JP6719050B2 - Electronic component mounting system - Google Patents

Description

The present invention relates to an electronic component mounting system for mounting an electronic component on a board on which solder is printed.

2. Description of the Related Art As an electronic component mounting system for mounting an electronic component on a board on which solder is printed, there is known an electronic component mounting system including a plurality of component mounting devices such as a printing device and an electronic component mounting device. As a printing device, there is one that prints solder on the electrodes of the substrate by performing a squeegee operation of sliding the squeegee on the screen mask with the substrate set on the lower surface of the screen mask to which the solder has been supplied. Are known. The electronic component mounting apparatus mounts the electronic component on the board after solder printing by the mounting head. The board on which the electronic component is mounted is reflowed by the reflow device. As a result, the board and the electronic component are soldered.

The solder supplied onto the screen mask is gradually dried by being exposed to air. When the electronic component is mounted on the substrate through the solder that has been dried more than a certain amount, the electronic component may not be sufficiently joined to the substrate, resulting in a mounting failure. Therefore, conventionally, an operation is performed in which the time for which the use of solder is allowed is set, and when it is found that the board after solder printing is not reflowed by the reflow device within that time (Patent Reference 1). In the example shown in Patent Document 1, the sum of the elapsed time after printing the solder on the substrate and the time estimated to be required for work in a mounting apparatus (for example, an electronic component mounting apparatus) is obtained, and the sum is the solder. When it is found that the allowable time as the elapsed time from printing to melting is exceeded, the work on the substrate is stopped.

Patent No. 5292163

However, the conventional technique has the following problems due to the fact that the elapsed time after printing the solder on the substrate is measured. That is, the solder progresses from the time when the solder is supplied to the screen mask and exposed to the air. Further, the degree of progress of the drying of the solder supplied to the screen mask differs depending on whether the solder is being moved on the screen mask by the action of the squeegee and is still on the screen mask. However, the prior art does not consider that the progress of drying differs depending on the state of the solder on the screen mask. Therefore, although the solder on the substrate is dried to a state where it cannot be actually used, the substrate is sent to a post process including a reflow device, and as a result, a defective substrate is manufactured. .. As described above, the conventional technology has room for improvement in terms of solder management.

Therefore, the present invention has an object to provide an electronic component mounting system capable of more accurately managing solder and preventing the generation of a defective substrate.

In the electronic component mounting system of the present invention, a printing device that prints the solder on a substrate by sliding a squeegee on a screen mask to which paste solder is supplied, and the solder is printed by the printing device. An electronic component mounting system including a mounting device that performs a work for mounting an electronic component on a substrate, wherein a storage unit that stores a permissible time during which use of the solder supplied to the screen mask can be permitted, and the solder By the time from the time when the solder is printed on the substrate by the printing device until the time it is printed on the substrate after being supplied on the screen mask, and by the time measuring unit. Based on the measured time, a determination unit that determines whether the solder printed on the board exceeds the allowable time, and the solder printed on the substrate by the determination unit exceeds the allowable time. And a notification unit for notifying the operator when it is determined that the solder is on the screen mask by the squeegee until the solder is supplied on the screen mask and printed on the substrate. And the time during which the solder does not move on the screen mask.

According to the present invention, it is possible to manage solder more accurately and prevent the generation of defective boards.

The figure which shows typically the whole structure of the electronic component mounting system in Embodiments 1 and 2 of this invention. A perspective view of a printing apparatus according to Embodiments 1 and 2 of the present invention Side view of the printing device according to the first and second embodiments of the present invention Partial perspective views of the printing apparatus according to Embodiments 1 and 2 of the present invention. Partial plan view of the printing device according to Embodiments 1 and 2 of the present invention (A) (b) Explanatory drawing of the printing operation which the printing device in Embodiments 1 and 2 of this invention performs. (A) (b) Explanatory drawing of the printing operation which the printing device in Embodiments 1 and 2 of this invention performs. (A) (b) Explanatory drawing of the printing operation which the printing device in Embodiments 1 and 2 of this invention performs. The top view of the printing inspection apparatus in Embodiments 1 and 2 of this invention. The top view of the electronic component mounting apparatus in Embodiments 1 and 2 of this invention. Side view of an electronic component mounting apparatus according to Embodiments 1 and 2 of the present invention 1 is a block diagram showing the configuration of part of a control system of an electronic component mounting system according to a first embodiment of the present invention. Explanatory drawing of the time (allowable time) in which the use of solder is allowed in Embodiment 1 of the present invention (A) (b) Explanatory drawing of the measurement interval of the time measured by the time measurement part in Embodiment 1 and 2 of this invention. Flowchart of solder management method according to Embodiment 1 of the present invention Block diagram showing a part of the configuration of the control system of the electronic component mounting system in Embodiment 2 of the present invention (A) (b) Explanatory drawing of the time (allowable time) which can use the solder in Embodiment 2 of this invention. Flowchart of solder management method according to Embodiment 2 of the present invention Flowchart of solder management method according to Embodiment 2 of the present invention

(Embodiment 1)
First, with reference to FIG. 1, an overall configuration of an electronic component mounting system according to a first exemplary embodiment of the present invention will be described. The electronic component mounting system 1 has a function of manufacturing a mounting substrate in which electronic components are mounted on a substrate, and a substrate supply device M1, a printing device M2, a print inspection device M3, and a plurality of electronic component mounting devices M4 in order from the upstream side. , M5, M6, a reflow device M7, and a substrate collecting device M8 are arranged in the mounting line 1a. These devices are connected to the host system 3 via a communication network 2 such as a LAN. Hereinafter, the substrate transport direction is defined as the X-axis direction, the direction orthogonal to the X-axis direction in the horizontal plane is defined as the Y-axis direction, and the direction orthogonal to the XY plane is defined as the Z-axis direction.

