JP2006088103A - Adhesive applying device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an adhesive applying device which enables application of an adhesive with high positional precision by precisely recognizing the position of a nozzle and a substrate on the plane and the distance between the nozzle and the substrate and precisely correcting the deviation of the nozzle. <P>SOLUTION: Following means are added in an adhesive applying apparatus. First, a substrate imaging means is provided integrally with the nozzle discharging the adhesive. Second, a nozzle imaging means for recognizing the position of a nozzle discharge port on the plane and a nozzle height detecting means for detecting the position of the nozzle discharge port in the height direction are provided. Third, the positional relation between the substrate imaging means and the nozzle discharge port on the plane is determined by the nozzle imaging means. Fourth, the height of the nozzle discharge port is determined by the nozzle height detecting means. Fifth, the adhesive is applied on the prescribed position of the substrate with the control of the movement of the nozzle on the basis of the obtained positional relation on the plane and the obtained position in the height. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to an improvement of an adhesive application apparatus, and more particularly, to an improvement of an apparatus for applying an adhesive used to bond a substrate and a component in an electronic component assembling apparatus to the substrate.

  Conventionally, there has been an adhesive application device that uses an adhesive application device to discharge an adhesive from a nozzle at the tip of a container and apply it onto a substrate. This adhesive application device is attached to an XYZ axis drive robot or the like for handling, and applies adhesive on a substrate in a preprogrammed locus. In this type of adhesive application device, it is necessary to capture an image of the substrate and perform alignment correction by the image processing device.

  Furthermore, in the adhesive application device, a displacement may occur after replacing the nozzle that discharges the adhesive, or a displacement due to thermal expansion may occur after a certain amount of operation time has elapsed, and it is necessary to adjust the displacement of the nozzle. there were. In order to adjust this misalignment, as shown in Patent Document 1, in the prior art, a paste is applied on a temporary substrate, and then the position of the nozzle is measured by measuring the position of the paste applied by an image recognition camera. Means for detecting deviation and adjusting the nozzle position have been adopted.

  However, in the case of the above means, it is a reality that there is always some variation in the size and shape of the paste that is temporarily applied in a dot shape due to the difference in the coating amount depending on the distance between the nozzle and the substrate. When the center of the paste is obtained by image processing, there is a problem that the position of the center is shifted and the positional accuracy is not improved.

Japanese Patent No. 2713687

  The present invention provides an adhesive application device capable of accurately recognizing the position of the nozzle and the substrate on the plane and the distance between the two, accurately correcting the displacement of the nozzle, and applying the adhesive with good positional accuracy. For the purpose.

  In order to solve the above problems, a first invention is a nozzle that discharges an adhesive from a discharge port at a tip, a moving unit that moves the nozzle, a holding unit that holds a substrate to which the adhesive is applied, The substrate imaging means for recognizing the position is added, and the following means is added to the adhesive application device that recognizes the position of the substrate by the substrate imaging means and applies the adhesive at a predetermined position.

First, the substrate imaging means is provided so as to move on a plane integrally with the nozzle.
Second, there are provided nozzle imaging means for recognizing the position of the nozzle outlet on the plane and nozzle height detecting means for detecting the position of the nozzle outlet in the height direction.
Third, the positional relationship on the plane between the substrate imaging means and the nozzle outlet is obtained by the nozzle imaging means.
Fourthly, the height position of the nozzle outlet is obtained by the nozzle height detecting means together with the positional relationship.
Fifth, the movement of the nozzle is controlled based on the obtained positional relationship on the plane and the height position, and the adhesive is applied to a predetermined position on the substrate.

The second invention is obtained by adding the following means to the first invention.
First, a target mark that can be moved back and forth is provided between the nozzle imaging means and the substrate imaging means.
Secondly, the positional relationship between the nozzle ejection port and the substrate imaging unit is obtained from the recognition of the target mark by the nozzle imaging unit, the recognition of the target mark by the substrate imaging unit, and the recognition of the nozzle ejection port by the nozzle imaging unit.

  The present invention obtains the height position of the nozzle by the nozzle height detecting means together with the positional relation on the plane, and controls the movement of the nozzle based on the obtained positional relation on the plane and the height position to apply the adhesive to the substrate. Therefore, the nozzle displacement can be accurately corrected, and the adhesive application device can apply the adhesive with high positional accuracy.

  According to a second aspect of the present invention, a target mark that can move forward and backward is provided between the nozzle imaging unit and the substrate imaging unit, the target mark is recognized by the nozzle imaging unit, the target mark is recognized by the substrate imaging unit, and the nozzle discharge port by the nozzle imaging unit From this recognition, the positional relationship between the nozzle ejection port and the substrate imaging means is obtained, and the correction movement of the nozzle is performed, so that the calibration operation such as when the nozzle is replaced can be performed with high accuracy.

