CN101026952A - Electronic component mounting method and device - Google Patents
Electronic component mounting method and device Download PDFInfo
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- CN101026952A CN101026952A CN 200710079114 CN200710079114A CN101026952A CN 101026952 A CN101026952 A CN 101026952A CN 200710079114 CN200710079114 CN 200710079114 CN 200710079114 A CN200710079114 A CN 200710079114A CN 101026952 A CN101026952 A CN 101026952A
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Abstract
The invention provides a method and apparatus for mounting electronic component. Its program lies in that it provides a method and apparatus for mounting electronic component which may assuredly compensate the printing deviation of scolding tin, carry out the carrying of the electronic component with high precisionoun, and may raise the productivity of substrate. As a solution means, the substrate is carried on to the apparatus and fixed at an assigned position(step S1); the vedio camera is moved to a substrate mark for the identification of the substrate position formed on the substrate; at the same time shoot the substrate mark and the soldering tin mark(S3) for the identification of the soldering tin location printed on or nearby the substrate mark. The center-of-gravity positions (S4, S5) of the substrate mark and scolding tin mark are detected based on the shot image, then calculates the deviation amount n of the centre of gravity positions, and calculates the printing deviation amount of the scolding tin (S6) relative to the substrate. Then, the correction quantity of the component carrying position (S10) corresponding to the printing deviation of the scolding tin is calculated based on the deviation amount n, then carrying out the correction of the component carrying position by joining this correction value with other correction values together, so as to carry the components (S11).
Description
Technical field
The present invention relates on the circuit substrate that has printed scolding tin, carry the electronic component mounting method and the device of electronic unit.
Background technology
In the past, in electronic component mounting apparatus, for electronic unit being carried accurately on the circuit substrate (being designated hereinafter simply as substrate), when substrate was moved in the device, the early-stage preparations as carrying were fixed on substrate the position that will implement to carry, identification is printed on the base plate mark on the substrate, detect the position deviation of substrate, the loading position (for example, with reference to following patent documentation 1) of correcting electronic parts on substrate.
But, in this structure, the solder printing deviation when not considering printed solder paste on each electrode on substrate.Therefore, exist the electronic unit that is carried correctly to locate with respect to the scolding tin that is printed on the electrode, produce the bad problem of installing.
To this, known following structure, just promptly take at the substrate of print solder figure, detect each electrode on the substrate and the position separately of the scolding tin that is printed thereon, proofread and correct the loading position (with reference to patent documentation 2) of each electronic unit according to this testing result.
But, in this structure, take all electrodes on the identification substrate also and the scolding tin figure that is printed thereon, so count and the number of electrodes of substrate, exist identification to handle spended time, the problem that the productive temp of substrate is elongated according to the lift-launch of parts.
To this, in patent documentation 3, put down in writing following structure, in the solder printing step of substrate, (for example two places) printing telltale mark at a plurality of positions, the deviation of detection and location mark is obtained the position deviation of printed pattern, according to this departure correcting unit loading position.
And, in patent documentation 4, put down in writing following structure, printing is used to discern the scolding tin mark (solder(ing) paste mark) of the position deviation of scolding tin figure on the substrate that has formed base plate mark (pictorial symbolization), after the position deviation of identification substrate, detect the position of scolding tin mark, the site error amount of the scolding tin mark when calculating base plate mark as benchmark is proofreaied and correct loading position according to this margin of error and substrate position deviation.
The special fair 7-105635 communique of patent documentation 3 Japan
No. 3264395 communique of patent documentation 4 Japan Patents
But, in the structure of patent documentation 3, obtain the position deviation of printed pattern with respect to the reference position, so do not consider the position deviation of substrate, for example in the solder printing position with respect to substrate slightly during deviation, existence is the problem of the loading position of localized electron parts appropriately.
To this, in the structure of patent documentation 4, though considered the position deviation of substrate and the printing deviation of scolding tin, but the base plate mark of substrate position identification usefulness and the shooting of the scolding tin mark that the solder printing location recognition is used and identification are separately carried out before and after being, so when moving to video camera on the base plate mark and when moving on the scolding tin mark, because machine error, video camera concerns deviation with respect to the position of each camera position, except that this departure is added to problem on the error when proofreading and correct the installation site, also has the time of taking behind the base plate mark position to the scolding tin mark position moves with spending in redundantly.
Summary of the invention
Problem of the present invention is to address this is that, and a kind of printing position deviation that can compensate scolding tin is provided, and carries out the lift-launch of electronic unit at short notice accurately, and can improve the productive electronic component mounting method and the device of substrate.
