CN108218213A - Cutter for substrate - Google Patents

Abstract

A kind of cutter for substrate in the embodiment of the present invention, including：First transfer unit, the first plate including being used to support substrate；Cutter unit, including：Framework extends to perpendicular to the direction that the substrate is transferred；Head can movably be set, and have cutting wheel along the framework；And second transfer unit, it moves back and forth on the direction transferred in the substrate, second transfer unit includes the second plate, and second plate supports the substrate when the substrate is cut by the cutting wheel with together with first plate.

Description

Cutter for substrate

Technical field

The present invention relates to a kind of cutter for substrate, are used for cutting substrate.

Background technology

It is commonly used for the liquid crystal display panel, organic EL display panel, inorganic EL of flat-panel monitor Display pannel, transmission projection substrate, reflective projection substrate etc. use unit glass panel (hereinafter referred to as " unit substrate "), institute It is by will such as glass brittleness mother glass panel (hereinafter referred to as " substrate ") be cut to predetermine sizes to state unit glass panel And it obtains.

The process of cutting substrate includes：Dicing processes and sliver process, the dicing processes are along desire cutting substrate Preset lines press and move by as made of the materials such as diamond score wheel come formed scribing line, and the sliver process be by along Scribing line pressing substrate carrys out cutting substrate with obtaining unit substrate.

It as a result, for cutting substrate, needs that dicing processes and sliver process is individually performed, ask there is process is increased Topic.

【Existing technical literature】

【Patent document】

KR published patent the 10-2007-0070824th (2007.07.04).

Invention content

It, can be with present invention aims at providing a kind of cutter for substrate in order to solve above-mentioned the problems of the prior art Cutting substrate dicing processes and sliver process need not be individually performed.

In order to achieve the above object, the present invention provides a kind of cutter for substrate, and feature is, including：First transfer Unit, the first plate including being used to support substrate；Cutter unit, including：Framework is transferred to perpendicular to the substrate Direction extend；Head can movably be set, and have cutting wheel along the framework；And second transfer unit, It is moved back and forth on the direction that the substrate is transferred, second transfer unit includes the second plate, and second plate is in the base When plate is cut by the cutting wheel substrate is supported with together with first plate.

First plate, second plate or first plate and the second plate float the substrate when the substrate moves It is floating, the fixed substrate is adsorbed when supporting the substrate.

First transfer unit is further included the shuttle unit of the base plate transfer to the cutter unit, institute from outside Shuttle unit is stated to include：Guide rail extends to the transfer direction of the substrate；Shuttle component adsorbs the bottom surface of the substrate And it is moved along the guide rail；Shuttle component lifting gear is used to lift the shuttle component.

First transfer unit further includes presser unit, and the presser unit is single to the cutting in the base plate transfer Pressurize when first the substrate rear row end and be directed at the substrate, the presser unit includes：Guide rail, the shifting to the substrate Direction is sent to extend；Propeller, is moved and the rear row end for the substrate that pressurizes along the guide rail；Propeller lifting gear, For lifting the propeller.

When the rear row end of the substrate during the substrate is by transfer is by the propeller, the propeller ratio The fast speed of the movement speed of the substrate is mobile and is contacted with after the rear row end of the substrate, with the movement with the substrate The identical speed movement of speed.

The head includes：First cutting wheel module and the second cutting wheel module, are spaced apart in the up-down direction, and Has cutting wheel respectively；First roller module and the second roller module, are spaced apart, and have roller respectively in the up-down direction Son.

The cutting wheel of the first cutting wheel module is aligned setting with the roller of second roller module, and described second cuts The cutting wheel for cutting wheel module is aligned setting with the roller of first roller module.

Second transfer unit further includes belt, and the belt is transferred with second plate one substrate in the same direction Direction it is mobile and by the base plate transfer.

Second transfer unit further includes lifting gear, and the lifting gear lifts the band relative to second plate Son.

Second transfer unit is in a state that a part for the substrate is fixed on first plate by the substrate Other parts be fixed on second plate so that second plate is far from first plate, so as to detach the substrate.

Cutter for substrate in the embodiment of the present invention further includes illusory elimination unit, is set to described first and moves It send between unit and second transfer unit, to eliminate positioned at leading end, rear row end or the leading end of the substrate and rear row The non-active area at end.

The illusory elimination unit includes：Fixture is used to hold the non-active area of the substrate；Fixture driving dress It puts, is used for the vertically and horizontally fixture, and the rolling clamp centered on trunnion axis and vertical axis.

Invention effect

Cutter for substrate in embodiment present invention as described above, multiple cutting lines, i.e. the first X-axis cutting line and Two X-axis cutting lines, the first Y-axis cutting line, the second Y-axis cutting line are single by the first cutter unit for setting gradually, the second cutting Member and third cutter unit sequentially form, so as to cutting substrate.Therefore, be individually performed for cutting substrate dicing processes and The prior art of sliver process is compared to process number is reduced, so as to improve the efficiency of cutting substrate.

Description of the drawings

Fig. 1 is the module map that outline represents cutter for substrate in the embodiment of the present invention.

Fig. 2 is the generalized schematic for the substrate for representing to be cut by the cutter for substrate in the embodiment of the present invention.

Fig. 3 is the side view that outline represents the aligned units of cutter for substrate in the embodiment of the present invention.

Fig. 4 is the vertical view that outline represents the aligned units of cutter for substrate in the embodiment of the present invention.

Fig. 5 is the side view that outline represents the aligned units of cutter for substrate in the embodiment of the present invention.

Fig. 6 be outline represent the first transfer unit of cutter for substrate in the embodiment of the present invention, the first cutter unit and The vertical view of second transfer unit.