  Hereinafter, embodiments of the present invention will be described together with examples according to the drawings. FIG. 1 is a schematic explanatory diagram of an adhesive application device according to an embodiment of the present invention. Reference numeral 1 in FIG. 1 denotes a carrier in which a substrate 2 to which an adhesive is applied is accommodated. The carrier 1 has storage recesses formed in a predetermined arrangement, and the substrate 2 is received in the storage recess. Yes. A plurality of carriers 1 are stored in a stacked manner in a magazine 3 supplied to the supply unit 4. When the carrier 1 is removed from one magazine 3, the next magazine 3 is supplied to the supply unit 4. It is like that.

  The carrier 1 taken out from the magazine 3 passes through an adhesive application device 5 through a conveyance path to an electronic component mounting device (not shown), where the electronic component is mounted on the adhesive, and the adhesive is hardened. Further, it is then transported to the storage device. Examples of the adhesive used in the examples include an ultraviolet curable resin and a thermosetting resin.

  The adhesive application device 5 includes a nozzle 6 that discharges the adhesive from the discharge port 11 at the tip, a moving unit that moves the nozzle 6, a holding unit that holds the substrate 2 to which the adhesive is applied, and the position of the substrate 2 A substrate observation camera 7 as a substrate imaging means, a nozzle observation camera 8 as a nozzle imaging means, a nozzle height measuring displacement sensor 9 for detecting the position of the ejection port 11 of the nozzle 6 in the height direction, and advancing and retreating. It has a possible target mark 10. The displacement sensor 9 for measuring the nozzle height is a contact displacement sensor incorporating a linear encoder.

  As a moving means for moving the nozzle 6, the X table 13 is moved by the X axis drive motor 12 in the X axis direction (the same direction as the carrier 1 transport direction), and the Y axis direction (the carrier 1 transport direction intersects). In the direction), there is a Y table 15 that is moved by the Y-axis drive motor 14, and in the Z-axis direction (vertical direction), there is a Z-axis drive mechanism 17 that moves the nozzle 6 up and down by the Z-axis drive motor 16.

  The nozzle 6 is attached to the Z-axis drive mechanism 17 so as to be movable up and down. The Z-axis drive mechanism 17 is attached to the X table 13 by a fixed Z-axis frame 18, and the X table 13 is placed on the Y table 15. It is attached. Accordingly, the nozzle 6 can be moved in the Y-axis direction by the Y table 15, in the X-axis direction by the X table 13, and in the Z-axis direction by the Z-axis drive mechanism 17.

  A substrate observation camera 7, an illumination ring 19, and a substrate height measuring laser displacement sensor 20 are fixed to the fixed Z-axis frame 18 downward. Accordingly, the substrate observation camera 7 and the Z-axis drive mechanism 17 are provided on the Z-axis frame 18, and the substrate observation camera 7 and the nozzle 6 move together in the X-axis direction and the Y-axis direction.

  The holding means for holding the substrate 2 to which the adhesive is applied is the carrier 1 that is positioned and held by a positioning pin (not shown) at a predetermined stop position in the transport path.

  The nozzle observation camera 8, the nozzle height measuring displacement sensor 9, and the target mark 10 are fixed to a base frame of the apparatus main body (not shown). Of course, the target mark 10 can be moved back and forth with respect to the intermediate position in the height direction of the nozzle observation camera 8 and the substrate observation camera 7.

  Next, an initial calibration operation according to the present embodiment will be described with reference to the flowchart of FIG. The first step is to attach the nozzle 6 to the Z-axis drive mechanism 17. As a second step, the nozzle 6 is moved directly above the nozzle observation camera 8 by driving the X table 13 and the Y table 15. As a third step, the nozzle observation camera 8 images the discharge port 11 of the nozzle 6, and as a fourth step, the center position of the discharge port 11 of the nozzle 6 is recognized with respect to the center of the nozzle observation camera 8.

  Next, as a fifth step, the target mark 10 moves right above the nozzle observation camera 8, and as a sixth step, the substrate observation camera 7 drives the X table 13 and the Y table 15 to directly above the target mark 10. Move to. Here, the movement right above is not a movement right above as an absolute position but a movement to a reference position set as right above.

  As the seventh step, the nozzle observation camera 8 captures the target mark 10, and as the eighth step, recognizes the position of the center of the target mark 10 relative to the center of the nozzle observation camera 8. On the other hand, as a ninth step, the substrate observation camera 7 images the target mark 10, and as a tenth step, the position of the center of the target mark 10 relative to the center of the substrate observation camera 7 is recognized. Here, the seventh and eighth steps and the ninth and tenth steps may be operated in parallel.

  As an eleventh step, the actual positional relationship between the discharge port 11 of the nozzle 6 and the substrate observation camera 7 is calculated. That is, the distance in the X-axis direction and the Y-axis direction from the center of the substrate observation camera 7 to the center of the discharge port 11 of the nozzle 6 is calculated. Thereafter, as a twelfth step, the target mark 10 is withdrawn from directly above the nozzle observation camera 8, and as a thirteenth step, the nozzle 6 moves directly above the nozzle height measuring displacement sensor 9.

