CN103298328B - Electronic component method for loading - Google Patents
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- CN103298328B CN103298328B CN201210479216.1A CN201210479216A CN103298328B CN 103298328 B CN103298328 B CN 103298328B CN 201210479216 A CN201210479216 A CN 201210479216A CN 103298328 B CN103298328 B CN 103298328B
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Abstract
It is an object of the invention to provide a kind of electronic component method for loading, even if also can reliably carry electronic component to each intracavity in that case of substrate deformation.Using inspection head（34）The inspection photographing unit possessing（34a）Identify respectively located at substrate（2）Multiple reference marks（2m）And multiple chamber（3）, after calculating the relative position relation between reference mark and the center in each chamber, using boarded head（35）The second substrate identification camera possessing（38）Identification calculates located at multiple reference marks of substrate with boarded head（35）Shifting axle on the basis of the boarded head shifting axle frame of reference in each reference mark position, the position of each reference mark being calculated based on this and the relative position relation calculating, obtain the center in each chamber in the boarded head shifting axle frame of reference, the center in each chamber that this is obtained is set as electronic component（4）Loading position.
Description
Technical field
The present invention relates to the electronics unit that the electronic component equipped system carrying electronic component to the intracavity located at substrate is carried out
Part method for loading.
Background technology
In the past, had multiple distributions more than two-layer in printed base plate in longitudinal direction（Thickness direction）Upper stacking and formed
Multilayered wiring structure multilager base plate known, in the manufacture of this multilager base plate, using possessing carrying electronics
Multiple chambeies of element（Concavity）Substrate（Cavity substrate）（For example, referring to patent documentation 1）.Cavity substrate carries electronic component
Before, it is made up of 1 big substrate, after being equipped with electronic component to each chamber, be divided into the size of finished product.
The electronic component equipped system that electronic component is used to the carrying operation of this cavity substrate generally links one
Or multiple working rig and constitute, carry out the sending and receiving of the substrate of basal plate conveyer generation between adjacent working rig and to operation position
The positioning put, and carry out bonding agent to the coating of each intracavity, using the work possessing boarded head beneficial to the working rig possessing coating head
Industry machine carries out electronic component to the carrying of each intracavity being coated with bonding agent.
Here, the working rig possessing boarded head identifies by substrate by using the substrate identification camera that boarded head possesses
Conveyer is positioned at multiple reference marks of setting on the substrate of job position, calculates the seat on the basis of the shifting axle of boarded head
Mark system（The boarded head shifting axle frame of reference）In each reference mark position, the position of each reference mark being calculated based on this
Relative position relation data and the reference mark that gives in advance as information substrate and the center in each chamber between（Substrate sets
Count）, obtain the center in each chamber in the boarded head shifting axle frame of reference（Center in design data）, will
Center in this design data in each chamber obtained is set as the loading position of electronic component, carries electronic component.
Patent documentation 1：No. 3238966 publication of patent
Content of the invention
But, cavity substrate is maximized and slim year by year from the raising of productivity ratio and the miniaturization angle of finished product
Change, and be easily deformed, therefore, in the carrying of electronic component, the center of the reality in each chamber is sometimes in off-design data
Center, accordingly, there exist the problem points being sometimes difficult to that electronic component is equipped on intracavity.
Therefore, it is an object of the invention to, even if providing one kind it is also possible to each chamber in that case of substrate deformation
Inside reliably carry the electronic component method for loading of electronic component.
The electronic component method for loading that first aspect is recorded, is the electronic component carrying side that electronic component equipped system is carried out
Method, described electronic component equipped system is using the inspection head possessing inspection photographing unit and the carrying possessing substrate identification camera
Head, to located at the respective internal carrying electronic component in multiple chambeies of substrate, described electronic component method for loading includes：Center
Calculation process, using the described described inspection photographing unit checking that head possesses, identifies the multiple fiducial marks located at described substrate respectively
Note and the plurality of chamber, calculate the relative position relation between described reference mark and the center in described each chamber；Electronics unit
Part loading position sets operation, identifies the institute located at described substrate using the described substrate identification camera that described boarded head possesses
State multiple reference marks, calculate described in the boarded head shifting axle frame of reference on the basis of the shifting axle of described boarded head
Calculate in the position of each reference mark, the position of the described each reference mark being calculated based on this and described center calculation process
Described relative position relation, obtain the center in the described each chamber in the described boarded head shifting axle frame of reference, should
The center in the described each chamber obtained is set as the loading position of electronic component；And electronic component carries operation, using institute
State boarded head and keep electronic component, this electronic component keeping is equipped in described electronic component loading position setting operation and sets
The loading position of fixed described electronic component.
The electronic component method for loading that second aspect is recorded, is the electronic component carrying side that electronic component equipped system is carried out
Method, described electronic component equipped system uses possesses the inspection head checking photographing unit, the painting possessing first substrate identification camera
The leftover of bolt of cloth and the boarded head possessing second substrate identification camera, to located at the respective internal carrying electronics unit in multiple chambeies of substrate
Part, described electronic component method for loading includes：Center calculation process, using the described described inspection photograph checking that head possesses
Machine, identifies the multiple reference marks located at described substrate and the plurality of chamber respectively, calculates described reference mark and described each chamber
Center between relative position relation；Bonding agent application place sets operation, possessed using described coating head described in
First substrate identification camera identifies the plurality of reference mark located at described substrate, calculates with the shifting axle of described coating head
On the basis of the coating head shifting axle frame of reference in described each reference mark position, the described each benchmark being calculated based on this
The described relative position relation calculating in the position of labelling and described center calculation process, obtains described coating head shifting axle
The center in the described each chamber in the frame of reference, the center in described each chamber that this is obtained is set as the painting of bonding agent
Cloth position；Bonding agent painting process, using described coating head, sets to described bonding agent application place described in setting in operation
Bonding agent application place coating adhesive；Electronic component loading position sets operation, after described bonding agent painting process, utilizes
The described second substrate identification camera that described boarded head possesses, identification, located at the plurality of reference mark of described substrate, is calculated
Go out the position of the described each reference mark in the boarded head shifting axle frame of reference on the basis of the shifting axle of described boarded head,
The described relative position calculating in the position of the described each reference mark being calculated based on this and described center calculation process is closed
System, obtains the center in the described each chamber in the described boarded head shifting axle frame of reference, described each chamber that this is obtained
Center is set as that the loading position of electronic component is carried out；And electronic component carries operation, using described boarded head, to institute
State the loading position carrying electronic component that electronic component loading position sets the described electronic component setting in operation.
