JP3417277B2 - How to set bond application position - Google Patents

Description

Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for setting a bond application position for bonding electronic components. 2. Description of the Related Art A bond applicator for applying a bond for bonding an electronic component to a substrate is mounted on a substrate by moving a bond applicator horizontally relative to the substrate while holding a bond near an electrode on the substrate. A bond is applied to the application point. The position data of the bond application point is registered in advance in the bond application position data storage unit of the control unit. However, even if the bond is applied to the substrate according to the registered position data, the bond is applied to a correct position. Not necessarily. Therefore, before applying the bond to the substrate by the bond applying device, the correctness of the position data is confirmed, and if incorrect, the position data is corrected. Conventionally, correction of position data has been performed as follows. First, position data of a bond application point is created by CAD data or actual measurement. Next, a test bond is actually applied to the substrate according to the position data. Then, the operator inspects the test-applied substrate and confirms whether or not the bond is applied at a correct position near the electrode. In the case of NG, the created data such as CAD data is corrected. [0004] However, the above-mentioned conventional method requires time since a bond must be actually applied to a substrate by trial application, and the bond and substrate for trial application are wasted. There was a problem. The number of bond application points is generally several hundred per substrate, and more than 1,000 at most. However, the operator holds the substrate in his hand and puts a large number of fine bonds test-coated on the substrate one by one. Since the inspection had to be performed, a great deal of labor was required, and it was easy to make an inspection mistake. Also N
In the case of G, the numerical value must be input again, so that this work also requires a great deal of labor and time. SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to provide a method for setting a bond application position that can easily and accurately correct the position data of a bond application point with light work. According to the present invention, there is provided a method for setting a bond application position, comprising the steps of: setting a camera provided integrally with a bond application device in accordance with position data registered in advance in a bond application position data storage unit; By driving the moving table, it is moved horizontally relative to the substrate and positioned above the bond application point, where the camera observes the substrate to project the substrate electrodes on the monitor screen and stores the virtual bond diagram. Projecting the virtual bond mark registered in advance on the monitor screen, and judging the magnitude of the positional deviation between the electrode and the virtual bond mark by looking at the monitor screen, and if OK, bond coating the position data. In the case of NG, the electrode is moved relative to the virtual bond mark by operating the operation unit to register the electrode at the virtual bond mark. By aligning, the position data registered in the bond application position data storage unit is corrected and registered. According to the present invention having the above-described structure, the magnitude of the relative displacement between the virtual bond mark and the electrode on the substrate is determined by looking at the electrode on the substrate. In the case of NG, the position data is corrected by performing a screen operation to correct the relative displacement between the virtual bond mark and the electrode. Therefore, the position data can be easily and accurately corrected, and correct position data can be set. Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a perspective view of a bond coater according to an embodiment of the present invention, FIG. 2 is a front view of a monitor television of the bond coater, FIG. 3 is a block diagram of the bond coater, and FIG. FIG. 5 is a position data diagram of the bond application registered in the bond application position data storage unit, FIG. 5 is a flowchart of a setting operation of the bond application position of the bond application device, and FIG. 6 is a monitor screen of the bond application device. First, the structure of a bond coating device will be described with reference to FIG. Reference numeral 1 denotes a moving table, which comprises an X table 2 and a Y table 3 which are orthogonal to each other. The X table 2 is driven by a motor 4, and the Y table 3 is driven by a motor 5. The head 6 is mounted on the Y table 3. A holder 7 is mounted on the head unit 6, and the holder 7 holds a bond applicator 8 and a camera 10. A nozzle 9 is mounted below the bond applicator 8. The bond applicator 8 is connected to the gas pressure applicator 12 through the tube 11, and when the valve 17 is operated to apply gas pressure from the gas pressure applicator 12, the bond stored in the bond applicator 8 is transferred to the nozzle 9. Is discharged from the lower end of the. The head unit 6 has built-in vertical movement means such as a motor 13 for moving the holder 7 up and down. Reference numeral 14 denotes a substrate on which electrodes 15 are formed. Although a large number of electrodes 15 are formed on the substrate 14, FIG.