Fig. 7 and Fig. 8 is that outline represents that the first transfer unit of cutter for substrate in the embodiment of the present invention, the first cutting are single The side view of member and the second transfer unit.

Fig. 9 is the side view that outline represents the presser unit of the first transfer unit of cutter for substrate in the embodiment of the present invention Figure.

Figure 10 to Figure 20 is to represent the first transfer unit of cutter for substrate in the embodiment of the present invention, the first cutting successively The schematic diagram of the operational process of unit and the second transfer unit.

Figure 21 is the second transfer unit and the second cutter unit that outline represents cutter for substrate in the embodiment of the present invention Side view.

Figure 22 to Figure 24 is that outline represents the second transfer unit of the cutter for substrate from the embodiment of the present invention to second The schematic diagram of the process of cutter unit transferring substrates.

Figure 25 is the vertical view that outline represents the second cutter unit of cutter for substrate in the embodiment of the present invention.

Figure 26 is that outline represents the second cutter unit of cutter for substrate and substrate roll-over unit in the embodiment of the present invention Side view.

Figure 27 to Figure 32 is that the operation of the substrate roll-over unit of cutter for substrate in the embodiment of the present invention illustrates schematic diagram.

Figure 33 is that outline represents the substrate roll-over unit of cutter for substrate and third cutter unit in the embodiment of the present invention Side view.

Figure 34 is the vertical view that outline represents the third cutter unit of cutter for substrate in the embodiment of the present invention.

Reference numeral：

100：Aligned units 200：First cutter unit

300：Second cutter unit 400：Substrate roll-over unit

500：Third cutter unit 600：First transfer unit

700：Second transfer unit S：Substrate

S1：First face S2：Second face.

Specific embodiment

Hereinafter, the cutter for substrate in the embodiment of the present invention is illustrated with reference to attached drawing.

The object cut by cutter for substrate in the embodiment of the present invention is that first substrate and second substrate are bonded and are formed Adhesive substrates.For example, first substrate can include thin film transistor (TFT), second substrate can include colour filter or opposite Structure.Hereinafter, adhesive substrates are referred to as substrate, the surface for the first substrate being externally exposed is known as the first face, by exposure It is known as the second face in the surface of Wai Bu second substrate.

Also, the transfer direction for the substrate for performing substrate cut process is defined as Y direction, with base plate transfer direction (Y Axis direction) intersect (for example, orthogonal) direction be defined as X-direction.Also, it will be perpendicular to the side of the X-Y plane of substrate setting To being defined as Z-direction.

As shown in Figures 1 and 2, cutter for substrate includes in the embodiment of the present invention：Aligned units 100 are determined from outer The position for the substrate that portion enters；First cutter unit 200 is respectively formed parallel in the first face S1 and the second face S2 of substrate S In the first X-axis cutting line XL1 and the second X-axis cutting line XL2 of X-direction；Second cutter unit 300, the first of substrate S Face S1 is formed in parallel with the first Y-axis cutting line YL1 of Y direction；Substrate roll-over unit 400 is formed with the first Y-axis for overturning The substrate S of cutting line YL1；Third cutter unit 500 is formed in parallel with the second Y-axis of Y direction in the second face S2 of substrate S Cutting line YL2；First transfer unit 600 is set between 100 and first cutter unit 200 of aligned units, by substrate from right Quasi- unit 100 is transferred to the first cutter unit 200；Second transfer unit 700 is set to the first cutter unit 200 and second Between cutter unit 300, substrate is transferred to the second cutter unit 300 from the first cutter unit 200.

Aligned units 100, the first cutter unit 200, the second cutter unit 300, substrate roll-over unit 400, third cutting Unit 500 is parallel to surface water level land and is arranged in a row.Therefore, substrate S is along aligned units 100, the first cutter unit 200, Two cutter units 300, substrate roll-over unit 400, the transfer of 500 horizontal continuity of third cutter unit, substrate S is cut in the process It cuts.

As shown in Fig. 2, the cutter for substrate in the embodiment of the present invention is distinguished in the first face S1 and the second face S2 of substrate S The first X-axis cutting line XL1 and the second X-axis cutting line XL2 is formed, the first Y-axis cutting line YL1 is formed in the first face S1 of substrate S Upset substrate S afterwards forms the second Y-axis cutting line YL2, so as to which substrate S is cut into unit substrate in the second face S2 of substrate S.

As shown in Figures 3 to 5, aligned units 100 include：Multiple belts 110, the direction (Y-axis transferred to substrate S Direction) extend, and be spaced apart at a predetermined interval in the X-axis direction；Belt lifting gear 120 is connect with multiple belts 110 And lift multiple belts 110；Multiple flotation gears 130 are set between multiple belts 110, for floating substrate S；Pressurization Device 140, for pressurizeing by the side of the substrate S of multiple 130 floats of flotation gear.

Multiple belts 110 are supported respectively by multiple belt wheels 111.At least one of multiple belt wheels 111, which are to provide, to be used for Rotate the driving pulley of the driving force of belt 110.

Belt lifting gear 120 can be the actuator, the root that are run by air pressure or oil pressure being connect with multiple belt wheels 111 According to the linear motor of electromagnetic interaction operation or ball screw device isoline movement equipment.

Multiple flotation gears 130 can include the multiple gas nozzles 131 being connect with gas supply source (not shown).It is multiple Gas nozzle 131 is spaced apart at a predetermined interval in the Y-axis direction.

