JPWO2014069132A1 - Solder ball, aggregation suppression device, and aggregation suppression method - Google Patents

Solder ball, aggregation suppression device, and aggregation suppression method Download PDF

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JPWO2014069132A1
JPWO2014069132A1 JP2014544385A JP2014544385A JPWO2014069132A1 JP WO2014069132 A1 JPWO2014069132 A1 JP WO2014069132A1 JP 2014544385 A JP2014544385 A JP 2014544385A JP 2014544385 A JP2014544385 A JP 2014544385A JP WO2014069132 A1 JPWO2014069132 A1 JP WO2014069132A1
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solder balls
aggregation
solder
ball
humidity
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寺嶋　晋一
晋一 寺嶋
小林　孝之
孝之 小林
將元 田中
將元 田中
勝一 木村
勝一 木村
忠礼 佐川
忠礼 佐川
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Nippon Micrometal Corp
Nippon Steel Chemical and Materials Co Ltd
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Nippon Micrometal Corp
Nippon Steel Chemical and Materials Co Ltd
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
    • B22F3/003—Apparatus, e.g. furnaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • B23K1/0016—Brazing of electronic components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0607—Solder feeding devices
    • B23K3/0623—Solder feeding devices for shaped solder piece feeding, e.g. preforms, bumps, balls, pellets, droplets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/08—Auxiliary devices therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • C22C13/02—Alloys based on tin with antimony or bismuth as the next major constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/11—Manufacturing methods
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L24/742—Apparatus for manufacturing bump connectors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/05—Metallic powder characterised by the size or surface area of the particles
    • B22F1/052—Metallic powder characterised by the size or surface area of the particles characterised by a mixture of particles of different sizes or by the particle size distribution
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F2201/00—Treatment under specific atmosphere
    • B22F2201/05—Water or water vapour
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F2203/00—Controlling
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/11—Manufacturing methods
    • H01L2224/113—Manufacturing methods by local deposition of the material of the bump connector
    • H01L2224/1133—Manufacturing methods by local deposition of the material of the bump connector in solid form
    • H01L2224/11332—Manufacturing methods by local deposition of the material of the bump connector in solid form using a powder
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
    • H01L2224/13001—Core members of the bump connector
    • H01L2224/13099—Material
    • H01L2224/131—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
    • H01L2224/13101—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of less than 400°C
    • H01L2224/13111—Tin [Sn] as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L24/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

分散剤を用いることなく凝集を抑制し得る半田ボールを提供し、また分散剤を用いることなく半田ボールの凝集を抑制し得る凝集抑制装置および凝集抑制方法を提供することを目的とする。本発明では、凝集抑制装置（7,8）によって相対湿度を調整した雰囲気下で半田ボールを管理することにより、外気で凝集し易い微小な半田ボールであっても分散剤を用いることなく凝集を抑制することができる。It is an object of the present invention to provide a solder ball that can suppress aggregation without using a dispersant, and to provide an aggregation suppression device and an aggregation suppression method that can suppress aggregation of solder balls without using a dispersant. In the present invention, by managing the solder balls in an atmosphere in which the relative humidity is adjusted by the aggregation suppressing device (7, 8), even if the solder balls are minute particles that easily aggregate in the outside air, the aggregation can be performed without using a dispersant. Can be suppressed.

Description

本発明は、半田ボール、凝集抑制装置および凝集抑制方法に関し、例えば直径10〜60[μm]の微小な半田ボールに適用して好適なものである。   The present invention relates to a solder ball, an aggregation suppression device, and an aggregation suppression method, and is suitable for application to a small solder ball having a diameter of 10 to 60 [μm], for example.

近年、電子機器の小型化や高性能化に伴い、電子機器に実装される材料の小型化や、接合部の小面積化が加速しており、直径10〜60［μm］でなる微小な半田ボールに対するニーズも高まっている（例えば、特許文献1参照）。しかしながら、このような微小な半田ボールは、製造過程において凝集し易く（ここで、「凝集」とは多数の半田ボールが集団化し、あたかも一つの塊のように振る舞うような現象の他、半田ボールが周辺部材にへばりついてしまう（付着してしまう）現象を指す）、製造歩留まりが低下するという問題があった。   In recent years, with the miniaturization and high performance of electronic devices, the miniaturization of materials mounted on electronic devices and the reduction of the area of joints have accelerated, and a small solder having a diameter of 10 to 60 [μm]. There is an increasing need for balls (see, for example, Patent Document 1). However, such a small solder ball easily aggregates in the manufacturing process (here, “aggregation” means that a large number of solder balls are aggregated and behave like a single lump. Is sticking to (attaching to) peripheral members), and there is a problem that the manufacturing yield is lowered.

また、造粒過程で凝集してしまった半田ボールは、例えば超音波を印加したり、あるいはパーツフィーダー等で振動を与えたとしても、個々の半田ボールに分散させることが困難であり、電気機器の実装材料として用いることができなくなってしまうという問題が生じてしまう。そこで、従来では、このような半田ボールの凝集を防止する方法として、造粒工程で分散剤を用い、各半田ボールのボール表面を分散剤でコーティングすることで半田ボールの凝集を防止する方法を用いることが一般的であった（例えば、特許文献２参照）。   In addition, solder balls that have aggregated during the granulation process are difficult to disperse into individual solder balls, even if, for example, ultrasonic waves are applied or vibration is applied by a parts feeder or the like. This causes a problem that it cannot be used as a mounting material. Therefore, conventionally, as a method of preventing such agglomeration of solder balls, a method of preventing agglomeration of solder balls by using a dispersant in the granulation step and coating the surface of each solder ball with a dispersant. It was common to use (for example, refer patent document 2).

特許第４９８７９２８号公報Japanese Patent No. 4987928 特許第４１２７３２０号公報Japanese Patent No. 4127320

しかしながら、このような分散剤を用いた場合には、半田ボールのボール表面が分散剤によって汚染されてしまうことから、半田ボールの接合性が低下してしまうという問題があった。特に径が小さい微小な半田ボールを用いるTSV（Through-Silicon Via：Si貫通電極）では、半田ボールの接合性が低下してしまうと、半田ボールによる接合面積が更に小さくなってしまうことから、半田ボールの接合性の低下は致命的な欠点となる。そのためこの種の微小な半田ボールでは、分散剤を用いることなく凝集を抑制し得ることが望まれている。   However, when such a dispersant is used, the ball surface of the solder ball is contaminated by the dispersant, so that there is a problem that the solder ball bondability is lowered. Especially in TSV (Through-Silicon Via: Si through electrode) using a small solder ball with a small diameter, if the solder ball bondability deteriorates, the solder ball joint area will be further reduced. Deterioration of the ball bondability is a fatal defect. Therefore, it is desired that this kind of fine solder ball can suppress aggregation without using a dispersant.

そこで、本発明は、上記のような問題に鑑みてなされたものであり、分散剤を用いることなく凝集を抑制し得る半田ボールを提供することを目的とし、また分散剤を用いることなく半田ボールの凝集を抑制し得る凝集抑制装置および凝集抑制方法を提供することを目的とする。   Accordingly, the present invention has been made in view of the above problems, and an object of the present invention is to provide a solder ball capable of suppressing aggregation without using a dispersant, and without using a dispersant. An object of the present invention is to provide a coagulation inhibitor and a coagulation inhibition method that can inhibit the coagulation.

