JPS63200041A - Wiring defect detector in ink jet type hybrid ic pattern forming apparatus - Google Patents

Abstract

PURPOSE:To enhance the reliability of hybrid IC by accurately detecting the wiring inferiority of a circuit pattern, by detecting the liquid droplet of the ink solution emitted by a liquid droplet emitter so as to follow relative movement. CONSTITUTION:A hybrid IC substrate 9 and a liquid droplet emitter 12 emitting the liquid droplet of an ink solution containing a circuit element forming part are relatively moved and a liquid droplet emitting apparatus 1 is subjected to emitting operation during the relative movement to draw a desired circuit pattern on the substrate 9. A camera 15 as a liquid droplet emitting means is mounted in the vicinity of the support part of the liquid droplet emitter 12 at the leading end part of an arm 11 and set so that the image pickup position thereof coincides with the arrival position on the substrate 9 of the ink solution due to the liquid droplet emitter 12. This camera 15 picks up the image of the arrival position of the liquid droplet of the ink solution on the substrate 9 each time. The continuous state of each liquid droplet is judged on the basis of the picked up detection data by a microcomputer being a wiring inferiority judging means.

Description

DETAILED DESCRIPTION OF THE INVENTION Object of the Invention (Field of Industrial Application) The present invention relates to a wiring defect detection device in an inkjet type hybrid IC pattern forming apparatus.

(Prior Art) Conventionally, in a hybrid IC pattern forming apparatus,
Once the circuit pattern was drawn, an inspector used a microscope to check for wiring defects such as disconnections.

(Problems to be Solved by the Invention) Inspections for wiring defects were performed visually by inspectors, which made the inspections extremely complicated and naturally had limitations in conducting complete inspections. .

An object of the present invention is to solve the above-mentioned problems and provide a wiring defect detection device for J3 in an inkjet hybrid IC pattern forming apparatus that can accurately detect wiring defects in circuit patterns and improve the reliability of hybrid ICs. It's about doing.

Structure of the Invention (Means for Solving Problems) In order to achieve the above object, the present invention relatively moves a hybrid IC substrate and a droplet ejector that ejects droplets of an ink solution containing a circuit element formation. , an inkjet hybrid IC pattern forming apparatus in which a droplet discharge device is ejected during the relative movement to draw a desired circuit pattern on the substrate, the droplet discharge device following the relative movement; An inkjet comprising: a droplet detecting means for detecting droplets of ink solution ejected by the droplet detecting means; and a wiring defect determining means for determining the continuous state of each droplet based on the detection γ-time of the droplet detecting means. The gist of this paper is a wiring defect detection device in a type hybrid IC pattern forming apparatus.

(Function) With the above means, the droplet detection means follows the relative movement between the hybrid IC substrate and the droplet ejector, and detects the droplet of the ink solution containing the circuit element formation ejected from the ejector. It is possible to detect whether it has been emitted onto a substrate and attached to the substrate. As a result, the wiring defect determining means determines the continuous state of each liquid layer based on the detection data of the droplet detecting means, that is, detects the presence or absence of a wiring defect.

(Example) An example embodying the present invention will be described below with reference to the drawings.

FIG. 1 schematically shows a wiring defect detection device in an inkjet hybrid IC pattern forming device 1, and a base 3 installed on a table 2 of the device 1 is movable in the left-right direction (X-axis direction). An X-direction moving table 4 is provided. The X-direction moving table 4 is engaged with a ball screw drivingly connected to a drive shaft of an X-direction driving stepping motor MX attached to the left side surface of the base 3. By rotating the X-direction driving stepping motor Mx forward and backward, the X-direction moving table 4 is moved in the left-right direction, that is, in the X-axis direction.

On the upper surface of the X-direction moving table 4, a Y-direction moving table 5 that is movable in the front-rear direction (Y-axis direction) is disposed. The Y-direction moving table 5 is a Y-direction moving table 5 attached to the front surface of the X-direction moving table 4.
A ball screw 6 drivingly connected to the drive shaft of the directional driving stepping heptad MY is engaged. Then, by stepping the Y-direction driving motor My and rotating forward and backward, the Y-direction movable table 5 is driven in the front-rear direction, that is, in the Y-axis direction.

The recess 7 formed on the upper surface of the Y-direction moving table 5 has a second
As shown in the figure, a fixed base 8 made of aluminum is fitted flush with the top surface of the moving base 5, and a hybrid IC board (hereinafter simply referred to as a board) 9 is mounted on the top surface of the fixed base 8. It is designed to be fixed in place. This board 9
A substrate made of aluminum oxide is used, and substrates made of aluminum nitride, silicon nitride, silicon carbide, beryllium oxide, glass, hollow substrate, zirconium oxide, etc. are also used.

