JP3621089B1 - Solder region forming apparatus and method, and continuous plating apparatus - Google Patents

Abstract

A solder region is formed by a solder paste to improve the reliability of joining, the mechanical strength of the solder itself, and the quality.
A solder region forming apparatus for forming a solder region H on a member S, which stores a solder paste K and discharges the solder paste K stored in the storage unit 12 toward the member S. A dispenser 14 having a nozzle 16, a discharge control unit 18 that controls the discharge amount and discharge speed of the solder paste K discharged from the nozzle 16, and a predetermined amount discharged from the nozzle 16 of the dispenser 14 controlled by the discharge control unit 18. By heating and melting the solder paste K applied to the position, a heating section 22 for forming a solder region H on the member S is provided.
[Selection] Figure 1

Description

  The present invention relates to a solder area forming apparatus and method, and a continuous plating apparatus, and more particularly, an apparatus for forming a solder area on an electronic component made of an electronic member such as a film carrier tape, a connector member, and a lead frame. The present invention also relates to a method and a continuous plating apparatus for continuously forming a solder region on an object to be processed of the electronic component.

  The plating process for electronic parts made from electronic members such as film carrier tape, connector members, and lead frames is made by continuously feeding the coiled material to the wet plating equipment and continuously after the plating process. It is wound up and processed. Such a process is performed by a continuous plating apparatus. A connector member will be described as a representative example of such continuous plating treatment.

  That is, in the continuous plating process, first, the plating pretreatment is performed, then the Ni plating process is performed as the base film, and then the contact plating on the Ni film is performed (the Au plating film is exclusively used). Finally, it is common to perform wet solder plating as a pre-solder at the time of solder joining on the solder joint at the time of connector assembly.

For wet solder plating, Pb-free solder (binary solder plating such as Sn-Ag solder, Sn-Cu solder, Sn-Bi solder, etc., and Sn simple plating) is used due to recent environmental problems. However, Pb-free solder plating has not yet obtained sufficient bonding reliability, and Pb-based solder is still used because of insufficient stability as a plating bath.
"Electronic high-functional thin film fabrication method using wet method", published by Koshinsha Co., Ltd., General Engineering Press, October 30, 1992

  Wet solder plating as a pre-solder is an indispensable element for maintaining high bonding reliability, and there is no technology that can be replaced in view of cost.

  However, the solder plating in the wet method has a number of problems. For example, in order to obtain further reliability, various elements are added to the solder plating film to improve the strength of the solder itself and the interfacial bonding strength with the base, control the melting point, etc. The alloy types that can control the elements in the coating on a mass production basis to a certain extent are at most binary alloy coatings, and it is difficult to deal with mass production based on ternary or higher alloys.

  In addition, it is said that the element ratio in the binary alloy solder plating film is possible only when each electrolytic condition and bath management are strictly controlled. On the other hand, in solder pastes, particularly Pb-free solder pastes, it is easy to obtain various performances by adding various metals.

  As a matter of course, a continuous wet plating apparatus for film carrier tape and connector members is provided with a water washing step before and after each treatment step. In order to remove the treatment liquid adhering to the object to be treated as much as possible, various contrivances are applied to the water washing process, which is an important know-how matter.

  However, it cannot be completely removed continuously within a limited processing space and processing time, and the ratio of the processing liquid of the previous process brought into the next process compared to other wet plating methods (rack method) There are many. That is, even in a solder plating bath close to the final process, the introduction of impurities from the previous process and the pumping out of the solder plating bath are inevitable, and the fluctuation of the bath is large. This tendency increases exponentially when the plating rate is increased in consideration of productivity. Thus, no matter how strictly the electrolysis conditions are managed, it is quite difficult to mass-produce alloy plating stably even in a binary system in a continuous plating line with large bath fluctuations.

