JP2005142586A - Parts mounting method and device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a parts mounting method which enables the feedforward control of each circuit board can be performed. <P>SOLUTION: The parts mounting method employs a parts mounting device with respective units 21, 22 and 23 disposed from an upper stream of a flow of the circuit board 18 to downstream in order, which process the circuit board 18 in order to mount electronic parts on the circuit board. Information about makers, lots or manufacturing time of the parts which are mounted on each circuit board 18 in the respective units 21, 22 and 23 is memorized while being associated with each circuit board 18. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a component mounting method and apparatus for mounting an electronic component on a circuit board.

  In recent years, in the component mounting process for mounting electronic components on circuit boards, it is necessary to improve the mounting quality control by implementing fine pitch, high-speed mounting, chlorofluorocarbon, etc., and various quality control for the component mounting process A method has been proposed.

  As a conventional technique related to a quality management method of a component mounting process, for example, there is one described in Japanese Patent Laid-Open No. 2-97100 as “Data Management Method in Electronic Component Mounting Device”. This is a data management method using a contactless card in which an NC program or the like is recorded.

  A data management method using a contactless card described in JP-A-2-97100 will be described with reference to FIGS.

  In FIG. 6, 1 is an electronic component mounting apparatus, 2 is an operation instruction data storage card, and 3 is a data storage card reading means.

The operation of this conventional example is as follows:
First, operation instruction data for operating the electronic component mounting apparatus is created in advance and stored in the operation instruction data storage card 2.

  Next, when the work model of the electronic component mounting apparatus 1 is converted, the operation instruction data storage card 2 storing the operation instruction data applied to the next model is transferred to the data storage card reading means 3 in the supply part of the circuit board. throw into.

  Next, the data storage card reading unit 3 reads the operation instruction data stored in the operation instruction data storage card 2 and transmits the operation instruction data to the electronic component mounting apparatus 1. .

  Next, the contents of the conventional example of the quality control method for the component mounting process will be described with reference to FIG.

  In FIG. 7, the solder printing unit 4, the component mounting unit 5, and the soldering unit 6 are sequentially arranged from the upper side along the circuit board transfer line.

  In the solder printing unit 4, the cream solder printer 7 prints cream solder on the land of the printed material such as a circuit board. The cream solder printing inspection machine 8 inspects the state of the substrate and the cream solder printing machine 7 and also checks the printing state of the cream solder printed by the cream solder printing machine 7. The print data processing means 9 connected to the cream solder printing inspection machine 8 analyzes the output data from the cream solder printing inspection machine 8, and feedback controls the cream solder printing machine 7 based on the analysis result.

  Further, in the component mounting unit 5, the mounting machine 10 moves the suction nozzle head to the component supply unit to which electronic components and the like are supplied by the XY moving device, and sucks the component to the suction nozzle head. The suction nozzle head is moved to the mounting position of the circuit board, and the electronic component is mounted so that the lead and electrode of the electronic component sucked by the suction nozzle head are positioned on the cream solder printed on the land. . At this time, the mounting of the component on the circuit board is performed while imaging the suction state of the component by the component recognition camera and managing the suction mistake and the suction deviation. The component mounting inspection machine 11 inspects the components mounted at predetermined positions on the circuit board by the mounting machine 10 and the state of the mounting machine 10. The mounting data processing means 12 connected to the component mounting inspection unit 11 analyzes the output data from the component mounting inspection unit 11, and feedback-controls the mounting machine 10 based on the analysis result.

  Further, in the soldering section 6, a conveyor for transferring a circuit board as a heated object is disposed in the reflow furnace 13, and heaters are respectively disposed above and below the conveyor. In this structure, a fan is disposed on the lower side and hot air gas heated through the heater is blown onto the circuit board from above and below. The interior of the reflow furnace 13 is divided into a preheating chamber, a reflow heating chamber, and a slow cooling chamber. The heater and fan are arranged in each chamber, and the reflow heating chamber heats the circuit board uniformly. The structure is such that the cream solder is reflowed and the components are soldered to the circuit board. The soldering inspection machine 14 inspects the soldering state of the component to the circuit board and the state of the reflow furnace 13. The soldering data processing means 15 connected to the soldering inspection machine 14 analyzes the output data from the soldering inspection machine 14 and feedback-controls the reflow furnace 13 based on the analysis result.

  The operation of the component mounting process will be described with reference to FIG.

