KR101220859B1 - Scribing apparatus - Google Patents

Scribing apparatus Download PDF

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Publication number
KR101220859B1
KR101220859B1 KR1020117001366A KR20117001366A KR101220859B1 KR 101220859 B1 KR101220859 B1 KR 101220859B1 KR 1020117001366 A KR1020117001366 A KR 1020117001366A KR 20117001366 A KR20117001366 A KR 20117001366A KR 101220859 B1 KR101220859 B1 KR 101220859B1
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KR
South Korea
Prior art keywords
scribe
substrate
slide
movable
attached
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KR1020117001366A
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Korean (ko)
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KR20110031340A (en
Inventor
아키라 에지마타니
다쓰오 기야타케
Original Assignee
미쓰보시 다이야몬도 고교 가부시키가이샤
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Priority to JPJP-P-2008-166612 priority Critical
Priority to JP2008166612 priority
Application filed by 미쓰보시 다이야몬도 고교 가부시키가이샤 filed Critical 미쓰보시 다이야몬도 고교 가부시키가이샤
Priority to PCT/JP2009/061400 priority patent/WO2009157440A1/en
Publication of KR20110031340A publication Critical patent/KR20110031340A/en
Application granted granted Critical
Publication of KR101220859B1 publication Critical patent/KR101220859B1/en

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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B28WORKING CEMENT, CLAY, OR STONE
    • B28DWORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0005Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
    • B28D5/0011Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing with preliminary treatment, e.g. weakening by scoring
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B28WORKING CEMENT, CLAY, OR STONE
    • B28DWORKING STONE OR STONE-LIKE MATERIALS
    • B28D1/00Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
    • B28D1/22Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising
    • B28D1/225Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising for scoring or breaking, e.g. tiles
    • B28D1/226Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising for scoring or breaking, e.g. tiles with plural scoring tools
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03BMANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00Severing cooled glass
    • C03B33/02Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/037Controlling or regulating
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03BMANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00Severing cooled glass
    • C03B33/07Cutting armoured, multi-layered, coated or laminated, glass products
    • C03B33/076Laminated glass comprising interlayers
    • GPHYSICS
    • G02OPTICS
    • G02FDEVICES OR ARRANGEMENTS, THE OPTICAL OPERATION OF WHICH IS MODIFIED BY CHANGING THE OPTICAL PROPERTIES OF THE MEDIUM OF THE DEVICES OR ARRANGEMENTS FOR THE CONTROL OF THE INTENSITY, COLOUR, PHASE, POLARISATION OR DIRECTION OF LIGHT, e.g. SWITCHING, GATING, MODULATING OR DEMODULATING; TECHNIQUES OR PROCEDURES FOR THE OPERATION THEREOF; FREQUENCY-CHANGING; NON-LINEAR OPTICS; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1303Apparatus specially adapted to the manufacture of LCDs

Abstract

According to the present invention, a scribe line can be simultaneously formed in two places on the front and back surfaces of a bonded substrate formed by joining brittle substrates, which is necessary for cutting a predetermined number of panel substrates from a bonded substrate such as a liquid crystal mother panel. The scribe device 1000 which can shorten the processing time to provide is provided.
A fixed scribe mechanism that is fixedly mounted on the base 301, and simultaneously forms a first scribe line on the front and back surfaces of the bonded substrate, and is movable on the base 401, the front and rear surfaces of the bonded substrate; And a movable scribe mechanism for simultaneously forming a second scribe line parallel to said first scribe line, wherein said fixed scribe mechanism and said movable scribe mechanism are formed simultaneously with said first and second scribe lines and said first And the spacing of the second scribe lines is adjusted by the separation distance of the two instruments.

Description

Scribe device {SCRIBING APPARATUS}
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a scribe device, and more particularly, a process for cutting a plurality of panel substrates from a bonded substrate formed by joining two brittle material substrates. A scribe device disposed in a line and capable of simultaneously scribing (marking) the bonded substrate on the front surface and the rear surface of the bonded substrate.
Conventionally, the cutting of brittle substrates such as plate glass generally produces a wound (scribe) along a line to be cut on one side thereof, and the cut along the line (scribe line) that caused the wound. It is done by bending plate glass.
However, the liquid crystal panel of the liquid crystal display device has a structure in which two glass plates are bonded to each other, and therefore, the bonded substrate formed by bonding two glass plates to such a liquid crystal panel. In the case of cutting out from the substrate, it is necessary to form scribe lines on both surfaces of the bonded substrate and the back surface thereof.
Conventionally, such a bonded substrate is processed to form a scribe line one by one, and Patent Document 1 discloses a processing line used in the above-described cutting process of the bonded substrate.
Hereinafter, the processing line (liquid crystal panel cutting line) disclosed in this patent document 1 is demonstrated concretely using drawing.
FIG. 11 is a block diagram of a conventional liquid crystal panel cutting line 900, and FIG. 12 is a perspective view showing a scribe device 901 constituting the liquid crystal panel cutting line 900. As shown in FIG.
This scribe device 901 is provided with a table 905 for mounting the liquid crystal mother panel 908. The table 905 is provided to be movable in the Y1 direction (predetermined direction parallel to the mounting surface of the panel) and to be rotatable in the θ1 direction, that is, rotatable within the surface including the mounting surface of the table. The liquid crystal mother panel 908 has a structure in which two glass substrates are bonded to each other.
The scribing apparatus 901 includes a scribing head for scribing the surface of an upper glass substrate (hereinafter also referred to as an A surface side substrate) of the two glass substrates constituting the liquid crystal mother panel 908 placed on the table 905. A scribe head 811 is provided to slide along the X1 direction (width direction of the liquid crystal mother panel). A tip holder 806 is attached to the scribe head 811, and a liquid crystal mother panel 908 is attached to the lower end of the tip holder 806 along a scribe setting line S. FIG. A cutter wheel tip 804 is attached for scribing. In addition, the scribe device 901 is provided with a motor 812 for driving the scribe head 811 along the X1 direction. The scribe device 901 includes a CCD camera 929 for recognizing an alignment mark formed on the liquid crystal mother panel for positioning the liquid crystal mother panel 908, and an alignment recognized by the CCD camera 929. A monitor 930 for displaying a mark is provided.
On the downstream side of the scribe device 901, a brake device 902 is provided which brakes the A surface side substrate of the scribed liquid crystal mother panel 908. In addition, a scribe device 901A is disposed downstream of the brake device 902. The scribe device 901A has the same configuration as the scribe device 901, and among the two glass substrates constituting the liquid crystal mother panel 908, the substrate on the side opposite to the A surface side substrate (hereinafter also referred to as B surface side substrate) is provided. Scribe. Further, a brake device 902A is disposed downstream of the scribe device 901A. This brake apparatus 902A has the same structure as the brake apparatus 902, and brakes a B surface side board | substrate along the scribe line formed in the B surface side board | substrate.
Next, the operation of the machining line 900 for cutting the bonded substrate having such a configuration will be described.
On the table 905 of the scribing apparatus 901, the liquid crystal mother panel 908 is mounted with the A surface side substrate facing up by a loading mechanism not shown in the drawing. The scribe device 901 forms a scribe line on the A surface side substrate of the liquid crystal mother panel 908 on the table 905 by the cutter wheel tip 804.
The liquid crystal mother panel 908 in which the scribe line S is formed on the A surface side substrate by the scribe device 901 is inverted by an inversion mechanism not shown in the drawing, and the A surface side substrate is turned downward. It is mounted on the table of the brake device 902. The brake device 902 cuts the substrate A side of the liquid crystal mother panel 908 along the scribe line S. FIG.
The liquid crystal mother panel 908, in which the A surface side substrate is cut by the brake device 902, is conveyed by a conveyance mechanism not shown in the drawing, and the scribe apparatus 901A is disposed so that the A surface side substrate becomes the lower side. It is placed on the table 905. The scribe device 901A forms a scribe line on the B surface side substrate by the cutter wheel tip 804. The liquid crystal mother panel 908 on which the B surface side substrate is scribed by the scribe device 901A is inverted by an inversion mechanism not shown in the drawing, and is placed on the table of the brake apparatus 902A with the B surface side substrate down. do. The brake device 902A cuts the B surface side substrate along the scribe line by pressing the A surface side substrate from above.
