CN105759473A - Binding machine and binding method - Google Patents
Binding machine and binding method Download PDFInfo
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- CN105759473A CN105759473A CN201610340072.XA CN201610340072A CN105759473A CN 105759473 A CN105759473 A CN 105759473A CN 201610340072 A CN201610340072 A CN 201610340072A CN 105759473 A CN105759473 A CN 105759473A
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- binding
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- subregion
- board
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
Abstract
The invention provides a binding machine and a binding method.The binding machine is used for implementing the binding process on a panel to be bound and comprises an adsorption area; the adsorption area comprises multiple movable adsorption units; the multiple movable adsorption units are used for being combined so as to form multiple adsorption subareas matched with the partition condition of the panel to be bound.The binding machine can be adapted to binding work of the to-be-bound panel which has different subareas, and thereby the problems that in the prior art, when a to-be-bound panel which has different subareas is bound, multiple machines of corresponding sizes are needed, so that hardware resource waste is caused, and in the binding process of the to-be-bound panel which has different subareas, the machines are replaced frequently, so that efficiency is low are effectively solved.
Description
Technical field
The present invention relates to Display Technique field, be specifically related to a kind of binding board and binding method.
Background technology
Q-panel refers to a face glass comprising several small size liquid crystal panels, and wherein the small size liquid crystal panel in Q-panel is generally known as independent panel, and each independent panel is formed by Q-panel is carried out subregion cutting.These small size liquid crystal panels, namely independent panel, can be used for small-size product, such as mobile phone, Pad etc..
Actually the existence of Q-panel is very favorable for liquid crystal manufacturer, for instance liquid crystal manufacturer can allow the foundries of specialty cut, and again through binding technique binding circuit board backlight etc., forms final products.
But, flexible printed circuit board (FlexiblePrintedCircuit is being carried out at present for Q-panel, or integrated circuit (IntegratedCircuit FPC), IC) during binding bonding, owing to Q-panel subregion difference causes the size difference of independent panel, prior art is when carrying out bonding for Q-panel, binding board for the Q-panel employing specific dimensions of different subregions is corresponding with it, so not only waste is bound board hardware resource but also is needed when the Q-panel that multiple subregions are different is bound frequently to change binding board, thus causing inefficiency.
Summary of the invention
For defect of the prior art, the present invention provides a kind of binding board and binding method, this board is adapted to the binding work treating binding panel of different subregion, thus efficiently solving in prior art for the hardware resource waste needing the board of multiple stage correspondingly-sized to cause in time binding panel and bind of different subregions and in the problem of the inefficiency that frequent changing machine platform causes in time binding panel and bind to different subregions.
For solving above-mentioned technical problem, the present invention provides techniques below scheme:
First aspect, the invention provides a kind of binding board, is used for treating binding panel and carries out binding technique, and described board includes: adsorption zone；
Described adsorption zone includes multiple moveable absorbing unit；
The plurality of moveable absorbing unit is for being combined forming the multiple absorption subregions matched with the described partitioning scenario treating binding panel.
Preferably, described absorbing unit includes strip Attraction block, and the length of described strip Attraction block is identical with the length of described adsorption zone, and the width of described strip Attraction block is less than the half of the width of described adsorption zone.
Preferably, described absorbing unit includes block Attraction block, and the length and width of described block Attraction block is respectively smaller than the half of the length and width of described adsorption zone.
Preferably, described board also includes the first thermal head that is removable and that be oppositely arranged and the second thermal head；
Described first thermal head and described second thermal head for together with treat each subregion of binding panel and be sequentially carried out heating binding technique.
Preferably, prepsetting gap is remained with between each two adjacent adsorbent subregion.
Preferably, the size of the plurality of moveable absorbing unit is all identical.
Preferably, the big fraction of the plurality of moveable absorbing unit is identical.
Preferably, the size of the plurality of moveable absorbing unit is all different.
Preferably, with vacuum sucking holes in described absorbing unit.
Second aspect, present invention also offers a kind of binding board utilized described in any of the above item and carries out the binding method of panel binding, including:
According to the partitioning scenario treating binding panel, it is combined the plurality of moveable absorbing unit forming the multiple absorption subregions matched with the described partitioning scenario treating binding panel；
To treat that binding panel is placed on the adsorption zone of described board；
Utilize the multiple absorption subregions obtained that described each subregion treating binding panel is bound respectively.