Further, a heater 10 is attached to the back surface of the fixing table 8 to maintain the substrate 9 at an appropriate temperature via the fixing table 8. This heater 10 warms the substrate 9 so that when an ink solution 13 (described later) falls onto the substrate 9, the solvent of the ink solution 13 is quickly evaporated and the ink solution 13 is prevented from spreading.

An arm 11 is provided on the rear side of the table 2 and is bent into an L shape and extends forward.
2 is attached so as to face the fixed base 8 at an upper position. This droplet ejector 12 has a tank 14 attached to its upper part for storing an ink solution 13 containing a circuit element formed therein. The tank 14 operates based on the signal.
The ink solution 13 sent from the ink solution 13 is discharged onto the substrate 9 placed on the fixing table 8. This ejection operation is to eject the ink solution 13 one drop at a time.

Therefore, while driving and controlling the stepping motors Mx and My for driving in the X direction and the Y direction, the droplet ejector 1
2, it becomes possible to draw a circuit pattern on the upper surface of the substrate 9 using the ink solution 13, as shown in FIG.

In this embodiment, a piezo type inkjet head is used as the droplet ejector 12, but other inkjet heads and ejection methods similar to those used in various inkjet type printers such as thermal inkjet heads can also be used as appropriate. selected and used. In the ink solution 13, for example, the solute is gold (ALJ) as a circuit element forming material, a paste containing an organic substance (manufactured by Englehard), and the solvent is α-
Ink solutions containing various metals for forming circuit elements are used, such as ink solutions containing terpineol.

In addition, the droplet ejector 1 is installed at the tip of the arm 11.
A camera 15 as a droplet detection means is attached to a position close to the support part 2, and the imaging position of the camera 15 is the position where the ink melt 113 reached by the droplet ejector 12 on the substrate 9 (adhesion position). ), and this camera 15 is configured to take an image of the top position of the ink solution 13 droplet on the substrate 9 at any given time.

An operation panel 16 is provided on the front side of the forming apparatus 1, and by operating a keyboard 17 on the panel 16'', the motors Mx, My and the droplet ejector 12 are driven to form a circuit pattern on the upper surface of the substrate 9. The drawing is executed. Then, the substrate 9 on which the circuit pattern has been drawn is fired in a firing furnace, and the ink solution 13 is decomposed and the circuit elements formed in the ink solution remain and form a film to complete the circuit pattern for the hybrid IC.

Next, the electrical configuration of the wiring defect detection device in the inkjet hybrid IC pattern forming apparatus 1 configured as described above will be explained.

In FIG. 4, a microcomputer 18 built in the operation panel 16 and serving as wiring defect determination means includes a central processing unit (hereinafter referred to as CPU) 19 and a read-only memory (ROM) that stores a control program. It is composed of a memory 20 and a working memory 21 consisting of a readable and rewritable memory (RAM) in which the arithmetic processing operations of the CPU 19, circuit pattern data, etc. are stored, and the CPU 19 performs the arithmetic processing operations according to the control program. Execute.

The CPU 19 inputs the coordinate data transferred from the CAD system 22 as an external device, and stores it in a predetermined storage area of the work tool 21.

Based on this coordinate data, data for drawing a circuit pattern on the substrate 9 by the droplet ejector 12, that is, the rotation direction of the stepping motor MX for driving in the X direction and the stepping motor My for driving in the Y direction. Circuit pattern data, which is data on the amount of rotation and the operation timing (timing for droplet light) of the droplet ejector 12, is created by arithmetic processing within the apparatus.

Based on this pattern data, the cpul 9 drives and controls the stepping motors MX and M'/ for driving in the X and Y directions via the motor drive circuits 23 and 24, and also controls the droplet through the ejection type drive circuit 25. Dispenser 12
The ink solution 13 is ejected as droplets by controlling the operation. Note that the execution processing command to the CPU 19 is sent from the keyboard 1.
This is done by operating the keys above.

Further, the CPU 19 inputs image data from the camera 15, and detects the adhesion state of the droplet (presence or absence of adhesion of a liquid layer) at the droplet arrival position on the substrate 9-A at that time. Furthermore, the CPU 19 determines the continuous state of each droplet at each drawing position based on the circuit pattern data to be drawn and the image data obtained by the camera 15, and detects the presence or absence of wiring defects.

