CN102557419A - Dividing Method Of Jointed Substrate - Google Patents
Dividing Method Of Jointed Substrate Download PDFInfo
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- CN102557419A CN102557419A CN2011104222248A CN201110422224A CN102557419A CN 102557419 A CN102557419 A CN 102557419A CN 2011104222248 A CN2011104222248 A CN 2011104222248A CN 201110422224 A CN201110422224 A CN 201110422224A CN 102557419 A CN102557419 A CN 102557419A
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- substrate
- line
- wheel
- slitter wheel
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
- C03B33/03—Glass cutting tables; Apparatus for transporting or handling sheet glass during the cutting or breaking operations
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
- C03B33/033—Apparatus for opening score lines in glass sheets
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
- C03B33/037—Controlling or regulating
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/10—Glass-cutting tools, e.g. scoring tools
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P40/00—Technologies relating to the processing of minerals
- Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
- Y02P40/57—Improving the yield, e-g- reduction of reject rates
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
Abstract
The present invention provides a dividing method of a jointed substrate, which can simplify process and endows required end surface strength of a dividing section. A first cutter wheel without a groove and a second cutter wheel with a preset groove are used. The dividing method comprises the following steps: (a) performing full-cutting scribing as full cutting with the second cutter wheel in a first direction of a second substrate, and simultaneously scribing with the first cutter wheel in a first direction of the first substrate; (b) performing fracture treatment for forming a plurality of short-sheet-shaped substrates; (c) performing scribing as full cutting with the second cutter wheel in the second direction of the second substrate of each short-sheet-shaped substrate, and simultaneously scribing with the first cutter wheel along the second direction of the first substrate; and (d) performing fracture treatment for dividing into individual unit substrates.
Description
Technical field
The invention relates to the method for dividing of a kind of use slitter wheel (also claiming tracing wheel) with the adhesive substrates disjunction.
Background technology
Fig. 7 is the sectional view that is used to make the glass adhering substrate of liquid crystal panel.In the manufacturing processed of liquid crystal panel etc., use the large-area mother substrate M that 2 thin glass substrate G1, G2 (the first substrate G1 in the outside and the second inboard substrate G2) are fitted and form with then material 11.Include the step that indivedual branches are broken into the unit substrate U that becomes product unit when so mother substrate M manufactures a product.
Be broken into the step of unit substrate U as indivedual branches, known have to use intersect the method for line.Also promptly, as shown in Figure 8, carry out the line of following intersection, the surface of the first substrate G1 of mother substrate M is formed the line S1 of directions X with slitter wheel, form the line S2 of the Y direction of intersecting subsequently with directions X.Many line that according to this X-Y direction intersected form after the reticulation, and upset mother substrate M delivers to the fracture device, pushes with the fracture bar from the second substrate G2 side, make the first substrate G1 along each line bending.Whereby, the first substrate G1 is split into discrete unit substrate U.At this moment, because the second substrate G2 not disjunction as yet, therefore the post-rift first substrate G1 is fixed on the second substrate G2 to follow material 11, can not be separated into discrete unit substrate U.
Then, as shown in Figure 9 for the second substrate G2, carry out following intersection line equally, form the line S3 of directions X, form the line S4 of Y direction subsequently, afterwards, deliver to the fracture device and make second substrate G2 division.At this moment, mother substrate M is separated into discrete unit substrate U.
So, when the disjunction adhesive substrates, the first substrate G1, the second substrate G2 are intersected rule and fracture respectively.
As the slitter wheel that is used for forming line at mother substrate M; Use has slitter wheel 1a (being called common slitter wheel 1a) with level and smooth sword leading edge crest line portion 2 shown in figure 10 and sword leading edge crest line portion 2 shown in figure 11 to be provided with breach 3 (groove), thereby is difficult for the slitter wheel 1b (being called trough of belt slitter wheel 1b) (seeing also patent documentation 1) that skids and have hypertonicity for substrate.
The former common slitter wheel 1a grinds the both sides of sword leading edge crest line portion for the scarp of the both sides that form sword leading edge crest line portion with grinding stone.Though the scarp is formed with the grinding streak; But all be trickle; Usually, the center line average roughness Ra of sword leading edge crest line portion is less than 0.4 μ m (so-called center line average roughness is one of the parameter of surfaceness that is used to represent Industrial products by " JIS B 0601-1982 " defined).The sword leading edge of hence one can see that common slitter wheel 1a is formed with very level and smooth crest line face.
