isolates the work space for handling solder balls from the outside air, and a gas such as dry air, argon, nitrogen, and helium in the box that becomes the work space. And humidity adjusting means (not shown) for adjusting the relative humidity in the box.
- the humidity adjusting means for supplying the gas into the box and adjusting the relative humidity in the box is applied as the humidity adjusting means.
- a humidity adjusting unit that adjusts the relative humidity in the box by evacuating the inside of the box with a vacuum pump may be applied.
- the granulating device 3 manages the granulated solder balls in an atmosphere having a relative humidity of 20 [% RH] or less by the aggregation suppressing device 7, and suppresses the aggregation of the solder balls and keeps them dispersed. Can be conveyed to the classification device 4 in the next step.
- the conveyance devices 14a, 14b, and 14c are also provided with the aggregation suppressing device 13, and the box (not shown) of the aggregation suppression device 13 isolates the conveyance space in which the solder balls are conveyed from the outside air, and the humidity.
- the adjusting means 15 can adjust the humidity in the box.
- the transfer device 14a can transfer the solder balls from the granulating device 3 to the classifying device 4 by a transfer mechanism (not shown).
- the humidity adjusting means 15 of the aggregation suppressing device 13 sets the transfer space of the solder balls to a relative humidity of 20 [% RH] or less can be adjusted.
- the solder balls are managed in an atmosphere with a relative humidity of 20 [% RH] or less, and the solder balls are kept in a dispersed state while suppressing the aggregation of the solder balls. It can be transported up to 4.
- the classifier 4 removes the solder balls having a large particle diameter and the solder balls having a small particle diameter from the ball group granulated by the granulator 3 by the ball removing apparatus 11, for example, an average particle diameter of 35 [ ⁇ m] Only small solder balls of a certain degree can be extracted.
- the ball removing device 11 is provided with a vibrating sieve mechanism having a mesh portion in which openings are formed in a mesh shape, for example, and by vibrating the mesh portion into which the ball group is inserted, the opening of the mesh portion is provided.
- a classification method that classifies the ball group by dropping only the solder balls having a particle size smaller than the area and leaving the solder balls having a particle size larger than the opening area of the mesh in the mesh portion. Only the solder balls can be extracted.
- solder balls are aggregated in the ball removing device 11, the solder balls are aggregated even though a small solder ball having a small particle diameter is granulated at the time of granulation, for example, 35 Aggregates of [ ⁇ m] or more are generated, or solder balls are likely to adhere to the mesh portion, and the number of solder balls remaining on the mesh portion without dropping from the mesh portion increases, and fine solder balls are classified. The problem of not being possible arises.
- the aggregation suppressing device 7 of the present invention adjusts the working space (in the box) where solder ball classification is performed in the ball removing device 11 to a relative humidity of 20 [% RH] or less, so Aggregation can be suppressed, the formation of aggregates can be prevented, and adhesion of solder balls to peripheral members (for example, mesh portions) can be prevented.
- the agglomeration suppressing device 7 can remove the solder balls having a large particle size during granulation or the solder balls having a small particle size by the ball removing device 11, and only the solder balls having a desired particle size can be surely obtained. Can be extracted.
- the classifying device 4 conveys the ball group of minute solder balls extracted by the ball removing device 11 to the deformed shape removing device 12 via the conveying device 14b, and the shape included in the ball group by the deformed shape removing device 12 Defective products can be removed.
- a solder ball with a true spherical shape is used as a good solder ball
- a solder ball with a deformed non-spherical ball shape is used as a defective product
- only the defective product is removed by the irregular shape removing device 12. It is made to be able to do.
- the irregular shape removing device 12 removes defective products whose ball shape has become irregular due to, for example, the difference in rolling behavior caused by the ball shape of the solder ball, and the non-defective solder ball is added to the packaging device 5 in the next process. Can only carry.
- the agglomeration suppressing device 7 of the present invention suppresses the agglomeration of the solder balls by adjusting the humidity of the work space (in the box) in which the defective shape removing device 12 performs the removal operation of the defective shape product.
- the solder balls are made easy to roll so that only defective products whose shape is deformed during granulation can be removed.