The substrate supply device M1 supplies the substrate to be worked to the printing device M2. The printing device M2 prints a cream-like solder paste (hereinafter abbreviated as “solder”) on the electrodes formed on the substrate. The print inspection device M3 inspects the state of the solder printed on the board. The electronic component mounting apparatuses M4, M5 and M6 mount electronic components on a board on which solder is printed. The reflow device M7 has a melting zone for melting the solder, and reflows the board on which the electronic component is mounted in accordance with a predetermined heating profile, thereby melting the solder and solder-bonding the board and the electronic component. As a result, the mounting board is manufactured. The substrate collecting device M8 collects the substrate after the reflow. The print inspection device M3 and the electronic component mounting devices M4 to M6 are examples of mounting devices that perform work for mounting electronic components on a board on which solder is printed by the printing device M2.

The printing apparatus M2 will be described with reference to FIGS. 2 and 3, the printing apparatus M2 includes a substrate holding and moving mechanism 12 on the base 11, and a screen mask 13 is provided above the substrate holding and moving mechanism 12. 4 and 5, a carry-in conveyor 14 that receives the substrate 4 supplied from the substrate supply device M1 and conveys the substrate 4 to the substrate holding and moving mechanism 12 is provided on the upstream side of the substrate holding and moving mechanism 12 in the X-axis direction. There is. On the downstream side of the substrate holding/moving mechanism 12 in the X-axis direction, a carry-out conveyor 15 that receives the substrate 4 on which the solder P is printed from the substrate holding/moving mechanism 12 and carries it out to the print inspection device M3 is provided.

3 and 4, the substrate holding/moving mechanism 12 includes a substrate holding unit 21 and a moving table unit 22. The substrate holding unit 21 includes a positioning conveyor 31, a lower receiving unit 32, and a pair of clampers 33. The positioning conveyor 31 positions the substrate 4 received from the carry-in conveyor 14 at a predetermined clamp position. The lower receiving portion 32 supports the substrate 4 positioned at the clamp position from below. The pair of clampers 33 clamp and hold the substrate 4 from both sides.

The moving table unit 22 includes an XYθ table mechanism 22a (FIG. 12) in which a plurality of table mechanisms are stacked in multiple stages, and moves the substrate holding unit 21 in the X axis direction, the Y axis direction, and the Z axis direction. As a result, the substrate 4 contacts the lower surface of the screen mask 13 and is positioned at the printing work position.

2 and 5, the screen mask 13 is composed of a rectangular flat plate-shaped metal member spread in the XY plane, and the outer periphery thereof is supported by the frame member 13W. The rectangular area at the center of the screen mask 13 is a substrate contact area R whose lower surface contacts the substrate 4. In this substrate contact area R, the electrodes 4d (FIG. 2) formed on the substrate 4 are arranged. Correspondingly, a plurality of openings 13h are provided.

In FIG. 3, a camera 16 is provided below the screen mask 13 so as to be movable in the X-axis direction and the Y-axis direction. The camera 16 includes an upper imaging section 16a having an imaging field of view directed upward and a lower imaging section 16b having an imaging field of view directed downward. The camera 16 moves in the XY plane by being driven by the camera moving mechanism 16k having a ball screw mechanism as an actuator. The upper imaging unit 16a images the pair of mask-side marks 13m (FIG. 5) provided on the screen mask 13. The lower imaging unit 16b images the pair of board-side marks 4m (FIG. 4) provided on the board 4 and the barcode label 4b (FIG. 5) provided at one corner of the board 4.

In FIGS. 2 and 3, a print head 17 is provided above the screen mask 13 so as to be movable in the Y-axis direction. The print head 17 includes a moving base 41, two squeegees 42, and two squeegee lifting cylinders 43. The moving base 41 is a member extending in the X-axis direction, and is moved in the Y-axis direction by being driven by the print head moving mechanism 17k having a ball screw mechanism as an actuator. The individual squeegees 42 are arranged to face the moving base 41 side by side in the Y direction, and move integrally in the Y axis direction by the movement of the moving base 41 in the Y axis direction. Each of the two squeegees 42 is a "spatular" member extending in the X-axis direction, and extends obliquely downward in a posture in which they spread downward. The surfaces of the individual squeegees 42 facing each other are the scraping surfaces 42a of the solder P.

The squeegee lifting cylinders 43 are provided side by side in the Y-axis direction with respect to the moving base 41 so as to correspond to the individual squeegees 42. The two squeegee lifting cylinders 43 operate individually to lift and lower the squeegee 42 independently of the moving base 41. Each squeegee lifting cylinder 43 has a standby height position (FIG. 3) in which the lower end of the corresponding squeegee 42 is separated from the upper surface of the screen mask 13 by a predetermined distance, and an abutting height position in which the lower end contacts the screen mask 13 ( 8(a)) is moved up and down.

In FIG. 3, a movable base 41 is provided with a syringe 44 that is movable along the X-axis direction that is the longitudinal direction of the squeegee 42. The syringe 44 includes a container 44a that seals the solder P in a vacuum state, and a discharge portion 44b that directs the discharge port for discharging the solder P toward the screen mask 13. The syringe 44 supplies the solder P accommodated in the container 44a to the screen mask 13 via the ejection portion 44b by the drive of the syringe drive mechanism 45 (FIG. 12). The syringe 44 is a solder supply unit that supplies the solder P to the screen mask 13. Further, the container 44a is a solder storage portion that stores the solder P before being supplied to the screen mask 13. The solder supply unit is not limited to the syringe 44, and various types may be adopted.

A barcode label 46 is attached to the container 44a. Identification information for identifying the container 44a is recorded on the barcode label 46. The barcode label 46 is read by a barcode reader 47 (FIG. 1) communicatively connected to the printing apparatus M2 and the host system 3. The barcode reader 47 includes a communication unit and transmits the read barcode label 46 to the printing device M2.

In FIG. 3, a signal tower 49 is rotatably provided on the upper surface of the casing 48 of the printing apparatus M2 so as to be in a lying posture or a standing posture with respect to the casing 48. The signal tower 49 blinks when an abnormality occurs in the printing apparatus M2, and notifies the operator OP (FIG. 2).

Next, the operation of the printing device M2 will be described. The following operation is performed by the control unit 90 (FIG. 12) provided in the printing apparatus M2 controlling various mechanisms. First, as shown in FIG. 6A, the substrate holding unit 21 positions the substrate 4 received from the carry-in conveyor 14 at a predetermined clamp position by the positioning conveyor 31 and supports it from below by the lower receiving unit 32. The clamper 33 clamps (arrow a). Next, as shown in FIG. 6B, the moving table unit 22 moves the substrate holding unit 21 to position the substrate 4 below the substrate contact area R of the screen mask 13 (arrow b).