Thereafter, the cut pieces of the A surface side substrate and the B surface side substrate bonded by the adhesive seal are collectively removed.
However, in the above-described processing line 900 for cutting liquid crystal panels, the liquid crystal mother panel 908 has to be scribed and braked on one side, which causes a long processing time and an increase in the installation area of the device. There is.
As a solution to such a problem, there is a scribe device disclosed in Patent Document 1 and Patent Document 2, for example.
Fig. 13 shows a scribe device disclosed in these patent documents.
The scribe device 950 includes a table 951 on which the liquid crystal mother panel 908 is placed, a fixture 952 that fixes the liquid crystal mother panel 908 to the table 951, and an upper and lower limit. The pair of cutter heads includes a pair of cutter heads 953 and 954, and the substrates on the front and rear surfaces of the liquid crystal mother panel 908 fixed to the table 951 by a fixture 952. To scribe at the same time.
In addition, Patent Document 1 discloses a processing line including a scribing device for simultaneously forming a scribe line on the substrate on the front and back surfaces of the bonded substrate.
FIG. 14 is a plan view of a processing line 100 of a mother substrate of a liquid crystal panel disclosed in Patent Document 1. As shown in FIG.
This processing line 100 is a mother substrate of a liquid crystal panel, and is a processing line for cutting a liquid crystal mother panel formed by joining two glass substrates into a liquid crystal panel.
The liquid crystal panel cutting line 100 includes a loader 12 for stocking the liquid crystal mother panel 8. An import robot 13 is installed in the liquid crystal panel cutting line 100. The carry-in robot 13 sucks one by one the liquid crystal mother panel 8 stocked in the loader 12 and places it on the conveyor 14. The liquid crystal mother panel 8 mounted on the conveyor 14 is conveyed to the front (right direction in FIG. 14) of the processing line 100, and is positioned.
In addition, the processing line 100 is provided with a liquid crystal panel cutting device (1).
FIG. 15 is a perspective view for explaining the liquid crystal panel cutting device 1, and FIG. 16 is a perspective view showing the main part of the liquid crystal panel cutting device 1 shown in FIG.
The liquid crystal panel cutting device 1 includes a table 5 on which the liquid crystal mother panel 8 supplied from the conveyor 14 is placed. The liquid crystal panel cutting device 1 is provided with an adsorption conveying mechanism 2. The adsorption and transport mechanism 2 adsorbs the liquid crystal mother panel 8 positioned and positioned on the conveyor 14 and places it on the table 5. The suction conveyance mechanism 2 is provided with the guide 27 provided along the horizontal direction shown by the arrow Y3. An arm is provided in the guide 27 to slide along the horizontal direction, and an adsorption pad 25 provided to adsorb the liquid crystal mother panel 8 at the tip of the arm, A cylinder 26 for driving the suction pad 25 along the vertical direction is provided.
This liquid crystal panel cutting device 1 is provided with a scribe mechanism 4 for scribing the liquid crystal mother panel 8, as shown in FIG. The scribe mechanism 4 is arranged on the opposite side of the conveyor 14 with respect to the table 5. The scribe mechanism 4 is provided with a pair of struts 122 and 123. Between the pair of struts 122 and 123, a pair of upper and lower guide bars 124 and 125 are provided, and the liquid crystal mother conveyed from the table 5 by the suction transport mechanism 2. The panel 8 is adapted to pass between these guide bars 124 and 125.
In the guide bar 124, a scribe portion 102 for scribing the surface of the liquid crystal mother panel 8 is provided so as to slide along the direction of the arrow X3, and in the guide bar 125, The scribe part 103 for scribing the back surface of the liquid crystal mother panel 8 is provided so that it can slide along the direction of the arrow X3 so that the scribe part 102 may face. The struts 122 are attached with motors 113 and 114 for sliding the scribe portions 102 and 103 along the direction of the arrow X3, respectively.
The scribe part 102 is provided with the movable body 109 provided so that it may slide along the direction shown by arrow X3. The lower surface of the movable body 109 is provided so that the scribe head 111 may slide along the direction shown by the arrow Y3. The tip holder 106 is provided in the lower surface of the scribe head 111. The lower end of the tip holder 106 is installed so that the cutter wheel tip 104 rotates.
The scribe portion 103 has the same configuration as the scribe portion 102 described above and is provided so as to face the scribe portion 102. The scribe part 103 is provided with the moving body 109 provided so that it may slide along the direction of arrow X3. On the upper surface of the movable body 109, the scribe head 111 is provided to slide along the direction of the arrow Y3. The tip holder 107 is provided on the upper surface of the scribe head 111. At the upper end of the tip holder 107, the cutter wheel tip 105 is installed to rotate.
Moreover, the said liquid crystal panel cutting device 1 is equipped with the capture | acquisition mechanism 31. As shown in FIG. The capture mechanism 31 is gripped to hold one end of the liquid crystal mother panel 8 protruding from the upper surface of the table 5. The capturing mechanism 31 is provided with a capturing device 32 having a substantially Y shape as viewed from the direction indicated by the arrow 127 in FIG. 15. The catcher 32 is configured to open and close by the operation of the cylinder 33, and is gripped to hold one end of the liquid crystal mother panel 8 protruding from the upper surface of the table 5. The capture | acquisition machine 32 is affixed in the position which contact | connects both surfaces of the liquid crystal mother panel 8 which the pair of mat 34 hold | grip.
The catching mechanism 31 is provided with the support | pillar 35 which supports the catcher 32 so that it may move up and down. On the support 35, a motor 36 for moving the capturer 32 up and down is provided. The strut 35 is provided so as to move back and forth along the direction indicated by the arrow Y3 by a motor not shown in the figure.
In addition, the liquid crystal panel cutting line 100 includes a conveyor 15 as shown in FIG. The conveyor 15 carries out positioning by conveying 1 row of liquid crystal mother panel 8A cut | disconnected by the liquid crystal panel cutting device 1 to a downstream positioning position. The conveyor 15 is provided with the rotary table 16. The rotary table 16 rotates the liquid crystal mother panel 8A positioned at the position of positioning by 90 degrees.
The liquid crystal panel cutting line 100 includes a liquid crystal panel cutting device 1A. The liquid crystal panel cutting device 1A has the same configuration as the liquid crystal panel cutting device 1 except that the dimension in the width direction is narrower than that of the liquid crystal panel cutting device 1 described above. Therefore, detailed description of the configuration of the liquid crystal panel cutting device 1A is omitted. The liquid crystal panel cutting device 1A cuts the liquid crystal mother panel 8A rotated 90 degrees by the rotation table 16 into the liquid crystal panel 9. The liquid crystal panel 9 cut by the liquid crystal panel cutting device 1A is carried out to the product stock 18 by the carrying out robot 17.
The operation of the liquid crystal panel cutting line 100 having such a configuration will be described.
When the carry-in robot 13 sucks each liquid crystal mother panel 8 stocked in the loader 12 and places it on the conveyor 14, the liquid crystal mother panel 8 placed on the conveyor 14 is a liquid crystal panel. It is conveyed to the front of the cutting line 100 (right direction in FIG. 14), and is positioned.
17 and 18 are front views for explaining the operation of the conventional liquid crystal panel cutting device 1.
The adsorption pad 25 of the adsorption conveyance mechanism 2 provided in the liquid crystal panel cutting device 1 attracts the liquid crystal mother panel 8 positioned on the conveyor 14 and onto the liquid crystal mother panel 8. One end of the liquid crystal mother panel 8 is positioned such that a predetermined scribe schedule line S5 is located between the cutter wheel tip 104 installed in the scribe part 102 and the cutter wheel tip 105 installed in the scribe part 103. The liquid crystal mother panel 8 is conveyed to the position which protrudes from the table 5. The cutter wheel tips 104 and 105 oppose each other on the scribe schedule line S5. The table 5 sucks and fixes the conveyed liquid crystal mother panel 8. The capturer 32 provided in the capture mechanism 31 grips one end of the liquid crystal mother panel 8.
The cutter wheel tips 104 and 105 simultaneously scribe the glass substrates 10A and 10B constituting the liquid crystal mother panel 8 along the scribe schedule line S5, respectively. When the cutter wheel tips 104 and 105 ride on the glass substrates 10A and 10B, respectively, the movement speed of the cutter wheel tips 104 and 105 is smaller than the movement speed at the time of scribing, shock when riding It is possible to prevent scratches from occurring on the glass substrates 10A and 10B by the shock.