- the transport device 14b installed between the ball removing device 11 and the deformed shape removing device 12 also uses a transport mechanism (not shown) for the ball group that has been classified by the ball removing device 11. )),
- the solder balls are managed in an atmosphere having a relative humidity of 20 [% RH] or less by the humidity adjusting means 15 so as to suppress the aggregation of the solder balls.
- the packing device 5 in the next process encloses a group of non-defective solder balls from which defective shapes are removed together with a desiccant such as silica gel in a container, and a plurality of containers enclosing the solder balls are, for example, cardboard or the like. It can be packed in a box.
- the agglomeration suppressing device 8 of the present invention uses the humidity adjusting means (not shown) to evacuate the working space (in the box) in which the solder balls are enclosed in the container in the packing device 5 to reduce the relative humidity in the container. Adjustable to 20 [% RH] or less.
- the packing device 5 manages the solder balls in an atmosphere having a relative humidity of 20 [% RH] or less by the aggregation suppressing device 8 so that the solder balls are sealed in the container while suppressing the aggregation of the solder balls. Can do.
- the inside of the container is adjusted to a relative humidity of 20 [% RH] or less by evacuating the working space (inside the box) in which the solder balls are enclosed in the container by humidity adjusting means (not shown).
- the packaging device 5 may supply gas into the box by the humidity adjusting means to adjust the relative humidity in the box to 20 [% RH] or less. Good.
- the container in which the solder ball is sealed is configured so that an airtight space can be formed by the cap and the container part, and the solder ball is inserted into the container part from the opening of the container part in the box evacuated.
- the desiccant is put in, and the opening of the container portion having a relative humidity of 20 [% RH] or less can be sealed with a cap.
- the container is kept in an atmosphere with a relative humidity of 20 [% RH] or less and the solder ball can be managed at a relative humidity of 20 [% RH] or less.
- a container after a container is packed in a box, it can be transported by a truck or the like to, for example, a mounting apparatus 18 of a business partner at a different place.
- the transfer device 14c between the deformed shape removing device 12 and the packing device 5 uses a transfer mechanism (not shown) as a ball group that has been subjected to the removal of defective products by the deformed shape removing device 12.
- the transport space can be adjusted to a relative humidity of 20 [% RH] or less by the humidity adjusting means 15 as described above.
- the humidity adjusting means 15 As a result, even in the transport device 14c, when the solder balls are transported to the packaging device 5 in the next process, the solder balls can be managed in an atmosphere with a relative humidity of 20 [% RH] or less so that aggregation of the solder balls can be suppressed. Has been made.
- the mounting device 18 includes, for example, solder ball mounting means (not shown). When the cap is removed from the container portion and the solder balls in the container portion are put into the solder ball mounting means, the solder ball mounting means Solder balls are mounted on each electrode of the TSV device.
- the agglomeration of the solder balls is suppressed in the manufacturing device 1, which is important.
- the solder balls agglomerate, resulting in a problem that individual solder balls cannot be mounted on each electrode of the TSV device.
- the aggregation suppressing device 7 of the present invention is configured such that the working space (in the box) for mounting the solder ball on the TSV device in the mounting device 18 can be adjusted to a relative humidity of 20 [% RH] or less.
- the mounting device 18 can manage the solder balls in an atmosphere having a relative humidity of 20 [% RH] or less by the aggregation suppressing device 7, thereby preventing the solder balls from aggregating.
- the mounting means ensures that individual solder balls can be mounted on the electrodes of the TSV device.
- the granulation apparatus 3, the classification apparatus 4 and the packing apparatus 5 are provided with the aggregation suppression devices 7 and 8, and the work space where the granulation work, classification work, and packing work are performed is suppressed.
- the humidity was adjusted by the devices 7 and 8, and the solder balls were managed in an atmosphere having a relative humidity of 20 [% RH] or less in each device.
- granulation work, classification work, and packing work can be performed in a state where the solder balls are dispersed without agglomerating fine solder balls from granulation to packing.
- the aggregation devices 13 are also provided in the conveying devices 14a, 14b, and 14c provided between the devices, and between the granulating device 3 and the classifying device 4, between the classifying device 4 and the packing device 5.