In order to address the above problem, the electronic component mounting method that on the substrate that has printed scolding tin, carries electronic unit of the present invention, it is characterized in that, the base plate mark (51 of the substrate position identification usefulness that on substrate, forms, 52,53) in or near it, the scolding tin mark (61 of print solder printing position identification usefulness, 62,63), take described base plate mark and scolding tin mark simultaneously, position according to image detection base plate mark that photographs and scolding tin mark, calculate the printing deviation amount of scolding tin with respect to substrate, carry out and the described corresponding mounting position correcting of printing deviation amount that calculates, thus boarded parts.
In addition, the electronic component mounting apparatus that on the substrate that has printed scolding tin, carries electronic unit of the present invention, it is characterized in that, this electronic component mounting apparatus has: image unit (17), and it takes base plate mark and in the base plate mark (51,52,53) of substrate position identification usefulness or near the scolding tin mark (61,62,63) used of the solder printing location recognition of printing it simultaneously; Computing unit (27, S4～S6), it calculates the printing deviation amount of scolding tin with respect to substrate according to the image detection base plate mark that photographs by described image unit and the position of scolding tin mark; And control unit (20, S10～S11), it carries out and the described corresponding mounting position correcting of printing deviation amount that calculates, thereby boarded parts.
In the present invention, detect the printing deviation amount of scolding tin, carry out the correction of component mounting position, so the solder printing position deviation that produces can compensate on substrate print solder reliably the time with respect to substrate.And, in the present invention, base plate mark and scolding tin mark are in the same visual field of image unit, can take simultaneously, so can obtain to obtain accurately at short notice the position deviation amount of substrate and the scolding tin effect with respect to the printing deviation amount of substrate.
Description of drawings
Fig. 1 is the stereogram of the whole schematic configuration of expression electronic component mounting apparatus of the present invention.
Fig. 2 is the block diagram of structure of the control system of this device of expression.
Fig. 3 is the plane graph that is illustrated in an example of the masterplate (stencill) that uses in the solder printing of circuit substrate.
Fig. 4 is that expression uses this masterplate to carry out the plane graph of the circuit substrate of solder printing.
Fig. 5 is the flow chart of expression parts installation procedure of the present invention.
Fig. 6 is the key diagram that the image of base plate mark that substrate identification video camera takes and scolding tin mark is used in expression.
Fig. 7 is to use another embodiment of the image of base plate mark that substrate identification video camera takes and scolding tin mark.
Fig. 8 is to use another embodiment of the image of base plate mark that substrate identification video camera takes and scolding tin mark.
Embodiment
Below, be used to implement the embodiment of best mode of the present invention with reference to description of drawings.
[embodiment]
Fig. 1 is the figure that summary is represented the electronic component mounting apparatus of embodiments of the invention.As shown in the drawing, electronic component mounting apparatus 1 has: circuit substrate carrying path 15, and it extends towards left and right directions (X-direction) after a while at central portion; Parts supply unit 14, the front portion (illustrated downside) that it is located at device 1 provides the electronic unit that will be installed on the substrate 10 (being designated hereinafter simply as parts); And the X-axis travel mechanism 11 and the y-axis shift actuation mechanism 12 that are located at their tops.
And, on suction head 13, being equipped with as the substrate identification video camera 17 of image unit and the not shown lighting unit that substrate 10 is thrown light on, video camera 17 is taken the base plate mark of the substrate position identification usefulness that is formed on the substrate 10.
And, the sidepiece of parts supply unit 14 be provided with from below take the component identification video camera 16 that is adsorbed on the parts on the suction nozzle 13a.And, be provided with the not shown lighting unit that adsorbed parts are thrown light on component identification video camera 16.In addition, though, on suction head 13, laser cell is installed, be used to discern the parts that do not require high accuracy identification for fear of miscellaneous not diagram.
And, be provided with the performance monitor 18 of the operating state etc. of display unit in the front upper of electronic component mounting apparatus 1.In addition, in main body, be provided with the control part 19 that carries out overall control of device and image processing etc.
Fig. 2 represents the structure of the control system of electronic component mounting apparatus 1.Control part 19 among Fig. 1 is made of the controller among Fig. 2 20, image processing apparatus 27 and storage device 30 etc.
And, image processing apparatus 27 (computing unit) is by A/D converter 27a, is the base plate mark of the substrate position identification usefulness of being taken by substrate identification video camera (image unit) 17 and the image transitions of the scolding tin mark that the solder printing location recognition is used digital signal, be stored among the memory 27b, CPU 27c detects the position of base plate mark and scolding tin mark according to this view data, described according to the back, obtain the position deviation amount of substrate and the printing deviation amount of scolding tin.Then, controller 20 (control unit) is according to each departure of obtaining from the photographed images of video camera 16,17, and the loading position of correcting unit 2 carries parts 2 on the correct loading position on the substrate 10.
Display unit (monitor) 31 is display unit data, operational data, the image that utilizes the parts 2 of component identification video camera 16 shootings, the base plate mark that utilizes 17 shootings of substrate identification video camera and the image of scolding tin mark on picture 31a.
Fig. 3 represents to be used for an example of the masterplate of print solder on the electrode of substrate.The position of corresponding each electrode is formed with a plurality of holes 33 respectively on masterplate 32, is used for print solder on the electrode on the substrate of link terminal.And the hole 41～43 that is used for the scolding tin mark of print solder printing position identification usefulness on substrate is formed at the assigned position place in three bights of masterplate 32 respectively.The scolding tin mark can be one, but in order to improve precision, prints a plurality of (2～4) usually, so be formed with on masterplate and the corresponding hole of this quantity.
Fig. 4 represents to use the masterplate 32 of Fig. 3 to carry out the substrate 10 of solder printing.On substrate 10, be printed with the base plate mark 51～53 of substrate position identification usefulness in advance at assigned position.Electrode by masterplate 32 is used hole 33, print solder 64 on each electrode of substrate 10, and by scolding tin mark hole 41～43 print solder marks 61～63.Herein, the scolding tin mark is corresponding with each position of base plate mark 51～53 with each position in hole 41～43, each scolding tin mark 61～63 is printed on each base plate mark 51～53, makes position, its center (center of gravity) consistent with the center of each base plate mark 51～53.And hole 41～43 is less than base plate mark 51～53, and scolding tin mark 61～63 is printed less than base plate mark respectively on base plate mark 51～53 thus.
In fact during print solder, masterplate 32 and substrate 10 can produce position deviations, so correspondingly scolding tin mark 61～63 produces position deviations with respect to base plate mark 51～53 and is printed, the scolding tin on the electrode also produces position deviation with respect to electrode and is printed.In Fig. 4, for fear of miscellaneous, the scolding tin 64 on the electrode illustrates with the state that does not have position deviation.
Below, according to the lift-launch action of flowchart text parts shown in Figure 5.
Before carrying action, use masterplate 32 shown in Figure 3, on substrate 10, carry out solder printing, according to shown in Figure 4, print solder 64 and scolding tin mark 61～63 on the electrode of substrate 10.
In step S1, on board carrying path 15 shown in Figure 1, carry the substrate 10 of print solder, and be fixed on assigned position.
In step S2, utilize X-axis travel mechanism 11 and y-axis shift actuation mechanism 12 that suction head 13 is moved on X, Y direction, make substrate identification video camera 17 move to assigned position in the face of first base plate mark 51.
In step S3, utilize substrate identification video camera 17 to take base plate mark 51 and printing scolding tin mark 61 thereon simultaneously, captured image is stored among the memory 27b.Fig. 6 represents the image of captured base plate mark 51 and scolding tin mark 61.
In step S4 and S5, the CPU 27c processing screened images of image processing apparatus 27, for example by pattern matching or detection edge, detect the position (X1, Y1) of base plate mark center of gravity 51a and the position (X2, Y2) of scolding tin mark center of gravity 61a, in step S6, calculate the departure n of two position of centre of gravitys.This departure n represents the printing deviation amount (margin of error) of scolding tin with respect to substrate 10.
In step S7, during greater than the tolerance limit value m of regulation, it is bad to be judged to be solder printing, finishes the processing action of Fig. 5, forbids the lift-launch action of parts on substrate in the value that is judged to be departure n.In addition, the bad information of output this moment warning user's solder printing.
The scolding tin mark that only utilizes a base plate mark and be printed thereon, also can obtain the printing deviation amount of scolding tin with respect to substrate, but, successively video camera 17 is moved to the position of other base plate marks 52,53, the processing of repeating step S3～S7 in order to improve precision.
After to all base plate mark end process (step S8), finally obtain the printing deviation amount of scolding tin with respect to substrate.For example, under the situation of only using a group substrate mark and scolding tin mark, obtain the printing deviation amount as the difference of the X coordinate of the position of centre of gravity of two marks and the difference of Y coordinate.In addition, under the situation of using two group substrate marks and scolding tin mark, owing to can carry out slant correction, so the mean value of the difference of the barycentric coodinates (X, Y) of carrying out two group substrate marks behind the slant correction and scolding tin mark as the printing deviation amount, under the situation of these external use three group substrate marks and scolding tin mark, owing to can obtain two inclinations, therefore utilize its mean value to carry out slant correction, the mean value of the difference of the barycentric coodinates (X, Y) of carrying out three group substrate marks behind the slant correction and scolding tin mark as the printing deviation amount.