  The area required for solder plating as a preliminary solder is naturally limited by the product. In the case of a connector member, it is necessary to prevent the plating solution from coming into contact so that no solder plating is deposited on the contact points. For this reason, masking in some form other than the portions that require solder plating, etc. However, it is too costly to completely mask. Therefore, a so-called liquid level control method in which only a necessary part of plating is immersed in a plating solution and others are put out into the air and plating or a partial plating method using a dedicated plating cell is used (see Non-Patent Document 1). .

  However, these methods have the problem that the plating solution cannot be exuded to a portion where plating is not necessary, and that the boundary does not finish accurately, and that expensive equipment is required. . In particular, in the case of connector members, finishing the boundaries with high precision has been increasingly demanded in recent miniaturization and narrow pitch. In order to prevent the molten solder from spreading into the contact area when soldering with other parts when assembling the connector member to the product, there is no solder plating film or gold plating film at all, and the underlying Ni plating is exposed. A 0.5 mm wide “solder rise prevention band” is indispensable. For this reason, it is inevitable to introduce a more expensive cell dedicated to plating for providing a solder rise prevention band, and the burden is greatly increased.

  Furthermore, for products that require solder plating at two or more different locations in the same product, it is necessary to prepare another expensive plating cell and incorporate it into the line, or repeatedly apply the number of solder plating required locations. There is a complication that there is.

  Other problems with wet solder plating are the need for wastewater treatment and variations in film thickness. Although a Pb-free solder plating bath is being introduced, the resulting Pb-free solder has insufficient film performance such as a melting point shifting to a higher temperature or a film becoming brittle than Pb-based solder, The fact is that the spread has not progressed because the instability as a plating bath has not been eliminated. Elements such as Sn, Ag, Cu, Zn, and Bi are used in the Pb-free plating bath, and it is necessary to treat waste water containing these elements. The Pb bath naturally contains harmful Pb, and complete removal of Pb from the waste water is an indispensable element.

  Wet solder plating is an electroplating method. For this reason, the film thickness of the film is likely to vary like other electroplated films.

  Since this wet solder plating portion is partially plated, it is often not linear and is not straightened to facilitate partial plating, and is often linear. Processing such as bending is performed after plating. This process causes problems such as cracking of the plating layer, deterioration of solder wettability due to corrosion resistance deterioration by reducing the thickness of the underlying plating such as nickel to improve workability, and limited selection of materials. .

  The present invention has been made in view of such circumstances, and a first object of the present invention is to freely select solder pastes having various characteristics in accordance with the purpose, thereby improving the reliability of solder joints and the solder itself. An object of the present invention is to realize a solder region forming apparatus and method capable of improving mechanical strength and improving quality.

  The second object is to realize a solder region forming apparatus and method capable of giving a degree of freedom in forming a solder region so that the solder region can be formed after processing such as bending.

  Furthermore, the third object is to improve the overall quality such as the bonding reliability of the objects to be processed after the solder area is formed and the mechanical strength of the solder itself by applying such a solder area forming apparatus. It is to realize a continuous plating apparatus that can be achieved.

  In order to achieve the above object, the present invention takes the following measures.

Specifically, in order to achieve the first and second objects, the invention of claim 1 is a solder region forming apparatus for forming a solder region in a connector member that is continuously conveyed , and stores solder paste. Controlled by the storage means, the discharge means for discharging the solder paste stored in the storage means toward the connector member, the control means for controlling the discharge amount and discharge speed of the solder paste discharged from the discharge means, and the control means Heating and melting means for forming a solder region in the electronic component by heating and melting the solder paste discharged from the discharging means and applied to the discharge position.

According to a second aspect of the present invention, in order to achieve the first and second objects, in the solder region forming apparatus according to the first aspect of the present invention, a plurality of discharge means are arranged, and the solder paste discharged from each discharge means The solder paste is applied to a predetermined position by controlling the discharge amount and the discharge speed by the control means.

  According to a third aspect of the present invention, in order to achieve the first and second objects, in the solder region forming apparatus according to the first or second aspect of the present invention, the solder paste is discharged using a dispenser as the discharge means.