- the humidity is adjusted by the humidity adjusting means 15 of the aggregation suppressing device 13, and the solder balls are managed between the devices in an atmosphere having a relative humidity of 20 [% RH] or less.
- the mounting device 18 is also provided with an agglomeration suppression device 7 so that the working space in which the mounting operation is performed is adjusted in humidity by the aggregation suppression device 7 so that the solder balls are managed in an atmosphere with a relative humidity of 20 [% RH] or less. I made it.
- the mounting device 18 can suppress the agglomeration of minute solder balls and maintain the dispersed state of the solder balls, thus ensuring that each minute solder ball is placed in a desired position of the TSV device. Can be implemented.
- the solder balls are managed in an atmosphere having a relative humidity of 20 [% RH] or less by the aggregation suppressing devices 7 and 15, so that the solder balls are likely to aggregate in the outside air. Also, it is possible to provide a solder ball capable of suppressing aggregation without using a dispersant.
- the solder balls according to the present invention can be controlled in an atmosphere having a relative humidity of 20 [% RH] or less, so that aggregation can be suppressed without using a dispersant, thereby preventing contamination of the ball surface with the dispersant.
- the bonding property does not deteriorate as in the case of using the dispersing agent, the semiconductor chips can be reliably bonded to each other, and a TSV device (semiconductor device) excellent in bonding property can be manufactured.
- a granulation process for granulating a solder ball, a solder ball A granulator that can suppress the aggregation of small solder balls by adjusting the humidity in each of the classification process for selecting the particle size, the packaging process for enclosing the solder balls in a container, and the mounting process for mounting the solder balls on the semiconductor device Various granulation methods, classification methods, packing methods, and mounting methods may be used as the granulating method 3, the classification method of the classification device 4, the packing method of the packing device 5, and the mounting method of the mounting device 18, respectively.
- the conveying devices 14a, 14b, and 14c are provided between the devices from granulation to packing, and the solder balls are managed in an atmosphere with a relative humidity of 20 [% RH] between the devices.
- the present invention is not limited to this, and each apparatus from granulation to packing, such as the manufacturing apparatus 21 in FIG. Instead of providing the transfer devices 14a, 14b, and 14c between them, an operator may manually transport the solder ball bottles between the devices.
- the operator collects the solder balls whose humidity has been adjusted by the aggregation suppressing device 7 in the granulating device 3 in the shipping container, and then seals the opening of the shipping container with the cap to maintain the internal humidity state.
- the solder balls are transported to the ball removing device 11 in the next process by the transport container.
- the opening of the transport container is immediately covered with the cap. By sealing, the time for the solder ball to contact the outside air whose humidity is not adjusted is shortened.
- the operator removes the cap from the shipping container, puts the solder balls in the shipping container into the ball removing device 11 whose humidity is adjusted by the aggregation suppressing device 7, and classifies using the ball removing device 11. Do work.
- the above-described bottle transportation is performed between the ball removing device 11 and the deformed shape removing device 12, and also between the deformed shape removing device 12 and the packaging device 5, and the solder balls are manually formed by the operator. Can be transported.
- the solder balls are transported before the solder balls are aggregated even if they come into contact with the outside air. By enclosing in the container, the solder balls can be kept dispersed without agglomeration.
- the manufacturing apparatus 21 adjusts the humidity of the granulation apparatus 3, the classification apparatus 4, and the packing apparatus 5 by the aggregation suppression apparatuses 7 and 8 without strictly adjusting the relative humidity between the apparatuses. If the solder balls are managed in an atmosphere with a relative humidity of 20 [% RH] or less, the granulation work can be performed in a state where the solder balls are dispersed without agglomeration of the fine solder balls from granulation to packaging. Classification work and packing work can be performed.
- solder ball classification operation is performed in the order of the ball removing device 11 and the deformed shape removing device 12, but the present invention is not limited thereto, and the deformed shape removing device 12 and the deformed shape removing device 12 Solder ball classification may be performed in the order of the ball removing device 11, or classification means by other various methods may be provided.
