WO2009157440A1

WO2009157440A1 - Scribing apparatus

Info

Publication number: WO2009157440A1
Application number: PCT/JP2009/061400
Authority: WO
Inventors: 彰江島谷; 辰夫喜屋武
Original assignee: 三星ダイヤモンド工業株式会社
Priority date: 2008-06-25
Filing date: 2009-06-23
Publication date: 2009-12-30
Also published as: JP5280442B2; TW201008887A; CN102083760B; JPWO2009157440A1; KR101220859B1; KR20110031340A; TWI369339B; CN102083760A

Abstract

Provided is a scribing apparatus (1000), which can form scribing lines on two parts at the same time, on the front surface and the rear surface of a bonded substrate formed by bonding brittle substrates, and thus, can shorten a machining time required for cutting out a predetermined number of panel substrates from the bonded substrates, such as a liquid crystal mother panel. The scribing apparatus is provided with a fixed scribing mechanism, which is fixed on a base (301) and forms first scribe lines at the same time on the front surface and the rear surface of the bonded substrate; and a movable scribing mechanism, which is movably arranged on the base (401) and forms second scribe lines parallel to the first scribe lines at the same time on the front surface and the rear surface of the bonded substrate. The fixed scribing mechanism and the movable scribing mechanism are configured so that the first and the second scribe lines are formed at the same time and the distance between the first and the second scribe lines is adjusted by the distance between the both mechanisms.

Description

Scribing equipment

The present invention relates to a scribing apparatus, and in particular, is disposed on a processing line for performing a process of cutting out a plurality of panel substrates from a bonded substrate formed by bonding two brittle material substrates, and scribes (scribes) the bonded substrate. Is related to the scribing apparatus capable of simultaneously performing the process on the front surface and the back surface of the bonded substrate.

Conventionally, when cutting a brittle substrate such as a plate glass, generally, a scratch (scribe) is made on one side along a line to be cut, and the plate glass is folded along a line (scribe line) with the scratch. Is done.

By the way, the liquid crystal panel of the liquid crystal display device has a structure in which two glass plates are bonded together. For this reason, such a liquid crystal panel is cut out from a bonded substrate formed by bonding two glass plates. In this case, it is necessary to form scribe lines on both the front and back surfaces of the bonded substrate.

Conventionally, such a bonded substrate has been processed to form a scribe line on each side, and Patent Document 1 includes a processing line used in the bonding substrate cutting process as described above. It is disclosed.

Hereinafter, the processing line (liquid crystal panel cutting line) disclosed in Patent Document 1 will be specifically described with reference to the drawings.

FIG. 11 is a block diagram of a conventional liquid crystal panel dividing line 900, and FIG. 12 is a perspective view showing a scribing device 901 that constitutes the liquid crystal panel dividing line 900.

The scribing device 901 includes a table 905 on which the liquid crystal mother panel 908 is placed. The table 905 is provided so as to be movable in the Y1 direction (a predetermined direction parallel to the panel placement surface) and to be rotatable in the θ1 direction, that is, rotatable in a plane including the table placement surface. . The liquid crystal mother panel 908 has a structure in which two glass substrates are bonded to each other.

The scribing device 901 is a scribing device for scribing the surface of an upper glass substrate (hereinafter also referred to as an A-side substrate) of two glass substrates constituting the liquid crystal mother panel 908 placed on the table 905. A head 811 is provided slidably along the X1 direction (the width direction of the liquid crystal mother panel). A tip holder 806 is attached to the scribe head 811, and a cutter wheel tip 804 for scribing the liquid crystal mother panel 908 along the planned scribe line S is attached to the lower end of the tip holder 806. In addition, the scribing device 901 is provided with a motor 812 for driving the scribing head 811 along the X1 direction. The scribing device 901 includes a CCD camera 929 for recognizing an alignment mark formed on the liquid crystal mother panel for positioning the liquid crystal mother panel 908, and a monitor 930 for displaying the alignment mark recognized by the CCD camera 929. ing.

A break device 902 for breaking the A-side substrate of the scribed liquid crystal mother panel 908 is provided on the downstream side of the scribe device 901. Further, a scribing device 901A is disposed on the downstream side of the breaking device 902. The scribing device 901A has the same configuration as the scribing device 901. Of the two glass substrates constituting the liquid crystal mother panel 908, the substrate opposite to the A-side substrate (hereinafter also referred to as B-side substrate). )). In addition, a break device 902A is disposed on the downstream side of the scribe device 901A. The break device 902A has the same configuration as the break device 902, and breaks the B-side substrate along a scribe line formed on the B-side substrate.

Next, the operation of the processing line 900 having such a configuration for cutting a bonded substrate will be described.

The liquid crystal mother panel 908 is placed on the table 905 of the scribe device 901 with its A-side substrate facing upward by a material supply mechanism (not shown). The scribe device 901 forms a scribe line on the A-side substrate of the liquid crystal mother panel 908 on the table 905 by the cutter wheel chip 804.

The liquid crystal mother panel 908 in which the scribe line S is formed on the A-side substrate by the scribe device 901 is inverted by a reversing mechanism (not shown) and placed on the table of the breaking device 902 with the A-side substrate facing down. Break device 902 cuts the A-side substrate of liquid crystal mother panel 908 along scribe line S.

The liquid crystal mother panel 908 obtained by dividing the A-side substrate by the break device 902 is conveyed by a conveyance mechanism (not shown) and placed on the table 905 of the scribe device 901A so that the A-side substrate is on the lower side. The scribing device 901A forms a scribe line on the B-side substrate by the cutter wheel chip 804. The liquid crystal mother panel 908 having the B-side substrate scribed by the scribing device 901A is inverted by a reversing mechanism (not shown) and placed on the table of the breaking device 902A with the B-side substrate facing down. The breaker 902A divides the B-side substrate along the scribe line by pressing the A-side substrate from above.

Thereafter, the cut pieces of the A-side substrate and the B-side substrate adhered by the adhesive seal are removed together.

However, in the above-described conventional liquid crystal panel cutting processing line 900, the liquid crystal mother panel 908 must be scribed and broken on each side, which increases the processing time and increases the installation area of the apparatus. There is.

As a solution to such a problem, for example, there are scribing apparatuses disclosed in Patent Document 1 and Patent Document 2. *

FIG. 13 is a diagram showing a scribing device disclosed in these patent documents.

The scribing device 950 includes a table 951 on which the liquid crystal mother panel 908 is placed, a fixed body 952 that fixes the liquid crystal mother panel 908 to the table 951, and a pair of upper and

lower cutter heads

953 and 954. The front and back substrates of the liquid crystal mother panel 908 fixed to 951 are simultaneously scribed by the pair of cutter heads.

Further, Patent Document 1 discloses a processing line provided with a scribing device that simultaneously forms a scribing line on the front and back substrates of the bonded substrate.

FIG. 14 is a plan view of a processing line 100 for a mother substrate of a liquid crystal panel disclosed in Patent Document 1.

This processing line 100 is a processing line for dividing a liquid crystal mother panel formed by bonding two glass substrates, which is a mother substrate of a liquid crystal panel, into a liquid crystal panel.

The liquid crystal panel dividing line 100 includes a loader 12 that stocks the liquid crystal mother panel 8. The liquid crystal panel dividing line 100 is provided with a material supply robot 13. The feeding robot 13 sucks the liquid crystal mother panels 8 stocked in the loader 12 one by one and places them on the conveyor 14. The liquid crystal mother panel 8 placed on the conveyor 14 is conveyed and positioned in front of the processing line 100 (rightward in FIG. 14).

Further, the processing line 100 includes a liquid crystal panel cutting device 1.

FIG. 15 is a perspective view for explaining the liquid crystal panel cutting apparatus 1, and FIG. 16 is a perspective view showing a main part of the liquid crystal panel cutting apparatus 1 shown in FIG.