  In FIG. 7, the cream solder printer 7 prints cream solder on the land of the circuit board. The cream solder printing inspection machine 8 inspects the state of the circuit board and the cream solder printing machine 7 and the printing state of the cream solder printed on the land, for example, printing scraping, printing misalignment, printing presence, and the like. The output data from the cream solder printing inspection machine 8 is subjected to data analysis by the print data processing means 9, and the cream solder printing machine 7 is feedback controlled so as to prevent the generation of defective products based on the analysis result.

  Next, the mounting machine 10 uses an XY moving device to transfer the suction nozzle head to a component supply unit to which electronic components and the like are supplied to suck the components and transfer them to the mounting position of the circuit board. The parts are mounted with the viscosity of the cream solder on the lands by pressing against the specified parts. The component mounting inspection machine 11 inspects the state of the mounting machine 10 and the mounting state of the component mounted by the mounting machine 10, for example, a component shortage, a component standing, a component mounting position shift, a component mounting polarity error, and the like. . The output data from the component mounting inspection machine 11 is subjected to data analysis by the mounting data processing means 12 and feedback control is performed on the mounting machine 10 so as to prevent generation of defective products based on the analysis result.

  Further, the circuit board is transported into the reflow furnace 13 by a conveyor, and hot air gas heated through a heater by a fan is blown onto the circuit board. First, the circuit board is preheated in the preheating chamber, and then in the reflow heating chamber. Then, the cream solder printed on the lands is reflowed, and the reflowed printed cream solder is gradually cooled in the slow cooling chamber to solder the lead or electrode of the component and the land of the circuit board. Then, the soldering inspection machine 14 inspects the state of the reflow furnace 13 and the soldering state of the components on the circuit board, for example, a component shortage, component standing, component mounting position deviation, component mounting polarity error, and the like. . The output data from the soldering inspection machine 14 is subjected to data analysis by the soldering data processing means 15, and the reflow furnace 13 is feedback-controlled based on the analysis result so as to prevent the occurrence of defective products.

  The defective circuit boards determined as defective by the solder printing unit 4, the component mounting unit 5, and the soldering unit 6 are either discarded or corrected.

The print data processing means 9, the mounting data processing means 12, and the soldering data processing means 15 are
There are cases where each operates independently, and cases where these are integrated to operate as one processing means.

  However, in the configuration of the above-described conventional example, there is a problem that the feedback control is based on the analysis of the inspection data, and the control at the start in the fine pitch, high-speed mounting or the like may not match the substance.

  Also, if the print data processing means 9, the mounting data processing means 12, the soldering data processing means 15, or the data processing means integrated with them fails for some reason, feedback information cannot be obtained, and feedback control can be performed. There is a problem that it becomes impossible.

  Further, regardless of the above-described conventional example, there is a problem that feedback control for each circuit board, which is desirable in the fine pitch, high-speed mounting, etc., cannot be performed, and there is a limit in the quality control level.

  Since quality control for each circuit board cannot be performed, the degree of moisture absorption of the hygroscopic parts used for mounting the circuit board and the time-dependent changes of materials such as solder materials and adhesive materials over time can be accurately determined. Therefore, there is a problem that it is difficult to prevent the use of a material exceeding the allowable limit of moisture absorption and change with time.

  This invention solves said problem and makes it a subject to provide the component mounting method and apparatus which can carry out feedforward control for every circuit board.

  The component mounting method of the first invention of this application is a component mounting method for mounting electronic components on a circuit board, and stores information on the manufacturer, lot, or manufacturing time of the component mounted on the circuit board in association with each circuit board. It is characterized by making it.

  In the component mounting method of the second invention of this application, in order to mount the electronic component on the circuit board, the components in the component mounting apparatus in which the parts to be processed on the circuit board are sequentially arranged from the upstream side to the downstream side in the flow direction of the circuit board. A mounting method is characterized in that information on a manufacturer, a lot, or a manufacturing time of a component to be mounted on each circuit board in each unit is stored in association with each circuit board.

  According to the present invention, for each circuit board, it is possible to know information on the manufacturer, lot, or production time of the components to be mounted on the circuit board. Based on this information, the processing conditions are most appropriate for each circuit board. There is an effect that can be done.

  In the component mounting method of the present invention, data writing / reading means is provided in each part of the component mounting apparatus, and the quality information obtained by the processing of each circuit board by each of the data writing / reading means is supplied to each circuit board. By writing to the corresponding substrate memory, the processing history of each part is accumulated as to the circuit board, and the quality information written to each substrate memory corresponding to each circuit substrate in the data writing / reading means Therefore, each part of the component mounting apparatus can know the processing history of each circuit board before processing each circuit board for each circuit board. And the component mounting method of the present invention is based on the quality information read by the data writing / reading means, and the operation of each part of the component mounting apparatus is matched with the quality information (processing history) for each circuit board. In particular, when a material that changes with time is used, it is possible to effectively manage the processing of the next process within the allowable change with time. For example, when cream solder or an adhesive is dried, or when a circuit board is used with hygroscopic parts, it is possible to prevent troubles such as excessive moisture absorption and steam explosion in a reflow furnace.

  In the component mounting method of the present invention, data is written in each board memory corresponding to each circuit board, so that not only information on the inspection result is lost even if a host computer or network fails. Even if the data writing / reading means of each part of the component mounting apparatus fails, the failure can be repaired without affecting the host computer or the network.

  An embodiment of a component mounting method and apparatus according to the present invention will be described with reference to FIGS.

  FIG. 4 is a block diagram showing the configuration of the electronic component mounting apparatus 1 used in the present embodiment, in which the circuit board flows in the direction of the arrow, and solder printing is arranged side by side from the upstream side to the downstream side in the flow direction of the circuit board. The electronic component mounting apparatus 1 which comprises a production line with the part 21, the adhesive application part 22, the component mounting part 23, the adhesive hardening part 24, and the soldering part 25 is shown.

  The board repair / correction unit 26 is arranged separately from the production line.

  The solder printing unit 21 includes a solder printing machine 27 and a solder printing inspection machine 28. The adhesive application unit 22 includes an adhesive application machine 29 and a coating inspection machine 30. The component mounting unit 23 includes a mounting machine 31 and a mounting inspection machine 32. The adhesive curing unit 24 includes an adhesive curing furnace 33 and a curing inspection machine 34. The soldering unit 25 includes a reflow furnace 35 and a soldering inspection machine 36. The board repair / correction unit 26 includes a data writing / reading means 17 and a data writing / reading means controller 37 for controlling the data writing / reading means 17. Although not shown in FIG. 4, a data writing / reading unit 17 is provided in each of the solder printing unit 21, the adhesive application unit 22, the component mounting unit 23, the adhesive curing unit 24, and the soldering unit 25. It has been.

  1 to 3 show data writing / reading means 17, a circuit board 18, a board memory 19, a control unit 38, and data writing provided in each part of the electronic component mounting apparatus 1 shown in FIG. A controller 39 for reading means, an information analyzing means 40, and an XY table 41 as an example of means for conveying the circuit board 18 are schematically shown.

  In FIG. 1, the electronic component mounting apparatus 1 has a loader unit and an unloader unit, and the direction of the arrow is the flow direction of the circuit board 18. In this electronic component mounting apparatus 1, there is an XY table 41 for placing and transporting the circuit board 18, a solder printing unit 21, an adhesive application unit 22, a component mounting unit 23, an adhesive curing unit 24, and soldering. In each of the sections 25, the data writing / reading means 17 is disposed so as to be movable to an arbitrary position on the circuit board 18. A board memory 19 is directly attached to the circuit board 18. The electronic component mounting apparatus 1 stores a control unit 38 that controls the whole, a data write / read means controller 39 that controls each data write / read means 17, and a board memory 19. Information analysis means 40 for analyzing information is provided.

  FIG. 2 is a perspective view when the board memory 19 is directly attached to the circuit board 18.

  FIG. 3 is a perspective view when the circuit board 18 is held by the board holding means 20 and the board memory 19 is affixed to the board holding means 20.

  Next, the operation of the present embodiment will be described with reference to FIG. 1, FIG. 4, and FIG.

  In Step # 1, a solder printer 27, a solder printing inspection machine 28, an adhesive application machine 29, a coating inspection machine 30, a mounting machine 31, a mounting inspection machine 32, an adhesive curing furnace 33, and a curing inspection machine shown in FIG. 34, the reflow furnace 35, and the soldering inspection machine 36, before starting the respective work, the data writing / reading means 17 is directly attached to the circuit board 18 at the respective positions, or the board memory 19 or Then, the quality information stored in the board memory 19 directly attached to the board holding means 20 holding the circuit board 18 at each position is read. In this case, the data writing / reading means 17 is controlled by the data writing / reading means controller 39 shown in FIG.

