CN105759473B - Bind board and binding method - Google Patents
Bind board and binding method Download PDFInfo
- Publication number
- CN105759473B CN105759473B CN201610340072.XA CN201610340072A CN105759473B CN 105759473 B CN105759473 B CN 105759473B CN 201610340072 A CN201610340072 A CN 201610340072A CN 105759473 B CN105759473 B CN 105759473B
- Authority
- CN
- China
- Prior art keywords
- binding
- panel
- bound
- board
- subregion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000000034 method Methods 0.000 title claims abstract description 31
- 238000010521 absorption reaction Methods 0.000 claims abstract description 60
- 238000000638 solvent extraction Methods 0.000 claims abstract description 38
- 238000001179 sorption measurement Methods 0.000 claims abstract description 30
- 239000003463 adsorbent Substances 0.000 claims description 6
- 239000002699 waste material Substances 0.000 abstract description 3
- 238000010586 diagram Methods 0.000 description 7
- 230000015572 biosynthetic process Effects 0.000 description 6
- 239000004973 liquid crystal related substance Substances 0.000 description 6
- 230000000694 effects Effects 0.000 description 2
- 238000007731 hot pressing Methods 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 239000002156 adsorbate Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 238000012163 sequencing technique Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
Landscapes
- Physics & Mathematics (AREA)
- Nonlinear Science (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Solid-Sorbent Or Filter-Aiding Compositions (AREA)
Abstract
The present invention provides a kind of binding board and binding method, the binding board carries out binding technique for treating binding panel, and the board includes: adsorption zone；The adsorption zone includes multiple moveable absorbing units；The multiple moveable absorbing unit is used to be combined to form the multiple absorption subregions to match with the partitioning scenario of the panel to be bound.Binding board provided by the invention is adapted to the binding work of the panel to be bound of different subregions, to efficiently solve the problems, such as to need hardware resource waste caused by the board of more correspondingly-sizeds when binding panel and binding and in the inefficiency caused by frequent changing machine platform when binding panel and binding to different subregions for different subregions in the prior art.
Description
Technical field
The present invention relates to field of display technology, and in particular to a kind of binding board and binding method.
Background technique
Q-panel refers to the glass panel comprising several small size liquid crystal display panels, wherein small in Q-panel
Sized liquid crystal panel is generally known as being independent panel, and each individually panel is and to Q-panel progress subregion cutting
It is formed.These small size liquid crystal display panels, i.e., independent panel can be used for small-size product, such as mobile phone, Pad.
Actually the presence of Q-panel is very favorable for liquid crystal manufacturer, such as liquid crystal manufacturer can allow profession
Foundries are cut, then bind circuit board backlight etc. by binding technique, form final products.
However, at present for Q-panel carry out flexible printed circuit board (Flexible Printed Circuit,
FPC when) or integrated circuit (Integrated Circuit, IC) binds bonding, since Q-panel subregion difference causes list
The size of only panel is different, and the prior art adopts the Q-panel of different subregions when carrying out bonding for Q-panel
It is corresponding to it with the binding board of specific dimensions, not only waste binds board hardware resource but also different to multiple subregions in this way
Q-panel need to frequently replace binding board when being bound, so as to cause inefficiency.
Summary of the invention
For the defects in the prior art, the present invention provides a kind of binding board and binding method, the board are adapted to
The binding work of the panel to be bound of different subregions, to efficiently solve in the prior art for different subregions wait bind
Needed when panel is bound hardware resource waste caused by the board of more correspondingly-sizeds and to different subregions wait tie up
The problem of determining inefficiency caused by frequent changing machine platform when panel is bound.
In order to solve the above technical problems, the present invention the following technical schemes are provided:
In a first aspect, carrying out binding technique, the machine for treating binding panel the present invention provides a kind of binding board
Platform includes: adsorption zone；
The adsorption zone includes multiple moveable absorbing units；
The multiple moveable absorbing unit is used to be combined to form the partitioning scenario with the panel to be bound
The multiple absorption subregions to match.