According to a fourth aspect of the present invention, in order to achieve the first and second objects, in the solder region forming apparatus according to any one of the first to third aspects, the solder paste is applied to the discharge position. Prior to this, first application means is further provided for applying a flux that promotes the spread of solder when the solder paste is melted to at least the region including the discharge position.

According to a fifth aspect of the present invention, in order to achieve the first and second objects, in the solder region forming apparatus according to the fourth aspect, after the solder region is formed, heating of the additive added to the solder paste is performed. A cleaning means is further provided for cleaning the residue from melting from the solder region.

According to a sixth aspect of the present invention, in order to achieve the first and second objects, in the solder region forming apparatus according to the fifth aspect, the solder region is formed in the solder region after the cleaning by the cleaning means. The image forming apparatus further includes a second application unit that applies at least one of an antioxidant that prevents the solder from being oxidized and a protective film that protects the solder.

According to a seventh aspect of the present invention , there is provided a plating apparatus for continuously performing a wet plating process on a connector member in order to achieve the third object, wherein the solder region is formed according to any one of the first to sixth aspects. This is a plating apparatus for forming a solder region by an apparatus.

In order to achieve the first and second objects, the invention according to claim 8 is a solder region forming method for forming a solder region in a connector member that is continuously conveyed, wherein a solder paste having a predetermined discharge amount is applied. The solder region is formed by applying the solder paste to the predetermined discharge position by discharging from the dispenser toward the predetermined discharge position of the connector member at a predetermined discharge speed and heating and melting the applied solder paste.

  That is, the solder paste used in the invention of claim 1 uses solder particles which are processed into fine particles after blending and melting various useful metals in an arbitrary ratio. Since solder with a composition that meets the purpose of use can be used in this way, there are metallurgical ideal solders that improve joint reliability and the mechanical strength of the solder itself, and solders that have an optimum melting point. Can be used. Further, by applying a predetermined amount of solder paste to a predetermined position and then melting the solder paste, it becomes possible to reliably and easily form a solder region at a predetermined position with high accuracy.

Some connector members require solder areas at a plurality of locations. In particular, there may be cases where the shapes of these plural places are different from each other or the characteristics of the solder and the film thickness are changed. Even in such a case, by using a plurality of ejection means as in claim 2, it is possible to form a plurality of solder regions by a single process without masking and repeating the process a plurality of times as in the prior art. Become. Furthermore, even when the solder area is wide, it can be solved by applying a plurality of the same solders simultaneously.

The dispenser according to claim 3 and claim 8 has the performance of discharging a substance from a low viscosity of 1 (Pa · s) or less to a grease-like high viscosity with good control. Therefore, it becomes easy to discharge the solder paste under arbitrary conditions. Moreover, the nozzle of the dispenser can be selected from among many types made of metal or resin. These can have a thin tip shape, bend, or bend according to the purpose. Therefore, it is easy to fix and install the tip of the nozzle toward a predetermined position of the electronic component. The tip of the nozzle may be placed slightly away from the surface of the electronic component, or may be placed so as not to be deformed. Alternatively, when using a dispenser with excellent discharge capacity, the nozzle may be installed completely away from the surface of the connector member within the discharge capacity range. This makes it possible to reliably apply a predetermined amount of solder paste to an arbitrary discharge position.

According to the fourth aspect , by applying the flux before the solder paste is applied, the solder wettability is further improved and the solder region having adhesiveness is effectively formed.

According to the fifth aspect , after the solder paste is heated and melted, a degree of freedom of the solder paste to be used can be increased by adding a cleaning means for removing residues such as flux remaining on the solder surface. That is, it is possible to use a solder paste or flux having a higher activity by washing after forming the solder region. This means that a solder paste can be applied to a part of the solder region forming portion, and the solder can be spread over the entire solder region when heated and melted. As a result, the solder region can be formed more easily. It also helps to improve adhesion. Also in this case, in order to fix the solder area, it is recommended to form a solder rise prevention band using an ink jet or a dispenser, or a flux bleeding up preventing agent.