As shown from the above technical solution, binding board provided by the invention, it is possible to adjust the absorption subregion of board according to the partitioning scenario treating binding panel, it is achieved that the purpose of the binding work of the binding panel of a board correspondence difference partitioning scenario.Binding board provided by the invention is adapted to the binding work treating binding panel of different subregion, thus efficiently solving in prior art for the hardware resource waste needing the board of multiple correspondingly-sized to cause in time binding panel and bind of different subregions and in the problem of the inefficiency that frequent changing machine platform causes in time binding panel and bind to different subregions.
Accompanying drawing explanation
In order to be illustrated more clearly that the present embodiment or technical scheme of the prior art, the accompanying drawing used required in embodiment or description of the prior art will be briefly described below, apparently, accompanying drawing in the following describes is some embodiments of the present invention, for those of ordinary skill in the art, under the premise not paying creative work, it is also possible to obtain other accompanying drawing according to these accompanying drawings.
Fig. 1 is the structural representation of the binding board that the embodiment of the present invention one provides；
Fig. 2 is the partitioning scenario treating binding panel M；
Fig. 3 is the partitioning scenario treating binding panel N；
Fig. 4 binds panel M for treating shown in Fig. 2 to carry out the result schematic diagram that absorbing unit moves；
Fig. 5 binds panel N for treating shown in Fig. 3 to carry out the result schematic diagram that absorbing unit moves；
Fig. 6 is the partitioning scenario treating binding panel P；
Fig. 7 is for the structural representation treating the binding panel P binding board carrying out binding shown in Fig. 6；
Fig. 8 is the structural representation of the binding board that the embodiment of the present invention two provides；
Fig. 9 is the partitioning scenario treating binding panel Q；
Figure 10 binds panel Q for treating shown in Fig. 9 to carry out the result schematic diagram that absorbing unit moves；
Figure 11 is the flow chart of the binding method that the embodiment of the present invention three provides；
Above in the accompanying drawing labelling of each figure, 1 represents adsorption zone, and 1A, 1B, 1C, 1D, 1E, 1a, 1b, 1c, 1d, 1e, 1f, 1g, 1h, 1i, 1j, 1k, 1l, 1m, 1n and 1o represent each absorbing unit respectively；A, b, c, d, e, f, g, h, i, j represent the absorption subregion of formation respectively；What M, N, P and Q represented different subregion respectively treats binding panel；G represents the second thermal head.
Detailed description of the invention
For making the purpose of the embodiment of the present invention, technical scheme and advantage clearly, below in conjunction with the accompanying drawing in the embodiment of the present invention, technical scheme in the embodiment of the present invention is carried out clear, complete description, obviously, described embodiment is a part of embodiment of the present invention, rather than whole embodiments.Based on the embodiment in the present invention, the every other embodiment that those of ordinary skill in the art obtain under not making creative work premise, broadly fall into the scope of protection of the invention.
Following by implementing one to implementing three concrete structure and the operation principles specifically introducing binding board provided by the invention.It addition, " multiple " that mention in the present invention refer to " two and two or more ".
Embodiment one
Fig. 1 illustrates the structural representation binding board that the embodiment of the present invention one provides.Referring to Fig. 1, the embodiment of the present invention one provides a kind of binding board, and this board is used for treating binding panel and carries out binding technique, and this board includes: adsorption zone 1；Described adsorption zone 1 includes multiple moveable absorbing unit, such as 1A, 1B, 1C, 1D and 1E；The plurality of moveable absorbing unit is for being combined forming the multiple absorption subregions matched with the described partitioning scenario treating binding panel.
In the present embodiment, treat that binding panel comprises multiple subregion, the different partitioning scenario differences treating binding panel described in.Such as a certain treating that binding panel comprises 4 identical separate panels of size, namely this binding panel comprises 4 subregions, wherein 4 subregions corresponding 4 separate panels respectively.And for example, treating that binding panel comprises 8 identical separate panels of size for a certain, namely this binding panel comprises 8 subregions, wherein 8 subregion corresponding 8 separate panels respectively.Also such as, treating binding panel for a certain, comprise 5 separate panels varied in size, namely this binding panel comprises 5 subregions varied in size, wherein 5 subregion corresponding 5 separate panels respectively.Wherein the multiple subregions on binding panel are formed by cutting technique.