On the basis of second aspect, described coating head possesses makes bonding to the electronic component method for loading that the third aspect is recorded
Transfer pin that agent is attached to lower end and is shifted and constitute, the inside in described each chamber is inserted in the front end of described transfer pin and applies
Cloth bonding agent.
On the basis of second aspect, it is viscous that described coating head possesses discharge to the electronic component method for loading that fourth aspect is recorded
Connect the ejection nozzle of agent and constitute, the coating adhesive by the inside in the front end described each chamber of insertion of described ejection nozzle.
In the present invention, reality identifies that the reference mark that the setting of the loading position of electronic component is used is obtained in each chamber
The relative position relation and center in each chamber between, therefore, even if in substrate deformation, electronic component each chamber reality when carrying
Center off-design data on center in the case of it is also possible to reliably carry electronic component to each intracavity.
Brief description
Fig. 1 is the plane graph of the electronic component equipped system of first embodiment of the invention；
Fig. 2 is substrate and the load that the electronic component equipped system of first embodiment of the invention carries out electronic component carrying
The axonometric chart that body and electronic component represent simultaneously；
Fig. 3 be first embodiment of the invention electronic component equipped system carry out electronic component carrying substrate local
Amplification view；
Fig. 4 is to represent that the electronic component equipped system in first embodiment of the invention carries out the substrate of electronic component carrying
Intracavity be coated with bonding agent state figure；
Fig. 5 is the block diagram of the control system of electronic component equipped system representing first embodiment of the invention；
Fig. 6 is the stream of the order of inspection operation of electronic component equipped system execution representing first embodiment of the invention
Cheng Tu；
Fig. 7 is the stream of the order of carrying operation of electronic component equipped system execution representing first embodiment of the invention
Cheng Tu；
Fig. 8（a）（b）Be illustrate first embodiment of the invention electronic component equipped system execution carrying operation suitable
The figure of sequence；
Fig. 9 is the plane graph of the electronic component equipped system of second embodiment of the invention；
Figure 10 is the block diagram of the control system of electronic component equipped system representing second embodiment of the invention；
Figure 11 is the order of the painting process of electronic component equipped system execution representing second embodiment of the invention
Flow chart；
Figure 12 is the simple pie graph of the electronic component equipped system of third embodiment of the invention.
Symbol description
1A, 1B, 1C electronic component equipped system
2 substrates
2m reference mark
3 chambeies
4 electronic components
34 inspection heads
34a checks photographing unit
35 boarded heads
38 second substrate identification cameras（Substrate identification camera, second substrate identification camera）
53 coating heads
53a transfer pin
54 first substrate identification cameras（First substrate identification camera）
Specific embodiment
（First embodiment）
First, the first embodiment of the present invention is illustrated.Electronic component equipped system 1A shown in Fig. 1 is in water
Square to（It is set to X-direction）Upper carrying substrate 2 and to the multiple chambeies 3 located at substrate 2（With reference to the enlarged drawing shown in Fig. 2）Respectively
From inside carry electronic component 4 system, by bonding agent apparatus for coating 11 and operation side downstream configuration electronic component
Loading device 12 is constituted.In this first embodiment, substrate 2 is to be attached at the support C r upper surface being made up of flat-shaped part
State to electronic component equipped system 1A supply but it is also possible to not be attached at support C r, and with substrate 2 monomer supply.Located at
The interior shape in each chamber 3 of substrate 2 has rectangular shape with viewed in plan, and the profile of each electronic component 4 has carries this electricity than becoming
The rectangular shape of the less circle in chamber 3 of the object of subcomponent 4.
In FIG, bonding agent apparatus for coating 11 possesses the basal plate conveyer on base station 21 along X-direction carrying substrate 2
22 and head moving mechanism 23, this head moving mechanism 23 is by along the direction orthogonal with X-direction（It is set to Y direction）It is extended
A pair of Y-axis workbench 23a, along X-direction extend and on a pair of Y-axis workbench 23a along Y direction movement X-axis work
Platform 23b and on X-axis workbench 23b along X-direction movement mobile station 23c constitute, in mobile station 23c of head moving mechanism 23
On coating head 24 is installed.
Coating head 24 possesses the transfer pin 24a extending downwards and shines shooting visual field first substrate identification downward
Camera 25, by the action of head moving mechanism 23（The shift action with respect to Y-axis workbench 23a for the X-axis workbench 23b and movement
The combination of the shift action with respect to X-axis workbench 23b for the platform 23c）, coating head 24 is on the basis of the shifting axle of coating head 24
The coating head shifting axle frame of reference（XY coordinate system）In become mobile freely.
Buanch unit 26 is provided with base station 21.This buanch unit 26 is by making scraper plate 26b with respect in transfer table 26a
Bonding agent B moves in the horizontal direction, and the thickness of bonding agent B is remained necessarily.
If the control device that this bonding agent apparatus for coating 11 possesses（Not shown）The other from upstream process side is detected
Device has put into this situation of substrate 2, then carry out the action control of basal plate conveyer 22, and this substrate 2 is transported in base station 21
Centre job position and positioned.And, make coating head 24 move to the top of substrate 2, identify photograph using first substrate
Machine 25 carries out two reference marks 2m located at substrate 2 diagonal position（Fig. 1 and Fig. 2）Shooting, by carrying out each reference mark
The image recognition of 2m, calculates its position.