Pressue device 140 includes：Pressing member 141, for the side for the substrate S that pressurizes；Pressing member mobile device 142, It moves pressing member 141 to the direction in the direction towards substrate S and separate substrate S.Multiple pressing members 141 are configured to Enough mutual at least two opposite sides of pressurization substrate S.The shape of pressing member 141 and the side of substrate S are correspondingly formed, with Convenient for the side for the substrate S that presses.Another example, the shape of pressing member 141 is correspondingly formed with the corner portion of substrate S, in order to apply Press the corner portion of substrate S.

According to constituted above, as shown in figure 3, during substrate S is fed through aligned units 100 from outside, multiple bands Son 110 maintains the state risen from multiple flotation gears 130.Also, with the rotation of multiple belts 110, substrate S may be moved It moves to the precalculated position between multiple pressing members 141.

Also, as shown in Figures 4 and 5, substrate S is moved to the precalculated position on multiple belts 110, then multiple belts 110 Gas nozzle 131 sprays gas to substrate S while decline, and substrate S is floated under the action of gas is sprayed.

Also, in the state of substrate S floatings, pressing member 141 pressurizes under the operating of pressing member mobile device 142 The side of substrate S, as a result, substrate S translated or rotated and determined position and the posture of substrate S.

After being determined in the position of substrate S and posture, while gas nozzle 131 interrupts gas injection on multiple belts 110 It rises, therefore, substrate S is supported in the state of being determined in its position by multiple belts 110.

In addition, according to the rotation of multiple belts 110, substrate S is sent out from aligned units 100, at the same time, the first sheet Member 600 runs and substrate S is transferred to the first cutter unit 200.

As shown in Figures 6 to 9, the first transfer unit 600 includes：Multiple belts 610, are used to support substrate S；Shuttle unit 620, it is set between 100 and first cutter unit 200 of aligned units and adsorbs and transfer substrate S；First holding unit 630, For holding the rear row end for being supported on the substrate S on multiple belts 610；First guide rail 640 connects with the first holding unit 630 It connects and extends to Y direction；Presser unit 650 presses the rear row end of substrate S when substrate S is fed through on multiple belts 610 And it is directed at substrate S；First plate 660 is adjacent to the first cutter unit 200 and sets, for floating or adsorbing and supporting substrate S.

The separated from each other setting in the X-axis direction of multiple belts 610.Each belt 610 is supported by multiple belt wheels 611, more At least one of a belt wheel 611 can be to provide the driving pulley of the driving force of rotation belt 610.

Multiple belts 610 of first transfer unit 600 are adjacent to multiple belts 110 of aligned units 100 and are set to same In one plane, substrate S can be transferred directly to multiple bands of the first transfer unit 600 from multiple belts 110 of aligned units 100 Son 610.

As shown in fig. 6, shuttle unit 620 includes to the extended guide rail 621 of Y direction, can be worn along what guide rail 621 moved Shuttle component 622, the shuttle component lifting gear 623 for lifting shuttle component 622 to Z-direction.

The actuator run by air pressure or oil pressure can be set between shuttle component 622 and guide rail 621, according to electromagnetism phase The linear motor of interaction operation or ball screw device isoline movement equipment.Shuttle component 622 can pass through straight line as a result, Mobile equipment is moved along guide rail 621 to Y direction.

Guide rail 621 extends to aligned units 100, and shuttle component 622 can be moved to first from aligned units 100 as a result, Transfer unit 600.

Shuttle component 622 is connect with vacuum source carrys out sorbing substrate S.As a result, as shuttle component 622 is sorbing substrate S's It is moved under state to Y direction, substrate S can be moved to Y direction.

Shuttle component 622 moves back and forth between 100 and first transfer unit 600 of aligned units, performs substrate S from right Quasi- unit 100 is transferred to the effect of the first transfer unit 600.

Shuttle component lifting gear 623 can include shuttle component 622 and the actuator, the root that are run by air pressure or oil pressure According to the linear motor of electromagnetic interaction operation or ball screw device isoline movement equipment.When transferring substrate S, shuttle portion Part lifting gear 623 rises shuttle component 622 so that 622 sorbing substrate S of shuttle component.Also, substrate S is by shuttle component 622 After being transferred to the first transfer unit 600, shuttle component lifting gear 623 decline shuttle component 622 prevent shuttle component 622 with Substrate S, 652 and first holding unit 630 of propeller interfere with each other.

Can be provided between first holding unit 630 and the first guide rail 640 air pressure or oil pressure operation actuator, Linear motor or ball screw device isoline the movement equipment run according to electromagnetic interaction.Therefore, it is held first single In a state that member 630 holds substrate S, the first holding unit 630 is moved by the equipment that moves linearly to Y direction, and substrate S can be with It is transferred to Y direction.At this point, the movement of multiple belts 610 and the first holding unit 630 rotates together with, so as to stablize twelve Earthly Branches Support group plate S.

First holding unit 630 includes to X-direction extending and be connected to the supporting rod 631 of the first guide rail 640 and more A holding component 632 for being set to supporting rod 631 and holding substrate S.Holding component 632 can be pressurization and maintain substrate S Fixture.Another example, holding component 632 can have the vacuum hole being connect with vacuum source and carry out sorbing substrate S.

Presser unit 650 include to the extended guide rail 651 of Y direction, can along the propeller 652 that guide rail 651 moves and The propeller lifting gear 653 that propeller 652 is lifted to Z-direction.

The actuator of air pressure or oil pressure operation can be provided between propeller 652 and guide rail 651, according to electromagnetism phase The linear motor of interaction operation or ball screw device isoline movement equipment.Propeller 652 can be moved by straight line as a result, Dynamic device is moved along guide rail 651 to Y direction.