Preferably, the absorbing unit includes strip Attraction block, length and the adsorption zone of the strip Attraction block
Length is identical, and the width of the strip Attraction block is less than the half of the width of the adsorption zone.
Preferably, the absorbing unit includes blocky Attraction block, and the length and width of the bulk Attraction block is respectively smaller than
The half of the length and width of the adsorption zone.
Preferably, the board further includes the first thermal head and the second thermal head that be removable and being oppositely arranged；
Each subregion that first thermal head and second thermal head are used to treat binding panel together successively carries out
Heat binding technique.
Preferably, prepsetting gap is remained between every two adjacent adsorbent subregion.
Preferably, the size of the multiple moveable absorbing unit is all the same.
Preferably, the big fraction of the multiple moveable absorbing unit is identical.
Preferably, the size of the multiple moveable absorbing unit is different.
Preferably, vacuum sucking holes are had in the absorbing unit.
Second aspect carries out panel binding using binding board described in any of the above item the present invention also provides a kind of
Binding method, comprising:
According to the partitioning scenario of panel to be bound, the multiple moveable absorbing unit is combined with formation and institute
State multiple absorption subregions that the partitioning scenario of panel to be bound matches；
Panel to be bound is placed on the adsorption zone of the board；
Each subregion of the panel to be bound is bound respectively using obtained multiple absorption subregions.
As shown from the above technical solution, binding board provided by the invention, can be according to the partitioning scenario of panel to be bound
Adjust the absorption subregion of board, realize board correspond to different subregions situation binding panel binding work mesh
's.Binding board provided by the invention is adapted to the binding work of the panel to be bound of different subregions, to efficiently solve
In the prior art for different subregions need when binding panel and binding it is hard caused by the board of multiple correspondingly-sizeds
The part wasting of resources and in the inefficiency caused by frequent changing machine platform when binding panel and binding to different subregions
Problem.
Detailed description of the invention
It, below will be to embodiment or existing skill in order to illustrate more clearly of the present embodiment or technical solution in the prior art
Attached drawing needed in art description is briefly described, it should be apparent that, the accompanying drawings in the following description is of the invention one
A little embodiments for those of ordinary skill in the art without creative efforts, can also be according to these
Attached drawing obtains other attached drawings.
Fig. 1 is the structural schematic diagram for the binding board that the embodiment of the present invention one provides；
Fig. 2 is the partitioning scenario of panel M to be bound；
Fig. 3 is the partitioning scenario of panel N to be bound；
Fig. 4 is to carry out the mobile result schematic diagram of absorbing unit for panel M to be bound shown in Fig. 2；
Fig. 5 is to carry out the mobile result schematic diagram of absorbing unit for panel N to be bound shown in Fig. 3；
Fig. 6 is the partitioning scenario of panel P to be bound；
Fig. 7 is the structural schematic diagram for the binding board bound for panel P to be bound shown in fig. 6；
Fig. 8 is the structural schematic diagram of binding board provided by Embodiment 2 of the present invention；
Fig. 9 is the partitioning scenario of panel Q to be bound；
Figure 10 is to carry out the mobile result schematic diagram of absorbing unit for panel Q to be bound shown in Fig. 9；
Figure 11 is the flow chart for the binding method that the embodiment of the present invention three provides；
Above in the appended drawing reference of each figure, 1 indicate adsorption zone, 1A, 1B, 1C, 1D, 1E, 1a, 1b, 1c, 1d, 1e, 1f, 1g,
1h, 1i, 1j, 1k, 1l, 1m, 1n and 1o respectively indicate each absorbing unit；A, b, c, d, e, f, g, h, i, j respectively indicate to be formed
Absorption subregion；M, N, P and Q respectively indicate the panel to be bound of different subregions；G indicates the second thermal head.
