201004520 六、發明說明： 【發明所屬之技術領域】 本發明是關於將焊錫球印刷於基板面上的電極’進行 錫焊時作爲事先處理形成焊劑所用的裝置。 【先前技術】 習知，爲了在印刷基板形成焊錫球，作爲事先處理而 使用網印技術，進行提昇印刷基板與焊錫球的定位桿力的 焊劑的印刷，惟隨著半導體的高積體化，基板的配線圖案 也微細化，被要求所作成的焊錫球的間距狹窄且小焊錫球 的作成。 所以，對於印刷的高速且高精度化的要求，作爲對網 印法有變化的低價格的焊劑的作成方法，如專利文獻1或 專利文獻2所述地提案著使用噴墨噴嘴的方式。 專利文獻1 :日本特開2001-168509號公報 專利文獻2 :日本特開2001-053099號公報 【發明內容】 上述習知技術僅具有爲了將焊劑塗佈於電極，而使用 噴墨頭的揭示’而有關於具體性的構成.動作等並未揭示 。然而’焊劑是爲了其本體爲高黏性的液體，當使用一般 的噴墨頭’則在噴嘴會附著焊劑，使得噴嘴堵住而無法吐 出，或是經過時間，則在吐出量上具有產生參差不齊等的 問題。又’提高流動性而加以塗佈，則焊劑會流出至電極 -5- 201004520 外，或是鄰接所塗佈的焊劑彼此間結合，或是在焊劑上附 著塵埃，而有失去絕緣性等的問題。 本發明的目的是爲了解決上述課題，使用噴墨頭而吐 出焊劑時，實現不會產生噴嘴堵住等的問題的裝置。 使用噴墨頭，將焊劑塗佈於形成在被載置於工作台上 的基板的電極部的焊劑形成裝置，其特徵爲：在將焊劑供 應於噴墨頭的儲存槽，設置加溫焊劑所用的加熱機構，而 且在噴墨頭也設置加熱機構，作成將焊劑保持在所定溫度 而吐出於電極，又將冷卻被吐出於基板上的焊劑的冷卻機 構設置於工作台的構成。 加溫焊劑而降低黏度，由噴墨頭順利地吐出，而且降 低吐出後的焊劑溫度，增加黏度而惡化流動性，藉此，在 所期望的領域內作成精度優異地可塗佈焊劑。 【實施方式】 在第1圖表示焊錫凸塊形成系統的全體構成的槪略圖 〇 欲形成焊劑凸塊時，首先在形成有電極的基板上設有 形成焊劑的焊劑形成裝置1 00。在此，形成於基板上的電 極上，配合電極形狀塗佈有焊劑。焊劑塗佈於基板上的電 極的基板’是被搬運至供應焊錫球的焊錫球供應裝置2 0 0 。本實施例的焊錫球供應裝置200是上述焊劑上焊錫球以 從電極形狀地具備開口部的網版上所供應的方式（網印裝 置）所構成。以焊錫球供應裝置2 0 0供應焊錫球的基板， 201004520 是被搬運至檢查•修正裝置300，進行缺陷檢查 修理的缺陷是在該處修理，而無法修理的基板是 被排除。完成檢查的基板，是被搬運至流平裝置 此被加熱熔融，而成爲焊錫球形成基板。 在焊劑形成裝置1 〇 〇具備：噴墨頭，及載置 時固定於工作台面的可上下移動的工作台。噴墨 箭號的水平方向（XY方向）可移動，基板是成 帶被搬運至工作台位置。又，在焊錫球供應裝置 備：供應焊錫球所用的焊錫球供應用頭，及與供 ，及可上下移動的基板保持用的工作台，就近地 位所用的攝影機等。又，在檢查•修正裝置3 00 影供應焊錫球的基板面，用以判定是否具有缺陷 影機，及用以去除缺陷部分的焊錫球的焊錫球吸 的噴嘴，及具備用以供應新穎的焊錫球的維修用 嘴的維修用頭。又，在該裝置雖未圖示，惟具備 部分廢棄被去掉的焊錫球的廢棄箱，或收納新穎 的焊錫球箱，及收納焊劑的焊劑箱等。在流平裝 加熱器設於搬運皮帶上側，加熱成所定溫度俾熔 而在電極上形成焊錫凸塊。所以，該部分的搬運 耐熱性的材料所形成。 在本實施例中，於塗佈焊劑使用具備噴墨頭 成裝置。此爲隨著電極的微細化，在網罩幕的開 ，僅依印刷圖案的下定尺寸的加工較難，即使可 ，也必須提昇罩幕與基板的對位的精度，因在形 ，而且可 由生產線 400，而 基板而暫 頭是朝著 爲藉由皮 200也具 應用罩幕 基板的對 具備：攝 部分的攝 引去除用 的分配噴 :在缺陷 的焊錫球 置 400， 融焊錫球 皮帶是以 的焊劑形 縫製作上 實施製作 成焊錫凸 201004520 塊的安排上需費時。又’一般焊劑是高黏度（約15〜30Pa .s )之故，因而對於形成於罩幕的微細開縫（流路）’ 印刷時的流動性不好，假設爲了迴避罩幕對於開縫的空氣 滯留或塵埃阻塞等所產生的印刷脫落或印刷量不足’即使 依強印壓而在電極上形成焊劑，也與鄰接的電極圖案上的 焊劑作成交聯’會容易產生印刷不良。又，成爲以大印壓 朝基板側推壓罩幕，也有罩幕的壽命短的問題。 在第2圖表示焊劑形成裝置的槪略構成。 如第2圖所示地，本實施例的焊劑形成裝置，是在未 圖示的架台上設有基板載置用工作台1，而在其工作台1 的兩側朝Y軸方向設有線性軌2。在線性軌2上設有移動 平台3。在移動平台3設有安裝腳4，而在其上面橫跨著 工作台1有移動框架5安裝於上方。在該移動框架5，設 有朝X軸方向移動塗佈頭6所用的頭移動機構（線性軌） Ί。 塗佈頭6是以Z軸工作台8，噴墨頭10與其安裝托 架11、攝影機12等所構成，Z軸工作台8是安裝於頭移 動機構7。亦即，Z軸工作台8是構成朝著X軸方向移動 。又，在Z軸工作台8設有Z軸電動機9，安裝噴墨頭1〇 等的安裝托架Π是構成朝著Z軸方向移動。又，在Z軸 工作台8設有用以旋轉噴墨頭1 〇的R軸電動機1 7。又， 在安裝托架1 1設有對位用攝影機1 2，或是未圖示的用以 計測噴墨頭1 0與基板1 5之距離的距離的距離計測用感測 器。依據該距離計測用感測器的檢測結果，上下地驅動塗 -8- 201004520 佈頭6而將塗佈時的基板與噴嘴的間隔作成保持在一定。 又，在夾在架台的線性軌2的工作台1的一方側端部，設 有用以移動噴嘴檢查用攝影機1 3與飛滴檢査攝影機1 4的 攝影機移動用線性軌1 6。該工作台1與攝影機移動用線性 軌16’是被構成上下地可移動。此爲由未圖示的基板搬運 皮帶接受基板，而用以載置於工作台1上。 又’雖未圖示，惟在工作台1設有接受基板15，用以 定位的可上下移動的止動件等。又，噴嘴檢查用攝影機13 是在將焊劑塗佈於基板1 5之前，事先確認在噴嘴孔32 ( 第3圖）是否有確認，同時確認噴嘴孔的塗佈配置位置， 而飛滴檢查攝影機1 4是確認由噴嘴孔3 2所射出的焊劑的 飛滴狀態，並確認在射出量等是否有問題。針對於噴嘴孔 3 2的阻塞狀態，塗佈配置位置及焊劑的飛滴的射出狀態良 否測定，事先在控制部3 5 (第3圖）設定成爲其判定基準 的條件，藉由滿足其條件，作成塗佈形成焊劑的方式被程 式化。若在噴嘴孔的塗佈位置有不適當，則主要旋轉塗佈 頭6的R軸電動機1 7以進行再調整。又，若在噴嘴孔的 阻塞及焊劑的射出量狀態不足，則藉由未圖示的噴墨頭塡 充機構，從噴嘴孔側真空吸引（以下，稱爲塡充）吐出部 31 (第3圖）以解決噴嘴阻塞，而且藉由布等吸收元件所 成的噴嘴清掃機構（未圖示），來實施塡充後的噴嘴孔周 圍的清掃。該動作是一直到沒有噴嘴阻塞爲止仍實施噴嘴 阻塞解決作業。又，在焊劑的射出量狀態有過於不足的情 形，則變更使用於射出控制的驅動電壓，也可進行調整。 -9- 201004520 又，在本實施例中’將用以解決噴嘴阻塞的塡充實施 次數，事先設定在控制部3 5 ’即使到達要塡充實施次數， 也不會解決噴嘴阻塞時，藉由噴嘴孔32的阻塞孔數或塗 佈形成焊劑所用的圖案，使用其他噴嘴孔3 2來實施塗佈 ，或是從控制部35發出警報，以便更換噴墨頭1〇。又， 定期性地實施噴嘴孔的阻塞，及焊劑的飛滴射出量的確認 ，而對於每次被確認的焊劑塗佈不良主要原因，以控制部 35來處理噴嘴阻塞解除（塡充）作業，或使用噴嘴的變更 等。 在第3圖表示將焊劑供應於焊劑塗佈用的噴墨塗佈頭 6的供應系統。然而，在形成焊劑，使用噴墨頭1 〇時，則 因所使用的焊劑材的黏度較高，而必須以高揮發性的溶劑 加以溶解，或是必須使用在高溫而降低黏性的焊劑。若使 用高揮發性的溶劑，則在作業環境等上會發生問題，而必 須在高氣密性房間使用裝置，且須充分地考慮排氣等，在 裝置全體來看會成爲大型且高成本，且作業性也有變壞的 可能性。又，所使用的噴墨頭1 0，也必須選擇對溶劑強的 材料或構造，而頭本體也複雜會成爲高價格者。如此，在 本發明中作爲焊劑材料，作成使用以高溫降低黏度的材料 的方法。 所以’如第3 ( a )圖所示地，在儲存所定量塗佈材料 的焊劑儲存槽（材料槽）2〇 ,設置加熱機構（加熱器）2 j 與計測溫度所用的溫度計（未圖示）。 又’在噴墨頭10也設有加熱機構22。又，設有：將 -10- 201004520 焊劑從焊劑儲存槽2 0供應於噴墨頭〗〇的供應配管2 3，及 將剩餘焊劑從噴墨頭1 0回流至焊劑儲存槽2 〇所用的回流 配管26，及在其回流配管26途中，將焊劑回流至儲存槽 2 〇所用的循環泵2 5。 又’如第3 ( b )圖所示地，在供應配管23及回流配 管26，捲繞有將焊劑溫度保持在一定所用的加熱機構24 〇 又’循環泵25是爲了將在利用加熱機構21、22、24 所加溫的供應系統內會變質（低黏度化：例如1 OmmPa · s 以下）的焊劑材料的材料特性作成均質，藉由在控制部3 5 所設疋的疋時器’構成可進行循環。在本實施例中，在未 塗佈焊劑時’則在焊劑材料是曝露於外氣的噴嘴孔部，不 會發生因焊劑的殘渣固化所致的噴嘴阻塞的方式，藉由在 控制部3 5所設定的定時器，構成可進行循環。又，藉由 加熱機構2 1、22、24進行上昇焊劑的溫度，惟由頭的特 性，在塗佈時，焊劑的溫度是作成60 °C以下較佳。