  As the 14th step, the nozzle 6 is lowered to the set reference height position, and as the 15th step, the actual height of the nozzle 6 is detected by the displacement sensor 9 for measuring the nozzle height, and as the 16th step, the reference height is set. Then, the deviation in the Z-axis direction is calculated. This completes the initial calibration operation. In this calibration operation, the target mark 10 is imaged after the nozzle 6 is imaged, but the nozzle 6 may be imaged after the target mark 10 is imaged. Furthermore, in the calibration operation, the position of the nozzle 6 is measured after measuring the position of the nozzle 6 on the plane, but the height of the nozzle 6 is measured first, and then the position of the position on the plane is measured. You may make a measurement.

  Next, the operation of the adhesive application by the adhesive application device 5 will be described with reference to the flowchart of FIG. In the first step, the first carrier 1 is taken out from the magazine 3 and conveyed to a predetermined position as the second step. At this position, the first carrier 1 is positioned and held by a positioning pin.

  The substrate observation camera 7 moves on the first substrate 2 as the third step, the substrate observation camera 7 images the first substrate 2 as the fourth step, and the substrate 2 as the fifth step. The position is recognized, and the distance in the X-axis direction and the Y-axis direction from the center of the substrate observation camera 7 to the center of the substrate 2 is calculated. As the sixth step, X to the adhesive application position on the substrate 2 is calculated based on the distance calculated in the fifth step and the distance between the substrate observation camera 7 and the center of the discharge port 11 of the nozzle 6 obtained at the time of calibration. The nozzle movement distance in the axial direction and the Y-axis direction is calculated.

  As the seventh step, the nozzle 6 moves to a position directly above the application position of the first substrate 2 and as the eighth step, the height of the substrate 2 is measured by the substrate height measuring laser displacement sensor 20. As the ninth step, the nozzle 6 has a predetermined distance between the substrate 2 and the discharge port of the nozzle 6 based on the height of the substrate 2 obtained in the eighth step and the amount of deviation of the height of the nozzle 6 obtained during calibration. The amount of lowering of the nozzle 6 in the Z-axis direction, which is the coating height, is calculated. In the tenth step, the nozzle 6 is lowered to the coating height, and in the eleventh step, an adhesive is applied. As a twelfth step, the substrate observation camera 7 moves onto the first substrate 2, and as a thirteenth step, the application state of the adhesive is imaged and inspected. In the fourteenth step, the substrate observation camera 7 moves onto the second substrate 2 and the operations in the above steps are repeated.

Schematic explanatory diagram of an adhesive application device according to one embodiment of the present invention Initial calibration flowchart Flow chart during adhesive application operation

Explanation of symbols

1. . . . . Carrier 2. . . . . Substrate 3. . . . . Magazine 4. . . . . Supply unit 5. . . . . 5. Adhesive application device . . . . Nozzle 7. . . . . Substrate observation camera 8. . . . . 8. Nozzle observation camera . . . . 10. Displacement sensor for nozzle height measurement . . . Target mark 11. . . . Discharge port 12. . . . X-axis drive motor 13. . . . X table 14. . . . Y axis drive motor 15. . . . Y table 16. . . . Z-axis drive motor 17. . . . Z axis drive mechanism 18. . . . Z-axis frame 19. . . . Lighting ring 20. . . . Laser displacement sensor for board height measurement

Claims (2)

  A nozzle that discharges an adhesive from a discharge port at a front end; a moving unit that moves the nozzle; a holding unit that holds a substrate to which the adhesive is applied; and a substrate imaging unit that recognizes the position of the substrate. In an adhesive coating apparatus that recognizes the position of a substrate by an imaging means and applies an adhesive at a predetermined position, the substrate imaging means is provided so as to move on a plane integrally with a nozzle, and on the plane of a nozzle discharge port. The nozzle imaging means for recognizing the position of the nozzle and the nozzle height detection means for detecting the position in the height direction of the nozzle ejection port are provided, and the positional relationship between the substrate imaging means and the nozzle ejection port on the plane is obtained by the nozzle imaging means. At the same time, the height position of the nozzle discharge port is obtained by the nozzle height detection means, and the movement of the nozzle is controlled based on the obtained positional relationship and height position on the plane to bring the adhesive to a predetermined position on the substrate. Adhesive applying device, characterized in that the fabric. A target mark that can be moved back and forth is provided between the nozzle imaging means and the substrate imaging means. From the recognition of the target mark by the nozzle imaging means, the recognition of the target mark by the substrate imaging means, and the recognition of the nozzle discharge port by the nozzle imaging means, The adhesive application device according to claim 1, wherein a positional relationship between the outlet and the substrate imaging means is obtained.

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