本発明の請求項1に係る半田ボールは、Sn-Ag-Cu系、Sn-Bi系、Sn-Ag系、Sn-Cu系、Sn-Zn系のうちいずれかのSn基合金でなる半田ボールであって、平均粒径が100[μm]以下であり、凝集が抑制されるように湿度調整された雰囲気下で管理されていることを特徴とする。   The solder ball according to claim 1 of the present invention is a solder ball made of any Sn-based alloy of Sn-Ag-Cu, Sn-Bi, Sn-Ag, Sn-Cu, and Sn-Zn. The average particle size is 100 [μm] or less and is controlled in an atmosphere whose humidity is adjusted so that aggregation is suppressed.

本発明の請求項2に係る半田ボールは、請求項1において、相対湿度が20[％RH]以下であることを特徴とする。   The solder ball according to claim 2 of the present invention is characterized in that, in claim 1, the relative humidity is 20 [% RH] or less.

本発明の請求項3に係る半田ボールは、請求項1または2において、ボール表面は、凝集を抑制する分散剤でコーティングされずに外部に露出していることを特徴とする。   The solder ball according to claim 3 of the present invention is characterized in that, in claim 1 or 2, the surface of the ball is exposed to the outside without being coated with a dispersant that suppresses aggregation.

本発明の請求項4に係る凝集抑制装置は、Sn-Ag-Cu系、Sn-Bi系、Sn-Ag系、Sn-Cu系、Sn-Zn系のうちいずれかのSn基合金でなり、平均粒径が100[μm]以下の半田ボールを造する製造装置、または前記半田ボールを半導体デバイスに実装させる実装装置のいずれかに設置される凝集抑制装置であって、前記製造装置または前記実装装置の前記半田ボールを管理する作業空間を湿度調整し、前記半田ボールの凝集を抑制させる湿度調整手段を備えることを特徴とする。   The aggregation suppressing device according to claim 4 of the present invention is a Sn-Ag-Cu system, a Sn-Bi system, a Sn-Ag system, a Sn-Cu system, a Sn-Zn system, any Sn group alloy, An agglomeration suppression apparatus installed in either a manufacturing apparatus for producing solder balls having an average particle size of 100 [μm] or less, or a mounting apparatus for mounting the solder balls on a semiconductor device, the manufacturing apparatus or the mounting Humidity adjustment means for adjusting the humidity of a work space for managing the solder balls of the apparatus and suppressing aggregation of the solder balls is provided.

本発明の請求項5に係る凝集抑制装置は、請求項4において、前記湿度調整手段は、前記作業空間を相対湿度20［％RH］以下とすることを特徴とする。   The aggregation suppressing apparatus according to claim 5 of the present invention is characterized in that, in claim 4, the humidity adjusting means sets the working space to a relative humidity of 20 [% RH] or less.

本発明の請求項6に係る凝集抑制方法は、Sn-Ag-Cu系、Sn-Bi系、Sn-Ag系、Sn-Cu系、Sn-Zn系のうちいずれかのSn基合金でなり、平均粒径が100[μm]以下の半田ボールを製造する製造装置、または前記半田ボールを半導体デバイスに実装させる実装装置の少なくともいずれかで、前記半田ボールを管理する作業空間を、湿度調整手段によって湿度調整し、前記半田ボールの凝集を抑制させることを特徴とする。   The aggregation suppressing method according to claim 6 of the present invention is a Sn-Ag-Cu system, a Sn-Bi system, a Sn-Ag system, a Sn-Cu system, a Sn-Zn system, any Sn group alloy, At least one of a manufacturing apparatus for manufacturing a solder ball having an average particle size of 100 [μm] or less and a mounting apparatus for mounting the solder ball on a semiconductor device, a working space for managing the solder ball is controlled by humidity adjusting means. The humidity is adjusted to suppress aggregation of the solder balls.

本発明の半田ボールによれば、微小な粒径であっても、相対湿度が調整された雰囲気下で管理されることで、分散剤を用いなくても凝集が抑制された半田ボールを提供し得る。また、本発明の凝集抑制装置および凝集抑制方法によれば、凝集し易い微小な半田ボールであっても、分散剤を用いることなく凝集を抑制し得る。   According to the solder ball of the present invention, it is possible to provide a solder ball in which agglomeration is suppressed without using a dispersant by being managed in an atmosphere in which the relative humidity is adjusted even if the particle size is small. obtain. Further, according to the aggregation suppressing device and the aggregation suppressing method of the present invention, even a small solder ball that easily aggregates can be suppressed without using a dispersant.

微小な半田ボールの造粒から実装までの工程を示す概略図である。It is the schematic which shows the process from granulation of a small solder ball to mounting. 他の実施の形態による造粒から実装までの工程を示す概略図である。It is the schematic which shows the process from granulation by other embodiment to mounting.

本発明は、例えば平均粒径が100[μm]以下、好ましくはフリップチップ実装、或いはTSV（Through-Silicon Via：Si貫通電極）構造に適用する平均粒径が60［μm］以下の微小な半田ボールに関し、当該半田ボールの造粒から、半田ボールのTSVデバイスへの実装までの各工程において半田ボールを取り扱う作業空間を湿度調整し、相対湿度20[％RH]以下の雰囲気下で半田ボールを管理する点に特徴を有する。   The present invention is, for example, a fine solder having an average particle diameter of 100 [μm] or less, preferably applied to flip chip mounting or TSV (Through-Silicon Via: Si through electrode) structure. Regarding the balls, the humidity of the work space where the solder balls are handled in each process from granulation of the solder balls to mounting of the solder balls on the TSV device is adjusted, and the solder balls are placed under an atmosphere with a relative humidity of 20% or less. It is characterized in that it is managed.

なお、この実施の形態では、平均粒径が10〜60［μm］の半田ボールを適用した場合について以下説明する。ここで、半田ボールの平均粒径は、例えば半田ボールを光学顕微鏡で観察し、個々の粒径を実測してゆき、100〜200個程度の半田ボールの粒径の平均値を平均粒径とする。   In this embodiment, a case where a solder ball having an average particle diameter of 10 to 60 [μm] is applied will be described below. Here, the average particle diameter of the solder balls is, for example, by observing the solder balls with an optical microscope, and measuring the individual particle diameters, and the average particle diameter of about 100 to 200 solder balls is defined as the average particle diameter. To do.

本発明の半田ボールは、Sn-Ag-Cu系、Sn-Bi系、Sn-Ag系、Sn-Cu系、Sn-Zn系のうちいずれかのSn基合金（Sn量が40[％]以上の合金をいう）であることが好ましい。この種の半田ボールは微小化されることで通常の外気中で凝集し易い性質を有するものの、本発明では、半田ボールの製造から実装までの各工程において、相対湿度を外気よりも低減させた雰囲気下で半田ボールを管理することで、半田ボールの凝集を抑制して分散した状態を維持させ得る。   The solder balls of the present invention are Sn-Ag-Cu-based, Sn-Bi-based, Sn-Ag-based, Sn-Cu-based, Sn-Zn-based Sn-based alloys (Sn content is 40% or more). Is preferable). Although this type of solder ball has the property of being easily agglomerated in normal outside air by being miniaturized, in the present invention, the relative humidity is reduced from the outside air in each step from manufacture to mounting of the solder ball. By managing the solder balls in an atmosphere, the dispersed state can be maintained by suppressing the aggregation of the solder balls.