因此， 進行溫度控制成爲焊劑的黏性降低的溫度40°C〜60°C的範 圍。溫度控制等，是構成在控制部3 5可進行。如上述地 ’若加溫焊劑而降低黏度，供應於基板1 5，則焊劑成爲液 狀，不僅電極上部，而擴展至電極外的可能性很高。所以 ，在保持基板15的工作台1，設有進行冷卻基板的冷卻機 構28，在塗佈焊劑時，則把該冷卻機構28予以動作，當 焊劑接觸於基板上的電極部，則急激地降低溫度而作成增 加焊劑的黏性。作爲冷卻機構，有在工作台內循環冷卻水 -11 - 201004520 的水冷方式，或是配置帕爾帖元件來電性地冷卻的方式等 ，本實施例是使用任何方式都可以。又，在焊劑儲存槽2 0 的上部供應負壓（黑箭頭30 )，作成在塗佈時以外，焊劑 不會從噴墨頭10自然地漏出。 又，如第3 ( b )圖所示地，在噴墨頭1 0，複數噴嘴 孔3 2設於吐出部3 1，雖未予圖示，惟每一噴嘴孔地設有 驅動部成爲每一噴嘴孔地可控制吐出。又，在本實施例中 ，噴嘴孔3 2是排列成一列，惟並不被限定於此，複數列 的配置或鋸齒狀排列都可以。 又，在工作台1，在塗佈時不會移動基板15的方式， 設有利用負壓來保持基板1 5所用的基板吸附機構2 7。又 ，如第2圖所示地，在塗佈頭6，設有對位用的攝影裝置 (攝影機）12，使用該攝影機12進行攝影設於基板15的 對位標誌，成爲可修正基板1 5的位置與噴墨頭1 0的偏位 等。又，在本實施例中，構成朝Y方向可移動具備塗佈頭 6的移動框架5，而朝X方向可移動具備移動框架5的塗 佈頭6，惟爲了修正該偏位，而在工作台1側設置X軸、 Y軸、及R軸方向的移動機構也可以。 又’該攝影機1 2是攝影所塗佈的焊劑狀態’亦即塗 佈材料的塗佈位置與液滴量，進行判別焊劑是否正常地塗 佈於電極上，而可兼具用以檢查是否橫跨電極結合著焊劑 等的攝影裝置（攝影機）。焊劑的塗佈不良，是在該焊劑 塗佈裝置可修補者則進行修正。事先未滿足設定於控制部 3 5的所期望的條件時，對於各該發生情形，實施在表示於 -12- 201004520 第4圖的控制部3 5被程式化的製程。 第4圖是表示在焊劑塗佈裝置中，用以確認焊劑塗佈 不良的流程圖。作爲焊劑塗佈不良的確認順序，首先，（ 1 )在被塗佈焊劑的基板1 5上移動攝影機，（2 )利用攝 影機1 2來確認有沒有塗佈不良。若沒有塗佈不良，則仍 將基板1 5移動至焊錫球形成工序，而若有塗佈不良，首 先，（3 )由有沒有未塗佈來進行判斷，若有未塗佈的情 形，則由攝影機的攝影結果、及事先記憶於控制部3 5的 塗佈圖案，進行選定使用於焊劑塗佈的噴嘴孔3 2，（ 4 ) 再實施塗佈。又，在實施修正塗佈前’確認使用於依噴嘴 檢查用攝影機1 3所致的修正的噴嘴孔3 2的阻塞，塗佈位 置狀態，及藉由液滴檢查用攝影機1 4來確認從其噴嘴孔 3 2所射出的焊劑的射出量，若在所使用的噴嘴孔有阻塞等 不良情形，而在上述的塡充動作也無法解決時，則選出其 他可使用的噴嘴孔，來進行修正。然後，鄰接的焊劑的塗 佈圖案彼此間進行結合的方式而被塗佈時，則（5 )雖未 予圖示，惟藉由倂設於噴墨頭所設置的焊劑去除機構，去 除結合部位的焊劑，進行確認噴嘴孔32的塗佈配置位置 與飛滴的射出方向•狀態之後’再實施塗佈。又’作爲該 焊劑去除機構的實施例，實施利用吸引用的噴嘴或微小管 的吸引，或是實施利用海綿或布等的吸收或擦掉’惟可實 現去除的運用，並未限制在此些也可以。 又’在實施該修正作業’在塗佈頭以外也可設置複數 台檢查攝影裝置（攝影機）12進行實施也可以。又，若不 -13- 201004520 gut嘴孔數變多，則也可進行噴嘴更換或噴嘴清掃的指示 。有關於噴嘴清掃，則將未圖示的噴嘴清掃部設於工作台 的端部’藉由一面加熱噴嘴部一面進行吸引，就可去除附 者於噴嘴部及其周邊部的焊劑。 以下，說明本裝置的動作。 欲形成焊劑時，事先將塗佈的位置（被形成於基板的 電極圖案與位置）記錄在控制部35，並將基板15搬進焊 劑形成裝置1 00。在本實施例中，如第1圖所示地，使用 將基板15裝載於帶式運送機而搬進的方式。不使用帶式 運送機’也有使用機器手臂等的方式。 以帶式運送機所搬進的基板1 5，是上昇工作台1就可 從運送機被交接給工作台1上。當基板15被載置於工作 台1，則將基板吸附機構2 7予以動作而將基板1 5固定於 工作台1。然後朝XY方向移動塗佈頭6，以設於塗佈頭 部的定位用攝影機1 2，進行攝影設於基板1 5的定位標誌 ，以求出基板位置（對於工作台1的偏移量）。決定塗佈 頭6對於基板15的初期位置，並將塗佈頭6移動至初期 位置。然後，求出噴嘴孔32對於設於基板15的電極圖案 的偏位量，而修正其偏位的方式，進行噴墨頭1 0的X Y 方向的移動及旋轉。 然後，將加熱機構21予以導通，進行確認焊劑的溫 度。當焊劑成爲所定溫度，則驅動循環栗2 5，同時開放電 磁閥29而將焊劑供應至噴墨頭1 0。首先焊劑是以自由掉 落而被供應至噴墨頭1 〇。控制部3 5是依據事先所登錄的 -14- 201004520 電極圖案與位置，來選擇須吐出的噴嘴孔3 2，而將吐出指 令送訊至吐出驅動部（未予圖示）。控制部3 5是同時地 也將朝XY方向移動所用的移動指令送訊至各驅動部。又 ，在塗佈時，也進行將基板1 5與噴嘴孔32的高度位置保 持在一定所用的控制。焊劑被供應於噴墨頭1 〇之後，確 認噴嘴孔3 2的塗佈配置位置與焊劑的射出狀態後，在基 板1 5實施塗佈。 完成塗佈後，以設於塗佈頭6的攝影機1 2，進行檢查 塗佈狀態，若有異常則中斷塗佈，而將對應於各種異常情 形的處理（先前所述的焊劑的修補等的處理）實施於基板 i 5。若無異常，則繼續進行塗佈。當完成塗佈，則關閉電 磁閥2 9。然後，當沒有噴墨頭1 〇內的焊劑’則停止循環 泵25。 當完成所塗佈的基板1 5的檢查•修正作業，則基板 15是被運送至下一工序之焊錫球形成裝置200。在此’將 焊錫球供應於以先前工序所形成的焊劑上。在本實施例中 ，供應焊錫球是使用經由網罩幕供應於焊劑上的方式。形 成焊錫球的基板是被搬運至檢査•修正裝置3 00 ’而在該 裝置檢查出焊錫球的供應狀態’並檢查出雙重附著或缺陷 ，而在該裝置進行修補可修正的缺陷’檢查結果’完成正 常的基板及修補的基板是被運送至流平裝置4 0 0，而被加 熱形成有焊錫凸塊。 如以上所述地’在本實施例的焊劑形成裝置’降低焊 劑的黏度進行塗佈，而所塗佈的焊劑不會流動擴展的方式 -15- 201004520 ’施以急冷而增加黏度。藉此，成爲精度優異地可塗佈焊 劑。 在以上所說明的焊劑形成裝置中，以1個構成來說明 塗佈頭，惟因應於基板尺寸等，當然可增加塗佈頭的數量 【圖式簡單說明】 第1圖是表示焊錫凸塊形成系統的槪略構成的圖式。 第2圖是表示焊劑形成裝置的一實施例的圖式。 第3 ( a )圖及第3 ( b )圖是表示對於噴墨頭的焊劑 供應系的圖式。 第4圖是表示實施檢查·修正焊劑塗佈後的基板面的 狀態的裝置的流程圖。 【主要元件符號說明】 1 :工作台 2 :線性軌 3 :移動平台 6 :塗佈頭 7 :線性軌 8 : Z軸工作台 9 : Z軸電動機 1 0 :噴墨頭 1 2 :攝影機 -16- 201004520 1 5 :基板 2 0 :焊劑儲存槽 21、22、24:加熱機構（加熱器） 2 8 :冷卻機構 -17-201004520 VI. [Technical Field] The present invention relates to a device for forming a flux by performing pretreatment on a solder electrode which is printed on a surface of a substrate by solder balls. [Prior Art] Conventionally, in order to form a solder ball on a printed circuit board, a screen printing technique is used as a pre-processing to perform soldering of a solder which raises the positioning rod force of a printed board and a solder ball, but the semiconductor is highly integrated. The wiring pattern of the substrate is also made fine, and the pitch of the solder balls to be formed is required to be narrow and the solder balls are formed. Therefore, as a method of producing a low-cost flux which has a change in the screen printing method, a method of using an inkjet nozzle is proposed as described in Patent