Specific embodiment
In order to make the object, technical scheme and advantages of the embodiment of the invention clearer, below in conjunction with the embodiment of the present invention
In attached drawing, the technical scheme in the embodiment of the invention is clearly and completely described, it is clear that described embodiment is
A part of the embodiment of the present invention, instead of all the embodiments.Based on the embodiments of the present invention, those of ordinary skill in the art
Every other embodiment obtained without creative efforts, shall fall within the protection scope of the present invention.
Below the specific structures and work provided by the invention for binding board will be specifically introduced to implementing three by implementing one
Make principle." multiple " refer to " two and more than two " in addition, mentioned in the present invention.
Embodiment one
Fig. 1 shows the structural schematic diagram of the binding board of the offer of the embodiment of the present invention one.Referring to Fig. 1, the present invention is implemented
Example one provides a kind of binding board, which carries out binding technique for treating binding panel, which includes: adsorption zone 1；
The adsorption zone 1 includes multiple moveable absorbing units, such as 1A, 1B, 1C, 1D and 1E；The multiple moveable absorption is single
Member is for being combined to form the multiple absorption subregions to match with the partitioning scenario of the panel to be bound.
In the present embodiment, the panel to be bound includes multiple subregions, and the partitioning scenario of different panels to be bound is not
Together.Such as a certain panel to be bound includes the identical separate panels of 4 sizes, i.e. the binding panel includes 4 subregions, wherein 4
A subregion respectively corresponds 4 separate panels.It for another example, include the identical separate panels of 8 sizes for a certain panel to be bound, i.e.,
The binding panel includes 8 subregions, wherein 8 subregions respectively correspond 8 separate panels.Also for example, for a certain face to be bound
Plate, comprising 5 separate panels of different sizes, i.e., the binding panel includes 5 subregions of different sizes, wherein 5 subregions point
It Dui Ying not 5 separate panels.The multiple subregions wherein bound on panel are formed by cutting technique.
Preferably, the panel to be bound can be Q-panel.The corresponding subregion of the panel to be bound is individually only
Panel, each individually panel are formed and carrying out subregion cutting to Q-panel.These small size liquid crystal display panels, i.e.,
Independent panel can be used for small-size product, such as mobile phone, Pad.
Wherein, for the above-mentioned panel to be bound comprising subregion, before forming final products, need by and circuit
The step of plate is bound.Binding board, that is, this reality will needed to use when binding panel and circuit board is bound
Apply the binding board that example one is mentioned.Referring to Fig. 1, binding board provided in this embodiment includes: adsorption zone 1；The adsorption zone 1 wraps
Include multiple moveable absorbing units, respectively 1A, 1B, 1C, 1D and 1E.Whole in the multiple moveable absorbing unit
Or partial adsorbates unit is used to be combined to form the multiple absorption to match with the partitioning scenario of the panel to be bound point
Area.
Shown in Figure 1, absorbing unit 1A, 1B, 1C, 1D and 1E described in the present embodiment is strip Attraction block, the item
The length of shape Attraction block is identical as the length of the adsorption zone, and the width of the strip Attraction block is less than the width of the adsorption zone
The half of degree, i.e., the described adsorption zone include at least 2 absorbing units.By in described absorbing unit 1A, 1B, 1C, 1D and 1E
All or part of combination for carrying out different modes to form the multiple suctions to match with the partitioning scenario of the panel to be bound
Fufen area.
Such as shown in Fig. 2 and Fig. 3, Fig. 2 is the partitioning scenario of panel M to be bound, and Fig. 3 is the subregion feelings of panel N to be bound
Condition.Referring to figs. 2 and 3, panel M to be bound includes 2 × 4=8 subregion, and panel N to be bound includes 2 × 2=4 subregion.It is false
If using the prior art, then for panel M and N to be bound, due to its partitioning scenario difference, then suitable by needs 2
Binding board respectively binds it.