The liquid crystal panel cutting apparatus 1 includes a table 5 on which the liquid crystal mother panel 8 supplied from the conveyor 14 is placed. The liquid crystal panel cutting apparatus 1 is provided with a suction conveyance mechanism 2. The suction conveyance mechanism 2 sucks the liquid crystal mother panel 8 placed and positioned on the conveyor 14 and places it on the table 5. The suction conveyance mechanism 2 has a guide 27 provided along a horizontal direction indicated by an arrow Y3. The guide 27 is provided with an arm that is slidable in the horizontal direction. At the tip of the arm, a suction pad 25 provided to suck the liquid crystal mother panel 8 and a suction pad 25 are provided. And a cylinder 26 for driving in the vertical direction.

The liquid crystal panel cutting apparatus 1 includes a scribe mechanism 4 for scribing the liquid crystal mother panel 8 as shown in FIG. The scribe mechanism 4 is arranged on the opposite side of the conveyor 14 with respect to the table 5. The scribe mechanism 4 has a pair of

support columns

122 and 123. A pair of upper and

lower guide bars

124 and 125 are provided between the pair of

columns

122 and 123, and the liquid crystal mother panel 8 transferred from the table 5 by the suction conveyance mechanism 2 is between these

guide bars

124 and 125. Is supposed to pass through.

The guide bar 124 is provided with a scribe portion 102 for scribing the surface of the liquid crystal mother panel 8 slidably along the direction of the arrow X3. A scribe portion 103 for scribing is provided slidably along the direction of the arrow X3 so as to face the scribe portion 102.

Motors

113 and 114 for sliding the

scribe parts

102 and 103 along the direction of the arrow X3 are attached to the column 122, respectively.

The scribe unit 102 includes a moving body 109 that is slidable along the direction indicated by the arrow X3. On the lower surface of the moving body 109, a scribe head 111 is slidably provided along the direction indicated by the arrow Y3. A chip holder 106 is provided on the lower surface of the scribe head 111. A cutter wheel tip 104 is rotatably provided at the lower end of the tip holder 106.

The scribe unit 103 has the same configuration as the scribe unit 102 described above, and is provided to face the scribe unit 102. The scribe unit 103 has a moving body 109 that is slidable along the direction of the arrow X3. On the upper surface of the moving body 109, a scribe head 111 is slidably provided along the direction of the arrow Y3. A chip holder 107 is provided on the upper surface of the scribe head 111. A cutter wheel tip 105 is rotatably provided at the upper end of the tip holder 107.

The liquid crystal panel cutting device 1 includes a capturing mechanism 31. The capturing mechanism 31 grips the liquid crystal mother panel 8 that protrudes from the upper surface of the table 5 so as to grip one end thereof. The capturing mechanism 31 is provided with a capturing device 32 having a substantially Y shape when viewed from the direction indicated by the arrow 127 in FIG. The catcher 32 is configured to be openable and closable by the operation of the cylinder 33 and grips one end of the liquid crystal mother panel 8 protruding from the upper surface of the table 5. A pair of mats 34 is affixed to the catcher 32 at positions where the mats abut on both sides of the grasped liquid crystal mother panel 8.

The capturing mechanism 31 includes a support column 35 that supports the capturing device 32 so as to be movable up and down. A motor 36 for moving the catcher 32 up and down is provided on the support 35. The support 35 is provided so as to be movable back and forth along the direction indicated by the arrow Y3 by a motor (not shown).

Moreover, the liquid crystal panel dividing line 100 includes a conveyor 15 as shown in FIG. The conveyor 15 conveys and positions the liquid crystal mother panel 8A for one row divided by the liquid crystal panel dividing device 1 to a downstream positioning position. The conveyor 15 is provided with a rotary table 16. The turntable 16 rotates the liquid crystal mother panel 8A positioned at the positioning position by 90 degrees.

The liquid crystal panel cutting line 100 includes a liquid crystal panel cutting device 1A. The liquid crystal panel cutting device 1A has the same configuration as the liquid crystal panel cutting device 1 except that the width dimension is narrower than the liquid crystal panel cutting device 1 described above. Therefore, detailed description of the configuration of the liquid crystal panel cutting apparatus 1A is omitted. The liquid crystal panel dividing apparatus 1A divides the liquid crystal mother panel 8A rotated 90 degrees by the rotary table 16 into the liquid crystal panel 9. The liquid crystal panel 9 cut by the liquid crystal panel cutting apparatus 1 </ b> A is carried out to the product stock 18 by the material removal robot 17.

The operation of the liquid crystal panel dividing line 100 having such a configuration will be described.

When the feeding robot 13 sucks the liquid crystal mother panels 8 stocked in the loader 12 one by one and places them on the conveyor 14, the liquid crystal mother panel 8 placed on the conveyor 14 is separated from the liquid crystal panel dividing line 100. Is moved forward (rightward in FIG. 1) and positioned.

17 and 18 are front views for explaining the operation of the conventional liquid crystal panel cutting apparatus 1.

The suction pad 25 of the suction conveyance mechanism 2 provided in the liquid crystal panel cutting device 1 sucks the liquid crystal mother panel 8 positioned on the conveyor 14, and a scribe scheduled line S5 preset on the liquid crystal mother panel 8 is scribed. The liquid crystal mother panel 8 is conveyed to a position where one end of the liquid crystal mother panel 8 protrudes from the table 5 so as to be positioned between the cutter wheel chip 104 provided in the section 102 and the cutter wheel chip 105 provided in the scribe section 103. To do. The

cutter wheel tips

104 and 105 are both opposed on the scheduled scribe line S5. The table 5 sucks and fixes the conveyed liquid crystal mother panel 8. A trap 32 provided in the trapping mechanism 31 grips one end of the liquid crystal mother panel 8.

The

cutter wheel chips

104 and 105 simultaneously scribe the

glass substrates

10A and 10B constituting the liquid crystal mother panel 8 along the scheduled scribe line S5. If the moving speed of the

cutter wheel chips

104 and 105 when the

cutter wheel chips

104 and 105 ride on the

glass substrates

10A and 10B, respectively, is smaller than the moving speed at the time of scribing, the

glass substrates

10A and 10B are missing due to a shock at the time of riding. Can be prevented.

Such

cutter wheel chips

104 and 105 can form deep vertical cracks that reach the inner surfaces of the

glass substrates

10A and 10B.

Since the deep vertical cracks reaching the inner surfaces of the

glass substrates

10A and 10B are formed by the

cutter wheel chips

104 and 105 along the planned scribe line S5, as shown in FIG. 18, the liquid crystal mother panel 8 If the catcher 32 holding one end of the liquid crystal is moved rightward as it is, the cut piece 63 cut off from the liquid crystal mother panel 8 along the formed scribe line can be removed.

Then, the conveyor 15 conveys the liquid crystal mother panel 8A placed by the catcher 32 to a downstream positioning position and positions it. The turntable 16 rotates the liquid crystal mother panel 8A positioned at the positioning position by 90 degrees. The liquid crystal panel dividing apparatus 1A divides the liquid crystal mother panel 8A into the liquid crystal panel 9 by the same operation as the operation of the liquid crystal panel dividing apparatus 1 described above. The liquid crystal panel 9 cut by the liquid crystal panel cutting apparatus 1 </ b> A is carried out to the product stock 18 by the material removal robot 17.

In the processing line having such a configuration, the suction conveyance mechanism 2 is configured so that the scribe line of the liquid crystal mother panel 8 is positioned between the

cutter wheel chips

104 and 105 provided in the

scribe units

102 and 103, respectively. The mother panel 8 is held and transported. The

cutter wheel chips

104 and 105 are separated by scribing the liquid crystal mother panel 8 conveyed by the suction conveyance mechanism 2 so that the planned scribe line is positioned between the

cutter wheel chips

104 and 105 along the planned scribe line. To do.