These cutter wheel tips 104 and 105 can form deep vertical cracks that reach the inner surfaces of the glass substrates 10A and 10B.
Since deep vertical cracks reaching the inner surfaces of the glass substrates 10A and 10B by the cutter wheel tips 104 and 105 are formed along the scribe schedule line S5, the liquid crystal mother panel as shown in FIG. If the capture | acquisition | pulling machine 32 holding one end of (8) is moved to the right direction as it is, the cut piece 63 cut | disconnected from the liquid crystal mother panel 8 along the formed scribe line can be removed.
The conveyor 15 carries out positioning by carrying the liquid crystal mother panel 8A mounted by the capture | acquisition machine 32 to a downstream positioning position. The rotary table 16 rotates the liquid crystal mother panel 8A positioned at the positioning position by 90 degrees. The liquid crystal panel cutting device 1A cuts the liquid crystal mother panel 8A into the liquid crystal panel 9 in the same operation as that of the liquid crystal panel cutting device 1 described above. The liquid crystal panel 9 cut by the liquid crystal panel cutting device 1A is carried out to the product stock 18 by the carrying out robot 17.
In the processing line of such a structure, the adsorption conveyance mechanism 2 is a liquid crystal so that the scribe plan line of the liquid crystal mother panel 8 may be located between the cutter wheel tips 104 and 105 provided in the scribe parts 102 and 103, respectively. The mother panel 8 is supported and conveyed. The cutter wheel tips 104 and 105 scribe the liquid crystal mother panel 8 conveyed by the suction transport mechanism 2 along the scribe line so that the scribe line is located between the cutter wheel tips 104 and 105. By cutting.
Therefore, the liquid crystal mother panel consisting of two glass substrates can be cut at the same time on both sides, thereby reducing the processing time for cutting the liquid crystal mother panel and reducing the installation area of the device for cutting the liquid crystal mother panel. It can be greatly reduced.
International Publication No. 02/057192 Pamphlet Published Japanese Utility Model Public Office No. 59-22101
However, in the liquid crystal panel cutting line 900 (processing line) 900 described with reference to FIGS. 14 to 18, the front and back surfaces of the bonded substrate are scribed simultaneously, but scribes are performed on the front and back surfaces of the bonded substrate one by one. For this reason, there is a problem that the processing time required to cut out a predetermined number of panel substrates (liquid crystal panels) from the bonded substrate becomes long.
SUMMARY OF THE INVENTION The present invention has been made to solve the above-described problems, and scribe lines can be simultaneously formed at two locations on the front and back surfaces of a bonded substrate formed by joining a brittle substrate, thereby joining a bonded substrate such as a liquid crystal mother panel. An object of the present invention is to obtain a scribing apparatus capable of shortening the processing time required to cut out a predetermined number of panel substrates from the substrate.
The scribing apparatus which concerns on this invention is a scribe apparatus which forms a scribe line in the bonded substrate of the structure which joined the brittle substrate, and has an installation surface. A fixed scribe mechanism that is fixedly installed on a base disposed on the base, and which forms a first scribe line on the front and back surfaces of the bonded substrate, and is movable on the base. And a movable scribe mechanism for forming a second scribe line parallel to the first scribe line on the front surface and the rear surface of the bonded substrate, wherein the fixed scribe mechanism and the movable scribe mechanism comprise: the first scribe mechanism; And a second scribe line is formed at the same time and between the first and second scribe lines The distance is comprised so that it may be adjusted by the separation distance of both the said mechanisms, and the said objective is achieved by doing so.
In the scribe device, the first and second scribe lines are provided between the position where the first scribe line is formed by the fixed scribe mechanism and the position where the second scribe line is formed by the movable scribe mechanism. It is preferable to provide a support region forming mechanism for forming a support region for supporting the bonded substrate in the range according to the separation distance of.
In the scribe device, the present invention is provided between the fixed scribe mechanism and the movable scribe mechanism, and includes a support for supporting the bonded substrate, and the support is provided with suction air flow. Or a plurality of openings formed so as to generate blown air, and when transporting the bonded substrate, the blown air flows to lift the bonded substrate on the support by the blown air. At the time of scribing the bonded substrate, it is preferable that the bonded substrate is configured to be adsorbed and fixed to the support.
The present invention provides the scribe device, wherein the support is fixed to the base so as to be positioned near the position where the first scribe line is formed, and a position where the second scribe line is formed. It is preferable to include a movable support table located in the vicinity of the base so as to be located near and further movable together with the movable scribe mechanism.
In the scribe device, the fixed scribe mechanism is attached to slide on the base in a horizontal direction, and the first scribe line is formed on the surface of the bonded substrate by the horizontal slide. The first upper scribe portion and the base are attached on the base so as to face the first upper scribe portion so as to slide in the same direction and in the same direction as the first upper scribe portion. A first lower scribe portion for forming a first scribe line on the back surface of the bonded substrate by a slide, wherein the movable scribe mechanism is attached to slide horizontally on the base; Table of the bonded substrate by the horizontal slide And a second upper scribe portion forming a second scribe line on the base and on the base so as to slide in the same direction opposite to the second upper scribe portion, and slide by the same direction as the second upper scribe portion. It is preferable to have a second lower scribe portion for forming a second scribe line on the back surface of the bonded substrate.
The present invention provides the scribe device, wherein the fixed scribe mechanism comprises: a pair of longitudinal supports attached to the base to face each other, and a pair of first attached parallel to each other to extend horizontally between the longitudinal supports; A first upper horizontal slide member having an upper and lower guide support, the first upper scribe portion attached to the first upper guide support so as to slide in a horizontal direction, and the first upper horizontal slide member; A scribe head having a first upper vertical slide member attached to the vertical slide member and a tip holder attached to the first upper vertical slide member and supporting a cutter wheel tip. and a scribe head, wherein the first lower scribe portion includes the first lower guide post A first lower horizontal slide member attached to slide in a horizontal direction, a first lower vertical slide member attached to slide in a vertical direction to the first lower horizontal slide member, and a first lower vertical slide member attached to the cutter It is desirable to have a scribe head with a tip holder for supporting a wheel tip.
In the scribe device, the movable scribe mechanism includes a pair of movable blocks provided to be movable along the rail member on a pair of rail members attached to face the base. A movable block), a pair of longitudinal movable supports attached to each of the movable blocks, and a pair of second upper and lower guide supports attached parallel to each other so as to extend in a horizontal direction between the vertical movable supports, The second upper scribe portion includes a second upper horizontal slide member attached to the second upper guide support so as to slide in a horizontal direction, and a second upper vertical slide member attached to the second upper horizontal slide member in a vertical direction. And a cutter wheel tip attached to the second upper vertical slide member. And a scribe head having a tip holder, wherein the second lower scribe portion is perpendicular to the second lower horizontal slide member and the second lower horizontal slide member attached to the second lower guide support so as to slide horizontally. It is preferable to have a scribe head having a second lower vertical slide member attached to slide in a direction and a tip holder attached to the second lower vertical slide member and supporting a cutter wheel tip.
The present invention provides the scribe device, wherein the support region forming mechanism is arranged to extend along a movement path of the movable scribe mechanism, and includes a pair of guide members each having a component guide groove and opposing each other, and the respective guide members. A pair of chain members movably attached along the component guide groove of the plurality of roller members, and a plurality of roller support bars attached to the pair of chain members at regular intervals and supporting the plurality of rollers ( A roller bar is provided, one end of each chain member is fixed to the movable scribe mechanism, and the other end of each chain is predetermined so that a constant tension is applied to the chain member. Direction, the support region forming mechanism is moved by the movement of the movable scribe mechanism. The support chain for moving the chain member and the roller supported by the plurality of roller support bars emerges between the fixed scribe mechanism and the movable scribe mechanism to support the bonded substrate. It is preferable that it is comprised so that it may become the width according to the separation distance of two scribe lines.
The present invention provides a scribe device, wherein the bonded substrate has a bonded structure in which two glass substrates are bonded to each other to form a rectangular mother substrate for cutting a liquid crystal panel. Is preferable.
Hereinafter, the operation of the present invention will be described.