半田ボールの凝集を抑制し得る相対湿度としては、20［％RH］以下、好ましくは15［％RH］以下が望ましい。半田ボールは、造粒から実装までの間、継続して相対湿度を20［％RH］以下に保った雰囲気下におかれることで凝集が抑制され得る。相対湿度を15［％RH］以下とした場合には、平均粒径40[μm]以下の微小な半田ボールでも確実に凝集を抑制し得る。その一方で、相対湿度が20［％RH］を超えると、半田ボールが次第に凝集してゆき、複数の半田ボールがくっついて一体化した凝集物が増え、また半田ボールが周辺部材に付着し易くなる。   The relative humidity that can suppress the agglomeration of the solder balls is 20 [% RH] or less, preferably 15 [% RH] or less. Aggregation can be suppressed by placing the solder ball in an atmosphere in which the relative humidity is kept at 20% RH or less continuously from granulation to mounting. When the relative humidity is 15 [% RH] or less, aggregation can be reliably suppressed even with a small solder ball having an average particle diameter of 40 [μm] or less. On the other hand, when the relative humidity exceeds 20 [% RH], the solder balls gradually aggregate, and a plurality of solder balls stick together to increase the aggregate, and the solder balls easily adhere to peripheral members. Become.

ここで、図１は、例えばTSVに用いる平均粒径10〜60［μm］の微小な半田ボールについて、造粒から実装までの一連の工程を概略的に示したものであり、製造業者が製造装置1を用いて微小な半田ボールを製造し、取引業者が実装装置18を用いて半田ボールをTSVデバイスに実装する例を示している。   Here, FIG. 1 schematically shows a series of processes from granulation to mounting for a fine solder ball having an average particle diameter of 10 to 60 [μm] used for TSV, for example. An example is shown in which a small solder ball is manufactured using the apparatus 1, and a trader mounts the solder ball on a TSV device using the mounting apparatus 18.

この場合、製造装置1には、微小な半田ボールを造粒する造粒装置3と、造粒装置3にて造粒した半田ボールを分級する分級装置4と、分級装置4にて分級された半田ボールを容器に封入して箱体に梱包する梱包装置5とが設けられており、分級装置4にはボール除去装置11と異形除去装置12とが設けられている。   In this case, the manufacturing apparatus 1 is classified by the granulating apparatus 3 for granulating the fine solder balls, the classifying apparatus 4 for classifying the solder balls granulated by the granulating apparatus 3, and the classifying apparatus 4. There is provided a packing device 5 that encloses the solder balls in a container and packs them in a box, and the classifying device 4 is provided with a ball removing device 11 and an irregular shape removing device 12.

この実施の形態の場合、製造装置1は、造粒装置3およびボール除去装置11間、ボール除去装置11および異形除去装置12間、異形除去装置12および梱包装置5間にそれぞれ搬送装置14a,14b,14cを備えており、各装置間が搬送装置14a,14b,14cによって連結された構成を有している。ここで、搬送装置14aは、造粒装置3にて造粒された半田ボールを次工程のボール除去装置11に搬送し、搬送装置14bは、ボール除去装置11にて選別された半田ボールを次工程の異形除去装置12に搬送し得る。また、搬送装置14cは、ボール形状が異形化した形状不良品を異形除去装置12にて除去した半田ボールを次工程の梱包装置5に搬送し得る。   In the case of this embodiment, the manufacturing apparatus 1 includes conveying devices 14a and 14b between the granulating device 3 and the ball removing device 11, between the ball removing device 11 and the irregular shape removing device 12, and between the irregular shape removing device 12 and the packing device 5. , 14c, and the apparatuses are connected by transfer apparatuses 14a, 14b, 14c. Here, the conveying device 14a conveys the solder balls granulated by the granulating device 3 to the ball removing device 11 in the next process, and the conveying device 14b performs the solder balls selected by the ball removing device 11 next. It can be conveyed to the process irregularity removing device 12. In addition, the transfer device 14c can transfer the solder ball, which is obtained by removing the defective shape with the deformed ball shape by the deformed shape removing device 12, to the packing device 5 in the next process.

かかる構成に加えてこの製造装置1は、造粒装置3、ボール除去装置11、および異形除去装置12にそれぞれ凝集抑制装置7を備えているとともに、梱包装置5にも凝集抑制装置8を備えており、各装置において半田ボールを取り扱う作業空間を、凝集抑制装置7,8によって相対湿度20[％RH]以下に調整し得るようになされている。このように製造装置1では、各装置において凝集抑制装置7,8により相対湿度20[％RH]以下の雰囲気下で半田ボールを管理することで、各装置でそれぞれ行われる作業処理時に半田ボールが凝集することなく分散した状態を維持させ得るようになされている。   In addition to this configuration, the manufacturing apparatus 1 includes an agglomeration suppressing device 7 in each of the granulating device 3, the ball removing device 11, and the deformed shape removing device 12, and the packing device 5 also includes an agglomeration suppressing device 8. The working space for handling the solder balls in each device can be adjusted to a relative humidity of 20% or less by the aggregation suppression devices 7 and 8. As described above, in the manufacturing apparatus 1, by managing the solder balls in an atmosphere having a relative humidity of 20 [% RH] or less by the aggregation suppression apparatuses 7 and 8 in each apparatus, the solder balls are not removed during the work processing performed in each apparatus. The dispersed state can be maintained without agglomeration.

ここで、造粒装置3は、例えばワイヤーカット法や、UDS（Uniform Droplet Spray method）法、アトマイズ法（ペースト用粉のみ）によって微小な半田ボールを造粒し、凝集抑制装置7によって相対湿度20[％RH]以下の雰囲気下で半田ボールを管理し得るようになされている。実際上、凝集抑制装置7は、例えば半田ボールを取り扱う作業空間を外気と隔離する箱状のボックス（図示せず）と、作業空間となるボックス内に乾燥空気やアルゴン、窒素、ヘリウム等のガスを供給してボックス内の相対湿度を調整する湿度調整手段（図示せず）とを有している。   Here, the granulating apparatus 3 granulates fine solder balls by, for example, a wire cut method, a UDS (Uniform Droplet Spray method) method, or an atomizing method (paste powder only), and an agglomeration suppressing device 7 has a relative humidity of 20 [% RH] The solder ball can be managed under the following atmosphere. In practice, the coagulation suppression device 7 includes, for example, a box-like box (not shown) that isolates the work space for handling solder balls from the outside air, and a gas such as dry air, argon, nitrogen, and helium in the box that becomes the work space. And humidity adjusting means (not shown) for adjusting the relative humidity in the box.

なお、この実施の形態においては、湿度調整手段として、ボックス内にガスを供給してボックス内の相対湿度を調整する湿度調整手段を適用するようにした場合について述べたが、本発明はこれに限らず、例えば真空ポンプでボックス内を減圧排気することによりボックス内の相対湿度を調整する湿度調整手段を適用しても良い。   In this embodiment, the case where the humidity adjusting means for supplying the gas into the box and adjusting the relative humidity in the box is applied as the humidity adjusting means has been described. For example, a humidity adjusting unit that adjusts the relative humidity in the box by evacuating the inside of the box with a vacuum pump may be applied.

造粒装置3は、造粒した半田ボールを凝集抑制装置7によって相対湿度20[％RH]以下の雰囲気下で管理し、半田ボールの凝集を抑制して分散させた状態のまま、搬送装置14aによって次工程の分級装置4に搬送し得る。   The granulating device 3 manages the granulated solder balls in an atmosphere having a relative humidity of 20 [% RH] or less by the aggregation suppressing device 7, and suppresses the aggregation of the solder balls and keeps them dispersed. Can be conveyed to the classification device 4 in the next step.