Propeller lifting gear 653 may include the actuator, the root that are run by air pressure or oil pressure being connect with propeller 652 According to the linear motor of electromagnetic interaction operation or ball screw device isoline movement equipment.Propeller lifting gear 653 is logical It crosses ascent propulsion device 652 and so that propeller 652 presses to the rear row end of substrate S, propeller 652 applies the rear row end of substrate S 653 descent propulsion device 652 of propeller lifting gear after pressure, so as to prevent propeller 652 and substrate S, shuttle component 622 and first Holding unit 630 interferes.

In a state that substrate S is located on multiple belts 610, presser unit 650 promotes the rear row end of substrate S so that base Plate S is located at accurate position P.

As another example, during the holding transferred to Y direction in advance of 622 sorbing substrate S of shuttle component, substrate S Rear row end by propeller 652 when, propeller 652 is mobile and be contacted with the speed fast compared to the movement speed of substrate S Behind the rear row end of substrate S, propeller 652 can be synchronous with the movement speed of substrate S driven by shuttle component 622, with substrate S Identical speed movement.

As another example, during substrate S is transferred according to the rotation of multiple belts 610 to Y direction, propeller After 652 are contacted with the rear row end of substrate S with the movement speed fast compared to the movement speed of substrate S, propeller 652 and substrate S Movement speed synchronize, moved with the speed identical with substrate S.

By propeller 652 as described above, substrate S can be located at accurate position on belt 610 without moving reelingly It puts.

First plate 660 can float or sorbing substrate S.For example, could be formed with can be with gas on the surface of the first plate 660 Source of supply and multiple groove portions of vacuum source connection.When gas is supplied to multiple groove portions of the first plate 660 from gas supply source, base Plate S can be floated from the first plate 660.Also, gas is sucked into multiple groove portions of the first plate 660 under the action of vacuum source When, substrate S is adsorbed by the first plate 660.

In substrate S in the state of the floating of the first plate 660, substrate S can be with the first plate 660 without frictionally moving.Also, During the first face S1 and the second face S2 of substrate S form the first X-axis cutting line XL1 and the second X-axis cutting line XL2, base Plate S is adsorbed and is fixed on the first plate 660.

Such as Fig. 6 to Fig. 8, the first cutter unit 200 is respectively formed the first X-axis in the first face S1 and the second face S2 of substrate S Cutting line XL1 and the second X-axis cutting line XL2.

First cutter unit 200 includes to extended first framework 210 of X-direction and can movably be set to X-direction In the first head 220 of the first framework 210.First framework 210 can have multiple first heads 220 in the X-axis direction.

Also, at least a pair of first head 220 is set to the first framework 210 opposite to each other in the Z-axis direction.

At least a pair of first head 220 includes：First cutting wheel module and the second cutting wheel module 221, in Z-direction On be spaced apart, and have cutting wheel 225 respectively；First roller module and the second roller module 222, separate in Z-direction Setting, and have roller 229 respectively.

The cutting wheel 225 of first cutting wheel module 221 is aligned setting with the roller 229 of the second roller module 222, and second cuts The cutting wheel 225 for cutting wheel module 221 is aligned setting with the roller 229 of the first roller module 222.

The roller 229 of 225 and first roller module of cutting wheel of first cutting wheel module 221 can apply pressure to the first face S1, the roller 229 of 225 and second roller module of cutting wheel of the second cutting wheel module 221 can apply pressure to the second face S2.

Therefore, the state of the first face S1 and the second face S2 is applied pressure to respectively in multiple cutting wheels 225 and multiple rollers 229 Under, the first head 220 is moved relative to substrate S to X-direction so that is respectively formed the first X in the first face S1 and the second face S2 Axis cutting line XL1 and the second X-axis cutting line XL2.

Also, the cutting wheel 225 of the 225 and second cutting wheel module 221 of cutting wheel of the first cutting wheel module 221 can be It is separated in Y direction, the roller 229 of 229 and second roller module 222 of roller of the first roller module 222 can be in Y direction On separate.The first X-axis cutting line XL1 and the second X-axis cutting line XL2 can be provided spaced in the Y-axis direction as a result,.

As a result, as shown in Fig. 2, can form Y-axis stepped part YS after substrate S is cut, the Y-axis stepped part has phase When in the first X-axis cutting line XL1 and the second X-axis cutting line XL2 distances spaced apart from each other in the Y-axis direction, this Y-axis stepped part YS could be formed with wiring and/or the electrode connected with wiring etc..

Also, as shown in Fig. 6 to Figure 21, the cutter for substrate in the embodiment of the present invention further includes illusory elimination unit 900, it holds (useless positioned at the leading end margin of substrate S and illusory (dummy, discarded, useless) part of rear row end margin Glass (cullet), that is, not as unit substrate, after dicing by discarded non-active area) and eliminate illusory portion from substrate S Point.

Illusory elimination unit 900 can be arranged between the first transfer unit 600 and the second transfer unit 700.

Illusory elimination unit 900 includes：Fixture 910 is used to hold the non-active area of substrate S；Fixture driving device 920, vertically and horizontally fixture 910, and the rolling clamp 910 centered on trunnion axis (X-axis) and vertical axis (Y-axis).

Fixture 910 can include a pair of of the clamp member moved with moving or be spaced from each other with adjoining each other.Pass through a pair Clamp member across substrate S it is adjacent to each other it is mobile, substrate S is held by clamp member.

For example, fixture driving device 920 can be the multi-spindle machining hand for the multiple arms for including connecting with fixture 910.