Document 1 or Patent Document 2, for the high-speed and high-precision printing. Patent Document 1: Japanese Laid-Open Patent Publication No. 2001-168509 (Patent Document 2) Japanese Laid-Open Patent Publication No. 2001-053099. SUMMARY OF THE INVENTION The above-mentioned prior art has only the disclosure of using an inkjet head for applying a flux to an electrode. There are details about the composition of the specificity. The action is not revealed. However, 'the flux is for the liquid whose body is highly viscous. When a general inkjet head is used, the flux is attached to the nozzle, so that the nozzle is blocked and cannot be spit out, or the elapsed time has a staggering amount in the discharge amount. Misalignment and other issues. In addition, when the liquidity is applied and the coating is applied, the flux may flow out to the electrode-5-201004520, or the adjacent solder may be bonded to each other, or dust may be attached to the solder, and the insulating property may be lost. . An object of the present invention is to solve the above problems and to realize a problem in which no problem such as nozzle clogging occurs when a flux is ejected by using an ink jet head. A flux forming apparatus for applying a flux to an electrode portion formed on a substrate placed on a stage using an ink jet head, wherein a flux is supplied to a storage tank of the ink jet head to provide a soldering flux In the heating mechanism, a heating mechanism is also provided in the inkjet head, and a cooling mechanism that discharges the flux at a predetermined temperature and discharges the electrode and cools the flux discharged from the substrate is provided on the table. The flux is heated to lower the viscosity, and the ink jet head is smoothly discharged, and the temperature of the flux after the discharge is lowered, and the viscosity is increased to deteriorate the fluidity. Therefore, the flux can be applied with excellent precision in a desired field. [Embodiment] Fig. 1 is a schematic view showing the overall configuration of a solder bump forming system. When a solder bump is to be formed, first, a flux forming apparatus 100 for forming a flux is provided on a substrate on which an electrode is formed. Here, the electrode formed on the substrate is coated with a flux in the shape of the electrode. The substrate ' of the electrode on which the flux is applied on the substrate is transported to the solder ball supply device 200 that supplies the solder ball. The solder ball supply device 200 of the present embodiment is configured such that the solder ball on the flux is supplied from a screen having an opening in the shape of an electrode (screen printing device). The substrate on which the solder ball is supplied by the solder ball supply device 200, 201004520 is transported to the inspection/correction device 300, and the defect inspection is performed at the place where the repair is made, and the unrepairable substrate is excluded. The substrate that has been inspected is transported to the leveling device, which is heated and melted to form a solder ball forming substrate. The flux forming apparatus 1 includes an ink jet head and a table that can be moved up and down to be fixed to the table surface during mounting. The horizontal direction (XY direction) of the inkjet arrow is movable, and the substrate is conveyed to the table position. Further, the solder ball supply device is provided with a solder ball supply head for supplying solder balls, a work table for holding and a substrate that can be moved up and down, and a camera for use in a near position. Further, in the inspection/correction device 300, the substrate surface of the solder ball is supplied, and a nozzle for determining whether or not there is a defective camera, a solder ball for removing the defective solder ball, and a solder for supplying a novel solder are provided. The