The latter's trough of belt slitter wheel 1b, " APIO (the registered trademark) " slitter wheel that particularly has Matsushita Diamond Industrial Co Ltd to make.The Zhou Fangxiang length that is characterized as breach (groove) of this trough of belt slitter wheel is short than the Zhou Fangxiang length of protruding part (crest line between 2 adjacent breach is long).For example, the wheel external diameter is among " APIO " of 3mm, and the degree of depth of breach is about 1 μ m, and the Zhou Fangxiang length of breach is (so the Zhou Fangxiang length of jut is more than the 14 μ m) about 4～14 μ m.
When utilizing the method for dividing that is accompanied by the fracture step after the scribe step to come the disjunction adhesive substrates, use any one among the Zhou Fangxiang length of common slitter wheel 1a (the following simple N type wheel 1a that is) or breach " APIO " wheel (following simply is that the A type is taken turns 1b) shorter than the Zhou Fangxiang length of protruding part.
The characteristic that the line of being undertaken by N type wheel 1a and A type wheel 1b is processed describes.N type wheel 1a is because sword leading edge crest line is treated to level and smooth shape, and the groove face that therefore is formed at the line on the substrate is possible compared to far having less scar by the A type wheel 1b former of institute so carry out the good line processing of end face intensity.On the other hand, the separation property after forming about perviousness (degree of depth of grooving), the line of the line that forms is just not as A type wheel 1b.Therefore, when on mutually orthogonal directions X and Y direction, intersecting the situation of line, can be created in the intersection point part and can't form line " intersection point leap " phenomenon.
With respect to this; A type wheel 1b is owing to be formed with breach in sword leading edge crest line portion; Therefore has better line perviousness compared to N type wheel 1a; The degree of depth of formed grooving is darker than N type wheel 1a, the interlock property (being difficult for skidding property) of substrate is improved, and can be carried out at when intersecting line in the partly difficult line processing that produces " intersection point leap " of intersection point.
On the other hand; Kind as the trough of belt slitter wheel; Except " APIO " shown in figure 11 being arranged the slitter wheel; Also have in order to carry out having more the line of hypertonicity than this, shown in figure 12, the Zhou Fangxiang length trough of belt slitter wheel 1c (for example " Penett (registered trademark) " slitter wheel of Matsushita Diamond Industrial Co Ltd manufacturing) longer than the Zhou Fangxiang length of protruding part of the breach of sword leading edge crest line portion made." Penett " slitter wheel that the Zhou Fangxiang length of breach is longer than the Zhou Fangxiang length of protruding part (following simply is P type wheel 1c) impacts increase because projection gives getting ready of substrate, thereby can form dark vertical slight crack (seeing also patent documentation 1).
This type is in scribe step, to make slight crack infiltrate into the inboard, thus the hypertonicity slitter wheel of directly disjunction fully (full cutting processing).
Therefore, the known P type wheel 1c that the hypertonicity utilized arranged, the method for dividing of directly complete disjunction in the step of on to separately first direction of first substrate and second substrate, second direction, ruling.
Figure 13, Figure 14 are the figure of the processing sequence of the disjunction of expression when using the line that P type wheel 1c cuts entirely.
At first, to the surface of the first substrate G1 of mother substrate M, 1c carries out the line B1 as full cutting at directions X with P type wheel, and substrate overturn subsequently to the surface of the second substrate G2, carries out the line B2 that cuts as entirely at directions X.Whereby, do not rupture and can cut out a plurality of short-movie shape substrate Mx yet along full line of cut B1, the B2 disjunction of directions X.
Next, to short-movie shape substrate Mx, on the first substrate G1, carry out the line B3 as full cutting in regular turn along the Y direction of intersecting with directions X, the short-movie shape substrate Mx that overturns afterwards carries out the line B4 as full cutting along the Y direction in regular turn on the second substrate G2.Whereby, full line of cut B3, B4 disjunction along the Y direction are divided into a plurality of unit substrate U individually.So, adopt the full cutting processing of being undertaken by P type wheel 1c, the step that need not rupture whereby is so have the advantage that can simplify step.