As shown in Fig. 6 to Figure 21, the second transfer unit 700 includes：Second plate 760 is adjacent to the first cutter unit 200 Setting is floated or is adsorbed and supporting substrate S；Belt 710 is connected to the second plate 760；Mobile device 730, is used in Y-axis The second plate 760 and belt 710 are moved back and forth on direction.The effect of mobile device 730 is along to the extended guide rail of Y direction 720 move back and forth the second plate 760 and belt 710 in the Y-axis direction.It can be applicable in through air pressure or oil as mobile device 730 Actuator, the linear motor run according to electromagnetic interaction or the ball screw device isoline of operation is pressed to move equipment.

Also, the second transfer unit 700 can selectively include the lifting gear 740 for lifting belt 710.

Second plate 760 can be moved with belt 710 with a Y direction in the same direction.That is, the second plate 760 can be together with belt 710 To being parallel to, the direction (Y direction) that substrate S transferred is mobile.

First X-axis cutting line is respectively formed by first face S1 and second face S2 of first cutter unit 200 in substrate S During XL1 and the second X-axis cutting line XL2, the second plate 760 is moved to the first plate 660, and the first head 220 can be located at the first plate 660 Between the second plate 760.First X-axis is respectively formed by first face S1 and second face S2 of first cutter unit 200 in substrate S During cutting line XL1 and the second X-axis cutting line XL2, the second plate 760 is moved to the first plate 660, and substrate S is by the first plate 660 and second Plate 760 is supported.

Belt 710 can be multiple, and multiple belts 710 can be provided spaced in the X-axis direction.Each belt 710 It is supported by multiple belt wheels 711, the driving of at least one driving force that can be to provide rotation belt 710 in multiple belt wheels 711 Belt wheel.

Second plate 760 can float or sorbing substrate S.For example, 760 surface of the second plate could be formed with and gas supply source And multiple groove portions of vacuum source connection.When gas is supplied to multiple groove portions of the second plate 760 from gas supply source, substrate S can be with It is floated from the second plate 760.Also, when gas is sucked into multiple groove portions of the second plate 760 under vacuum source effect, substrate S can be with It is adsorbed in the second plate 760.

During substrate S is transferred to the second plate 760, gas is supplied to the groove portion of the second plate 760, as a result, substrate S It can be with the second plate 760 without frictionally being moved.

The mistake of the first X-axis cutting line XL1 and the second X-axis cutting line XL2 is formed in the first face S1 and the second face S2 of substrate S Cheng Zhong, substrate S are adsorbed and fixed by the second plates 760.

In substrate S from during the second plate 760 is moved to subsequent handling, gas is supplied to the groove portion of the second plate 760, by This, substrate S can be with the second plate 760 without frictionally being moved.

Hereinafter, with reference to such as 10 to Figure 20, to the first transfer unit 600, the first cutter unit 200 and the second transfer unit 700 operation illustrates.

As shown in Figure 10, substrate S is transferred to the first cutter unit in the state that its dummy portions held in advance is not eliminated 200.At this point, substrate S can be floated under the action of the gas sprayed from the first plate 660 from the first plate 660.

Also, substrate S is adsorbed by the first plate 660 when substrate S is located on the first plate 660.At this point, the first cutting wheel module 221 and second cutting wheel module 221 cutting wheel 225 be contacted with substrate S respectively after, to X-direction move, as a result, in substrate S Dummy portions formed the first X-axis cutting line XL1 and the second X-axis cutting line XL2.

Also, as shown in FIG. 11 and 12, the illusory fixture 910 for eliminating unit 900, which is moved to, is formed with the cutting of the first X-axis The dummy portions of the substrate S of line XL1 and the second X-axis cutting line XL2.Also, fixture 910 is held after the dummy portions of substrate S It rotates or moves horizontally, so as to which dummy portions be eliminated from substrate S.The fixture 910 for eliminating dummy portions revert to and does not interfere the The home position of the movement of the cutting wheel 225 of one cutting wheel model block 221 and the second cutting wheel module 221.

Also, as shown in figure 13, in the state of the fixation of the first plate 660 second plate 760 towards the first plate 660 to Y-axis side To movement.The interval between the first plate 660 and the second plate 760 reduces as a result, and substrate S is by 760 institute of the first plate 660 and the second plate Support.

In addition, as shown in figure 14, substrate S is transferred to the second transfer unit 700.At this point, substrate S is supplied to the first plate 660 and second plate 760 gas under the action of, floated from the first plate 660 and the second plate 760.

Also, as shown in figure 15, substrate S be located at when on the first plate 660 and the second plate 760 substrate S by the first plate 660 and Second plate 760 is adsorbed.At this point, the cutting wheel 225 of the first cutting wheel module and the second cutting wheel module 221 is contacted with base respectively It is moved after plate S to X-direction, forms the first X-axis cutting line XL1 and the second X-axis cutting line XL2 in substrate S as a result,.

Also, as shown in FIG. 16 and 17, the first X-axis cutting line XL1 and the second X-axis cutting line XL2 is formed in substrate S Afterwards, the cutting wheel 225 of the first cutting wheel module and the second cutting wheel module 221, which separates, is moved to substrate S.Also, in substrate S quilts In the state of first plate 660 and the absorption of the second plate 760, the second plate 760 is moved far from the first plate 660, then substrate S is along first X-axis cutting line XL1 and the second X-axis cutting line XL2 are separated.

Also, it behind the middle section for as shown in figure 18, separating substrate S, is not eliminated with the dummy portions at row end after substrate S State, substrate S is transferred to the first cutter unit 200.At this point, under the action of the gas sprayed from the second plate 760, substrate It can be floated from the second plate 760.