For this reason, the liquid crystal mother panel composed of two glass substrates can be divided simultaneously on both sides, thereby reducing the processing time for dividing the liquid crystal mother panel and dividing the liquid crystal mother panel. The installation area of the apparatus for doing so can be greatly reduced.
International Publication No. 02/057192 Pamphlet Japanese Utility Model Publication No.59-22101

However, in the liquid crystal panel cutting line (processing line) 900 described with reference to FIGS. 14 to 18, the front surface and the back surface of the bonded substrate are simultaneously scribed. It will be performed one place at a time. For this reason, there exists a problem that the processing time required to cut out a predetermined number of panel substrates (liquid crystal panel) from a bonding substrate becomes long.

The present invention has been made to solve the above-described conventional problems, and scribe lines can be simultaneously formed on the front and back surfaces of a bonded substrate formed by bonding a brittle substrate. An object of the present invention is to obtain a scribing apparatus capable of shortening the processing time required to cut out a predetermined number of panel substrates from a bonded substrate such as a liquid crystal mother panel.

A scribe device according to the present invention is a scribe device for forming a scribe line on a bonded substrate having a structure in which a brittle substrate is bonded, and is fixed on a base placed on an installation surface. A fixed scribe mechanism that simultaneously forms a first scribe line on the front surface and the back surface of the laminated substrate, and a movable scribe mechanism provided on the base, and the first scribe line simultaneously on the front surface and the back surface of the bonded substrate; A movable scribe mechanism that forms a second parallel scribe line, wherein the fixed scribe mechanism and the movable scribe mechanism are formed such that the first and second scribe lines are formed simultaneously and the first and second scribe lines are formed. The distance between the lines is adjusted by the distance between the two mechanisms, whereby the above object is achieved.

The present invention provides the scribing apparatus, wherein the first and second scribe lines are formed between a position where the first scribe line is formed by the fixed scribe mechanism and a position where the second scribe line is formed by the movable scribe mechanism. It is preferable to have a support region forming mechanism for forming a support region for supporting the bonded substrate in a range corresponding to the separation distance of the lines.

The present invention is the above scribing apparatus, further comprising a support base provided between the fixed scribe mechanism and the movable scribe mechanism, for supporting the bonded substrate board, wherein the support base is an intake air flow or a jet air flow. A plurality of openings formed so as to be generated, and when the bonded substrate is transferred, the bonded substrate is supported to be lifted on the support table by the jet air flow, and when the bonded substrate is scribed. It is preferable that the laminated substrate is configured to be adsorbed and fixed to the support base.

The present invention provides the scribing apparatus, wherein the support base is fixed to the base so as to be positioned in the vicinity of a position where the first scribe line is formed, and the second scribe line. And a movable support table provided on the base so as to be movable together with the second scribe mechanism.

In the scribing apparatus according to the present invention, the fixed scribe mechanism is mounted on the base so as to slide in a horizontal direction, and the horizontal slide forms a first scribe line on the surface of the bonded substrate. A first upper scribe portion that is mounted on the base so as to slide in the same direction facing the first upper scribe portion, and by sliding in the same direction as the first upper scribe portion, A first lower scribe portion that forms a first scribe line on the back surface of the bonded substrate, and the movable scribe mechanism is attached to slide in a horizontal direction on the base, A second upper scribe portion that forms a second scribe line on the surface of the bonded substrate by sliding, and the second upper scribe portion on the base. A second lower scribe portion that is attached to slide in the same direction as the second upper scribe portion and forms a second scribe line on the back surface of the bonded substrate board by sliding in the same direction as the second upper scribe portion It is preferable to have.

According to the present invention, in the scribing apparatus, the fixed scribe mechanism includes a pair of vertical struts attached to face the base, and a first attached parallel to each other so as to extend in the horizontal direction between the vertical struts. A pair of upper and lower guide struts, wherein the first upper scribe portion is attached to the first upper guide strut so as to slide in a horizontal direction, and the first upper lateral slide member, A first upper longitudinal slide member attached to the upper lateral slide portion so as to slide in a vertical direction; and a scribe head having a tip holder attached to the first upper longitudinal slide member and holding a cutter wheel tip. The first lower scribe portion is attached to the first lower guide column so as to slide in the horizontal direction. And a first lower longitudinal slide member attached to the first lower lateral slide portion so as to slide in the vertical direction, and attached to the first lower longitudinal slide member to hold the cutter wheel tip It is preferable to have a scribe head having a chip holder.

In the scribing apparatus according to the present invention, the movable scribing mechanism includes a pair of movable blocks provided on a pair of rail members attached to face the base so as to be movable along the rail members; Each of the movable blocks has a pair of vertical movable columns attached to face each other, and a second pair of upper and lower guide columns attached in parallel to each other so as to extend horizontally between the vertical movable columns, The second upper scribe portion is attached to the second upper guide column so as to slide in the horizontal direction, and to be slid in the vertical direction on the second upper side slide portion. Scrub having a second upper vertical slide member formed and a tip holder attached to the second upper vertical slide member and holding a cutter wheel tip The second lower scribe portion is attached to the second lower guide column so as to slide in the horizontal direction, and the second lower scribe portion A second lower longitudinal slide member attached to the lateral slide portion so as to slide vertically; and a scribe head having a tip holder attached to the second lower longitudinal slide member and holding a cutter wheel tip. It is preferable to have.

According to the present invention, in the scribing apparatus, the support region forming mechanism is disposed so as to extend along a movement path of the movable scribe mechanism, and has a pair of opposing guide members having component guide grooves, and each of the guide members. Each chain member has a pair of chain members that are movably attached along the component guide grooves, and a plurality of roller support bars that are attached to the pair of chain members at regular intervals and support a plurality of rollers. One end of each chain is fixed to the movable scribe mechanism, and the other end of each chain is urged in a predetermined direction so that a constant tension is applied to the chain member. The movement causes the chain member to move, and the rollers supported by the plurality of roller support bars move between the first and second scribe mechanisms. And infested support region for supporting the bonded substrate is preferably configured to be a size corresponding to the distance between the first and second scribe lines.

In the scribing apparatus according to the present invention, it is preferable that the bonded substrate is a rectangular mother substrate for cutting out a liquid crystal panel having a bonded structure in which two glass substrates are bonded.

Hereinafter, the operation of the present invention will be described.

In the present invention, a fixed scribe mechanism that is fixedly provided on a base and simultaneously forms a first scribe line on the front and back surfaces of the bonded substrate, and is provided movably on the base. A movable scribe mechanism that simultaneously forms a second scribe line parallel to the first scribe line on the front and back surfaces of the laminated substrate, and the fixed scribe mechanism and the movable scribe mechanism are connected to the first and second scribe lines. Since the scribe line is formed at the same time and the distance between the first and second scribe lines is adjusted by the distance between the two mechanisms, the front and back surfaces of the bonded substrate formed by bonding the brittle substrate In addition, a scribe line can be formed at two locations at the same time, thereby cutting a predetermined number of panel substrates from a bonded substrate such as a liquid crystal mother panel. It is possible to shorten the processing time required to put out.

In the present invention, the first scribe line and the second scribe line are formed between the first scribe line formed position by the fixed scribe mechanism and the second scribe line formed position by the movable scribe mechanism. Since it has a support region forming mechanism for forming a support region for supporting the bonded substrate in a range corresponding to the separation distance, the region for supporting the strip substrate is always appropriate even when the second scribe mechanism is moved. Can be formed.

Further, in the present invention, a support base is provided between the fixed scribe mechanism and the movable scribe mechanism and supports the bonded substrate, and the support base generates an intake air flow or a jet air flow. A plurality of openings formed so as to support the laminated substrate on the support table by the blown air flow when the laminated substrate is transported, and when the laminated substrate is scribed, Since the bonded substrate is sucked and fixed to the support base, the bonded substrate is fixed so as not to be displaced at the time of scribing, and can be easily transferred when the bonded substrate is transferred.