[prior art document]
[patent documentation]
[patent documentation 1] International Publication WO2007/004700 communique
Summary of the invention
[problem that invention institute desire solves]
Use Zhou Fangxiang length P type wheel disjunction that 1c the carried out processing longer of the breach of sword leading edge crest line than the Zhou Fangxiang length of protruding part; Though impact big and can carry out full cutting processing because projection is bestowed getting ready of substrate; But get the reason that impact also becomes the end face weakening strength that makes adhesive substrates ready on the other hand, greatlyyer.
Therefore, when in the unit substrate U that uses P type wheel 1c to cut apart, enclosing the situation of liquid crystal etc. since end face intensity a little less than, so the situation that the defective that has liquid crystal to leak produces, causes yield to descend.
In addition, take turns with the P type in the disjunction of carrying out according to the order of Figure 13, Figure 14 explanation, must be with substrate overturn twice, the auxiliary facility that when each time overturn, needs substrate overturn perhaps carries out operation with manual work.Particularly first upset is because must be in the upset of the mother substrate M one piece before being processed to short-movie shape substrate Mx, so the big more operation of substrate area is just more difficult.
Therefore; The object of the present invention is to provide a kind of method for dividing; It is compared to intersecting the method for dividing of ruling; Not only can reduce the number of times of fracture step, when can simplify step, also when being divided into the discrete unit substrate, can give product needed end face intensity in the step of saving substrate overturn fully.
[technique means of dealing with problems]
For reaching above-mentioned purpose, adopt the technique means that is described below among the present invention.That is; The method for dividing of adhesive substrates of the present invention; Make the adhesive substrates disjunction on cross one another first direction and second direction that forms by first substrate and second baseplate-laminating, whereby this adhesive substrates is divided into the discrete unit substrate, use sword leading edge crest line not have first slitter wheel (N type wheel) of breach; And alternately be formed with projection and breach on the sword leading edge crest line, and the Zhou Fangxiang length of breach second slitter wheel (P type wheel) longer than the Zhou Fangxiang length of protruding part.First slitter wheel and second slitter wheel are configured to clip adhesive substrates are relative up and down, according to following order processing.
(a) first direction along second substrate carries out the line as full cutting with second slitter wheel, rules by first slitter wheel along the first direction of first substrate simultaneously.
(b) secondly, along the processing of rupturing of the first direction of first substrate, above-mentioned unit substrate is formed a plurality of short-movie shape substrates that are in line.
(c) then, carry out the line as full cutting along the second direction of second substrate of each short-movie shape substrate with second slitter wheel, the while rules by first slitter wheel along the second direction of first substrate.
(d) subsequently, along the processing of rupturing of the second direction of first substrate of above-mentioned each short-movie shape substrate, be divided into the discrete unit substrate.
[effect of invention]
According to the present invention, use second slitter wheel on first direction and second direction, all to carry out line as full cutting for second substrate.Use first slitter wheel all to carry out the line processing of finite depth, the processing of rupturing subsequently for first substrate in first direction and second direction.Therefore, no matter be for first substrate or for second substrate, all, there is not necessity of substrate overturn as long as use of X, the processing of Y direction of the slitter wheel of same type (N type or P type) in substrate.As for the fracture step, owing to, therefore there is no need substrate overturn also as long as to first substrate.
And in the unit substrate that cuts out at last, four limits of second substrate-side are owing to use second slitter wheel, thus end face intensity a little less than, but then end face intensity can grow on four limits of first substrate-side of being rule by first slitter wheel.
Therefore, with adhesive substrates, any one of its four limits all contains the more weak end face of end face intensity and stronger end face, not have the end face that only formed by more weak end face in four limits, so can guarantee the end face intensity of evenness.
And then, according to the present invention,, therefore can not produce the intersection point bridging phenomenon owing to not intersecting line yet.
In foregoing invention, when the different situation of the thickness of slab of substrate, be preferably the substrate that thickness of slab is thicker and be configured to second substrate.
Whereby, second substrate that thickness of slab is thicker will carry out the line as full cutting by second slitter wheel (P type wheel).The substrate that thickness of slab is thicker more can bear mechanical line processing compared to thin plate, and it is comparatively ideal that the processing that second slitter wheel that therefore will adopt the impact mode to apply strong loading is carried out puts on thicker substrate.
Description of drawings
The plat of one example of the cutting system that Fig. 1 uses when showing the method for dividing of embodiment of the present invention.