Furthermore substrate S is adsorbed by the second plate 760 when substrate S is located at the second plate 760.At this point, the first cutting wheel module And second the cutting wheel 225 of cutting wheel module 221 be contacted with after substrate S to X-direction and move respectively, as a result, in the void of substrate S If part forms the first X-axis cutting line XL1 and the second X-axis cutting line XL2.

Also, as shown in FIG. 19 and 20, the illusory fixture 910 for eliminating unit 900, which is moved to, is formed with the cutting of the first X-axis The dummy portions of the substrate S of line XL1 and the second X-axis cutting line XL2.Also, after fixture 910 holds the dummy portions of substrate S, rotation Turn or move horizontally and eliminate dummy portions from substrate S.The fixture 910 for eliminating dummy portions restores to original position without hindering the The movement of the cutting wheel 225 of one cutting wheel model block and the second cutting wheel module 221.

In addition, as shown in figure 21, pass through along the first X-axis cutting line XL1 and the second X-axis cutting line XL2 substrate S divided The rotation of multiple belts 710 is transferred to the second cutter unit 300.

At this point, as shown in figure 22, the second transfer unit 700 and the second cutter unit 300 are arranged on sustained height, substrate S It can be transferred directly to the second cutter unit 300.At this point, substrate S is from second under the influence of the gas supplied by the second plate 760 Plate 760 floats.

Another example is provided with liftable between the second transfer unit 700 and the second cutter unit 300 and moves horizontally Substrate S is transferred to the second cutter unit 300 by pickup unit (not shown) from the second transfer unit 700.Such as Figure 24 and Figure 25 institutes Show, the second transfer unit 700 can be arranged on the position than 300 low predetermined altitude H of the second cutter unit.At this point, belt 710 is logical It crosses lifting gear 740 and rises predetermined altitude H so that belt 710 is located at the height identical with the second cutter unit 300.At this point, band Son 710 is by lifting gear 740 when being risen, substrate S it is mobile and far from the second plate 760.As described above, by lifting gear 740, band Son 710 rises relative to the second plate 760 so that substrate S is far from the second plate 760.As a result, without substrate S and second in order to prevent Friction between plate 760 floats substrate S from the second plate 760.

As shown in Figure 25 and Figure 26, the second cutter unit 300 forms the first Y-axis cutting line in the first face S1 of substrate S YL1。

Second cutter unit 300 includes：Second framework 310 extends to X-direction and is moved to Y direction；Second Portion 320 can movably be set to second framework 310, and with cutting wheel 321 to X-direction；Second guiding rail 330 is used In the movement of guiding second framework 310；Belt 340, supporting substrate S；Support plate 350 can movably be set to Z-direction In the lower section of belt 340, belt 340 is supported when cutting wheel 321 applies pressure to substrate S, so as to supporting substrate S；Support plate lifts Device 360 lifts support plate 350 to Z-direction.

Second framework 310 is provided with multiple second heads 320 in the X-axis direction.

Can be provided between 310 and second guiding rail 330 of second framework air pressure or oil pressure operation actuator, Linear motor or ball screw device isoline the movement equipment run according to electromagnetic interaction.As a result, in cutting wheel 321 apply pressure to second framework 310 in the state of substrate S moves along the second guiding rail 330 to Y direction, and the first of substrate S Face S1 forms the first Y-axis cutting line YL1.

Belt 340 is supported by multiple belt wheels 341, and at least one of multiple belt wheels 341 can be to provide to rotate The driving pulley of the driving force of belt 340.Belt 340 is preferably the undivided one-piece type belt for multiple portions, with uniform The integral face of ground supporting substrate S and transfer.

Belt 340 rotate and substrate S move when, support plate 350 decline under the action of support plate lifting gear 360 and with Belt 340 separates, so as to which belt 340 can successfully be moved without the friction between support plate 350.Also, it is formed in substrate S During the first Y-axis cutting line YL1, support plate 350 is supported the bottom surface that plate lifting gear 360 rises and support belt 340, so as to prop up Support group plate S.For example, support plate 350 can have the vacuum hole being connect with vacuum source with sorbing substrate S.

During the first face S1 of substrate S forms the first Y-axis cutting line YL1, it is provided with and has the of cutting wheel 321 The second framework 310 on two heads 320 can move, and substrate S is supported plate 350 and supports, and therefore, cutting wheel 321 may be with larger Pressure pressing is in substrate S, so as to be easily separated substrate S.

Also, substrate S is supported plate 350 and supports, and there is no need to be used to support the roller of cutting wheel 321.Correspond to as a result, The width on the second head 320 can be reduced by removing the size in the space of roller, nearest so as to reduce multiple second heads 320 Ground adjacent to when multiple second heads 320 cutting wheel 321 between interval.It is possible thereby to reduce what is formed by cutting wheel 321 Interval between first Y-axis cutting line YL1.

As shown in figure 26, the substrate S for being formed with the first Y-axis cutting line YL1 is single from the second cutting by the rotation of belt 340 Member 300 is transferred to substrate roll-over unit 400.Another example, the pickup unit (not shown) that can be moved horizontally while lifting are set It is placed between the second cutter unit 300 and substrate roll-over unit 400, for substrate S to be transferred to base from the second cutter unit 300 Plate roll-over unit 400.

As shown in Figure 26 to Figure 33, substrate roll-over unit 400 includes：Multiple belts 410, in the X-axis direction mutually every It opens up and puts；Supporting table 420 extends to Z-direction；First adsorption plate 430 has the first adsorption nozzle 431；Second absorption Plate 440 has the second adsorption nozzle 441；Adsorption plate lifting gear 450 moves along supporting table 420 to Z-direction One adsorption plate 430 and the second adsorption plate 440；Adsorption plate rotating device 460 is used to rotate the first adsorption plate 430 and the second suction Attached plate 440.