As described above, according to the present invention, a fixed scribe mechanism that is fixedly provided on a base and forms a first scribe line simultaneously on the front and back surfaces of the bonded substrate, and is movable on the base. And a movable scribe mechanism that forms a second scribe line parallel to the first scribe line simultaneously on the front surface and the back surface of the bonded substrate, the fixed scribe mechanism and the movable scribe mechanism, Since the first and second scribe lines are formed at the same time and the distance between the first and second scribe lines is adjusted by the separation distance between the two mechanisms, the bonding is performed by bonding the brittle substrate. Two scribing lines can be formed simultaneously on the front and back surfaces of the laminated substrate, respectively, so that a predetermined amount can be obtained from a laminated substrate such as a mother substrate of a liquid crystal panel. It is possible to shorten the processing time required to cut the panel substrates.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.

(Embodiment 1)
FIGS. 1 to 10 are diagrams for explaining a substrate cutting system according to Embodiment 1 of the present invention. FIG. 1 shows a processing line for a brittle material substrate in the substrate cutting system of Embodiment 1, and FIG. A mother substrate Ms (FIG. (A)) of the liquid crystal panel which is the brittle material substrate, a strip substrate Ts (FIG. (B)) obtained from the mother substrate, and a liquid crystal panel substrate Ps (FIG. (C) obtained from the strip substrate. )). FIG. 3 is a plan view showing a scribing apparatus installed on the processing line, and FIG. 4 shows a cross-sectional structure taken along line IV-IV of the scribing apparatus shown in FIG. 5A is a view of the scribing device shown in FIG. 3 as viewed in the direction of the arrow indicated by the line VV in FIG. 3, and FIG. 5B is a view showing the movable scribing portion of the scribing device. It is.

The substrate cutting system 200 according to the first embodiment includes a processing line for cutting a bonded substrate obtained by bonding two brittle material substrates to create a panel substrate (liquid crystal panel substrate) Ps used for a liquid crystal panel or the like. .

In addition, the bonding board | substrate which bonded two brittle material board | substrates is the bonding board | substrate which bonded together the glass substrate for forming flat display panels, such as a liquid crystal panel, a plasma display panel, and an organic electroluminescent display panel. In addition, it includes a bonded substrate of a semiconductor device in which a glass substrate is bonded to a silicon substrate, a sapphire substrate, or the like. Here, a mother substrate of a liquid crystal panel will be described as an example.

The processing line (substrate cutting system) 200 includes a mother substrate loader unit 200a for supplying a mother substrate Ms of a liquid crystal panel onto the processing line 200, and a mother substrate Ms supplied from the mother substrate loader unit 200a. A mother substrate dividing unit 200b that creates the substrate Ts, and a strip substrate rotating and conveying unit 200c that rotates the strip substrate Ts divided by the mother substrate dividing unit 200b by 90 degrees and conveys it to the downstream processing unit. Yes. Further, the processing line 200 includes a strip substrate dividing unit 200d that divides the strip substrate Ts transported from the strip substrate rotation transport unit 200c to create a liquid crystal panel substrate Ps, and a liquid crystal created by the strip substrate partition unit 200d. A panel substrate rotating / conveying unit 200e that rotates the panel substrate Ps and conveys it to the panel substrate inspection unit 200f on the downstream side thereof. The panel substrate inspection unit 200f is a portion that inspects the dimensional accuracy and the like of the panel substrate created by processing in the processing line 200.

Here, the mother substrate Ms shown in FIG. 2A has a dimension in the horizontal direction (left and right direction in FIG. 2A), that is, a dimension in a direction parallel to the conveying direction in the processing line 200, 2500 mm. The length in the vertical direction (the vertical direction in FIG. 2 (a)), that is, the width in the width direction of the processing line 200 has a rectangular shape of 2200 mm, and is divided along the scribe lines Lm1 to Lm6. It is cut out as Ts. Also, the strip substrate Ts shown in FIG. 2B is divided along the scribe lines Lt1 to Lt8, and is cut out as four panel substrates Ps (see FIG. 2C).

Further, the strip substrate rotating / conveying section 200c sucks and transports the strip substrate. However, this may be one that conveys the strip substrate while holding one end thereof.

Hereinafter, the configuration of each part constituting the processing line of the first embodiment will be described in detail.

The mother board loader unit 200a includes mechanisms corresponding to the loader 12, the feed robot 13, and the conveyor 14 in the conventional processing line 100 shown in FIG. 14, and is a mother board stored in a predetermined storage location. Ms is conveyed to the mother substrate dividing part 200b. The mother substrate dividing unit 200b is a scribe mechanism (the scribe mechanism shown in FIGS. 15 and 16) that simultaneously scribes the front surface side substrate and the back surface side substrate of the mother substrate, similar to the cutting device 1 in the conventional processing line 100 shown in FIG. 4). Further, the strip substrate rotating / conveying unit 200c includes mechanisms corresponding to the capturing mechanism 31, the conveyor 15 and the rotary table 16 in the conventional processing line 100 shown in FIG. 11, and the mother substrate dividing unit 200b causes the mother substrate Ms. The strip substrate Ts cut out from is transported from the mother substrate dividing section 200b to the strip substrate dividing section 200d.

The strip substrate dividing unit 200d according to the first embodiment has a scribing mechanism for simultaneously scribing the front and back surfaces of the brittle material substrate one by one in the cutting apparatus 1A in the conventional processing line 100 described with reference to FIGS. 4 includes a scribing device 1000 having a scribing mechanism different from 4, and this scribing device 1000 includes a fixed scribing mechanism unit 300 disposed on the strip substrate rotation transport unit 200 c side (line upstream side), and a panel substrate rotation transport unit. It has a movable scribe mechanism 400 arranged on the 200e side (downstream side of the line), and is configured such that scribing from the front side and the back side of the strip substrate Ts can be executed simultaneously at two locations.

First, the fixed scribe mechanism 300 will be described.

The fixed scribing mechanism unit 300 includes a fixed base 301 fixed to the installation surface R of the scribing device 1000, and a fixed interval on the fixed base 301 according to the short side dimension of the strip substrate. It has a pair of component mounting fixing

blocks

310a and 310b mounted so as to face each other, and a pair of opposing

vertical columns

311a and 311b fixed on the

respective blocks

310a and 310b. Also, fixed

guide columns

320a and 320b are attached between the opposed

vertical columns

311a and 311b so as to be positioned in parallel vertically. Guide grooves 321 are formed on the side surfaces of the

guide columns

320a and 320b on the downstream side of the line, and the guide grooves 321 of the upper guide column 320a and the lower guide column 320b are formed along the guide grooves. An upper lateral slide member 322a and a lower lateral slide member 322b that slide in the lateral direction (that is, the direction across the processing line) between the vertical struts are fitted. Note that a mechanism for driving the upper side slide member 322a and the lower side slide member 322b is configured by a linear motor or the like incorporated in the

guide columns

320a and 320b, although not shown.

An upper vertical slide member 323a is attached to the upper horizontal slide member 322a so as to be slidable in the vertical direction (vertical direction) with respect to the horizontal slide member 322a, and a lower end portion of the vertical slide member 323a. The scribe head 331 is fixed to the front. A tip holder 332 is attached to the lower surface of the scribe head 331. Further, a cutter wheel tip 333 that performs scribing along the scribe line of the strip substrate Ts is disposed at the tip of the tip holder 332 so that the cutting edge faces downward. Is held in. Similarly, a lower vertical slide member 323b is attached to the lower horizontal slide member 322b so as to be slidable in the vertical direction (vertical direction) with respect to the horizontal slide member 322b. A scribe head 331 is fixed to the upper end portion of the. A tip holder 332 is attached to the upper surface of the scribe head 331, and a cutter wheel tip 333 is held at the tip of the tip holder 332 so that the cutting edge faces upward. Although a mechanism for driving the upper vertical slide member 323a and the lower vertical slide member 323b is not shown, a motor or a solenoid coil attached to the upper horizontal slide member 322a and the lower horizontal slide member 322b is used. An electric actuator or an actuator using air pressure or hydraulic pressure is used.