- the aggregation suppressing device 7 is provided in the granulating device 3, the classification device 4, and the mounting device 18 and the aggregation suppressing device 8 is also provided in the packing device 5 has been described.
- the present invention is not limited to this, and the aggregation suppressing device may be provided only in any one of the granulating device 3, the classification device 4, the packing device 5, and the mounting device 18 as necessary.
- the humidity in the entire manufacturing apparatus 1 and 21 is collectively adjusted with one aggregation suppressing device, or the granulating device 3 and the classification device 4 with one aggregation suppressing device.
- the humidity inside the packaging device 5 may be adjusted collectively.
- SAC305 composition Sn-3Ag-0.5Cu: Sn-Ag-Cu system
- low silver composition Sn-1.2Ag-0.5Cu: Sn-Ag-Cu system
- Sn-Bi composition Sn-58Bi: Sn-Bi system
- Sn-Ag composition Sn-3.5Ag: Sn-Ag system
- Sn-Cu composition Sn-0.7Cu: Sn -Cu type
- Sn-Zn composition Sn-3Zn: Sn-Zn type solder balls, each of which is granulated 1 million, and the humidity inside the glove box is adjusted at a temperature of 25 ° C ⁇ 5 ° C.
- the agglomeration suppression rate is a value obtained by dividing the number of solder balls passing through the mesh part of the sieve by the number of solder balls put into the sieve, using a sieve having a mesh part with openings formed in a mesh shape. Yes, the larger this value is, the more solder balls that have passed through the mesh portion of the sieve, and the more the aggregation of the solder balls can be suppressed.
- Example 1 to Example 24 of Table 1 when the relative humidity is 20 [% RH] or less, the aggregation inhibition rate is 90 [%] or more, and Comparative Example 1 with a relative humidity of 50 [% RH] It was confirmed that the aggregation inhibition rate was improved step by step as compared with Comparative Example 2 having a relative humidity of 30 [% RH]. In addition, by reducing the relative humidity to 15 [% RH] or less, the aggregation suppression rate is further improved, and when the relative humidity is lowered to 0 [% RH], the aggregation suppression rate becomes 99 [%] and the aggregation suppression rate is remarkably high. It was confirmed that the improvement was achieved.
- solder ball aggregation can be suppressed without using a dispersant by managing the solder ball in an atmosphere with adjusted relative humidity.
- the effect of suppressing the aggregation of the solder balls is enhanced, and the aggregation of the solder balls can be suppressed without using a dispersant. It could be confirmed.
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Abstract
Description
3 造粒装置
4 分級装置
5 梱包装置
7,8,13 凝集抑制装置
15 湿度調整手段
18 実装装置
1,21
Claims (6)
- Sn-Ag-Cu系、Sn-Bi系、Sn-Ag系、Sn-Cu系、Sn-Zn系のうちいずれかのSn基合金でなる半田ボールであって、
平均粒径が100[μm]以下であり、凝集が抑制されるように湿度調整された雰囲気下で管理されている
ことを特徴とする半田ボール。 A solder ball made of any Sn-based alloy of Sn-Ag-Cu, Sn-Bi, Sn-Ag, Sn-Cu, Sn-Zn,
A solder ball characterized by having an average particle size of 100 [μm] or less and being controlled in an atmosphere adjusted in humidity so that aggregation is suppressed. - 相対湿度が20[%RH]以下である
ことを特徴とする請求項1記載の半田ボール。 2. The solder ball according to claim 1, wherein the relative humidity is 20 [% RH] or less. - ボール表面は、凝集を抑制する分散剤でコーティングされずに外部に露出している
ことを特徴とする請求項1または2に記載の半田ボール。 3. The solder ball according to claim 1, wherein the ball surface is exposed to the outside without being coated with a dispersant that suppresses aggregation. - Sn-Ag-Cu系、Sn-Bi系、Sn-Ag系、Sn-Cu系、Sn-Zn系のうちいずれかのSn基合金でなり、平均粒径が100[μm]以下の半田ボールを製造する製造装置、または前記半田ボールを半導体デバイスに実装させる実装装置のいずれかに設置される凝集抑制装置であって、