If the control device of bonding agent apparatus for coating 11 calculates the position of each reference mark 2m, based on this calculate each
Phase between the position of reference mark 2m and reference mark 2m giving in advance as information substrate and the center in each chamber 3
To position relationship, obtain the above-mentioned coating head shifting axle frame of reference（XY coordinate system）In each chamber 3 center（Design number
According to upper center）.Here, the relative position relation between said reference labelling 2m and the center in each chamber 3 is for example made
It is the substrate fixed coordinate system on the basis of two reference marks 2m（Here, linking side's reference mark 2m and the opposing party's benchmark
The line of labelling 2m forms the ε η coordinate system that the orthogonal ε axle of drift angle φ and η axle are constituted.With reference to Fig. 2 and Fig. 3）In each chamber 3 in
The coordinate of heart position P0（ε0、η0）Data（Substrate design data）Give.
The control device of bonding agent apparatus for coating 11 obtains the coating head shifting axle frame of reference as described above（XY coordinate
System）In each chamber 3 center（Center in design data）Afterwards, in the design data in each chamber 3 this obtained
Center is as the application place of bonding agent B, coating adhesive B.
Specifically, the coating of this bonding agent B is carried out as follows, i.e. control device makes coating head 24 mobile, makes transfer pin
24a is inserted from above into being retained certain thickness bonding agent B in transfer table 26a, thus, makes to be attached under transfer pin 24a
The bonding agent B of end is contacted with the bottom surface in chamber 3（Transfer）（Fig. 4）.Control device finishes bonding agent B to the coating in each chamber 3
Afterwards, make basal plate conveyer 22 action, the electronic component loading device 12 of substrate 2 downstream operation side is taken out of.
In Fig. 1, electronic component loading device 12 has the basal plate conveyer on base station 31 along X-direction carrying substrate 2
32 and head moving mechanism 33, this head moving mechanism 33 is by a pair of Y-axis workbench 33a being extended along Y direction, along X-axis side
To extension along two X-axis workbench 33b of Y direction movement and in each X-axis workbench 33b on a pair of Y-axis workbench 33a
On constitute along mobile station 33c of X-direction movement, inspection 34 is provided with mobile station 33c of head moving mechanism 33,
Boarded head 35 is provided with another mobile station 33c.One side at the both ends relative along Y direction on base station 31 is provided with
Multiple feed appliances 36 of supply electronic component 4, are provided between these feed appliance 36 and basal plate conveyers 32 and will shoot visual field court
Component recognition camera 37 upward.
Check that 34 possess and will shoot visual field inspection photographing unit 34a downward, boarded head 35 possesses and extends downwards
And multiple adsorption mouth 35a of electronic component 4 are kept by vacuum pressure absorption and visual field second substrate knowledge downward will be shot
Other photographing unit 38.The action of head moving mechanism 33 is passed through in inspection 34（The shifting with respect to Y-axis workbench 33a for the X-axis workbench 33b
The combination of the action and mobile station 33c shift action with respect to X-axis workbench 33b）, with the shifting axle of inspection 34 as base
The accurate inspection head shifting axle frame of reference（XY coordinate system）Middle movement is freely.In addition, same, boarded head 35 passes through head moving machine
The action of structure 33, in the boarded head shifting axle frame of reference on the basis of the shifting axle of boarded head 35（XY coordinate system）Middle movement
Freely.
In Figure 5, basal plate conveyer 32 is carried out the carrying of substrate 2 and the inspection that location action, head moving mechanism 33 are carried out
Look into 34 and boarded head 35 shift action, check that 34 shooting action of inspections photographing unit 34a possessing, second substrate identify
The shooting action of photographing unit 38, carry out the adsorbing mechanism of setting in the boarded head 35 of the absorption to electronic component 4 for each adsorption mouth 35a
Each control of the shooting action of 39 action and component recognition camera 37 is filled by the control that electronic component loading device 12 possesses
Put 40 to carry out.
The control device 40 of electronic component loading device 12 detects and send from the bonding agent apparatus for coating 11 of upstream process side
After carrying out this situation of substrate 2, carry out the action control of basal plate conveyer 32, this substrate 2 is transported to the operation in base station 31 central authorities
Position and positioned, afterwards execute Fig. 6 the inspection operation shown in flow chart.
In inspection operation, control device 40 makes inspection 34 move to the top of substrate 2 first, using inspection photographing unit
34a carries out the shooting of two reference marks 2m located at substrate 2, based on the view data obtaining, in substrate identification part 40a（Figure
5）Calculate the position of each reference mark 2m（Step ST1 shown in Fig. 6）.
In addition, control device 40 shoots the multiple chambeies 3 located at substrate 2 respectively using inspection photographing unit 34a, based on obtain
View data, in chamber identification part 40b（Fig. 5）Calculate the corner location in each chamber 3（Step ST2 shown in Fig. 6）.And, based on calculation
The corner location in each chamber 3 going out（By carry out corner location coordinate figure average）, calculate the center in each chamber 3（Fig. 6 institute
Step ST3 shown）.
In addition, the position of calculate in step ST2 two reference marks 2m, each chamber 3 calculating in same steps ST2
Corner location and each chamber 3 calculating in step ST3 center by the inspection on the basis of the shifting axle checking 34
The head shifting axle frame of reference（XY coordinate system）Calculate as benchmark.
Position after control device 40 finishes above-mentioned steps ST3, based on two reference marks 2m calculating in step ST1
The center in each chamber 3 put and calculate in step ST3, calculates the phase between reference mark 2m and the center in each chamber 3
To position relationship, the data storage of the relative position relation that this is calculated is in the phase of the storage device 41 being connected with control device 40
To position relationship storage part 41a（Fig. 5）（Step ST4 shown in Fig. 6）.
Here, be stored in above-mentioned steps ST4 relative position relation storage part 41a relative position relation as shown in figure 3,
It can also be the substrate fixed coordinate system on the basis of two reference marks 2m obtained in step ST1（ε η coordinate system）In seat
Mark P1（ε1、η1）Or given and be stored in the information substrate storage part of storage device 41 in advance as information substrate
41b（Fig. 5）The center P0 in each chamber 3 as substrate design data coordinate（ε0、η0）And with this center P0（ε
0、η0）Departure △ P（△ε、△η）Combination（ε0+△ε、η0+△η）Data.