Fig. 2 is the stereographic map of chalker for the part in the cutting system of presentation graphs 1.
Fig. 3 is promptly the rupture stereographic map of device of the part in the cutting system of presentation graphs 1.
Fig. 4 (a), Fig. 4 (b) are the figure of expression according to the machining state of the processing sequence of method for dividing of the present invention and each step.
Fig. 5 (a), Fig. 5 (b) are the figure of the machining state of continue on drawing 4 expression processing sequences and each step.
Fig. 6 adopts the synoptic diagram of end face of the unit substrate of method for dividing of the present invention institute disjunction for expression.
Fig. 7 is the sectional view that is used to make the glass adhering substrate of liquid crystal panel.
Fig. 8 is the figure of the processing sequence of the previous adhesive substrates of expression.
Fig. 9 is the figure of the processing sequence of the previous adhesive substrates of expression.
Figure 10 (a), Figure 10 (b) are the figure of the shape of the common slitter wheel of expression (N type wheel).
Figure 11 is the figure of the shape of expression trough of belt slitter wheel (A type wheel).
Figure 12 is the figure of the shape of expression trough of belt slitter wheel (P type wheel).
Figure 13 (a), Figure 13 (b) are the figure of the processing sequence of the previous adhesive substrates of expression.
Figure 14 (a), Figure 14 (b) are the figure of the processing sequence of the previous adhesive substrates of expression.
M: adhesive substrates (mother substrate) Mx: short-movie shape substrate
G1: the first substrate G2: second substrate
E1: stronger end face intensity E2: more weak end face intensity
B1: the full line of cut of the first direction of second substrate (directions X)
S1: the line of the first direction of first substrate (directions X)
B2: the full line of cut of the first direction of first substrate (directions X)
B3: the full line of cut of the second direction of second substrate (Y direction)
S3: the line of the second direction of first substrate (Y direction)
B4: the full line of cut of the second direction of first substrate (Y direction)
200: the second lines of 100: the first lines
400: transport mechanism 102: chalker (line simultaneously up and down)
104: fracture device 111P: trough of belt slitter wheel (P type wheel)
112N: common slitter wheel (N type wheel) 202: chalker (line simultaneously up and down)
204: the fracture device
Embodiment
Specify the details of the method for dividing of adhesive substrates of the present invention based on diagram.Moreover below the enforcement kenel of explanation is merely an example, and what should understand is in the scope that does not break away from aim of the present invention, can take various types of kenel.
(formation of cutting system)
A kind of general view of implementing kenel of the cutting system MT that Fig. 1 uses when showing the substrate-cutting system of embodiment of the present invention.
The mother substrate M of processing object is made up of the 2 sheet glass substrate G1 that fit, G2; Unit substrate (unit tectosome) as liquid crystal panel is to form on the XY of substrate direction (face direction), to be arranged in cancellate mode, is that unit substrate can obtain product with mother substrate M disjunction.
Cutting system MT is with haply classification; First line 100 by the directions X that is used to process mother substrate M (first direction); Second line 200 of the Y direction of the short-movie shape substrate Mx that is used to process the Y direction (second direction) of mother substrate M that is is described below is used for short-movie shape substrate Mx is delivered to from first line 100 400 formations of transport mechanism of second line 200.
Be convenient explanation, formulation xyz coordinate system as shown in Figure 1 on cutting system MT.That is, being set at place, processing starting position (the first following microscope carrier 101) at cutting system MT, the directions X of mother substrate M (first direction) is consistent with the x direction of the xyz coordinate system of cutting system MT, and Y direction (second direction) is consistent with the y direction.Again, setting y direction is consistent with the substrate throughput direction of cutting system MT.
In addition, mother substrate M is to be that the second substrate G2, downside (inboard) are that the mode of the first substrate G1 is carried and put with upside (outside).
At first, first line 100 is described.First line 100 is by first microscope carrier 101, chalker 102, second microscope carrier 103, fracture device 104, the 3rd microscope carrier 105 order arranged in series and disposing according to this.
Fig. 2 representes the stereographic map (chalker 202 that is described below is same configuration, and is only different on the width of x direction) of the structure of chalker 102.Again, for ease of explanation, the diagram of conveying belt 106 is omitted in Fig. 2, and 101,103 of microscope carriers be in order to illustrate its inboard, so only representes its position with some chain lines.