Next, as shown in FIG. 7A, the upper imaging section 16a images the pair of mask-side marks 13m (FIG. 5) provided in the substrate contact area R from below. The lower imaging unit 16b also images the pair of substrate-side marks 4m (FIG. 4) of the substrate 4 held by the substrate holding unit 21. Next, as shown in FIG. 7B, the substrate holding/moving mechanism 12 moves the substrate 4 so that the mask-side mark 13m and the substrate-side mark 4m coincide with each other in plan view, and then raises them so that the substrate contact area R The substrate 4 is contacted with (arrow c). As a result, each electrode 4d matches the corresponding opening 13h and is exposed on the upper surface side of the screen mask 13.

When the substrate 4 is in contact with the substrate contact area R, each clamper 33 contacts the lower surface of the screen mask 13 in an area outside the substrate contact area R. As shown in FIG. 5, the solder P is supplied to the area on the screen mask 13 corresponding to the upper side of the one clamper 33 outside the substrate contact area R (FIG. 5).

Then, the squeegee operation by the squeegee 42 is executed. That is, as shown in FIG. 8A, one of the squeegees 42 descends to the contact height position above the clamper 33 to bring the lower end into contact with the screen mask 13. Next, as shown in FIG. 8B, the moving base 41 moves in the Y-axis direction to slide one squeegee 42 on the screen mask 13 (arrow d). The solder P scraped by the squeegee 42 rolls on the screen mask 13 and is filled in the opening 13h when passing through the opening 13h. While the squeegee 42 is sliding, stress is applied to the solder P and the viscosity is lowered. The squeegee 42 that has moved from one clamper 33 to above the other clamper 33 rises to the standby height position.

After filling the solder P, the substrate holding/moving mechanism 12 lowers the substrate holding portion 21 to separate the plate. As a result, the solder portion Pa (FIG. 9) which is a layer of the solder P corresponding to the thickness of the screen mask 13 is formed on the electrode 4d of the substrate 4. Next, the substrate holding/moving mechanism 12 opens the clamper 33 to release the holding of the substrate 4, operates the positioning conveyor 31, and transfers the substrate 4 to the carry-out conveyor 15. The carry-out conveyor 15 carries out the received substrate 4 to the print inspection device M3 located downstream. As a result, the work of the printing apparatus M2 is completed. Then, the new board 4 is carried into the printing apparatus M2, and the solder P is printed on the board 4 by sliding the other squeegee 42. In this way, the printing apparatus M2 in the first embodiment prints the solder P on the substrate 4 by sliding the squeegee 42 on the screen mask 13 to which the paste-like solder P is supplied.

Next, the configuration of the print inspection device M3 will be described with reference to FIG. On the upper surface of the base 51, a substrate transfer mechanism 52 connected to the printing device M2 and the electronic component mounting device M4 is provided. The board carrying mechanism 52 carries the board 4 after solder printing carried out from the printing apparatus M2 and positions it at a predetermined inspection position. An inspection camera 55 that is horizontally moved by a camera moving mechanism including a Y-axis beam 53 extending in the Y-axis direction and an X-axis beam 54 extending in the X-axis direction is provided above the substrate transfer mechanism 52. By operating the camera moving mechanism, the inspection camera 55 moves above the substrate 4 positioned at the inspection position and images the solder portion Pa.

The image pickup data of the solder portion Pa is subjected to recognition processing by the inspection processing unit 104 (FIG. 16) provided in the print inspection apparatus M3, so that various inspections of the printing state of the solder P printed on the substrate 4 are executed. Examples of the inspection items executed by the inspection processing unit 104 include inspection of whether or not the printing amount of the solder portion Pa is sufficient. The function of the print inspection device M3 may be incorporated into the print device M2 and the print device M2 may perform the inspection.

Next, the electronic component mounting apparatuses M4 to M6 will be described with reference to FIGS. A substrate transfer mechanism 61 including a pair of transfer conveyors extending in the X-axis direction is provided at the center of the base 60. The board transfer mechanism 61 transfers the board 4 and positions it at a predetermined mounting work position. The component supply units 62 are arranged on both sides of the board transfer mechanism 61, respectively. In the component supply unit 62, a plurality of tape feeders 64 mounted on the carriage 63 are arranged. The tape feeder 64 feeds the electronic component 5 to the component take-out position by the mounting head 69 described later by feeding the carrier tape 65 holding the electronic component 5 by pitch. The carrier tape 65 is wound and accommodated on a supply reel 66 which is rotatably held by a carriage 63.

A Y-axis beam 67 is provided at one end of the base 60 in the X-axis direction, and an X-axis beam 68 is installed on the Y-axis beam 67 so as to be movable in the Y-axis direction. A mounting head 69 is mounted on the X-axis beam 68 so as to be movable in the X-axis direction. The mounting head 69 moves in the XY plane by driving the Y-axis beam 67 and the X-axis beam 68.

A plurality of suction nozzles 70 capable of sucking and holding the electronic component 5 are mounted on the mounting head 69. The suction nozzle 70 takes out the electronic component 5 supplied to the component taking-out position and mounts it on the substrate 4.

In FIG. 10, the mounting head 69 includes a board recognition camera 71 whose imaging field of view is directed downward. The board recognition camera 71 images the board side mark 4m and the bar code label 4b of the board 4 positioned at the mounting work position. A component recognition camera 72 having an imaging field of view directed upward is provided between the substrate transport mechanism 61 and the tape feeder 64. The component recognition camera 72 captures an image of the electronic component 5 held by the mounting head 69 that moves above the component recognition camera 72 from below. In FIG. 11, the Y-axis beam 67, the X-axis beam 68, the substrate recognition camera 71, and the like are omitted.

In FIG. 11, a signal tower 74 is rotatably provided on the upper surface of the casing 73 of the electronic component mounting apparatuses M4 to M6 so as to be in a lying posture or a standing posture with respect to the casing 73. The signal tower 74 notifies the operator OP by blinking when an abnormality occurs in the electronic component mounting apparatuses M4 to M6.