Next, the operation of the wiring defect detection device in the inkjet type hybrid IC pattern forming apparatus 1 configured as described above will be explained based on FIG. 5.

It is now assumed that the CA( ) system 22 has created coordinate data indicating a circuit pattern to be drawn. Based on key operations on the keyboard 17, the CPU 19
The coordinate data created by the system 22 is received, stored in the working memory 21, and at the same time, arithmetic processing is executed based on the same data to create circuit pattern data such as motor drive timing and liquid layer discharge timing, and the data is stored in the working memory 21. Memories cover 21 different areas.

Next, place the board 9 at a predetermined position on the fixing base 8! When the start key on the keyboard 17 is operated in a fixed state, the CPLJ 19 reads circuit pattern data created as a result of arithmetic processing from the working memory 21 in response to the ON signal of the start key, and based on the data. It drives and controls the stepping motors MX and My for driving in the X and Y directions, and also controls the operation of the droplet ejector 12. Therefore, the substrate 9 on the fixed base 8 is arranged in X and Y directions with respect to the droplet ejector 12 so that the circuit pattern is drawn by the ejector 12.
During the movement, the droplet ejector 1
2 will eject the ink solution 13 one drop at a time, and C
The pattern created by the AD system 22 will be drawn on the same board 9 as it is.

During the droplet ejection operation by the droplet ejector 12, the CPU 1
Reference numeral 9 reads the image signal from the camera 15 and binarizes the signal. Then, the state of adhesion of the liquid layer of the ink solution 13 to the substrate 9 at the coordinate position in the XY direction (XY coordinate position), that is, whether or not a droplet is attached at that coordinate position is detected. Furthermore, the CPU 19 determines the calculated coordinate position in the X-Y direction (XY coordinate position) to be drawn.
Compare the circuit pattern data obtained by the camera 15 with the image data showing the adhesion state of the droplet, and if the ink solution 13 is not attached to the position where it should be drawn (should be attached), it is determined that a wiring defect has occurred. do.

Then, when this defect detection occurs, the CPIJ 19 stops the pattern drawing operation, and the septa Mx and My are driven to return to the defective wiring position. CP (J19) drives the droplet ejector 12 at the location of the wiring defect to eject additional droplets at that location.

When the CPtJ 19 confirms the adhesion of droplets of the ink solution 13 at this time using the camera 15, it determines that the correction has been completed, returns to the P mark position where pattern drawing was interrupted, and resumes drawing. In this manner, the CPU 19 detects wiring defects and performs additional printing operations at the defective locations, thereby completing drawing of all circuit patterns.

As described above, in the wiring defect detection device of this embodiment, while the droplet dispenser 12 is drawing a circuit pattern on the substrate 9, a camera is used to take a decoy image of the pattern data to be drawn and the droplet arrival position. Based on the image data from 15 and 15, the continuous state of each droplet at each coordinate 43 can be determined, and wiring defects in the circuit pattern can be easily detected. Further, if a wiring defect is detected, the drawing operation is interrupted and the device returns to the defective position again to discharge a liquid layer to correct the defective portion.

Therefore, it is possible to automatically and accurately detect wiring defects in a circuit pattern, which was conventionally done by visual inspection with a microscope after drawing the circuit pattern, and also to detect the β positive during the drawing of the circuit pattern. A hybrid IC pattern can be quickly formed.

Note that this invention is not limited to the above embodiments,
It may also be implemented as shown below.

(B) In the above embodiment, when a defective wiring location is detected, it is immediately corrected. However, when a defective wiring location is detected, the first thing to do is to determine its coordinate position, that is, the coordinates Pn in the X and Y directions (X exit,
Yn) is stored in the working memory 21. In this way, all defective coordinate positions Pn during drawing of circuit patterns are stored. After the drawing of the circuit pattern is completed, the defective position data stored in the working memory 21 may be corrected in the order in which they are called.

Alternatively, after drawing a predetermined pattern, for example, the sixth
If you want to draw the straight line pattern shown in figure (a),
As shown in Figure (b), the defective positions P1 to P7 in this straight line pattern are detected and stored, and after the drawing of the straight line pattern is finished, the defective positions P1 to P7 are corrected again in order, and this is done at each predetermined interval. You may do so.

Furthermore, if there are more than a predetermined number of defective wiring locations, it is determined that the droplet ejector 12 itself is in a state of ejection failure (defective due to nozzle clogging, etc.), and purges (droplet ejection operation) the nozzle. The reliability of the droplet ejector 12 may be improved by repairing the clogging.