Preferably, treat described in that binding panel can be Q-panel.What the described subregion treating binding panel was corresponding is independent solely panel, each independent panel is formed by Q-panel is carried out subregion cutting.These small size liquid crystal panels, namely independent panel, can be used for small-size product, such as mobile phone, Pad etc..
Wherein, for above-mentioned comprise subregion treat binding panel, it is being formed before final products, it is necessary to through and circuit board carry out the step bound.When binding until binding panel and circuit board, it is necessary to use binding board, the binding board that namely the present embodiment one is mentioned.Referring to Fig. 1, the binding board that the present embodiment provides includes: adsorption zone 1；Described adsorption zone 1 includes multiple moveable absorbing unit, respectively 1A, 1B, 1C, 1D and 1E.All or part of absorbing unit in the plurality of moveable absorbing unit is for being combined forming the multiple absorption subregions matched with the described partitioning scenario treating binding panel.
Shown in Figure 1, absorbing unit 1A described in the present embodiment, 1B, 1C, 1D and 1E are strip Attraction block, the length of described strip Attraction block is identical with the length of described adsorption zone, and the width of described strip Attraction block is less than the half of the width of described adsorption zone, namely described adsorption zone at least includes 2 absorbing units.By all or part of combination carrying out different modes in described absorbing unit 1A, 1B, 1C, 1D and 1E is bound, with described waiting, multiple absorption subregions that the partitioning scenario of panel matches to be formed.
Such as shown in Fig. 2 and Fig. 3, Fig. 2 is the partitioning scenario treating binding panel M, and Fig. 3 is the partitioning scenario treating binding panel N.Referring to Fig. 2 and Fig. 3, treat that binding panel M comprises 2 × 4=8 subregion, treat that binding panel N comprises 2 × 2=4 subregion.Assume to adopt prior art, then for treating binding panel M and N, owing to its partitioning scenario is different, then respectively it is bound needing 2 suitable binding boards.
And according to the method that the present embodiment provides, then have only to several the moveable absorbing units in mobile described board, several moveable absorbing units are made to be combined the multiple absorption subregions to be formed with treat that the partitioning scenario of binding panel M or N matches, thus realizing the technique effect treating binding panel that a board adapts to have different multi-region situation.
Such as, panel M is bound for treating shown in Fig. 2, it is possible to mobile absorbing unit 1A, 1B, 1C and 1D, 1A, 1B, 1C and 1D is made to be separated from each other, each self-forming and treat partitioning scenario match 4 the absorption subregions of binding panel M, respectively a, b, c and d, concrete mobile result can be shown in Figure 4.Wherein absorbing unit 1E is not used by.Wherein, the absorption subregion a of formation is corresponding with the subregion 1,2 treating binding panel M；The absorption subregion b formed is corresponding with the subregion 3,4 treating binding panel M；The absorption subregion c formed is corresponding with the subregion 5,6 treating binding panel M；The absorption subregion d formed is corresponding with the subregion 7,8 treating binding panel M.It should be noted that between each two adjacent adsorbent subregion, (such as a and b) remains with the gap of predetermined width (such as 1～2cm), for providing work space for the first thermal head (not shown) and the second thermal head G.Wherein, the first thermal head and the second thermal head are two thermal heads (as above thermal head and lower thermal head) being oppositely arranged, and carry out binding technique for cooperation to treat binding panel.
And for example, panel N is bound for treating shown in Fig. 3, absorbing unit 1A, 1B, 1C and 1D can be moved, 1A, 1B is made to be combined into one group and make 1C, 1D be combined into one group, wherein 1A, 1B formed one group with 1C, 1D formation one group be separated from each other, 2 absorption subregion, respectively e and the f that the partitioning scenario formed and treat binding panel N matches, concrete mobile result can be shown in Figure 5.Wherein absorbing unit 1E is not used by.Wherein, the absorption subregion e of formation is corresponding with the subregion 1,2 treating binding panel N；The absorption subregion f formed is corresponding with the subregion 3,4 treating binding panel N.It should be noted that between each two adjacent adsorbent subregion, (such as e and f) remains with the gap of predetermined width (such as 1～2cm), for providing work space for the second thermal head G.