  In step # 2, based on the quality information read by the data writing / reading means 17 in step # 1, the control means 38 performs solder printing machine 27, solder printing inspection machine 28, adhesive application machine 29, application inspection machine. 30, it is determined whether it is necessary to change the operating conditions of the mounting machine 31, the mounting inspection machine 32, the adhesive curing furnace 33, the curing inspection machine 34, the reflow furnace 35, and the soldering inspection machine 36, and if necessary, step # Proceed to 3, and if not necessary, proceed to Step # 4. As quality information in this case, the time from solder printing exceeds the use limit time, the time from application of the adhesive exceeds the use limit time, or the moisture absorption attached by the upstream mounting machine. There is quality information such as the time after the installation of parts exceeds the limit of use time.

  In step # 3, based on the determination in step # 2, solder printing machine 27, solder printing inspection machine 28, adhesive application machine 29, coating inspection machine 30, mounting machine 31, mounting inspection machine 32, adhesive curing furnace 33, operating conditions of the curing inspection machine 34, the reflow furnace 35, and the soldering inspection machine 36 are changed. In this case, for the quality information, the operating condition is changed such as stopping the subsequent processing on the circuit board, and the process proceeds to step # 4.

  In step # 4, it is determined whether or not the contents of steps # 2 and 3 need to be displayed / warned. If not, the process proceeds to step # 7 to start production, and then to step # 8. move on. If necessary, the process proceeds to step # 5 to issue a display / warning, and then proceeds to step # 6. With this display / warning, the operator determines whether or not to stop production. Proceed to step # 7 to start production, and if necessary, proceed to step # 8.

  In step # 8, the quality information obtained by the processing in that process is written into the substrate memory 19 by the data writing / reading means 17.

  Then, the quality information written in the substrate memory 19 is subjected to data analysis as required by the information analysis means 40 shown in FIG.

In the above embodiment, the quality information to be stored includes the following.
(1) Misalignment information such as printing misalignment information, application misalignment information, and mounting misalignment information.
(2) Method information such as temperature information in process equipment, various concentration information such as nitrogen gas.
(3) Quality information such as parts manufacturer, lot, production time, type, product number, composition, etc.
(4) Work information such as mounting machine name, worker name, work date and time.
(5) Production management information such as operating rate, component suction rate, component mounting rate, various error rates, component supply information, suction nozzle information, etc. of each mounting machine.
(6) Quality information such as management value information of the time-varying material.

It is a side view which shows the principal part of the Example of the component mounting apparatus which uses this invention method. It is a figure which shows an example of the memory for a board | substrate used with the method of this invention. It is a figure which shows the other example of the memory for substrates used by the method of this invention. It is a block diagram which shows the structure of the Example of the component mounting apparatus which uses this invention method. It is a flowchart which shows operation | movement of the Example of the component mounting apparatus which uses this invention method. It is a figure which shows operation | movement of the data storage card | curd of the component mounting apparatus which uses a prior art example method. It is a block diagram which shows the structure of the component mounting apparatus which uses a prior art example method.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Electronic component mounting apparatus 17 Data writing / reading means 18 Circuit board 19 Memory for board | substrate 20 Board | substrate holding means 21 Solder printing part 22 Adhesive application part 23 Component mounting part 24 Adhesive hardening part 25 Soldering part 26 Substrate repair and correction 27 Solder printing machine 28 Solder printing inspection machine 29 Adhesive coating machine 30 Coating inspection machine 31 Mounting machine 32 Mounting inspection machine 33 Adhesive curing furnace 34 Curing inspection machine 35 Reflow furnace 36 Soldering inspection machine 37 Data writing / reading means Controller 38 control unit 39 controller for data writing / reading means 40 information analyzing means

Claims (6)

A component mounting method for mounting an electronic component on a circuit board, wherein information on a manufacturer, a lot, or a manufacturing time of the component mounted on the circuit board is stored in association with each circuit board. In order to mount an electronic component on a circuit board, there is a component mounting method in a component mounting apparatus in which each part that performs processing on the circuit board is sequentially arranged from the upstream side to the downstream side in the flow direction of the circuit board. A component mounting method comprising storing information on a manufacturer, a lot, or a manufacturing time of a component to be mounted on a circuit board in association with each circuit board. The component mounting method according to claim 1 or 2, wherein information on the type, product number, or composition of the component to be mounted is further stored as information to be stored. The component mounting method according to claim 1 or 2, further comprising storing information on a mounting machine name, a worker name, or a work date and time as information to be stored. A component mounting apparatus for mounting an electronic component on a circuit board, comprising: a board memory for storing information on a manufacturer, a lot, or a manufacturing time of a part to be mounted on the circuit board in association with each circuit board; A component mounting apparatus comprising data writing / reading means for reading information written in the board memory and reading information written in the board memory. 6. The component mounting apparatus according to claim 5, further comprising information analysis means for analyzing information stored in association with the board.

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