ここで、搬送装置14a,14b,14cにも凝集抑制装置13が設けられており、凝集抑制装置13のボックス（図示せず）によって、半田ボールが搬送される搬送空間を外気と隔離し、湿度調整手段15によって当該ボックス内を湿度調整し得るようになされている。例えば、搬送装置14aは、図示しない搬送機構によって造粒装置3から分級装置4に半田ボールを搬送し得、この際、凝集抑制装置13の湿度調整手段15によって半田ボールの搬送空間が相対湿度20[％RH]以下に調整され得る。かくして、この搬送装置14aでも、相対湿度20[％RH]以下の雰囲気下で半田ボールを管理し、半田ボールの凝集を抑制して分散させた状態のまま、当該半田ボールを次工程の分級装置4まで搬送し得るようになされている。   Here, the conveyance devices 14a, 14b, and 14c are also provided with the aggregation suppressing device 13, and the box (not shown) of the aggregation suppression device 13 isolates the conveyance space in which the solder balls are conveyed from the outside air, and the humidity. The adjusting means 15 can adjust the humidity in the box. For example, the transfer device 14a can transfer the solder balls from the granulating device 3 to the classifying device 4 by a transfer mechanism (not shown). At this time, the humidity adjusting means 15 of the aggregation suppressing device 13 sets the transfer space of the solder balls to a relative humidity of 20 [% RH] or less can be adjusted. Thus, also in this transport device 14a, the solder balls are managed in an atmosphere with a relative humidity of 20 [% RH] or less, and the solder balls are kept in a dispersed state while suppressing the aggregation of the solder balls. It can be transported up to 4.

分級装置4は、ボール除去装置11によって、造粒装置3にて造粒したボール群の中から粒径が大きい半田ボールおよび粒径が小さい半田ボールを除去し、例えば平均粒径35[μm]程度の微小な半田ボールのみを抽出し得るようになされている。因みに、ここでボール除去装置11は、例えば網目状に開口が形成された網目部を有した振動篩機構を備えており、ボール群が投入された網目部を振動させることで、網目部の開口面積以下の粒径でなる半田ボールのみを落下させ、網目部の開口面積以上の粒径でなる半田ボールを網目部に残すことでボール群を分級する分級手法を利用し、最終的に微小な半田ボールのみを抽出し得るようになされている。   The classifier 4 removes the solder balls having a large particle diameter and the solder balls having a small particle diameter from the ball group granulated by the granulator 3 by the ball removing apparatus 11, for example, an average particle diameter of 35 [μm] Only small solder balls of a certain degree can be extracted. Incidentally, here, the ball removing device 11 is provided with a vibrating sieve mechanism having a mesh portion in which openings are formed in a mesh shape, for example, and by vibrating the mesh portion into which the ball group is inserted, the opening of the mesh portion is provided. Using a classification method that classifies the ball group by dropping only the solder balls having a particle size smaller than the area and leaving the solder balls having a particle size larger than the opening area of the mesh in the mesh portion. Only the solder balls can be extracted.

ところで、この際、ボール除去装置11において半田ボールが凝集してしまうと、造粒時に粒径の小さい微小な半田ボールが造粒できているにもかかわらず、半田ボール同士が凝集して例えば35[μm]以上の凝集物が生成されたり、或いは網目部に半田ボールが付着し易くなり、半田ボールが網目部から落下せずに網目部に残る半田ボール数が増え、微小な半田ボールを分級し得ないという問題が生じる。   By the way, in this case, if the solder balls are aggregated in the ball removing device 11, the solder balls are aggregated even though a small solder ball having a small particle diameter is granulated at the time of granulation, for example, 35 Aggregates of [μm] or more are generated, or solder balls are likely to adhere to the mesh portion, and the number of solder balls remaining on the mesh portion without dropping from the mesh portion increases, and fine solder balls are classified. The problem of not being possible arises.

これに対して、本発明の凝集抑制装置7は、ボール除去装置11において半田ボールの分級作業を行う作業空間（ボックス内）を相対湿度20[％RH]以下に調整することで、半田ボールの凝集を抑制し、凝集物の生成を防止するとともに、半田ボールの周辺部材（例えば網目部）への付着を防止し得る。これにより凝集抑制装置7は、造粒時に粒径が大きくなった半田ボールや粒径が小さくなった半田ボールをボール除去装置11によって除去し得、所望の粒径でなる半田ボールだけを確実に抽出させ得る。   On the other hand, the aggregation suppressing device 7 of the present invention adjusts the working space (in the box) where solder ball classification is performed in the ball removing device 11 to a relative humidity of 20 [% RH] or less, so Aggregation can be suppressed, the formation of aggregates can be prevented, and adhesion of solder balls to peripheral members (for example, mesh portions) can be prevented. As a result, the agglomeration suppressing device 7 can remove the solder balls having a large particle size during granulation or the solder balls having a small particle size by the ball removing device 11, and only the solder balls having a desired particle size can be surely obtained. Can be extracted.

また、分級装置4は、ボール除去装置11によって抽出した微小な半田ボールのボール群を、搬送装置14bを介して異形除去装置12に搬送し、当該異形除去装置12によってボール群に含まれた形状不良品を除去し得るようになされている。   Further, the classifying device 4 conveys the ball group of minute solder balls extracted by the ball removing device 11 to the deformed shape removing device 12 via the conveying device 14b, and the shape included in the ball group by the deformed shape removing device 12 Defective products can be removed.

因みに、ここでは、例えばボール形状が真球状の半田ボールを良品の半田ボールとし、ボール形状が非真球状に異形化した半田ボールを形状不良品として、異形除去装置12により形状不良品のみを除去し得るようになされている。この実施の形態の場合、異形除去装置12は、例えば半田ボールのボール形状により生じる転がり挙動の違いからボール形状が異形化した形状不良品を除去し、次工程の梱包装置5に良品の半田ボールだけを搬送し得る。   By the way, here, for example, a solder ball with a true spherical shape is used as a good solder ball, a solder ball with a deformed non-spherical ball shape is used as a defective product, and only the defective product is removed by the irregular shape removing device 12. It is made to be able to do. In the case of this embodiment, the irregular shape removing device 12 removes defective products whose ball shape has become irregular due to, for example, the difference in rolling behavior caused by the ball shape of the solder ball, and the non-defective solder ball is added to the packaging device 5 in the next process. Can only carry.

この際、本発明の凝集抑制装置7は、異形除去装置12において形状不良品の除去作業を行う作業空間（ボックス内）を湿度調整することにより半田ボールの凝集を抑制し、異形除去装置12において半田ボールを転がり易くして、造粒時にボール形状が異形化した形状不良品のみを除去させ得るようになされている。   At this time, the agglomeration suppressing device 7 of the present invention suppresses the agglomeration of the solder balls by adjusting the humidity of the work space (in the box) in which the defective shape removing device 12 performs the removal operation of the defective shape product. The solder balls are made easy to roll so that only defective products whose shape is deformed during granulation can be removed.