Belt 410 is supported by multiple belt wheels 411, at least one in multiple belt wheels 411 to be to provide rotation belt 410 The driving pulley of driving force.

Adsorption plate lifting gear 450 can include the actuator run by air pressure or oil pressure, according to electromagnetic interaction Linear motor or ball screw device isoline the movement equipment of operation.

Adsorption plate rotating device 460 can include motor.

First adsorption plate 430 and the second adsorption plate 440 are provided spaced being provided with substrate S in-between.First inhales First adsorption nozzle 431 of attached plate 430 can be set mutually opposite to each other with the second adsorption nozzle 441 of the second adsorption plate 440.

Hereinafter, the action of upset substrate S is illustrated.For convenience of description, it is located at second with the first adsorption plate 430 to inhale It is illustrated subject to the state of 440 top of attached plate.

First, as shown in figure 27, when substrate S is not located at belt 410, the first adsorption plate 430 and the second adsorption plate 440 are located at Space between belt 410.Also, as shown in figure 28, when substrate S is sent on belt 410, substrate S is located at the first adsorption plate 430 and second between adsorption plate 440.

Also, as shown in figure 29, as the first adsorption plate 430 and the second adsorption plate 440 rise, the absorption of substrate S and second Second adsorption nozzle 441 of plate 440 contacts.Also, as the first adsorption plate 430 and the second adsorption plate 440 continue to rise, substrate S is risen with being contacted with the state of the second adsorption nozzle 441 of the second adsorption plate 440.At this point, substrate S is to be inhaled by gravity by second Attached nozzle 441 is supported, therefore even if the posture that substrate S is not maintained the second adsorption nozzle 441 applies adsorption capacity.

In addition, adsorption force is when the first adsorption nozzle 431 or the second adsorption nozzle 441, in order to by its strong adsorption force Degree increase to can the appropriate size of sorbing substrate S, need the scheduled time.In the present invention, the first suction within the predetermined time During the adsorption capacity of attached 431 or second adsorption nozzle 441 of nozzle is increased, substrate S can also be supported in by gravity One adsorption nozzle 431 or the second adsorption nozzle 441, so as to rise substrate S.Thus, it is possible to it prevents from increasing in adsorption capacity intensity The phenomenon that suitably can not can rising substrate S and wait in a period of the intensity of sorbing substrate S.That is, it is possible to reduce Rise the time needed for substrate S.

The 441 sorbing substrate S of the second adsorption nozzle of the second adsorption plate 440 during substrate S rises, then such as Figure 30 institutes It states, the first adsorption plate 430 and the second adsorption plate 440 are rotated by adsorption plate rotating device 460.

Also, as shown in figure 31, under substrate S by the second adsorption nozzle 441 of the second adsorption plate 440 in the state of being adsorbed Drop.

Furthermore as shown in figure 32, when the first adsorption plate 430 is inserted into the space between belt 410, then substrate S is located at band 410 top of son is simultaneously detached from the second adsorption nozzle 441.In this state, the first adsorption plate 430 can be located at the second adsorption plate 440 lower section, so as to be immediately performed the action of subsequent upset substrate S, it is possible thereby to shorten the time needed for process.

In this state, as shown in figure 33, the substrate S of overturning by the rotation of belt 410 from substrate roll-over unit 400 It is transferred to third cutter unit 500.Another example, liftable and the pickup unit (not shown) moved horizontally are arranged on substrate overturning Between unit 400 and third cutter unit 500, for substrate S to be transferred to third cutter unit from substrate roll-over unit 400 500。

As shown in Figure 33 and Figure 34, third cutter unit 500 forms the second Y-axis cutting line in the second face S2 of substrate S YL2。

Third cutter unit 500 includes：Third framework 510 extends and can be moved to Y direction to X-direction；Third Head 520 can movably be set to third framework 510 and with cutting wheel 521 to X-direction；Third guiding rail 530, It is used for the movement for guiding third framework 510；Belt 540 is used to support substrate S；Support plate 550, can be to Z-direction The lower section of belt 540 is movably set to, the support belt 540 when cutting wheel 521 applies pressure to substrate S and supporting substrate S；Support Plate lifting gear 560 increases in the Z-axis direction descending branch fagging 550.

Third framework 510 can have multiple third heads 520 in the X-axis direction.

Actuator, the basis of air pressure or oil pressure operation are provided between third framework 510 and third guiding rail 530 The linear motor of electromagnetic interaction operation or ball screw device isoline movement equipment.As a result, in cutting wheel 521 by substrate In the state of S pressures, third framework 510 is moved along third guiding rail 530 to Y direction, so as in the second face of substrate S S2 forms the second Y-axis cutting line YL2.

Belt 540 is supported by multiple belt wheels 541, and at least one of multiple belt wheels 541 can be to provide to rotate The driving pulley of the driving force of belt 540.Belt 540 is preferably the undivided one-piece type belt into multiple portions, with equably The integral face of supporting substrate S simultaneously transfers substrate.

Belt 540 rotates and moving substrate S when moving, and support plate 550 is supported plate lifting gear 560 and declines and separate Belt 540 so that belt 540 is with support plate 550 without frictionally smoothly mobile.Also, form the cutting of the second Y-axis in substrate S During line YL2, support plate 550 is supported the bottom surface that plate lifting gear 560 rises and support belt 540, so as to supporting substrate S.Example Such as, support plate 550 have the vacuum hole being connect with vacuum source and sorbing substrate S.