According to the sixth aspect of the present invention, surface contamination including oxide formation on the solder surface can be suppressed during the standing period after the solder region is formed. This makes it possible to increase the reliability of soldering.

According to a seventh aspect of the present invention, by applying the solder region forming apparatus according to any one of the first to sixth aspects of the present invention in the plating apparatus, the bonding reliability of the objects to be processed after the solder region is formed, the machine of the solder itself It is possible to realize a plating apparatus capable of improving overall quality such as mechanical strength.

  According to the present invention, there is provided a solder area forming apparatus and method capable of improving the overall quality such as the reliability of bonding and the mechanical strength of the solder itself by forming the solder area using a solder paste. It becomes possible to provide.

Further, by applying such a solder region forming apparatus as an alternative to the wet solder plating portion of the connector member plating apparatus, it is possible to improve the reliability, mechanical strength, and quality of the connector member after plating. It is possible to provide a possible plating apparatus.

  In addition, the solder area can be easily formed on the deformed part, so the solder area can also be formed on the processed part, in addition to preventing deterioration of corrosion resistance and solder wettability. It becomes possible to expand the degree of freedom of material selection.

  The best mode for carrying out the present invention will be described below with reference to the drawings.

(First embodiment)
A first embodiment will be described with reference to FIGS.

  FIG. 1 is a conceptual diagram showing an example of a solder region forming apparatus to which the solder region forming method according to the first embodiment is applied.

  That is, this solder region forming device is a device that forms a solder region H on a member S such as a film carrier tape, a connector member, and a lead frame, and includes a storage unit 12, a dispenser 14 provided with a nozzle 16 at the tip, Flux application unit 15, position sensor 17, discharge control unit 18, drive unit 19, process control unit 20, heating unit 22, cleaning unit 24, drying unit 25, application unit 26, not shown And a transport unit.

  The process control unit 20 controls the flux application unit 15, the heating unit 22, the cleaning unit 24, the drying unit 25, and the application unit 26.

  The flux application unit 15 applies a flux that promotes the spread of the solder when the solder paste is melted, to a region including the position to be the solder region H before the solder paste is applied. When a flux needs to be applied partially, it is desirable to use a dispenser system having a control mechanism similar to that for solder paste application.

  In this case, in order to fix the solder region H, it is preferable to form a solder rising prevention band or apply a chemical agent that prevents the solder from spreading further.

  The position sensor 17 automatically detects the application position and outputs a detection signal to the discharge controller 18. The position sensor 17 may be realized by a combination of a photodiode and a light receiving sensor using punching holes R provided at equal intervals on both ends of the member S, or a positioning pin or the like may be used. . If higher precision positioning is required, image processing may be used.

  Upon receiving the detection signal from the position sensor 17, the discharge control unit 18 generates a movement command signal for moving the nozzle 16 of the dispenser 14 to a predetermined position, and outputs this movement command signal to the driving unit 19.

  Upon receiving such a movement command signal, the driving unit 19 moves the nozzle 16 to a predetermined position in accordance with the movement command signal. Such positioning may be performed once at the start of the work, or timely during the work, or continuously with the work. The positioning may be performed manually. In this case, positioning by the drive part 19 becomes unnecessary.

  The storage unit 12 stores solder paste K. For the solder paste K, generally, solder particles blended at an arbitrary ratio and processed into fine particles are used (see, for example, Non-Patent Document 1). This makes it possible to use solder with a composition that suits the purpose of use, thus obtaining metallurgical ideal solder that can improve joint reliability and increase the mechanical strength of the solder itself, and solder with the optimum melting point. be able to.