When practical operation, first will treat that binding panel (such as Q-panel) is placed on board, then the moveable absorbing unit multiple absorption subregions to be formed with treat that the partitioning scenario of binding panel matches are moved, corresponding subregion panel is held up by each absorption subregion, wait for a period of time, until each absorption subregion on board treat subregion panel (such as independent panel) absorption corresponding in binding panel stable after, control the mobile lower section to the subregion needing bonding of the second thermal head (G in Fig. 4) pre-set, and carry out para-position with the first thermal head (not shown) pre-set, after all preparations carry out, second thermal head and the first thermal head can carry out hot press working, the panel of this subregion is carried out binding technique.After work at present terminates, the second thermal head moves to next subregion preparation, and the first thermal head can carry out movement upper and lower all around to realize the accurate contraposition with the second thermal head.According to above-mentioned operation, each subregion carried out binding technique successively until after the panel of all of subregion all carried out binding technique, terminate this is treated the binding work of binding panel, and wait that bind panel takes away from board by what bind.
Certainly can also first move the moveable absorbing unit multiple absorption subregions to be formed with treat that the partitioning scenario of binding panel matches when reality performs, then will treat that binding panel is placed on board again, two kinds of executive modes.
From the description above it can be seen that described board also includes the first thermal head that is removable and that be oppositely arranged and the second thermal head；Described first thermal head and described second thermal head for together with treat each subregion of binding panel and be sequentially carried out heating binding technique.In addition, it is also noted that between each two adjacent adsorbent subregion (such as a and b) remain with the gap of predetermined width (such as 1～2cm), for providing work space for the first thermal head and the second thermal head.Visible, the board that the present embodiment provides, absorption subregion and the hot pressing district of board can be adjusted according to the partitioning scenario treating binding panel, realize to each subregion panel (such as independent panel) adsorbed while, board also can reserve the working region of thermal head, it is achieved the push-down head treating binding panel bonding technique processes.
Preferably, with vacuum sucking holes (not shown) in described absorbing unit, for treating that binding panel adsorbs to described.Preferably, the vacuum sucking holes in each absorbing unit is uniformly distributed.
In the example shown in above-mentioned Fig. 4 and Fig. 5, the size of the multiple absorbing units in described adsorption zone 1 is all identical.But the present invention is not limited to this.In other embodiments of the invention, the size of the multiple absorbing units in described adsorption zone can part be identical, part is different, it is also possible to different.For example, with reference to Fig. 6, treating binding panel P for irregular subregion, subregion 3,4,5,6 size is the same, and subregion 1,2,7,8 size is the same.If so wanting the absorption subregion reaching with treating that the partitioning scenario of binding panel P matches, then each absorbing unit is preferably also is the absorbing unit that differs of size, to form the absorption subregion corresponding with treating binding panel P partitioning scenario, such as shown in Figure 7, absorbing unit 1A can independently form an absorption subregion, treats the subregion 1,2 of binding panel P for correspondence；Absorbing unit 1B can independently form an absorption subregion, treats the subregion 3,4 of binding panel P for correspondence；Absorbing unit 1C can independently form an absorption subregion, treats the subregion 5,6 of binding panel P for correspondence；Absorbing unit 1D can independently form an absorption subregion, treats the subregion 7,8 of binding panel P for correspondence；Wherein absorbing unit 1E is not used by.
From the above it can be seen that the binding board that provides of the present embodiment, it is possible to the partitioning scenario according to treating binding panel adjusts the absorption subregion of board, it is achieved that the purpose of the binding work of the binding panel of a board correspondence difference partitioning scenario.The binding board that the present embodiment provides is adapted to the binding work treating binding panel of different subregion, thus efficiently solving in prior art for the hardware resource waste needing the board of multiple correspondingly-sized to cause in time binding panel and bind of different subregions and in the problem of the inefficiency that frequent changing machine platform causes in time binding panel and bind to different subregions.
Embodiment two
The present embodiment two and above-described embodiment one the difference is that, absorbing unit in the present embodiment is no longer strip Attraction block, but bulk Attraction block, the length and width of described block Attraction block is respectively smaller than the half of the length and width of described adsorption zone, and namely described adsorption zone at least includes 2 absorbing units.
