JP2713687B2 - Paste coating machine - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a paste dispenser for applying and drawing a paste pattern of a desired shape on a substrate placed on a table, and more particularly to a paste dispenser having a nozzle fixed to a tip. The present invention relates to a paste dispenser that can be used.

[0002]

2. Description of the Related Art A substrate mounted on a table is opposed to a nozzle fixed to the tip of a paste storage cylinder in which paste is stored, and at least one of the nozzle and the table is discharged while discharging the paste from the nozzle. As a discharge drawing technique for applying a paste in a desired pattern on a substrate by moving the relative positional relationship by moving the paste, for example, a paste coating machine described in JP-A-2-52742 is known. . In such a paste applicator, an insulating substrate is used as a substrate, and a resistive paste is discharged from a paste discharge port at the tip of a nozzle onto the insulating substrate to form a resistive paste pattern of a desired shape on the insulating substrate.

[0003]

By the way, in the case of the paste applicator as in the above-mentioned prior art, the paste stored in the paste storage tube is used up sufficiently, and the paste is cut off during drawing of the next substrate. In some cases. In such a case, it is conceivable to fill the paste container with the paste prior to drawing on the next substrate. However, since such filling has a structural problem as a precision device, a new paste filled with the paste is required. It is common to be able to replace it with a storage tube. In this case, the nozzle is integrated with the paste container, and the nozzle is also replaced at the same time. Such replacement is hereinafter referred to as nozzle replacement.

However, if there is a slight variation in the processing accuracy of the paste storage cylinder and the nozzle and the mounting accuracy thereof, the above-mentioned nozzle replacement causes the position of the nozzle discharge port at the tip of the nozzle before and after the nozzle replacement. In many cases, it has become impossible to draw a paste pattern of a desired shape at a predetermined correct position on the substrate.

That is, when the nozzle is replaced during the pattern drawing, if the position of the nozzle outlet at the tip of the nozzle fluctuates due to the replacement of the nozzle, the end position of the pattern formed before replacement and the pattern after replacement are changed. Is displaced from the tip position. This poses a serious problem as the paste pattern to be drawn becomes thinner.

For example, with respect to the resistance pattern, there is a case where the pattern before the nozzle replacement and the pattern after the nozzle replacement partially overlap at a joint, or the pattern is displaced in the width direction and bent. In this case, the resistance value per unit length of the resistance pattern will be different,
In particular, if a gap occurs at the joint between the pattern before the nozzle replacement and the pattern after the nozzle replacement, the resistance pattern may be disconnected. When drawing and applying the sealant of the liquid crystal display device, the sealant may be interrupted, and in such a case, the liquid crystal cannot be sealed.

Further, when the same paste pattern is drawn on a plurality of substrates, the drawing positions of the paste patterns on these substrates must be the same. However, as described above, the position of the nozzle outlet at the tip of the nozzle is changed by replacing the nozzle. If there is a change, the position of the paste pattern formed on the substrate is shifted before and after the nozzle replacement, and the value as a product is lost. For example, in the case of a liquid crystal sealing substrate of a liquid crystal display device, if there is a misalignment in the pattern of the sealing material, when these substrates are overlapped, a part of the display pixel is located outside the pattern and a display cannot be performed correctly. There is a risk of becoming a device.

SUMMARY OF THE INVENTION An object of the present invention is to solve such a problem and to accurately apply and draw a paste pattern having a desired shape even if the positional relationship of a nozzle discharge port with respect to a substrate changes due to nozzle replacement or the like. It is an object of the present invention to provide an improved paste application machine.

[0009]

In order to achieve the above object, the present invention provides a first means for measuring the position of a paste discharge port of a nozzle when replacing the nozzle, A second means for calculating a displacement amount of the nozzle discharge port of the nozzle from the measurement result, and a third means for adjusting the position of the substrate according to the displacement amount obtained by the second means. Is provided.

Further, according to the present invention, a storage means for storing information indicating that the nozzle has been replaced is provided, and the first, second and third means are operated based on this information.