  The dispenser 14 discharges the solder paste K supplied from the storage unit 12 toward the member S through the nozzle 16. Generally, a dispenser has the performance of discharging a substance from a low viscosity of 1 (Pa · s) or less to a grease-like high viscosity with good control. Therefore, it is suitable for discharging the solder paste K under arbitrary conditions. The nozzle 16 can be selected from a variety of commercially available metal and resin types. For example, as shown in FIG. 2, the tip shape can be made narrower, longer, or bent according to the shape of the workpiece 3. Therefore, it is easy to install the tip of the nozzle 16 toward a predetermined position of the object 3 such as the member S. As shown in FIG. 3 (a), the tip of the nozzle 16 may be placed slightly away from the surface of the object 3 to be processed. Alternatively, as shown in FIG. May be installed. Or when using the dispenser 14 excellent in discharge capability, you may install the nozzle 16 completely away from the surface of the member S in the range of the discharge capability. This makes it possible to reliably apply the solder paste K to any discharge position.

  As an application method using such a dispenser 14, there are a continuous method in which the solder paste K is continuously discharged and an intermittent method in which the solder paste K is intermittently discharged. The intermittent method can be controlled in a short time in milliseconds per shot. In addition, as shown in FIG. 3C, it is possible to fly a discharge distance of about 10 mm length with high accuracy. In particular, when it is difficult to supply the solder paste K, such as when the connector member having a complicated shape or the solder region H is not linear, it is effective to apply using the dispenser 14 having a long discharge distance.

  The discharge controller 18 controls the discharge amount and discharge speed of the solder paste K discharged from the nozzle 16 of the dispenser 14. The discharge amount and the discharge speed are controlled according to the properties of the solder paste K stored in the storage unit 12, the shape of the nozzle, the material of the member S, the pressure determined in advance according to the size and thickness of the solder region H to be formed, and the like. The storage unit 12 is controlled based on the conditions. Under this condition, the solder paste K stored in the storage unit 12 is pushed out to the dispenser 14 and further discharged from the tip of the nozzle 16 at a predetermined discharge amount and discharge speed.

  The heating unit 22 is provided downstream of the dispenser 14 and the nozzle 16 in the transport direction F. For example, a far-infrared heater, a warm air heater, or the like is used, and the solder applied to the discharge position of the member S is used. Paste K is heated and melted. As a result, a solder region H is formed. This heating amount is controlled by the process control unit 20.

  The process control unit 20 is a solder applied to the member S based on the properties, particle diameter, amount of the solder paste K applied to the member S, the material of the member S, the size and thickness of the solder region H to be formed, and the like. The heating unit 22 is controlled so that the paste K is heated with a heating amount capable of melting the paste K. The heating conditions are not constant depending on the composition of the solder paste K, the particle diameter, the type of additive, the conveyance speed, the heat capacity of the member S that is the object to be processed, and the like. Accordingly, the heating amount is set each time according to these changes. In heating, it is important to avoid a steep temperature gradient. Therefore, the main heating is preferably performed after the heating unit 22 is preheated. Alternatively, a preheating device may be provided upstream of the heater 22 in the transport direction F, and preheating may be performed by the preheating device.

  Thus, the solder area | region H is formed by carrying out the main heating of the solder paste K apply | coated to the member S by the heating part 22 controlled by the process control part 20. FIG. At the time of this heating and melting, it is preferable to fire in a non-oxidizing atmosphere in order to minimize the oxidation of the solder and to optimize the solder spread. In order to improve the solder spread, it is possible to supply solder to the entire solder region forming portion by applying and melting a solder paste on a part of the solder region forming portion.

  As described above, additives are added to the solder paste and flux, but when the solder paste is heated and melted by the heating unit 22, these additives remain in the solder region H as residues. The cleaning unit 24 removes such residues from the solder region H by cleaning the solder region H after being heated and melted. The drying unit 25 dries the solder region H cleaned by the cleaning unit 24.

  The application unit 26 is at least one of an antioxidant that prevents the solder forming the solder region H from being oxidized in the solder region H after being dried by the drying unit 25 and a protective film that protects the solder. Apply.

