WO2014069131A1 - Variant removal device and variant removal method - Google Patents

Variant removal device and variant removal method Download PDF

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Publication number
WO2014069131A1
WO2014069131A1 PCT/JP2013/076306 JP2013076306W WO2014069131A1 WO 2014069131 A1 WO2014069131 A1 WO 2014069131A1 JP 2013076306 W JP2013076306 W JP 2013076306W WO 2014069131 A1 WO2014069131 A1 WO 2014069131A1
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WO
WIPO (PCT)
Prior art keywords
shape
ball
deformed
moving surface
disk
Prior art date
Application number
PCT/JP2013/076306
Other languages
French (fr)
Japanese (ja)
Inventor
寺嶋　晋一
小林　孝之
將元 田中
勝一 木村
忠礼 佐川
Original Assignee
新日鉄住金マテリアルズ株式会社
日鉄住金マイクロメタル株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 新日鉄住金マテリアルズ株式会社, 日鉄住金マイクロメタル株式会社 filed Critical 新日鉄住金マテリアルズ株式会社
Priority to JP2014544384A priority Critical patent/JPWO2014069131A1/en
Priority to TW102135628A priority patent/TW201429599A/en
Publication of WO2014069131A1 publication Critical patent/WO2014069131A1/en
Priority to PH12015500949A priority patent/PH12015500949A1/en

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • B23K35/025—Pastes, creams, slurries
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/041—Solder preforms in the shape of solder balls

Definitions

  • the present invention relates to a deformed shape removing apparatus and a deformed shape removing method, and is applied to, for example, removing a defective shape having a deformed ball shape from a group of small solder balls having a diameter of 10 to 60 [ ⁇ m]. Therefore, it is suitable.
  • an inclined plate having a predetermined inclination angle is provided, a solder ball is supplied onto the inclined plate, and the solder ball is rolled on the inclined plate by its own weight.
  • the device is known.
  • a good solder ball that has not been deformed rolls linearly on the inclined plate, while an irregularly shaped product that has been deformed cannot move straight and falls off the side of the inclined plate.
  • the irregular shape removing device can collect only the solder balls that have been rolled linearly, and can remove the shape waste generated in the manufacturing process.
  • the conventional irregular shape removing apparatus has a problem that defective products cannot be removed from a large number of solder balls.
  • the solder ball on the inclined plate simply slides down without rolling either a true spherical product or a defective product. There is a problem in that defective products cannot be removed from the solder ball group, and the deformed content cannot be reduced.
  • the present invention has been made in view of the above problems, and an irregular shape removal device and irregular shape removal that can remove defective shapes contained in a large number of metal balls and reduce the irregular content rate. It aims to provide a method.
  • the profile removing device includes a moving body whose moving surface moves in one direction, and a supply unit that supplies a metal ball from the opposite direction side of the one direction toward the moving surface, The metal ball is rotated by bringing the metal ball into contact with the moving surface, and a defective product having a deformed ball shape is removed from a difference in rolling behavior caused by the ball shape of the metal ball. .
  • An irregular shape removing apparatus is characterized in that, in claim 1, humidity adjustment means is provided for adjusting the humidity of a work space where the metal ball classification work is performed, and suppressing aggregation of the metal balls.
  • the apparatus for removing irregularities according to the second aspect is characterized in that the humidity adjusting means sets the working space to a relative humidity of 20 [% RH] or less.
  • the deformed shape removing apparatus classifies a metal ball having a diameter of 60 [ ⁇ m] or less and a shape defect product in which the metal ball is deformed in any one of claims 1 to 3. In addition, the defective shape product is removed.
  • the deformed shape removing apparatus according to claim 5 of the present invention is the deformed shape removing apparatus according to any one of claims 1 to 4, wherein the moving body is a disk, the moving surface rotates, and the supply means rotates in the rotating direction of the disk. The metal balls are supplied from the opposite direction side.
  • the method for removing a deformed shape is a supply step of moving the moving surface of the moving body in one direction and supplying the metal ball from the opposite direction side of the one direction toward the moving surface by the supplying means.
  • the supplying step and the removing step are performed in a humidity-adjusted atmosphere, and aggregation of the metal balls is suppressed.
  • the metal ball is rotated by bringing the metal ball into contact with the moving surface, and the shape of the ball is deformed due to the difference in rolling behavior caused by the ball shape of the metal ball.
  • Non-defective products can be removed, and thus defective products contained in a large number of metal balls can be removed, and the content of irregular shapes can be reduced.
  • FIG. 1 schematically shows a series of steps from granulation to mounting for a fine solder ball having a diameter of 10 to 60 [ ⁇ m] used for TSV, for example. In this case, it can be roughly divided into a manufacturing process performed by a manufacturer and a mounting process performed by a trader.
  • the manufacturing process consists of a granulation process SP1 that granulates minute solder balls, a classification process SP2 that removes defective shape balls with irregular shapes from many solder balls, and a group of balls from which defective shape products have been removed. It can be divided into packing process SP3 which is packed in a container and packed.
  • the transport / mounting process includes, for example, a mounting process SP4 in which the product packed in the packing process SP3 is transported from the manufacturing site to the mounting site, and then the solder balls enclosed in the container are mounted on the TSV device at the mounting site. Prepare.
  • fine solder balls are granulated by a wire cut method, a UDS (Uniform Droplet Spray method) method, or an atomizing method (paste powder only).
  • Sn-Ag-Cu-based, Sn-Bi-based, Sn-Ag-based, Sn-Cu-based, Sn-Zn-based Sn-based alloys (Sn amount is 40) are used as the metal balls. [%] Refers to the case of using a solder ball made of an alloy), but the present invention is not limited to this, and the present invention is not limited to this. You may make it use the other metal ball
  • bowl which consists of either of an alloy (all base alloys mean the alloy whose element (Au, Cu, Ag, Ni, Pb) amount is 40 [%] or more).
  • this type of metal ball including solder balls
  • solder balls is agglomerated by being miniaturized (in addition to the phenomenon that many metal balls are grouped and behave like a lump, solder balls are attached to peripheral members. This refers to the phenomenon of sticking (attaching). Therefore, in this embodiment, it is necessary to prevent agglomeration of solder balls not only during the granulation step SP1, but also during the classification step SP2, the packing step SP3, and further the mounting step SP4.
  • the relative humidity of the environment in which the solder balls are handled is adjusted throughout the classification process SP2, the packaging process SP3, and the mounting process SP4, and the atmosphere in each process is dried to make it fine. Aggregation of the solder balls can be suppressed.
  • the relative humidity is 20 [% RH] or less, preferably 15 [% RH] or less. That is, in the classification process SP2, the packaging process SP3, and the mounting process SP4, the solder balls are less likely to agglomerate by maintaining the relative humidity below 20% RH continuously from the granulation process SP1. It is possible to suppress generation of a defective shape having a deformed shape and adhesion of solder balls to peripheral members.
  • the relative humidity when the relative humidity is 15% RH or less, it becomes difficult to agglomerate even with a small solder ball having a particle size of 40 ⁇ m or less. Can be suppressed.
  • the relative humidity exceeds 20 [% RH]
  • the solder balls gradually aggregate, and a plurality of solder balls stick together to increase the aggregate, and the solder balls easily adhere to peripheral members. Become.
  • the relative humidity may be adjusted by adjusting the humidity of the room itself, which is a work space for performing the classification process SP2, the packaging process SP3, and the mounting process SP4, by using a humidity adjustment means, Only the working space in each device main body of the packaging device used in the packaging step SP3 and the mounting device used in the packaging step SP4 may be humidity adjusted by the humidity adjusting means.
  • a gas such as dry air, argon, nitrogen, or helium may be used, and the humidity in the work space may be adjusted by evacuating with a vacuum pump.
  • FIG. 2 shows the irregular shape removing apparatus 1 of the present invention used in the classification step SP2.
  • This irregular shape removing device 1 includes a disk 2 that rotates around a rotating shaft 2a by a driving means (not shown), an inclined plate 3 that supplies the solder balls B granulated in the granulation step SP1 onto the disk 2, And a collection container 4 for collecting only non-deformed good solder balls B1 falling from the outer periphery of the disk 2.
  • the profile removing device 1 includes a humidity adjusting means (not shown), and can perform humidity adjustment in the apparatus main body in which the disc 2, the inclined plate 3 and the collection container 4 are installed.
  • the humidity adjusting means includes, for example, a box-like box that contains the disk 2, the inclined plate 3, and the collection container 4 and is separated from the outside air, and a box that becomes a work space by supplying a gas such as nitrogen into the box. And a gas supply unit for adjusting the relative humidity inside.
  • Humidity adjustment means may be provided, and the humidity of the room itself, which is the work space in which the profile removing device 1 is installed, may be adjusted by the humidity adjustment means.
  • the disk 2 as a moving body is formed of, for example, a plate member having a flat surface, and is formed into a thin circular shape having a diameter of 1 to 200 [cm].
  • the disk 2 may be any material as long as the moving surface 2b has high flatness, and may be formed of various other members such as a glass plate, a metal plate, and a plastic plate.
  • the smoothness of the moving surface 2b in the disk 2 may be a general arithmetic average roughness Ra of 5 to 1000 [nm], preferably 5 to 500 [nm], and most preferably 5 to 100 [nm]. If there is, sufficient smoothness is secured.
  • the disk 2 can be rotated by a driving means, for example, in a counterclockwise direction at a rotational speed of 5 to 500 [rpm], preferably 30 to 120 [rpm].
  • the disk 2 has a circular moving surface 2b arranged substantially horizontally, and can rotate around the rotation axis 2a while keeping the moving surface 2b horizontal.
  • the driving means (not shown) is arranged above or below the disk 2 and can rotate the disk 2 in conjunction with the shaft by rotating the shaft connected to the rotating shaft 2a.
  • the collection container 4 has a bottomed cylindrical shape and has a diameter that is slightly larger than the diameter of the disk 2.
  • the high-quality solder that falls from the disk 2 into the space ER1 surrounded by the wall and the bottom.
  • the ball B1 can be collected.
  • the inclined plate 3 disposed above the disk 2 has a rectangular and smooth inclined surface 3a, and is disposed at a predetermined angle so that the inclined surface 3a is inclined with respect to the moving surface 2b of the disk 2. ing.
  • the solder ball B slides down on the inclined surface 3a and falls downward from the lower end to solder onto the moving surface 2b. Ball B can be supplied.
  • the inclined plate 3 is disposed at an angle of 20 to 80 degrees with respect to the moving surface 2b of the disk 2, and is desirably disposed at an angle of 40 degrees or more, preferably 40 degrees.
  • the solder ball B on the inclined surface 3a can be reliably slid down.
  • the inclined plate 3 may be dropped by giving an initial speed to the extent that it slides down the inclined surface 3a regardless of whether it is a good solder ball or a defective shape. In this case, the solder ball surely reaches the disk 2. be able to.
  • the solder balls B may be supplied to the disk 2 by applying vibration to the inclined plate 3 by vibration supply means such as a parts feeder so that the solder balls reach the disk 2 one by one.
  • the inclined plate 3 is arranged with a gap of 1 to 30 [mm] between the lower end from which the solder ball B is discharged and the moving surface 2b of the disk 2, and slips down the inclined surface 3a.
  • the ball group of the coming solder balls B can be dropped on the moving surface 2b.
  • the inclined plate 3 is arranged such that the supply direction x2 for supplying the ball group to the moving surface 2b is opposite to the moving direction x1 of the moving surface 2b.
  • the inclined plate 3 supplies the solder ball B to the moving surface 2b in a direction opposite to the moving direction x1 of the moving surface 2b and at a predetermined angle, thereby bringing the solder ball B into contact with the moving surface 2b and moving direction x1
  • the behavior of the solder ball B is changed by the force applied from the moving surface 2b toward the solder ball B so that the solder ball B can be forcibly rotated on the moving surface 2b.
  • the inclined plate 3 is arranged so that the longitudinal direction H1 of the inclined plate 3 is orthogonal to the radial direction H2 of the disk 2, and the solder ball sliding down the inclined surface 3a.
  • the supply direction x2 of B and the movement direction x1 of the movement surface 2b at the supply position of the solder ball B are arranged in opposite directions and in parallel.
  • a rotational force is applied to the contact surface with the moving surface 2b by applying a force in a direction opposite to the supply direction x2, thereby moving the solder ball B. It is designed to be able to rotate reliably on the surface 2b.
  • the inclined plate 3 is disposed so that the longitudinal direction H1 thereof is orthogonal to the radial direction H2 of the disk 2, and the supply direction x2 and the moving direction x1 are opposite and parallel to each other.