Here, only one set of electrodes 15 is shown. The substrate 14 is placed on a table 16. By driving the X table 2 and the Y table 3 to move the head unit 6 horizontally with respect to the substrate 14, the bond applicator 8 is positioned above a predetermined coordinate position of the substrate 14. Then, by driving the motor 13 to move the nozzle 9 up and down, and applying gas pressure to the bond applicator 8 by the gas pressure applicator 12, the bond is discharged from the lower end of the nozzle 9 and applied to the substrate 14. . Alternatively, the bond applicator 8 may be fixed, and the substrate 14 may be horizontally moved with respect to the bond applicator 8 by using a moving table to apply a bond to a predetermined coordinate position on the substrate 14. A monitor television 30 is provided in this bond application apparatus.
Is attached. In FIG. 2, 31 is a monitor screen,
Reference numeral 32 denotes a touch-type direction key, and reference numeral 33 denotes a function key such as a registration key. Next, the control system will be described with reference to FIG.
Reference numeral 20 denotes a control unit such as a CPU. The monitor television 30 is connected to the control unit 20 via the display unit 21, and the camera 10 is connected to the control unit 20 via the recognition unit 22. The control unit 20 controls each of the motors 4, 5, and 13 via the motor drive unit 23. Further, a bond application position data storage unit 24 and a virtual bond diagram storage unit 25 are connected to the control unit 20. In the bond application position data storage unit 24,
Position data of the X coordinate and the Y coordinate of the bond application points P1 to Pn on the substrate 14 shown in FIG. 4 are registered. In the virtual bond diagram storage unit 25, a virtual bond mark is registered. This bond coating apparatus has the above-described configuration. Next, a method for setting the bond coating position will be described with reference to the flowchart of FIG. First, the moving table 1 is driven to move the bond application head 8 to the first bond application point (P
The camera is moved to 1) (step 1), and the vicinity of the first point is displayed on the monitor screen 31 of the monitor television 30 by the camera 10 (step 2). The monitor screen 31 in FIG. 6A shows the state at this time. In the figure, reference numeral 15 denotes an electrode of the substrate 14 at the first bond application point P1. Q is a virtual bond mark registered in the virtual bond diagram storage unit 25. Next, a determination is made in step 3. FIG.
As shown in (a), in this example, the virtual bond mark Q is displaced from the electrode 15 to the upper right. Therefore, in step 4, data correction is performed. This modification is shown in FIG.
Is performed by touching the direction key 32 to move the electrode 15 relative to the virtual bond mark Q in the X direction or the Y direction. FIG. 6B shows the monitor screen 3 after the correction.
1, the virtual bond mark Q is located at an intermediate position between the electrodes 15. At the same time, the data shown in FIG. 4 is rewritten based on the amount of movement of the electrode 15 in the X and Y directions. In this example, the X coordinate of the first bond application point P1 is rewritten from 8 to 11, and the Y coordinate is rewritten from 7 to 5. When the registration key 33 is operated, the rewritten data is registered in the bond application position data storage unit 24 as correction data (step 5). If it is OK in step 3, the data is registered without rewriting the data. The above operation is repeated for all bond application points (steps 6 and 7). According to the present invention, the magnitude of the relative displacement between the two is determined by looking at the virtual bond mark projected on the monitor screen and the electrode on the substrate. In the case of NG, the position data is corrected by operating the screen to correct the relative displacement between the virtual bond and the electrode. Therefore, the position data can be easily and accurately corrected, and correct position data can be set.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a perspective view of a bond coating device according to an embodiment of the present invention. FIG. 2 is a front view of a monitor television of the bond coating device according to an embodiment of the present invention. FIG. 4 is a block diagram of a bond application apparatus according to an embodiment of the present invention; FIG. 4 is a position data diagram of bond application registered in a bond application position data storage unit of the bond application apparatus according to an embodiment of the present invention; Flow chart of setting operation of the bond application position of the bond application apparatus according to the embodiment of the present invention. FIG. 6 is a monitor screen view of the bond application apparatus according to the embodiment of the present invention. Device 9 nozzle 10 camera 14 substrate 15 electrode 30 monitor television 31 monitor screen Q virtual bond mark

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Claims (1)

(57) [Claims 1] According to position data registered in advance in a bond application position data storage unit, a camera provided integrally with the bond applicator is moved relative to a substrate by driving a moving table. It is relatively horizontally moved and positioned above the bond application point, where the substrate is observed with a camera to project the electrodes of the substrate on the monitor screen and the virtual bond mark registered in the virtual bond diagram storage unit in advance. Is projected on the monitor screen, and the size of the positional deviation between the electrode and the virtual bond mark is determined by looking at the monitor screen. In the case of OK, the position data is directly registered in the bond application position data storage unit, In the case of NG, the operation portion is operated to move the electrode relative to the virtual bond mark to align the electrode with the virtual bond mark, thereby obtaining the bond application position data. Setting the bond coating position and registers to correct the position data registered in the data storage unit.