なお、この実施の形態の場合、ボール除去装置11と異形除去装置12との間に設置された搬送装置14bも、ボール除去装置11にて分級作業を行ったボール群を、搬送機構（図示せず）によって異形除去装置12まで搬送する際、湿度調整手段15によって相対湿度20[％RH]以下の雰囲気下で半田ボールを管理し、半田ボールの凝集を抑制し得るようになされている。   In the case of this embodiment, the transport device 14b installed between the ball removing device 11 and the deformed shape removing device 12 also uses a transport mechanism (not shown) for the ball group that has been classified by the ball removing device 11. )), The solder balls are managed in an atmosphere having a relative humidity of 20 [% RH] or less by the humidity adjusting means 15 so as to suppress the aggregation of the solder balls.

次工程の梱包装置5は、形状不良品を除去した良品の半田ボールからなるボール群を、シリカゲル等の乾燥剤とともに容器内に封入し、当該半田ボールを封入した複数の容器を例えばダンボール等の箱体に梱包し得るようになされている。この際、本発明の凝集抑制装置8は、梱包装置5において容器内へ半田ボールを封入する作業空間（ボックス内）を湿度調整手段（図示せず）によって減圧排気することにより容器内を相対湿度20[％RH]以下に調整し得るようになされている。このように梱包装置5は、凝集抑制装置8によって相対湿度20[％RH]以下の雰囲気下で半田ボールを管理することにより、半田ボールの凝集を抑制したまま半田ボールを容器内に封入させることができる。   The packing device 5 in the next process encloses a group of non-defective solder balls from which defective shapes are removed together with a desiccant such as silica gel in a container, and a plurality of containers enclosing the solder balls are, for example, cardboard or the like. It can be packed in a box. At this time, the agglomeration suppressing device 8 of the present invention uses the humidity adjusting means (not shown) to evacuate the working space (in the box) in which the solder balls are enclosed in the container in the packing device 5 to reduce the relative humidity in the container. Adjustable to 20 [% RH] or less. In this way, the packing device 5 manages the solder balls in an atmosphere having a relative humidity of 20 [% RH] or less by the aggregation suppressing device 8 so that the solder balls are sealed in the container while suppressing the aggregation of the solder balls. Can do.

なお、上述した実施の形態においては、容器へ半田ボールを封入する作業空間（ボックス内）を図示しない湿度調整手段によって減圧排気することにより容器内を相対湿度20[％RH]以下に調整するようにした場合について述べたが、本発明はこれに限らず、梱包装置5において湿度調整手段によってボックス内にガスを供給しボックス内の相対湿度を20[％RH]以下に調整するようにしてもよい。   In the embodiment described above, the inside of the container is adjusted to a relative humidity of 20 [% RH] or less by evacuating the working space (inside the box) in which the solder balls are enclosed in the container by humidity adjusting means (not shown). However, the present invention is not limited to this, and the packaging device 5 may supply gas into the box by the humidity adjusting means to adjust the relative humidity in the box to 20 [% RH] or less. Good.

因みに、半田ボールが封入される容器は、キャップ及び容器部により気密空間が形成し得るように構成されており、減圧排気されているボックス内にて、容器部の開口から容器部内に半田ボールが供給された後、乾燥剤が入れられ、相対湿度20[％RH]以下とした容器部の開口がキャップによって封止され得る。これにより容器は、気密空間が相対湿度20[％RH]以下の雰囲気下に保たれ、相対湿度20[％RH]以下で半田ボールを管理し得るようになされている。なお、容器は、箱体に梱包された後、例えば場所を異にした取引業者先の実装装置18までトラック等によって搬送され得る。   Incidentally, the container in which the solder ball is sealed is configured so that an airtight space can be formed by the cap and the container part, and the solder ball is inserted into the container part from the opening of the container part in the box evacuated. After being supplied, the desiccant is put in, and the opening of the container portion having a relative humidity of 20 [% RH] or less can be sealed with a cap. As a result, the container is kept in an atmosphere with a relative humidity of 20 [% RH] or less and the solder ball can be managed at a relative humidity of 20 [% RH] or less. In addition, after a container is packed in a box, it can be transported by a truck or the like to, for example, a mounting apparatus 18 of a business partner at a different place.

なお、この実施の形態の場合、異形除去装置12および梱包装置5間の搬送装置14cは、異形除去装置12にて形状不良品の除去作業を行ったボール群を、搬送機構（図示せず）によって梱包装置5まで搬送する際、上述と同様に、湿度調整手段15によって搬送空間を相対湿度20[％RH]以下に調整し得るようになされている。これにより搬送装置14cでも、半田ボールを次工程の梱包装置5まで搬送する際に、相対湿度20[％RH]以下の雰囲気下で半田ボールを管理し、半田ボールの凝集を抑制し得るようになされている。   In the case of this embodiment, the transfer device 14c between the deformed shape removing device 12 and the packing device 5 uses a transfer mechanism (not shown) as a ball group that has been subjected to the removal of defective products by the deformed shape removing device 12. When transporting to the packaging device 5 by means of the above, the transport space can be adjusted to a relative humidity of 20 [% RH] or less by the humidity adjusting means 15 as described above. As a result, even in the transport device 14c, when the solder balls are transported to the packaging device 5 in the next process, the solder balls can be managed in an atmosphere with a relative humidity of 20 [% RH] or less so that aggregation of the solder balls can be suppressed. Has been made.

実装装置18は、例えば半田ボール搭載手段（図示せず）を備えており、容器部からキャップが外されて容器部内の半田ボールが半田ボール搭載手段に投入されると、当該半田ボール搭載手段によってTSVデバイスの各電極に半田ボールを実装させてゆく。   The mounting device 18 includes, for example, solder ball mounting means (not shown). When the cap is removed from the container portion and the solder balls in the container portion are put into the solder ball mounting means, the solder ball mounting means Solder balls are mounted on each electrode of the TSV device.

ところで、実装装置18において湿度調整を行わずに通常の外気中にて半田ボールの実装作業を行った場合には、製造装置1において半田ボールの凝集が抑制されていたにもかかわらず、肝心な実装工程において半田ボールが凝集してしまい、個々の半田ボールをTSVデバイスの各電極に実装し得ないという問題が生じる。   By the way, when the mounting operation of the solder balls is performed in the normal outside air without adjusting the humidity in the mounting device 18, the agglomeration of the solder balls is suppressed in the manufacturing device 1, which is important. In the mounting process, the solder balls agglomerate, resulting in a problem that individual solder balls cannot be mounted on each electrode of the TSV device.

そこで、本発明の凝集抑制装置7は、実装装置18において半田ボールをTSVデバイスへ実装する作業空間（ボックス内）を相対湿度20[％RH]以下に調整し得るようになされている。このように実装装置18は、凝集抑制装置7によって相対湿度20[％RH]以下の雰囲気下で半田ボールを管理し得るようになされており、これにより半田ボールの凝集を抑止しつつ、半田ボール搭載手段によって個々の半田ボールをTSVデバイスの各電極に対し確実に実装し得るようになされている。   Therefore, the aggregation suppressing device 7 of the present invention is configured such that the working space (in the box) for mounting the solder balls on the TSV device in the mounting device 18 can be adjusted to a relative humidity of 20 [% RH] or less. In this way, the mounting device 18 can manage the solder balls in an atmosphere having a relative humidity of 20 [% RH] or less by the aggregation suppressing device 7, thereby preventing the solder balls from aggregating. The mounting means ensures that individual solder balls can be mounted on the electrodes of the TSV device.