Next, the operation of the electronic component mounting apparatuses M4 to M6 will be described. The operation described below is performed by the control unit 110 (FIG. 16) included in the electronic component mounting apparatuses M4 to M6 controlling various mechanisms. First, the substrate transfer mechanism 61 transfers the substrate 4 received from the upstream device and positions it at the mounting work position. Next, the board recognition camera 71 images the board-side mark 4m of the board 4. Next, the mounting head 69 takes out the electronic component 5 supplied by the tape feeder 64, and moves it above the component recognition camera 72 to above the desired mounting point on the substrate 4. At this time, the component recognition camera 72 images the electronic component 5 held by the suction nozzle 70. Next, the mounting head 69 corrects the position in the XY plane and the θ direction based on the imaging data acquired through the imaging by the substrate recognition camera 71 and the component recognition camera 72 of the substrate 4, and then the electronic component 5 is mounted. It is mounted on the substrate 4.

Next, the configuration of the control system will be described with reference to FIG. In the first embodiment, the description will be limited to the host system 3 and the printing apparatus M2. The host system 3 includes a communication unit 80, a storage unit 81, and a solder management unit 82. The communication unit 80 transmits/receives signals to/from the communication unit 91 of the printing apparatus M2.

The storage unit 81 is necessary for inspecting the print work data 81a necessary for printing the solder P on the substrate 4 and the state of the solder P (the solder portion Pa formed on the electrode 4d) printed on the substrate 4. In addition to the inspection work data 81b and the mounting work data 81c required to mount the electronic component 5 on the board 4, the allowable time data 81d and the like are stored.

The allowable time data 81d is data defining a time (hereinafter referred to as "allowable time T1") in which the use of the solder P supplied to the screen mask 13 in the printing apparatus M2 is allowed. That is, the solder P has thixotropy and is gradually dried by being exposed to air. In addition, "drying" is synonymous with increasing the hardness of the solder P. If the solder P on the screen mask 13 dries to a certain extent or more, the filling property into the opening 13h deteriorates, which causes printing failure. The substrate 4 on which the solder P is printed is subjected to a predetermined work by a plurality of mounting devices after being discharged from the printing device M2, and the solder P (solder portion Pa) on the substrate 4 is also exposed to air during that time. As the exposure continues, the drying progresses. When the solder P printed on the substrate 4 dries for a certain amount or more, the electrodes of the electronic component 5 do not adapt to the solder P, the bonding strength between the substrate 4 and the electronic component 5 becomes insufficient, and a defective substrate occurs. The solder P is dried before being supplied to the screen mask 13 and before being melted in the reflow device M7 while being printed on the substrate 4. Therefore, for the solder P supplied on the screen mask 13, the time allowed to be exposed to the air until it is printed on the substrate 4 is set as the allowable time T1, and when the allowable time T1 is exceeded, the solder P is set. Are not printed on the substrate 4.

An example of determining the allowable time T1 will be described with reference to FIG. In the allowable time data 81d, for the purpose of manufacturing the mounting board, the solder P is supplied to the screen mask 13 and is printed on the board 4 until it is melted by the reflow device M7. An allowable time T2 that allows the solder P to be exposed to the air is included. The allowable time T2 may be individually stored in the storage unit 81. Further, in the storage unit 81, an estimated time ta estimated to be required until the substrate 4 is subjected to a predetermined work in the print inspection device M3 and conveyed to the adjacent downstream side device, and the individual electronic component mounting device M4. Stored are the estimated times tb, tc, and td estimated to be required for the substrate 4 to undergo a predetermined work in M6 to be transported to the adjacent downstream side device. Therefore, the maximum value of the permissible time T1 that can be set by the printing device M2 is obtained by subtracting the estimated times ta, tb, tc, and td from the permissible time T2 (the maximum value of the permissible time T1=T2-(ta+tb+tc+td)). ). The allowable time T1 is determined within the maximum value range. The calculation of the allowable time T1 is not limited to the above, and may be calculated based on various ideas. In this way, the storage unit 81 stores the allowable time T1 of the solder P supplied to the screen mask 13.

The solder management unit 82 manages the solder P supplied on the screen mask 13, and has a time measurement unit 83 and a determination unit 84 as internal processing functions. The time measuring unit 83 measures the time during which the solder P is being supplied to the screen mask 13. The measurement start timing may be, for example, when the solder P is supplied from the syringe 44 and the operation of the syringe drive mechanism 45 is stopped. The measurement interval by the time measuring unit 83 varies depending on the state of the solder P on the screen mask 13. That is, the hardness of the solder P changes according to the applied stress, and the progress of drying the solder P while the squeegee 42 slides is greater than the progress of the solder P while staying on the screen mask 13. slow. Therefore, as shown in FIGS. 14A and 14B, the time measuring unit 83 measures the time by making the measurement interval sa when the solder is moved larger than the measurement interval sb when the solder is not moved. There is.

That is, the time measuring unit 83 sets the measurement interval sa during which the solder P is moving on the screen mask 13 by the squeegee 42 to be larger than the measurement interval sb during which the solder P is not moving on the screen mask 13. The time is measured by weighting so that The degree of progress of drying while the solder P is being moved by the squeegee 42 is close to zero. Therefore, the time measuring unit 83 may not measure the time while the solder P is moving on the screen mask 13 by the squeegee 42 by weighting.

The determination unit 84 compares the time measured by the time measurement unit 83 (measurement time) with the allowable time T1, and determines whether the measured time exceeds the allowable time T1. When the determination unit 84 determines that the measurement time exceeds the allowable time T1, the host system 3 transmits a signal to the printing apparatus M2 via the communication unit 80. That is, the determination unit 84 determines whether or not the solder P supplied to the screen mask 13 has exceeded the allowable time T1 based on the time measured by the time measurement unit 83.

The control unit 90 included in the printing apparatus M2 includes a communication unit 91, a storage unit 92, a mechanism driving unit 93, a recognition processing unit 94, a work prohibition unit 95, and a notification unit 96. The storage unit 92 stores the print work data 81a, the permissible time data 81d, and the like received from the host system 3. The mechanism drive unit 93 is controlled by the control unit 90 to drive various mechanisms such as the carry-in conveyor 14. As a result, the work of sliding the squeegee 42 on the screen mask 13 to which the solder P is supplied and printing the solder P on the substrate 4 positioned on the lower surface of the screen mask 13 is executed.