Why the P type is taken turns the upside that 111P is disposed at working position; And N type wheel 112N is disposed at downside; Be because be described below when rupturing processing, the method that fracture bar 131 is descended and ruptured by the top more can rupture compared with being risen to rupture by the below simply.
In addition, can on a pair of base 119 that moves on x direction and the y direction, be respectively arranged with camera 120.Base 119 moves along extending the guide rail 122 that is arranged on the brace table 121 in the x direction.Camera 120 can come the focus of adjustment photography automatically by moving up and down, and the captured pictorial display of camera 120 is in watch-dog 123.
On the surface of the contained mother substrate M that puts of conveying belt 106 (seeing also Fig. 1) on the microscope carrier 101,102, be provided with the alignment mark (not icon) of location usefulness,, can adjust the position of mother substrate M by taking alignment mark through camera 120.Particularly, be the lip-deep alignment mark of taking the mother substrate M that conveying belt 106 are carried with camera 120, thus the position of specific alignment mark.According to the position of specific alignment mark, position deviation and the deviation in driction of mother substrate M surface when carrying can detect via picture processing.Its result to mother substrate M line (and full line of cut) time, is by line starting position inching on the y direction to position deviation.And to deviation in driction, then be to move by the straight-line interpolation that the line of combination x direction and y direction is moved to form line.Particularly, move the direction of travel adjustment by making by the mobile phase interconnection of conveying belt 106 on the x direction that moves and produce on the y direction by the driving of motor 118.
Fig. 3 is the stereographic map (chalker 204 that is described below is same configuration, and is only different at the width of directions X) of the structure of expression fracture device 104.Moreover also for the ease of explanation, the diagram of conveying belt 106 is omitted among Fig. 3, and 103,105 of microscope carriers are only represented its position with some chain lines.And then the structure that is used for coming localized camera and supporting mechanism thereof etc. and Fig. 2 to be put down in writing through alignment mark is identical, therefore indicates same-sign and explains with clipped.
Fracture bar 131 is provided with the piston 132 that is used for driving up and down in central authorities, is provided with guide rod 133 in both sides.Again, constitute at an end that is fixed with piston 132 by the pillar stiffener 134 of both sides and at base 135 places that x direction level is set up, about guide rod 133 communicating poress 136.Fracture bar 131 just can transverse shakiness when whereby, piston 132 moved up and down fracture bar 131.
The a series of action of first line 100 is described according to Fig. 1 here.First microscope carrier, the 101 contained mother substrate M that put are transported to chalker 102, and the directions X (first direction) of substrate is gone up underscore processing (upside is full cutting) simultaneously, are delivered to second microscope carrier 103 subsequently.And then, being delivered to fracture device 104 by second microscope carrier 103, the processing of rupturing is that unit substrate is taken out of with the short-movie shape substrate Mx that the x direction is arranged in delegation to the 3rd microscope carrier 105.
Secondly, transport mechanism 400 is described.This transport mechanism 400 is used to carry out first line, 100 completion of processing are taken out of the processing that moves to second line 200 to the short-movie shape substrate Mx of the 3rd microscope carrier 105.
Transport mechanism 400 is made up of the 4th microscope carrier 403, arm 404,405 of arm drive units.
The 4th microscope carrier 403 is to be provided with the mode that the 3rd microscope carrier 105 is prolonged on the y direction; Also be provided with conveying belt 106 on the 4th microscope carrier 403; Conveying belt 106 with the 3rd microscope carrier 105 prolongs, so that short-movie shape substrate Mx is transported to the angle of rotation (90 degree) of considering arm 404 and the receiving position that configures in advance.
Arm 404 be by bar-shaped arm body 404a with make through vacuum suck mechanism (not shown) short-movie shape substrate Mx removably absorption layer 404b constitute, and controlled by arm drive unit 405.The end of arm body 404a is supported by arm drive unit 405, can move up and down (z moves) and rotatable motion.
Rotatablely moving is that receiving position from the 4th microscope carrier 403 revolves and turn 90 degrees, and the short-movie shape substrate Mx of absorption layer 404b absorption is carried the 5th microscope carrier 201 that places second line 200 that is described below.
A series of action to transport mechanism 400 describes.After short-movie shape substrate Mx was transported to the receiving position that configures in advance on the 4th microscope carrier 403, arm 404 was fallen (z moves) with absorption layer 404b from the top of this short-movie shape substrate Mx, is adsorbed in the upper surface of short-movie shape substrate Mx.