前記製造装置または前記実装装置の前記半田ボールを管理する作業空間を湿度調整し、前記半田ボールの凝集を抑制させる湿度調整手段を備える
ことを特徴とする凝集抑制装置。 Solder balls made of Sn-based alloys of Sn-Ag-Cu, Sn-Bi, Sn-Ag, Sn-Cu, and Sn-Zn, with an average particle size of 100 [μm] or less An agglomeration suppression apparatus installed in either a manufacturing apparatus for manufacturing or a mounting apparatus for mounting the solder balls on a semiconductor device,
An agglomeration suppression apparatus comprising humidity adjusting means for adjusting a humidity of a work space for managing the solder balls of the manufacturing apparatus or the mounting apparatus to suppress agglomeration of the solder balls. - 前記湿度調整手段は、前記作業空間を相対湿度20[%RH]以下とする
ことを特徴とする請求項4記載の凝集抑制装置。 5. The aggregation suppressing device according to claim 4, wherein the humidity adjusting means sets the work space to a relative humidity of 20 [% RH] or less. - Sn-Ag-Cu系、Sn-Bi系、Sn-Ag系、Sn-Cu系、Sn-Zn系のうちいずれかのSn基合金でなり、平均粒径が100[μm]以下の半田ボールを製造する製造装置、または前記半田ボールを半導体デバイスに実装させる実装装置の少なくともいずれかで、前記半田ボールを管理する作業空間を、湿度調整手段によって湿度調整し、前記半田ボールの凝集を抑制させる
ことを特徴とする凝集抑制方法。
Solder balls made of Sn-based alloys of Sn-Ag-Cu, Sn-Bi, Sn-Ag, Sn-Cu, and Sn-Zn, with an average particle size of 100 [μm] or less At least one of a manufacturing apparatus for manufacturing and a mounting apparatus for mounting the solder balls on a semiconductor device, the working space for managing the solder balls is humidity-adjusted by a humidity adjusting unit to suppress aggregation of the solder balls. A method for inhibiting aggregation.
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JP2014544385A JPWO2014069132A1 (en) | 2012-10-30 | 2013-09-27 | Solder ball, aggregation suppression device, and aggregation suppression method |
TW102135629A TW201424910A (en) | 2012-10-30 | 2013-10-02 | Solder ball, agglomeration limiting device, and agglomeration limiting method |
PH12015500950A PH12015500950A1 (en) | 2012-10-30 | 2015-04-28 | Solder ball, agglomeration limiting device, and agglomeration limiting method |
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JP (1) | JPWO2014069132A1 (en) |
PH (1) | PH12015500950A1 (en) |
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Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000012593A (en) * | 1998-04-24 | 2000-01-14 | Nippon Steel Corp | Ball transferring method and device |
JP2010073394A (en) * | 2008-09-17 | 2010-04-02 | Sekisui Chem Co Ltd | Flux including capsule, conductive particle with flux including capsule, anisotropic conductive material, and connection structure |
JP2010161293A (en) * | 2009-01-09 | 2010-07-22 | Athlete Fa Kk | Treatment device and method using mask |
-
2013
- 2013-09-27 JP JP2014544385A patent/JPWO2014069132A1/en active Pending
- 2013-09-27 WO PCT/JP2013/076307 patent/WO2014069132A1/en active Application Filing
- 2013-10-02 TW TW102135629A patent/TW201424910A/en unknown
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2015
- 2015-04-28 PH PH12015500950A patent/PH12015500950A1/en unknown
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000012593A (en) * | 1998-04-24 | 2000-01-14 | Nippon Steel Corp | Ball transferring method and device |
JP2010073394A (en) * | 2008-09-17 | 2010-04-02 | Sekisui Chem Co Ltd | Flux including capsule, conductive particle with flux including capsule, anisotropic conductive material, and connection structure |
JP2010161293A (en) * | 2009-01-09 | 2010-07-22 | Athlete Fa Kk | Treatment device and method using mask |
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TW201424910A (en) | 2014-07-01 |
PH12015500950A1 (en) | 2015-07-06 |
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