The recognition processing unit 94 obtains the amount of positional deviation between the screen mask 13 and the substrate 4 by performing recognition processing on the imaged data of the board side mark 4m and the mask side mark 13m taken by the camera 16. The substrate holding/moving mechanism 12 moves the substrate 4 based on the obtained positional displacement amount and positions it on the lower surface of the screen mask 13. Further, the recognition processing unit 94 recognizes the identification information of the substrate 4 by recognizing the imaged data of the barcode label 4b imaged by the camera 16. As a result, the board 4 carried into the printing apparatus M2 is specified.

When the determination unit 84 determines that the time measured by the time measurement unit 83 exceeds the allowable time T1, the work prohibition unit 95 receives a signal from the higher-level system 3 to prohibit the work on the printing apparatus M2. More specifically, the work prohibition unit 95 instructs the mechanism drive unit 93 to prohibit work, and the mechanism drive unit 93 that has received the command stops driving of various mechanisms. That is, the work inhibiting unit 95 inhibits the work for printing the solder P on the substrate 4 when the determining unit 84 determines that the solder P supplied to the screen mask 13 exceeds the allowable time T1.

When the notification unit 96 determines that the measurement time by the determination unit 84 exceeds the allowable time T1, the notification unit 96 receives the signal from the host system 3 to turn on the signal tower 49. As a result, the operator OP can notice that an abnormality has occurred in the printing apparatus M2. That is, the notification unit 96 notifies the operator when the determination unit 84 determines that the solder P supplied to the screen mask 13 has exceeded the allowable time T1. The notification unit 96 may light the signal tower 49 when the work prohibiting unit 95 prohibits the work on the printing apparatus M2.

The electronic component mounting system 1 according to the first embodiment is configured as described above. Next, a method of managing the solder P will be described with reference to the flowchart of FIG. First, the time measuring unit 83 clears the measurement time, that is, sets it to zero (ST1: measurement time clearing step). Next, the syringe 44 supplies the solder P to the screen mask 13 (ST2: solder supply step). Next, the time measuring unit 83 starts measuring time at a measurement interval corresponding to a state in which the solder P stays on the screen mask 13, that is, a measurement interval corresponding to unmoved solder shown in FIG. 14B. ST3: Solder non-transfer time measuring step).

Next, the determination unit 84 determines whether or not the time measured by the time measurement unit 83 exceeds the allowable time T1 (ST4: first allowable time excess determination step). When it is determined that the allowable time T1 is not exceeded (“No” shown in (ST4)), the time measuring unit 83 determines whether or not the squeegee 42 has started sliding (ST5: slide start presence/absence determination). Process). “The sliding of the squeegee 42 has started” means that the solder P on the screen mask 13 is scraped by the squeegee 42 to start moving. When it is determined that the squeegee 42 has not started sliding (“No” shown in (ST5)), the process returns to (ST4).

On the other hand, when it is determined that the sliding of the squeegee 42 has started (“Yes” shown in (ST5)), the time measuring unit 83 stops measuring the time corresponding to the solder non-moving time measurement interval ( ST6: Solder non-moving time measurement stopping step). Then, the time measuring unit 83 starts measurement at a measurement interval corresponding to the solder movement shown in FIG. 14A (ST7: solder movement time measurement starting step). (ST6) and (ST7) constitute a measurement interval switching step of switching the time measurement interval by the time measuring unit 83.

Next, the determination unit 84 determines the total time of the time measured by the time measurement unit 83, that is, the time measured at the measurement interval corresponding to the solder non-moving time and the time measured at the measurement interval corresponding to the solder moving time. It is determined whether the allowable time T1 has been exceeded (ST8: second allowable time determining step).

When it is determined that the allowable time T1 is not exceeded (“No” shown in (ST8)), the time measuring unit 83 determines whether or not the sliding of the squeegee 42 is completed (ST9: determination of completion of sliding). Process). The determination here is made, for example, based on whether or not the drive of the print head moving mechanism 17k, which is the drive source of the moving base 41, is stopped. When it is determined that the sliding of the squeegee 42 is not completed (“No” shown in (ST9)), the process returns to (ST8). On the other hand, when it is determined that the squeegee 42 has finished sliding (“Yes” in ST9), the time measuring unit 83 stops measuring the time at the measurement interval corresponding to the solder movement time (ST10: Solder transfer time measurement stop process). Next, returning to (ST3), the time measuring unit 83 starts measuring time at a measurement interval corresponding to the unmoved solder. In (ST4) thereafter, the determination unit 84 determines the allowable time based on the total measurement time measured up to now, that is, the total time measured at the measurement intervals corresponding to the solder non-moving time and the solder moving time, respectively. It is determined whether T1 is exceeded.

Further, in (ST4) or (ST8), when it is determined that the measurement time measured by the time measuring unit 83 exceeds the allowable time T1 (“Yes” shown in (ST4) or (ST8)), the higher system 3 Transmits a signal to the printing apparatus M2, and the work prohibition unit 95 prohibits the work on the printing apparatus M2 (ST11: work prohibition step). Next, the notification unit 96 lights the signal tower 49 to notify the operator OP (ST12: notification step).

Next, the work prohibition unit 95 determines whether the prohibition cancellation work for canceling the work prohibition is completed (ST13: prohibition cancellation work completion determination step). That is, the operator OP who received the notification performs the work of removing the solder P on the screen mask 13 which is one of the prohibition releasing works. Further, when the amount of the solder P stored in the container 44a of the syringe 44 is less than or equal to a certain amount, the worker OP performs a work of replacing the solder P with a new container 44a. At this time, the operator OP makes the reading surface of the barcode reader 47 face the barcode label 46 attached to the container 44a. As a result, the barcode reader 47 reads the barcode label 46 and sends it to the printing device M2. The control unit 90 of the printing device M2 recognizes the identification information of the newly replaced container 44a based on the transmitted barcode label 46. The barcode reader 47 and the control unit 90 form a recognition unit that recognizes identification information.