Arm 404 is to rise (+z moves) with the state that is adsorbed with short-movie shape substrate Mx, revolves towards the 5th microscope carrier 201 of second line 200 subsequently to turn 90 degrees.Then, the back of stopping the rotation in the time of above arrival the 5th microscope carrier 201 descends (z moves), short-movie shape substrate Mx is carried on the conveying belt 106 that places the 5th microscope carrier 201 and removes adsorb, the conveyance that next time is waited in the position after rising once more.
Via above action, short-movie shape substrate Mx accomplishes toward the handover of second line, 200 sides.
In the processing starting position of second line 200 (the 5th microscope carrier 201), because short-movie shape substrate Mx has rotated 90 degree from carrying when placing first line 100, so the Y direction (second direction) of short-movie shape substrate Mx is consistent with the x direction of xyz coordinate system.
Secondly, second line 200 is described.Second line 200 is by the 5th microscope carrier 201, chalker 202, the 6th microscope carrier 203, fracture device 204, the 7th microscope carrier 205 order arranged in series according to this.
The 5th microscope carrier 201, the 6th microscope carrier 203, the 7th microscope carrier 205 are separately installed with the conveying belt 106 of a pair of driven independently, and short-movie shape substrate Mx is transferred in regular turn.Moreover, in the position of chalker 202 and fracture device 204, being formed with the gap of the width that does not influence the substrate conveying between the adjacent conveying belt, line processing or fracture are handled and are carried out at this gap location.
In second line 200, carry and to place the short-movie shape substrate Mx of the 5th microscope carrier 201 to be delivered to chalker 202, the Y direction of short-movie shape substrate Mx is gone up underscore processing (upside be to cut entirely) simultaneously, take out of subsequently to the 6th microscope carrier 203.And then, be delivered to fracture device 204 by the 6th microscope carrier 203, the processing of rupturing, unit substrate U is taken out of to the 7th microscope carrier 205.
(processing sequence)
Secondly, use the processing sequence of the above-mentioned cutting system MT integral body of figure explanation for adhesive substrates.Fig. 4, Fig. 5 represent according to the processing sequence of method for dividing of the present invention and the figure of the machining state in each step.
At first, with mother substrate M with the second substrate G2 side up, and then the directions X of substrate (first direction) mode consistent with the x direction and carry places on first microscope carrier 101 of first line 100.
Then, be delivered to chalker 102, on the second substrate G2, form full line of cut B1, on the first substrate G1, take turns the line S1 that 112N forms finite depth simultaneously, take out of to second microscope carrier 103 by the N type by P type wheel 111P.Its result shown in Fig. 4 (a), becomes at the second substrate G2 and is formed with full line of cut B1, is formed with the state of the line S1 of finite depth at the first substrate G1.
Then, mother substrate M is delivered to fracture device 104 from second microscope carrier 103, shown in Fig. 4 (b), pushes via the fracture bar from the second substrate G2 side and to make first substrate G1 fracture and, take out of to the 3rd microscope carrier 105 as full line of cut B2.Its result is the state that is formed with short-movie shape substrate Mx.
Subsequently, short-movie shape substrate Mx through transport mechanism 400, is transferred to the 5th microscope carrier 201 of second line 200 via the receiving position of the 4th microscope carrier 403.At this moment, short-movie shape substrate Mx is with the second substrate G2 up, and Y direction (second direction) state consistent with the x direction carries the 5th microscope carrier 201 that places second line 200.
Afterwards, Mx is delivered to chalker 202 with short-movie shape substrate, forms full line of cut B3 at the second substrate G2 by P type wheel 111P, at the line S3 of the first substrate G1 by N type wheel 112N formation finite depth, takes out of to the 6th microscope carrier 203 simultaneously.Its result shown in Fig. 5 (a), becomes at the second substrate G2 and is formed with full line of cut B3, is formed with the state of the line S3 of finite depth at the first substrate G1.
Then, short-movie shape substrate Mx is delivered to fracture device 204 from the 6th microscope carrier 203, shown in Fig. 5 (b), pushes by the fracture bar from the second substrate G2 side and to make first substrate G1 fracture and, take out of to the 7th microscope carrier 205 as full line of cut B4.Its result is for dividing the state that is broken into the unit substrate U that scatters individually.