In addition,

auxiliary struts

341a and 341b are attached to the component mounting fixing

blocks

310a and 310b so as to be located downstream of the

vertical struts

311a and 311b, and the fixed support table 342 is formed by the

auxiliary struts

341a and 341b. It is attached. The support table 342 is formed on the surface thereof, and has an opening for ejecting or sucking air, and when the strip substrate sent from the upstream side of the line is processed, the strip substrate is sucked and fixed. When the strip substrate is transferred, the strip substrate is slightly floated by the air flow. A plurality of divided support tables 343 are arranged on the upstream side of the support table 342 so as to face the support table 342. These divided support tables 343 are fixed on the fixed base 301 by a support member (not shown) provided on the fixed base 301, and on the surface thereof, similar to the fixed support table 342. When the strip substrate is formed and has an opening (not shown) for ejecting or sucking air, and the strip substrate is sent from the upstream side of the line, the strip substrate is sucked and fixed, and the strip substrate is transferred. In some cases, the strip substrate is slightly floated by an air flow.

Further, on the upstream side of each divided support table 343, a frame member 344 to which a roller 344a is attached is provided along the transfer direction of the strip substrate Ts. The roller 344a supports the strip substrate Ts by contacting the lower surface of the strip substrate to be transferred.

Here, the fixed scribe mechanism in the fixed scribe mechanism section 300 is constituted by

members

310a, 310b, 311a, 311b, 320a, 320b, 322a, 322b, 323a, 323b, 331, 332, 333.

Next, the movable scribe mechanism 400 will be described.

The movable scribing mechanism 400 has a fixed base 401 fixed to the installation surface R of the scribing device 1000, and a fixed interval on the fixed base 401 according to the dimension in the width direction of the strip substrate Ts. A pair of

rail members

402a and 402b mounted so as to face each other, and a pair of component mounting

movable blocks

410a and 410b mounted on the

rail members

402a and 402b so as to be movable along the rail members; A pair of opposed vertically

movable struts

411a and 411b fixed on the

respective blocks

410a and 410b are provided.

Here, on both end sides of the rail member 402a, bearing

members

412a and 413a that rotatably support a shaft member 414a disposed on the rail member 402a in parallel therewith are disposed. A motor 415a for rotating the shaft member 414a is attached to the member 412a. The shaft member 414a has a thread formed on the surface thereof, and is disposed through the component mounting movable block 410a. The shaft 414a is screwed with a nut member (not shown) attached to the inside of the movable block 410a so that the component-attachable movable block 411a moves on the rail member 402a by the rotation. Yes. Further, on both end sides of the rail member 402b, bearing

members

412b and 413b that rotatably support a shaft member 414b disposed in parallel to the rail member 402b are disposed, and a downstream bearing member is disposed. A motor 415b for rotating the shaft member 414b is attached to 412b. The shaft member 414b has a thread formed on the surface thereof, and is disposed so as to penetrate the component mounting movable block 411b. The shaft 414b is screwed with a nut member (not shown) attached to the inside of the movable block 411b so that the component-attached movable block 411b moves on the rail member 402b by the rotation. Yes.

In addition,

movable guide columns

420a and 420b are attached between the opposing vertical

movable columns

411a and 411b so as to be positioned in parallel vertically. A guide groove 421 is formed on the side of the

guide column

420a and 420b on the upstream side of the line, and the guide groove 421 of the upper movable guide column 420a and the lower movable guide column 420b extends along the guide groove. An upper lateral slide member 422a and a lower lateral slide member 422b that slide in the lateral direction (that is, the direction across the processing line) are fitted between the longitudinal movable struts. A mechanism for driving the upper side slide member 422a and the lower side slide member 422b is configured by a linear motor or the like incorporated in the

guide columns

420a and 420b, although not shown.

Further, an upper vertical slide member 423a is attached to the upper horizontal slide member 422a so as to be slidable in the vertical direction (vertical direction) with respect to the horizontal slide member 422a, and a lower end portion of the vertical slide member 423a. A scribe head 431 is fixed. A tip holder 432 is attached to the lower surface of the scribe head 431, and a cutter wheel tip 433 is held at the tip of the tip holder 432 so that the cutting edge faces downward. Similarly, a lower vertical slide member 423b is attached to the lower horizontal slide member 422b so as to be slidable in the vertical direction (vertical direction) with respect to the horizontal slide member 422b. A scribe head 431 is fixed to the upper end portion of the. A tip holder 432 is attached to the upper surface of the scribe head 431, and a cutter wheel tip 433 is held at the tip of the tip holder 432 so that the cutting edge faces upward. Although a mechanism for driving the upper vertical slide member 423a and the lower vertical slide member 423b is not shown, a motor or a solenoid coil attached to the upper horizontal slide member 422a and the lower horizontal slide member 422b is used. An electric actuator or an actuator using air pressure or hydraulic pressure is used.

In addition, a horizontal strut 441 is attached to the component mounting

movable blocks

410a and 410b so as to be located upstream of the

vertical struts

411a and 411b so as to straddle these

blocks

410a and 410b. A pair of

vertical support columns

451a and 451b are attached to the center portion so as to face each other, and a movable support table 442 is attached to the pair of vertical support columns so as to move together with the component mounting movable block. The movable support table 442 is formed on the surface thereof, and has an opening for ejecting or sucking air. When processing the strip substrate sent from the upstream side of the line, the strip substrate is sucked and fixed. Further, when the strip substrate is transferred, the strip substrate is slightly floated by an air flow. Further, on the downstream side of the movable support table 442, a scribe head 431 attached to the upper and lower

horizontal slide members

422a and 422b that moves along the side edge of the movable support table 442 is located.

Here, the movable scribing mechanism in the movable scribing mechanism section 400 includes

members

410a, 410b, 411a, 411b, 420a, 420b, 422a, 422b, 423a, 423b, 431, 432, 433.

In addition, a pair of

guide members

460a and 460b are disposed on the inner side of the

rail members

402a and 402b so as to be positioned at a substantially middle height position between the upper movable guide column 420a and the lower movable guide column 420b. The

guide members

460a and 460b are attached to the guide member support frames 461a and 461b, respectively. The downstream ends of these guide member support frames 461a and 461b are supported by vertical fixing

posts

462a and 462b attached to the fixed base 401, and the upstream ends of the guide member support frames 461a and 461b are fixed. It is supported by

vertical fixing columns

463a and 463b attached to the base 401.

The

sprockets

465a and 465b are rotatably attached to the upstream end faces of the guide member support frames 461a and 461b by

brackets

464a and 464b.

Sprockets

467a and 467b are rotatably attached to the upstream end surface of the fixed base 401 by

brackets

466a and 466b so as to face the

sprockets

465a and 465b.

A pair of

sprockets

465a and 467a that are vertically opposed to each other are hooked with one chain 470a. One end of the chain 470a is attached to a cylinder rod 481a of a hydraulic or pneumatic cylinder 480a provided in the fixed base 401. It is connected. The other pair of

sprockets

465b and 467b that are vertically opposed to each other is hooked with another chain 470b. One end of the chain 470b is a hydraulic pressure provided in the fixed base 401 like the chain 470a. Alternatively, it is connected to the cylinder rod 481b of the pneumatic cylinder 480b (see FIG. 5).

Further, a roller support bar 491 is attached to the pair of

chains

470a and 470b at regular intervals so as to straddle them, and a roller 493 is rotatably attached to each roller support bar 491 by a bracket 494.