And according to method provided by the present embodiment, then only need to move several moveable suctions in the board
Coupon member, so that several moveable absorbing units are combined to form the partitioning scenario phase with panel M or N to be bound
The multiple absorption subregions matched, to realize that a board adapts to the technical effect with the panel to be bound of different multi-region situations.
For example, can move absorbing unit 1A, 1B, 1C and 1D for panel M to be bound shown in Fig. 2, make 1A, 1B, 1C
Be separated from each other with 1D, 4 absorption subregions that the partitioning scenario of each self-forming and panel M to be bound match, respectively a, b, c and
D, specific mobile result can be found in shown in Fig. 4.Wherein absorbing unit 1E is not used by.Wherein, the absorption subregion a of formation with wait tie up
The subregion 1,2 for determining panel M is corresponding；The absorption subregion b of formation is corresponding with the subregion 3,4 of panel M to be bound；The absorption subregion of formation
C is corresponding with the subregion 5,6 of panel M to be bound；The absorption subregion d of formation is corresponding with the subregion 7,8 of panel M to be bound.It needs to infuse
Meaning, (such as a and b) remains with the gap of predetermined width (such as 1~2cm) between every two adjacent adsorbent subregion, for being the
One thermal head (not shown) and the second thermal head G provide working space.Wherein, the first thermal head and the second thermal head are phase
To two thermal heads (thermal head as above and lower thermal head) of setting, binding work is carried out to treat binding panel for working together
Skill.
For another example, for panel N to be bound shown in Fig. 3, absorbing unit 1A, 1B, 1C and 1D can be moved, ties 1A, 1B
It is combined into one group and 1C, 1D is made to be combined into one group, one group of one group formed with 1C, 1D that wherein 1A, 1B are formed is separated from each other, shape
2 the absorption subregions, respectively e and f to match at the partitioning scenario with panel N to be bound, specific mobile result can be found in Fig. 5
It is shown.Wherein absorbing unit 1E is not used by.Wherein, the absorption subregion e of formation is corresponding with the subregion 1,2 of panel N to be bound；Shape
At absorption subregion f it is corresponding with the subregion 3,4 of panel N to be bound.It should be noted that between every two adjacent adsorbent subregion
The gap that (such as e and f) remains with predetermined width (such as 1~2cm), for providing working space for the second thermal head G.
In practical operation, panel (such as Q-panel) to be bound is placed on board first, it is then mobile moveable
For absorbing unit to form the multiple absorption subregions to match with the partitioning scenario of panel to be bound, each absorption subregion will be corresponding
Subregion panel is held up, and is waited for a period of time, and treats corresponding subregion panel in binding panel to each absorption subregion on board
After (such as independent panel) absorption is stablized, pre-set second thermal head (G in Fig. 4) of control, which is moved to, needs bonding's
The lower section of subregion, and aligned with pre-set first thermal head (not shown), when all preparations have carried out
Bi Hou, the second thermal head and the first thermal head can carry out hot press working, carry out binding technique to the panel of the subregion.Current work
After work, the second thermal head is moved to next subregion preparation, and the first thermal head can carry out above and below all around
Movement is to realize the accurate contraposition with the second thermal head.Binding technique successively is carried out to each subregion until institute according to above-mentioned operation
After the panel of some subregions has carried out binding technique, terminate binding work to the panel to be bound, and will bind to
Binding panel is taken away from board.
Certainly moveable absorbing unit can also first be moved when actually executing to be formed and the subregion of panel to be bound
Panel to be bound, is then placed on board by multiple absorption subregions that situation matches again, two kinds of executive modes.
From the description above it is found that the board further includes removable and the first thermal head being oppositely arranged and the second hot pressing
Head；Each subregion that first thermal head and second thermal head are used to treat binding panel together successively carries out heating and ties up
Determine technique.In addition, it is also noted that between every two adjacent adsorbent subregion (such as a and b) remain with predetermined width (such as 1~
Gap 2cm), for providing working space for the first thermal head and the second thermal head.As it can be seen that board provided in this embodiment,
Absorption subregion and the hot pressing area of board can be adjusted according to the partitioning scenario of panel to be bound, and realized to each subregion panel
While (such as independent panel) is adsorbed, board can also reserve the working region of thermal head, and binding panel is treated in realization
The push-down head of bonding technique is handled.