以上の構成において、製造装置1では、造粒装置3、分級装置4および梱包装置5に凝集抑制装置7,8を設け、造粒作業や、分級作業、梱包作業が行われる作業空間を凝集抑制装置7,8によって湿度調整し、各装置において相対湿度20[％RH]以下の雰囲気下で半田ボールを管理するようにした。これにより製造装置1では、造粒から梱包までの間、微小な半田ボールを凝集させることなく、半田ボールを分散させた状態で造粒作業や分級作業、梱包作業を行わせることができる。   In the above configuration, in the manufacturing apparatus 1, the granulation apparatus 3, the classification apparatus 4 and the packing apparatus 5 are provided with the aggregation suppression devices 7 and 8, and the work space where the granulation work, classification work, and packing work are performed is suppressed. The humidity was adjusted by the devices 7 and 8, and the solder balls were managed in an atmosphere having a relative humidity of 20 [% RH] or less in each device. Thereby, in the manufacturing apparatus 1, granulation work, classification work, and packing work can be performed in a state where the solder balls are dispersed without agglomerating fine solder balls from granulation to packing.

また、この製造装置1では、各装置間にそれぞれ設けられた搬送装置14a,14b,14cにも凝集抑制装置13を設け、造粒装置3および分級装置4間、分級装置4および梱包装置5間でも凝集抑制装置13の湿度調整手段15によって湿度調整し、各装置間も相対湿度20[％RH]以下の雰囲気下で半田ボールを管理するようにした。これにより製造装置1では、造粒から梱包まで各装置間も含めて一貫して微小な半田ボールの凝集を抑制させることができ、半田ボールを分散させた状態を維持させることができる。   Further, in this manufacturing apparatus 1, the aggregation devices 13 are also provided in the conveying devices 14a, 14b, and 14c provided between the devices, and between the granulating device 3 and the classifying device 4, between the classifying device 4 and the packing device 5. However, the humidity is adjusted by the humidity adjusting means 15 of the aggregation suppressing device 13, and the solder balls are managed between the devices in an atmosphere having a relative humidity of 20 [% RH] or less. As a result, in the manufacturing apparatus 1, it is possible to consistently suppress agglomeration of minute solder balls including between the apparatuses from granulation to packing, and to maintain a state where the solder balls are dispersed.

さらに、実装装置18にも、凝集抑制装置7を設け、実装作業が行われる作業空間を凝集抑制装置7によって湿度調整し、相対湿度20[％RH]以下の雰囲気下で半田ボールを管理するようにした。これにより実装装置18では、微小な半田ボールの凝集を抑制し、半田ボールを分散させた状態を維持させることができ、かくして、微小な半田ボール1つ1つをTSVデバイスの所望の位置に確実に実装させてゆくことができる。   Furthermore, the mounting device 18 is also provided with an agglomeration suppression device 7 so that the working space in which the mounting operation is performed is adjusted in humidity by the aggregation suppression device 7 so that the solder balls are managed in an atmosphere with a relative humidity of 20 [% RH] or less. I made it. As a result, the mounting device 18 can suppress the agglomeration of minute solder balls and maintain the dispersed state of the solder balls, thus ensuring that each minute solder ball is placed in a desired position of the TSV device. Can be implemented.

以上の構成によれば、本発明では、凝集抑制装置7,15によって相対湿度20[％RH]以下の雰囲気下で半田ボールを管理することにより、外気で凝集し易い微小な半田ボールであっても分散剤を用いることなく凝集を抑制し得る半田ボールを提供できる。また、本発明による半田ボールは、相対湿度20[％RH]以下の雰囲気下で管理することにより、分散剤を用いることなく凝集を抑制することができるので、分散剤によるボール表面の汚染を防止し得、分散剤を用いたときのような接合性の低下も起きず、半導体チップ同士を確実に接合させることができ、接合性に優れたTSVデバイス（半導体デバイス）を製造できる。   According to the above configuration, in the present invention, the solder balls are managed in an atmosphere having a relative humidity of 20 [% RH] or less by the aggregation suppressing devices 7 and 15, so that the solder balls are likely to aggregate in the outside air. Also, it is possible to provide a solder ball capable of suppressing aggregation without using a dispersant. In addition, the solder balls according to the present invention can be controlled in an atmosphere having a relative humidity of 20 [% RH] or less, so that aggregation can be suppressed without using a dispersant, thereby preventing contamination of the ball surface with the dispersant. In addition, the bonding property does not deteriorate as in the case of using the dispersing agent, the semiconductor chips can be reliably bonded to each other, and a TSV device (semiconductor device) excellent in bonding property can be manufactured.

なお、本発明は、本実施の形態に限定されるものではなく、本発明の要旨の範囲内で種々の変形実施が可能であり、例えば、半田ボールを造粒する造粒工程、半田ボールの粒径を選別する分級工程、半田ボールを容器に封入する梱包工程、および半田ボールを半導体デバイスに実装する実装工程にてそれぞれ湿度調整することにより微小な半田ボールの凝集を抑制できれば、造粒装置3の造粒方法や、分級装置4の分級方法、梱包装置5の梱包方法、実装装置18の実装方法として、それぞれ種々の造粒方法、分級方法、梱包方法、実装方法を用いても良い。   The present invention is not limited to the present embodiment, and various modifications can be made within the scope of the present invention. For example, a granulation process for granulating a solder ball, a solder ball A granulator that can suppress the aggregation of small solder balls by adjusting the humidity in each of the classification process for selecting the particle size, the packaging process for enclosing the solder balls in a container, and the mounting process for mounting the solder balls on the semiconductor device. Various granulation methods, classification methods, packing methods, and mounting methods may be used as the granulating method 3, the classification method of the classification device 4, the packing method of the packing device 5, and the mounting method of the mounting device 18, respectively.

また、上述した実施の形態においては、造粒から梱包までの各装置間にそれぞれ搬送装置14a,14b,14cを設け、各装置間でも相対湿度20[％RH]の雰囲気下に半田ボールを管理するようにした場合について述べたが、本発明はこれに限らず、図１との対応部分に同一符号を付して示す図２の製造装置21のように、造粒から梱包までの各装置間に搬送装置14a,14b,14cを設けずに、各装置間において作業者が手作業で半田ボールのボトル輸送を行うようにしてもよい。   In the above-described embodiment, the conveying devices 14a, 14b, and 14c are provided between the devices from granulation to packing, and the solder balls are managed in an atmosphere with a relative humidity of 20 [% RH] between the devices. However, the present invention is not limited to this, and each apparatus from granulation to packing, such as the manufacturing apparatus 21 in FIG. Instead of providing the transfer devices 14a, 14b, and 14c between them, an operator may manually transport the solder ball bottles between the devices.

この場合、作業者は、例えば造粒装置3において凝集抑制装置7により湿度調整された半田ボールを輸送用容器に回収した後キャップで輸送用容器の開口部を密封し、内部の湿度状態を維持した輸送用容器によって半田ボールを次工程のボール除去装置11まで輸送する。このようなボトル輸送では、造粒装置3にて造粒した半田ボールを輸送用容器で回収する際、輸送用容器内に半田ボールを入れた後、即座に輸送用容器の開口をキャップにて封止することで、半田ボールが湿度調整されていない外気と接触する時間を短時間にする。このようなボトル輸送では、半田ボールが外気と接触しても、半田ボールが凝集する前に即座に半田ボールを輸送用容器内に封入して外気と隔離することで、半田ボールの凝集が抑制された状態を維持し得る。   In this case, the operator, for example, collects the solder balls whose humidity has been adjusted by the aggregation suppressing device 7 in the granulating device 3 in the shipping container, and then seals the opening of the shipping container with the cap to maintain the internal humidity state. The solder balls are transported to the ball removing device 11 in the next process by the transport container. In such a bottle transport, when collecting the solder balls granulated by the granulating device 3 in the transport container, after the solder balls are put in the transport container, the opening of the transport container is immediately covered with the cap. By sealing, the time for the solder ball to contact the outside air whose humidity is not adjusted is shortened. In such bottle transportation, even if the solder balls come into contact with the outside air, the solder balls are immediately enclosed in a transport container and isolated from the outside air before the solder balls are agglomerated, thereby suppressing the aggregation of the solder balls. Can be maintained.