maintenance head of the maintenance mouth of the ball. Further, although the device is not shown, it has a waste box for partially discarding the removed solder balls, a novel solder ball box, and a flux box for storing flux. The leveling heater is placed on the upper side of the carrying belt, heated to a predetermined temperature, and melted to form solder bumps on the electrodes. Therefore, this part is formed by a material that carries heat resistance. In the present embodiment, an ink jet head forming device is used for the application of the flux. This is because with the miniaturization of the electrode, the opening of the mesh mask is difficult, and it is difficult to process only the size of the printed pattern. Even if it is possible, the accuracy of the alignment of the mask and the substrate must be improved. The production line 400, while the substrate is temporarily oriented toward the skin 200 is also applied to the cover substrate. The dispensing spray is provided for the removal of the camera portion: the defective solder ball is placed 400, and the solder ball belt is The arrangement of the flux-shaped seams on the fabrication of the solder bumps 201004520 is time consuming. In addition, the general flux is a high viscosity (about 15 to 30 Pa.s), so the flowability at the time of printing on the fine slit (flow path) formed in the mask is not good, and it is assumed that in order to avoid the mask for the slit Printing loss or insufficient printing due to air retention or dust clogging or the like 'even if a flux is formed on the electrode by strong printing, and the flux on the adjacent electrode pattern is traded together', printing defects are likely to occur. Further, the mask is pressed toward the substrate side by the large printing pressure, and the life of the mask is also short. Fig. 2 shows a schematic configuration of the flux forming apparatus. As shown in Fig. 2, in the flux forming apparatus of the present embodiment, the substrate mounting table 1 is provided on a gantry (not shown), and linearity is provided on both sides of the table 1 in the Y-axis direction. Track 2. A moving platform 3 is provided on the linear rail 2. Mounting feet 4 are provided on the mobile platform 3, and a moving frame 5 is mounted thereon above the table 1 across it. The moving frame 5 is provided with a head moving mechanism (linear rail) 用 for moving the coating head 6 in the X-axis direction. The coating head 6 is constituted by a Z-axis table 8, an ink-jet head 10, a mounting bracket 11, a camera 12, and the like, and the Z-axis table 8 is attached to the head moving mechanism 7. That is, the Z-axis table 8 is configured to move in the X-axis direction. Further, the Z-axis motor 9 is provided with a Z-axis motor 9, and a mounting bracket 安装 for mounting the ink jet head 1 or the like is configured to move in the Z-axis direction. Further, an R-axis motor 17 for rotating the ink jet head 1 is provided on the Z-axis table 8. Further, the mounting bracket 1 1 is provided with a positioning camera 1 2 or a distance measuring sensor for measuring the distance between the ink jet head 10 and the substrate 15 (not shown). According to the detection result of the distance measuring sensor, the coating head 8 is driven up and down to keep the interval between the substrate and the nozzle at the time of coating constant. Further, a camera moving linear rail 16 for moving the nozzle inspection camera 13 and the droplet inspection camera 14 is provided at one end portion of the table 1 which is sandwiched between the linear rails 2 of the gantry. The table 1 and the camera moving linear rail 16' are configured to be movable up and down. This is to receive the substrate by a substrate transfer belt (not shown), and is placed on the table 1. Further, although not shown, the table 1 is provided with a receiving substrate 15 and a vertically movable