The work prohibition unit 95 determines that the prohibition cancellation work is completed in response to the recognition of the identification information (“Yes” in (ST13)), and cancels the prohibition of the work on the printing apparatus M2. That is, the work prohibition unit 95 prohibits the work until the identification information is recognized by the recognition unit. When the amount of the solder P stored in the container 44a is sufficient and the container 44a does not need to be replaced, the operator OP removes the solder P on the screen mask 13 after the allowable time T1 and then performs the operation. An input indicating that the prohibition cancellation work has been completed is input via a touch panel (not shown) as an input unit. When it is determined in (ST13) that the prohibition cancellation work is completed, the process returns to (ST1).

As described above, according to the printing apparatus M2 in the first embodiment, the solder P moves on the screen mask 13 at the measurement interval of the time during which the solder P moves on the screen mask 13 by the squeegee 42. Since the time is measured by weighting it so as to be larger than the measurement interval of the unused time, it is possible to more accurately manage the solder P and prevent the occurrence of a defective substrate. In the first embodiment, the host system 3 including the solder management section 82 and the printing apparatus M2 constitute a solder management system.

The printing apparatus M2 and the solder management system according to the first embodiment are not limited to the configurations described so far, and can be appropriately modified in design without departing from the spirit of the invention. For example, the determining unit 84 determines whether or not the time measured by the time measuring unit 83 exceeds the allowable time T2, and when the measured time exceeds the allowable time T2, the work prohibiting unit 95 prohibits the work. You may Further, the solder management unit 82 may be incorporated in the printing apparatus M2, and the work prohibition unit 95 and the notification unit 96 may be incorporated in the host system 3. Further, the barcode reader 47 may send the read barcode label 46 to the host system 3.

(Embodiment 2)
Next, a second embodiment of the present invention will be described. In the second embodiment, the solder P (solder portion Pa formed on the electrode 4d) printed on the substrate 4 conveyed by the mounting device such as the print inspection device M3 and the electronic component mounting devices M4 to M6 is also managed. This point is different from the first embodiment. First, the configuration of the control system will be described with reference to FIG. The description of the same components as those described in the first embodiment will be omitted.

In FIG. 16, the solder management unit 82A included in the upper system 3A includes a time measuring unit 83A, a determination unit 84A, and an estimated time calculation unit 85. The time measuring unit 83A measures the time from when the solder P is supplied onto the screen mask 13 to when it is printed on the substrate 4 and the time after the solder P is printed on the substrate 4 by the printing device M2. As described in the first embodiment, the time from when the solder P is supplied onto the screen mask 13 to when it is printed on the substrate 4 is set to the solder moving time and the solder non-moving time by the time measuring unit 83A. It is measured based on the corresponding measurement interval. That is, the time from when the solder P is supplied onto the screen mask 13 to when it is printed on the substrate 4 is the time during which the solder P is moving on the screen mask 13 by the squeegee 42 and the time when the solder P is above the screen mask 13. Is the total time of not moving. Further, the time measuring unit 83A makes the measurement interval of the time during which the solder P is moving on the screen mask 13 by the squeegee 42 smaller than the measurement interval during which the solder P is not moving over the screen mask 13. Is weighted and time is measured.

The measurement start timing after the solder P is printed on the substrate 4 may be set, for example, when the sliding of the squeegee 42 for printing the solder P on the substrate 4 is completed. The time measurement by the time measurement unit 83A is performed for each individual substrate 4, and the position where the management of the solder P is not required, that is, when the substrate 4 is carried into the melting zone of the reflow device M7, or the determination unit 84A described later is performed. The process ends when it is determined that the solder P on the board 4 has exceeded the allowable time T2.

The determination unit 84A determines whether or not the solder P printed on the substrate 4 has exceeded the allowable time T2, based on the time measured by the time measurement unit 83. As described above, the allowable time T2 means that the solder P is exposed to the air between the time when the solder P is supplied to the screen mask 13 and the time when the solder P is printed on the substrate 4 and melted by the reflow device M7. It is a time that can be allowed to be given.

Two specific determination methods by the determination unit 84A will be illustrated. The first example is a method of determining whether or not the time measured by the time measuring unit 83A exceeds the allowable time T2. For example, when the measurement time te measured by the time measurement unit 83A exceeds the allowable time T2 when the board 4 is loaded into the electronic component mounting apparatus M4, the solder P printed on the board 4 is It cannot be used. Therefore, the board 4 is inevitably discarded as a defective board even when the electronic component 5 is mounted. Therefore, the time (elapsed time) after the solder P is supplied to the screen mask 13 is measured, and if the allowable time T2 is exceeded at a predetermined time when the board 4 is transported to the mounting apparatus, the solder P is By prohibiting the work on the printed board 4, waste of the electronic component 5 is prevented. That is, in the first example, the determination unit 84A determines that the time from the supply of the solder P onto the screen mask 13 to the printing on the substrate 4 and the time from the printing of the solder P on the substrate 4 (elapsed time). It is determined whether or not the total time of () exceeds the allowable time T2.

The second example is a method in which the estimated time estimated to be required for the substrate 4 to be reflowed by the reflow device M7 from a predetermined time when the substrate 4 is transported by the mounting device is taken into consideration. With reference to FIG. 17, description will be given by taking as an example the time when the substrate 4 is loaded into the electronic component mounting apparatus M4. FIG. 17A shows a measurement time te from when the solder P is supplied to the screen mask 13 to when the solder P is printed on the board 4 and is carried into the electronic component mounting apparatus M4, and the board 4 in the electronic component mounting apparatus M4. It shows a case where the total time of the estimated times tb, tc, and td estimated to be required from the time when the product is carried in to the time when it is reflowed by the reflow device M7 is within the allowable time T2. Normally, the board 4 is transported through a plurality of mounting devices so that the printed solder P is melted within the allowable time T2.

