JPH1126495A - Adjusting method of camera offset in wire bonding - Google Patents
Adjusting method of camera offset in wire bondingInfo
- Publication number
- JPH1126495A JPH1126495A JP9182017A JP18201797A JPH1126495A JP H1126495 A JPH1126495 A JP H1126495A JP 9182017 A JP9182017 A JP 9182017A JP 18201797 A JP18201797 A JP 18201797A JP H1126495 A JPH1126495 A JP H1126495A
- Authority
- JP
- Japan
- Prior art keywords
- camera
- capillary tool
- wire
- bonding
- wire bonding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/02—Bonding areas ; Manufacturing methods related thereto
- H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L24/06—Structure, shape, material or disposition of the bonding areas prior to the connecting process of a plurality of bonding areas
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/04042—Bonding areas specifically adapted for wire connectors, e.g. wirebond pads
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
- H01L2224/0555—Shape
- H01L2224/05552—Shape in top view
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/494—Connecting portions
- H01L2224/4943—Connecting portions the connecting portions being staggered
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78301—Capillary
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7865—Means for transporting the components to be connected
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01004—Beryllium [Be]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01005—Boron [B]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01006—Carbon [C]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01015—Phosphorus [P]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01039—Yttrium [Y]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/1015—Shape
- H01L2924/1016—Shape being a cuboid
- H01L2924/10162—Shape being a cuboid with a square active surface
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、チップと基板をワ
イヤで接続するワイヤボンディングにおけるカメラオフ
セットの調整方法に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for adjusting a camera offset in wire bonding for connecting a chip and a substrate with wires.
【０００２】[0002]
【従来の技術】プリント基板やリードフレームなどの基
板のパッドと、これに搭載されたチップのパッドをワイ
ヤで接続するワイヤボンディング装置は、ホーンの先端
部に保持されたキャピラリツールにワイヤを挿通し、キ
ャピラリツールを水平移動させながら、ワイヤボンディ
ングを行うようになっている。2. Description of the Related Art A wire bonding apparatus for connecting a pad of a substrate, such as a printed board or a lead frame, to a pad of a chip mounted thereon with a wire, inserts the wire through a capillary tool held at the tip of a horn. The wire bonding is performed while the capillary tool is horizontally moved.
【０００３】基板やチップのパッドは微小であって狭ピ
ッチで多数個形成されており、ワイヤはこれらのパッド
上に位置ずれなく正確にボンディングしなければならな
い。そこでワイヤボンディング装置にはキャピラリツー
ルと一体的に水平移動するカメラが備えられており、キ
ャピラリツールによるワイヤボンディング動作を一時的
に適宜中断し、カメラをワイヤのボンディング点の上方
へ移動させ、カメラでボンディング点を観察してボンデ
ィング点の位置ずれの有無を点検するようになってい
る。そしてボンディング点に位置ずれが生じている場合
には、キャピラリツールの水平方向の移動ストロークを
調整することにより、この位置ずれを補正するようにな
っている。A large number of pads on a substrate or a chip are formed at a small pitch with a small pitch, and wires must be bonded accurately on these pads without displacement. Therefore, the wire bonding apparatus is provided with a camera that horizontally moves integrally with the capillary tool, temporarily suspends the wire bonding operation by the capillary tool, moves the camera to above the bonding point of the wire, and uses the camera. By observing the bonding points, it is checked whether there is any displacement of the bonding points. When a displacement occurs at the bonding point, the displacement is corrected by adjusting the horizontal movement stroke of the capillary tool.
【０００４】ボンディング対象物である基板はボンディ
ングを容易に行うためにヒートブロックなどの加熱手段
により加熱されており、その放熱によりホーンは次第に
加熱されて熱膨張することから、ホーンの長さ方向にお
けるボンディング点に位置ずれが生じやすいものであ
り、このためワイヤボンディング装置では、上記カメラ
によるボンディング点の点検はかなり頻繁に行われる。[0004] The substrate to be bonded is heated by a heating means such as a heat block in order to easily perform bonding, and the horn is gradually heated and thermally expanded by the heat radiation. The bonding point is apt to be displaced. Therefore, in the wire bonding apparatus, the inspection of the bonding point by the camera is performed quite frequently.
【０００５】[0005]
【発明が解決しようとする課題】ところで近年は、小型
高集積化の要請からパッドの大きさは益々微小化する傾
向にある。このためカメラでボンディング点を観察して
も、ボンディング点の位置ずれ量を正確に求めにくくな
っている。In recent years, however, the size of pads has tended to be further reduced due to the demand for smaller and higher integration. For this reason, even if the bonding point is observed with a camera, it is difficult to accurately determine the positional deviation amount of the bonding point.
【０００６】そこで本発明は、微小化したパッド上のボ
ンディング点の位置ずれを正確に検出できるワイヤボン
ディングにおけるカメラオフセットの調整方法を提供す
ることを目的とする。SUMMARY OF THE INVENTION It is an object of the present invention to provide a method for adjusting a camera offset in wire bonding, which can accurately detect a displacement of a bonding point on a miniaturized pad.
【０００７】[0007]
【課題を解決するための手段】本発明は、先端部にキャ
ピラリツールを保持するホーンと、チップが搭載された
基板を加熱する加熱手段と、キャピラリツールと一定の
オフセット位置にあってキャピラリツールと一体的に水
平移動するカメラとを備え、キャピラリツールを水平移
動させながらキャピラリツールに挿通されたワイヤでチ
ップのパッドと基板のパッドをワイヤで接続するワイヤ
ボンディング装置において、ワイヤボンディング動作を
一時的に中断してカメラをワイヤのボンディング点の上
方へ移動させ、カメラでボンディング点を観察してオフ
セットの点検を行うにあたり、カメラで観察されたボン
ディング点をソフト処理により拡大してモニタ画面に映
出し、モニタ画面上のボンディング点にカメラの基準部
を合わせることによりオフセットの点検を行い、点検結
果にしたがってオフセットの修正を行う。According to the present invention, there is provided a horn for holding a capillary tool at a tip end, heating means for heating a substrate on which a chip is mounted, and a capillary tool which is at a predetermined offset position from the capillary tool. A camera that horizontally moves in an integrated manner, and temporarily moves the wire bonding operation in a wire bonding apparatus that connects a chip pad and a board pad with a wire inserted through the capillary tool while horizontally moving the capillary tool. Pause and move the camera above the bonding point of the wire, observe the bonding point with the camera and check the offset, and expand the bonding point observed by the camera by software processing and project it on the monitor screen, Aligning the camera reference to the bonding point on the monitor screen Ri carried out inspection of the offset, to correct the offset in accordance with the inspection results.
【０００８】[0008]
【発明の実施の形態】上記構成の発明は、カメラでボン
ディング点を観察してモニタ画面に映出するときに、こ
のボンディング点を拡大してモニタ画面に映出し、ボン
ディング点にカメラの基準部を合わせるようにしている
ので、微小なパッド上の微小なボンディング点であって
も、カメラのオフセット値を正確に修正し、以後、この
修正されたオフセット値に基づいて正確なワイヤボンデ
ィングを行うことができる。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS According to the invention having the above structure, when a bonding point is observed by a camera and projected on a monitor screen, the bonding point is enlarged and projected on the monitor screen, and a camera reference portion is placed on the bonding point. The camera offset value must be accurately corrected even for a very small bonding point on a very small pad, and thereafter, accurate wire bonding should be performed based on this corrected offset value. Can be.
【０００９】以下、本発明の実施の形態を図面を参照し
て説明する。図１は、本発明の一実施の形態のワイヤボ
ンディング装置の斜視図、図２は同キャピラリツールと
カメラの位置関係を示す平面図、図３および図４は同モ
ニタテレビの画面図、図５は同ソフト処理の説明図であ
る。An embodiment of the present invention will be described below with reference to the drawings. 1 is a perspective view of a wire bonding apparatus according to an embodiment of the present invention, FIG. 2 is a plan view showing a positional relationship between the capillary tool and a camera, FIGS. 3 and 4 are screen views of the monitor television, and FIGS. Is an explanatory diagram of the software processing.
【００１０】図１において、１は基板であり、その上面
中央にチップ２が搭載されている。基板１は位置決めテ
ーブル３上に載置されている。位置決めテーブル３の内
部には、基板１を加熱する加熱手段４が内蔵されてい
る。５はワイヤボンディングの作業位置に配設されたマ
スクであり、シリンダ６のロッド６ａに保持されてい
る。マスク５は作業位置の基板１上にあって、基板１の
ボンディングエリアのみを露呈させる。In FIG. 1, reference numeral 1 denotes a substrate on which a chip 2 is mounted at the center of the upper surface. The substrate 1 is placed on a positioning table 3. A heating means 4 for heating the substrate 1 is built in the positioning table 3. Reference numeral 5 denotes a mask disposed at a work position for wire bonding, which is held by a rod 6 a of a cylinder 6. The mask 5 is on the substrate 1 at the working position and exposes only the bonding area of the substrate 1.
【００１１】１０はホーンであり、その先端部にキャピ
ラリツール１１を保持している。キャピラリツール１１
にはワイヤ７が挿通されている。ホーン１０の基端部は
駆動ボックス１２に挿入されている。駆動ボックス１２
の内部には、ホーン１０を上下方向に揺動させる駆動手
段が内蔵されている。駆動ボックス１２の上部にはブラ
ケット１３が装着されており、ブラケット１３の先端部
にはカメラ１４が装着されている。A horn 10 holds a capillary tool 11 at its tip. Capillary tool 11
Is passed through the wire 7. The base end of the horn 10 is inserted into the drive box 12. Drive box 12
A driving means for swinging the horn 10 in the up-down direction is built in the inside. A bracket 13 is mounted on the upper part of the drive box 12, and a camera 14 is mounted on a tip of the bracket 13.
【００１２】駆動ボックス１２は可動テーブル２０上に
設置されている。Ｘ軸モータ２１とＹ軸モータ２２が駆
動すると、駆動ボックス１２はＸ方向やＹ方向へ水平移
動し、これによりキャピラリツール１１とカメラ１４は
一体的に同方向へ水平移動する。２３はコンピュータな
どの制御部であり、Ｘ軸モータ２１やＹ軸モータ２２を
制御する。２４は入力部であり、操作キー２５などを備
えている。２６はモニタテレビである。入力部２４やモ
ニタテレビ２６は制御部２３に接続されている。The drive box 12 is set on a movable table 20. When the X-axis motor 21 and the Y-axis motor 22 are driven, the drive box 12 moves horizontally in the X and Y directions, whereby the capillary tool 11 and the camera 14 move horizontally in the same direction integrally. A control unit 23 such as a computer controls the X-axis motor 21 and the Y-axis motor 22. An input unit 24 includes operation keys 25 and the like. 26 is a monitor television. The input unit 24 and the monitor television 26 are connected to the control unit 23.
【００１３】このワイヤボンディング装置は上記のよう
な構成より成り、次にワイヤボンディング作業を説明す
る。図２において、キャピラリツール１１とカメラ１４
の光軸Ａの基準座標上の位置は予め求められており、カ
メラ１４の光軸Ａのキャピラリツール７に対する相対的
な位置は、オフセット値ＸａおよびＹａとして制御部２
３のメモリに登録されている。This wire bonding apparatus is constructed as described above. Next, the wire bonding operation will be described. In FIG. 2, a capillary tool 11 and a camera 14
The position of the optical axis A of the camera 14 on the reference coordinates is determined in advance, and the relative position of the optical axis A of the camera 14 with respect to the capillary tool 7 is defined as the offset values Xa and Ya by the control unit 2.
No. 3 is registered in the memory.
【００１４】さて図１において、基板１が位置決めテー
ブル３上の所定位置に位置決めされると、キャピラリツ
ール１１はＸ方向やＹ方向へ水平移動し、また上下動作
を行って、基板１のパッドとチップ２のパッドをワイヤ
７で次々に接続していく。この場合、カメラ１４でワイ
ヤ７のボンディング点を観察してボンディング位置を確
認し、上記オフセット値ＸａおよびＹａを加味してＸ軸
モータ２１とＹ軸モータ２２の駆動を制御し、キャピラ
リツール１１をＸ方向やＹ方向へ水平移動させながらワ
イヤボンディングを行う。In FIG. 1, when the substrate 1 is positioned at a predetermined position on the positioning table 3, the capillary tool 11 horizontally moves in the X and Y directions, and moves up and down to make contact with the pads of the substrate 1. The pads of the chip 2 are connected one after another by wires 7. In this case, the bonding position of the wire 7 is confirmed by observing the bonding point of the wire 7 with the camera 14, the driving of the X-axis motor 21 and the Y-axis motor 22 is controlled in consideration of the offset values Xa and Ya, and the capillary tool 11 is moved. Wire bonding is performed while moving horizontally in the X and Y directions.
【００１５】繰り返しワイヤボンディングを行う間に、
キャピラリツール１１の位置に位置ずれ（狂い）が生じ
る。この位置ずれの主因は、上述したように、位置決め
テーブル３に内蔵された加熱手段の放熱によりホーン１
０が加熱されてその長手方向に熱膨張することによる。
このようにキャピラリツール１１に位置ずれが生じる
と、オフセット値ＸａおよびＹａにも狂いが生じるので
オフセット値の補正を行う必要がある。During the repeated wire bonding,
The position of the capillary tool 11 is displaced (out of order). As described above, the main cause of this displacement is that the horn 1
0 is heated and thermally expanded in the longitudinal direction.
If the capillary tool 11 is displaced in this way, the offset values Xa and Ya also become inconsistent, and it is necessary to correct the offset value.
【００１６】そこで次のようにしてオフセット値の補正
作業を行う。すなわち、ワイヤボンディング作業を一時
的に適宜中断し、カメラ１４をボンディング点の上方へ
移動させ、ボンディング点を観察する。図３は、このよ
うにしてカメラ１４に取り込まれた画像を映出したモニ
タテレビ２６の画面を示している。図３において、９
ａ、９ｂはカメラ１４の視野内に設定された十字線であ
り、その交点がカメラ１４の光軸Ａであって位置合わせ
の基準部となる。Therefore, the offset value is corrected in the following manner. That is, the wire bonding operation is temporarily interrupted appropriately, the camera 14 is moved above the bonding point, and the bonding point is observed. FIG. 3 shows a screen of the monitor television 26 on which the image captured by the camera 14 is projected. In FIG. 3, 9
Reference numerals “a” and “9b” denote crosshairs set in the field of view of the camera 14, and the intersection thereof is the optical axis A of the camera 14 and serves as a reference portion for alignment.
【００１７】近年、基板１のパッド８は微小化する傾向
にあり、したがってパッド８にボンディングされたワイ
ヤ７のボール７ａの直径も小径化している。したがって
基準部Ａをボンディング点のセンター、すなわちボール
７ａのセンターに位置合わせしにくい。そこで図４に示
すように観察対象となるボール７ａを画面上で部分的に
拡大する。この拡大はコンピュータのソフト処理（後
述）により行われる。そしてオペレータは手作業により
カメラ１４をＸ方向やＹ方向へ微小移動させ、これによ
り十字線９ａ，９ｂを実線位置から鎖線位置へ移動させ
て光軸（基準部）Ａをボール７ａのセンターに合わせ
る。このときのＸ方向およびＹ方向の移動量ｘａおよび
ｙａがオフセット値Ｘａ、Ｙａの修正値となる。なお図
４において実線で示す十字線９ａ，９ｂは、補正前（図
３の状態）における十字線である。In recent years, the size of the pad 8 of the substrate 1 has been reduced, and the diameter of the ball 7a of the wire 7 bonded to the pad 8 has also been reduced. Therefore, it is difficult to align the reference portion A with the center of the bonding point, that is, the center of the ball 7a. Therefore, as shown in FIG. 4, the ball 7a to be observed is partially enlarged on the screen. This enlargement is performed by software processing of a computer (described later). Then, the operator manually moves the camera 14 minutely in the X direction or the Y direction, thereby moving the cross lines 9a and 9b from the solid line position to the chain line position, and aligning the optical axis (reference portion) A with the center of the ball 7a. . The movement amounts xa and ya in the X direction and the Y direction at this time are correction values of the offset values Xa and Ya. Note that the cross lines 9a and 9b indicated by solid lines in FIG. 4 are cross lines before correction (the state in FIG. 3).
【００１８】そこでこの移動量ｘａ、ｙａを修正値とし
て制御部２３のメモリに登録し、以後、この修正値ｘ
ａ、ｙａで修正されたオフセット値に基づいてキャピラ
リツール１１をＸ方向やＹ方向へ水平移動させてワイヤ
ボンディングを行う。Therefore, the movement amounts xa and ya are registered in the memory of the control unit 23 as correction values.
The wire bonding is performed by horizontally moving the capillary tool 11 in the X and Y directions based on the offset values corrected in a and ya.
【００１９】図５は、上記ソフト処理の一例を示してい
る。Ｐはフレームメモリ、ＱはフレームメモリＰに取り
込んだ画像、Ｇは画素である。図示するように、画像Ｑ
の上半分の画素Ａ，Ｂ，Ｃ・・・は左上から順にフレー
ムメモリＰに４画素づつコピーし、また下半分の画素
ａ，ｂ，ｃ・・・は左下から順に４画素づつコピーす
る。このようにしてフレームメモリＰに拡大されたデー
タをモニタテレビ２６に表示し、上記操作を行う。FIG. 5 shows an example of the software processing. P is a frame memory, Q is an image captured in the frame memory P, and G is a pixel. As shown, the image Q
.. Of the upper half are copied to the frame memory P in order of four pixels from the upper left, and the pixels a, b, c,... Of the lower half are copied four pixels in order from the lower left. The data expanded in the frame memory P in this manner is displayed on the monitor television 26, and the above operation is performed.
【００２０】[0020]
【発明の効果】本発明は、カメラでボンディング点を観
察してモニタ画面に映出するときに、このボンディング
点をソフト処理により拡大してモニタ画面に映出し、ボ
ンディング点にカメラの基準部を合わせるようにしてい
るので、微小なパッド上の微小なボンディング点であっ
ても、カメラのオフセット値を正確に修正し、以後、こ
の修正されたオフセット値に基づいて正確なワイヤボン
ディングを行うことができる。しかもボンディング点は
ソフト処理により拡大するので、装置自体の変更は格別
必要なく、コスト的にも有利である。According to the present invention, when a bonding point is observed with a camera and projected on a monitor screen, the bonding point is enlarged by software processing and projected on the monitor screen, and the camera reference portion is set at the bonding point. Since the camera is aligned, even at a very small bonding point on a very small pad, it is possible to accurately correct the camera offset value, and thereafter perform accurate wire bonding based on the corrected offset value. it can. Moreover, since the bonding point is expanded by software processing, there is no particular need to change the apparatus itself, which is advantageous in terms of cost.
【図１】本発明の一実施の形態のワイヤボンディング装
置の斜視図FIG. 1 is a perspective view of a wire bonding apparatus according to an embodiment of the present invention.
【図２】本発明の一実施の形態のワイヤボンディング装
置のキャピラリツールとカメラの位置関係を示す平面図FIG. 2 is a plan view showing a positional relationship between a capillary tool and a camera of the wire bonding apparatus according to one embodiment of the present invention.
【図３】本発明の一実施の形態のワイヤボンディング装
置のモニタテレビの画面図FIG. 3 is a screen view of a monitor television of the wire bonding apparatus according to the embodiment of the present invention.
【図４】本発明の一実施の形態のワイヤボンディング装
置のモニタテレビの画面図FIG. 4 is a screen view of a monitor television of the wire bonding apparatus according to one embodiment of the present invention.
【図５】本発明の一実施の形態のワイヤボンディング装
置のソフト処理の説明図FIG. 5 is an explanatory diagram of software processing of the wire bonding apparatus according to the embodiment of the present invention;
【符号の説明】 １ 基板 ２ チップ ３ 位置決めテーブル ７ ワイヤ ７ａ ボール ８ パッド １０ ホーン １１ キャピラリツール １４ カメラ ２０ 可動テーブル ２６ モニタテレビ Ａ 基準部[Description of Signs] 1 substrate 2 chip 3 positioning table 7 wire 7a ball 8 pad 10 horn 11 capillary tool 14 camera 20 movable table 26 monitor TV A reference section
Claims (1)
ンと、チップが搭載された基板を加熱する加熱手段と、
キャピラリツールと一定のオフセット位置にあってキャ
ピラリツールと一体的に水平移動するカメラとを備え、
キャピラリツールを水平移動させながらキャピラリツー
ルに挿通されたワイヤでチップのパッドと基板のパッド
をワイヤで接続するワイヤボンディング装置において、
ワイヤボンディング動作を一時的に中断してカメラをワ
イヤのボンディング点の上方へ移動させ、カメラでボン
ディング点を観察してオフセットの点検を行うにあた
り、カメラで観察されたボンディング点をソフト処理に
より拡大してモニタ画面に映出し、モニタ画面上のボン
ディング点にカメラの基準部を合わせることによりオフ
セットの点検を行い、点検結果にしたがってオフセット
の修正を行うことを特徴とするワイヤボンディングにお
けるカメラオフセットの調整方法。A horn for holding a capillary tool at a tip end; heating means for heating a substrate on which a chip is mounted;
Equipped with a capillary tool and a camera that is at a certain offset position and moves horizontally with the capillary tool,
In a wire bonding apparatus for connecting a chip pad and a substrate pad with a wire by a wire inserted into the capillary tool while horizontally moving the capillary tool,
Temporarily suspend the wire bonding operation, move the camera above the bonding point of the wire, observe the bonding point with the camera, and check the offset by expanding the bonding point observed by the camera by software processing. A method for adjusting a camera offset in wire bonding, wherein an offset is checked by adjusting a reference portion of the camera to a bonding point on the monitor screen, and the offset is corrected according to the check result. .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18201797A JP3379392B2 (en) | 1997-07-08 | 1997-07-08 | Adjustment method of camera offset in wire bonding |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18201797A JP3379392B2 (en) | 1997-07-08 | 1997-07-08 | Adjustment method of camera offset in wire bonding |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH1126495A true JPH1126495A (en) | 1999-01-29 |
| JP3379392B2 JP3379392B2 (en) | 2003-02-24 |
Family
ID=16110889
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18201797A Expired - Fee Related JP3379392B2 (en) | 1997-07-08 | 1997-07-08 | Adjustment method of camera offset in wire bonding |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3379392B2 (en) |
-
1997
- 1997-07-08 JP JP18201797A patent/JP3379392B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JP3379392B2 (en) | 2003-02-24 |
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