CN104849887A - Novel binding machine - Google Patents
Novel binding machine Download PDFInfo
- Publication number
- CN104849887A CN104849887A CN201510316161.6A CN201510316161A CN104849887A CN 104849887 A CN104849887 A CN 104849887A CN 201510316161 A CN201510316161 A CN 201510316161A CN 104849887 A CN104849887 A CN 104849887A
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- Prior art keywords
- switch board
- binding machine
- cylinder
- camera
- glass substrate
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
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- Physics & Mathematics (AREA)
- Nonlinear Science (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Wire Bonding (AREA)
Abstract
The invention discloses a novel binding machine. The novel binding machine comprises a base, a vacuum absorption plate, a control cabinet, a press head and a camera; the vacuum absorption plate is fixedly arranged on the upper surface of the base; the control cabinet is fixedly arranged on the base; the press head is fixedly connected with the first end of an air cylinder; the second end of the air cylinder is movably arranged at the lower surface of the control cabinet through a driving device; the camera is arranged at one side of the air cylinder; and the camera, the air cylinder and the driving device are electrically connected with the control cabinet respectively. According to the novel binding machine, the press head is fixedly connected with the air cylinder, and the air cylinder is slidingly arranged on the control cabinet, and therefore, when driving chips are fittingly pressed onto a glass substrate, it only needs to control the air cylinder to drive the press head to slide so that the driving chips at different positions of the glass substrate can be pressed one by one, and thus, operation is convenient, and binding efficiency is high; and the camera is arranged at one side of the air cylinder, and the camera can slide with the press head, and therefore, line positions between the glass substrate and the driving chips can be corresponded effectively, and alignment precision of the glass substrate and the driving chips can be improved.
Description
Technical field:
The invention belongs to LCD Technology field, specifically relate to a kind of novel binding machine.
Background technology:
Liquid crystal display is the display device of planar ultra-thin, and it is made up of the colour of some or monochrome pixels, is positioned over light source or reflecting surface front.Liquid crystal display power consumption is very low, therefore extremely slip-stick artist's favor, is applicable to the electronic equipment using battery.Its cardinal principle produces point, line, surface with galvanism liquid crystal molecule to coordinate back fluorescent tube to be formed picture.Liquid crystal display needs driving chip to fix on the glass substrate in the process manufactured, and this process is called the binding of liquid crystal display.
Usually binding machine is used to be fixed on the glass substrate by driving chip in prior art, vacuum adsorption table on binding machine is normally fixedly installed in frame, when large-sized glass substrate bound by needs, just seem inconvenience particularly, need continuous movable glass substrate glass substrate could be positioned at the driving chip pressing one by one at diverse location place, waste time and energy, and existing binding machine normally carries out the corresponding situation in line position that judges between glass substrate with driving chip by human eye, contraposition precision is not high.
Summary of the invention:
For this reason, technical matters to be solved by this invention to be in prior art for the pressing of the binding machine driving chip of liquid crystal display and glass substrate is inconvenient, aligning accuracy is low, it is low to bind efficiency, thus proposes a kind of novel binding machine.
For achieving the above object, technical scheme of the present invention is as follows:
A kind of novel binding machine, comprising:
Base, described base upper surface is fixedly installed bracing frame.
Vacuum adsorption plate, described vacuum adsorption plate is fixedly installed on described base upper surface, and described vacuum adsorption plate is for adsorbing glass substrate.
Switch board, described switch board is fixedly installed on described base by support frame as described above, described switch board is provided with display screen and key area.
Pressure head, described pressure head is arranged on the top of described glass substrate, described pressure head is for being pressed together on described glass substrate by driving chip, and the upper surface of described pressure head is fixedly connected with the first end of cylinder, and the second end of described cylinder is movably arranged on the lower surface of described switch board by drive unit.
Camera, described camera is arranged on the side of described cylinder, and described camera is movably arranged on the lower surface of described switch board by described drive unit.
Described camera, described cylinder, described drive unit are electrically connected with described switch board respectively.
Preferred as technique scheme, be provided with heating arrangement and temperature sensor in described pressure head, described heating arrangement and described temperature sensor are electrically connected with described switch board.
Preferred as technique scheme, described drive unit is Linear slide-rail device, and described drive unit comprises the line slide rail being arranged on described switch board lower surface and the sliding shoe slided on described line slide rail.
Preferred as technique scheme, described cylinder and described camera are fixedly installed on described sliding shoe.
Preferred as technique scheme, the first end of described cylinder is piston rod, and described piston rod is fixedly connected with the upper surface of described pressure head, and the second end of described cylinder is cylinder body, and described cylinder body is fixedly connected with described sliding shoe.