In the present invention, a fixed scribing mechanism is fixedly mounted on a base and simultaneously forms a first scribe line on the front and back surfaces of the bonded substrate, and is movable on the base, and the front and rear surfaces of the bonded substrate are movable. And a movable scribe mechanism for simultaneously forming a second scribe line parallel to said first scribe line, wherein said fixed scribe mechanism and said movable scribe mechanism are formed simultaneously with said first and second scribe lines and said first And the distance between the second scribe lines is adjusted by the separation distance between the two mechanisms, so that the scribe lines can be simultaneously formed in two places on the front and back surfaces of the bonded substrate formed by joining the brittle substrates. According to the liquid From the bonded mother substrate such as a panel, it is possible to shorten the processing time required for the I cut the panel substrate with a predetermined number.
Moreover, in this invention, between the formation position of the 1st scribe line by the said fixed scribe mechanism, and the formation position of the 2nd scribe line by the said movable scribe mechanism, according to the separation distance of the said 1st and 2nd scribe line Since the support area forming mechanism which forms the support area which supports the said bonded substrate in the range is provided, even if the movable scribe mechanism is moved, the area | region which always supports a rectangular substrate can be formed suitably.
Moreover, in this invention, it is provided between the said fixed scribe mechanism and the said movable scribe mechanism, and is provided with the support stand which supports the said bonded substrate, The said support stand is a some opening formed so that intake air or blown air may generate | occur | produce. It is provided with a structure to support the lifting substrate to lift the bonded substrate on the support by the blowing air flow during the transfer of the bonded substrate, and the bonded substrate is adsorbed and fixed to the support during the scribe of the bonded substrate Therefore, the bonded substrate can be fixed at the time of scribing so that the position does not shift, and the conveyance can be facilitated at the time of conveyance of the bonded substrate.
According to the present invention as described above, the fixed scribe mechanism is fixedly installed on the base, and the first scribe line is formed on the front and back of the bonded substrate at the same time, the movable scribe mechanism is provided to be movable on the base, And a movable scribe mechanism that simultaneously forms a second scribe line parallel to the first scribe line on the front and back surfaces, wherein the fixed scribe mechanism and the movable scribe mechanism are formed simultaneously with the first and second scribe lines. Since the spacing between the first and second scribe lines is adjusted by the separation distance between the two mechanisms, scribe lines can be simultaneously formed at two locations on the front and back surfaces of the bonded substrate formed by joining the brittle substrates. As a result, small substrates, such as mother substrates of the liquid crystal panel, It cuts the panel substrates can be processed to reduce the time required to.
Fig. 1 is a view for explaining a substrate cutting system according to Embodiment 1 of the present invention, showing a processing line of a brittle material substrate in the substrate cutting system.
FIG. 2 is a view for explaining a brittle material substrate processed by the substrate cutting system of Embodiment 1, FIG. 2 (a) shows a mother substrate of a liquid crystal panel composed of the brittle material substrate, and FIG. A rectangular substrate obtained by cutting the mother substrate is shown, and Fig. 2 (c) shows a liquid crystal panel substrate obtained by cutting the rectangular substrate.
Fig. 3 is a plan view illustrating the substrate cutting system of the first embodiment, showing a scribing apparatus provided in the processing line of this system.
FIG. 4 is a view for explaining the substrate cutting system of the first embodiment, showing the structure of the section IV-IV of the scribe device shown in FIG.
FIG. 5 is a view for explaining the substrate cutting system of Embodiment 1, FIG. 5 (a) is a view of the scribe device shown in FIG. b) is a figure which shows the movable scribe part of the said scribe device.
FIG. 6 is a plan view for explaining the operation of the scribe device provided in the processing line of the substrate cutting system according to the first embodiment, and shows a state when the movable scribe mechanism of the scribe device shown in FIG. 3 is moved in the horizontal direction. .
FIG. 7 is a cross-sectional view taken along the line VI-VI of FIG. 6, illustrating the operation of the scribing apparatus installed in the processing line of the substrate cutting system of the first embodiment; The state at the time of making it is shown.
FIG. 8 is a view for explaining the operation of the scribing apparatus installed in the processing line of the substrate cutting system of the first embodiment, showing a portion corresponding to the section IV-IV of FIG. 3, and the scribe shown in FIG. The state when the scribe head of the apparatus is moved to the position to scribe the bonded substrate (rectangular substrate) is shown.
9 (a) and 9 (b) illustrate the operation of the scribe device in the substrate cutting system of the first embodiment, and show a state in which the scribe head of the movable scribe portion moves to the scribe position.
10 (a) and 10 (b) illustrate the operation of the scribing apparatus in the substrate cutting system of the first embodiment, in which the scribe head of the movable scribe portion scribes the bonded substrate.
FIG. 11 is a block diagram illustrating a conventional liquid crystal panel cutting line, showing what is disclosed in Patent Document 1. As shown in FIG.
FIG. 12 is a perspective view showing a scribing apparatus constituting the conventional liquid crystal panel cutting line shown in FIG.
Fig. 13 is a schematic diagram illustrating another conventional scribing apparatus and shows what is disclosed in Patent Documents 1 and 2;
Fig. 14 is a plan view illustrating a conventional liquid crystal panel cutting line having a scribing mechanism for simultaneously scribing the front and back surfaces of a bonded substrate bonded to two brittle material substrates (Patent Document 1).
Fig. 15 is a perspective view for explaining a conventional liquid crystal panel cutting device having a scribing mechanism for scribing the front and back surfaces of the bonded substrate at the same time.
FIG. 16 is a perspective view showing an essential part of a conventional liquid crystal panel cutting device shown in FIG.
FIG. 17 is a front view for explaining a scribe operation of the conventional liquid crystal panel cutting device shown in FIG.
FIG. 18 is a front view for explaining a brake operation of the conventional liquid crystal panel cutting device shown in FIG.
EMBODIMENT OF THE INVENTION Hereinafter, embodiment of this invention is described, referring drawings.
(Embodiment 1)
1 to 10 illustrate a substrate cutting system according to Embodiment 1 of the present invention, FIG. 1 shows a processing line of a brittle material substrate in the substrate cutting system of Embodiment 1, and FIG. Mother substrate Ms (Fig. 2 (a)) of the liquid crystal panel which is a brittle material substrate, rectangular substrate Ts (Fig. 2 (b)) obtained from the mother substrate, and liquid crystal panel substrate Ps (obtained from the rectangular substrate) ( Fig. 2 (c) is shown. 3 is a plan view showing a scribing apparatus installed in the processing line, and FIG. 4 shows a structure of section IV-IV of the scribe apparatus shown in FIG. Fig. 5A is a view of the scribe device shown in Fig. 3 in the direction of an arrow shown in the V-V line of Fig. 3, and Fig. 5B is a view showing the movable scribe portion of the scribe device.
In the substrate cutting system 200 of the first embodiment, a bonded substrate on which two brittle material substrates are bonded is cut and used for a liquid crystal panel or the like. It includes a processing line for manufacturing a panel substrate (liquid crystal panel substrate) Ps.
In addition, the bonded substrate on which the two brittle material substrates are bonded is used for forming flat display panels such as liquid crystal panels, plasma display panels, and organic EL display panels. The glass substrate includes a bonded substrate bonded to each other, and also includes a bonded substrate of a semiconductor device in which a glass substrate is bonded to a silicon substrate, a sapphire substrate, or the like. The mother substrate of (mother substrate) will be described as an example.
The processing line (substrate cutting system) 200 includes a mother substrate loader 200a for supplying the mother substrate Ms of the liquid crystal panel onto the processing line 200, and a mother substrate loader. A mother substrate cut portion 200b for cutting a mother substrate Ms supplied from the portion 200a to produce a rectangular substrate Ts, and the mother substrate cut portion 200b. And the rectangular substrate rotational transfer part 200c which rotates the cut rectangular substrate Ts by 90 degrees, and conveys it to the downstream process part. In addition, the processing line 200 cuts the rectangular substrate Ts conveyed from the rectangular substrate rotation carrier 200c to produce a liquid crystal panel substrate Ps 200d. ) And a panel substrate rotation conveying unit for rotating the liquid crystal panel substrate Ps produced by the rectangular substrate cutting unit 200d and conveying the same to the downstream panel substrate inspection unit 200f. A back portion 200e is provided. The panel substrate inspection unit 200f is a portion for inspecting the dimensional accuracy and the like of the panel substrate produced by the processing in the processing line 200.