Fig. 6 is the synoptic diagram of expression according to the state of the end face intensity of the isolating unit substrate U of said sequence.In the end face on four limits any one, its second substrate G2 cuts by P type wheel 111P entirely, and first substrate is by N type wheel 112N line, and therefore, the first base board end surface intensity E1 is stronger, and a little less than the second base board end surface intensity E2 than it is.Each minute section since stronger end face intensity with more weak end face intensity and end face intensity receives equalization.
In this enforcement kenel; The line and the full line of cut that are formed on upper and lower base plate G1, G2 all form the end face that is positioned on the same plane; Even yet in terminal area in order to be formed for electrically connecting with the outside; And when making end face form the situation of jump face, only needing increases the line radical that forms man-hour adding, and can directly be suitable for the present invention.
In addition, though this example is an object with the mother substrate that is formed by two sheet glass baseplate-laminatings, but also can use by the adhesive substrates that hard brittle material constituted beyond the glass substrate.
[utilizability on the industry]
Scribble method of the present invention can be used with adhesive substrates disjunctions such as glass substrates the time.
Claims (2)
1. the method for dividing of an adhesive substrates, it is by making the adhesive substrates disjunction on cross one another first direction and second direction that is formed by first substrate and second baseplate-laminating, and this adhesive substrates is divided into the discrete unit substrate, it is characterized in that:
Use sword leading edge crest line does not have first slitter wheel of breach, and
Alternately be formed with projection and breach on the sword leading edge crest line, and the Zhou Fangxiang length of breach second slitter wheel long than the Zhou Fangxiang length of protruding part,
First slitter wheel and second slitter wheel are configured to clip adhesive substrates and relative up and down,
(a) first direction along second substrate carries out the line as full cutting with second slitter wheel, rules by first slitter wheel along the first direction of first substrate simultaneously;
(b) secondly, along the processing of rupturing of the first direction of first substrate, above-mentioned unit substrate is formed a plurality of short-movie shape substrates that are in line;
(c) then, carry out the line as full cutting along the second direction of second substrate of each short-movie shape substrate with second slitter wheel, the while rules by first slitter wheel along the second direction of first substrate;
(d) subsequently, along the processing of rupturing of the second direction of first substrate of above-mentioned each short-movie shape substrate, be divided into the discrete unit substrate.
2. the method for dividing of adhesive substrates as claimed in claim 1 is characterized in that: wherein when first substrate situation different with the thickness of slab of second substrate, the substrate-side that thickness of slab is thicker is configured to second substrate.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010276706A JP5156085B2 (en) | 2010-12-13 | 2010-12-13 | Method for dividing bonded substrates |
| JP2010-276706 | 2010-12-13 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102557419A true CN102557419A (en) | 2012-07-11 |
| CN102557419B CN102557419B (en) | 2014-08-06 |
Family
ID=46404225
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201110422224.8A Expired - Fee Related CN102557419B (en) | 2010-12-13 | 2011-12-09 | Dividing method of jointed substrate |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP5156085B2 (en) |
| KR (1) | KR101317878B1 (en) |
| CN (1) | CN102557419B (en) |
| TW (1) | TWI458690B (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104108119A (en) * | 2013-04-02 | 2014-10-22 | 三星钻石工业股份有限公司 | Breaking apparatus |
| CN104416615A (en) * | 2013-09-03 | 2015-03-18 | 三星钻石工业股份有限公司 | Brake apparatus |
| CN106217664A (en) * | 2015-06-02 | 2016-12-14 | 三星钻石工业股份有限公司 | Disconnect device, disconnect system and switching units |
| CN111497034A (en) * | 2019-01-30 | 2020-08-07 | 三星钻石工业股份有限公司 | Cutting method and breaking method |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6540272B2 (en) * | 2015-06-26 | 2019-07-10 | 三星ダイヤモンド工業株式会社 | Breaking apparatus and breaking method |
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Also Published As
| Publication number | Publication date |
|---|---|
| KR20120065927A (en) | 2012-06-21 |
| KR101317878B1 (en) | 2013-10-16 |
| TW201223901A (en) | 2012-06-16 |
| CN102557419B (en) | 2014-08-06 |
| JP5156085B2 (en) | 2013-03-06 |
| JP2012126581A (en) | 2012-07-05 |
| TWI458690B (en) | 2014-11-01 |
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