Preferred as technique scheme, the top of described switch board is fixedly installed signal lamp, and described signal lamp is electrically connected with described switch board.
Preferred as technique scheme, a pair of described switch board in opposite directions on sidewall symmetry offer ventilating opening.
Beneficial effect of the present invention is: it is by being fixedly connected with pressure head with cylinder, cylinder slide be arranged on switch board, like this when carrying out the pressing of driving chip and glass substrate, only need control described cylinder slide drives the slip of described pressure head glass substrate will be positioned at the driving chip pressing one by one at diverse location place, easy to operate, binding efficiency is high; Arrange camera by the side at cylinder, described camera slides together along with pressure head, effectively can be mapped the line position between glass substrate with driving chip, improve the aligning accuracy of glass substrate and driving chip; It, by arranging heating arrangement and temperature sensor in pressure head, effectively can heat driving chip, further increase the bonding accurcy of glass substrate and driving chip.
Accompanying drawing illustrates:
The following drawings is only intended to schematically illustrate the present invention and explain, not delimit the scope of the invention.Wherein:
Fig. 1 is the one novel binding machine perspective view of one embodiment of the invention;
Fig. 2 is the one novel binding machine structure left view of one embodiment of the invention;
Fig. 3 is the one novel binding machine structure front view of one embodiment of the invention;
Fig. 4 is the vacuum adsorption plate upper surface schematic diagram of one embodiment of the invention;
Fig. 5 is the switch board lower surface schematic diagram of one embodiment of the invention.
Symbol description in figure:
1-base, 2-vacuum adsorption plate, 3-glass substrate, 4-switch board, 5-pressure head, 6-driving chip, 7-cylinder, 8-drive unit, 9-camera, 101-bracing frame, 401-display screen, 402-key area, 403-signal lamp, 404-ventilating opening, 701-piston rod, 702-cylinder body, 801-line slide rail, 802-sliding shoe.
Embodiment:
As shown in Figure 1-Figure 3, the novel binding machine of one of the present invention, comprising:
Base 1, vacuum adsorption plate 2, switch board 4, pressure head 5, camera 9.
Described base 1 is rectangular parallelepiped base station, and described base 1 upper surface is fixedly installed bracing frame 101, and in the present embodiment, support frame as described above 101 is two, and is separately positioned on the both sides of described base 1 upper surface.
Described vacuum adsorption plate 2 is fixedly installed on described base 1 upper surface, described vacuum adsorption plate 2 is for adsorbing glass substrate 3, described vacuum adsorption plate 2 is provided with multiple vacuum absorption holes, described glass substrate 3 can be adsorbed securely, as shown in Figure 4, the upper surface of described vacuum adsorption plate 2 adsorbs described glass substrate 3, described glass substrate 3 has multiple driving chip 5 need pressing.
Described switch board 4 is fixedly installed on described base 1 by two support frames as described above 101, described switch board 4 is provided with display screen 401 and key area 402, described display screen 401, for showing the image of described camera 9 shooting, facilitates staff to determine the alignment situation of described glass substrate 3 and described driving chip 6.Described key area 402 is arranged on the side of described display screen 401, facilitates operated by personnel.The top of described switch board 4 is fixedly installed signal lamp 403, and described signal lamp 403 is for the state of display device, and when signal lamp is green, indication equipment is in normal operating conditions; When signal lamp is red, under indication equipment is in malfunction.A pair of described switch board 4 in opposite directions on sidewall symmetry offer ventilating opening 404, the setting of described ventilating opening 404 is the ventilation and heat being convenient to described switch board 4.
Described pressure head 5 is arranged on the top of described glass substrate 3, described pressure head 5 is for being pressed together on described glass substrate 3 by driving chip 6, as shown in Figure 5, the upper surface of described pressure head 5 is fixedly connected with the first end of cylinder 7, and the second end of described cylinder 7 is movably arranged on the lower surface of described switch board 4 by drive unit 8.The first end of described cylinder 7 is piston rod 701, described piston rod 701 is fixedly connected with the upper surface of described pressure head 5, second end of described cylinder 7 is cylinder body 702, described cylinder body 702 is fixedly connected with described sliding shoe 802, can control the pressing downwards of described pressure head 5 or upwards mention by described piston rod 701.Heating arrangement and temperature sensor is provided with in described pressure head 5, described heating arrangement is heating wire, can be heated by described heating arrangement to described driving chip 6, improves pressing effect, described temperature sensor, can by heating and temperature control within the specific limits for detecting heating-up temperature.