Here, the mother substrate Ms shown in Fig. 2 (a) is parallel to the dimension of the horizontal direction (left and right direction of the paper surface in Fig. 2 (a)), that is, the conveying direction in the machining line 200. The dimension in the direction is 2500 mm, the dimension in the longitudinal direction (up and down direction of the paper in Fig. 2 (a)), that is, the dimension in the width direction of the processing line 200 has a rectangular shape of 2200 mm, and a scribe line It cuts along Lm1-Lm6, and is cut out as three rectangular board | substrates Ts. In addition, the rectangular substrate Ts shown in Fig. 2B is cut along the scribe lines Lt1 to Lt8 and cut into four liquid crystal panel substrates Ps (see Fig. 2C).
Moreover, the said rectangular substrate rotation conveyance part 200c adsorb | sucks and conveys the said rectangular substrate. However, this may be carried while holding the one end of the rectangular substrate.
Hereinafter, the structure of each part which comprises the processing line of this Embodiment 1 is demonstrated in detail.
The mother board loader 200a includes a loader 12, a carry-on robot 13 and a conveyor 14 in the conventional machining line 100 shown in FIG. It includes a mechanism corresponding to the above, and conveys the mother substrate Ms stored in a predetermined storage location to the mother board cutout portion 200b. The mother substrate cutout 200b scribes the substrate on the front side and the substrate on the back side of the mother board at the same time as the cutting device 1 in the conventional processing line 100 shown in FIG. A scribe mechanism (scribe mechanism 4 of Figs. 15 and 16) is provided. In addition, the rectangular substrate rotary conveying unit 200c includes a trapping mechanism 31, a conveyor 15, and a rotary table 16 in the conventional processing line 100 shown in FIG. ), A rectangular board Ts cut out from the mother board Ms by the mother board cutout 200b is transferred from the mother board cutout 200b to the rectangular board cutout 200d.
The rectangular substrate cutout portion 200d of the first embodiment uses a simultaneous scribe of the front and back surfaces of the brittle material substrate of the cutting device 1A in the conventional processing line 100 described with reference to Figs. A scribe device 1000 is provided which has a scribe mechanism different from the scribe mechanism 4 by which each place is provided, and this scribe device 1000 is a rectangular board | substrate rotation conveyance part 200c side (line upstream). A fixed scribe mechanism 300 disposed on the side) and a movable scribe mechanism 400 disposed on the panel substrate rotary transfer part 200e side (line downstream). Thus, the scribe from the front side and the back side with respect to the rectangular substrate Ts can be performed simultaneously in two places.
First, the fixed scribe mechanism 300 will be described.
The fixed scribe mechanism 300 is formed on the fixed base 301 fixed to the mounting surface R of the scribe device 1000 and the rectangular base on the fixed base 301. A pair of component fixing blocks 310a and 310b attached so as to face each other at regular intervals in accordance with the dimensions of the short sides of the substrate, and the respective fixing blocks 310a and A pair of opposed longitudinal posts 311a and 311b fixed on 310b are provided. In addition, between the opposing longitudinal posts 311a and 311b, fixed guide posts 320a and 320b are attached so as to be positioned in parallel in the vertical direction. In these fixed guide struts 320a and 320b, guide grooves 321 are formed on the side of the line downstream, and guide grooves 321 of the upper guide struts 320a and the lower guide struts 320b. ), An upper horizontal slide member 322a and a lower horizontal slide member 322b, which slide in the horizontal direction (that is, the direction transverse to the processing line) between the two longitudinal posts along the guide groove, are inserted. In addition, although the mechanism which drives the upper horizontal slide member 322a and the lower horizontal slide member 322b is comprised by the linear motor etc. which were provided in the fixed guide struts 320a and 320b.
In addition, an upper vertical slide member 323a is attached to the upper horizontal slide member 322a so as to be able to slide in the vertical direction (vertical direction) with respect to the upper horizontal slide member 322a. The scribe head 331 is fixed to the lower end of the. A tip holder 332 is attached to the lower surface of the scribe head 331, and a cutter wheel tip for scribing along the scribe line of the rectangular substrate Ts is attached to the tip of the tip holder 332. cutter wheel tip 333 is supported with the blade facing downward. Similarly, a lower vertical slide member 323b is attached to the lower horizontal slide member 322b so as to be able to slide in the vertical direction (vertical direction) with respect to the lower horizontal slide member 322b. The scribe head 331 is fixed to the upper end of the). A tip holder 332 is attached to the upper surface of the scribe head 331, and a cutter wheel tip 333 is supported at the tip of the tip holder 332 so that the blade faces upward. The mechanism for driving the upper vertical slide member 323a and the lower vertical slide member 323b is a motor or solenoid coil attached to the upper horizontal slide member 322a and the lower horizontal slide member 322b although not shown in the drawing. It consists of an electric actuator using a coil or an actuator using pneumatic pressure or hydraulic pressure.
In addition, auxiliary parts 341a and 341b are attached to the component mounting fixing blocks 310a and 310b so as to be located downstream of the longitudinal supports 311a and 311b, and these auxiliary supports 341a and 341b. The fixed support table 342 is attached by the following. The fixed support table 342 has an opening formed on the surface thereof for ejecting or inhaling air, and absorbs the rectangular substrate during processing of the rectangular substrate conveyed from the upstream side of the line. When the rectangular substrate is fixed and conveyed, the rectangular substrate is slightly lifted by the air flow. In addition, on the upstream side of the fixed support table 342, a plurality of divided support tables 343 are disposed to face the fixed support table 342. Moreover, these divided support tables 343 are fixed on the fixing base 301 by a supporting member (not shown in the drawing) provided on the fixing base 301, and like the fixed supporting table 342 An opening (not shown) is formed on the surface to blow out or suck in air, and the rectangular substrate is adsorbed and fixed when the rectangular substrate is processed from the upstream side of the line. At the time of transfer, the rectangular substrate is slightly floated by the air flow.
Moreover, the frame member 344 with the roller 344a is provided in the upstream of each division | segment support table 343 along the conveyance direction of the rectangular substrate Ts. The roller 344a is in contact with the lower surface of the rectangular substrate to be transported to support the rectangular substrate Ts.
Here, the fixed scribe mechanism in the fixed scribe mechanism portion 300 is composed of members 310a, 310b, 311a, 311b, 320a, 320b, 322a, 322b, 323a, 323b, 331, 332, 333.
Next, the movable scribe mechanism unit 400 will be described.
The movable scribing mechanism 400 has a fixing base 401 fixed to the mounting surface R of the scribing apparatus 1000 and on the fixing base 401 in the width direction of the rectangular substrate Ts. A pair of rail members 402a and 402b attached to face each other at regular intervals according to the dimensions, and a pair of rail members 402a and 402b attached to the rail members 402a and 402b so as to be movable along the rail members. The component mounting movable blocks 410a and 410b and a pair of opposing longitudinal movable supports 411a and 411b fixed on the respective component mounting movable blocks 410a and 410b are provided.
Here, on both ends of the rail member 402a, bearing members 412a and 413a rotatably supporting a shaft member 414a disposed parallel to it on the rail member 402a are disposed. A motor 415a for rotating the shaft member 414a is attached to the downstream bearing member 412a. The shaft member 414a has a thread formed on its surface, and is disposed to penetrate through the component mounting movable block 410a. In addition, the shaft member 414a has a nut member attached to the inside of the component attachment movable block 410a such that the component attachment movable block 410a moves on the rail member 402a by rotation thereof. Screw). Further, on both ends of the rail member 402b, bearing members 412b and 413b rotatably supporting the shaft member 414b disposed in parallel therewith are disposed on the rail member 402b. The motor 415b for rotating the shaft member 414b is attached to the bearing member 412b. The shaft member 414b is formed by threading the surface thereof, and is disposed to penetrate through the component mounting movable block 410b. In addition, the shaft member 414b has a nut member attached to the inside of the component attachment movable block 410b such that the component attachment movable block 410b moves on the rail member 402b by rotation thereof. Screw).
Moreover, between the opposing longitudinal movable holding posts 411a and 411b, the movable guide posts 420a and 420b are attached so that it may be located in parallel up and down. In these movable guide struts 420a and 420b, guide grooves 421 are formed on the side surfaces of the upstream lines, and guide grooves 421 of the upper movable guide struts 420a and the lower movable guide struts 420b. The upper horizontal slide member 422a and the lower horizontal slide member 422b, which slide in the horizontal direction (that is, the direction transverse to the processing line), are inserted between the two vertical movable posts along the guide groove. Moreover, although the mechanism which drives the upper horizontal slide member 422a and the lower horizontal slide member 422b is comprised with the linear motor etc. which were provided in the movable guide struts 420a and 420b.
In addition, an upper vertical slide member 423a is attached to the upper horizontal slide member 422a so as to be able to slide in the vertical direction (vertical direction) with respect to the upper horizontal slide member 422a. The scribe head 431 is fixed to the lower end of the). A tip holder 432 is attached to the lower surface of the scribe head 431, and a cutter wheel tip 433 is supported at the tip of the tip holder 432 so that the blade faces downward. Similarly, a lower vertical slide member 423b is attached to the lower horizontal slide member 422b so as to be able to slide in the vertical direction (vertical direction) with respect to the lower horizontal slide member 422b. The scribe head 431 is fixed to the upper end of the). The tip holder 432 is attached to the upper surface of the scribe head 431, and the cutter wheel tip 433 is supported at the tip of the tip holder 432 so that the blade faces upward. Moreover, although the mechanism which drives the upper vertical slide member 423a and the lower vertical slide member 423b uses the motor or solenoid coil attached to the upper horizontal slide member 422a and the lower horizontal slide member 422b, although not shown in figure, It consists of an electric actuator or the actuator which used pneumatic or hydraulic pressure.
Further, a cross holder 441 is attached to the movable block 410a and 410b so as to be located upstream of the vertical movable supports 411a and 411b, and across the movable block 410a and 410b. A pair of longitudinal support posts 451a and 451b are attached to the center portion of the transverse support 441 so that the pair of longitudinal support posts are provided with a movable support table 442 for the movable block with parts. It is attached to move with. The movable support table 442 is provided on the surface thereof and has an opening for blowing or suctioning air, and absorbs and fixes the rectangular substrate when the rectangular substrate is processed from the upstream side of the line, In the transfer of the rectangular substrate, the rectangular substrate is slightly floated by the air flow. Further, on the downstream side of the movable support table 442, a scribe head 431 attached to the upper and lower upper horizontal slide members 422a and 422b, which moves along the edge of the movable support table 442, is located.
Here, the movable scribe mechanism in the movable scribe mechanism unit 400 is composed of members 410a, 410b, 411a, 411b, 420a, 420b, 422a, 422b, 423a, 423b, 431, 432, 433.
In addition, inside the rail members 402a and 402b, a pair of guide members 460a and 460b are positioned at an approximately middle height position of the upper movable guide support 420a and the lower movable guide support 420b. It is provided in parallel with the members 402a and 402b, and the guide members 460a and 460b are attached to the guide member support frames 461a and 461b, respectively. The downstream ends of these guide member support frames 461a and 461b are supported by the vertical fixing posts 462a and 462b attached to the fixing base 401, and the guide member support frames 461a and 461b are supported. The upstream side end of the upholstery) is supported by the vertical holding posts 463a and 463b attached to the fixing base 401.
The sprockets 465a and 465b are rotatably attached to the upstream end faces of the guide member support frames 461a and 461b by brackets 464a and 464b. In addition, the sprockets 467a and 467b are rotatably attached to the upstream end surface of the fixing base 401 so as to face the sprockets 465a and 465b by the brackets 466a and 466b.
One pair of sprockets 465a and 467a are faced with one chain 470a, and one end of the chain 470a is provided with a hydraulic or pneumatic cylinder 480a installed in a fixed base 401. It is connected to the cylinder rod (481a) of the. In addition, a pair of sprockets 465b and 467b facing up and down are hooked with another chain 470b, and one end of the chain 470b is similar to the chain 470a so that the hydraulic pressure is provided in the fixed base 401. It is connected to the cylinder rod 481b of the pneumatic cylinder 480b (refer FIG. 5).
A roller support bar 491 is attached to the pair of chains 470a and 470b at regular intervals so as to span them, and a roller 494 is attached to each roller support bar 491 by a bracket 494. 493 is attached so as to be rotatable.
Here, among the plurality of roller support bars 491, the roller support bar 491 positioned closest to the horizontal support 441 is a pair of vertical auxiliary posts 451a attached to the horizontal support 441. And a pair of connecting pieces 483a and 483b connected to the upper end of the 451b and located at both ends of the roller support bar 491 located closest to the transverse support 441. The other end of the pair of chains 470a and 470b is fixed.
One end of the pair of chains 470a and 470b is pressed in the direction of pulling the chain by the cylinder rods 481a and 481b connected thereto, so that a constant tension is always applied to the chains 467a and 467b. It is.
Moreover, the roller 493 attached to the roller support bar 491 located on the upper surface of the said guide member 460a and 460b of the rectangular board | substrate Ts conveyed from the upstream of this scribe apparatus 1000 is carried out. The support surface (support area) is formed in contact with the lower surface to support the rectangular substrate Ts.
Next, the operation will be described.
In the processing line (substrate cutting system) 200, when the mother substrate Ms of the liquid crystal panel is supplied onto the processing line 200 by the mother substrate loader 200a, the mother substrate loader 200a is supplied from the mother substrate loader 200a. The supplied mother substrate Ms is cut by the mother substrate cutout 200b and manufactured into a rectangular substrate Ts. Here, the mother substrate Ms shown in Fig. 2A is cut along the scribe lines Lm1 to Lm6 and cut into three rectangular substrates Ts.
The rectangular board | substrate Ts cut | disconnected by this mother board | substrate cut part 200b is rotated 90 degrees by the rectangular board | substrate rotation conveyance part 200c, and is conveyed to the downstream rectangular board | substrate cut part 200d. In this processing line 200, the rectangular substrate Ts conveyed from the rectangular substrate rotation transfer part 200c is cut by the rectangular substrate cutting part 200d, and the liquid crystal panel substrate Ps is produced. Here, the rectangular substrate Ts shown in Fig. 2 (b) is cut along the scribe lines Lt1 to Lt8 and cut out as four liquid crystal panel substrates Ps (see Fig. 2 (c)).
The liquid crystal panel substrate Ps produced by this rectangular substrate cutting part 200d is rotated by the panel rotation conveyance part 200e, and is conveyed to the downstream panel substrate inspection part 200f. In the panel substrate inspection unit 200f, the dimensional accuracy and the like of the liquid crystal panel substrate Ps produced by the processing line 200 are inspected.
Hereinafter, the operation | movement of each part which comprises the processing line of this Embodiment 1 is demonstrated in detail.
The mother substrate loader 200a includes mechanisms corresponding to the loader 12, the loading robot 13 and the conveyor 14 in the conventional machining line 100 shown in FIG. In the mother board loader part 200a, the mother board Ms stored in the predetermined | prescribed storage place is conveyed to the said mother board cut part 200b.
In the mother substrate cutout portion 200b, a scribe line is formed on the front side substrate and the back side substrate of the mother substrate in the same manner as the cutting device 1 in the conventional processing line 100 shown in FIG. .
The rectangular substrate rotary transfer part 200c includes mechanisms corresponding to the capture mechanism 31, the conveyor 15, and the rotary table 16 in the conventional machining line 100 shown in FIG. As a result, the rectangular board | substrate Ts cut out from the mother board | substrate Ms by the mother board | substrate cutting part 200b is conveyed from the mother board | substrate cutting part 200b to the rectangular board | substrate cutting part 200d.
The rectangular substrate cutout portion 200d of the first embodiment uses a simultaneous scribe of the front and back surfaces of the brittle material substrate of the cutting device 1A in the conventional processing line 100 described with reference to Figs. A scribe device 1000 is provided having a scribe mechanism different from the scribe mechanism 4 to be used in place. In this scribe apparatus 1000, the surface to the rectangular substrate Ts is fixed by the fixed scribe mechanism and the movable scribe mechanism. The scribes on the side and the back side are executed simultaneously in two places.
First, an operation of adjusting the distance between the fixed scribe mechanism and the movable scribe mechanism will be described with reference to FIGS. 3, 4, 6, and 7.
The distance is adjusted according to the dimensions of the liquid crystal panel substrate Ps cut out from the rectangular substrate to be scribed, and specifically, the size of the liquid crystal panel substrate Ps, that is, between the scribe line Lt1 and the scribe line Lt2. It is based on the interval. In addition, the interval between the scribe line Lt3 and the scribe line Lt4, the interval between the scribe line Lt5 and the scribe line Lt6, and the interval between the scribe line Lt7 and the scribe line Lt8 are different from the scribe line Lt1. Needless to say, the same interval as between the scribe lines Lt2.
For example, in Figs. 6 and 7, the movable parts 410a and 410b with parts are provided in order to widen the distance between the scribe head 331 of the fixed scribe mechanism 300 and the scribe head 431 of the movable scribe mechanism 400. The state which moved to the right side of the paper surface from the position shown in FIG.3 and FIG.4 is shown. The moving parts attaching blocks 410a and 410b are moved by rotating the rotary shafts 414a and 414b by the motors 415a and 415b.
At this time, the roller support bar 491 connected through the horizontal member 441 of the movable block is moved to the right direction by the movement of the component mounting movable blocks 410a and 410b, and thus the chain members 470a and 470b. ) Will be pulled to the right. As a result, a roller support bar 491 also appears between the scribe head 331 of the fixed scribe mechanism and the scribe head 431 of the movable scribe mechanism, whereby the scribe head 331 of the fixed scribe mechanism and the movable head are moved. Between the scribe heads 431 of the scribing mechanism, a substrate supporting area necessary for supporting the rectangular substrate is formed in accordance with the size of the liquid crystal panel substrate Ps to be produced from the rectangular substrate Ts.
In this manner, after adjusting the distance between the scribe head 331 of the fixed scribe mechanism and the scribe head 431 of the movable scribe mechanism, the scribe of the rectangular substrate Ts is performed.
8, 9 and 10 illustrate this scribing operation, in which, in particular, the movement of the scribe head 431 in the movable scribe mechanism is shown, but the movement of the scribe head 331 in the fixed scribe mechanism. Is exactly the same.
First, in the movable scribe mechanism, as the upper and lower vertical slide members 423a and 423b are indicated by arrows, the cutter tips of the respective scribe heads 431 are vertically positioned to the positions where the cutter tips of the scribe heads 431 can contact the front and rear surfaces of the rectangular substrate Ts. It moves (FIGS. 9 (a) and 9 (b)). At this time, in the fixed scribe mechanism, the vertical and vertical slide members 323a and 323b are vertically positioned to the position where the cutter tip of each scribe head 331 can contact the front and rear surfaces of the rectangular substrate Ts as shown in FIG. Move in the direction of
Thereafter, the vertical slide members 423a and 423b in the movable scribe mechanism move simultaneously in the width direction of the rectangular substrate Ts as shown by the arrows (Figs. 8, 10 (a) and 10 (b). )). At this time, the vertical slide members 323a and 323b above and below the fixed scribe mechanism also move simultaneously in the width direction of the rectangular substrate Ts similarly to the vertical slide members 423a and 423b of the movable scribe mechanism. Thus, for example, in the rectangular substrate Ts, scribe lines on the front and back sides are formed simultaneously at the positions indicated by Lt1 and Lt2 in Fig. 2B.
Subsequently, in the rectangular substrate cutout portion 200d, the rectangular substrate Ts on which the scribe line is formed by the scribe device 1000 is cut by the cutting device (not shown) at the rear end thereof to form the liquid crystal panel substrate Ps. Is formed. This liquid crystal panel substrate Ps is conveyed to the panel substrate inspection part 200f by the panel substrate rotation conveyance part 200e.
Thus, in this Embodiment 1, in the scribe apparatus 1000 which comprises the rectangular board | substrate cutting part 200d, it is provided by fixing on a base and joining by brittle boards, such as mother board Ms of a liquid crystal panel, bonding together. A fixed scribe mechanism that simultaneously forms a first scribe line on the front and back surfaces of the substrate, and a second scribe line movably mounted on the base and parallel to the first scribe line on the front and back surfaces of the bonded substrate; And a movable scribe mechanism for forming the fixed scribe mechanism and the movable scribe mechanism, wherein the first and second scribe lines are formed at the same time, and the interval between the first and second scribe lines is equal to the separation distance between the two mechanisms. Because it is configured to be adjusted by Scribble lines can be simultaneously formed in two places on the front and back surfaces of the bonded substrate formed by joining the brittle substrates. Thus, a predetermined number of liquid crystal panel substrates Ps are cut out from the bonded substrate such as the mother substrate of the liquid crystal panel. This can shorten the machining time required for this process.
In the first embodiment, in the scribe device 1000, the first and the first positions are formed between the position where the first scribe line is formed by the fixed scribe mechanism and the position where the second scribe line is formed by the movable scribe mechanism. A support region forming mechanism comprising members 470a, 470b, 491, 493 and the like, each having a support region supporting the bonded substrate (rectangular substrate Ts) within a range corresponding to the distance between two scribe lines. Since a mechanism is provided, the area | region which always supports a rectangular substrate can be appropriately formed also when a movable scribe mechanism is moved.
In the first embodiment, in the scribe device 1000, a fixed support table 342 and a movable support table 442, which are provided between the fixed scribe mechanism and the movable scribe mechanism and support the bonded substrate, are provided. And the support table has a plurality of openings formed to generate intake air or blown air, and lifts the bonded substrate on the support table by the blown air when transporting the bonded substrate. It is configured to adsorb and fix the bonded substrate to the support table when scribing the bonded substrate, so that the rectangular substrate is fixed so as not to shift the position during scribing, and the conveyance is easy when conveying the rectangular substrate. Let There.
Specifically, a fixed support table 342 is provided on the downstream side of the scribe area by the fixed scribe mechanism to support the bonded substrate in close proximity to the scribe area, and the divided support table 343 is located upstream of the scribe area. And the fixed support table 342 and the divided support table 343 have a plurality of openings formed to generate intake air or blow-off air, and to the blow-off air at the time of transferring the bonded substrate. By holding the bonded substrate on the support table to lift the bonded substrate, the bonded substrate is adsorbed and fixed to the supporting table at the time of scribing the bonded substrate. That scribe It can be fixed firmly near the groove area. In addition, a movable support table 442 is provided on the downstream side of the scribe area by the movable scribe mechanism and supports the bonded substrate, and the movable support table 442 generates intake air or blown air. And a plurality of openings formed to support the bonded substrate to lift the bonded substrate onto the support by the blowing air flow during the transfer of the bonded substrate, and adsorb the bonded substrate to the movable support during the scribe of the bonded substrate. Since it is a structure to fix and fix, the bonded substrate can be firmly fixed to the scribe by a movable scribe mechanism in the vicinity of the scribe area.
In the first embodiment, the scribing apparatus for forming a scribe line on a rectangular substrate as the substrate cutting system is configured to form a scribe line on the front and back surfaces of two rectangular substrates at the same time. The cutting system may be configured such that a scribing apparatus for forming a scribe line on the mother substrate is formed so as to simultaneously form a scribe line on its front and back surfaces at two places on the mother substrate, and this substrate cutting system will be described as the second embodiment. .
(Embodiment 2)
The substrate cutting system of the second embodiment uses a scribe device having the configuration shown in FIGS. 3 to 5 as the mother substrate cutting portion 200b in the substrate cutting system of the first embodiment.
Thus, also in this Embodiment 2, in the scribe apparatus of a mother substrate, it is fixed and installed on a base, and it can move on the said base and the fixed scribe mechanism which forms a 1st scribe line simultaneously on the surface and the back of a mother substrate. And a movable scribe mechanism formed on the front and rear surfaces of the mother substrate at the same time to form a second scribe line parallel to the first scribe line, wherein the fixed scribe mechanism and the movable scribe mechanism are provided as the first and the second scribe mechanisms. Since two scribe lines are formed at the same time and the distance between the first and second scribe lines is adjusted by the separation distance of the two mechanisms, the scribe lines are bonded to the front and back surfaces of the mother substrate, which is a bonded substrate formed by joining the brittle substrates. 2 May form a scribe line at the same time small, so that it is possible to shorten the processing time required for the I cut a rectangular substrate (Ts) a predetermined number from the bonding substrate such as a mother board (Ms) of the liquid crystal panel.
In the second embodiment, a scribe device having the configuration shown in Figs. 3 to 5 was used for both the mother substrate cutting portion 200b and the rectangular substrate cutting portion 200d in the substrate cutting system. The system may use a scribe device having the configuration shown in Figs.
As mentioned above, although this invention was illustrated using preferable embodiment of this invention, this invention is limited to this embodiment and should not be interpreted. The scope of the present invention should be interpreted only by the claims. Those skilled in the art can implement equivalent ranges from the description of the specific and preferred embodiments of the present invention based on the description of the present invention and common technical knowledge. As for the patent document quoted in this specification, the content should be used as a reference | reference to this specification similarly to the content itself describing in this specification.
The present invention is arranged in a processing line for cutting a plurality of panel substrates from a bonded substrate formed by joining two brittle material substrates, and scribing (marking) of the bonded substrates on the surface of the bonded substrate. In the field of scribing devices which can be simultaneously formed on the back side and the back side thereof, scribe lines can be simultaneously formed at two places on the front and back sides of the bonded substrate formed by joining the brittle substrates. The processing time required for cutting out a predetermined number of panel substrates from the bonded substrate can be shortened.
200: processing line (substrate cutting system)
200a: Mother board loader
200b: Mother board cutout
200c: rectangular substrate rotary transfer unit
200d: rectangular substrate cutout
200e: Panel board conveying unit
200f: panel board inspection unit
300: fixed scribe mechanism
301, 401: fixed base
310a, 310b: Fixed block with parts
311a, 311b: vertical column
320a, 420a: Upper guide post
320b, 420b: Lower guide post
321, 421: Guide groove
322a: upper horizontal slide member
322b: lower horizontal slide member
323a: upper vertical slide member
323b: lower vertical slide member
331, 431: scribe head
332, 432: Tip Holder
333, 433: Cutter Wheel Tips
341a, 341b: auxiliary holding
342: fixed support table
343: divided support table
344: frame member
344a: Roller
400: movable scribe mechanism
402a, 402b: rail member
410a, 410b: moving block with parts
411a, 411b: vertical movable column
412a, 412b, 413a, 413b: bearing member
414a, 414b: shaft member
442: movable support table
460a, 460b: guide member
461a, 461b: Guide member support frame
462a, 462b, 463a, 463b: vertical fixed column
464a, 464b, 466a, 466b, 494: bracket
465a, 465b, 467a, 467b: sprocket
470a, 470b: chain
491: Roller Support Bar
493: Roller
1000: scribe device
Lm1 ~ Lm6, Lt1 ~ Lt8: scribe line
Ms: Mother board (bonded board)
Ts: Rectangular Substrate
Ps: Panel Board (Liquid Crystal Panel)
R: Mounting surface

Claims (9)

  1. A scribe device for forming a scribe line on a bonded substrate having a structure in which a brittle substrate is bonded,
    A fixed scribe mechanism which is fixedly installed on a base disposed on an installation surface, and which simultaneously forms a first scribe line on the front surface and the rear surface of the bonded substrate;
    A movable scribe mechanism which is provided on the base so as to be movable and which forms a second scribe line parallel to the first scribe line on the front and rear surfaces of the bonded substrate;
    Respectively,
    In the fixed scribe mechanism and the movable scribe mechanism, the first and second scribe lines are formed simultaneously, and the interval between the first and second scribe lines is equal to the separation distance between the fixed scribe mechanism and the movable scribe mechanism . A scribe device, characterized in that configured to be adjusted by.
  2. The method of claim 1,
    In the range according to the separation distance of the said 1st and 2nd scribe line between the formation position of the 1st scribe line by the said fixed scribe mechanism, and the formation position of the 2nd scribe line by said movable scribe mechanism, A scribing apparatus comprising a support region forming mechanism for forming a support region for supporting a bonded substrate.
  3. The method of claim 2,
    It is provided between the said fixed scribe mechanism and the said movable scribe mechanism, and is provided with the support stand which supports the said bonded substrate,
    The support has a plurality of openings formed to generate intake air or blow-off air, and is supported by the blow-off air during transfer of the bonded substrate. And supporting the bonded substrate on the substrate and adhering the bonded substrate to the support when the scribe substrate is scribed.
  4. delete
  5. The method of claim 3,
    The fixed scribe mechanism,
    A first upper scribe portion attached to the base so as to slide in a horizontal direction and forming a first scribe line on the surface of the bonded substrate by the horizontal slide;
    On the base, the first scribe line is attached to face the first upper scribe portion so as to slide in the same direction, and the first scribe line is formed on the rear surface of the bonded substrate by the slide in the same direction as the first upper scribe portion. The first lower scribe portion to be formed
    Respectively,
    The movable scribe mechanism,
    A second upper scribe portion attached to the base so as to slide in a horizontal direction and forming a second scribe line on a surface of the bonded substrate by the horizontal slide;
    A second scribe line attached to the base so as to slide in the same direction opposite the second upper scribe portion, and to form a second scribe line on the back surface of the bonded substrate by a slide in the same direction as the second upper scribe portion; Lower scribe section
    A scribing apparatus comprising:
  6. The method of claim 5,
    The fixed scribe mechanism includes a pair of longitudinal supports attached to the base and a pair of first upper and lower guide supports attached in parallel to each other so as to extend in a horizontal direction between the vertical supports. ),
    The first upper scribe portion includes a first upper horizontal slide member attached to the first upper guide support so as to slide in a horizontal direction, and a first upper vertical slide member attached to the first upper horizontal slide member to slide in a vertical direction. And a scribe head attached to said first upper vertical slide member, said scribe head having a tip holder for supporting a cutter wheel tip,
    The first lower scribe portion includes a first lower horizontal slide member attached to the first lower guide support so as to slide in a horizontal direction, and a first lower vertical slide member attached to the first lower horizontal slide member in a vertical direction. And a scribe head attached to said first lower vertical slide member, said scribe head having a tip holder for supporting a cutter wheel tip.
  7. The method of claim 5,
    The movable scribe mechanism includes a pair of movable blocks provided on the pair of rail members attached to the base so as to be movable along the rail members, and the movable blocks. A pair of longitudinal movable supports attached to face each other, and a pair of second upper and lower guide supports attached in parallel to each other so as to extend in a horizontal direction between the longitudinal movable supports,
    The second upper scribe portion includes a second upper horizontal slide member attached to the second upper guide support so as to slide in a horizontal direction, and a second upper vertical slide member attached to the second upper horizontal slide member in a vertical direction. And a scribe head attached to said second upper vertical slide member, said scribe head having a tip holder for supporting a cutter wheel tip,
    The second lower scribe portion includes a second lower horizontal slide member attached to the second lower guide support so as to slide in a horizontal direction, and a second lower vertical slide member attached to the second lower horizontal slide member in a vertical direction. And a scribe head attached to said second lower vertical slide member, said scribe head having a tip holder for supporting a cutter wheel tip.
  8. The method of claim 2,
    The support region forming mechanism,
    A pair of guide members disposed to extend along a movement path of the movable scribe mechanism, the guide members having a component guide groove and facing each other;
    A pair of chain members movably attached along the component guide grooves of the guide members,
    A plurality of roller support bars attached to the pair of chain members at regular intervals and supporting a plurality of rollers,
    Above will secure the one end (一端) of each chain member to the movable scribing mechanism and presses the other end (他端) of each of the chain members in a predetermined direction so as to take a certain amount of tension (張力) in the chain member,
    The support region forming mechanism,
    The chain member is moved by the movement of the movable scribe mechanism so that the roller supported by the plurality of roller support bars emerges between the fixed scribe mechanism and the movable scribe mechanism to support the bonded substrate. The scribe device, characterized in that the support area is configured to be the width according to the separation distance of the first and second scribe line.
  9. The method of claim 1,
    The bonded substrate,
    A scribing apparatus comprising: a rectangular mother substrate for cutting out a liquid crystal panel having a bonding structure in which two glass substrates are bonded together.
KR1020117001366A 2008-06-25 2009-06-23 Scribing apparatus KR101220859B1 (en)

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JPJP-P-2008-166612 2008-06-25
JP2008166612 2008-06-25
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KR20110031340A (en) 2011-03-25
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CN102083760B (en) 2014-01-08
JPWO2009157440A1 (en) 2011-12-15
TWI369339B (en) 2012-08-01
JP5280442B2 (en) 2013-09-04
TW201008887A (en) 2010-03-01

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