Preferably, in the absorbing unit have vacuum sucking holes (not shown), for the panel to be bound into
Row absorption.Preferably, the vacuum sucking holes in each absorbing unit are uniformly distributed.
In above-mentioned Fig. 4 and example shown in fig. 5, the size of multiple absorbing units in the adsorption zone 1 is all the same.But
The present invention is not limited thereto.In other embodiments of the invention, the size of multiple absorbing units in the adsorption zone can be with
Part is identical, part is different, can also be different.The panel P to be bound of irregular subregion is divided for example, with reference to Fig. 6
3,4,5,6 size of area is the same, and 1,2,7,8 size of subregion is the same.If so wanting to reach the partitioning scenario phase with panel P to be bound
The absorption subregion matched, then it is the different absorbing unit of size that each absorbing unit, which is preferably also, to be formed and panel P to be bound
The corresponding absorption subregion of partitioning scenario, such as shown in fig. 7, absorbing unit 1A can independently form an absorption subregion, be used for
The subregion 1,2 of corresponding panel P to be bound；Absorbing unit 1B can independently form an absorption subregion, for corresponding face to be bound
The subregion 3,4 of plate P；Absorbing unit 1C can independently form an absorption subregion, the subregion 5,6 for corresponding panel P to be bound；
Absorbing unit 1D can independently form an absorption subregion, the subregion 7,8 for corresponding panel P to be bound；Wherein absorbing unit
1E is not used by.
As can be seen from the above description, binding board provided in this embodiment, can according to the partitioning scenario of panel to be bound come
The absorption subregion for adjusting board realizes the purpose for binding work that a board corresponds to the binding panel of different subregions situation.
Binding board provided in this embodiment is adapted to the binding work of the panel to be bound of different subregions, to efficiently solve
Hardware caused by the board of multiple correspondingly-sizeds is needed when binding panel and binding for different subregions in the prior art
The wasting of resources and asking in the inefficiency caused by frequent changing machine platform when binding panel and binding to different subregions
Topic.
Embodiment two
For the present embodiment two unlike above-described embodiment one, the absorbing unit in the present embodiment is no longer strip absorption
Block, but blocky Attraction block, the length and width of the bulk Attraction block are respectively smaller than the length and width of the adsorption zone
Half, i.e., the described adsorption zone include at least 2 absorbing units.
Referring to Fig. 8, binding board provided in this embodiment includes: adsorption zone 1；The adsorption zone 1 includes multiple removable
Absorbing unit, respectively 1a, 1b, 1c, 1d, 1e, 1f, 1g, 1h, 1i, 1j, 1k, 1l, 1m, 1n and 1o.It is the multiple removable
Absorbing unit in all or part of absorbing unit be used to be combined to be formed and the partitioning scenario of the panel to be bound
The multiple absorption subregions to match.
Why the present embodiment by absorbing unit sets blocky Attraction block, is because more special for certain subregions
Panel to be bound, the strip Attraction block that above-described embodiment two is mentioned can not preferably be completed to bind.For example, for shown in Fig. 9
Panel to be bound, partitioning scenario unlike Fig. 2 and it is shown in Fig. 3, for panel to be bound shown in Fig. 9, according to upper
The board that embodiment is mentioned is stated, then can not complete binding work well.And use machine as shown in Figure 8 provided in this embodiment
Platform can but be completed, and specific explanations are as follows.