  A transport unit (not shown) transports the member S continuously or intermittently along the transport direction F.

  Next, the operation of the solder region forming apparatus will be described with reference to the flowchart of FIG.

  That is, first, the member S that is an object to be processed is transported continuously or intermittently along the transport direction F by a transport unit (not shown).

  In addition, a solder paste K is used to form the solder region H in the member S that is the object to be processed, and the solder paste K is stored in the storage unit 12. Since solder particles generally blended at an arbitrary ratio and processed into fine particles are used for the solder paste K, solder having a composition in accordance with the intended use can be used. Therefore, it is possible to select and use a metallurgical ideal solder that can improve the bonding reliability and increase the mechanical strength of the solder itself, or a solder having an optimum melting point.

  First, the nozzle 16 is positioned at the start of work. In this positioning, when the member S is transported to the dispenser 14 side by a transport unit (not shown), the punching hole R carved in the member S is detected by the position sensor 17. Then, a detection signal is output from the position sensor 17 to the discharge controller 18. When the detection signal is received by the discharge controller 18, the discharge controller 18 generates a movement command signal for moving the nozzle 16 of the dispenser 14 to a predetermined position and outputs the movement command signal to the drive unit 19. When this movement command signal is received by the drive unit 19, the nozzle 16 moves to a predetermined position in accordance with this movement command signal. Such positioning may be performed once at the start of the work, or timely during the work, or continuously with the work. The positioning may be performed manually. In this case, positioning by the drive part 19 becomes unnecessary.

  First, in the flux application unit 15, before the solder paste is applied to the member S, a flux that promotes the solder spread when the solder paste is melted is applied to the region including the position to be the solder region H (S1). .

  When the member S thus coated with the flux is transported to the dispenser 14 side by a transport unit (not shown), a punching hole or the like carved in the member S is detected by the position sensor 17 (S2). Then, a detection signal is output from the position sensor 17 to the discharge controller 18.

  Next, the solder paste K stored in the storage unit 12 is applied from the nozzle 16 of the dispenser 14 to the member S. The discharge amount and the discharge speed from the nozzle 16 depend on the properties of the solder paste K and the member S. Depending on the material, the shape of the nozzle, and the size and thickness of the solder region H to be formed, it is determined by the discharge controller 18. Further, the discharge control unit 18 applies a pressure corresponding to the discharge amount and the discharge speed to the storage unit 12 (S3).

  With this pressure, the solder paste K stored in the storage unit 12 is pushed out to the dispenser 14 and further discharged from the tip of the nozzle 16 at a predetermined discharge amount and discharge speed (S4).

  Generally, a dispenser has the performance of discharging a substance from a low viscosity of 1 (Pa · s) or less to a grease-like high viscosity with good control. Therefore, it is suitable for discharging the solder paste K under arbitrary conditions. The nozzle 16 can be selected from a variety of commercially available metal and resin types. Furthermore, since the tip shape can be made thin, long, or bent according to the shape of the object 3 to be processed, it is easy to install the tip of the nozzle 16 at a specific position of the member S. As described above, a mechanism for automatically applying to a predetermined position may be provided as necessary. Thereby, the solder paste K is reliably applied to an arbitrary discharge position (S5).

  The discharging method of the solder paste K from the dispenser 14 can be either continuous or intermittent. When the solder paste K is applied over a wide continuous range, the solder S is continuously conveyed while the solder S is being conveyed. The paste K is also made by discharging continuously. When applying the solder paste K in a narrow range, the conveying unit is temporarily stopped, a predetermined amount of solder paste K is discharged, and then the conveying unit is operated to convey the member S to the next predetermined position. It is made by intermittent discharge.

  When the solder paste K is applied to the predetermined position in this way, the member S is transported along the transport direction F by the transport unit, so that the position where the solder paste K is applied moves toward the heating unit 22. (S6). Thus, the solder paste K is heated and melted by the heating unit 22 (S7). The heating amount of the heating unit 22 is controlled by the process control unit 20.