Referring to Fig. 8, the binding board that the present embodiment provides includes: adsorption zone 1；Described adsorption zone 1 includes multiple moveable absorbing unit, respectively 1a, 1b, 1c, 1d, 1e, 1f, 1g, 1h, 1i, 1j, 1k, 1l, 1m, 1n and 1o.All or part of absorbing unit in the plurality of moveable absorbing unit is for being combined forming the multiple absorption subregions matched with the described partitioning scenario treating binding panel.
Why absorbing unit is set to block Attraction block by the present embodiment, be because for some subregion more special treat binding panel, the strip Attraction block that above-described embodiment two is mentioned cannot complete binding preferably.Such as, for treating binding panel shown in Fig. 9, shown in unlike Fig. 2 and the Fig. 3 of its partitioning scenario, for treating binding panel shown in Fig. 9, according to the board that above-described embodiment is mentioned, then cannot complete binding work well.And adopting the board as shown in Figure 8 that the present embodiment provides to complete, specific explanations is as follows.
Such as shown in Fig. 9, Fig. 9 is the partitioning scenario treating binding panel Q.Referring to Fig. 9, treat that binding panel Q comprises 1+1+1+1=4 subregion.Adopt the method that the present embodiment provides, absorbing unit 1a, 1b, 1c, the 1d in mobile board shown in Fig. 8, make 1a, 1b, 1c, 1d, be combined into absorption subregion g, treat the subregion 1 of binding panel Q with correspondence；Mobile 1f, 1g, 1h, 1i so that 1f, 1g, 1h, 1i are combined into absorption subregion h, treat the subregion 2 of binding panel Q with correspondence；Mobile 1k, 1l so that 1k, 1l are combined into absorption subregion i, treat the subregion 3 of binding panel Q with correspondence；Mobile 1m, 1n so that 1m, 1n are combined into absorption subregion j, treat the subregion 4 of binding panel Q with correspondence；Concrete mobile result can be shown in Figure 10, defines 4 absorption subregions altogether, respectively g, h, i and j, these 4 absorption subregions respectively with treat binding panel Q 4 the subregion one_to_one corresponding comprised.In Figure 10, the part in broken box represents the absorbing unit being not engaged in forming absorption subregion.It should be noted that between each two adjacent adsorbent subregion, (such as g and h) remains with the gap of predetermined width (such as 1～2cm), for providing work space for the second thermal head G.
Additionally, treat the partitioning scenario shown in binding panel M and N for what Fig. 2 and Fig. 3 mentioned, board described in the present embodiment is adopted also to be able to the binding to it equally.Such as, panel N is bound for treating described in Fig. 3, it is possible to absorbing unit 1a, 1b, 1f, 1g are combined into an absorption subregion, treat the subregion 1 of binding panel N with correspondence；In like manner, it is possible to absorbing unit 1k, 1l are combined into an absorption subregion, treat the subregion 2 of binding panel N with correspondence；In like manner, it is possible to absorbing unit 1c, 1d, 1h, 1i are combined into an absorption subregion, treat the subregion 3 of binding panel N with correspondence；In like manner, it is possible to absorbing unit 1m, 1n are combined into an absorption subregion, treat the subregion 4 of binding panel N with correspondence.Board described in visible the present embodiment can also realize absorption subregion and the one_to_one corresponding treating binding panel subregion.Wherein, after obtaining each absorption subregion, utilize each absorption subregion obtained that described each subregion treating binding panel is bound respectively.
From the description above it can be seen that absorbing unit is set to block Attraction block by the present embodiment, relative to the strip Attraction block described in last embodiment, the present embodiment can more be flexibly adapted to treat the various partitioning scenario of binding panel.
Embodiment three
The present embodiment three provides a kind of binding board utilized described in any of the above-described embodiment and carries out the binding method of panel binding, and referring to Figure 11, described method comprises the steps:
Step 101: according to the partitioning scenario treating binding panel, is combined the plurality of moveable absorbing unit forming the multiple absorption subregions matched with the described partitioning scenario treating binding panel.
In this step, assume to treat the partitioning scenario of binding panel as shown in Figure 3, so according to the partitioning scenario treating binding panel, moveable for the part on board absorbing unit is combined with formed as shown in Figure 5 with described partitioning scenario multiple absorption subregion a, b, c and d of matching treating binding panel.
Step 102: will treat that binding panel is placed on the adsorption zone of described board.