After control device 40 finishes step ST4（Or it is parallel with step ST4）, based on each chamber 3 calculating in step ST2
Corner location, obtain the axial minimum dimension d η of ε axial minimum dimension d ε and η in each chamber 3（Fig. 3）, utilize these
Size calculates the interior shape size in each chamber 3, and is stored in the intracavity shape size storage part 41c of storage device 41（Fig. 5）（Shown in Fig. 6
Step ST5）.Thus, inspection operation terminates.
After the control device 40 of electronic component loading device 12 finishes above-mentioned inspection operation, the flow chart of execution Fig. 7
Shown carrying operation.In carrying operation, control device 40 makes boarded head 35 move to the top of substrate 2, using the second base
Plate identification camera 38 carries out the shooting of a pair of reference mark 2m located at substrate 2, based on the view data obtaining, calculates each base
Fiducial mark remembers the position of 2m（Step ST11 shown in Fig. 7）.And, the position of each reference mark 2m being calculated based on this and above-mentioned
Step ST4 in relative position relation between reference mark 2m that calculates and the center in each chamber 3, calculate with boarded head 35
Shifting axle on the basis of the boarded head shifting axle frame of reference（XY coordinate system）In each chamber 3 center P（Shown in Fig. 7
Step ST12）, the center P in each chamber 3 that this is calculated is set as the loading position of electronic component 4, is stored in storage dress
Put 41 electronic component loading position storage part 41d（Fig. 5）（Step ST13 shown in Fig. 7）.
After control device 40 sets the loading position of electronic component 4 as described above, carry out the dynamic of head moving mechanism 33
Work controls, mobile boarded head 35, so that adsorption mouth 35a is adsorbed the electronic component 4 of feed appliance 36 supply and be kept（Shown in Fig. 7
Step ST14）.And, to make electronic component 4 mobile carrying by way of component recognition camera 37 top of this holding
35, carry out being kept by boarded head 35 using component recognition camera 37（It is adsorbed in adsorption mouth 35a）Electronic component 4 bat
After taking the photograph, by element identification part 40c（Fig. 5）Executive component identifies（Fig. 8（a））, obtain the electronics that will be equipped in each chamber 3
The overall dimensions of element 4（Dx、Dy）Information（Step ST15 shown in Fig. 7）.In addition, now, detection electronic component 4 with respect to
The dislocation of adsorption mouth 35a.
In addition, the image of acquirement electronic component 4 obtained from identification of the information of the overall dimensions of this electronic component 4
Data calculates the overall dimensions of electronic component 4, or by reading the electronic component dimensions data storage being stored in storage device 41
Portion 41e（Fig. 5）Overall dimensions（Dx、Dy）Data carrying out.
After control device 40 achieves the overall dimensions of electronic component 4 in step ST15, in judging part 40d（Fig. 5）Will
The overall dimensions of electronic component 4 obtaining in step ST15 are compared with the interior shape size in the chamber 3 calculating in step ST5, carry out
Whether electronic component 4 can be equipped on the judgement in corresponding chamber 3（Step ST16 shown in Fig. 7）.
Here, the overall dimensions of electronic component 4 that the judging part 40d of control device 40 obtains in step ST15 add
When below the interior shape size in chamber 3 a size of calculating in step ST5 obtained from regulation value more than needed, it is judged as this electronic component 4
Can be equipped in corresponding chamber 3.For example, in Fig. 8（b）In, to electronic component 4 dimension D x value add Dx side
To value more than needed（δx1+δx2）Obtained from a size of one side in chamber 3 below minimum dimension d ε, and, to electronic component 4
The value of dimension D y of another side adds the value more than needed in Dy direction（δ y1+ δ y2））Obtained from a size of chamber 3 another side
During below small size d η, it is judged as that this electronic component 4 can be equipped in corresponding chamber 3.
Control device 40 judging part 40d in above-mentioned steps ST16 is judged as that the electronic component 4 being kept by boarded head 35 can
In the case of being equipped in corresponding chamber 3, revise the electronic component 4 detecting in step ST15 with respect to adsorption mouth 35a
Dislocation, and by this electronic component 4 in step ST12 set electronic component 4 loading position（In chamber 3）Carry, judging
In the case that portion 40d is judged as that the electronic component 4 being kept by boarded head 35 can not be equipped in corresponding chamber 3, control device 40
Stop this electronic component 4 to the carrying in chamber 3, and discard the discard bin 42 of setting on base station 31（Fig. 1）In（Shown in Fig. 7
Step ST17）.
After control device 40 finishes step ST17, carry out for predetermined all of electronic component 4 step being equipped on substrate 2
The judgement whether process of rapid ST14～step ST17 finishes（Step ST18 shown in Fig. 7）.And, as a result, to
In the case of the predetermined above-mentioned process of all of electronic component 4 being equipped on substrate 2 is unclosed, return to step ST14, for also not
The electronic component 4 being processed is processed, and in the case that process above-mentioned for all of electronic component 4 finishes, terminates
A series of carrying operation, makes basal plate conveyer 32 carry out action, substrate 2 is downstream taken out of operation side.
So, the electronic component method for loading that the electronic component equipped system 1A of first embodiment is carried out is to use to possess
Check the inspection 34 of photographing unit 34a and possess substrate identification camera（Second substrate identification camera 38）Boarded head 35,
Carry the electronic component method for loading of electronic component 4 to the respective inside in multiple chambeies 3 located at substrate 2, including：Using inspection head
The inspection photographing unit 34a that 34 possess identifies multiple located at substrate 2 respectively（Here, being two）Reference mark 2m and multiple chamber 3
And calculate the center calculation process of the relative position relation between reference mark 2m and the center in each chamber 3（Step ST1
～step ST4）；The substrate identification camera being possessed using boarded head 35（Second substrate identification camera 38）Identification is located at substrate
2 multiple reference marks 2m and calculate the boarded head shifting axle frame of reference on the basis of the shifting axle of boarded head 35（XY sits
Mark system）In each reference mark 2m position, the position of each reference mark 2m being calculated based on this and center calculation process
In the relative position relation that calculates, obtain the center in each chamber 3 in the boarded head shifting axle frame of reference, this obtained
The center in each chamber 3 is set as that the electronic component loading position of the loading position of electronic component 4 sets operation（Step ST11～
Step ST13）；And keep electronic component 4 using boarded head 35, this electronic component 4 keeping is equipped on electronic component and carries
The electronic component that position sets the loading position of electronic component 4 setting in operation carries operation（Step ST14～step
ST17）.