次いで、作業者は、輸送用容器からキャップを外して輸送用容器内の半田ボールを、凝集抑制装置7によって湿度調整されているボール除去装置11に投入し、当該ボール除去装置11を用いて分級作業を行う。   Next, the operator removes the cap from the shipping container, puts the solder balls in the shipping container into the ball removing device 11 whose humidity is adjusted by the aggregation suppressing device 7, and classifies using the ball removing device 11. Do work.

なお、この実施の形態の場合は、上述のボトル輸送が、ボール除去装置11および異形除去装置12間、さらに異形除去装置12および梱包装置5間でも行われ、作業者の手作業で半田ボールが搬送され得る。このように各装置間をボトル輸送した場合でも、上述と同様に半田ボールを輸送用容器にて回収する際、半田ボールが外気と接触しても、半田ボールが凝集する前に半田ボールを輸送用容器内に封入することで、半田ボールが凝集することなく分散した状態を維持し得る。   In the case of this embodiment, the above-described bottle transportation is performed between the ball removing device 11 and the deformed shape removing device 12, and also between the deformed shape removing device 12 and the packaging device 5, and the solder balls are manually formed by the operator. Can be transported. Thus, even when the bottles are transported between the devices, when the solder balls are collected in the transport container as described above, the solder balls are transported before the solder balls are aggregated even if they come into contact with the outside air. By enclosing in the container, the solder balls can be kept dispersed without agglomeration.

以上の構成において、製造装置21では、各装置間の相対湿度を厳密に調整しなくとも、造粒装置3、分級装置4および梱包装置5を凝集抑制装置7,8によって湿度調整し、各装置において相対湿度20[％RH]以下の雰囲気下で半田ボールを管理すれば、造粒から梱包までの間、微小な半田ボールを凝集させることなく、半田ボールを分散させた状態で造粒作業や分級作業、梱包作業を行うことができる。   In the above configuration, the manufacturing apparatus 21 adjusts the humidity of the granulation apparatus 3, the classification apparatus 4, and the packing apparatus 5 by the aggregation suppression apparatuses 7 and 8 without strictly adjusting the relative humidity between the apparatuses. If the solder balls are managed in an atmosphere with a relative humidity of 20 [% RH] or less, the granulation work can be performed in a state where the solder balls are dispersed without agglomeration of the fine solder balls from granulation to packaging. Classification work and packing work can be performed.

なお、上述した実施の形態においては、ボール除去装置11および異形除去装置12の順に半田ボールの分級作業を行うようにした場合について述べたが、本発明はこれに限らず、異形除去装置12およびボール除去装置11の順に半田ボールの分級作業を行ってもよく、また、その他の種々の手法による分級手段を設けるようにしてもよい。   In the above-described embodiment, the solder ball classification operation is performed in the order of the ball removing device 11 and the deformed shape removing device 12, but the present invention is not limited thereto, and the deformed shape removing device 12 and the deformed shape removing device 12 Solder ball classification may be performed in the order of the ball removing device 11, or classification means by other various methods may be provided.

また、上述した実施の形態においては、造粒装置3、分級装置4、および実装装置18に凝集抑制装置7を設け、かつ梱包装置5にも凝集抑制装置8を設けるようにした場合について述べたが、本発明はこれに限らず、造粒装置3、分級装置4、梱包装置5、および実装装置18のうちいずれかの装置にだけ、必要に応じて凝集抑制装置を設けるようにしてもよい。さらに、他の実施の形態としては、1つの凝集抑制装置によって、製造装置1、21内全てを一括して湿度調整するようにしたり、或いは1つの凝集抑制装置によって造粒装置3、分級装置4および梱包装置5の装置内を一括して湿度調整するようにしてもよい。   In the above-described embodiment, the case where the aggregation suppressing device 7 is provided in the granulating device 3, the classification device 4, and the mounting device 18 and the aggregation suppressing device 8 is also provided in the packing device 5 has been described. However, the present invention is not limited to this, and the aggregation suppressing device may be provided only in any one of the granulating device 3, the classification device 4, the packing device 5, and the mounting device 18 as necessary. . Further, as another embodiment, the humidity in the entire manufacturing apparatus 1 and 21 is collectively adjusted with one aggregation suppressing device, or the granulating device 3 and the classification device 4 with one aggregation suppressing device. Alternatively, the humidity inside the packaging device 5 may be adjusted collectively.

次に、相対湿度を変化させときに微小な半田ボールの凝集抑制率がどのように変化するかについて調べた。この検証試験では、微小な半田ボールとして、平均粒径35[μm]でなるSAC305組成(Sn-3Ag-0.5Cu：Sn-Ag-Cu系)、低銀組成（Sn-1.2Ag-0.5Cu：Sn-Ag-Cu系）、Sn-Bi組成（Sn-58Bi：Sn-Bi系）、Sn-Ag組成（Sn-3.5Ag：Sn-Ag系）、Sn-Cu組成（Sn-0.7Cu：Sn-Cu系）、Sn-Zn組成（Sn-3Zn：Sn-Zn系）の半田ボールをそれぞれ100万個造粒し、25℃±5℃の温度下でグローブボックス内を湿度調整して半田ボール周辺空間の相対湿度を変化させ、その際の凝集抑制率について調べた。その結果、表１に示すような結果が得られた。なお、相対湿度は、グローブボックス内に設置した湿度計（株式会社チノー ポケットサイズ温湿度計 NH-CHP）にて測定した。   Next, it was examined how the agglomeration suppression rate of minute solder balls changes when the relative humidity is changed. In this verification test, SAC305 composition (Sn-3Ag-0.5Cu: Sn-Ag-Cu system) with a mean particle size of 35 [μm], low silver composition (Sn-1.2Ag-0.5Cu: Sn-Ag-Cu system), Sn-Bi composition (Sn-58Bi: Sn-Bi system), Sn-Ag composition (Sn-3.5Ag: Sn-Ag system), Sn-Cu composition (Sn-0.7Cu: Sn -Cu type) and Sn-Zn composition (Sn-3Zn: Sn-Zn type) solder balls, each of which is granulated 1 million, and the humidity inside the glove box is adjusted at a temperature of 25 ° C ± 5 ° C. The relative humidity of the surrounding space was changed, and the aggregation inhibition rate at that time was examined. As a result, the results shown in Table 1 were obtained. The relative humidity was measured with a hygrometer (Chino pocket size temperature and humidity meter NH-CHP) installed in the glove box.