stopper for positioning. In addition, before the application of the flux to the substrate 15, the nozzle inspection camera 13 confirms whether or not the nozzle hole 32 (Fig. 3) is confirmed, and confirms the application position of the nozzle hole, and the droplet inspection camera 1 4 is to confirm the state of the flying droplets of the flux emitted from the nozzle holes 32, and to confirm whether there is a problem in the amount of injection or the like. In the clogging state of the nozzle hole 32, the application placement position and the emission state of the droplet of the flux are measured, and the control unit 35 (Fig. 3) sets the condition to be the criterion for determination, and by satisfying the condition, The manner in which the coating is formed to form a flux is programmed. If the application position of the nozzle hole is not appropriate, the R-axis motor 17 of the coating head 6 is mainly rotated to perform readjustment. In addition, when the nozzle hole is blocked and the amount of the flux is insufficient, the ink jet head charging mechanism (not shown) vacuum suctions (hereinafter referred to as "filling") discharge unit 31 (third) In order to solve the problem that the nozzle is clogged, the cleaning around the nozzle hole after the filling is performed by a nozzle cleaning mechanism (not shown) formed by an absorbing member such as a cloth. This action is performed until the nozzle is blocked, and the nozzle blocking operation is still performed. Further, in the case where the amount of the flux is excessively insufficient, the driving voltage used for the injection control can be changed, and the adjustment can be performed. -9- 201004520 Further, in the present embodiment, the number of times of charging to solve the nozzle clogging is set in advance, and the control unit 35 5' does not solve the nozzle clogging even if it reaches the number of times to be charged. The number of the blocked holes of the nozzle holes 32 or the pattern for applying the flux is applied, the coating is performed using the other nozzle holes 32, or an alarm is issued from the control portion 35 to replace the ink jet heads 1''. In addition, the clogging of the nozzle holes and the detection of the amount of the droplets of the flux are periodically performed, and the nozzle clogging operation is performed by the control unit 35 for the main cause of the poor solder coating application. Or use nozzle changes, etc. Fig. 3 shows a supply system for supplying flux to the inkjet coating head 6 for flux coating. However, when the inkjet head 1 is used for forming a flux, since the viscosity of the flux material to be used is high, it is necessary to dissolve it with a highly volatile solvent, or it is necessary to use a flux which is high in viscosity and which is low in viscosity. When a highly volatile solvent is used, problems occur in the working environment, etc., and it is necessary to use the device in a high-airtight room, and it is necessary to fully consider the exhaust gas, etc., and it becomes large and costly in the whole apparatus. And the workability is also likely to deteriorate. Further, the ink jet head 10 used must also select a material or structure that is strong against the solvent, and the head body is complicated to become a high price. As described above, in the present invention, as a flux material, a method of using a material which lowers the viscosity at a high temperature is used. Therefore, as shown in Fig. 3(a), a heating device (heater) 2 j and a thermometer for measuring the temperature are provided in the flux storage tank (material tank) for storing the quantitative coating material (not shown). ). Further, the ink jet head 10 is also provided with a heating mechanism 22. Further, a supply pipe 23 for supplying the -10-201004520 flux from the flux storage tank 20 to the ink jet head ,, and a reflow for reflowing