During the second face S2 of substrate S forms the second Y-axis cutting line YL2, it is provided with the with cutting wheel 521 The third framework 510 on three heads 520 can move, and substrate S is supported plate 550 and is supported, and therefore, cutting wheel 521 can be with bigger Pressure pressing is in substrate S, so as to be easily isolated substrate S.

Also, substrate S is supported plate 550 and is supported, and there is no need for support the roller of cutting wheel 521.As a result, may be used The width on third head 520 is reduced with the space size for corresponding to removal roller, thus, it is possible to shorten multiple third heads 520 Interval between the cutting wheel 521 on multiple third heads 520 when recently abutting.So as to shorten through cutting wheel 521 Interval between the second Y-axis cutting line YL2 formed.

As the second face S2 in substrate S forms the second Y-axis cutting line YL2, the first Y-axis cutting line YL1 and the second Y-axis are cut Secant YL2 is connected with each other, and substrate S can be cut along the first Y-axis cutting line YL1 and the second Y-axis cutting line YL2.

As a result, after substrate S is cut, X-axis stepped part XS can be formed, has and is equivalent to the first Y-axis cutting line The width of YL2 and the second Y-axis cutting line YL2 distances spaced apart from each other in the X-axis direction, the X-axis stepped part XS can be formed There are wiring and/or the electrode connected with wiring etc..

Cut substrate S can be transferred to subsequent handling by the rotation of belt 540 from third cutter unit 500.Separately An example, the pickup unit (not shown) that liftable is provided between third cutter unit 500 and subsequent technique and is moved horizontally, Substrate S is transferred to subsequent technique from third cutter unit 500.

Cutter for substrate in embodiment present invention as described above, multiple cutting lines, i.e. the first X-axis cutting line XL1 And the second X-axis cutting line XL2, the first Y-axis cutting line YL1, the second Y-axis cutting line YL2 are single by the first cutting set gradually First 200, second cutter unit 300 and third cutter unit 400 sequentially form, so as to cutting substrate S.Therefore, in order to cut Substrate and the prior art of dicing processes and sliver process is individually performed compared to process number is reduced, so as to improve cutting The efficiency of substrate.

Although having illustrated the preferred embodiment of the present invention, the scope of the present invention is not limited to such specific reality Example is applied, can be suitably changed in the range recorded in claims.

Claims (12)

1. a kind of cutter for substrate, which is characterized in that including：

First transfer unit, the first plate including being used to support substrate；

Cutter unit, including：Framework extends to perpendicular to the direction that the substrate is transferred；Head, can be along described Framework and movably set, and have cutting wheel；And

Second transfer unit is moved back and forth on the direction transferred in the substrate, and second transfer unit includes second Plate, second plate support the substrate when the substrate is cut by the cutting wheel with together with first plate.

2. cutter for substrate according to claim 1, which is characterized in that first plate or second plate or institute It states the first plate and the second plate to float the substrate when the substrate moves, the fixed base is adsorbed when supporting the substrate Plate.

3. cutter for substrate according to claim 1, which is characterized in that first transfer unit is further included from outside By the shuttle unit of the base plate transfer to the cutter unit,

The shuttle unit includes：Guide rail extends to the transfer direction of the substrate；Shuttle component adsorbs the substrate Bottom surface and moved along the guide rail；Shuttle component lifting gear is used to lift the shuttle component.

4. cutter for substrate according to claim 1, which is characterized in that it is single that first transfer unit further includes pressurization Member, the presser unit pressurize in the base plate transfer to the cutter unit substrate rear row end and be directed at the base Plate,

The presser unit includes：Guide rail extends to the transfer direction of the substrate；Propeller is moved along the guide rail It moves and the rear row end for the substrate that pressurizes；Propeller lifting gear is used to lift the propeller.

5. cutter for substrate according to claim 4, which is characterized in that described during the substrate is by transfer When the rear row end of substrate is by the propeller, the propeller speed faster than the movement speed of the substrate is mobile and contacts After the rear row end of the substrate, moved with the speed identical with the movement speed of the substrate.

6. cutter for substrate according to claim 1, which is characterized in that the head includes：First cutting wheel module And the second cutting wheel module, it is spaced apart in the up-down direction, and have cutting wheel respectively；First roller module and the second roller Submodule is spaced apart in the up-down direction, and has roller respectively.

7. cutter for substrate according to claim 6, which is characterized in that the cutting wheel of the first cutting wheel module with The roller alignment setting of second roller module, the cutting wheel of the second cutting wheel module and first roller module Roller alignment setting.

8. cutter for substrate according to claim 1, which is characterized in that second transfer unit further includes belt, The belt and second plate one direction that the substrate is transferred in the same direction it is mobile and by the base plate transfer.

9. cutter for substrate according to claim 8, which is characterized in that second transfer unit further includes lifting dress It puts, the lifting gear lifts the belt relative to second plate.

10. cutter for substrate according to claim 8, which is characterized in that second transfer unit is in the substrate A part be fixed in the state of first plate another part of the substrate be fixed on second plate so that it is described Second plate is far from first plate, so as to detach the substrate.

11. cutter for substrate according to claim 1, which is characterized in that further include illusory elimination unit, be set to Between first transfer unit and second transfer unit, to eliminate positioned at the leading end of the substrate or rear row end or The non-active area at end and rear row end in advance.

12. cutter for substrate according to claim 11, which is characterized in that the illusory elimination unit includes：Fixture, It is used for the non-active area for holding the substrate；Fixture driving device, is used for the vertically and horizontally fixture, and with Rolling clamp centered on trunnion axis and vertical axis.