The estimated time calculation unit 85 calculates an estimated time estimated to be required from the predetermined time when the board 4 is loaded into the electronic component mounting apparatus M4 until the reflow is performed by the reflow apparatus M7. In the example shown in FIG. 17A, the estimated time required from the time the substrate 4 is loaded into the electronic component mounting apparatus M4 to the time it is reflowed by the reflow apparatus M7 is estimated by the electronic component mounting apparatuses M4 to M6. Is calculated by summing the estimated times tb, tc, and td. That is, the estimated time calculation unit 85 reaches a position (here, the melting zone of the reflow device M7) where the management of the solder P is unnecessary from a predetermined time when the substrate 4 on which the solder P is printed is conveyed to the mounting device. Calculate the estimated time required to complete.

In FIG. 17B, the measured time te and the estimated times tb, tc, and td estimated to be required from the time the substrate 4 is loaded into the electronic component mounting apparatus M4 to the time it is reflowed by the reflow apparatus M7. The case where the total time exceeds the allowable time T2 is shown. In this case, the time required for the solder P on the substrate 4 to be melted after being supplied to the screen mask 13 exceeds the allowable time T2. Therefore, even if the work is performed on the board 4 on which the solder P is printed in the electronic component mounting apparatuses M4 to M6, the electronic component 5 is simply wasted. Therefore, the determination unit 84A determines the time from when the solder P is supplied onto the screen mask 13 to when it is printed on the substrate 4 and until a predetermined time when the solder P is printed on the substrate and is transported to the mounting apparatus. And the total estimated time required to reach the position where the management of the solder P becomes unnecessary (here, the melting zone in the reflow device M7) from the predetermined time exceeds the allowable time T2. Is decided. If it is determined that the total time exceeds the allowable time T2, the work on the board 4 in the mounting apparatus is prohibited. This makes it possible to predict the occurrence of a defective substrate at an early stage and prevent waste of the electronic component 5.

The control unit 100 included in the print inspection device M3 includes a communication unit 101, a storage unit 102, a mechanism driving unit 103, an inspection processing unit 104, a work prohibition unit 105, and an informing unit 106. The storage unit 102 stores the inspection work data 81b, the allowable time data 81d, and the like received from the host system 3. The mechanism drive unit 103 is controlled by the control unit 100 and drives the camera drive mechanism to move the inspection camera 55 above the substrate 4.

The inspection processing unit 104 recognizes the image data acquired through the image pickup by the inspection camera 55 and recognizes the solder portion Pa. Then, the inspection processing unit 104 inspects the state of the solder portion Pa based on the recognition processing result. When it is determined that the elapsed time of the solder P printed on the board 4 exceeds the allowable time T2, the work prohibition unit 105 receives a signal from the higher-level system 3 to prohibit work in the print inspection device M3. ..

If the inspection processing unit 104 determines that the state of the solder portion Pa is defective, the notification unit 106 controls and lights up the signal tower 107 (FIG. 1) provided in the print inspection apparatus M3, so that the operator OP can operate. Notify me. Further, the notification unit 106 receives a signal from the higher-level system 3 when the determination unit 84A determines that the solder P printed on the substrate 4 has exceeded the allowable time T2, thereby controlling the signal tower 107 and lighting it. And notify the operator.

The control unit 110 included in the electronic component mounting apparatuses M4 to M6 includes a communication unit 111, a storage unit 112, a mechanism driving unit 113, a recognition processing unit 114, a work prohibition unit 115, and a notification unit 116. The storage unit 112 stores the mounting work data 81c, the allowable time data 81d, and the like received from the host system 3. The mechanism drive unit 113 is controlled by the control unit 110 and drives various mechanisms such as the Y-axis beam 67. As a result, the work of mounting the electronic component 5 on the substrate 4 is executed.

The recognition processing unit 114 performs a recognition process on the imaged data acquired by the board recognition camera 71 and the imaged data acquired by the component recognition camera 72 to obtain the positional deviation of the board 4 and the electronic component 5. The mounting position of the electronic component 5 is corrected based on this amount of positional deviation.

When it is determined that the elapsed time of the solder P printed on the board 4 exceeds the allowable time T2, the work prohibition unit 115 receives a signal from the host system 3 to mount the electronic component on which the board 4 is loaded. Work on the devices M4 to M6 is prohibited. More specifically, the work prohibition unit 115 commands the mechanism drive unit 113 to prohibit work, and the mechanism drive unit 113 that has received the command stops driving of various mechanisms. That is, when the determination unit 84A determines that the solder P printed on the substrate 4 exceeds the allowable time T2, the work prohibition unit 115 prints the solder P that exceeds the allowable time T2 on the mounting apparatus. Work for mounting the electronic component 5 on the board is prohibited. The same applies to the work prohibition unit 105 of the print inspection device M3.

When the determination unit 84A determines that the solder P printed on the substrate 4 has exceeded the allowable time T2, the notification unit 116 receives a signal from the higher-level system 3 to control and light the signal tower 74, Notify the operator. That is, the notification unit 116 notifies the operator when the determination unit 84A determines that the solder P printed on the substrate 4 has exceeded the allowable time T2. The notification unit 106 of the print inspection device M3 is also the same.

Next, a method of managing the solder P according to the second embodiment will be described with reference to FIG. Here, the case where the electronic component mounting apparatuses M4 to M6 are taken as an example of the mounting apparatus and the determination unit 84A makes a determination by the first determination method will be described. First, the substrate transfer mechanism 61 loads the substrate 4 into the apparatus (ST21: substrate loading step). Next, the board recognition camera 71 takes an image of the barcode label 4b of the board 4 that has been carried in (ST22: imaging step). Next, the recognition processing unit 114 performs recognition processing on the barcode label 4b and recognizes the identification information of the substrate 4 (ST23: identification information recognition step). The recognized identification information is sent to the upper system 3A. Next, the determination unit 84A reads out the measurement time measured by the time measurement unit 83A for the solder P printed on the substrate 4 corresponding to the identification information (ST24: measurement time reading step). The measurement time read out here is the elapsed time from the time the solder P is supplied to the screen mask 13 to the time when the solder P is loaded on the electronic component mounting apparatus M4 in a state of being printed on the substrate 4.