the remaining flux from the ink jet head 10 to the flux storage tank 2 are provided. The piping 26 and the circulating pump 25 for returning the flux to the storage tank 2 are in the middle of the return piping 26. Further, as shown in Fig. 3(b), the supply pipe 23 and the return pipe 26 are wound with a heating mechanism 24 for keeping the flux temperature constant. Further, the 'circulation pump 25' is for using the heating mechanism 21 22, 24, the temperature of the heating system in the heating system (low viscosity: for example, 1 OmmPa · s or less), the material properties of the flux material are made homogeneous, and the damper device is provided in the control unit 35 Can be cycled. In the present embodiment, when the flux is not applied, the flux material is exposed to the nozzle hole portion of the outside air, and the nozzle clogging due to the solidification of the flux residue does not occur, by the control portion 35. The set timer can be configured to cycle. Further, the temperature of the rising flux is increased by the heating means 2 1, 22, and 24, but the temperature of the flux is preferably 60 ° C or less at the time of coating. Therefore, temperature control is performed to a temperature at which the viscosity of the flux is lowered by 40 ° C to 60 ° C. The temperature control or the like is configured in the control unit 35. As described above, if the flux is heated and the viscosity is lowered and supplied to the substrate 15, the flux becomes liquid, and it is highly likely that not only the upper portion of the electrode but also the outside of the electrode. Therefore, the table 1 for holding the substrate 15 is provided with a cooling mechanism 28 for cooling the substrate, and when the flux is applied, the cooling mechanism 28 is operated, and when the flux contacts the electrode portion on the substrate, the electrode portion is sharply lowered. The temperature is increased to increase the viscosity of the flux. As the cooling mechanism, there is a water cooling method in which the cooling water -11 - 201004520 is circulated in the table, or a method in which the Peltier element is arbitrarily cooled, and the like. This embodiment can be used in any manner. Further, a negative pressure (black arrow 30) is supplied to the upper portion of the flux storage tank 20, so that the flux does not naturally leak out from the ink jet head 10 except at the time of coating. Further, as shown in Fig. 3(b), in the ink jet head 10, the plurality of nozzle holes 3 2 are provided in the discharge portion 3 1, although not shown, each of the nozzle holes is provided with a driving portion. A nozzle hole can control the discharge. Further, in the present embodiment, the nozzle holes 32 are arranged in a line, but are not limited thereto, and the arrangement of the plurality of columns or the zigzag arrangement may be employed. Further, in the table 1, the substrate suction mechanism 27 for holding the substrate 15 by the negative pressure is provided so as not to move the substrate 15 during coating. Further, as shown in Fig. 2, the coating head 6 is provided with an imaging device (camera) 12 for alignment, and the camera 12 is used to image the alignment mark provided on the substrate 15, thereby making the substrate 15 correctable. The position and the offset of the ink jet head 10 and the like. Further, in the present embodiment, the moving frame 5 including the coating head 6 is movable in the Y direction, and the coating head 6 having the moving frame 5 is movable in the X direction, but is operated to correct the deviation. The movement mechanism of the X-axis, the Y-axis, and the R-axis direction may be provided on the stage 1 side. Further, 'the camera 12 is a soldering state applied by photography', that is, a coating position and a droplet amount of the coating material, and it is determined whether or not the flux is