Such as shown in Fig. 9, Fig. 9 is the partitioning scenario of panel Q to be bound.Referring to Fig. 9, panel Q to be bound includes 1+1+1+1
=4 subregions.Using method provided by the present embodiment, absorbing unit 1a, 1b, 1c, 1d in mobile board shown in Fig. 8,
Make 1a, 1b, 1c, 1d, be combined into absorption subregion g, with the subregion 1 of corresponding panel Q to be bound；Mobile 1f, 1g, 1h, 1i, so that
1f, 1g, 1h, 1i are combined into absorption subregion h, with the subregion 2 of corresponding panel Q to be bound；Mobile 1k, 1l, so that 1k, 1l are combined into
Subregion i is adsorbed, with the subregion 3 of corresponding panel Q to be bound；Mobile 1m, 1n, so that 1m, 1n are combined into absorption subregion j, with correspondence
The subregion 4 of panel Q to be bound；Specific mobile result can be found in shown in Figure 10, form 4 absorption subregions, respectively g, h, i altogether
And j, 4 subregions that this 4 absorption subregions include with panel Q to be bound respectively correspond.Part in Figure 10 in dotted line frame
It indicates to be not engaged in the absorbing unit to form absorption subregion.It should be noted that every two adjacent adsorbent subregion between (such as g and
H) gap for remaining with predetermined width (such as 1~2cm), for providing working space for the second thermal head G.
In addition, partitioning scenario shown in the panel M and N to be bound mentioned for Fig. 2 and Fig. 3, using described in the present embodiment
Board equally can also complete the binding to it.For example, for panel to be bound N described in Fig. 3, can by absorbing unit 1a,
1b, 1f, 1g are combined into an absorption subregion, with the subregion 1 of corresponding panel N to be bound；It similarly, can be by absorbing unit 1k, 1l
It is combined into an absorption subregion, with the subregion 2 of corresponding panel N to be bound；Similarly, absorbing unit 1c, 1d, 1h, 1i can be tied
An absorption subregion is synthesized, with the subregion 3 of corresponding panel N to be bound；Similarly, absorbing unit 1m, 1n can be combined into one
Subregion is adsorbed, with the subregion 4 of corresponding panel N to be bound.It can be seen that board described in the present embodiment can also realize absorption subregion with
The one-to-one correspondence of panel subregion to be bound.Wherein, after obtaining each absorption subregion, obtained each absorption subregion pair is utilized
Each subregion of the panel to be bound is bound respectively.
From the description above as can be seen that absorbing unit is set blocky Attraction block by the present embodiment, relative to last implementation
Strip Attraction block described in example, the present embodiment can more be flexibly adapted to the various partitioning scenarios of panel to be bound.
Embodiment three
The present embodiment three provides a kind of tying up using binding board progress panel binding described in any of the above-described embodiment
Determine method, referring to Figure 11, described method includes following steps:
Step 101: according to the partitioning scenario of panel to be bound, by the multiple moveable absorbing unit be combined with
Form the multiple absorption subregions to match with the partitioning scenario of the panel to be bound.
In this step, it is assumed that the partitioning scenario of panel to be bound is as shown in figure 3, so according to the subregion of panel to be bound
The moveable absorbing unit in part on board is combined as shown in Figure 5 with the panel to be bound to be formed by situation
Partitioning scenario multiple absorption subregion a, b, c and d for matching.
Step 102: panel to be bound being placed on the adsorption zone of the board.
In this step, on the adsorption zone of board formed and the panel to be bound partitioning scenario match it is multiple
After adsorbing subregion, panel to be bound is placed on the adsorption zone of the board, so that each absorption subregion is treated tie up respectively
Determine corresponding subregion panel on panel to be adsorbed.
Step 103: each subregion of the panel to be bound being bound respectively using obtained multiple absorption subregions.
In this step, each subregion of the panel to be bound is tied up respectively using obtained multiple absorption subregions
It is fixed.Specifically, each subregion successively treated by the first thermal head and the second thermal head on binding panel carries out binding technique
Until terminating the binding work to the panel to be bound after binding all subregions on panel and completing binding.In binding work
After work, the panel to be bound bound can be taken away from board, to carry out subsequent process flow.