Here, of the plurality of roller support bars 491, the support bar 491 located closest to the horizontal column 441 is disposed at the upper ends of the pair of vertical

auxiliary columns

451a and 451b attached on the horizontal column 441. The pair of connecting

pieces

483a and 483b are connected to each other, and the other ends of the pair of

chains

470a and 470b are fixed to both ends of the support bar 491 located closest to the horizontal column 441.

One end of the pair of

chains

470a and 470b is urged in the direction of pulling the chain by

cylinder rods

481a and 481b connected thereto, and constant tension is always applied to the

chains

467a and 467b. It is like that.

Further, the roller 493 attached to the roller support bar 491 located on the upper surface of the

guide members

460a and 460b is in contact with the lower surface of the strip substrate Ts sent from the upstream side of the scribe device 1000, A support surface (support region) for supporting the strip substrate Ts is formed.

Next, the operation will be described.

In the processing line (substrate cutting system) 200, when the mother substrate Ms of the liquid crystal panel is supplied onto the processing line 200 by the mother substrate loader unit 200a, the mother substrate Ms supplied from the mother substrate loader unit 200a is The strip substrate Ts is created by being divided by the mother substrate dividing portion 200b. Here, the mother substrate Ms shown in FIG. 2A is divided along the scribe lines Lm1 to Lm6, and is cut out as three strip substrates Ts.

The strip substrate Ts divided by the mother substrate dividing unit 200b is rotated 90 degrees by the strip substrate rotating and conveying unit 200c and conveyed to the downstream side substrate dividing unit 200d. In this processing line 200, the strip substrate Ts transported from the strip substrate rotation transport unit 200c is cut by the strip substrate cutting unit 200d to create the liquid crystal panel substrate Ps. Here, the strip substrate Ts shown in FIG. 2B is divided along the scribe lines Lt1 to Lt8, and is cut out as four liquid crystal panel substrates Ps (see FIG. 2C).

The liquid crystal panel substrate Ps created by the strip substrate dividing unit 200d is rotated by the panel rotation conveyance unit 200e and conveyed to the panel substrate inspection unit 200f on the downstream side. The panel substrate inspection unit 200f inspects the dimensional accuracy and the like of the panel substrate Ps created on the processing line 200.

Hereinafter, the operation of each part constituting the processing line of the first embodiment will be described in detail.

The mother substrate loader unit 200a includes mechanisms corresponding to the loader 12, the feed robot 13, and the conveyor 14 in the conventional processing line 100 shown in FIG. 14, and the mother substrate loader unit 200a has a predetermined storage. The mother board Ms stored in the place is transported to the mother board cutting section 200b.

In the mother substrate dividing section 200b, scribe lines are simultaneously formed on the front surface side substrate and the back surface side substrate of the mother substrate in the same manner as the dividing device 1 in the conventional processing line 100 shown in FIG.

Further, the strip substrate rotating and conveying unit 200c includes mechanisms corresponding to the capturing mechanism 31, the conveyor 15 and the rotary table 16 in the conventional processing line 100 shown in FIG. 14, and the mother substrate dividing unit 200b causes the mother substrate Ms. The strip substrate Ts cut out from is transported from the mother substrate dividing section 200b to the strip substrate dividing section 200d.

The strip substrate dividing unit 200d according to the first embodiment has a scribing mechanism for simultaneously scribing the front and back surfaces of the brittle material substrate one by one in the cutting apparatus 1A in the conventional processing line 100 described with reference to FIGS. 4 includes a scribing device 1000 having a scribing mechanism different from that in FIG. 4. In this scribing device 1000, scribing from the front surface side and the back surface side of the strip substrate Ts is simultaneously executed by two places by the fixed scribing mechanism and the movable scribing mechanism. Is done.

First, the operation for adjusting the distance between the fixed scribe mechanism and the movable scribe mechanism will be described with reference to FIG. 3, FIG. 4, FIG. 6, and FIG.

The adjustment of the distance is performed according to the size of the liquid crystal panel substrate Ps cut out from the strip substrate to be scribed, and specifically, based on the size of the liquid crystal panel substrate Ps, that is, the distance between the scribe lines Lt1 and Lt2. Done. Needless to say, the distance between the scribe lines Lt3 and Lt4, the distance between the scribe lines Lt5 and Lt6, and the distance between the scribe lines Lt7 and Lt8 are equal to the distance between the scribe lines Lt1 and Lt2.

For example, in FIGS. 6 and 7, in order to increase the distance between the scribe head 331 of the fixed scribe mechanism 300 and the scribe head 431 of the movable scribe mechanism 400, the

movable blocks

410a and 410b are moved to the positions shown in FIGS. It shows a state where it has moved to the right side of the page. The movement of the

movable blocks

410a and 410b is performed by rotating the

rotating shafts

414a and 414b by the

motors

415a and 415b.

At this time, the movement of the

movable blocks

410a and 410b causes the roller support bar 491 connected via the movable block member 441 to move to the right, thereby pulling the

chain members

470a and 470b to the right side of the page. Will be. As a result, a roller support bar 491 further appears between the scribe head 331 of the fixed scribe mechanism and the scribe head 431 of the movable scribe mechanism, and thereby the scribe head 331 of the fixed scribe mechanism and the movable scribe mechanism 431. Between the scribe head 431, a substrate support region necessary for supporting the strip substrate is formed according to the size of the liquid crystal panel substrate Ps to be created from the strip substrate Ts.

In this way, after adjusting the distance between the scribe head 331 of the fixed scribe mechanism and the scribe head 431 of the movable scribe mechanism, the strip substrate Ts is scribed.

8, 9 and 10 are diagrams for explaining the scribe operation. In these drawings, particularly, the movement of the scribe head 431 in the movable scribe mechanism is shown, but the scribe head 331 in the fixed scribe mechanism is shown. The movement is exactly the same.

First, in the movable scribe mechanism, the upper and lower

vertical slide members

423a and 423b move in the vertical direction to the positions where the cutter chips of the respective scribe heads 431 can come into contact with the front and back surfaces of the strip substrate Ts as indicated by arrows. (FIGS. 9A and 9B). At this time, in the fixed scribe mechanism, the upper and lower

vertical slide members

323a and 323b are vertically moved to positions where the cutter chips of the respective scribe heads 331 can contact the front and back surfaces of the strip substrate Ts as shown in FIG. Move to.

Thereafter, the upper and lower

vertical slide members

423a and 423b in the movable scribe mechanism simultaneously move in the width direction of the strip substrate Ts as shown by arrows (FIGS. 8, 10A and 10B). At this time, the upper and lower

vertical slide members

323a and 323b in the fixed scribe mechanism simultaneously move in the width direction of the strip substrate Ts similarly to the

vertical slide members

423a and 423b of the movable scribe mechanism. Thereby, for example, the front and back side scribe lines are simultaneously formed at the positions indicated by Lt1 and Lt2 in FIG. 2B of the strip substrate Ts.

Thereafter, in the strip substrate dividing unit 200d, the strip substrate Ts on which the scribe line is formed by the scribe device 1000 is divided by a subsequent dividing device (not shown) to form the liquid crystal panel substrate Ps. The liquid crystal panel substrate Ps is transported to the panel substrate inspection unit 200f by the panel substrate rotation transport unit 200e.

As described above, in the first embodiment, in the scribing apparatus 1000 constituting the strip substrate dividing portion 200d, a bonded substrate is provided which is fixed on a base and is bonded to a brittle substrate such as a mother substrate Ms of a liquid crystal panel. A fixed scribe mechanism that simultaneously forms a first scribe line on the front surface and the back surface of the substrate; and a movable scribe mechanism that is movably provided on the base. A movable scribe mechanism that forms a second scribe line, the fixed scribe mechanism and the movable scribe mechanism, wherein the first and second scribe lines are formed at the same time, and the first and second scribe lines Since the interval is configured to be adjusted by the separation distance between the two mechanisms, the front and back surfaces of the bonded substrate obtained by bonding the brittle substrate are bonded to each other. Each can form two places simultaneously scribe line, which makes it possible to shorten the processing time required from the bonded substrate, such as a mother substrate of the liquid crystal panel to cut the liquid crystal panel substrate Ps of a predetermined number.