Figure 2014069132
Figure 2014069132

因みに、凝集抑制率は、網目状に開口が形成された網目部を備えた篩を用い、篩の網目部を通過した半田ボールの数を、篩に投入した半田ボールの数で割った値であり、この値が大きい程、篩の網目部を通過した半田ボールが多いことを示し、半田ボールの凝集が抑制できていることを示す。   Incidentally, the agglomeration suppression rate is a value obtained by dividing the number of solder balls passing through the mesh part of the sieve by the number of solder balls put into the sieve, using a sieve having a mesh part with openings formed in a mesh shape. Yes, the larger this value is, the more solder balls that have passed through the mesh portion of the sieve, and the more the aggregation of the solder balls can be suppressed.

実際上、この検証試験では、網目部の各開口が50[μm]の円形状に形成された篩を用い、半田ボールを網目部上に投入してゆき、篩を手で揺すって半田ボールを網目部から落下させていった。この際、凝集していない半田ボールは、粒径（35[μm]）よりも大きな開口（50[μm]）を容易に通過できるのに対し、凝集している半田ボールは、多数の半田ボールが塊状となって粒径が半田ボール1個分よりも大きな凝集物となったり、或いは網目部に付着してしまい、篩の開口を通過できない。この結果、篩を通過した半田ボールを凝集していない半田ボールとして回収して凝集抑制率を算出した。   In practice, in this verification test, a screen with each mesh opening having a circular shape of 50 [μm] was used, the solder balls were thrown onto the mesh, and the solder balls were shaken by hand. It was dropped from the mesh part. At this time, the non-aggregated solder balls can easily pass through the opening (50 [μm]) larger than the particle size (35 [μm]), whereas the agglomerated solder balls have many solder balls. Becomes agglomerated and becomes an agglomerate having a particle size larger than that of one solder ball, or adheres to the mesh portion and cannot pass through the opening of the sieve. As a result, the solder balls that passed through the sieve were recovered as non-aggregated solder balls, and the aggregation suppression rate was calculated.

表１の実施例1〜実施例24に示すように、相対湿度が20[％RH]以下になると、凝集抑制率が90[％]以上となり、相対湿度50[％RH]の比較例1や、相対湿度30[％RH]の比較例2と比べて各段的に凝集抑制率が向上することが確認できた。また、相対湿度を15[％RH]以下にすることで、凝集抑制率がさらに向上し、相対湿度を0[％RH]まで下げると、凝集抑制率が99[％]となり凝集抑制率が格段的に向上することが確認できた。かくして、この検証試験から、相対湿度を調整した雰囲気下で半田ボールを管理することで、分散剤を用いることなく半田ボールの凝集を抑制し得ることが確認できた。また、相対湿度20[％RH]以下の雰囲気下で半田ボールを管理することで、半田ボールの凝集を抑制する効果が高くなり、分散剤を用いることなく半田ボールの凝集を抑制し得ることが確認できた。   As shown in Example 1 to Example 24 of Table 1, when the relative humidity is 20 [% RH] or less, the aggregation suppression rate is 90 [%] or more, and Comparative Example 1 with a relative humidity of 50 [% RH] It was confirmed that the aggregation inhibition rate was improved step by step as compared with Comparative Example 2 having a relative humidity of 30 [% RH]. In addition, by reducing the relative humidity to 15 [% RH] or less, the aggregation suppression rate is further improved, and when the relative humidity is lowered to 0 [% RH], the aggregation suppression rate becomes 99 [%] and the aggregation suppression rate is remarkably high. It was confirmed that the improvement was achieved. Thus, from this verification test, it was confirmed that solder ball aggregation can be suppressed without using a dispersant by managing the solder ball in an atmosphere with adjusted relative humidity. In addition, by managing the solder balls in an atmosphere with a relative humidity of 20 [% RH] or less, the effect of suppressing the aggregation of the solder balls is enhanced, and the aggregation of the solder balls can be suppressed without using a dispersant. It could be confirmed.

1,21 製造装置
3 造粒装置
4 分級装置
5 梱包装置
7,8,13 凝集抑制装置
15 湿度調整手段
18 実装装置

1,21 Production equipment
3 Granulator
4 classifier
5 Packing equipment
7,8,13 Aggregation inhibitor
15 Humidity adjustment means
18 Mounting equipment

Claims (6)

Sn-Ag-Cu系、Sn-Bi系、Sn-Ag系、Sn-Cu系、Sn-Zn系のうちいずれかのSn基合金でなる半田ボールであって、
平均粒径が100[μm]以下であり、凝集が抑制されるように湿度調整された雰囲気下で管理されている
ことを特徴とする半田ボール。A solder ball made of any Sn-based alloy of Sn-Ag-Cu, Sn-Bi, Sn-Ag, Sn-Cu, Sn-Zn,
A solder ball characterized by having an average particle size of 100 [μm] or less and being controlled in an atmosphere whose humidity is adjusted so that aggregation is suppressed. 相対湿度が20[％RH]以下である
ことを特徴とする請求項1記載の半田ボール。2. The solder ball according to claim 1, wherein the relative humidity is 20 [% RH] or less. ボール表面は、凝集を抑制する分散剤でコーティングされずに外部に露出している
ことを特徴とする請求項1または2に記載の半田ボール。3. The solder ball according to claim 1, wherein the ball surface is exposed to the outside without being coated with a dispersant that suppresses aggregation. Sn-Ag-Cu系、Sn-Bi系、Sn-Ag系、Sn-Cu系、Sn-Zn系のうちいずれかのSn基合金でなり、平均粒径が100[μm]以下の半田ボールを製造する製造装置、または前記半田ボールを半導体デバイスに実装させる実装装置のいずれかに設置される凝集抑制装置であって、
前記製造装置または前記実装装置の前記半田ボールを管理する作業空間を湿度調整し、前記半田ボールの凝集を抑制させる湿度調整手段を備える
ことを特徴とする凝集抑制装置。Solder balls made of Sn-based alloys of Sn-Ag-Cu, Sn-Bi, Sn-Ag, Sn-Cu, and Sn-Zn, with an average particle size of 100 [μm] or less An agglomeration suppression apparatus installed in either a manufacturing apparatus for manufacturing or a mounting apparatus for mounting the solder balls on a semiconductor device,
An agglomeration suppression apparatus comprising humidity adjusting means for adjusting a humidity of a work space for managing the solder balls of the manufacturing apparatus or the mounting apparatus to suppress agglomeration of the solder balls. 前記湿度調整手段は、前記作業空間を相対湿度20［％RH］以下とする
ことを特徴とする請求項4記載の凝集抑制装置。5. The aggregation suppressing device according to claim 4, wherein the humidity adjusting means sets the work space to a relative humidity of 20 [% RH] or less. Sn-Ag-Cu系、Sn-Bi系、Sn-Ag系、Sn-Cu系、Sn-Zn系のうちいずれかのSn基合金でなり、平均粒径が100[μm]以下の半田ボールを製造する製造装置、または前記半田ボールを半導体デバイスに実装させる実装装置の少なくともいずれかで、前記半田ボールを管理する作業空間を、湿度調整手段によって湿度調整し、前記半田ボールの凝集を抑制させる
ことを特徴とする凝集抑制方法。

Solder balls made of Sn-based alloys of Sn-Ag-Cu, Sn-Bi, Sn-Ag, Sn-Cu, and Sn-Zn, with an average particle size of 100 [μm] or less At least one of a manufacturing apparatus for manufacturing and a mounting apparatus for mounting the solder balls on a semiconductor device, humidity of a work space for managing the solder balls is adjusted by humidity adjusting means to suppress aggregation of the solder balls. A method for inhibiting aggregation.

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