In the electronic component method for loading of first embodiment, reality identifies that the carrying of electronic component 4 is obtained in each chamber 3
Relative position relation between reference mark 2m that the setting of position is used and the center in each chamber 3, therefore, even if in base
Plate 2 deforms, the situation of the center in the center off-design data of the reality in each chamber 3 during the carrying of electronic component 4
Down it is also possible to reliably carry electronic component 4 into each chamber 3.
In addition, in above-mentioned example, coating head 24 possesses transfer pin 24a, by the inside in its leading section each chamber 3 of insertion
Coating adhesive B, but replace this composition, coating head 24 can also possess the ejection nozzle discharging bonding agent B（Not shown）, should
The inside in each chamber 3 is inserted and coating adhesive B in the front end of ejection nozzle.
（Second embodiment）
Fig. 9 represents the electronic component equipped system 1B of second embodiment of the invention.This electronic component equipped system 1B with
The electronic component equipped system 1A of first embodiment is the same, in the horizontal direction（X-direction）Carrying substrate 2, and to located at base
The respective internal carrying electronic component 4 in multiple chambeies 3 of plate 2, it is made up of an electronic component loading device 50.
Electronic component loading device 50 be provided with base station 51 along X-direction carrying substrate 2 basal plate conveyer 52 and
Upstream side and downstream are respectively provided with one and first embodiment identical head moving mechanism 33.Head moving mechanism in upstream side
It is provided with 33 1 mobile stations 33c and possess the transfer pin 53a's extending downwards as the coating head 24 of first embodiment
Coating head 53, is provided with the inspection 34 as first embodiment in another mobile station 33c.In addition, the head in downstream
Two mobile stations 33c of travel mechanism 33 are separately installed with the boarded head 35 with first embodiment same structure.
Coating head 53 possesses and will shoot visual field direction as the first substrate identification camera 25 of first embodiment
The first substrate identification camera 54 of lower section, by the action of head moving mechanism 33, on the basis of the shifting axle of coating head 53
The coating head shifting axle frame of reference（XY coordinate system）Middle movement is freely.
Buanch unit 26 with first embodiment same structure is provided with base station 51, the downstream one on base station 51
The both ends of half end relative along Y direction are provided with the feed appliance 36 as first embodiment.In these feedings
It is provided between device 36 and basal plate conveyer 52 and the component recognition camera 37 as first embodiment.
Inspection 34 is possessed as first embodiment and will shoot visual field inspection photographing unit 34a downward, carries
35 are possessed as first embodiment and extend through downwards adsorption mouth 35a that vacuum pressure absorption keeps electronic component 4
With will shoot visual field second substrate identification camera 38 downward.
The action of the head moving mechanism 33 of upstream side is passed through in inspection 34, in the inspection on the basis of the shifting axle of inspection 34
Look into a shifting axle frame of reference（XY coordinate system）Middle movement is freely.Equally, two boarded heads 35 are respectively by the head in downstream
The action of travel mechanism 33, in the boarded head shifting axle frame of reference on the basis of the shifting axle of boarded head 35（XY coordinate system）
Middle movement is freely.
In Fig. 10, the carrying of substrate 2 that basal plate conveyer 52 is carried out and location action, two head moving mechanisms 33 are carried out
Coating head 53, check 34 and two boarded heads 35 shift action, check the shooting of a 34 inspection photographing unit 34a possessing
Action, the shooting action of first substrate identification camera 54, the shooting action of two second substrate identification cameras 38, carry out each
The action of adsorbing mechanism 39 of setting and two element identifications in each boarded head 35 of the absorption to electronic component 4 for adsorption mouth 35a
The control device 60 that each control of the shooting action of photographing unit 37 is possessed by electronic component loading device 50 is carried out.
Control device 6, after detecting and having put into this situation of substrate 2 from other devices of upstream process side, carries out substrate
The action control of conveyer 52, this substrate 2 is transported to the job position in region central authorities of the upstream side half of base station 51 and enters
Row positioning.And, carry out the situation identical inspection operation with first embodiment using inspection 34.
That is, control device 60 makes inspection 34 be positioned above the substrate 2 of job position to move, and is taken a picture using checking
Machine 34a shoots two reference marks 2rn located at substrate 2, based on the view data obtaining, in substrate identification part 60a（Figure 10）
Calculate the position of each reference mark 2m（Step ST1 shown in Fig. 6）.In addition, control device 60 is using inspection photographing unit 34a respectively
Shoot located at multiple chambeies 3 of substrate 2, based on the view data obtaining, in chamber identification part 60b（Figure 10）Calculate the corner in each chamber 3
Position（Step ST2 shown in Fig. 6）.And, based on the corner location in each chamber 3 calculating, calculate the center in each chamber 3（Fig. 6
Shown step ST3）.
In addition, here, the corner location in the position of calculate in step ST2 two reference marks 2m and each chamber 3 and
Inspection head shifting axle benchmark on the basis of the shifting axle of inspection 34 is sat by the center in each chamber 3 calculating in step ST3
Mark system（XY coordinate system）Obtain as benchmark.
Position after control device 60 finishes above-mentioned steps ST3, based on two reference marks 2m calculating in step ST1
The center in each chamber 3 put and calculate in step ST3, calculates the phase between reference mark 2m and the center in each chamber 3
To position relationship, it is stored in the relative position relation storage part 61a of the storage device 61 being connected with control device 60（Figure 10）（Figure
Step ST4 shown in 6）.
Here, the relative position relation being stored in relative position relation storage part 61a in above-mentioned steps ST4 can also be
Substrate fixed coordinate system on the basis of two reference marks 2m obtained in step ST1（ε η coordinate system）In coordinate P1（ε
1、η1）Or given in advance as information substrate and be stored in the information substrate storage part 61b of storage device 61（Figure
10）The center P0 in each chamber 3 as substrate design data coordinate（ε0、η0）And with this center P0（ε0、η0）
Departure △ P（△ε、△η）Combination（ε 0+ △ ε, η 0+ △ η）Data.
After control device 60 finishes step ST4（Or it is parallel with step ST4）, based on each chamber 3 calculating in step ST2
Corner location, obtain the axial minimum dimension d η of ε axial minimum dimension d ε and η, calculate each chamber 3 using these sizes
Interior shape size and be stored in the intracavity shape size storage part 61c of storage device 61（Step ST5 shown in Fig. 6）.Thus, check
Operation terminates.
After control device 60 finishes above-mentioned inspection operation, the painting process shown in flow chart of execution Figure 11.Applying
In cloth operation, control device 60 makes coating head 53 move to the top of substrate 2, is set using first substrate identification camera 54
In the shooting of two reference marks 2m of substrate 2, based on the view data obtaining, in substrate identification part, 60a calculates each fiducial mark
The position of note 2m（Step ST21 shown in Figure 11）.And, the position of each reference mark 2m being calculated based on this, in inspection operation
Step ST4 in relative position relation between reference mark 2m that calculates and the center in each chamber 3, calculate with coating head 53
Shifting axle on the basis of the coating head shifting axle frame of reference（XY coordinate system）In each chamber 3 center P（Shown in Figure 11
Step ST22）, the center P in each chamber 3 that this is calculated is set as that the application place of bonding agent B is stored in storage device
61 application place storage part 61d（Figure 10）（Step ST23 shown in Figure 11）.
After control device 60 sets the application place of bonding agent B as described above, carry out the head moving mechanism of upstream side
33 action control, makes coating head 53 mobile, in the application place of the bonding agent B setting, with the situation with first embodiment
Identical main points, using transfer pin 53a coating adhesive B（Step ST24 shown in Figure 11）.Thus, painting process terminates.
After control device 60 finishes above-mentioned painting process, make basal plate conveyer 52 action, make substrate 2 move to downstream
Half region central authorities job position and positioned.And, using two boarded heads 35, carry out and first embodiment
Situation identical carries operation.
That is, control device 60 carries out the action control of the head moving mechanism 33 in downstream, makes boarded head 35 upper to substrate 2
Fang Yidong, carries out the shooting of two reference marks 2m located at substrate 2, based on obtain using second substrate identification camera 38
View data, calculates the position of each reference mark 2m in substrate identification part 60a（Step ST11 shown in Fig. 7）.And, based on this
Phase between the position of each reference mark 2m calculating, reference mark 2m calculating in step ST4 and the center in each chamber 3
To position relationship, calculate the boarded head shifting axle frame of reference on the basis of the shifting axle of boarded head 35（XY coordinate system）In
The center P in each chamber 3（Step ST12 shown in Fig. 7）, the center P in each chamber 3 that this is calculated is set as electronic component 4
Loading position and be stored in the electronic component loading position storage part 61e of storage device 61（Figure 10）（Step shown in Fig. 7
ST13）.
After control device 60 sets the loading position of electronic component 4 as described above, make boarded head 35 mobile, make absorption
Mouth 35a adsorbs the electronic component 4 of feed appliance 36 supply and is kept（Step ST14 shown in Fig. 7）.And, with this holding
Electronic component 4, by way of component recognition camera 37 top, is made boarded head 35 mobile, is entered using component recognition camera 37
After the shooting of electronic component 4 that row is kept by boarded head 35, by element identification part 60c（Figure 10）Executive component identifies,
Acquirement will be equipped on the overall dimensions of the electronic component 4 in each chamber 3（Dx、Dy）Information（Step ST15 shown in Fig. 7）.Separately
Outward, should in the case of, the acquirement of the information of the overall dimensions of electronic component 4 is also by being carried out as follows, i.e. according to obtained from identification
The view data of electronic component 4 calculates the overall dimensions of electronic component 4, or the electronic component dimensions data reading storage device 41
Storage part 61f（Figure 10）The overall dimensions of storage（Dx、Dy）Data.
After control device 60 achieves the overall dimensions of electronic component 4 in step ST15, in judging part 60d（Figure 10）Will
The overall dimensions of electronic component 4 calculating in step ST15 are compared with the interior shape size in the chamber 3 corresponding to this electronic component 4,
Carry out whether electronic component 4 can be equipped on the judgement in corresponding chamber 3（Step ST16 shown in Fig. 7）.
In addition, here, the overall dimensions of electronic component 4 that obtain in step ST15 of the judging part 60d of control device 60
Plus when obtained from the value more than needed of regulation a size of below the interior shape size in the chamber 3 calculating in step ST5, it is judged as this electricity
Subcomponent 4 can be equipped in corresponding chamber 3.
Control device 60 judging part 60d in step ST16 is judged as that the electronic component 4 being kept by boarded head 35 can carry
In the case of in the corresponding chamber 3, this electronic component 4 is taken to the loading position of the electronic component 4 setting in step ST12
Carry, in the case that the electronic component 4 being judged as being kept by boarded head 35 can not be equipped in corresponding chamber 3, control device 60
Stop the discard bin 42 that setting on base station 31 discarded by this electronic component 4 to the carrying in chamber 3（Fig. 9）In（Step shown in Fig. 7
Rapid ST17）.
After control device 60 finishes step ST17, carry out for predetermined all of electronic component 4 step being equipped on substrate 2
The judgement whether process of rapid ST14～step ST17 finishes（Step ST18 shown in Fig. 7）.And, as a result, for
In the case of the predetermined above-mentioned process of all of electronic component 4 being equipped on substrate 2 is unclosed, return to step ST14, for also not
The electronic component 4 being processed is processed, and in the case that process above-mentioned for all of electronic component 4 finishes, terminates
A series of carrying operation, makes basal plate conveyer 52 action, substrate 2 is downstream taken out of operation side.
So, the electronic component method for loading that the electronic component equipped system 1B of second embodiment is carried out is to use to possess
Check checking 34, possessing the coating head 53 of first substrate identification camera 54 and possess second substrate identification of photographing unit 34a
The boarded head 35 of photographing unit 38, carries to located at the respective internal electronic component carrying electronic component 4 in multiple chambeies 3 of substrate 2
Method, including：Multiple located at substrate 2 using checking that a 34 inspection photographing unit 34a possessing identifies respectively（Here is two）
Reference mark 2m and multiple chamber 3 and calculate the center of the relative position relation between reference mark 2m and the center in each chamber 3
Position calculation operation（Step ST1～step ST4）；Using the first substrate identification camera 54 that coating head 53 possesses identify located at
Multiple reference marks 2m of substrate 2 and calculate the coating head shifting axle frame of reference on the basis of the shifting axle of coating head 53
（XY coordinate system）In each reference mark 2m position, the position of each reference mark 2m being calculated based on this and center are calculated
The relative position relation calculating in operation, obtains the center in each chamber 3 in the coating head shifting axle frame of reference, this is asked
The center in each chamber 3 going out is set as that the bonding agent application place of the application place of bonding agent B sets operation（Step ST21～
Step ST23）；Set the bonding agent application place coating bonding setting in operation using coating head 53 in bonding agent application place
The bonding agent painting process of agent B（Step ST24）；After bonding agent painting process, the second substrate that possessed using boarded head 35
Identification camera 38 identifies and calculates the carrying on the basis of the shifting axle of boarded head 35 located at multiple reference marks 2m of substrate 2
The head shifting axle frame of reference（XY coordinate system）In each reference mark 2m position, each reference mark 2m being calculated based on this
The relative position relation calculating in position and center calculation process, obtains each chamber in the boarded head shifting axle frame of reference
3 center, the center in each chamber 3 that this is obtained is set as that the electronic component of the loading position of electronic component 4 carries
Position sets operation（Step ST11～step ST13）；And set in operation in electronic component loading position using boarded head 35
The electronic component that the loading position of the electronic component 4 setting carries electronic component 4 carries operation（Step ST14～step ST17）.
In the electronic component method for loading of second embodiment, also reality identifies that taking of electronic component 4 is obtained in each chamber 3
Carry the relative position relation between reference mark 2m that used of setting of position and the center in each chamber 3, therefore, except terrible
To outside the situation identical effect with first embodiment additionally it is possible to bonding agent B always be coated the center in the chamber 3 of reality
Position, therefore, even if deforming in substrate 2, the center off-design data of the reality in each chamber 3 during the carrying of electronic component 4
On center in the case of it is also possible to obtain can into each chamber 3 reliably coating adhesive B further effect.
（3rd embodiment）
As shown in figure 12, the electronic component equipped system 1C of the 3rd embodiment becomes bonding agent apparatus for coating 70A, inspection
Device 70B and electronic component loading device 70C is successively from the upstream process lateral lower procedure side system constituting side by side.?
This, bonding agent apparatus for coating 70A be to possess the coating head 24 same with the bonding agent apparatus for coating 11 of first embodiment and to
The device of each chamber 3 coating adhesive B of substrate 2.Check device 70B is the electronic component carrying dress possessing with first embodiment
Put the same inspection 34 of electronic component loading device 50 of 12 or second embodiment, in executing in above-mentioned inspection operation
Heart position calculation operation（Step ST1～step ST4）With intracavity shape Size calculation operation（Step ST2 and step ST5）Device.
In addition, electronic component loading device 70C is electronic component loading device 12 or the second embodiment party possessing with first embodiment
The same boarded head 35 of the electronic component loading device 50 of formula, the electronic component loading position executing in above-mentioned carrying operation sets
Determine operation（Step ST11～step ST13）Carry operation with electronic component（Step ST14～step ST17）Device.
In first embodiment and second embodiment, the device of implementation center's position calculation operation and execution electronics are first
Part loading position sets operation and the device of electronic component carrying operation is made up of same device（It is electronics in first embodiment
Element mounting device 12, is electronic component loading device 50 in second embodiment）, but like this, even if implementation center position
The device of calculation process（Check device 70B）Set operation with execution electronic component loading position and electronic component carries operation
Device（Electronic component loading device 70C）It is different devices it is also possible to implementing the electronic component method for loading of the present invention and obtaining
To the situation identical effect with first embodiment, second embodiment.
In addition, in this case, need to pass through check device 70B implementation center to electronic component loading device 70C transmitting-receiving
Position calculation operation（Step ST1～step ST4）And the data of the center in each chamber 3 calculating and pass through check device 70B
Execution intracavity shape Size calculation operation（Step ST2 and step ST5）And the data of the interior shape size in each chamber 3 calculating, therefore, such as
Shown in Figure 12, the upper level computer CP being connected with both check device 70B and electronic component loading device 70C is set and enters
The transmitting-receiving of the above-mentioned data of row.Or it is also possible to not via this upper level computer CP, and from check device 70B directly to electricity
Subcomponent loading device 70C sends above-mentioned data.
Industrial applicability
Even if the present invention is provided in that case of substrate deformation it is also possible to reliably carry electronic component to each intracavity
Electronic component method for loading.
Claims (4)
1. a kind of electronic component method for loading, is the electronic component method for loading that electronic component equipped system is carried out, described electronics
Element mounting system using the inspection head possessing inspection photographing unit and possesses the boarded head of substrate identification camera to located at substrate
Multiple chambeies respective internal carry electronic component, described electronic component method for loading is characterised by, including：
Center calculation process, using the described described inspection photographing unit checking that head possesses, identifies respectively located at described substrate
The respective corner location of multiple reference marks and the plurality of chamber, calculate the center of described reference mark and each described chamber
Between relative position relation；
Intracavity shape Size calculation operation, based on the corner location in each chamber calculating in the calculation process of described center, calculates each
The interior shape size in chamber；
Electronic component loading position sets operation, is identified located at institute using the described substrate identification camera that described boarded head possesses
State the plurality of reference mark of substrate, calculate the boarded head shifting axle reference coordinate on the basis of the shifting axle of described boarded head
The position of the described each reference mark in system, the position of each described reference mark being calculated based on this and described center are calculated
The described relative position relation calculating in operation, obtains the center in the described each chamber in the described boarded head shifting axle frame of reference
Position, the center in described each chamber that this is obtained is set as the loading position of electronic component；And
Electronic component carries operation, by calculate in the overall dimensions of described electronic component and described intracavity shape Size calculation operation
The interior shape size in chamber compares, in the case of being judged as that described electronic component can be equipped on corresponding described intracavity, using institute
State boarded head and described electronic component is equipped on the described electronic component that described electronic component loading position sets setting in operation
Loading position.