  • the present invention is not limited to this, and if the solder ball can be supplied to the moving surface 2b from the direction opposite to the moving direction x1, for example, the longitudinal direction of the inclined plate 3 H1 may be arranged in various directions such as 30 degrees and 60 degrees with respect to the radial direction H2 of the disk 2.
  • the disk 2 to which the solder ball B is supplied preferably has an appropriate frictional resistance on the moving surface 2b, and when the solder ball B comes into sliding contact with the moving surface 2b, the frictional resistance of the moving surface 2b is concerned. And a non-defective solder ball B1 can be rotated by the rotational force of the moving surface 2b.
  • the irregular shape removing device 1 when a large number of solder balls B are supplied from the upper end side of the inclined plate 3, the solder balls B slide down on the inclined surface 3a, and the lower end of the inclined plate 3 is below the lower end.
  • the solder ball B is dropped onto the moving surface 2b of the disk 2 arranged in the above.
  • the irregular shape removing device 1 applies a rotational force to the solder ball B by causing the solder ball B to slide in contact with the moving surface 2b of the rotating disk 2, thereby rotating the solder ball B.
  • the disk 2 rotates so that a good solder ball B1 formed in a spherical shape rolls toward the outer periphery, and a defective shape product B2 having a deformed ball shape stays on the moving surface 2b.
  • a good solder ball B1 having a ball shape formed into a spherical shape rolls along the rotation direction of the disk 2 and jumps out of the outer periphery of the disk 2 by centrifugal force. Fall.
  • the recovery container 4 can recover a good solder ball B1 having a true spherical shape.
  • the defective shape B2 of the solder ball B which has a deformed ball shape, differs in rolling behavior from the good solder ball B1 because the ball shape is different from that of the good solder ball B1, and like the good solder ball B1. Without going out from the outer periphery of the disk 2, it continues to circulate around a certain place on the disk 2 and stays in the central region on the disk 2.
  • the solder ball B is rotated by bringing the solder ball B into contact with the moving surface 2b, and the shape of the defective ball ball is deformed due to the difference in rolling behavior caused by the ball shape of the solder ball B. Only B2 can be removed, and thus defective shape products B2 contained in a large number of solder balls B can be removed, and the deformed content rate can be reduced.
  • the solder ball B when the solder ball B is supplied from the same direction side as the moving direction x1 of the disk 2 toward the moving surface 2b (that is, the moving direction of the solder ball B and the moving surface 2b at the position where the solder ball B is supplied).
  • the direction x1 is the same direction
  • the solder ball B that has jumped out in the supply direction is simply transported in the moving direction x1 in the same direction by the moving surface 2b, and the rotational force that rotates the solder ball B Is less likely to occur on the solder ball B.
  • the good solder balls B1 and the poorly shaped products B2 both fall from the outer periphery of the disk 2 due to the centrifugal force, and the change in rolling behavior caused by the difference in the ball shapes hardly appears. Therefore, it is desirable to supply the solder balls B from the opposite direction side of the rotation direction x1 of the moving surface 2b to the moving surface 2b as in the deformed shape removing apparatus 1 of the present invention. In this case, depending on the difference in the ball shape Thus, the rolling behavior is changed, and the defective shape product B2 can be removed from the ball group.
  • the classification work is performed under an atmosphere adjusted for relative humidity, so that the fine solder balls granulated in the granulation step SP1 are maintained in a dispersed state without agglomeration. It is possible to suppress the deforming of the ball shape caused by the aggregation of the solder balls B in the classification step SP2, and to reduce the deformed content rate.
  • a good solder ball B1 selected by the profile removing device 1 is sealed in a highly airtight container in an atmosphere with a relative humidity of 20 [% RH] or less.
  • the container in which only the non-defective solder ball B1 is sealed is packed in a sealed state, and is transported to each trader who uses the solder ball as a mounting component, and then used in the mounting process SP4.
  • the relative humidity is kept at an atmosphere of 20 [% RH] or less, so that the solder can be opened in the container, the solder ball B1 is removed from the container, and the solder ball B1 is mounted. Aggregation of the ball B1 can be prevented.
  • the relative humidity is adjusted at the time of the classification process SP2 using the deformed shape removing device 1, the packing process SP3, and the mounting process SP4, without using a dispersant.
  • the agglomeration of minute solder balls was suppressed.
  • the solder balls classified by the deformed shape removing apparatus 1 of the present invention can reliably bond the substrates to each other without deteriorating the bondability because the dispersant is not used.
  • the present invention is not limited to the present embodiment, and various modifications are possible within the scope of the gist of the present invention.
  • the defective shape product B2 collected in the central region of the disk 2 is collected. You may apply the irregular shape removal apparatus provided with such a structure.
  • FIG. 4 in which the same reference numerals are assigned to the corresponding parts as in FIG. 2 shows the deformed shape removing device 11 having a disc 12 configuration different from that of the above-described embodiment.
  • the disc 12 has a recess 14 formed in a circular shape in the central region, and the defective shape that collects in the central region when the solder balls B are supplied from the inclined plate 3 to the rotated disc 12. B2 can be collected in the storage unit 14.
  • the accommodating portion 14 may be a through hole that penetrates the thickness of the disk 12.
  • the collection container disposed below the disk 12 is disposed along the outer periphery of the disk 12 and is disposed below the through hole in the central region, and the annular first container that collects good solder balls B1 that jump out of the outer periphery.
  • a bottomed cylindrical second container that collects the defective shape product B2 falling from the through hole is provided.
  • the irregular shape removing device can drop the defective shape product from the through hole to the lower side of the disk 12 and collect it in the second container as it is, and the defective shape product B2 does not accumulate on the disk 12. Therefore, it is not necessary to perform the removal work for removing the defective shape product B2 from the disk 12, and the classification work can be continued continuously.
  • the irregular shape removing device 21 includes a columnar rotating body 22 formed in a columnar shape, an inclined plate 3 that supplies the solder balls B to the columnar rotating body 22, and an inclined table disposed below the columnar rotating body 22. And 25.
  • the cylindrical rotating body 22 has a rotating shaft 22a disposed horizontally, and a moving surface 22b can be rotated clockwise around the rotating shaft 22a by a driving means (not shown).
  • the inclined plate 3 has an inclined surface 3a for supplying the solder ball B to the moving surface 22b from the direction opposite to the rotation direction of the cylindrical rotating body 22, and by bringing the solder ball B into contact with the moving surface 22b, A rotational force can be applied to the solder ball B.
  • the inclined plate 3 is positioned lower than the rotation axis 22a of the cylindrical rotating body 22 and the lower end is positioned on the rotation rear side with respect to the perpendicular P1 passing through the rotation axis 22a.
  • the inclined surface 3a is inclined downward so that the inclined surface 3a faces the moving surface 22b.
  • the inclined plate 3 can supply the solder balls B to the moving surface 22b from the direction opposite to the rotation direction of the cylindrical rotating body 22.
  • the non-defective solder ball B1 whose ball shape is a spherical shape contacts the moving surface 22b that rotates in the clockwise direction, and for example, rotates in the counterclockwise direction and falls to the tilting table 25 as it is.
  • the deformed product B2 with a deformed ball shape is difficult to rotate because of the non-spherical shape of the ball even if it contacts the moving surface 22b that rotates in one direction. It falls to 25.
  • the inclined base 25 disposed below the cylindrical rotating body 22 has an inclined surface 25a in which the lower end side is disposed on the rotating rear side of the cylindrical rotating body 22 and the upper end side is disposed on the rotating front side of the cylindrical rotating body 22.
  • the solder ball B falling from the cylindrical rotating body 22 is received by the inclined surface 25a.
  • the inclined surface 25a As a result, when the good solder ball B1 rotated in the counterclockwise direction, for example, by the cylindrical rotating body 22 falls on the tilting table 25, the inclined surface remains as it is by the counterclockwise rotational force applied from the cylindrical rotating body 22. Roll down 25a.
  • the tilting table 25 is such that a good spherical solder ball B1 rolls on the inclined surface 25a while rolling to the lower end, while the non-rotating non-rotating defective product B2 does not slide down on the inclined surface 25a.
  • the angle of the inclined surface 25a is adjusted so that it can stay in the air.
  • the irregular shape removing device 21 can collect the non-defective solder ball B1 having a true spherical shape in a collection container (not shown) disposed at the lower end of the inclined base 25, and can achieve the same effect as the above-described embodiment. Obtainable. Further, even with such an irregular shape removing device 21, it is possible to remove the defective shape product B2 while preventing agglomeration of minute solder balls B by providing the humidity adjusting means in the same manner as described above.
  • an irregular shape removing apparatus having a configuration in which the irregular shape removing apparatus 1 shown in FIG.
  • the plurality of disks are arranged so that the diameter of the disk gradually increases from the top to the bottom, and the solder balls are dropped from the disks arranged above to the disks arranged below.
  • this irregular shape removing device it is possible to remove defective products for each stage of the disk, and by simply supplying a group of balls to the upper inclined plate 3, a removal operation for removing defective products at a time is possible. It can be performed multiple times as many as the number of disks. 2 may also be combined with the irregular shape removing device 1 shown in FIG. 4, the irregular shape removing device 11 shown in FIG. 4, and the irregular shape removing device 21 shown in FIG. Good. In addition, these various irregular shape removing devices can remove the defective shape product B2 while preventing the aggregation of minute solder balls B by providing the humidity adjusting means in the same manner as described above.
  • the present invention is not limited to this, and on both sides from the one end to the other end of the inclined plate 3 Side walls may be provided, and in this case, it is possible to prevent the solder balls from dropping from the side between one end and the other end of the inclined plate.
  • the supply means not only the inclined plate but also a cylindrical body in which the solder ball slides in the internal space may be applied.
  • the present invention is not limited thereto, and rotating bodies having various outer shapes may be applied, Further, not only a rotating body that rotates to move the moving surface 2b in one direction but also a moving body in which the moving surface 2b moves linearly in one direction may be applied.
  • a moving body in which an endless belt member is stretched between the first roller and the second roller and the belt member rotates may be applied.
  • the belt member has a moving surface arranged horizontally as described above, and the solder ball B is supplied from the upper side of the moving surface by the inclined plate 3 in a direction opposite to the moving direction of the belt member. Is done. Even in such a configuration, the solder ball B is forcibly rotated by the belt member, and it is possible to remove the defective shape product B2 in which the ball shape is deformed due to the difference in rolling behavior caused by the ball shape. .
  • the irregular shape removing apparatus 1 is provided with a humidity adjusting means (not shown), and the defective shape product is removed without agglomerating the solder balls B in an atmosphere adjusted by the humidity adjusting means.
  • a humidity adjusting means not shown
  • the solder ball is not aggregated by the irregular shape removing device 1 without adjusting the humidity by the humidity adjusting means. A defective product can be removed.
  • solder ball B having a diameter of 10 to 60 [ ⁇ m] is used as the minute metal ball supplied from the inclined plate 3 to the disk 2 .
  • a metal ball having a diameter of 200 [ ⁇ m] or less or a metal ball having a diameter of 100 [ ⁇ m] or less may be used.
  • solder ball classification work was actually performed using the deformed shape removing device 1 shown in FIG. 2, and the deformed content rate of the balls collected in the collecting container 4 was examined.
  • SAC305 composition Sn-3.0Ag-0.5Cu: Sn-Ag-Cu system
  • low silver composition Sn-1.2Ag-0.5Cu: Sn-Ag-Cu system
  • Sn -Bi composition Sn-58Bi: Sn-Bi system
  • Sn-Ag composition Sn-3.5Ag: Sn-Ag system
  • Sn-Cu composition Sn-0.7Cu: Sn-Cu system
  • Sn-Zn composition One million (Sn-3Zn: Sn—Zn) solder balls were granulated, and the deformed ball removing device 1 classified the solder balls.
  • the profile removal device 1 was installed in the glove box, and the relative humidity in the glove box was changed to 5, 15, 20, 50 [% RH] at a temperature of 25 ° C ⁇ 5 ° C. After that, the balls were classified using the deformed shape removing device 1 under the atmosphere of each relative humidity. The relative humidity was measured with a hygrometer (Chino Co., Ltd. pocket size temperature and humidity meter NH-CHP) installed in the glove box.
  • the disc 2 was installed in the drive mechanism so as to rotate while maintaining horizontal.