In the present embodiment, the step 101 and the step 102 can exchange, and sequencing does not influence the application
The use of the method.Binding method described in the present embodiment will be the multiple removable according to the partitioning scenario of panel to be bound
Dynamic absorbing unit is combined to form the multiple absorption subregions to match with the partitioning scenario of the panel to be bound, thus
The multiple absorption subregions that can use bind each subregion of the panel to be bound respectively.
Binding method provided in this embodiment has similar work with the board described in above-described embodiment for binding
Principle and technical effect, therefore details are not described herein again.
The above examples are only used to illustrate the technical scheme of the present invention, rather than its limitations；Although with reference to the foregoing embodiments
Invention is explained in detail, those skilled in the art should understand that: it still can be to aforementioned each implementation
Technical solution documented by example is modified or equivalent replacement of some of the technical features；And these are modified or replace
It changes, the spirit and scope for technical solution of various embodiments of the present invention that it does not separate the essence of the corresponding technical solution.
Claims (10)
1. a kind of binding board, which is characterized in that carry out binding technique for treating binding panel, the board includes: absorption
Area；
The adsorption zone includes multiple moveable absorbing units；
The multiple moveable absorbing unit is used to be combined to form the partitioning scenario phase with the panel to be bound
The multiple absorption subregions matched.
2. binding board according to claim 1, which is characterized in that the absorbing unit includes strip Attraction block, described
The length of strip Attraction block is identical as the length of the adsorption zone, and the width of the strip Attraction block is less than the adsorption zone
The half of width.
3. binding board according to claim 1, which is characterized in that the absorbing unit includes blocky Attraction block, described
The length and width of blocky Attraction block is respectively smaller than the half of the length and width of the adsorption zone.
4. binding board described in any one of claim 1 to 3, which is characterized in that the board further includes moving
And the first thermal head and the second thermal head being oppositely arranged；
Each subregion that first thermal head and second thermal head are used to treat binding panel together is successively heated
Binding technique.
5. binding board according to claim 4, which is characterized in that remained between every two adjacent adsorbent subregion default
Gap.
6. binding board described in any one of claim 1 to 3, which is characterized in that the multiple moveable absorption
The size of unit is all the same.
7. binding board described in any one of claim 1 to 3, which is characterized in that the multiple moveable absorption
The big fraction of unit is identical.
8. binding board described in any one of claim 1 to 3, which is characterized in that the multiple moveable absorption
The size of unit is different.
9. binding board described in any one of claim 1 to 3, which is characterized in that with true in the absorbing unit
Suction hole.
10. a kind of binding method that panel binding is carried out using binding board such as according to any one of claims 1 to 9,
It is characterized in that, comprising:
According to the partitioning scenario of panel to be bound, the multiple moveable absorbing unit is combined with formed with it is described to
Multiple absorption subregions that the partitioning scenario of binding panel matches；
Panel to be bound is placed on the adsorption zone of the board；
Each subregion of the panel to be bound is bound respectively using obtained multiple absorption subregions.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610340072.XA CN105759473B (en) | 2016-05-19 | 2016-05-19 | Bind board and binding method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610340072.XA CN105759473B (en) | 2016-05-19 | 2016-05-19 | Bind board and binding method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105759473A CN105759473A (en) | 2016-07-13 |