In the first embodiment, in the scribing apparatus 1000, the first and second scribe lines are formed between the formation position of the first scribe line by the fixed scribe mechanism and the formation position of the second scribe line by the movable scribe mechanism. Since it has a support region forming mechanism composed of

members

470a, 470b, 491, 493, etc., which forms a support region for supporting the bonded substrate (strip substrate Ts) in a range corresponding to the separation distance of the scribe line of 2. Even when the second scribe mechanism is moved, the region for supporting the strip substrate can always be appropriately formed.

In the first embodiment, the scribing apparatus 1000 includes a fixed support table 342 and a movable support table 442 that are provided between the fixed scribe mechanism and the movable scribe mechanism and serve as a support base for supporting the bonded substrate. The support table has a plurality of openings formed so as to generate an intake air flow or a jet air flow, and is bonded onto the support table by the jet air flow when the bonded substrate is transferred. Since the substrate is lifted and supported, and when the bonded substrate is scribed, the bonded substrate is sucked and fixed to the support table. Therefore, when the scribe is performed, the strip substrate is fixed so as not to be displaced, and the strip substrate is transported. Sometimes it can be easily transported.

Specifically, on the downstream side of the scribe area by the fixed scribe mechanism, a fixed support table 342 for supporting the bonded substrate is provided in the vicinity of the scribe area, and divided on the upstream side of the scribe area. A support table 343 is provided, and the fixed support table 342 and the divided support table 343 have a plurality of openings formed so as to generate a suction air flow or a jet air flow. The bonded substrate is supported by being lifted on the support table by flow, and when the bonded substrate is scribed, the bonded substrate is sucked and fixed to the support table. The strip substrate can be fixed firmly in the vicinity of the scribe region. In addition, a movable support table 442 that supports the bonded substrate is provided on the downstream side of the scribe region by the movable scribe mechanism, and the movable support table 442 is provided with an intake air flow or a jet air flow. A plurality of openings formed so as to be generated, and when the bonded substrate is transferred, the blown air stream supports the bonded substrate to be lifted on the support base, and when the bonded substrate is scribed, Since the bonded substrate is sucked and fixed to the movable support base, scribing by the movable scribe mechanism can be performed with the bonded substrate firmly fixed in the vicinity of the scribe region.

In the first embodiment, as the substrate cutting system, the scribing device that forms the scribe line on the strip substrate is configured to simultaneously form the scribe line on the front and back surfaces of the strip substrate at two locations. The substrate cutting system may be configured such that a scribe device for forming a scribe line on a mother substrate or a structure in which a scribe line is simultaneously formed on the front surface and the back surface of two locations on the mother substrate. Will be described as a second embodiment.

(Embodiment 2)
In the substrate cutting system according to the second embodiment, a scribe device having the configuration shown in FIGS. 3 to 5 is used as the mother substrate cutting section 200b in the substrate cutting system according to the first embodiment.

As described above, in the second embodiment as well, in the mother substrate scribing apparatus, the fixed scribing mechanism that is fixedly provided on the base and simultaneously forms the first scribe lines on the front surface and the back surface of the mother substrate, and the base A movable scribe mechanism that is provided movably on a table and that simultaneously forms a second scribe line parallel to the first scribe line on the front surface and the back surface of the mother substrate, the fixed scribe mechanism and the movable scribe Since the mechanism is configured such that the first and second scribe lines are formed at the same time and the distance between the first and second scribe lines is adjusted by the distance between the two mechanisms, the brittle substrate is attached. Two scribe lines can be formed simultaneously on the front and back surfaces of the mother substrate, which is a bonded substrate. It makes it possible to shorten the processing time required from the bonded substrate, such as a mother substrate Ms of the liquid crystal panel to cut a predetermined number of the strip substrate Ts.

In the second embodiment, the scribing device having the configuration shown in FIGS. 3 to 5 is used for both the mother substrate cutting unit 200b and the strip substrate cutting unit 200d in the substrate cutting system. The system may use a scribing device having the configuration shown in FIGS. 3 to 5 only for the mother substrate dividing section 200b.

As described above, the present invention has been exemplified using the preferred embodiment of the present invention, but the present invention should not be construed as being limited to this embodiment. It is understood that the scope of the present invention should be construed only by the claims. It is understood that those skilled in the art can implement an equivalent range based on the description of the present invention and the common general technical knowledge from the description of specific preferred embodiments of the present invention. It is understood that the patent documents cited in the present specification should be incorporated by reference into the present specification in the same manner as the content itself is specifically described in the present specification.

The present invention is arranged in a processing line for performing a process of cutting out a plurality of panel substrates from a bonded substrate obtained by bonding two brittle material substrates, and a scribe (scribe) to the bonded substrate is placed on the bonded substrate. In the field of the scribing apparatus that can be performed simultaneously on the front surface and the back surface thereof, two scribe lines can be simultaneously formed on the front surface and the back surface of the bonded substrate formed by bonding the brittle substrate. The processing time required to cut out a predetermined number of panel substrates from a bonded substrate such as a mother substrate of a liquid crystal panel can be shortened.

FIG. 1 is a diagram for explaining a substrate cutting system according to Embodiment 1 of the present invention, and shows a processing line for a brittle material substrate in the substrate cutting system. FIG. 2 is a diagram for explaining a brittle material substrate processed by the substrate cutting system according to the first embodiment. FIG. 2A shows a mother substrate of a liquid crystal panel composed of the brittle material substrate. 2 (b) shows a strip substrate obtained by dividing the mother substrate, and FIG. 2 (c) shows a liquid crystal panel substrate obtained by dividing the strip substrate. FIG. 3 is a plan view for explaining the substrate cutting system according to the first embodiment, and shows a scribing apparatus installed in a processing line of this system. FIG. 4 is a diagram for explaining the substrate cutting system according to the first embodiment, and shows a cross-sectional structure taken along line IV-IV of the scribing apparatus shown in FIG. FIG. 5 is a diagram for explaining the substrate cutting system according to the first embodiment, and FIG. 5A is a diagram of the scribing device shown in FIG. 3 as seen in the direction of the arrow indicated by the line VV in FIG. FIG.5 (b) is a figure which shows the movable scribe part of this scribe apparatus. 6 is a plan view for explaining the operation of the scribing apparatus installed in the processing line of the substrate cutting system according to the first embodiment, and when the movable scribing mechanism of the scribing apparatus shown in FIG. 3 is moved in the horizontal direction. Indicates the state. 7 is a cross-sectional view taken along the line VI-VI in FIG. 6 for explaining the operation of the scribing apparatus installed in the processing line of the substrate cutting system according to the first embodiment. The movable scribing mechanism of the scribing apparatus shown in FIG. The state when moved is shown. FIG. 8 is a diagram illustrating a portion corresponding to a cross section taken along line IV-IV in FIG. 3 for explaining the operation of the scribing apparatus installed in the processing line of the substrate cutting system according to the first embodiment. The state when the scribe head of the apparatus is moved to a position where the bonded substrate (strip substrate) is scribed is shown. FIGS. 9A and 9B are diagrams for explaining the operation of the scribing apparatus in the substrate cutting system according to the first embodiment, and shows how the scribe head of the movable scribe portion moves to the scribe position. FIGS. 10A and 10B are diagrams for explaining the operation of the scribing apparatus in the substrate cutting system according to the first embodiment, and shows how the scribe head of the movable scribe portion scribes the bonded substrate. FIG. 11 is a block diagram for explaining a conventional liquid crystal panel dividing line, which is disclosed in Patent Document 1. In FIG. FIG. 12 is a perspective view showing a scribing device constituting the conventional liquid crystal panel dividing line shown in FIG. FIG. 13 is a schematic diagram for explaining another conventional scribing device, which is disclosed in Patent Documents 1 and 2. FIG. FIG. 14 is a plan view for explaining a conventional liquid crystal panel dividing line provided with a scribe mechanism for simultaneously scribing the front and back surfaces of a bonded substrate obtained by bonding two brittle material substrates (Patent Document 1). . FIG. 15 is a perspective view for explaining a conventional liquid crystal panel cutting apparatus provided with a scribe mechanism for simultaneously scribing the front and back surfaces of a laminated substrate. FIG. 16 is a perspective view showing a main part of the conventional liquid crystal panel cutting apparatus shown in FIG. FIG. 17 is a front view for explaining the scribe operation of the conventional liquid crystal panel cutting apparatus shown in FIG. FIG. 18 is a front view for explaining a break operation of the conventional liquid crystal panel cutting apparatus shown in FIG.