[0011]

When the nozzle is replaced, the position of the paste discharge port of the nozzle is measured by the first means, and based on the measurement result, the second means detects the amount of displacement from before the nozzle replacement. Is done. The position of the substrate or the nozzle is adjusted by the third means based on the detected amount. This eliminates nozzle misalignment before and after replacement.

When the nozzle is replaced, information indicating this is stored in the storage means. When a paste pattern of the same shape is drawn on a plurality of substrates, even if the nozzle is replaced in the middle, it is possible to know that the nozzle has been replaced by the information stored in the storage means,
When this information can be read from this storage means, the paste position can be drawn from the same position on each substrate by automatically performing the above-described nozzle position shift measurement and adjustment movement.

[0013]

Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a schematic perspective view showing one embodiment of a paste applicator according to the present invention, wherein 1 is a nozzle, 2 is a paste storage cylinder (or syringe), 3 is an optical distance meter, 4a is a Z-axis table, 4b Is the camera support, 5 is the X-axis table, 6
Is a Y-axis table, 7 is a substrate, 8 is a θ-axis table, 9 is a gantry, 10 is a Z-axis table support, 11a is an image recognition camera, 11b is a lens barrel of the image recognition camera 11a, 12 is a nozzle support, 13 is a suction table, 14 is a control device, and 15a to
Reference numeral 15c denotes a servo motor, 16 denotes a monitor, and 17 denotes a keyboard.

In FIG. 1, an X-axis table 5 is fixed on a gantry 9, and a Y-axis table 6 is mounted on the X-axis table 5 so as to be movable in the X-axis direction. On the Y-axis table 6, a θ-axis table 8 to which a suction table 13 is fixed so as to be movable in the Y-axis direction is mounted. The substrate 7 is mounted on the suction table 13 by suction, for example, such that each side thereof is parallel to the X and Y axis directions. Suction table 13
Board 7 mounted on the above, the drive control of the control unit 14 can move in X, Y axis direction. That is, when the servo motor 15b is driven by the control device 14,
When the X-axis table 5 moves in the X-axis direction and the substrate 7 moves in the X-axis direction, and the servomotor 15c is driven, the Y-axis table 6 moves in the Y-axis direction and the substrate 7 moves in the Y-axis direction. Moving. Therefore, when the X-axis table 5 and the Y-axis table 6 are respectively moved by an arbitrary distance by the control device 14,
The substrate 7 moves by an arbitrary position in an arbitrary direction in a plane parallel to the gantry 9. The θ axis table 8
A servo motor (not shown) is rotatable in the θ direction about the center position as a central axis.

On the gantry 9, a Z-axis table support 10
Is mounted, and a Z-axis table 4a is attached to the Z-axis table 4a so as to be movable in the Z-axis direction (vertical direction). The nozzle 1, the paste storage cylinder 2, and the optical distance meter 3 are mounted on the Z-axis table 4. The control device 14 also controls driving of the Z-axis table 4a in the Z-axis direction (vertical direction).
Done by That is, when the control device 14 drives the servomotor 15a, the Z-axis table 4a moves in the Z-axis direction, and accordingly, the nozzle 1 , the paste storage cylinder 2, and the optical distance meter 3 move in the Z-axis direction. The nozzle 1 is provided at the tip of the paste storage cylinder 2, and the lower end of the plaster storage cylinder 2 is provided with a nozzle support 1 having a communicating portion.
Slightly separated via 2.

The optical distance meter 3 is at the tip (lower end) of the nozzle 1
, The distance between the paste discharge port and the upper surface of the substrate 7
Non-contact and measured by triangulation.

That is, as shown in FIG.
Is cut in a triangular shape, a light emitting element is provided on one side, and a light receiving element is provided on the other side. The nozzle support 12 is attached to the tip of the paste storage cylinder 2 and extends to below the cut portion of the optical rangefinder 3, and the nozzle 1 is attached to the lower surface of the tip. The light emitting element provided in the above-mentioned cut portion of the optical rangefinder 3 is:
As shown by the dashed line, the position below the nozzle 1 on the substrate 7 (FIG. 1) is irradiated, and the reflected light from the light is received by the light receiving element. The paste discharge port at the tip of the nozzle 1 and the substrate 7
When the distance from the upper surface of the nozzle is the correct distance, the positional relationship between the nozzle 1 and the optical distance meter 3 and the optical The arrangement of the light emitting element and the light receiving element in the distance meter 3 are set. Therefore, when the distance between the paste discharge port of the nozzle 1 and the substrate 7 changes, the irradiation position of the light from the light emitting element changes from the position directly below the nozzle 1 on the substrate 7 and the light receiving state of the light receiving element changes. Change. Thereby, the distance between the paste discharge port of the nozzle 1 and the substrate 7 can be measured.

As will be described later, when the substrate 7 moves in the X- and Y-axis directions to form a paste pattern, an irradiation point (hereinafter, this point is referred to as a measurement point) of light from the light-emitting element on the substrate is set. Crossing the already formed paste pattern, the paste discharge port of the nozzle 1 by the optical distance meter 3 and the substrate 7
The measured value of the distance to the surface has an error corresponding to the thickness of the paste pattern. Therefore, in order to prevent the measurement point from crossing the paste pattern as much as possible, a point at which the paste is dropped from the nozzle 1 on the substrate 7 (hereinafter, referred to as a paste point).
It is preferable that the measurement point is located in a direction oblique to the X and Y axes from the application point).

When the paste in the paste container 2 is used up, the nozzle is replaced as described above.
The nozzle 1 is mounted so that the application point coincides with a certain set position where the paste on the substrate 7 is to be applied.
The position of the nozzle 1 may fluctuate before and after replacement of the nozzle due to variations in the accuracy of the paste storage cylinder 2, the nozzle support 12, and the nozzle 1. However, as shown in FIG. 2, when the application point is within a predetermined size allowable range (△ X, 許 容 Y) centered on the set position, it is assumed that the nozzle 1 is normally attached. . Here, ΔX is the width in the X-axis direction, and ΔY is the width in the Y-axis direction.

A camera support 4b is attached to the Z-axis table support 10, on which an image recognition camera 11a and its lens barrel 11b are mounted. The control device 14 is supplied with data from the optical distance meter 3 and the image recognition camera 11a, and in response to this, servo motors 15a, 15b, 15
The servo motor (not shown) for the c- and θ-axis tables 8 is driven. In addition, data on the movement status of each motor is transmitted from the encoder provided on these servo motors to the control device 1.
4 is fed back.

On the monitor 16, an image of the substrate 7 read by the image recognition camera 11a, data input from the keyboard 17, data on the processing status in this embodiment obtained from the control device 14, and the like are displayed on a screen. .

In such a configuration, a rectangular substrate 7
Is placed on the suction table 13 and fixed by vacuum suction, and by operating the θ-axis table 8, the sides of the substrate 7 are set so as to be parallel to the X and Y axes, respectively. Then, the Z-axis table 4a is moved downward by the drive control of the servo motor 15a based on the measurement result of the optical distance meter 3 to lower the nozzle 1 from above the substrate 7, When the distance between the paste discharge port 1 and the surface of the substrate 7 reaches a specified distance, the lowering is stopped.

Thereafter, the X-axis table 5 and the Y-axis table 6 are appropriately moved by the drive control of the servo motors 15b and 15c while the paste is discharged from the nozzle 1 through the nozzle holder 12 from the paste storage cylinder 2. A paste is applied on the substrate 7 in a desired shape pattern. The paste pattern to be formed can be converted by distance in the X and Y axis directions. When data for this is input from the keyboard 17, the control device 14 converts this data into the servo motor 1 data.
The command is issued after converting into the number of pulses given to 5b and 15c.
Automatically perform drawing.

FIG. 3 is a block diagram showing a specific example of the control device 14 shown in FIG. 1. 14a is a microcomputer, 14b is a motor controller, 14ca is a Z-axis driver, 14cb is an X-axis driver, and 14cc is a Y-axis. A driver, 14cd is a θ-axis driver, 14d is an image processing device, 14e is an external interface, 15d is a servomotor of the θ-axis table 8 (FIG. 1), E is an encoder, and portions corresponding to FIG. I'm wearing it.

In FIG. 1, a control unit 14 includes a microcomputer 14a having a ROM storing a processing program, a motor controller 14b for each of the servomotors 15a to 15d, and a servomotor 15a to 15d.
d drivers 14ca to 14cd and the image recognition camera 1
An image processing device 14d for processing the image read in 1;
A keyboard 17 and an external interface 14e with the image processing device 14d are provided.

Various data from the keyboard 17 indicating a paste drawing pattern, nozzle replacement, and the like, and various data processed and produced by the microcomputer 14a are stored in a RAM built in the microcomputer 14a.
Is stored in

Hereinafter, the processing operation of the control device 14 at the time of paste application drawing and nozzle replacement will be described.

In FIG. 5, when the power is turned on (step 100), the initial setting of the paste coater is executed (step 200). In this initial setting, as shown in FIG. 6, the Z-axis table 4a, the X-axis table 5, and the Y-axis table 6 are positioned at predetermined origin positions (step 201), and the paste pattern data and the position of the substrate 7 are determined. Data setting (step 202) and setting of paste ejection end position data (step 203) are performed. Data input for these settings is performed from the keyboard 17. Such input data is, as described above,
It is stored in a RAM built in the microcomputer 14a.

When the above initial settings are completed, it is determined in FIG. 5 whether or not the nozzle has been replaced (step 300). For nozzle replacement,
Later, the paste film forming process of FIG. 9 (step 700)
This will be described in detail. If the nozzle has been replaced, the nozzle position deviation amount measurement processing (step 400) is performed. Hereinafter, step 400 will be described in detail with reference to FIG.

In FIG. 7, first, a temporary substrate is mounted on the suction table 13 in FIG. 1 (step 401).
The temporary substrate at the center of the field of view of the image recognition camera 11 is moved to a position immediately below the nozzle 1 (step 403). Then, the Z-axis table 4a
To lower the nozzle 1 (step 404),
The paste filled in the paste container 2 is supplied to the nozzle 1
To form a point-like paste film on the temporary substrate (step 405). After a while
The nozzle 1 is raised (Step 406), and the temporary substrate is moved below the center of the visual field of the image recognition camera 11 (Step 407). Then, a point-like paste film is photographed by the image recognition camera 11, and the output is used as an image processing device 14d (FIG. 3).
Then, known image processing is performed to determine the center of gravity of the point-like paste film (that is, the center position of the point) (step 408).

In FIG. 4, if the application point when the nozzle 1 on the temporary substrate has no displacement is P1, and the field of view in the image recognition camera 11a is G1, the application point P
1 (the center position of the dot-like paste film) and the center of the field of view G1 in the image recognition camera 11a.
1 is the distance over which the temporary substrate has been moved by the servomotor 15b. Therefore, the microcomputer 14a
Then, the application point P1 on the temporary substrate is moved backward by the known distance X1 toward the visual field G1 of the image recognition camera 11a. In a situation where there is no displacement of the nozzle 1, if the nozzle 1 is moved backward, the application point P1 coincides with the center of the field of view G1. The center and the application point do not coincide.
Assuming that the application point in the reversely fed situation is P2, the deviation 中心 between the center of the visual field G1 of the image recognition camera 11a and the center of the application point P2.
X1 and △ Y1 are obtained (step 409), and are stored in the RAM of the microcomputer 14a as the positional deviation amount of the nozzle 1. Then, the suction of the temporary substrate is released (step 410).

The above is the processing of step 400 in FIG.

Next, in FIG. 5, when the paste storage tube 2 is not replaced, or when the process of step 400 is completed, the substrate on which the paste pattern of the desired shape is to be applied and drawn is placed on the suction table 13 (FIG. 1). The substrate is mounted and held by suction (step 500), and a substrate pre-positioning process is performed (step 600). Hereinafter, this processing will be described with reference to FIG.

Referring to FIG. 8, first, a positioning mark previously attached to the substrate 7 (FIG. 1) mounted on the suction table 13 is photographed by the image recognition camera 11a (step 601).
The position of the center of gravity of the positioning mark in the field of view G1 (FIG. 4) of the image recognition camera 11a is obtained by image processing (step 602). Then, the amount of deviation between the center of the field of view G1 and the position of the center of gravity of the positioning mark is calculated (step 6).
03), the amount of movement of each of the substrates 7 to the desired position on each of the X-axis table 5, the Y-axis table 6, and the θ-axis table 8 (above, FIG. 1) is calculated using this deviation amount (step 60).
4). Further, the amount of these movements is
15d (FIGS. 1 and 3) is converted into an operation amount (step 60).
5) Servo motors 15b to 15b depending on the manipulated variables
By driving d, each of the tables 5, 6, 8 is moved to set the substrate 7 at a desired position (step 60).
6).

Thereafter, in order to confirm whether or not the substrate 7 has been moved to this position, the positioning mark on the substrate 7 is again photographed by the image recognition camera 11a, and the center of the positioning mark in the field of view G1 (center of gravity) ) (Step 60)
7), the deviation amount of the center of the mark in the field of view G1 is obtained (step 608), and it is confirmed whether the deviation amount is within the allowable range (ΔX, ΔY) described in FIG. 2 (step 60).
9). Then, if it is within this allowable range, step 600
Is completed, and the allowable range (ΔX, ΔY)
If outside, the process returns to step 604 to repeat the above processing.

Returning to FIG. 5 again, when the process of step 600 is completed, the process proceeds to a paste film forming step (process) of step 700. This will be described below with reference to FIG.

In FIG. 9, first, the substrate 7 is moved to a coating start position (Step 701), and the position of the substrate 7 is compared and adjusted (Step 702). this is,
The nozzle 1 in step 400 described above with reference to FIGS.
Is based on the position shift amount measurement processing. Figure 1
0 will be described.

In FIG. 10, first, the positional deviation amount of the nozzle 1 １ ， X1, which is obtained in step 409 of FIG. 7 and stored in the RAM of the microcomputer 14a (FIG. 3).
It is determined whether ΔY1 is within the allowable displacement range (ΔX, ΔY) of the nozzle 1 described with reference to FIG. 2 (step 702a). This allowable range (△ X ≧ △ X1, △ Y ≧ △
Y1), the process directly proceeds to step 703 in FIG. 9, but if it is out of the allowable range (許 容 X <△ X1, △ Y <△ Y1), the positional deviation amounts 求 め X1, △ Y1 previously obtained. The amount of movement between the X-axis table 5 and the Y-axis table 6 for moving the substrate 7 is calculated from the calculation (step 702b), and the operation amount is set in the motor controller 14b (FIG. 3) based on these movement amounts (step 702b). 702c). Then, the servo motors 15b and 15c are rotated by a designated amount via the X-axis driver 14cb and the Y-axis driver 14cc, respectively,
The axis table 5 and the Y-axis table 6 are moved. As a result, the displacement between the discharge port of the nozzle 1 and the desired application point on the substrate 7 caused by replacing the paste storage cylinder 2 is eliminated, and the desired application point on the substrate 7 from which coating is to be started is determined by the nozzle 1 This means that the substrate 7 has been positioned so as to be directly below the discharge port, and this processing ends.

When this process is completed, the process proceeds to step 703 in FIG. 9 to set the height of the nozzle 1 (step 703). That is, the distance from the discharge port of the nozzle 1 to the substrate 7 is made equal to the thickness of the paste film to be formed. The substrate 7 is subjected to a substrate pre-positioning process (step 6 in FIG. 8).
00) and the substrate position comparison / adjustment movement process (Step 702 in FIG. 10), the paste has been positioned at the desired position.

Then, the measured data of the distance from the discharge port of the nozzle 1 to the substrate 7 from the optical distance meter 3 is input to measure the undulation of the surface of the substrate 7 (step 705). It is determined whether or not the measurement position of the optical distance meter 3 is on the paste film from the actual measurement data of Step 3 (Step 706). This determination is made based on whether the measured data from the optical distance meter 3 has changed extremely based on the fact that the measured data crosses the paste film, whether the swell has exceeded an allowable value, and the like. If the measurement position of the optical distance meter 3 is not on the paste film, correction data for moving the Z-axis table 4a is calculated based on the actually measured data (step 707). Then, the height of the nozzle 1 is corrected using the Z-axis table 4a, and the nozzle 1 in the Z-axis direction is corrected.
Is maintained at the set value (step 708). On the other hand, when it is determined that the measurement position is passing over the paste film, the discharge of the paste is continued while maintaining the height of the nozzle 1 at the height before the determination (step 706). While the measurement position is passing over the paste film having a small width, the undulation of the substrate 7 is hardly changed in many cases. Therefore, if the height of the nozzle 1 is not changed, the discharge shape of the paste does not change. ,
Thereby, a paste film having a desired thickness can be drawn.

The process proceeds from step 706 or 708 to step 709, where it is determined whether the set pattern operation has been completed (step 709). If this is completed, the paste discharge is terminated (step 710), and if not completed, the paste discharge is continued. This processing is a processing operation based on whether or not the end point of the pattern that has been continuously drawn has been reached. This end point is not necessarily the end point of each pattern. It is determined in step 711 whether the end point of each pattern has been reached. If it is the end point of the middle pattern, the process returns to the substrate surface undulation measurement process (step 705) and repeats the above-described steps. When the measurement on the paste film is stopped, the process returns to the original nozzle height correction process (step 70).
7,708).

When the paste film is formed up to the end of each pattern (step 711), the Z-axis table 4a is driven to raise the nozzle 1 (step 712), and the paste film is formed (step 700). To end.

In FIG. 5, when the step 700 is completed, the substrate 7 on which the paste drawing has been completed is moved to the suction table 13.
Is discharged (step 800), and it is determined whether or not all the above processes are stopped (step 900). That is, when a paste film having the same pattern is formed on a plurality of substrates 7, the process returns to the syringe replacement determination step (step 300) and repeats the steps up to the substrate discharge step (step 800). Become.

In the stop judging process (step 900), the microcomputer 14a checks whether or not the remaining amount of the paste in the paste storage tube 2 is sufficient, for example, by an operator or from the accumulated paste discharge amount after replacement. If it is determined that the remaining amount is small, the paste storage cylinder 2 is replaced here. The fact of this exchange is input from the keyboard 17 and the RA of the microcomputer 14a is input.
By storing the flag as a flag in M, when returning to the syringe replacement determination step (step 300), RA
By checking the presence / absence of a flag in the data table relating to the replacement of the paste storage cylinder of M, the deviation can be automatically obtained in the next nozzle position deviation amount measuring step (step 400).

The microcomputer 14a checks the presence / absence of a flag in the data table relating to the exchange of the paste storage cylinder in the RAM, and if the deviation is automatically obtained in the next nozzle position deviation measuring step (step 400), The flag in the data table relating to the paste storage cylinder replacement is deleted, and the nozzle position shift amount measurement step (step 400) is prevented from being executed again with the flag.

If there is no more paste in the paste container 2 during the paste film forming step (step 700) described with reference to FIG. 9 and the paste container is replaced, the substrate discharging step (step 800) is performed at the time of replacement. In the case of the substrate 7 in which the application and drawing can be continued without changing or replacing, the syringe replacement determination step (step 300) and the nozzle position deviation amount measurement step (step 400) in FIG. 5 are performed. It may be performed before restarting the paste film forming step (step 700).

In the above embodiment, the substrate 7 is moved in the X and Y-axis directions with respect to the paste container 2.
May be fixed, and the paste storage cylinder 2 (therefore, the nozzle 1) may be moved in the X and Y axis directions.

In order to shorten the time required for the coating machine initial setting process (step 200) in FIG. 5, external storage means such as an IC card or a floppy disk or a hard disk is provided in the external interface 14e (FIG. 3). 5 is set in advance on a coater initial setting process (step 200) in FIG. 5 using a personal computer or the like, and the data is read out during the coater initial setting process (step 200). Each data may be transferred from the external storage means to the RAM of the microcomputer 14a in FIG. 3 via a storage and reading device connected to the external interface 14e.

[0049]

As described above, according to the present invention,
Even if the positional relationship between the paste discharge port of the nozzle and the substrate fluctuates due to replacement of the paste container, etc., the positional relationship between the nozzle and the substrate can be set as desired and with high accuracy, and a high-precision paste pattern can be drawn. can do.

[Brief description of the drawings]

FIG. 1 is a schematic perspective view showing one embodiment of a paste applicator according to the present invention.

FIG. 2 is a perspective view showing an arrangement relationship among a paste storage cylinder, a nozzle, and an optical distance meter in the embodiment shown in FIG.

FIG. 3 is a block diagram showing a specific example of a control device in FIG.

FIG. 4 is a diagram showing a specific example of a method for detecting a nozzle position shift in the embodiment shown in FIG. 1;

FIG. 5 is a flowchart showing an overall operation of the embodiment shown in FIG. 1;

FIG. 6 is a flowchart showing details of an applicator initial setting step in FIG. 5;

FIG. 7 is a flowchart showing details of a nozzle position shift amount measuring step in FIG. 5;

FIG. 8 is a flowchart showing details of a substrate pre-positioning step in FIG. 5;

FIG. 9 is a flowchart showing details of a paste film forming step in FIG. 5;

FIG. 10 is a flowchart showing details of a substrate position comparison / adjustment movement step in FIG. 9;

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Nozzle 2 Paste storage cylinder 3 Optical rangefinder 4a Z-axis table 4b Camera support part 5 X-axis table 6 Y-axis table 7 Substrate 8 θ-axis table 9 Mounting part 10 Z-axis table support part 11a Image recognition camera 12 Nozzle support DESCRIPTION OF SYMBOLS 13 Suction table 14 Control device 15a-15d Servo motor 16 Monitor 17 Keyboard

 ──────────────────────────────────────────────────続 き Continued on the front page (72) Inventor Fukuo Yoneda 5-2-2 Koyodai, Ryugasaki-city, Ibaraki Pref. Hitachi Techno Engineering Co., Ltd. (72) Inventor Haruo Mikai 5-2-2 Koyodai, Ryugasaki-shi, Ibaraki Hitachi Techno Engineering Co., Ltd. Development Laboratory (56) References JP-A-2-1197 (JP, A) JP-A-6-114315 (JP, A) JP-A-2-284672 (JP, A) JP-A 5-329423 (JP, A) Japanese Utility Model 1-73374 (JP, U)

Claims (2)

(57) [Claims] 1. A substrate is held on a table facing a nozzle that discharges a paste stored in a paste storage cylinder, and the relative positional relationship between the nozzle and the table is changed while discharging the paste from the nozzle. A paste applying apparatus configured to apply a paste on the substrate to form a paste pattern of a desired shape, wherein first means for measuring a position of a paste discharge port of the nozzle when exchanging the nozzle; A second means for calculating a displacement amount of the nozzle discharge port of the nozzle from a measurement result of the first means; and a position adjustment of the substrate in accordance with the displacement amount obtained by the second means. A paste dispenser characterized in that the paste dispenser is provided with a third means so as to be able to remove the positional displacement of the nozzle accompanying the replacement of the nozzle. 2. The method according to claim 1, wherein the storage means stores information indicating that the nozzle has been replaced with the replacement of the nozzle, and prior to drawing the paste pattern on a substrate on which the same paste pattern is drawn. A reading means for reading the storage means, wherein the reading means reads the information from the storage means, and the first, second, and third means are operated, and the nozzles accompanying the replacement of the nozzles are provided. A paste dispenser characterized in that it is configured to be able to remove positional deviation of the paste.