  That is, in the process control unit 20, the properties of the solder paste K applied to the member S (for example, the solder particle diameter and its amount, the kind and amount of additive, etc.), the material and heat capacity of the member S, and the solder to be formed A heating amount that can melt the solder paste K applied to the member S is determined based on the size and thickness of the region H, and the heating unit 22 is controlled based on the heating amount. In this manner, the solder paste K applied to the member S is heated by the heating unit 22 controlled by the process control unit 20. As a result, the applied solder paste K is efficiently melted, and the solder region H is accurately and reliably formed at a predetermined position.

  The solder region H after such heat-melting is then transported to the cleaning unit 24 by the transport unit and cleaned (S8). As described above, additives are added to the solder paste and flux, and when the solder paste is heated and melted in this way, these additives remain in the solder region H as a residue. However, these residues are removed from the solder region H when the solder region H is cleaned by the cleaning unit 24.

  The solder region H is further dried by the drying unit 25 and then transferred to the coating unit 26. Here, an antioxidant for preventing oxidation of the solder forming the solder region H is applied, or a protective film for protecting the solder is applied (S9).

  In this way, an electronic component in which the solder region H is formed is obtained.

  As described above, in the solder region forming apparatus to which the solder region forming method according to the first embodiment is applied, it is possible to solve a number of problems that are difficult to cope with by the wet solder plating method.

  That is, since a solder having an arbitrary composition can be used, it is possible to greatly improve the fundamental quality such as improvement in the reliability of joining, improvement in the mechanical strength of the solder itself, and setting of the optimum melting point.

  In addition, precise positioning to the required solder area H and supply amount of the solder paste K can be precisely controlled, and there is no variation in the finished film thickness, and a clear solder area H can be obtained. It is possible to eliminate the influence on

  Furthermore, since the discharge section realized by the dispenser 14 and the nozzle 16 has the flexibility to be able to arbitrarily process the shape of the nozzle 16 in accordance with the shape of the object to be processed and the layout conditions of the apparatus, expensive dedicated equipment It can be realized without using the, and is excellent in cost. Also, the installation area is much smaller and it is possible to easily turn on the line.

  Such a solder region forming apparatus can also be applied to a continuous plating apparatus that continuously performs a plating process on a target object such as an electronic component. .

  In addition, since the solder region H can be formed only in the minimum necessary place, the broken material generated from the base material is not attached with solder, so that these broken materials can be effectively reused.

(Second Embodiment)
A second embodiment will be described with reference to FIGS. The second embodiment is a modification of the first embodiment. Accordingly, only the different points will be described here, and a duplicate description will be avoided.

  FIG. 5 is a conceptual diagram showing an example of a solder region forming apparatus to which the solder region forming method according to the second embodiment is applied.

  That is, this solder region forming apparatus is different from the first embodiment only in that a plurality of dispensers 14 and nozzles 16 are provided. The plurality of dispensers 14 and nozzles 16 are also supplied with the solder paste K from the storage unit 12. FIG. 5 shows a configuration in the case where the solder paste K is supplied from the same storage unit 12 to a plurality of dispensers 14, but it corresponds to each dispenser 14 as shown in FIG. The storage unit 12 may be provided.

  In FIGS. 5 and 6, only two dispensers 14 and nozzles 16 are representatively shown, but three or more may be used.

  The discharge control unit 18 controls the discharge amount and discharge speed of the solder paste K discharged from the nozzle 16 of each dispenser 14 by applying pressure to the storage unit 12 as in the first embodiment. . As shown in FIG. 6, when a storage unit 12 corresponding to each dispenser 14 is provided, a different pressure is applied to each storage unit 12, and the discharge amount and discharge speed of the solder paste K discharged from each nozzle 16. Can also be controlled individually.