(b) In the above embodiment, the direction of the camera 15 was set so as to directly reach the droplet arrival position, but as shown in FIG. A mirror 27 provided with a hole 26 through which droplets of the solution 13 can pass is placed, and a camera 15 is placed in the horizontal direction of the same 5J127. Then, an R image of the arrival position of the ink solution 13 may be performed by reflection from the mirror 27.

(c) Furthermore, as shown in FIGS. 8 and 9, the number of cameras 15 (eight in FIG. 1) are arranged around the droplet ejector 12. 15, the peripheral part of the droplet that has reached the substrate 9 is VJ Fl.
p.

(d) An image showing the state of the liquid layer at a predetermined position is transferred using a fiberscope to a position far from the M'L location where it is difficult to install the camera 15, and a light receiving element recognizes the droplet from the transferred image. You may also do so.

(E) The location for detecting the presence or absence of droplets of ink solution is not limited to the position where the liquid layer reaches on the substrate 9 or its surrounding area, but is located in the space between the droplet ejector 12 and the substrate 9. If a type passage sensor is provided, the falling droplet may be detected by the sensor. That is, the flying liquid layer may be optically detected using a photodetector.

Effects of the Invention As detailed above, according to the present invention, wiring defects in circuit patterns can be accurately detected, various countermeasures can be taken, and the reliability of hybrid ICs can be improved. do.

[Brief explanation of the drawing]

FIG. 1 is a perspective view of a wiring defect detection device in an inkjet hybrid IC pattern forming apparatus embodying the present invention, FIG. 2 is a sectional view of the Y-direction moving table, and FIG.
The figure shows the droplet ejector, camera, and board, Figure 4 is a circuit diagram of the electrical block of the wiring failure detection device, and Figure 5 is a flowchart for explaining the operation of the wiring failure detection device. Figure,
FIGS. 6(a) and 6(b) are diagrams for explaining another example of defect detection in a circuit pattern, FIG. 7 is a diagram showing another example of a droplet ejector, a camera, and a board, and FIGS. FIG. 9 is a diagram showing another example of a droplet ejector, a camera, and a substrate. In the figure, 1 is an inkjet type hybrid IC pattern forming apparatus, 4 is a moving table in the X direction, 5 is a moving table in the Y direction, 8 is a fixed table, 9 is a substrate, 12 is a droplet ejector, 13 is an ink solution, and 15 is a A camera as a droplet detection means, 18 a microcomputer as a wiring defect determination means, 19 a central processing unit (CPtJ), 20 a program memory,
21 is a work tool, 22 is a CAD system, Mx is a stepping motor for driving in the X direction, and MV is a stepping motor for driving in the Y direction. Patent applicant Ne1 Co., Ltd. ψta Automatic Loom Manufacturing Co., Ltd.
86 Figure 1] Figure 7 I! Figure 5

Claims (1)

[Claims] 1. Relatively moving a hybrid IC substrate and a droplet ejector that ejects droplets of an ink solution containing a circuit element formation,
In an inkjet type hybrid IC pattern forming apparatus in which a droplet discharge device is ejected during the relative movement to draw a desired circuit pattern on the substrate, the droplet discharge device follows the relative movement. an inkjet type hybrid IC pattern comprising: a droplet detecting means for detecting droplets of ink solution ejected by the droplet detecting means; and a wiring defect determining means for determining a continuous state of each droplet based on detection data of the droplet detecting means. Wiring defect detection device in forming equipment. 2. The droplet detection means is provided at a position close to the droplet ejector,
2. The wiring defect detection device in an inkjet hybrid IC pattern forming apparatus according to claim 1, which is a camera that moves together with the ejector and images the arrival position of the ink solution droplet on the hybrid IC substrate. 3. A patent claim in which the droplet detection means is a plurality of cameras that are provided around the droplet ejector and move together with the ejector to image the area around the position where the ink solution droplet reaches on the hybrid IC substrate. A wiring defect detection device in an inkjet hybrid IC pattern forming apparatus according to item 1. 4. Wiring defect detection in the inkjet hybrid IC pattern forming apparatus according to claim 1, wherein the droplet detection means is a photodetector that moves together with the ejector and optically detects the flying droplets. Device. 5. According to claim 1, the wiring defect determining means determines the continuous state of each droplet at each drawing position based on the circuit pattern data to be drawn and the detection data of the droplet detecting means. Wiring defect detection device for inkjet hybrid IC pattern forming equipment.