Described camera 9 is arranged on the side of described cylinder 7, described camera 9 is movably arranged on the lower surface of described switch board 4 by described drive unit 8, described camera 9 is for obtaining the corresponding situation in line position between described glass substrate 3 with described driving chip 6, operating personnel can check the corresponding situation in line position by described display screen 401, if described glass substrate 3 is not corresponding with described driving chip 6 line position, then adjust.
Described drive unit 8 is Linear slide-rail device, and described drive unit 8 comprises the line slide rail 801 being arranged on described switch board 4 lower surface and the sliding shoe 802 slided on described line slide rail 801.Described cylinder 7 and described camera 8 are fixedly installed on described sliding shoe 802, by described Linear slide-rail device, described cylinder 7 can drive described pressure head 5 to slide, arrive the top of described driving chip 6, described driving chip 6 is pressed together on described glass substrate 3, after pressing completes, described cylinder 7 drives described pressure head 5 to slide into the top of driving chip 6 described in another, continues pressing.
Described camera 9, described cylinder 7, described drive unit 8, described signal lamp 403, described heating arrangement and described temperature sensor are electrically connected with described switch board 4 respectively, be electrically connected with described switch board 4, controlled the keying of above-mentioned parts by the button area 402 on described switch board 4.
The novel binding machine of one described in the present embodiment, comprise base, vacuum adsorption plate, switch board, pressure head and camera, vacuum adsorption plate is fixedly installed on base upper surface; Switch board is fixedly installed on base; Pressure head is fixedly connected with the first end of cylinder, and the second end of cylinder is movably arranged on the lower surface of switch board by drive unit; Camera is arranged on the side of cylinder; Camera, cylinder, drive unit are electrically connected with switch board respectively.It is by being fixedly connected with pressure head with cylinder, cylinder slide be arranged on switch board, like this when carrying out the pressing of driving chip and glass substrate, only need control cylinder slip band dynamic head to slide and glass substrate will be positioned at the driving chip pressing one by one at diverse location place, easy to operate, binding efficiency is high; Arrange camera by the side at cylinder, camera slides together along with pressure head, effectively can be mapped the line position between glass substrate with driving chip, improve the aligning accuracy of glass substrate and driving chip; It, by arranging heating arrangement and temperature sensor in pressure head, effectively can heat driving chip, further increase the bonding accurcy of glass substrate and driving chip.
Obviously, above-described embodiment is only for clearly example being described, and the restriction not to embodiment.For those of ordinary skill in the field, can also make other changes in different forms on the basis of the above description.Here exhaustive without the need to also giving all embodiments.And thus the apparent change of extending out or variation be still among the protection domain of the invention.
Claims (7)
1. a novel binding machine, is characterized in that, comprising:
Base (1), described base (1) upper surface is fixedly installed bracing frame (101);
Vacuum adsorption plate (2), described vacuum adsorption plate (2) is fixedly installed on described base (1) upper surface, and described vacuum adsorption plate (2) is for adsorbing glass substrate (3);
Switch board (4), described switch board (4) is fixedly installed on described base (1) by support frame as described above (101), described switch board (4) is provided with display screen (401) and key area (402);
Pressure head (5), described pressure head (5) is arranged on the top of described glass substrate (3), described pressure head (5) is for being pressed together on described glass substrate (3) by driving chip (6), the upper surface of described pressure head (5) is fixedly connected with the first end of cylinder (7), and the second end of described cylinder (7) is movably arranged on the lower surface of described switch board (4) by drive unit (8);
Camera (9), described camera (9) is arranged on the side of described cylinder (7), and described camera (9) is movably arranged on the lower surface of described switch board (4) by described drive unit (8);
Described camera (9), described cylinder (7), described drive unit (8) are electrically connected with described switch board (4) respectively.
2. novel binding machine according to claim 1, is characterized in that: described pressure head is provided with heating arrangement and temperature sensor in (5), described heating arrangement and described temperature sensor are electrically connected with described switch board (4).
3. novel binding machine according to claim 1, it is characterized in that: described drive unit (8) is Linear slide-rail device, described drive unit (8) comprises the line slide rail (801) being arranged on described switch board (4) lower surface and the sliding shoe (802) above slided at described line slide rail (801).
4. novel binding machine according to claim 3, is characterized in that: described cylinder (7) and described camera (8) are fixedly installed on described sliding shoe (802).
5. novel binding machine according to claim 4, it is characterized in that: the first end of described cylinder (7) is piston rod (701), described piston rod (701) is fixedly connected with the upper surface of described pressure head (5), second end of described cylinder (7) is cylinder body (702), and described cylinder body (702) is fixedly connected with described sliding shoe (802).