In this step, after the adsorption zone of board is formed the multiple absorption subregions matched with the described partitioning scenario treating binding panel, to treat that binding panel is placed on the adsorption zone of described board, adsorb so that each absorption subregion treats corresponding subregion panel on binding panel respectively.
Step 103: utilize the multiple absorption subregions obtained that described each subregion treating binding panel is bound respectively.
In this step, utilize the multiple absorption subregions obtained that described each subregion treating binding panel is bound respectively.Specifically, treat each subregion on binding panel successively by the first thermal head and the second thermal head and carry out binding technique until after all subregions on binding panel all complete binding, this is treated the binding work of binding panel by end.After binding end-of-job, it is possible to treat that binding panel is taken away from board by what bound, to carry out subsequent process flow.
In the present embodiment, described step 101 and described step 102 can be exchanged, and its sequencing does not affect the use of herein described method.Binding method described in the present embodiment, according to the partitioning scenario treating binding panel, it is combined the plurality of moveable absorbing unit forming the multiple absorption subregions matched with the described partitioning scenario treating binding panel, such that it is able to utilize the multiple absorption subregions obtained that described each subregion treating binding panel is bound respectively.
The binding method that the present embodiment provides, has similar operation principle and technique effect with the board being used for binding described in above-described embodiment, so place repeats no more.
Above example is merely to illustrate technical scheme, is not intended to limit；Although the present invention being described in detail with reference to previous embodiment, it will be understood by those within the art that: the technical scheme described in foregoing embodiments still can be modified by it, or wherein portion of techniques feature is carried out equivalent replacement；And these amendments or replacement, do not make the essence of appropriate technical solution depart from the spirit and scope of various embodiments of the present invention technical scheme.
Claims (10)
1. a binding board, it is characterised in that being used for treating binding panel and carry out binding technique, described board includes: adsorption zone；
Described adsorption zone includes multiple moveable absorbing unit；
The plurality of moveable absorbing unit is for being combined forming the multiple absorption subregions matched with the described partitioning scenario treating binding panel.
2. board according to claim 1, it is characterised in that described absorbing unit includes strip Attraction block, and the length of described strip Attraction block is identical with the length of described adsorption zone, and the width of described strip Attraction block is less than the half of the width of described adsorption zone.
3. board according to claim 1, it is characterised in that described absorbing unit includes block Attraction block, and the length and width of described block Attraction block is respectively smaller than the half of the length and width of described adsorption zone.
4. the board according to any one of claims 1 to 3, it is characterised in that described board also includes the first thermal head that is removable and that be oppositely arranged and the second thermal head；
Described first thermal head and described second thermal head for together with treat each subregion of binding panel and be sequentially carried out heating binding technique.
5. board according to claim 4, it is characterised in that remain with prepsetting gap between each two adjacent adsorbent subregion.
6. the board according to any one of claims 1 to 3, it is characterised in that the size of the plurality of moveable absorbing unit is all identical.
7. the board according to any one of claims 1 to 3, it is characterised in that the big fraction of the plurality of moveable absorbing unit is identical.
8. the board according to any one of claims 1 to 3, it is characterised in that the size of the plurality of moveable absorbing unit is all different.
9. the board according to any one of claims 1 to 3, it is characterised in that with vacuum sucking holes in described absorbing unit.
10. the binding board that a kind utilizes as according to any one of claim 1～9 carries out the binding method of panel binding, it is characterised in that including:
According to the partitioning scenario treating binding panel, it is combined the plurality of moveable absorbing unit forming the multiple absorption subregions matched with the described partitioning scenario treating binding panel；
To treat that binding panel is placed on the adsorption zone of described board；
Utilize the multiple absorption subregions obtained that described each subregion treating binding panel is bound respectively.
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| CN108445656B (en) * | 2018-04-16 | 2023-08-08 | 苏州富强科技有限公司 | Multi-size glass adsorption mechanism for COF and LCD pre-pressing device |
| CN112188830A (en) * | 2020-10-16 | 2021-01-05 | Tcl华星光电技术有限公司 | Adsorption mechanism, pressing device and pressing method of display module |
| CN112188830B (en) * | 2020-10-16 | 2021-09-03 | Tcl华星光电技术有限公司 | Adsorption mechanism, pressing device and pressing method of display module |
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| CN105759473B (en) | 2018-12-28 |
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