  • the inclined plate 3 disposed above the disk 2 is manufactured by processing a flat wafer into a rectangular shape, and is disposed so that the smooth inclined surface 3a is at an angle of 40 degrees with respect to the moving surface 2b of the disk 2. Further, the inclined plate 3 was placed in a non-contact state with the disk 2 so that the lower end was disposed at a position 10 mm above the moving surface 2b. Further, the inclined plate 3 is arranged so that the longitudinal direction H1 thereof is orthogonal to the radial direction H2 of the disk 2.
  • a collection container 4 for collecting solder balls dropped from the outer periphery of the disk 2 was installed below the disk 2 so as not to contact the disk.
  • Such an irregular shape removing device 1 was prepared, and the group of balls granulated in the granulation step SP1 was dropped onto the inclined plate 3.
  • the solder ball slides down on the inclined plate 3, and drops the solder ball on the moving surface 2b of the rotating disk 2.
  • the solder ball from the inclined plate 3 is dropped from the direction opposite to the rotation direction of the disk 2, the solder ball is brought into contact with the moving surface 2b, and a rotational force is applied to the solder ball. And rotated.
  • the ball group supplied from the inclined plate 3 to the disk 2 rolls along the rotation direction of the disk 2, and finally the solder balls that fall from the outer periphery of the disk 2 to the lower side of the disk 2 as they are. It was possible to classify it into solder balls that stayed in the central area of disk 2. Then, the deformed content rate of the ball group of the solder balls B1 dropped from the outer periphery of the disk 2 and recovered in the recovery container 4 was examined.
  • Example 1 to Example 30 in Table 1 the relative humidity at which the classification work is performed and the number of revolutions of the disk 2 are changed, and the recovery rate and the deformed content rate at this time are examined. It was.
  • Comparative Example 1 and Comparative Example 2 the recovery rate and the deformed content of the ball group immediately after granulation were examined by changing the relative humidity without performing the classification work by the deformed shape removing device 1 described above.
  • the recovery rate in Examples 1 to 30 refers to the amount of balls collected in the recovery container 4 by the irregular shape removal device 1 as the collection amount, and put into the inclined plate 3 of the irregular shape removal device 1 This is a numerical value calculated by “recovered amount / injected amount”, where the amount of the ball group is the input amount.
  • the ball group was supplied from the inclined plate 3 to the stationary disk 2 and slid on the moving surface 2b of the disk 2 and dropped into the recovery container 4 as it was. This is a numerical value calculated by “recovered amount / injected amount” with the amount of the ball group as the recovered amount.
  • the deformed content rate is a numerical value calculated from the number of deformed balls per million population by examining the balls collected by the collecting container 4 using a commercially available powder measuring device.
  • Comparative Example 1 in which the relative humidity is 50 [% RH], the solder balls are likely to aggregate, and there are few solder balls reaching the recovery container 4 from the disk 2 and the recovery rate is 2 [%]. ]Met.
  • Comparative Example 2 where the relative humidity was 20 [% RH], the aggregation of the solder balls was suppressed, and the recovery rate increased to 80 [% RH]. From this, it was confirmed that agglomeration of the solder balls can be suppressed by lowering the relative humidity and drying.
  • Comparative Example 1 and Comparative Example 2 classification work using the deformed shape removing device 1 was not performed, and the deformed content rate of the shape defect product having the deformed ball shape at this time was 10 [%]. It was.
  • Examples 1 to 30 are those in which classification work is performed using the deformed shape removing apparatus 1 of the present invention, and a group of balls supplied from the inclined plate 3 to the disk 2 is recovered in the recovery container 4 It was confirmed that the ball could be divided into two types of balls, divided into balls and solder balls staying in the central region of the disk 2.
  • the recovery rate was 90% or higher.
  • Example 19 to Example 24 at 120 [rpm] the deformed content decreased overall, and good results were obtained. From this, it was confirmed that when performing the classification work using the deformed shape removing apparatus 1, the deformed content rate decreases as the number of rotations of the disk 2 is increased.

Abstract

The purpose of the present invention is to provide a variant removal device and a variant removal method that make it possible to reduce variant content by removing misshapen articles from among a plurality of metal balls. Provided is a variant removal device (1) that rotates a solder ball (B) by bringing the solder ball (B) into contact with a moving surface (2b) and that is capable of removing only a misshapen article (B2) having a deformed ball shape on the basis of differences in rolling behavior caused by the ball shape of the solder ball (B). In this way, misshapen articles (B2) are removed from among the plurality of solder balls and it is possible to reduce variant content.

Description

異形除去装置および異形除去方法Deformation removal apparatus and irregular shape removal method
　本発明は、異形除去装置および異形除去方法に関し、例えば直径10～60[μm]の微小な半田ボールの集合でなるボール群の中からボール形状が異形化した形状不良品を除去する際に適用して好適なものである。 The present invention relates to a deformed shape removing apparatus and a deformed shape removing method, and is applied to, for example, removing a defective shape having a deformed ball shape from a group of small solder balls having a diameter of 10 to 60 [μm]. Therefore, it is suitable.
　近年、電子機器の小型化や高性能化に伴い、電子機器に実装される材料の小型化や、接合部の小面積化が加速しており、直径10～60［μm］でなる微小な半田ボールに対するニーズも高まっている（例えば、特許文献1参照）。しかしながら、このような微小な半田ボールの製造過程でも、2～3個の半田ボールが溶着（複数の半田ボールが接触したまま凝固して1つの塊となる現象を指す）し、ボール形状が異形化した形状不良品が生成されることがある。 In recent years, with the miniaturization and high performance of electronic devices, the miniaturization of materials mounted on electronic devices and the reduction in the area of joints have accelerated, and a small solder with a diameter of 10-60 [μm]. There is an increasing need for balls (see, for example, Patent Document 1). However, even in the manufacturing process of such a small solder ball, two to three solder balls are welded (refers to a phenomenon in which a plurality of solder balls are solidified to form one lump), and the ball shape is irregular. In some cases, a defective shape defective product is generated.
　そこで、このように、ボール形状が異形化した形状不良品を効率良く除去し、最終製品時において異形含有率を低下させることが望まれている。ここで、このようなボール形状が異形化した形状不良品を除去する一般的な手法としては、ボール形状が異形化していない真球状の半田ボールの転がり挙動と、ボール形状が異形化した形状不良品の転がり挙動とが異なるという性質を利用し、良品の半田ボールと、異形化した形状不良品とを分級して、形状不良品を除去する手法が知られている。 Therefore, it is desired to efficiently remove defective products having a deformed ball shape in this way, and to reduce the deformed content in the final product. Here, as a general method for removing a defective shape having a deformed ball shape, the rolling behavior of a spherical solder ball having a non-deformed ball shape and a shape defect having a deformed ball shape are used. There is known a technique for classifying non-defective solder balls and irregularly shaped defective products and removing the defective shape products by utilizing the property that the good products have different rolling behaviors.
　例えば、このような原理を利用した装置としては、所定の傾斜角度をもたせた傾斜板を設け、この傾斜板上に半田ボールを供給してゆき、自重によって半田ボールを傾斜板上で転がす異形除去装置が知られている。この場合、異形化してない良品の半田ボールは、傾斜板上を直線的に転がり、その一方で異形化した形状不良品は、直進できずに傾斜板の脇から脱落する。これにより異形除去装置は、直線的に転がった半田ボールだけを回収し、製造過程において生成された形状不用品を除去し得るようになされている。 For example, as an apparatus utilizing such a principle, an inclined plate having a predetermined inclination angle is provided, a solder ball is supplied onto the inclined plate, and the solder ball is rolled on the inclined plate by its own weight. The device is known. In this case, a good solder ball that has not been deformed rolls linearly on the inclined plate, while an irregularly shaped product that has been deformed cannot move straight and falls off the side of the inclined plate. As a result, the irregular shape removing device can collect only the solder balls that have been rolled linearly, and can remove the shape waste generated in the manufacturing process.
特許第４９８７９２８号公報Japanese Patent No. 4987928
　しかしながら、かかる構成でなる異形除去装置では、半田ボールが微小化すると、半田ボールの自重が軽いために、半田ボールの運動挙動が大きく変化してしまい、半田ボールを傾斜板上に供給しても転がらずに傾斜板上に留まってしまう。そのため、従来の異形除去装置では、多数の半田ボールの中から形状不良品を除去できないという問題があった。また、この際、半田ボールを強制的に転がすために傾斜板の傾斜角度を大きくしても、傾斜板上の半田ボールは真球な正常品と形状不良品のいずれも転がることなく単に滑り落ちてゆくだけであり、これら半田ボールのボール群の中から形状不良品を除去することができず、異形含有率を低減し得ないという問題があった。 However, in the deformed shape removing apparatus having such a configuration, when the solder ball is miniaturized, the solder ball's own weight is light, so that the movement behavior of the solder ball changes greatly, and even if the solder ball is supplied onto the inclined plate. It stays on the inclined plate without rolling. For this reason, the conventional irregular shape removing apparatus has a problem that defective products cannot be removed from a large number of solder balls. At this time, even if the inclination angle of the inclined plate is increased in order to forcibly roll the solder ball, the solder ball on the inclined plate simply slides down without rolling either a true spherical product or a defective product. There is a problem in that defective products cannot be removed from the solder ball group, and the deformed content cannot be reduced.
　そこで、本発明は、上記のような問題に鑑みてなされたものであり、多数の金属ボールの中に含まれた形状不良品を除去し、異形含有率を低減し得る異形除去装置および異形除去方法を提供することを目的とする。 Therefore, the present invention has been made in view of the above problems, and an irregular shape removal device and irregular shape removal that can remove defective shapes contained in a large number of metal balls and reduce the irregular content rate. It aims to provide a method.
　本発明の請求項1に係る異形除去装置は、一方向に移動面が移動する移動体と、前記一方向の逆方向側から前記移動面に向けて金属ボールを供給する供給手段とを備え、前記移動面に前記金属ボールを接触させることにより該金属ボールを回転させ、前記金属ボールのボール形状により生じる転がり挙動の違いから前記ボール形状が異形化した形状不良品を除去することを特徴とする。 The profile removing device according to claim 1 of the present invention includes a moving body whose moving surface moves in one direction, and a supply unit that supplies a metal ball from the opposite direction side of the one direction toward the moving surface, The metal ball is rotated by bringing the metal ball into contact with the moving surface, and a defective product having a deformed ball shape is removed from a difference in rolling behavior caused by the ball shape of the metal ball. .
　本発明の請求項2に係る異形除去装置は、請求項1において、前記金属ボールの分級作業が行なわれる作業空間を湿度調整し、該金属ボールの凝集を抑制させる湿度調整手段を備えることを特徴とする。 An irregular shape removing apparatus according to claim 2 of the present invention is characterized in that, in claim 1, humidity adjustment means is provided for adjusting the humidity of a work space where the metal ball classification work is performed, and suppressing aggregation of the metal balls. And
　本発明の請求項3に係る異形除去装置は、請求項2において、前記湿度調整手段は、前記作業空間を相対湿度20［％RH］以下とすることを特徴とする。 According to a third aspect of the present invention, the apparatus for removing irregularities according to the second aspect is characterized in that the humidity adjusting means sets the working space to a relative humidity of 20 [% RH] or less.
　本発明の請求項4に係る異形除去装置は、請求項1～3のうちいずれか1項において、直径60［μm］以下の金属ボールと、該金属ボールが異形化した形状不良品とを分級し、該形状不良品を除去することを特徴とする。 The deformed shape removing apparatus according to claim 4 of the present invention classifies a metal ball having a diameter of 60 [μm] or less and a shape defect product in which the metal ball is deformed in any one of claims 1 to 3. In addition, the defective shape product is removed.
　本発明の請求項5に係る異形除去装置は、請求項1～4のいずれか1項において、前記移動体は円盤であり、前記移動面が回転し、前記供給手段は、前記円盤の回転方向の逆方向側から前記金属ボールを供給することを特徴とする。 The deformed shape removing apparatus according to claim 5 of the present invention is the deformed shape removing apparatus according to any one of claims 1 to 4, wherein the moving body is a disk, the moving surface rotates, and the supply means rotates in the rotating direction of the disk. The metal balls are supplied from the opposite direction side.
　本発明の請求項6に係る異形除去方法は、移動体の移動面を一方向に移動させ、供給手段によって、前記一方向の逆方向側から前記移動面に向けて金属ボールを供給する供給ステップと、前記移動面に前記金属ボールを接触させることにより該金属ボールを回転させ、前記金属ボールのボール形状により生じる転がり挙動の違いから前記ボール形状が異形化した形状不良品を除去する除去ステップとを備えることを特徴とする。 According to a sixth aspect of the present invention, the method for removing a deformed shape is a supply step of moving the moving surface of the moving body in one direction and supplying the metal ball from the opposite direction side of the one direction toward the moving surface by the supplying means. A removal step of rotating the metal ball by bringing the metal ball into contact with the moving surface, and removing a defective product having a deformed ball shape due to a difference in rolling behavior caused by the ball shape of the metal ball; It is characterized by providing.
　本発明の請求項7に係る異形除去方法は、請求項6において、前記供給ステップおよび前記除去ステップは、湿度調整された雰囲気下で行われ、前記金属ボールの凝集が抑制されていることを特徴とする。 According to Claim 7 of the present invention, in the method for removing deformed shapes according to Claim 6, the supplying step and the removing step are performed in a humidity-adjusted atmosphere, and aggregation of the metal balls is suppressed. And
　本発明の異形除去装置および異形除去方法によれば、移動面に金属ボールを接触させることにより金属ボールを回転させ、金属ボールのボール形状により生じる転がり挙動の違いからボール形状が異形化した形状不良品を除去でき、かくして多数の金属ボールの中に含まれた形状不良品を除去し、異形含有率を低減し得る。 According to the irregular shape removing apparatus and irregular shape removing method of the present invention, the metal ball is rotated by bringing the metal ball into contact with the moving surface, and the shape of the ball is deformed due to the difference in rolling behavior caused by the ball shape of the metal ball. Non-defective products can be removed, and thus defective products contained in a large number of metal balls can be removed, and the content of irregular shapes can be reduced.
微小な半田ボールの造粒から実装までの工程を示す概略図である。It is the schematic which shows the process from granulation of a small solder ball to mounting. 本発明の異形除去装置の構成を示す概略図である。It is the schematic which shows the structure of the deformed shape removal apparatus of this invention. 異形除去装置の傾斜板と円盤との配置構成を示す概略図である。It is the schematic which shows the arrangement configuration of the inclination board and disk of a deformed shape removal apparatus. 他の実施の形態による異形除去装置の構成（１）を示す概略図である。It is the schematic which shows the structure (1) of the deformed shape removal apparatus by other embodiment. 他の実施の形態による異形除去装置の構成（２）を示す概略図である。It is the schematic which shows the structure (2) of the deformed shape removal apparatus by other embodiment.
　ここでは、先ず始めにフリップチップ実装、或いはTSV（Through-Silicon Via：Si貫通電極）構造に適用する直径60［μm］以下の微小な半田ボールに用いる異形除去装置について以下説明する。図１は、例えばTSVに用いる直径10～60［μm］の微小な半田ボールについて、造粒から実装するまでの一連の工程を概略的に示したものである。この場合、製造業者にて行われる製造工程と、取引業者にて行われる実装工程とに大きく分けることができる。製造工程は、微小な半田ボールを造粒する造粒工程SP1、多数の半田ボールの中からボール形状が異形化した形状不良品を除去する分級工程SP2、および形状不良品を取り除いたボール群を容器に封入して梱包する梱包工程SP3に分けることができる。一方、搬送・実装工程は、例えば梱包工程SP3にて梱包された製品を製造現場から実装現場まで搬送した後、容器に封入された半田ボールを実装現場にてTSVデバイスに実装する実装工程SP4を備える。 Here, first of all, a description will be given of an irregular shape removing device used for a small solder ball having a diameter of 60 [μm] or less applied to a flip chip mounting or a TSV (Through-Silicon-Via: Si through electrode) structure. FIG. 1 schematically shows a series of steps from granulation to mounting for a fine solder ball having a diameter of 10 to 60 [μm] used for TSV, for example. In this case, it can be roughly divided into a manufacturing process performed by a manufacturer and a mounting process performed by a trader. The manufacturing process consists of a granulation process SP1 that granulates minute solder balls, a classification process SP2 that removes defective shape balls with irregular shapes from many solder balls, and a group of balls from which defective shape products have been removed. It can be divided into packing process SP3 which is packed in a container and packed. On the other hand, the transport / mounting process includes, for example, a mounting process SP4 in which the product packed in the packing process SP3 is transported from the manufacturing site to the mounting site, and then the solder balls enclosed in the container are mounted on the TSV device at the mounting site. Prepare.
　ここで、この実施の形態の場合、造粒工程SP1では、ワイヤーカット法やUDS（Uniform Droplet Spray method）法、アトマイズ法（ペースト用粉のみ）によって微小な半田ボールを造粒する。なお、この実施の形態においては、金属ボールとして、例えばSn-Ag-Cu系、Sn-Bi系、Sn-Ag系、Sn-Cu系、Sn-Zn系等のSn基合金（Sn量が40[％]以上の合金をいう）でなる半田ボールを用いるようにした場合について述べるが、本発明はこれに限らず、Au基合金、Cu基合金、Ag基合金、Ni基合金、またはPb基合金（いずれも基合金とは、元素（Au,Cu,Ag,Ni,Pb）量が40[％]以上の合金をいう）のいずれかからなる他の金属ボールを用いるようにしても良い。 Here, in the case of this embodiment, in the granulation step SP1, fine solder balls are granulated by a wire cut method, a UDS (Uniform Droplet Spray method) method, or an atomizing method (paste powder only). In this embodiment, for example, Sn-Ag-Cu-based, Sn-Bi-based, Sn-Ag-based, Sn-Cu-based, Sn-Zn-based Sn-based alloys (Sn amount is 40) are used as the metal balls. [%] Refers to the case of using a solder ball made of an alloy), but the present invention is not limited to this, and the present invention is not limited to this. You may make it use the other metal ball | bowl which consists of either of an alloy (all base alloys mean the alloy whose element (Au, Cu, Ag, Ni, Pb) amount is 40 [%] or more).
　因みに、半田ボールを含め、この種の金属ボールは、微小化されることで凝集（多数の金属ボールが集団化し、あたかも一つの塊のように振る舞うような現象の他、半田ボールが周辺部材にへばりついてしまう（付着してしまう）現象を指す）し易くなる。そのため、この実施の形態の場合には、造粒工程SP1のときだけでなく、分級工程SP2や、梱包工程SP3、さらには実装工程SP4に亘って半田ボールの凝集を防ぐ必要がある。 By the way, this type of metal ball, including solder balls, is agglomerated by being miniaturized (in addition to the phenomenon that many metal balls are grouped and behave like a lump, solder balls are attached to peripheral members. This refers to the phenomenon of sticking (attaching). Therefore, in this embodiment, it is necessary to prevent agglomeration of solder balls not only during the granulation step SP1, but also during the classification step SP2, the packing step SP3, and further the mounting step SP4.
　そこで、凝集し易い半田ボールの場合には、分級工程SP2、梱包工程SP3および実装工程SP4に亘って半田ボールを取り扱う環境の相対湿度を調整し、各工程の雰囲気を乾燥化させることで、微小な半田ボールの凝集を抑制し得る。相対湿度としては、20［％RH］以下、好ましくは15［％RH］以下が望ましい。すなわち、分級工程SP2、梱包工程SP3および実装工程SP4では、造粒工程SP1から継続して相対湿度を20［％RH］以下に保つことで半田ボールが凝集し難くなり、半田ボールの凝集によってボール形状が異形化した形状不良品の生成や、半田ボールの周辺部材への付着を抑制し得る。また、相対湿度を15［％RH］以下とした場合には、粒径40[μm]以下の微小な半田ボールでも凝集し難くなり、凝集による形状不良品の生成や、半田ボールの周辺部材への付着を抑制し得る。その一方で、相対湿度が20［％RH］を超えると、半田ボールが次第に凝集してゆき、複数の半田ボールがくっついて一体化した凝集物が増え、また半田ボールが周辺部材に付着し易くなる。 Therefore, in the case of solder balls that tend to aggregate, the relative humidity of the environment in which the solder balls are handled is adjusted throughout the classification process SP2, the packaging process SP3, and the mounting process SP4, and the atmosphere in each process is dried to make it fine. Aggregation of the solder balls can be suppressed. The relative humidity is 20 [% RH] or less, preferably 15 [% RH] or less. That is, in the classification process SP2, the packaging process SP3, and the mounting process SP4, the solder balls are less likely to agglomerate by maintaining the relative humidity below 20% RH continuously from the granulation process SP1. It is possible to suppress generation of a defective shape having a deformed shape and adhesion of solder balls to peripheral members. In addition, when the relative humidity is 15% RH or less, it becomes difficult to agglomerate even with a small solder ball having a particle size of 40 μm or less. Can be suppressed. On the other hand, when the relative humidity exceeds 20 [% RH], the solder balls gradually aggregate, and a plurality of solder balls stick together to increase the aggregate, and the solder balls easily adhere to peripheral members. Become.
　なお、相対湿度の調整は、これら分級工程SP2、梱包工程SP3および実装工程SP4を行う作業空間である室内自体を湿度調整手段で湿度調整してもよく、或いは分級工程SP2で用いる異形除去装置や、梱包工程SP3で用いる梱包装置、実装工程SP4で用いる実装装置の各装置本体内の作業空間だけを湿度調整手段によって湿度調整するようにしてもよい。作業空間のみを湿度調整する場合は乾燥空気やアルゴン、窒素、ヘリウムなどのガスを使用しても良く、また真空ポンプで減圧排気することにより作業空間の湿度を調整するようにしても良い。 The relative humidity may be adjusted by adjusting the humidity of the room itself, which is a work space for performing the classification process SP2, the packaging process SP3, and the mounting process SP4, by using a humidity adjustment means, Only the working space in each device main body of the packaging device used in the packaging step SP3 and the mounting device used in the packaging step SP4 may be humidity adjusted by the humidity adjusting means. When humidity is adjusted only in the work space, a gas such as dry air, argon, nitrogen, or helium may be used, and the humidity in the work space may be adjusted by evacuating with a vacuum pump.
　図２は、分級工程SP2にて用いられる本発明の異形除去装置1を示す。この異形除去装置1は、図示しない駆動手段により回転軸2aを中心に回転する円盤2と、造粒工程SP1にて造粒した半田ボールBを円盤2上に供給してゆく傾斜板3と、円盤2の外周から落下する異形化してない良品の半田ボールB1のみを回収する回収容器4とを備えている。 FIG. 2 shows the irregular shape removing apparatus 1 of the present invention used in the classification step SP2. This irregular shape removing device 1 includes a disk 2 that rotates around a rotating shaft 2a by a driving means (not shown), an inclined plate 3 that supplies the solder balls B granulated in the granulation step SP1 onto the disk 2, And a collection container 4 for collecting only non-deformed good solder balls B1 falling from the outer periphery of the disk 2.
　これに加えて、この実施の形態の場合、異形除去装置1は、図示しない湿度調整手段を備えており、円盤2、傾斜板3および回収容器4を設置した装置本体内の湿度調整を行え得るようになされている。この場合、湿度調整手段は、例えば、円盤2、傾斜板3および回収容器4を収容して外気と隔離させる箱状のボックスと、ボックス内に窒素等のガスを供給して作業空間となるボックス内の相対湿度を調整する気体供給部とを備えている。 In addition to this, in the case of this embodiment, the profile removing device 1 includes a humidity adjusting means (not shown), and can perform humidity adjustment in the apparatus main body in which the disc 2, the inclined plate 3 and the collection container 4 are installed. It is made like that. In this case, the humidity adjusting means includes, for example, a box-like box that contains the disk 2, the inclined plate 3, and the collection container 4 and is separated from the outside air, and a box that becomes a work space by supplying a gas such as nitrogen into the box. And a gas supply unit for adjusting the relative humidity inside.
　なお、この実施の形態の場合においては、異形除去装置1の装置本体に湿度調整手段を設置した場合について述べるが、本発明はこれに限らず、異形除去装置1の装置本体とは別体に湿度調整手段を設け、異形除去装置1が設置された作業空間たる室内自体を湿度調整手段によって湿度調整してもよい。 In the case of this embodiment, the case where the humidity adjusting means is installed in the apparatus main body of the irregular shape removing apparatus 1 will be described, but the present invention is not limited to this, and is separate from the apparatus main body of the irregular shape removing apparatus 1. Humidity adjustment means may be provided, and the humidity of the room itself, which is the work space in which the profile removing device 1 is installed, may be adjusted by the humidity adjustment means.
　この実施の形態の場合、移動体としての円盤2は、例えば表面が平坦な板部材により形成されており、薄肉状で直径1～200［cm］の円形状に形成されている。なお、円盤2は、移動面2bの平坦性が高い素材であればよく、例えばガラス板、金属板、プラスティック板等その他種々の部材により形成され得る。円盤2における移動面2bの平滑性は、一般的な算術平均粗さRaで5～1000[nm]であればよく、好ましくは5～500[nm]、最も好ましくは5～100[nm]であれば平滑性が充分確保される。また、この円盤2は、駆動手段によって、例えば反時計周り方向に回転数5～500［rpm]、好ましくは30～120[rpm]で回転され得るようになされている。この実施の形態の場合、円盤2は、円形状の移動面2bがほぼ水平に配置され、当該移動面2bを水平に維持したまま回転軸2aを中心に回転し得るようになされている。因みに、図示しない駆動手段は、円盤2の上方または下方に配置され、回転軸2aに連結させた軸部を回転させ、当該軸部に連動させて円盤2を回転させ得る。 In the case of this embodiment, the disk 2 as a moving body is formed of, for example, a plate member having a flat surface, and is formed into a thin circular shape having a diameter of 1 to 200 [cm]. The disk 2 may be any material as long as the moving surface 2b has high flatness, and may be formed of various other members such as a glass plate, a metal plate, and a plastic plate. The smoothness of the moving surface 2b in the disk 2 may be a general arithmetic average roughness Ra of 5 to 1000 [nm], preferably 5 to 500 [nm], and most preferably 5 to 100 [nm]. If there is, sufficient smoothness is secured. The disk 2 can be rotated by a driving means, for example, in a counterclockwise direction at a rotational speed of 5 to 500 [rpm], preferably 30 to 120 [rpm]. In the case of this embodiment, the disk 2 has a circular moving surface 2b arranged substantially horizontally, and can rotate around the rotation axis 2a while keeping the moving surface 2b horizontal. Incidentally, the driving means (not shown) is arranged above or below the disk 2 and can rotate the disk 2 in conjunction with the shaft by rotating the shaft connected to the rotating shaft 2a.
　回収容器4は、有底筒状からなり、直径が円盤2の直径よりも一回り大きく形成されており、壁部および底部にて囲まれた空間ER1に円盤2から落下してくる良質の半田ボールB1を回収し得るようになされている。 The collection container 4 has a bottomed cylindrical shape and has a diameter that is slightly larger than the diameter of the disk 2. The high-quality solder that falls from the disk 2 into the space ER1 surrounded by the wall and the bottom. The ball B1 can be collected.
　円盤2の上方に配置された傾斜板3は、長方形状で平滑な傾斜面3aを有しており、傾斜面3aが円盤2の移動面2bに対し傾斜するように所定角度を設けて配置されている。これにより、傾斜板3は、上端側から連続的に多数の半田ボールBが供給されると、当該傾斜面3aを半田ボールBが滑り落ち、下端から下方に落下させて移動面2b上に半田ボールBを供給し得るようになされている。 The inclined plate 3 disposed above the disk 2 has a rectangular and smooth inclined surface 3a, and is disposed at a predetermined angle so that the inclined surface 3a is inclined with respect to the moving surface 2b of the disk 2. ing. Thus, when a large number of solder balls B are continuously supplied from the upper end side of the inclined plate 3, the solder ball B slides down on the inclined surface 3a and falls downward from the lower end to solder onto the moving surface 2b. Ball B can be supplied.
　実際上、この実施の形態の場合、傾斜板3は、円盤2の移動面2bに対し20～80度の角度で配置され、好ましくは40度以上の角度で配置されることが望ましく、40度以上とすることで傾斜面3a上の半田ボールBを確実に滑り落とすことができる。なお、傾斜板3は、良品の半田ボール、形状不良品を問わず傾斜面3aを滑り落ちる程度に初速を与えて落下させるようにしてもよく、この場合、確実に半田ボールを円盤2まで到達させることができる。また、半田ボールが1個ずつ円盤2に到達するように、パーツフィーダー等の振動供給手段によって傾斜板3に振動を与えて半田ボールBを円盤2に供給する構成としても良い。 In practice, in the case of this embodiment, the inclined plate 3 is disposed at an angle of 20 to 80 degrees with respect to the moving surface 2b of the disk 2, and is desirably disposed at an angle of 40 degrees or more, preferably 40 degrees. By doing so, the solder ball B on the inclined surface 3a can be reliably slid down. It should be noted that the inclined plate 3 may be dropped by giving an initial speed to the extent that it slides down the inclined surface 3a regardless of whether it is a good solder ball or a defective shape. In this case, the solder ball surely reaches the disk 2. be able to. Alternatively, the solder balls B may be supplied to the disk 2 by applying vibration to the inclined plate 3 by vibration supply means such as a parts feeder so that the solder balls reach the disk 2 one by one.
　また、傾斜板3は、半田ボールBが排出される下端と、円盤2の移動面2bとの間に1～30[mm]の隙間を設けて配置されており、傾斜面3aを滑り落ちてくる半田ボールBのボール群を移動面2b上に落下させ得る。さらに、傾斜板3は、図３に示すように、移動面2bに対してボール群を供給する供給方向x2が、移動面2bの移動方向x1と逆方向となるように配置されている。 Further, the inclined plate 3 is arranged with a gap of 1 to 30 [mm] between the lower end from which the solder ball B is discharged and the moving surface 2b of the disk 2, and slips down the inclined surface 3a. The ball group of the coming solder balls B can be dropped on the moving surface 2b. Further, as shown in FIG. 3, the inclined plate 3 is arranged such that the supply direction x2 for supplying the ball group to the moving surface 2b is opposite to the moving direction x1 of the moving surface 2b.
　傾斜板3は、移動面2bの移動方向x1と逆方向で、かつ所定の角度で半田ボールBを移動面2bに対し供給することにより、半田ボールBを移動面2bに接触させ、移動方向x1へ向かう移動面2bから与えられる力によって半田ボールBの挙動を変えさせて、移動面2b上で半田ボールBを強制的に回転させ得るようになされている。 The inclined plate 3 supplies the solder ball B to the moving surface 2b in a direction opposite to the moving direction x1 of the moving surface 2b and at a predetermined angle, thereby bringing the solder ball B into contact with the moving surface 2b and moving direction x1 The behavior of the solder ball B is changed by the force applied from the moving surface 2b toward the solder ball B so that the solder ball B can be forcibly rotated on the moving surface 2b.
　因みに、この実施の形態の場合、傾斜板3は、傾斜板3の長手方向H1が、円盤2の半径方向H2に対し直交するように配置されており、傾斜面3aを滑り落ちてくる半田ボールBの供給方向x2と、半田ボールBの供給位置での移動面2bの移動方向x1とが逆方向で、かつ平行になるよう配置されている。これにより、供給方向x2に向かう半田ボールBは、移動面2bと接触した際、移動面2bとの接触面に供給方向x2とは真逆方向に力が加わることで回転力が与えられ、移動面2b上で確実に回転し得るようになされている。 Incidentally, in the case of this embodiment, the inclined plate 3 is arranged so that the longitudinal direction H1 of the inclined plate 3 is orthogonal to the radial direction H2 of the disk 2, and the solder ball sliding down the inclined surface 3a. The supply direction x2 of B and the movement direction x1 of the movement surface 2b at the supply position of the solder ball B are arranged in opposite directions and in parallel. As a result, when the solder ball B heading in the supply direction x2 comes into contact with the moving surface 2b, a rotational force is applied to the contact surface with the moving surface 2b by applying a force in a direction opposite to the supply direction x2, thereby moving the solder ball B. It is designed to be able to rotate reliably on the surface 2b.
　なお、この上述した実施の形態においては、傾斜板3の長手方向H1が円盤2の半径方向H2と直交するように配置し、供給方向x2と移動方向x1とが逆向きで平行になるように傾斜板3を配置させるようにした場合について述べたが、本発明はこれに限らず、移動方向x1に対して逆方向側から半田ボールを移動面2bに供給できれば、例えば傾斜板3の長手方向H1を、円盤2の半径方向H2に対し30度や60度など種々の方向に配置させてもよい。 In the above-described embodiment, the inclined plate 3 is disposed so that the longitudinal direction H1 thereof is orthogonal to the radial direction H2 of the disk 2, and the supply direction x2 and the moving direction x1 are opposite and parallel to each other. Although the case where the inclined plate 3 is arranged has been described, the present invention is not limited to this, and if the solder ball can be supplied to the moving surface 2b from the direction opposite to the moving direction x1, for example, the longitudinal direction of the inclined plate 3 H1 may be arranged in various directions such as 30 degrees and 60 degrees with respect to the radial direction H2 of the disk 2.
　因みに、半田ボールBが供給される円盤2は、移動面2bに適度な摩擦抵抗を有していることが望ましく、移動面2bに半田ボールBが摺接したとき、当該移動面2bの摩擦抵抗と、移動面2bの回転力とによって良品の半田ボールB1を回転させ得るように構成されている。 Incidentally, the disk 2 to which the solder ball B is supplied preferably has an appropriate frictional resistance on the moving surface 2b, and when the solder ball B comes into sliding contact with the moving surface 2b, the frictional resistance of the moving surface 2b is concerned. And a non-defective solder ball B1 can be rotated by the rotational force of the moving surface 2b.
　以上の構成において、この異形除去装置1では、傾斜板3の上端側から多数の半田ボールBが供給されると、傾斜面3a上を半田ボールBが滑り落ちてゆき、傾斜板3の下端下方に配置された円盤2の移動面2b上に半田ボールBを落下させてゆく。これにより、異形除去装置1は、回転している円盤2の移動面2bに半田ボールBを摺接させることにより半田ボールBに回転力を与え、半田ボールBを回転させる。この際、円盤2は、真球状に形成された良品の半田ボールB1が外周へ向けて転がり、ボール形状が異形化した形状不良品B2が移動面2b上に滞留するように回転している。 In the above-described configuration, in the irregular shape removing device 1, when a large number of solder balls B are supplied from the upper end side of the inclined plate 3, the solder balls B slide down on the inclined surface 3a, and the lower end of the inclined plate 3 is below the lower end. The solder ball B is dropped onto the moving surface 2b of the disk 2 arranged in the above. As a result, the irregular shape removing device 1 applies a rotational force to the solder ball B by causing the solder ball B to slide in contact with the moving surface 2b of the rotating disk 2, thereby rotating the solder ball B. At this time, the disk 2 rotates so that a good solder ball B1 formed in a spherical shape rolls toward the outer periphery, and a defective shape product B2 having a deformed ball shape stays on the moving surface 2b.
　これにより、図２および図３に示すように、ボール形状が真球状に形成された良品の半田ボールB1は、円盤2の回転方向に沿って転がってゆき、遠心力により円盤2の外周から飛び出して落下する。かくして、回収容器4では、真球状でなる良品の半田ボールB1を回収することができる。一方、半田ボールBのうちボール形状が異形化した形状不良品B2は、良品の半田ボールB1とボール形状が異なることから良品の半田ボールB1とは転がり挙動が異なり、良品の半田ボールB1のように円盤2の外周から飛び出すことなく、円盤2上の一定箇所を周回し続け、円盤2上の中心領域に滞留する。 As a result, as shown in FIGS. 2 and 3, a good solder ball B1 having a ball shape formed into a spherical shape rolls along the rotation direction of the disk 2 and jumps out of the outer periphery of the disk 2 by centrifugal force. Fall. Thus, the recovery container 4 can recover a good solder ball B1 having a true spherical shape. On the other hand, the defective shape B2 of the solder ball B, which has a deformed ball shape, differs in rolling behavior from the good solder ball B1 because the ball shape is different from that of the good solder ball B1, and like the good solder ball B1. Without going out from the outer periphery of the disk 2, it continues to circulate around a certain place on the disk 2 and stays in the central region on the disk 2.
　このように異形除去装置1では、移動面2bに半田ボールBを接触させることにより半田ボールBを回転させ、半田ボールBのボール形状により生じる転がり挙動の違いからボール形状が異形化した形状不良品B2だけを除去でき、かくして多数の半田ボールBの中に含まれた形状不良品B2を除去し、異形含有率を低減し得る。 As described above, in the irregular shape removing apparatus 1, the solder ball B is rotated by bringing the solder ball B into contact with the moving surface 2b, and the shape of the defective ball ball is deformed due to the difference in rolling behavior caused by the ball shape of the solder ball B. Only B2 can be removed, and thus defective shape products B2 contained in a large number of solder balls B can be removed, and the deformed content rate can be reduced.
　因みに、円盤2の移動方向x1と同じ方向側から移動面2bに向けて半田ボールBを供給した場合（すなわち、半田ボールBの供給方向と、半田ボールBの供給位置での移動面2bの移動方向x1とが同じ方向の場合）には、供給方向に向けて飛び出した半田ボールBを移動面2bが同じ方向の移動方向x1へそのまま搬送するだけとなり、半田ボールBを回転させるような回転力が半田ボールBに生じ難くなる。その結果、良品の半田ボールB1と形状不良品B2は、遠心力によっていずれも円盤2の外周から落下し、ボール形状の違いから生じる転がり挙動の変化が現れ難くなる。よって、本発明の異形除去装置1のように、移動面2bの回転方向x1の逆方向側から移動面2bに向けて半田ボールBを供給することが望ましく、この場合、ボール形状の違いに応じて転がり挙動が変化し、ボール群から形状不良品B2を除去し得る。 Incidentally, when the solder ball B is supplied from the same direction side as the moving direction x1 of the disk 2 toward the moving surface 2b (that is, the moving direction of the solder ball B and the moving surface 2b at the position where the solder ball B is supplied). In the case where the direction x1 is the same direction), the solder ball B that has jumped out in the supply direction is simply transported in the moving direction x1 in the same direction by the moving surface 2b, and the rotational force that rotates the solder ball B Is less likely to occur on the solder ball B. As a result, the good solder balls B1 and the poorly shaped products B2 both fall from the outer periphery of the disk 2 due to the centrifugal force, and the change in rolling behavior caused by the difference in the ball shapes hardly appears. Therefore, it is desirable to supply the solder balls B from the opposite direction side of the rotation direction x1 of the moving surface 2b to the moving surface 2b as in the deformed shape removing apparatus 1 of the present invention. In this case, depending on the difference in the ball shape Thus, the rolling behavior is changed, and the defective shape product B2 can be removed from the ball group.
　また、この異形除去装置1では、相対湿度を調整した雰囲気下で分級作業が行われることにより、造粒工程SP1にて造粒した微小な半田ボールが凝集することなくそのまま分散した状態を維持させることができ、分級工程SP2にて半田ボールBが凝集することにより生じるボール形状の異形化を抑制し、異形含有率を低減し得る。 Further, in this irregular shape removing device 1, the classification work is performed under an atmosphere adjusted for relative humidity, so that the fine solder balls granulated in the granulation step SP1 are maintained in a dispersed state without agglomeration. It is possible to suppress the deforming of the ball shape caused by the aggregation of the solder balls B in the classification step SP2, and to reduce the deformed content rate.
　因みに、微小な半田ボールBは、分級工程SP2のみならず、その後の梱包工程SP3から実装工程SP4に亘って湿度調整を行うことが望ましい。この場合、異形除去装置1にて選定された良品の半田ボールB1は、相対湿度20[％RH]以下の雰囲気下で気密性の高い容器に封入される。良品の半田ボールB1のみが封入された容器は、密閉状態が維持されたまま梱包され、当該半田ボールを実装部品として使用する各取引業者に搬送された後、実装工程SP4にて使用される。なお、実装工程SP4でも相対湿度を20[％RH]以下の雰囲気に維持し続けることで、容器の開封や、容器内部からの半田ボールB1の取り出し作業、半田ボールB1の実装作業にて、半田ボールB1の凝集を防止することができる。 Incidentally, it is desirable to adjust the humidity of the small solder ball B not only in the classification process SP2, but also in the subsequent packaging process SP3 to the mounting process SP4. In this case, a good solder ball B1 selected by the profile removing device 1 is sealed in a highly airtight container in an atmosphere with a relative humidity of 20 [% RH] or less. The container in which only the non-defective solder ball B1 is sealed is packed in a sealed state, and is transported to each trader who uses the solder ball as a mounting component, and then used in the mounting process SP4. In the mounting process SP4, the relative humidity is kept at an atmosphere of 20 [% RH] or less, so that the solder can be opened in the container, the solder ball B1 is removed from the container, and the solder ball B1 is mounted. Aggregation of the ball B1 can be prevented.
　ところで、従来、微小な半田ボールの製造過程において半田ボールの凝集を抑制する手法としては、造粒工程中に半田ボールの表面を分散剤でコーティングし、半田ボールの凝集を抑制することが一般的であった。しかしながら、このような分散剤を用いた場合には、半田ボールの表面が分散剤によって汚染されることから、半田ボールの接合性が低下してしまうという問題がある。特に微小な半田ボールでは、基板同士を接合させる実装部品として用いる際、径が小さいことからその接合面積も小さいため、接合性が低下により接合不良が発生し易くなってしまう。 By the way, conventionally, as a technique for suppressing the agglomeration of the solder ball in the manufacturing process of the minute solder ball, it is common to coat the surface of the solder ball with a dispersing agent during the granulation process to suppress the agglomeration of the solder ball. Met. However, when such a dispersant is used, the surface of the solder ball is contaminated by the dispersant, so that there is a problem that the bondability of the solder ball is lowered. In particular, in the case of a small solder ball, when used as a mounting component for joining substrates together, since the diameter is small, the joining area is also small.
　これに対して、この実施の形態においては、異形除去装置1を用いた分級工程SP2時や、梱包工程SP3時、実装工程SP4時において、相対湿度を調整することで、分散剤を用いることなく微小な半田ボールの凝集を抑制するようにした。これにより本発明の異形除去装置1にて分級される半田ボールは、分散剤を用いない分、接合性が低下することなく、基板同士を確実に接合させることができる。 On the other hand, in this embodiment, the relative humidity is adjusted at the time of the classification process SP2 using the deformed shape removing device 1, the packing process SP3, and the mounting process SP4, without using a dispersant. The agglomeration of minute solder balls was suppressed. As a result, the solder balls classified by the deformed shape removing apparatus 1 of the present invention can reliably bond the substrates to each other without deteriorating the bondability because the dispersant is not used.
　なお、本発明は、本実施の形態に限定されるものではなく、本発明の要旨の範囲内で種々の変形実施が可能であり、例えば円盤2の中心領域に集まった形状不良品B2を回収するような構成を備えた異形除去装置を適用してもよい。 The present invention is not limited to the present embodiment, and various modifications are possible within the scope of the gist of the present invention. For example, the defective shape product B2 collected in the central region of the disk 2 is collected. You may apply the irregular shape removal apparatus provided with such a structure.
　この場合、図２との対応部分に同一符号を付して示す図４は、上述した実施の形態とは円盤12の構成が異なる異形除去装置11を示す。実際上、円盤12は、中心領域に円形状に凹んだ収容部14が形成されており、回転した円盤12に対し傾斜板3から半田ボールBが供給されることで中心領域に集まる形状不良品B2を収容部14にて回収し得るようになされている。なお、この収容部14は、円盤12の厚みを貫通した貫通孔としてもよい。この場合、円盤12下方に配置される回収容器は、円盤12の外周に沿って配置され外周から飛び出す良品の半田ボールB1を回収する環状の第1容器と、中心領域の貫通孔下方に配置され貫通孔から落下する形状不良品B2を回収する有底筒状の第2容器とを設ける。 In this case, FIG. 4 in which the same reference numerals are assigned to the corresponding parts as in FIG. 2 shows the deformed shape removing device 11 having a disc 12 configuration different from that of the above-described embodiment. In practice, the disc 12 has a recess 14 formed in a circular shape in the central region, and the defective shape that collects in the central region when the solder balls B are supplied from the inclined plate 3 to the rotated disc 12. B2 can be collected in the storage unit 14. The accommodating portion 14 may be a through hole that penetrates the thickness of the disk 12. In this case, the collection container disposed below the disk 12 is disposed along the outer periphery of the disk 12 and is disposed below the through hole in the central region, and the annular first container that collects good solder balls B1 that jump out of the outer periphery. A bottomed cylindrical second container that collects the defective shape product B2 falling from the through hole is provided.
　これにより、異形除去装置では、形状不良品を貫通孔から円盤12下方に落下させ、そのまま第2容器にて回収することができ、円盤12上に形状不良品B2が貯まることがないのでその分、形状不良品B2を円盤12から除去する除去作業を行う必要がなく、そのまま連続して分級作業を続けることができる。 As a result, the irregular shape removing device can drop the defective shape product from the through hole to the lower side of the disk 12 and collect it in the second container as it is, and the defective shape product B2 does not accumulate on the disk 12. Therefore, it is not necessary to perform the removal work for removing the defective shape product B2 from the disk 12, and the classification work can be continued continuously.
　また、他の実施の形態としては、図２との対応部分に同一符号を付した図５のような異形除去装置21を適用するようにしても良い。実際上、この異形除去装置21は、円柱状に形成された円柱回転体22と、円柱回転体22に半田ボールBを供給する傾斜板3と、円柱回転体22の下方に配置された傾斜台25とを備えている。この場合、円柱回転体22は、回転軸22aが水平に配置されており、図示しない駆動手段によって回転軸22aを中心に移動面22bが時計周り方向に回転し得るようになされている。 Also, as another embodiment, a deformity removing apparatus 21 as shown in FIG. 5 in which the same reference numerals are attached to the corresponding parts as in FIG. 2 may be applied. Actually, the irregular shape removing device 21 includes a columnar rotating body 22 formed in a columnar shape, an inclined plate 3 that supplies the solder balls B to the columnar rotating body 22, and an inclined table disposed below the columnar rotating body 22. And 25. In this case, the cylindrical rotating body 22 has a rotating shaft 22a disposed horizontally, and a moving surface 22b can be rotated clockwise around the rotating shaft 22a by a driving means (not shown).
　傾斜板3は、円柱回転体22の回転方向とは逆方向側から半田ボールBを移動面22bに対し供給する傾斜面3aを有しており、半田ボールBを移動面22bに接触させることにより半田ボールBに回転力を与え得る。実際上、この実施の形態の場合、傾斜板3は、下端が円柱回転体22の回転軸22aよりも上方に配置され、かつ下端が回転軸22aを通る垂線P1よりも回転後方側に位置しており、傾斜面3aが移動面22bに向かうように斜め下方向に傾斜している。これにより、傾斜板3は、円柱回転体22の回転方向とは逆方向側から半田ボールBを移動面22bに対し供給し得るようになされている。 The inclined plate 3 has an inclined surface 3a for supplying the solder ball B to the moving surface 22b from the direction opposite to the rotation direction of the cylindrical rotating body 22, and by bringing the solder ball B into contact with the moving surface 22b, A rotational force can be applied to the solder ball B. In practice, in the case of this embodiment, the inclined plate 3 is positioned lower than the rotation axis 22a of the cylindrical rotating body 22 and the lower end is positioned on the rotation rear side with respect to the perpendicular P1 passing through the rotation axis 22a. The inclined surface 3a is inclined downward so that the inclined surface 3a faces the moving surface 22b. Thus, the inclined plate 3 can supply the solder balls B to the moving surface 22b from the direction opposite to the rotation direction of the cylindrical rotating body 22.
　この際、ボール形状が真球状でなる良品の半田ボールB1は、時計周り方向に回転する移動面22bと接触することで、例えば反時計周り方向へ回転してそのまま傾斜台25に落下してゆく。一方、ボール形状が異形化した形状不良品B2は、一方向に回転する移動面22bと接触しても、ボール形状が異形化して非真球状のために回転し難く、非回転のまま傾斜台25に落下してゆく。 At this time, the non-defective solder ball B1 whose ball shape is a spherical shape contacts the moving surface 22b that rotates in the clockwise direction, and for example, rotates in the counterclockwise direction and falls to the tilting table 25 as it is. . On the other hand, the deformed product B2 with a deformed ball shape is difficult to rotate because of the non-spherical shape of the ball even if it contacts the moving surface 22b that rotates in one direction. It falls to 25.
　円柱回転体22の下方に配置された傾斜台25は、円柱回転体22の回転後方側に下端側が配置され、円柱回転体22の回転前方側に上端側が配置された傾斜面25aを有しており、円柱回転体22から落下してくる半田ボールBを傾斜面25aにて受け止める。これにより、円柱回転体22によって例えば反時計周り方向に回転された良品の半田ボールB1は、傾斜台25に落下すると、円柱回転体22から与えられた反時計周り方向の回転力でそのまま傾斜面25aを転がり落ちてゆく。 The inclined base 25 disposed below the cylindrical rotating body 22 has an inclined surface 25a in which the lower end side is disposed on the rotating rear side of the cylindrical rotating body 22 and the upper end side is disposed on the rotating front side of the cylindrical rotating body 22. The solder ball B falling from the cylindrical rotating body 22 is received by the inclined surface 25a. As a result, when the good solder ball B1 rotated in the counterclockwise direction, for example, by the cylindrical rotating body 22 falls on the tilting table 25, the inclined surface remains as it is by the counterclockwise rotational force applied from the cylindrical rotating body 22. Roll down 25a.