6. novel binding machine according to claim 1, is characterized in that: the top of described switch board (4) is fixedly installed signal lamp (403), and described signal lamp (403) is electrically connected with described switch board (4).
7. the novel binding machine according to claim 1 or 6, is characterized in that: a pair of described switch board (4) in opposite directions on sidewall symmetry offer ventilating opening (404).
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201510316161.6A CN104849887A (en) | 2015-06-10 | 2015-06-10 | Novel binding machine |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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CN201510316161.6A CN104849887A (en) | 2015-06-10 | 2015-06-10 | Novel binding machine |
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CN104849887A true CN104849887A (en) | 2015-08-19 |
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ID=53849651
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CN201510316161.6A Pending CN104849887A (en) | 2015-06-10 | 2015-06-10 | Novel binding machine |
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Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105759473A (en) * | 2016-05-19 | 2016-07-13 | 京东方科技集团股份有限公司 | Binding machine and binding method |
CN106292004A (en) * | 2016-08-19 | 2017-01-04 | 京东方科技集团股份有限公司 | Chip on film and the binding device of display floater and binding method |
CN112157936A (en) * | 2020-09-14 | 2021-01-01 | 深圳市合力泰光电有限公司 | Device is bound to touch-sensitive screen circuit board |
Citations (7)
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JPH11163509A (en) * | 1997-11-28 | 1999-06-18 | Matsushita Electric Ind Co Ltd | Method for setting bond application position |
US20020073536A1 (en) * | 1996-08-27 | 2002-06-20 | Osamu Okuda | Component mounting apparatus |
CN2715188Y (en) * | 2004-06-18 | 2005-08-03 | 陈栋栋 | Hot press bond equipment |
CN201261108Y (en) * | 2008-09-27 | 2009-06-24 | 郑春晓 | Automatically controlled pulse hot-press arrangement |
CN201423775Y (en) * | 2009-01-20 | 2010-03-17 | 深圳市联得自动化机电设备有限公司 | Multiple-prepressing hot press |
CN203778920U (en) * | 2014-04-14 | 2014-08-20 | 苏州志东岚自动化设备有限公司 | Visual positioning heteromorphic bar single-head solder wire automatic soldering machine |
CN204790230U (en) * | 2015-06-10 | 2015-11-18 | 苏州市邦成电子科技有限公司 | Novel bind machine |
-
2015
- 2015-06-10 CN CN201510316161.6A patent/CN104849887A/en active Pending
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
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US20020073536A1 (en) * | 1996-08-27 | 2002-06-20 | Osamu Okuda | Component mounting apparatus |
JPH11163509A (en) * | 1997-11-28 | 1999-06-18 | Matsushita Electric Ind Co Ltd | Method for setting bond application position |
CN2715188Y (en) * | 2004-06-18 | 2005-08-03 | 陈栋栋 | Hot press bond equipment |
CN201261108Y (en) * | 2008-09-27 | 2009-06-24 | 郑春晓 | Automatically controlled pulse hot-press arrangement |
CN201423775Y (en) * | 2009-01-20 | 2010-03-17 | 深圳市联得自动化机电设备有限公司 | Multiple-prepressing hot press |
CN203778920U (en) * | 2014-04-14 | 2014-08-20 | 苏州志东岚自动化设备有限公司 | Visual positioning heteromorphic bar single-head solder wire automatic soldering machine |
CN204790230U (en) * | 2015-06-10 | 2015-11-18 | 苏州市邦成电子科技有限公司 | Novel bind machine |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105759473A (en) * | 2016-05-19 | 2016-07-13 | 京东方科技集团股份有限公司 | Binding machine and binding method |
CN105759473B (en) * | 2016-05-19 | 2018-12-28 | 京东方科技集团股份有限公司 | Bind board and binding method |
CN106292004A (en) * | 2016-08-19 | 2017-01-04 | 京东方科技集团股份有限公司 | Chip on film and the binding device of display floater and binding method |
CN106292004B (en) * | 2016-08-19 | 2017-12-08 | 京东方科技集团股份有限公司 | The binding device and binding method of chip on film and display panel |
US10395945B2 (en) | 2016-08-19 | 2019-08-27 | Boe Technology Group Co., Ltd. | Bonding device for chip on film and display panel and bonding method for the same |
CN112157936A (en) * | 2020-09-14 | 2021-01-01 | 深圳市合力泰光电有限公司 | Device is bound to touch-sensitive screen circuit board |
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Application publication date: 20150819 |