Next, the determination unit 84A determines whether or not the read measurement time exceeds the allowable time T2 (ST25: allowable time excess determination step). When it is determined that the allowable time T2 is not exceeded (“No” shown in (ST25)), the solder management unit 82A determines whether or not a predetermined work is completed in the electronic component mounting device M4 (ST26: work). Completion judgment process). When it is determined that the work is completed (“Yes” in (ST26)), the board transport mechanism 61 carries out the board 4 to the downstream electronic component mounting apparatus M5 (ST27: board carry-out step). If it is determined that the work is not completed (“No” shown in (ST26)), the process returns to (ST25).

When it is determined in (ST25) that the allowable time T2 has been exceeded (“Yes” in (ST25)), the work prohibition unit 115 prohibits the work on the board 4 in the electronic component mounting apparatus M4 (ST28: Work prohibition). Process). At this time, when the succeeding substrate 4 is carried in the print inspection device M3 arranged upstream of the electronic component mounting device M4 in which the prohibited work substrate 4 is carried in, the work prohibiting unit 105 causes the substrate 4 to be carried in. The work for 4 may be prohibited. That is, when the determining unit 84A determines that the solder P on the board 4 carried into one mounting apparatus out of the plurality of mounting apparatuses exceeds the allowable time T2, the work prohibiting section carries the board 4 into the mounting apparatus. The work in the mounting device arranged upstream of the existing mounting device is prohibited. As a result, it is possible to prevent a situation where defective substrates are continuously generated.

Next, the notification unit 116 controls and lights the signal tower 74 to notify the operator OP (ST29: notification step). Next, the work prohibition unit 115 determines whether the prohibition release work has been performed (ST30: prohibition release work determination step). That is, the operator OP takes out the substrate 4 for which the work is prohibited from the mounting apparatus. After taking out the substrate 4, the operator OP inputs through the operation input unit (not shown) such as a touch panel that the prohibition cancellation work is completed. If it is determined that the prohibition release work has been performed (“Yes” in ST30), the process returns to (ST11).

Next, with reference to FIG. 19, a method of managing the solder P when the determination unit 84A makes a determination by the second determination method will be described. Note that description of steps that are the same as the steps shown in FIG. 18 is omitted. In this example, the following steps are added after the measurement time reading step of (ST34). That is, the estimated time calculation unit 85 calculates the estimated time estimated to be required from the predetermined time when the board 4 is carried into the electronic component mounting apparatus M4 to the time when the board 4 is carried into the melting zone of the reflow apparatus M7 ( ST35: Estimated time calculation step). Next, the determination unit 84A determines whether the total time of the elapsed time (measurement time measured by the time measurement unit 83A) after the solder P is supplied to the screen mask 13 and the estimated time exceeds the allowable time T2. Judgment (ST36: allowable time excess judgment process).

As described above, according to the second embodiment, it is possible to more accurately manage the solder P on the substrate 4 to which each mounting device is conveyed and prevent the occurrence of a defective substrate. The electronic component mounting system according to the second embodiment is not limited to the configuration described so far and can be appropriately modified in design without departing from the spirit of the invention. For example, the solder management unit 82A may be incorporated into the printing device M2 and the electronic component mounting devices M4 to M6, and the work prohibition units 105 and 115 and the notification units 106 and 116 may be incorporated into the host system 3.

According to the present invention, the solder P can be controlled more accurately and the generation of a defective substrate can be prevented, which is useful in the field of electronic component mounting.

3 Upper system 4 Substrate 5 Electronic component 13 Screen mask 42 Squeegee 81 Storage section 83A Time measuring section 84A Judgment section 85 Estimated time calculation section 100,110 Control section 105,115 Work prohibition section 106,116 Notification section M2 Printing device M3 Printing inspection Device M4, M5, M6 Electronic component mounting device OP Worker P Solder T2 Allowable time

Claims (6)

A printing device that prints the solder on a substrate by sliding a squeegee against a screen mask supplied with paste-like solder, and for mounting an electronic component on the substrate on which the solder is printed by the printing device. An electronic component mounting system comprising a mounting device for performing work,
A storage unit that stores an allowable time that allows the use of the solder supplied to the screen mask.
A time from when the solder is supplied onto the screen mask until it is printed on the substrate, and a time measuring unit that measures the time after the solder is printed on the substrate by the printing device,
Based on the time measured by the time measuring unit, a determination unit that determines whether the solder printed on the substrate exceeds the allowable time,
An informing unit for informing a worker when the solder printed on the substrate by the determining unit is determined to have exceeded the allowable time,
The time from when the solder is supplied onto the screen mask to when it is printed on the substrate is the time during which the solder is moving on the screen mask by the squeegee and the time when the solder is moving on the screen mask. Electronic component mounting system that is the total time of not doing. Wherein the time measurement unit, a measurement interval of time during which the solder is moved on the screen mask by the squeegee, the solder is in the size Kunar so than measurement interval of time not moving on the screen mask The electronic component mounting system according to claim 1, wherein the electronic component mounting system measures time. The determination unit determines whether the total time from the time when the solder is supplied onto the screen mask to the time when the solder is printed on the substrate and the time after the solder is printed on the substrate exceeds the allowable time. The electronic component mounting system according to claim 1, wherein it is determined whether or not the electronic component mounting system is determined. An estimated time calculating unit for calculating an estimated time estimated to be required from a predetermined time when the board on which the solder is printed is conveyed through the mounting apparatus to a position where the management of the solder becomes unnecessary is further provided. Prepare,
The determination unit determines the time from when the solder is supplied onto the screen mask to the time when the solder is printed on the substrate, and the predetermined time when the solder is printed on the substrate and when the mounting apparatus is transported. And the total time of the estimated time estimated to be required from the predetermined time point to the position where the management of the solder P is not required exceeds the allowable time. Electronic component mounting system described. When it is determined by the determination unit that the solder printed on the substrate has exceeded the allowable time, the electronic component on the substrate on which the solder that has exceeded the allowable time is printed on the mounting apparatus is printed. 5. The electronic component mounting system according to claim 1, further comprising a work prohibition unit that prohibits a work for mounting the. When it is determined by the determination unit that the solder on the board carried into one mounting device of the plurality of mounting devices exceeds the allowable time, the work prohibition unit is more than the mounting device. 6. The electronic component mounting system according to claim 5, wherein work in the mounting device disposed upstream is prohibited.

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