　ここで、傾斜台25は、真球状でなる良品の半田ボールB1が傾斜面25a上を回転しながら下端まで転がり、その一方で非回転状態の形状不良品B2が滑り落ちることなくそのまま傾斜面25a上に滞留し得るように、その傾斜面25aの角度が調整されている。これにより、異形除去装置21は、真球状でなる良品の半田ボールB1を傾斜台25の下端に配置された回収容器（図示せず）に回収し得、上述の実施の形態と同様の効果を得ることができる。また、このような異形除去装置21でも、上述と同様に湿度調整手段を設けることで、微小な半田ボールBの凝集を防止しつつ、形状不良品B2を除去することができる。 Here, the tilting table 25 is such that a good spherical solder ball B1 rolls on the inclined surface 25a while rolling to the lower end, while the non-rotating non-rotating defective product B2 does not slide down on the inclined surface 25a. The angle of the inclined surface 25a is adjusted so that it can stay in the air. As a result, the irregular shape removing device 21 can collect the non-defective solder ball B1 having a true spherical shape in a collection container (not shown) disposed at the lower end of the inclined base 25, and can achieve the same effect as the above-described embodiment. Obtainable. Further, even with such an irregular shape removing device 21, it is possible to remove the defective shape product B2 while preventing agglomeration of minute solder balls B by providing the humidity adjusting means in the same manner as described above.
　また、その他の実施の形態としては、例えば図１に示した異形除去装置1を複数段上下に積層させた構成を有する異形除去装置としても良い。この場合、異形除去装置では、上から下に向かうに従って円盤の径が次第に大きくなるようにして複数の円盤を配置し、上方に配置した円盤から下方に配置した円盤上に半田ボールを落下させるようにする。 Further, as another embodiment, for example, an irregular shape removing apparatus having a configuration in which the irregular shape removing apparatus 1 shown in FIG. In this case, in the irregular shape removing device, the plurality of disks are arranged so that the diameter of the disk gradually increases from the top to the bottom, and the solder balls are dropped from the disks arranged above to the disks arranged below. To.
　これによりこの異形除去装置では、各段の円盤毎に形状不良品を除去することができ、上方の傾斜板3にボール群を単に供給させるだけで、形状不良品を除去する除去作業を一度に円盤の数だけ複数回行うことができる。なお、図２に示す異形除去装置1や、図４に示す異形除去装置11、図５に示す異形除去装置21を必要に応じて複数段上下に積層させて組み合わせるようにした異形除去装置としてもよい。なお、これら各種異形除去装置についても、上述と同様に湿度調整手段を設けることで、微小な半田ボールBの凝集を防止しつつ、形状不良品B2を除去することができる。 As a result, in this irregular shape removing device, it is possible to remove defective products for each stage of the disk, and by simply supplying a group of balls to the upper inclined plate 3, a removal operation for removing defective products at a time is possible. It can be performed multiple times as many as the number of disks. 2 may also be combined with the irregular shape removing device 1 shown in FIG. 4, the irregular shape removing device 11 shown in FIG. 4, and the irregular shape removing device 21 shown in FIG. Good. In addition, these various irregular shape removing devices can remove the defective shape product B2 while preventing the aggregation of minute solder balls B by providing the humidity adjusting means in the same manner as described above.
　また、上述した実施の形態においては、供給手段として、板状の傾斜板3を適用した場合について述べたが、本発明はこれに限らず、傾斜板3の一端から他端までの両側辺に側壁を設けてもよく、この場合、傾斜板の一端から他端までの間に半田ボールが側辺から落下してしまうことを防止できる。また、供給手段としては傾斜板だけでなく、内部空間を半田ボールが滑り落ちる筒状体を適用してもよい。 Further, in the above-described embodiment, the case where the plate-like inclined plate 3 is applied as the supply means has been described, but the present invention is not limited to this, and on both sides from the one end to the other end of the inclined plate 3 Side walls may be provided, and in this case, it is possible to prevent the solder balls from dropping from the side between one end and the other end of the inclined plate. Further, as the supply means, not only the inclined plate but also a cylindrical body in which the solder ball slides in the internal space may be applied.
　さらに、上述した実施の形態においては、移動体として、円盤2,12を適用した場合について述べたが、本発明はこれに限らず、種々外郭形状を備えた回転体を適用してもよく、また、回転して移動面2bが一方向に回転移動する回転体のみならず、移動面2bが直線的に一方向へ移動する移動体を適用してもよい。 Furthermore, in the above-described embodiment, the case where the disks 2 and 12 are applied as the moving body has been described, but the present invention is not limited thereto, and rotating bodies having various outer shapes may be applied, Further, not only a rotating body that rotates to move the moving surface 2b in one direction but also a moving body in which the moving surface 2b moves linearly in one direction may be applied.
　具体的にこの種の移動体としては、無端状のベルト部材が第1ローラおよび第2ローラ間に架け渡され、当該ベルト部材が回転する移動体を適用してもよい。この場合、ベルト部材は、移動面が上述と同様に水平状に配置され、ベルト部材の移動方向となる一方向とは逆方向で、かつ移動面の上方から傾斜板3によって半田ボールBが供給される。このような構成であっても、半田ボールBは、ベルト部材によって強制的に回転させられ、そのボール形状により生じる転がり挙動の違いからボール形状が異形化した形状不良品B2を除去することができる。 Specifically, as this type of moving body, a moving body in which an endless belt member is stretched between the first roller and the second roller and the belt member rotates may be applied. In this case, the belt member has a moving surface arranged horizontally as described above, and the solder ball B is supplied from the upper side of the moving surface by the inclined plate 3 in a direction opposite to the moving direction of the belt member. Is done. Even in such a configuration, the solder ball B is forcibly rotated by the belt member, and it is possible to remove the defective shape product B2 in which the ball shape is deformed due to the difference in rolling behavior caused by the ball shape. .
　なお、上述した実施の形態においては、異形除去装置1に湿度調整手段（図示せず）を設け、湿度調整手段によって湿度調整した雰囲気下で半田ボールBを凝集させずに形状不良品を除去する場合について述べたが、本発明はこれに限らず、例えば分散剤によって凝集を抑制した半田ボールを用いれば、湿度調整手段によって湿度調整することなく、異形除去装置1によって半田ボールを凝集させずに形状不良品を除去することができる。 In the above-described embodiment, the irregular shape removing apparatus 1 is provided with a humidity adjusting means (not shown), and the defective shape product is removed without agglomerating the solder balls B in an atmosphere adjusted by the humidity adjusting means. Although the present invention is not limited to this, for example, if a solder ball whose aggregation is suppressed by a dispersant is used, the solder ball is not aggregated by the irregular shape removing device 1 without adjusting the humidity by the humidity adjusting means. A defective product can be removed.
　また、上述した実施の形態においては、傾斜板3から円盤2に供給する微小な金属ボールとして、直径10～60[μm]の半田ボールBを用いるようにした場合について述べたが、本発明はこれに限らず、例えば直径200[μm]以下の金属ボールや、直径100[μm]以下の金属ボールを用いるようにしても良い。 In the above-described embodiment, the case where the solder ball B having a diameter of 10 to 60 [μm] is used as the minute metal ball supplied from the inclined plate 3 to the disk 2 has been described. For example, a metal ball having a diameter of 200 [μm] or less or a metal ball having a diameter of 100 [μm] or less may be used.
　次に、図２に示した異形除去装置1を用いて実際に半田ボールの分級作業を行い、回収容器4にて回収したボール群の異形含有率を調べた。この検証試験では、φ33[μm]のSAC305組成（Sn-3.0Ag-0.5Cu：Sn-Ag-Cu系）、低銀組成（Sn-1.2Ag-0.5Cu：Sn-Ag-Cu系）、Sn-Bi組成（Sn-58Bi：Sn-Bi系）、Sn-Ag組成（Sn-3.5Ag：Sn-Ag系）、Sn-Cu組成（Sn-0.7Cu：Sn-Cu系）、Sn-Zn組成（Sn-3Zn：Sn-Zn系）の半田ボールをそれぞれ100万個造粒し、異形除去装置1によってこれら半田ボールのボール群を分級していった。実際上、この検証試験では、グローブボックス中に異形除去装置1を設置し、25℃±5℃の温度において、グローブボックス内の相対湿度を5、15、20、50[％RH]に変えてゆき、各相対湿度の雰囲気下で異形除去装置1を用いてボール群を分級した。相対湿度は、グローブボックス内に設置した湿度計（株式会社チノー ポケットサイズ温湿度計 NH-CHP）にて測定した。 Next, the solder ball classification work was actually performed using the deformed shape removing device 1 shown in FIG. 2, and the deformed content rate of the balls collected in the collecting container 4 was examined. In this verification test, SAC305 composition (Sn-3.0Ag-0.5Cu: Sn-Ag-Cu system) of φ33 [μm], low silver composition (Sn-1.2Ag-0.5Cu: Sn-Ag-Cu system), Sn -Bi composition (Sn-58Bi: Sn-Bi system), Sn-Ag composition (Sn-3.5Ag: Sn-Ag system), Sn-Cu composition (Sn-0.7Cu: Sn-Cu system), Sn-Zn composition One million (Sn-3Zn: Sn—Zn) solder balls were granulated, and the deformed ball removing device 1 classified the solder balls. In fact, in this verification test, the profile removal device 1 was installed in the glove box, and the relative humidity in the glove box was changed to 5, 15, 20, 50 [% RH] at a temperature of 25 ° C ± 5 ° C. After that, the balls were classified using the deformed shape removing device 1 under the atmosphere of each relative humidity. The relative humidity was measured with a hygrometer (Chino Co., Ltd. pocket size temperature and humidity meter NH-CHP) installed in the glove box.
　因みに、この異形除去装置1では、直径10[cm]の平坦なウェハ（移動面2bの算術平均粗さRa=20[nm]）を円盤2として用い、回転軸2aを中心にして移動面2bを水平に維持したまま回転するように円盤2を駆動機構に設置した。円盤2の上方に配置する傾斜板3は、平坦なウェハを長方形状に加工して作製し、平滑な傾斜面3aが円盤2の移動面2bに対し40度の角度になるように配置した。また、傾斜板3は、移動面2bから上方10[mm]の位置に下端が配置されるようにし、円盤2と非接触状態とした。さらに、この傾斜板3は、その長手方向H1が円盤2の半径方向H2に対し直交するよう配置した。 Incidentally, in this irregular shape removing apparatus 1, a flat wafer having a diameter of 10 [cm] (arithmetic average roughness Ra = 20 [nm] of the moving surface 2b) is used as the disk 2, and the moving surface 2b is centered on the rotating shaft 2a. The disc 2 was installed in the drive mechanism so as to rotate while maintaining horizontal. The inclined plate 3 disposed above the disk 2 is manufactured by processing a flat wafer into a rectangular shape, and is disposed so that the smooth inclined surface 3a is at an angle of 40 degrees with respect to the moving surface 2b of the disk 2. Further, the inclined plate 3 was placed in a non-contact state with the disk 2 so that the lower end was disposed at a position 10 mm above the moving surface 2b. Further, the inclined plate 3 is arranged so that the longitudinal direction H1 thereof is orthogonal to the radial direction H2 of the disk 2.
　円盤2の下方には、円盤2の外周から落下した半田ボールを回収する回収容器4を、円盤と接触しないように設置した。このような異形除去装置1を用意して、造粒工程SP1にて造粒したボール群を傾斜板3に落下させていった。異形除去装置1は、傾斜板3上を半田ボールが滑り落ちてゆき、回転している円盤2の移動面2b上に半田ボールを落下させていった。この際、この検証試験では、傾斜板3からの半田ボールを円盤2の回転方向とは逆方向から落下させてゆき、半田ボールを移動面2bに対して接触させ、半田ボールに回転力を与えて回転させた。 A collection container 4 for collecting solder balls dropped from the outer periphery of the disk 2 was installed below the disk 2 so as not to contact the disk. Such an irregular shape removing device 1 was prepared, and the group of balls granulated in the granulation step SP1 was dropped onto the inclined plate 3. In the deformed shape removing apparatus 1, the solder ball slides down on the inclined plate 3, and drops the solder ball on the moving surface 2b of the rotating disk 2. At this time, in this verification test, the solder ball from the inclined plate 3 is dropped from the direction opposite to the rotation direction of the disk 2, the solder ball is brought into contact with the moving surface 2b, and a rotational force is applied to the solder ball. And rotated.