normally applied to the electrode, and can be used to check whether the horizontal is A photographing device (camera) such as a flux is bonded across the electrodes. The coating failure of the flux is corrected when the flux coating device is repairable. When the desired condition set in the control unit 35 is not satisfied in advance, a process that is programmed in the control unit 35 shown in Fig. 4 of -12-201004520 is implemented for each of the occurrences. Fig. 4 is a flow chart showing the failure of flux coating in the flux coating apparatus. As a procedure for confirming the flux coating failure, first, (1) the camera was moved on the substrate 15 to which the flux was applied, and (2) the camera 12 was used to confirm the presence or absence of the coating failure. If there is no coating failure, the substrate 15 is moved to the solder ball forming step, and if there is a coating failure, first (3) is judged by the presence or absence of uncoating, and if it is not applied, The nozzle hole 3 2 selected for use in the flux application is selected from the photographing result of the camera and the application pattern previously stored in the control unit 35, and (4) is applied. In addition, before the correction coating is performed, the clogging of the nozzle hole 3 2 for correction by the nozzle inspection camera 13 is confirmed, the application position state, and the liquid droplet inspection camera 14 are confirmed from the nozzle. When the amount of flux emitted from the nozzle hole 32 is insufficient in the nozzle hole to be used, and the above-described charging operation cannot be solved, another usable nozzle hole is selected and corrected. Then, when the application patterns of the adjacent fluxes are applied to each other, (5), although not shown, the bonding portion is removed by the flux removing mechanism provided in the ink jet head. The flux is applied to confirm the application position of the nozzle hole 32 and the direction and state of the droplets. Further, as an example of the flux removing mechanism, the suction by the nozzle or the microtube for suction or the absorption or wiping off by the sponge or the cloth is performed, and the removal can be performed, and the use is not limited thereto. Also. Further, in addition to the coating head, a plurality of inspection photographing apparatuses (cameras) 12 may be provided in addition to the coating head. In addition, if the number of nozzle holes is larger than -13-201004520 gut, the nozzle replacement or nozzle cleaning instruction can be performed. In the cleaning of the nozzle, the nozzle cleaning portion (not shown) is provided at the end portion of the table. By sucking while heating the nozzle portion, the flux attached to the nozzle portion and its peripheral portion can be removed. Hereinafter, the operation of the device will be described. When the flux is to be formed, the position of the application (the electrode pattern and the position formed on the substrate) is previously recorded in the control unit 35, and the substrate 15 is carried into the solder forming apparatus 100. In the present embodiment, as shown in Fig. 1, a method in which the substrate 15 is loaded on a belt conveyor and carried in is used. There is also a method of using a robot arm or the like without using a belt conveyor. The substrate 15 carried by the belt conveyor is lifted from the table 1 and can be transferred from the conveyor to the table 1. When the substrate 15 is placed on the table 1, the substrate suction mechanism 27 is operated to fix the substrate 15 to the table 1. Then, the coating head 6 is moved in the XY direction, and the positioning camera 12 provided on the coating head is used to photograph the positioning mark provided on the substrate 15 to determine the substrate position (the offset amount for the table 1). . The initial position of the coating head 6 