After obtaining the printing deviation amount like this, multiply by weight coefficient (correction coefficient) k, obtain and carry correcting value (step S10) to this printing deviation amount.This weight coefficient can be determined according to unit type, for example is 0.5, if require to carry the parts of precision, then weight coefficient is made as value greater than 0.5.Then, utilize the correcting value of obtaining like this to proofread and correct loading position, with component mounting (step S11) to substrate.
In addition, at the timing that carries out loading position,, also proofread and correct these departures when the absorption deviation that has parts and substrate during with respect to the position deviation of reference position.Can come the center and the absorption angle of detection part by the image processing of the captured parts 2 of component identification video camera 16, thereby obtain the absorption deviation of parts, in addition, can obtain the position deviation of substrate by the position of detecting base plate mark 51～53.In the present embodiment, take base plate mark and scolding tin mark simultaneously, and detect the position of each mark, can obtain scolding tin at short notice with respect to the printing deviation amount of substrate and substrate advantage with respect to the position deviation amount of reference position so have.
In addition, in above embodiment, the printing position of scolding tin mark is located on the base plate mark, but also can be as shown in Figure 7, makes the printing position of scolding tin mark 81 be limited in the inboard of annulus base plate mark 71.Can also be as shown in Figure 8, if can be 98 taking simultaneously in the same visual field of base plate mark 91 and scolding tin mark 99 income substrates identification video cameras 17, then also can be with near scolding tin label print position base plate mark.
Claims (4)
1. an electronic component mounting method that carries electronic unit on the substrate that has printed scolding tin is characterized in that,
Near the scolding tin mark of print solder printing position identification usefulness in the base plate mark of substrate position on being formed at substrate identification usefulness or it,
Take described base plate mark and scolding tin mark simultaneously,
According to the position of image detection base plate mark that photographs and scolding tin mark, calculate the printing deviation amount of scolding tin with respect to substrate,
Carry out and the described corresponding mounting position correcting of printing deviation amount that calculates, thus boarded parts.
2. electronic component mounting method according to claim 1 is characterized in that, multiply by weight coefficient to the printing deviation amount of the described scolding tin that calculates, and carries out and the corresponding mounting position correcting of printing deviation amount that multiply by behind the weight coefficient.
3. electronic component mounting method according to claim 1 and 2 is characterized in that, when the printing deviation amount of described scolding tin surpasses the tolerance limit value of regulation, forbids carrying action.
4. electronic component mounting apparatus that carries electronic unit on the substrate that has printed scolding tin is characterized in that this electronic component mounting apparatus has:
Image unit, it takes base plate mark and in the base plate mark of substrate position identification usefulness or near the scolding tin mark used of the solder printing location recognition of printing it simultaneously;
Computing unit, it calculates the printing deviation amount of scolding tin with respect to substrate according to the image detection base plate mark that photographs by described image unit and the position of scolding tin mark; And
Control unit, it carries out and the described corresponding mounting position correcting of printing deviation amount that calculates, thus boarded parts.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006038734 | 2006-02-16 | ||
| JP2006038734A JP2007220837A (en) | 2006-02-16 | 2006-02-16 | Method and device for mounting electronic component |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101026952A true CN101026952A (en) | 2007-08-29 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200710079114 Pending CN101026952A (en) | 2006-02-16 | 2007-02-13 | Electronic component mounting method and device |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP2007220837A (en) |
| CN (1) | CN101026952A (en) |
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| CN111386028A (en) * | 2018-12-27 | 2020-07-07 | 松下知识产权经营株式会社 | Substrate processing system |
| CN113498634A (en) * | 2019-03-05 | 2021-10-12 | 株式会社富士 | Correction amount calculation device and correction amount calculation method |
| CN113508651A (en) * | 2019-03-05 | 2021-10-15 | 株式会社富士 | Correction amount calculation device, component mounting machine, and correction amount calculation method |
| CN113508651B (en) * | 2019-03-05 | 2022-09-20 | 株式会社富士 | Correction amount calculation device, component mounting machine, and correction amount calculation method |
| CN113498634B (en) * | 2019-03-05 | 2023-04-28 | 株式会社富士 | Correction amount calculation device and correction amount calculation method |
| WO2020191840A1 (en) * | 2019-03-27 | 2020-10-01 | 阳程（佛山）科技有限公司 | Pcb or fpc cross-wiring calibration and positioning method for solder paste printing of single or multiple pcs |
| CN110012613A (en) * | 2019-03-27 | 2019-07-12 | 阳程（佛山）科技有限公司 | The PCB or FPC of single or multiple PCS, which is getting lines crossed, calibrates positioning tin impression method |
| CN110012613B (en) * | 2019-03-27 | 2022-04-05 | 阳程（佛山）科技有限公司 | Single or multiple PCS PCB or FPC serial line calibration and positioning tin printing method |
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|---|---|
| JP2007220837A (en) | 2007-08-30 |
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