　これにより、異形除去装置1では、傾斜板3から円盤2に供給したボール群を、円盤2の回転方向に沿って転がり最終的に円盤2の外周から円盤2下方に落下する半田ボールと、そのまま円盤2の中心領域に滞留し続ける半田ボールとに分級できた。そして、円盤2の外周から落下し、回収容器4にて回収した半田ボールB1のボール群の異形含有率を調べた。 Thereby, in the irregular shape removing device 1, the ball group supplied from the inclined plate 3 to the disk 2 rolls along the rotation direction of the disk 2, and finally the solder balls that fall from the outer periphery of the disk 2 to the lower side of the disk 2 as they are. It was possible to classify it into solder balls that stayed in the central area of disk 2. Then, the deformed content rate of the ball group of the solder balls B1 dropped from the outer periphery of the disk 2 and recovered in the recovery container 4 was examined.
　この検証試験では、表1の実施例1～実施例30に示すように、分級作業を行う相対湿度と、円盤2の回転数とを変え、このときの回収率と異形含有率とをそれぞれ調べた。また、比較例1および比較例2では、上述した異形除去装置1による分級作業を行わずに、相対湿度を変えて造粒直後のボール群の回収率および異形含有率について調べた。 In this verification test, as shown in Example 1 to Example 30 in Table 1, the relative humidity at which the classification work is performed and the number of revolutions of the disk 2 are changed, and the recovery rate and the deformed content rate at this time are examined. It was. In Comparative Example 1 and Comparative Example 2, the recovery rate and the deformed content of the ball group immediately after granulation were examined by changing the relative humidity without performing the classification work by the deformed shape removing device 1 described above.
　なお、ここで、実施例1～実施例30での回収率とは、異形除去装置1によって回収容器4にて回収したボール群の量を回収量とし、異形除去装置1の傾斜板3へ投入したボール群の量を投入量として、「回収量／投入量」にて算出した数値である。一方、比較例1および比較例2での回収率は、静止させた円盤2に対し傾斜板3からボール群を供給してゆき、円盤2の移動面2bを滑ってそのまま回収容器4に落下したボール群の量を回収量として、「回収量／投入量」にて算出した数値である。また、異形含有率は、回収容器4により回収したボール群を市販の粉体測定装置で調べて、母数100万個当たりの異形ボール数から算出した数値である。 Here, the recovery rate in Examples 1 to 30 refers to the amount of balls collected in the recovery container 4 by the irregular shape removal device 1 as the collection amount, and put into the inclined plate 3 of the irregular shape removal device 1 This is a numerical value calculated by “recovered amount / injected amount”, where the amount of the ball group is the input amount. On the other hand, in the recovery rate in Comparative Example 1 and Comparative Example 2, the ball group was supplied from the inclined plate 3 to the stationary disk 2 and slid on the moving surface 2b of the disk 2 and dropped into the recovery container 4 as it was. This is a numerical value calculated by “recovered amount / injected amount” with the amount of the ball group as the recovered amount. The deformed content rate is a numerical value calculated from the number of deformed balls per million population by examining the balls collected by the collecting container 4 using a commercially available powder measuring device.
Figure JPOXMLDOC01-appb-T000001
Figure JPOXMLDOC01-appb-T000001
　表1に示すように、相対湿度50[％RH]とした比較例1では、半田ボールが凝集し易くなっており、円盤2から回収容器4まで到達する半田ボールが少なく回収率が2[％]であった。一方、相対湿度20[％RH]とした比較例2では、半田ボールの凝集が抑制されており、回収率が80[％RH]まで上がった。このことから相対湿度を下げて乾燥化させることで半田ボールの凝集を抑制できることが確認できた。なお、比較例1および比較例2は異形除去装置1を用いた分級作業を行っておらず、このときのボール形状が異形化した形状不良品の異形含有率はいずれも10[％]であった。 As shown in Table 1, in Comparative Example 1 in which the relative humidity is 50 [% RH], the solder balls are likely to aggregate, and there are few solder balls reaching the recovery container 4 from the disk 2 and the recovery rate is 2 [%]. ]Met. On the other hand, in Comparative Example 2 where the relative humidity was 20 [% RH], the aggregation of the solder balls was suppressed, and the recovery rate increased to 80 [% RH]. From this, it was confirmed that agglomeration of the solder balls can be suppressed by lowering the relative humidity and drying. In Comparative Example 1 and Comparative Example 2, classification work using the deformed shape removing device 1 was not performed, and the deformed content rate of the shape defect product having the deformed ball shape at this time was 10 [%]. It was.
　実施例1～実施例30は、本発明の異形除去装置1を用いて分級作業を行ったものであり、傾斜板3から円盤2に供給したボール群が、回収容器4内に回収される半田ボールと、円盤2の中心領域に滞留する半田ボールとに分かれ、2種のボール群に分級できることが確認できた。また、相対湿度を5[％RH]以上とした雰囲気下で異形除去装置1を用いて分級作業を行った実施例1～実施例30では、回収率がいずれも90[％]以上となった。 Examples 1 to 30 are those in which classification work is performed using the deformed shape removing apparatus 1 of the present invention, and a group of balls supplied from the inclined plate 3 to the disk 2 is recovered in the recovery container 4 It was confirmed that the ball could be divided into two types of balls, divided into balls and solder balls staying in the central region of the disk 2. In Examples 1 to 30 in which classification work was performed using the deformed shape removal device 1 in an atmosphere with a relative humidity of 5% RH or higher, the recovery rate was 90% or higher. .
　また、相対湿度を20[％RH]とした雰囲気下で異形除去装置1を用いて分級作業を行った実施例13～実施例18よりも、相対湿度を5[％RH]とした雰囲気下で異形除去装置1を用いて分級作業を行った実施例1～実施例6、実施例19～24のほうが、回収率が上がり、良好な結果が得られた。このことから、異形除去装置1を用いて分級作業を行う際には、相対湿度を低くしたほうが、回収率が良くなることが確認できた。 Also, in an atmosphere with a relative humidity of 5 [% RH], compared to Examples 13 to 18 in which classification work was performed using the deformed shape removing device 1 in an atmosphere with a relative humidity of 20 [% RH]. In Examples 1 to 6 and Examples 19 to 24 in which classification work was performed using the deformed shape removing apparatus 1, the recovery rate increased and good results were obtained. From this, it was confirmed that when the classification operation was performed using the profile removing device 1, the recovery rate was improved when the relative humidity was lowered.
　実施例1～実施例30において、回収容器4にて回収したボール群の異形含有率を調べたところ、10[ppm]以下まで下がることが確認できた。以上より本発明の異形除去装置1では、多数の半田ボールの中に含まれた形状不良品を除去し、異形含有率を低減し得ることが確認できた。 In Examples 1 to 30, when the deformed content of the balls collected in the collection container 4 was examined, it was confirmed that the content decreased to 10 ppm or less. From the above, it was confirmed that the deformed shape removing apparatus 1 of the present invention can remove defective products contained in a large number of solder balls and reduce the deformed content rate.
　また、例えば相対湿度が同じ5[％RH]であっても、異形除去装置1での円盤2の回転数を5[rpm]とした実施例1～実施例6よりも、回転数を上げて120[rpm]とした実施例19～実施例24のほうが、全体的に異形含有率が下がり、良好な結果が得られた。このことから、異形除去装置1を用いて分級作業を行う際には、円盤2の回転数を大きくしたほうが、異形含有率が小さくなることが確認できた。 Further, for example, even if the relative humidity is the same 5 [% RH], the rotational speed is higher than those in Examples 1 to 6 in which the rotational speed of the disk 2 in the deformed shape removing device 1 is 5 [rpm]. In Example 19 to Example 24 at 120 [rpm], the deformed content decreased overall, and good results were obtained. From this, it was confirmed that when performing the classification work using the deformed shape removing apparatus 1, the deformed content rate decreases as the number of rotations of the disk 2 is increased.
　因みに、実施例1～実施例30に示した異形含有率が10[ppm]以下となったボール群については、再びこの異形除去装置1に投入して形状不良品を除去する除去作業を更に複数回行うことで、最終的には異形含有率を0[ppm]まで下げることができた。かくして、この異形除去装置1は、最終的に良品の半田ボールのみからなるボール群を生成できることが確認できた。 Incidentally, for the ball group whose deformed content rate shown in Examples 1 to 30 is 10 [ppm] or less, a plurality of removing operations for removing the defective products by putting them again into the deformed shape removing device 1 are performed. By repeating this process, the deformed content was finally reduced to 0 [ppm]. Thus, it was confirmed that the deformed shape removing apparatus 1 can finally generate a ball group consisting of only good solder balls.
　1,11,21　異形除去装置
　2　円盤（移動体）
　3　傾斜板（供給手段）
　4　回収容器
　B　半田ボール（金属ボール）
　22　円柱回転体（移動体）

  1,11,21 Profile removal device 2 Disc (moving body)
3 Inclined plate (supply means)
4 Collection container B Solder ball (metal ball)
22 Rotating cylinder (moving body)

Claims (7)

  1. 　一方向に移動面が移動する移動体と、
    　前記一方向の逆方向側から前記移動面に向けて金属ボールを供給する供給手段とを備え、
    　前記移動面に前記金属ボールを接触させることにより該金属ボールを回転させ、前記金属ボールのボール形状により生じる転がり挙動の違いから前記ボール形状が異形化した形状不良品を除去する
    　ことを特徴とする異形除去装置。     A moving body whose moving surface moves in one direction;
    Supply means for supplying a metal ball from the opposite direction side of the one direction toward the moving surface;
    The metal ball is rotated by bringing the metal ball into contact with the moving surface, and the defective shape product having the deformed ball shape is removed from the difference in rolling behavior caused by the ball shape of the metal ball. Profile removal device.
  2. 　前記金属ボールの分級作業が行なわれる作業空間を湿度調整し、該金属ボールの凝集を抑制させる湿度調整手段を備える
    　ことを特徴とする請求項1記載の異形除去装置。     2. The irregular shape removing device according to claim 1, further comprising humidity adjusting means for adjusting a humidity of a work space in which the metal ball classification operation is performed and suppressing aggregation of the metal balls.
  3. 　前記湿度調整手段は、前記作業空間を相対湿度20［％RH］以下とする
    　ことを特徴とする請求項2記載の異形除去装置。     3. The irregular shape removing apparatus according to claim 2, wherein the humidity adjusting means sets the working space to a relative humidity of 20 [% RH] or less.
  4. 　直径60［μm］以下の金属ボールと、該金属ボールが異形化した形状不良品とを分級し、該形状不良品を除去する
    　ことを特徴とする請求項1～3のうちいずれか1項に記載の異形除去装置。     4. The metal ball having a diameter of 60 [μm] or less and a shape defect product in which the metal ball is deformed are classified, and the shape defect product is removed. Deformation device as described.
  5. 　前記移動体は円盤であり、前記移動面が回転し、
    　前記供給手段は、前記円盤の回転方向の逆方向側から前記金属ボールを供給する
    　ことを特徴とする請求項1～4のいずれか1項に記載の異形除去装置。     The moving body is a disk, the moving surface rotates,
    5. The deformed shape removing apparatus according to claim 1, wherein the supplying means supplies the metal ball from a direction opposite to a rotation direction of the disk.
  6. 　移動体の移動面を一方向に移動させ、供給手段によって、前記一方向の逆方向側から前記移動面に向けて金属ボールを供給する供給ステップと、
    　前記移動面に前記金属ボールを接触させることにより該金属ボールを回転させ、前記金属ボールのボール形状により生じる転がり挙動の違いから前記ボール形状が異形化した形状不良品を除去する除去ステップと
    　を備えることを特徴とする異形除去方法。     A supply step of moving the moving surface of the moving body in one direction, and supplying a metal ball from the opposite direction side of the one direction toward the moving surface by a supply unit;
    Removing the defective shape having the deformed ball shape from the difference in rolling behavior caused by the ball shape of the metal ball by rotating the metal ball by bringing the metal ball into contact with the moving surface. A method for removing irregularities characterized by the above.
  7. 　前記供給ステップおよび前記除去ステップは、湿度調整された雰囲気下で行われ、前記金属ボールの凝集が抑制されている
    　ことを特徴とする請求項6記載の異形除去方法。

          7. The deformed shape removing method according to claim 6, wherein the supplying step and the removing step are performed in an atmosphere whose humidity is adjusted, and aggregation of the metal balls is suppressed.

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