with respect to the substrate 15 is determined, and the coating head 6 is moved to the initial position. Then, the offset amount of the nozzle hole 32 with respect to the electrode pattern provided on the substrate 15 is corrected, and the offset is corrected, and the movement and rotation of the ink jet head 10 in the XY direction are performed. Then, the heating mechanism 21 is turned on to check the temperature of the flux. When the flux becomes a predetermined temperature, the circulation pump 25 is driven while the electromagnetic valve 29 is opened to supply the flux to the ink jet head 10. First, the flux is supplied to the ink jet head 1 by free fall. The control unit 35 selects the nozzle hole 3 2 to be discharged based on the electrode pattern and the position of the -14-201004520 registered in advance, and transmits the discharge command to the discharge drive unit (not shown). The control unit 35 simultaneously transmits the movement command for moving in the XY direction to each of the drive units. Further, at the time of coating, the control for maintaining the height position of the substrate 15 and the nozzle hole 32 is also performed. After the flux is supplied to the ink jet head 1 , the application position of the nozzle hole 32 and the emission state of the flux are confirmed, and then the coating is applied to the substrate 15 . After completion of the application, the camera 1 provided in the coating head 6 is inspected and coated, and if there is an abnormality, the coating is interrupted, and the treatment corresponding to various abnormal conditions (the repair of the flux described above, etc.) is performed. Processing) is performed on the substrate i 5 . If there is no abnormality, continue coating. When the coating is completed, the solenoid valve 29 is closed. Then, the circulation pump 25 is stopped when there is no flux ' in the ink jet head 1'. When the inspection and correction work of the applied substrate 15 is completed, the substrate 15 is the solder ball forming apparatus 200 that is transported to the next step. Here, the solder balls are supplied to the flux formed in the previous process. In the present embodiment, the supply of the solder balls is performed by using a mesh mask to supply the flux. The substrate on which the solder ball is formed is transported to the inspection/correction device 300 00 ', and the supply state of the solder ball is checked in the device', and double adhesion or defects are detected, and the defect repaired in the device is corrected. The completed substrate and the repaired substrate are transported to the leveling device 400 and heated to form solder bumps. As described above, the flux forming apparatus of the present embodiment reduces the viscosity of the solder to be applied, and the applied flux does not flow and expands. -15-201004520 」 The viscosity is increased to increase the viscosity. Thereby, the solder can be applied with excellent precision. In the flux forming apparatus described above, the coating head is described in one configuration. However, the number of coating heads can of course be increased in accordance with the substrate size and the like. [Simple description of the drawing] Fig. 1 shows the formation of solder bumps. The schema of the system's strategy. Fig. 2 is a view showing an embodiment of a flux forming apparatus. Figures 3(a) and 3(b) are diagrams showing the flux supply system for the ink jet head. Fig. 4 is a flow chart showing an apparatus for performing inspection and correction of the state of the substrate surface after the flux application. [Main component symbol description] 1 : Workbench 2: Linear rail 3: Mobile platform 6: Coating head 7: Linear rail 8: Z-axis table 9: Z-axis motor 1 0: Inkjet head 1 2: Camera-16 - 201004520 1 5 : Substrate 2 0 : Flux storage tank 21, 22, 24: Heating mechanism (heater) 2 8 : Cooling mechanism -17-