200 processing line (substrate cutting system)
200a Mother board loader section 200b Mother board cutting section 200c Strip board rotation transport section 200d Strip board cutting section 200e Panel board rotation transport section 200f Panel board inspection section 300

Fixed scribing mechanism

301, 401

Fixed base

310a, 310b Component mounting fixing block 311a 311b

Vertical column

320a, 420a

Upper guide column

320b, 420b

Lower guide column

321, 421 Guide groove 322a Upper horizontal slide member 322b Lower horizontal slide member 323a Upper vertical slide member 323b Lower

vertical slide member

331, 431

Scribe head

332 , 432

Tip holder

333, 433

Cutter wheel tip

341 a, 341 b Auxiliary support 342 Fixed support table 343 Split support table 344 Frame member 344 Roller 400

Movable scribing mechanism

402a,

402b Rail member

410a, 410b Parts mounting

movable block

411a, 411b Vertical

movable strut

412a, 412b, 413a,

413b Bearing member

414a, 414b Shaft member 442 Movable support table 460a,

460b Guide member

461a, 461b Guide

Member support frame

462a, 462b, 463a, 463b Vertical fixed

column

464a, 464b, 466a, 466b, 494

Bracket

465a, 465b, 467a,

467b Sprocket

470a, 470b Chain 491 Roller support bar 493 Roller 1000 Scribing device mLt1 to Lm1L Lt8 Scribe line Ms Mother board (Laminated board)
Ts strip substrate Ps panel substrate (liquid crystal panel)
R Installation surface

Claims

A scribing device for forming a scribe line on a bonded substrate having a structure in which a brittle substrate is bonded,
A fixed scribe mechanism which is fixedly provided on a base placed on an installation surface and simultaneously forms a first scribe line on the front and back surfaces of the bonded substrate;
A movable scribe mechanism that is movably provided on the base, and that simultaneously forms a second scribe line parallel to the first scribe line on the front and back surfaces of the bonded substrate;
The fixed scribe mechanism and the movable scribe mechanism are configured such that the first and second scribe lines are formed simultaneously, and an interval between the first and second scribe lines is adjusted by a separation distance between the two mechanisms. Scribe device.
Between the formation position of the first scribe line by the fixed scribe mechanism and the formation position of the second scribe line by the movable scribe mechanism, in a range corresponding to the separation distance of the first and second scribe lines. The scribing apparatus according to claim 1, further comprising a support region forming mechanism for forming a support region for supporting the bonded substrate.
Provided between the fixed scribe mechanism and the movable scribe mechanism, and having a support base for supporting the bonded substrate;
The support base has a plurality of openings formed to generate an intake air flow or a jet air flow, and the bonded substrate is lifted on the support by the jet air flow when the bonded substrate is transferred. The scribing device according to claim 2, wherein the scribing apparatus is configured to support the bonding substrate and to adsorb and fix the bonding substrate to the support base when the bonding substrate is scribed.
The support base is
A fixed support table provided fixed to the base so as to be positioned in the vicinity of the formation position of the first scribe line;
The scribing apparatus according to claim 3, further comprising: a movable support table that is located in the vicinity of a position where the second scribe line is formed and is provided on the base so as to be movable together with the second scribe mechanism. .
The fixed scribe mechanism is
A first upper scribe portion which is attached to slide on the base in a horizontal direction, and forms a first scribe line on the surface of the bonded substrate board by the horizontal slide;
On the base, it is attached so as to slide in the same direction as the first upper scribe portion, and the first upper scribe portion slides in the same direction on the back surface of the bonded substrate. A first lower scribe portion that forms a scribe line;
The movable scribe mechanism is
A second upper scribe portion that is mounted on the base so as to slide in a horizontal direction, and forms a second scribe line on the surface of the bonded substrate board by the horizontal slide;
It is attached on the base so as to slide in the same direction as the second upper scribe portion, and the second upper scribe portion slides in the same direction on the back surface of the bonded substrate. The scribing device according to claim 3, further comprising a second lower scribe portion that forms a scribe line.
The fixed scribe mechanism has a pair of vertical columns attached to face the base and a first pair of upper and lower guide columns attached in parallel to each other so as to extend in the horizontal direction between the vertical columns. And
The first upper scribe portion slides vertically on the first upper side slide member, which is attached to the first upper guide column so as to slide in the horizontal direction, and on the first upper side slide portion. A first upper vertical slide member attached; and a scribe head attached to the first upper vertical slide member and having a tip holder for holding a cutter wheel tip;
The first lower scribe portion includes a first lower lateral slide member attached to the first lower guide column so as to slide in a horizontal direction, and a vertical direction to the first lower lateral slide portion. 6. A first lower longitudinal slide member attached to slide on the first lower longitudinal slide member, and a scribe head having a tip holder attached to the first lower longitudinal slide member and holding a cutter wheel tip. Scribing device.
The movable scribe mechanism is configured to face a pair of movable blocks provided on a pair of rail members mounted to face the base so as to be movable along the rail members. A pair of vertically movable struts attached and a second pair of upper and lower guide struts attached in parallel to each other so as to extend horizontally between the vertically movable struts;
The second upper scribe portion slides vertically on the second upper side slide member attached to the second upper guide column so as to slide in the horizontal direction, and on the second upper side slide portion. A second upper vertical slide member attached; and a scribe head having a tip holder attached to the second upper vertical slide member and holding a cutter wheel tip;
The second lower scribe portion includes a second lower lateral slide member attached to the second lower guide column so as to slide in a horizontal direction, and a vertical direction to the second lower lateral slide portion. 6. A second lower longitudinal slide member attached to slide on the second lower longitudinal slide member, and a scribe head having a tip holder attached to the second lower longitudinal slide member and holding a cutter wheel tip. Scribing device.
The support region forming mechanism is
A pair of opposing guide members disposed along the moving path of the movable scribe mechanism and having component guide grooves;
A pair of chain members movably attached along the component guide grooves of the respective guide members;
A plurality of roller support bars attached to the pair of chain members at regular intervals and supporting a plurality of rollers;
One end of each chain member is fixed to the movable scribe mechanism, and the other end of each chain is urged in a predetermined direction so that a constant tension is applied to the chain member,
The support region forming mechanism is:
The chain member is moved by the movement of the movable scribe mechanism, and the rollers supported by the plurality of roller support bars appear and disappear between the first and second scribe mechanisms, and the bonded substrate is The scribing apparatus according to claim 2, wherein a supporting region to be supported is configured to have a width corresponding to a separation distance between the first and second scribe lines.
The bonded substrate is
The scribing apparatus according to claim 1, wherein the scribing apparatus is a rectangular mother substrate for cutting out a liquid crystal panel, which has a bonding structure in which two glass substrates are bonded.