  Some objects to be processed require the formation of solder regions H at a plurality of locations. Furthermore, it may be necessary to change the shape of the plurality of locations from each other, or to change the type of solder and the film thickness. Even in such a case, by using a plurality of dispensers 14 and nozzles 16 as in the present embodiment, a plurality of solder regions H can be formed in one process without masking and repeating a plurality of times as in the prior art. It becomes possible to form.

  As mentioned above, although preferred embodiment of this invention was described referring an accompanying drawing, this invention is not limited to this structure. Within the scope of the invented technical idea of the scope of claims, a person skilled in the art can conceive of various changes and modifications. The technical scope of the present invention is also applicable to these changes and modifications. It is understood that it belongs to.

1 is a conceptual diagram showing an example of a solder region forming apparatus to which a solder region forming method according to a first embodiment is applied. The schematic diagram which shows an example of the front-end | tip shape of a nozzle. The conceptual diagram which shows the example of the positional relationship of a nozzle and a to-be-processed object. The flowchart which shows operation | movement of the solder area | region formation apparatus to which the solder area | region formation method which concerns on 1st Embodiment is applied. FIG. 9 is a conceptual diagram illustrating an example of a solder region forming apparatus to which a solder region forming method according to a second embodiment is applied. FIG. 9 is a conceptual diagram illustrating another example of a solder region forming apparatus to which a solder region forming method according to a second embodiment is applied.

Explanation of symbols

  DESCRIPTION OF SYMBOLS S ... Member, H ... Solder area | region, F ... Transport direction, R ... Punching hole, 3 ... To-be-processed object, 12 ... Storage part, 14 ... Dispenser, 15 ... Flux application part, 16 ... Nozzle, 17 ... Position sensor, 18 DESCRIPTION OF SYMBOLS ... Discharge control part, 19 ... Drive part, 20 ... Process control part, 22 ... Heating part, 24 ... Cleaning part, 25 ... Drying part, 26 ... Application | coating part

Claims (8)

A solder area forming apparatus for forming a solder area on a connector member that is continuously conveyed ,
Storage means for storing solder paste;
Discharging means for discharging the solder paste stored in the storage means toward the connector member;
Control means for controlling the discharge amount and discharge speed of the solder paste discharged from the discharge means;
A solder region forming apparatus comprising heating and melting means for forming a solder region on the connector member by heating and melting the solder paste discharged from the discharging means controlled by the control means and applied to the predetermined position. The solder region forming apparatus according to claim 1,
Forming a solder region in which a plurality of the discharge means are arranged and the solder paste is applied to the predetermined position by controlling the discharge amount and discharge speed of the solder paste discharged from each discharge means by the control means apparatus. In the solder area | region formation apparatus of Claim 1 or Claim 2,
A solder region forming apparatus using a dispenser as the discharging means and discharging the solder paste. The solder region forming apparatus according to any one of claims 1 to 3 ,
Before the solder paste is applied to the discharge position, solder area formation further comprising first application means for applying a flux that promotes solder spreading at the time of melting the solder paste to an area including at least the discharge position Equipment . The solder region forming apparatus according to claim 4 ,
The solder area | region formation apparatus further provided with the washing | cleaning means which wash | cleans the residue by the said heat melting of the additive added to the said solder paste from the said solder area | region after formation of the said solder area | region. In the solder area | region formation apparatus of Claim 5 ,
After the cleaning by the cleaning means, the solder region is coated with at least one of an antioxidant that prevents oxidation of the solder forming the solder region and a protective film that protects the solder. The solder area | region formation apparatus further provided with the application | coating means. In plating equipment that continuously performs wet plating on connector members ,
The plating apparatus which formed the solder area | region of the said connector member with the solder area | region formation apparatus of any one of Claims 1 thru | or 6 . A solder region forming method for forming a solder region on a connector member that is continuously conveyed ,
A predetermined amount of solder paste is applied to the predetermined discharge position by discharging from the nozzle of the dispenser toward the predetermined discharge position of the connector member at a predetermined discharge speed, and the applied solder paste is heated and melted. A solder region forming method in which the solder region is formed by:

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