2. a kind of electronic component method for loading, is the electronic component method for loading that electronic component equipped system is carried out, described electronics
Element mounting system checks checking head, possess the coating head of first substrate identification camera and possessing the of photographing unit using possessing
The boarded head of two substrate identification cameras, to located at the respective internal carrying electronic component in multiple chambeies of substrate, described electronics unit
Part method for loading is characterised by, including：
Center calculation process, using the described described inspection photographing unit checking that head possesses, identifies respectively located at described substrate
Multiple reference marks and the plurality of chamber, calculate the relative position between described reference mark and the center in described each chamber
Relation；
Bonding agent application place sets operation, the described first substrate identification camera identification being possessed using described coating head located at
The plurality of reference mark of described substrate, calculates the coating head shifting axle benchmark on the basis of the shifting axle of described coating head and sits
The position of the described each reference mark in mark system, the position of the described each reference mark being calculated based on this and described center meter
Calculate the described relative position relation calculating in operation, obtain in the described each chamber in the described coating head shifting axle frame of reference
Heart position, the center in described each chamber that this is obtained is set as the application place of bonding agent；
Bonding agent painting process, using described coating head, sets the described of setting in operation to described bonding agent application place and glues
Connect agent application place coating adhesive；
Electronic component loading position sets operation, after described bonding agent painting process, possessed using described boarded head described in
Second substrate identification camera, identification, located at the plurality of reference mark of described substrate, calculates with the movement of described boarded head
The position of the described each reference mark in the boarded head shifting axle frame of reference on the basis of axle, the described each base being calculated based on this
The described relative position relation calculating in the position of fiducial mark note and described center calculation process, obtains described boarded head and moves
The center in the described each chamber in the axle frame of reference, the center in described each chamber that this is obtained is set as electronic component
Loading position；
Electronic component carries operation, using described boarded head, sets, to described electronic component loading position, the institute setting in operation
The loading position stating electronic component carries electronic component.
3. electronic component method for loading as claimed in claim 2 makes bonding agent adhere to it is characterised in that described coating head possesses
The transfer pin that shifted in lower end and constitute, the front end of described transfer pin is inserted the inside in described each chamber and is coated with bonding
Agent.
4. electronic component method for loading as claimed in claim 2 discharges bonding agent it is characterised in that described coating head possesses
Ejection nozzle and constitute, the inside in described each chamber is inserted and coating adhesive in the front end of described ejection nozzle.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012037103A JP5927490B2 (en) | 2012-02-23 | 2012-02-23 | Electronic component mounting method |
| JP2012-037103 | 2012-02-23 |
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| Publication Number | Publication Date |
|---|---|
| CN103298328A CN103298328A (en) | 2013-09-11 |
| CN103298328B true CN103298328B (en) | 2017-03-01 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201210479216.1A Active CN103298328B (en) | 2012-02-23 | 2012-11-22 | Electronic component method for loading |
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| JP (1) | JP5927490B2 (en) |
| CN (1) | CN103298328B (en) |
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| KR101704124B1 (en) * | 2014-10-24 | 2017-02-07 | 세메스 주식회사 | Apparatus for handling semiconductor devices and method of acquiring location information of the semiconductor devices using the same |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000277990A (en) * | 1999-03-24 | 2000-10-06 | Matsushita Electric Ind Co Ltd | Apparatus and method for mounting electronic component |
| CN1720769A (en) * | 2002-12-02 | 2006-01-11 | 松下电器产业株式会社 | Parts mounting device and method |
| CN101026952A (en) * | 2006-02-16 | 2007-08-29 | 重机公司 | Electronic component mounting method and device |
| CN101385409A (en) * | 2006-04-13 | 2009-03-11 | 松下电器产业株式会社 | Electronic components mounting system, placement state inspecting apparatus, and electronic components mounting method |
| JP2011082242A (en) * | 2009-10-05 | 2011-04-21 | Panasonic Corp | Electronic component mounting device and electronic component mounting method |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3417277B2 (en) * | 1997-11-28 | 2003-06-16 | 松下電器産業株式会社 | How to set bond application position |
| JP3848967B2 (en) * | 2006-04-10 | 2006-11-22 | 株式会社日立ハイテクインスツルメンツ | Electronic component automatic mounting device |
-
2012
- 2012-02-23 JP JP2012037103A patent/JP5927490B2/en not_active Expired - Fee Related
- 2012-11-22 CN CN201210479216.1A patent/CN103298328B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000277990A (en) * | 1999-03-24 | 2000-10-06 | Matsushita Electric Ind Co Ltd | Apparatus and method for mounting electronic component |
| CN1720769A (en) * | 2002-12-02 | 2006-01-11 | 松下电器产业株式会社 | Parts mounting device and method |
| CN101026952A (en) * | 2006-02-16 | 2007-08-29 | 重机公司 | Electronic component mounting method and device |
| CN101385409A (en) * | 2006-04-13 | 2009-03-11 | 松下电器产业株式会社 | Electronic components mounting system, placement state inspecting apparatus, and electronic components mounting method |
| JP2011082242A (en) * | 2009-10-05 | 2011-04-21 | Panasonic Corp | Electronic component mounting device and electronic component mounting method |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103298328A (en) | 2013-09-11 |
| JP5927490B2 (en) | 2016-06-01 |
| JP2013172130A (en) | 2013-09-02 |
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