| CN105759473B true CN105759473B (en) | 2018-12-28 |
Family
ID=56324234
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610340072.XA Expired - Fee Related CN105759473B (en) | 2016-05-19 | 2016-05-19 | Bind board and binding method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105759473B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108445656B (en) * | 2018-04-16 | 2023-08-08 | 苏州富强科技有限公司 | Multi-size glass adsorption mechanism for COF and LCD pre-pressing device |
| CN112188830B (en) * | 2020-10-16 | 2021-09-03 | Tcl华星光电技术有限公司 | Adsorption mechanism, pressing device and pressing method of display module |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102963720A (en) * | 2012-11-02 | 2013-03-13 | 华映视讯（吴江）有限公司 | Multi-panel adsorption transporting device |
| KR101297240B1 (en) * | 2013-04-19 | 2013-08-16 | 주식회사 엠피에스 | Jig apparatus of manufacturing touch screen panel |
| CN104849887A (en) * | 2015-06-10 | 2015-08-19 | 苏州市邦成电子科技有限公司 | Novel binding machine |
| CN105223712A (en) * | 2015-08-28 | 2016-01-06 | 京东方科技集团股份有限公司 | A kind of device for the binding of substrate external circuits, crimping system and binding method |
-
2016
- 2016-05-19 CN CN201610340072.XA patent/CN105759473B/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102963720A (en) * | 2012-11-02 | 2013-03-13 | 华映视讯（吴江）有限公司 | Multi-panel adsorption transporting device |
| KR101297240B1 (en) * | 2013-04-19 | 2013-08-16 | 주식회사 엠피에스 | Jig apparatus of manufacturing touch screen panel |
| CN104849887A (en) * | 2015-06-10 | 2015-08-19 | 苏州市邦成电子科技有限公司 | Novel binding machine |
| CN105223712A (en) * | 2015-08-28 | 2016-01-06 | 京东方科技集团股份有限公司 | A kind of device for the binding of substrate external circuits, crimping system and binding method |
Also Published As
| Publication number | Publication date |
|---|---|
| CN105759473A (en) | 2016-07-13 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN105759473B (en) | Bind board and binding method | |
| HK1091027A1 (en) | A heat spreader and the method for applying the same to a heat source such as a plasma display panel | |
| CA2575469A1 (en) | Process for producing sandwich structures with particulate material pattern | |
| JP5542976B2 (en) | Bonded substrate scribing machine | |
| CN104698631B (en) | A kind of ultra-thin glass bonding structure and its stripping means, display device | |
| CN103797171B (en) | The manufacture method of fiberglas chopped strand mat and the manufacture method of motor vehicle molded ceiling material | |
| US8999094B2 (en) | Method of continuous manufacture of a composite hollow board material, and machine and computer program | |
| CN109177441A (en) | A kind of coat peeling unit and its dyestripping method | |
| BRPI0503048A (en) | method for operating a near field communication system, system or apparatus, near field communication device, computer program product, and computer readable storage medium | |
| WO2002053368A3 (en) | Method and apparatus for controlling retraction of composite materials | |
| ATE341449T1 (en) | METHOD USING TWO ADHESIVE COMPONENTS FOR LAMINATING ELASTIC BANDS | |
| MX2014001344A (en) | Improvements in and relating to corrugated board and the manufacture thereof. | |
| WO2008149801A1 (en) | Press apparatus, and press apparatus system | |
| CN106078899B (en) | A kind of PP plates automatic punch machine and PP plate processing method | |
| DE60013647D1 (en) | METHOD FOR GLUING AND DEVICE THEREFOR | |
| NO20045329L (en) | Method and apparatus for manufacturing plate-like, fiber-reinforced products | |
| JP2016013928A (en) | Cutting method of glass panel body | |
| WO2006131196A8 (en) | Dressing material and method for its production | |
| CN109272875A (en) | A kind of the bending jig and bending method of display panel | |
| CN103204377A (en) | Material distribution system and method | |
| EP1783653A3 (en) | Login control for multiple applications | |
| CN105472890A (en) | Production method and production apparatus for bonding sheet | |
| HK1105193A1 (en) | Method of evaluating evenness of suplatast tosilate crystal, even crystal, and process for producing the same | |
| CN104503114B (en) | Crimping apparatus and method | |
| WO2007116302A3 (en) | Semifinished products, footwear elements, apparatuses and methods for obtaining footwear elements, and footwear |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20181228 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |