KR20200144167A - Dummy removing unit - Google Patents

Abstract

According to an embodiment of the present invention, a dummy removing unit designed to remove a dummy partitioned by a scribing line formed at an end of a first panel of a substrate formed by bonding a first panel and a second panel together, includes: a first adsorption unit configured so as to adsorb the dummy; a second adsorption unit configured so as to adsorb an end of a second panel; and a rotating mechanism for rotating the first adsorption unit and the second adsorption unit by bending the end of the substrate so as to divide the dummy along a scribing line. The dummy may be separated from the substrate by the first adsorption unit being spaced apart from the second adsorption unit in a state wherein the first adsorption unit and the second adsorption unit are rotated so that the end of the substrate is bent. According to the present invention, damage to the end of the substrate can be prevented in the process of removing the dummy from the end of the substrate to form a stepped portion at the end of the substrate.

Description

Single material removal device {DUMMY REMOVING UNIT}

The present invention relates to an end material removal device provided in a substrate cutting apparatus for cutting a substrate and for removing an end material from an end of a substrate to form a step at the end of the substrate.

In general, liquid crystal display panels, organic electroluminescent display panels, inorganic electroluminescent display panels, transmissive projector substrates, and reflective projector substrates used in flat panel displays are brittle mother glass panels such as glass (hereinafter referred to as'substrates'). ), a unit glass panel cut into a predetermined size (hereinafter, referred to as'unit substrate') is used.

In the process of cutting a substrate into a unit substrate, scribing by moving the scribing wheel and/or the substrate while pressing a scribing wheel made of a material such as diamond against the substrate along the line to be cut. It includes a scribing process to form a line.

The substrate is formed by bonding the first panel and the second panel, and a process of forming a step portion at an end portion of the substrate may be required according to design conditions of the substrate.

According to the prior art, in order to form a step portion at the end of the substrate, a step of forming a scribing line in any one of the first panel and the second panel at the end of the substrate, and the end material partitioned by the scribing line ( A process of removing a cullet, that is, an ineffective area that is not used in the product and is discarded, is removed from the end of the substrate.

In order to remove the cut material from the end of the substrate, after clamping the ends of the substrate including the cut material together (i.e., the end of the first panel and the end of the second panel together), the cut material is separated from the end of the substrate. After rotating the clamp in the direction, a process of returning the clamp to its original state is performed. Accordingly, by bending the end of the substrate, the crack advances along the scribing line, whereby the end material is divided from the end of the substrate. However, according to this process, in the process of returning to the original state after the clamp is rotated to bend the end of the substrate, interference occurs between the end material and the end of the substrate, and due to friction, slip, etc. There is a problem that the end of the substrate is damaged.

The present invention is to solve the problem of the prior art, the object of the present invention is an end material removal device capable of preventing damage to the end of the substrate in the process of removing the end material from the end of the substrate in order to form a step at the end of the substrate Is to provide.

In order to achieve the above object, an end material removal apparatus according to an embodiment of the present invention comprises: an end material partitioned by a scribing line formed at an end of a first panel of a substrate formed by bonding a first panel and a second panel. A first adsorption unit configured to adsorb the cut material; A second adsorption unit configured to adsorb an end portion of the second panel; And a rotation mechanism for rotating the first adsorption unit and the second adsorption unit to bend the end of the substrate to divide the end material along the scribing line, wherein the end material is adsorbed to the first adsorption unit, and the end of the second panel is The end material may be separated from the substrate by being adsorbed by the second adsorption unit and being spaced apart from the second adsorption unit while the first adsorption unit and the second adsorption unit are rotated so that the end of the substrate is bent.

An end material removal apparatus according to an embodiment of the present invention includes: a pressing member by pressing one surface of a first panel; And a support plate supporting one surface of the second panel.

The end material removal apparatus according to an embodiment of the present invention may further include a braking member configured to press the corresponding surface of the second panel corresponding to the scribing line.

The end material removal apparatus according to an embodiment of the present invention may further include a braking member driving mechanism for moving the braking member toward the corresponding surface of the second panel.

The first adsorption unit and the second adsorption unit are connected to the negative pressure source and may be configured to adsorb the ends of the end material and the second panel respectively by negative pressure acting by the negative pressure source, and the first adsorption unit and the second adsorption unit It is connected to and may be configured to eject the gas supplied from the gas supply to release the ends of the end material and the second panel, respectively.

The end material removal apparatus according to an embodiment of the present invention further includes at least one moving mechanism configured to move the first adsorption unit to be spaced apart from the end of the substrate while moving the first adsorption unit to be spaced apart from the second adsorption unit. I can.

According to an end material removal apparatus according to an embodiment of the present invention, the clamp module includes a first pressing member having a first adsorption unit configured to adsorb the end material partitioned by a scribing line formed on the first panel, and a second A second pressurizing member having a second adsorption unit configured to adsorb an end of the panel, and a first pressurization in a state in which the first pressurizing member and the second pressurizing member press each end of the first panel and the end of the second panel. And a rotation mechanism that bends the end of the substrate by rotating the member and the second pressing member to divide the end material from the end of the substrate. And, in a state where the bent state of the end of the substrate is maintained by the second adsorption unit, the end material may be separated from the first panel by movement of the first pressing member with respect to the second pressing member. That is, in a state in which the end of the substrate is bent downward as it is, the end material can be separated from the end of the substrate in a diagonal direction. Therefore, in the process of removing the end material from the end of the substrate in order to form the stepped portion at the end of the substrate, interference between the end material and the end of the substrate can be prevented, and accordingly, due to interference between the end material and the end of the substrate. It is possible to prevent damage such as scratches on the substrate.

1 is a plan view schematically illustrating a substrate cutting apparatus to which an end material removal apparatus according to a first embodiment of the present invention is applied.
2 is a side view schematically illustrating a substrate cutting apparatus to which an end material removal apparatus according to a first embodiment of the present invention is applied.
3 is a perspective view schematically illustrating an end material removal apparatus according to a first embodiment of the present invention.
4 is a side view schematically showing an apparatus for removing cut materials according to a first embodiment of the present invention.
5 to 7 are schematic diagrams for explaining the operation process of the end material removal apparatus according to the first embodiment of the present invention.
8 is a side view schematically showing an end material removal apparatus according to a second embodiment of the present invention.
9 to 11 are schematic diagrams for explaining the operation process of the end material removal apparatus according to the second embodiment of the present invention.
12 is a side view schematically showing an end material removal apparatus according to a third embodiment of the present invention.
13 is a schematic diagram for explaining an operation process of an end material removal apparatus according to a third embodiment of the present invention.

Hereinafter, with reference to the accompanying drawings, a description will be given of a single material removal apparatus according to an embodiment of the present invention.

First, a description will be given of a substrate cutting apparatus provided with an end material removal apparatus according to an embodiment of the present invention. The object to be cut by the substrate cutting apparatus may be a bonded substrate formed by bonding the first panel and the second panel. For example, a first panel may include a thin film transistor, and a second panel may include a color filter. Conversely, the first panel may include a color filter, and the second panel may include a thin film transistor. In the drawings, the first panel is positioned at the top and the second panel is positioned at the bottom, but the present invention is not limited to the directions of the first panel and the second panel.

Hereinafter, the bonding substrate is simply referred to as a substrate. In addition, the surface of the first panel exposed to the outside is referred to as a first surface, and the surface of the second panel exposed to the outside is referred to as a second surface.

1 and 2, the direction in which the substrate S on which the substrate cutting process is to be performed is transported is defined as the Y-axis direction, and the direction perpendicular to the direction in which the substrate S is transported (Y-axis direction) is X. It is defined as the axial direction. In addition, a direction perpendicular to the X-Y plane on which the substrate S is placed is defined as a Z-axis direction. In addition, the term scribing line means a groove and/or a crack formed to extend in a predetermined direction from the surface of the substrate S.

1 and 2, the substrate cutting apparatus includes a scribing unit 30 configured to form a scribing line on the substrate S in the X-axis direction and/or the Y-axis direction, and the substrate A first transfer unit 10 transferring (S) to the scribing unit 30, a second transfer unit 20 transferring the substrate (S) from the scribing unit 30 to a subsequent process, It may include an end material removal device 40 disposed adjacent to the scribing unit 30.

The scribing unit 30 includes a first frame 31 extending in the X-axis direction, a first scribing head 32 installed on the first frame 31 so as to be movable in the X-axis direction, and A second frame 33 extending in the X-axis direction parallel to the first frame 31 under the 1 frame 31, and a second frame 33 movable in the X-axis direction on the second frame 33 Cribing head 34 may be included. Between the first scribing head 32 and the first frame 31, there is a linear movement mechanism connected to the first scribing head 32 to move the first scribing head 32 in the X-axis direction. It can be provided. Similarly, between the second scribing head 34 and the second frame 33, it is connected to the second scribing head 34 to move the second scribing head 34 in the X-axis direction. Appliances may be provided. For example, the linear movement mechanism may be composed of an actuator using pneumatic or hydraulic pressure, a linear motor operated by electromagnetic interaction, or a ball screw mechanism.

A plurality of first scribing heads 32 may be mounted on the first frame 31 in the X-axis direction. A plurality of second scribing heads 34 may be mounted on the second frame 33 in the X-axis direction. The plurality of first scribing heads 32 may be driven simultaneously or may be driven sequentially. Likewise, the plurality of second scribing heads 34 may be driven simultaneously or may be driven sequentially.

A space through which the substrate S passes may be formed between the first frame 31 and the second frame 33. The first frame 31 and the second frame 33 may be manufactured and assembled as separate members, or may be integrally manufactured.

The first scribing head 32 and the second scribing head 34 may be disposed to face each other in the Z-axis direction. The first scribing head 32 is used to form a scribing line on the first side of the substrate S, and the second scribing head 34 is used on the second side of the substrate S. It is used to form the scribing line.

A wheel holder 35 for holding the scribing wheel 351 may be installed on the first and second scribing heads 32 and 34. The scribing wheel 351 mounted on the first scribing head 32 and the scribing wheel 351 mounted on the second scribing head 34 may be disposed to face each other in the Z-axis direction. have.

The pair of scribing wheels 351 may be pressed against the first and second surfaces of the substrate S, respectively. With the pair of scribing wheels 351 pressed against the first and second surfaces of the substrate S, respectively, the first and second scribing heads 32 and 34 By relatively moving in the X-axis direction, scribing lines may be formed on the first and second surfaces of the substrate S in the X-axis direction. In addition, the surface of the substrate S is moved in the Y-axis direction while the pair of scribing wheels 351 are pressed against the first and second surfaces of the substrate S, respectively. A scribing line may be formed in the Y-axis direction.

Meanwhile, the first and second scribing heads 32 and 34 may be configured to be movable in the Z-axis direction with respect to the first and second frames 31 and 33, respectively. To this end, a head that is connected to the first scribing head 32 between the first scribing head 32 and the first frame 31 to move the first scribing head 32 in the Z-axis direction A moving module 38 may be provided, and a second scribing head 34 is connected to the second scribing head 34 between the second scribing head 34 and the second frame 33 A head movement module 39 may be provided to move the in the Z-axis direction. For example, the head movement modules 38 and 39 may be provided with an actuator using pneumatic or hydraulic pressure, a linear motor operated by electromagnetic interaction, or a linear movement mechanism such as a ball screw mechanism.

As the first and second scribing heads 32 and 34 move in the Z-axis direction with respect to the first and second frames 31 and 33, respectively, the pair of scribing wheels 351 It may be pressed against S) or separated from the substrate S. And, by adjusting the degree of movement of the first and second scribing heads 32 and 34 in the Z-axis direction, the pressing force applied by the pair of scribing wheels 351 to the substrate S is controlled. Can be. Accordingly, by moving the first and second scribing heads 32 and 34 in the Z-axis direction, the cutting depth (penetration depth) of the pair of scribing wheels 351 into the substrate S Can be adjusted.

The first transfer unit 10 includes a plurality of belts 11 for supporting the substrate S, a gripping member 12 for gripping the trailing end of the substrate S supported on the plurality of belts 11, The support bar 13 connected to the holding member 12 and extending in the X-axis direction, the guide rail 14 connected to the support bar 13 and extending in the Y-axis direction, and the scribing unit 30 It may include a first support plate 15 disposed adjacent to the substrate S to lift or adsorb and support the substrate S.

The plurality of belts 11 may be spaced apart from each other in the X-axis direction. Each belt 11 is supported by a plurality of pulleys 111. At least one of the plurality of pulleys 111 connected to one belt 11 may be a driving pulley that provides a driving force to rotate the belt 11.

Between the support bar 13 and the guide rail 14, an actuator using pneumatic or hydraulic pressure, a linear motor operated by electromagnetic interaction, or a linear movement mechanism such as a ball screw mechanism may be provided. Accordingly, as the support bar 13 is moved in the Y-axis direction by the linear movement mechanism while the holding member 12 holds the substrate S, the substrate S can be transferred in the Y-axis direction. At this time, the plurality of belts 11 may stably support the substrate S while rotating in synchronization with the movement of the gripping member 12.

The gripping member 12 may be a clamp for pressing and holding the trailing end of the substrate S. As another example, the gripping member 12 may be configured to have a vacuum hole connected to a vacuum source to adsorb the trailing end of the substrate S.

The first support plate 15 may be configured to lift or adsorb the substrate S. For example, a plurality of slots connected to a gas supply source and a vacuum source may be formed on the surface of the first support plate 15. When gas is supplied from the gas supply source to the plurality of slots of the first support plate 15, the substrate S may be lifted from the first support plate 15. In addition, when gas is sucked through a plurality of slots of the first support plate 15 by the negative pressure formed by the vacuum source, the substrate S may be adsorbed to the first support plate 15.

When the substrate S is lifted from the first support plate 15, the substrate S may be moved without friction with respect to the first support plate 15. In the process of forming the scribing lines on the first and second surfaces of the substrate S, the substrate S may be adsorbed and fixed to the first support plate 15.

The second transfer unit 20 is disposed adjacent to the scribing unit 30 to support the substrate S by lifting or adsorbing the second support plate 25 and the second support plate 25. It may include a plurality of belts 21 disposed adjacent to each other.

In the process of forming a scribing line on each of the first and second surfaces of the substrate S by the scribing unit 30, the substrate S is formed of the first support plate 15 and the second support plate. Can be supported by (25). In this case, the first and second scribing heads 32 and 34 may be positioned between the first support plate 15 and the second support plate 25.

The plurality of belts 21 may be spaced apart from each other in the X-axis direction. Each belt 21 is supported by a plurality of pulleys 211. At least one of the plurality of pulleys 211 connected to one belt 21 may be a driving pulley that provides a driving force to rotate the transfer belt 21.

The second support plate 25 may be configured to lift or adsorb the substrate S. For example, a plurality of slots connected to a gas supply source and a vacuum source may be formed on the surface of the second support plate 25. When gas is supplied from the gas supply source to the plurality of slots of the second support plate 25, the substrate S may be lifted from the second support plate 25. In addition, when gas is sucked through a plurality of slots of the second support plate 25 by the negative pressure formed by the vacuum source, the substrate S may be adsorbed to the second support plate 25.

In the process of transferring the substrate S to the second support plate 25, gas is supplied to the slot of the second support plate 25, and accordingly, the substrate S is transferred to the second support plate 25. It can be moved without friction. In addition, in the process of forming the scribing lines on the first and second surfaces of the substrate S, the substrate S may be adsorbed and fixed to the second support plate 25.

Meanwhile, in the process of moving the substrate S from the second support plate 25 to a subsequent process by rotation of the plurality of belts 21, gas is supplied to the slot of the second support plate 25, thereby , The substrate S may be moved without friction with respect to the second support plate 25 while being raised from the second support plate 25.

3 and 4, the end material removal apparatus 40 according to the first embodiment of the present invention includes the leading end of the substrate S (the front end of the substrate S in the Y-axis direction). End material D (cullet) partitioned by a scribing line L at the edge and/or the edge of the trailing end of the substrate S (the rear end of the substrate S in the Y-axis direction) That is, it serves to remove the non-effective areas that are not used as a unit substrate and are discarded after being cut.

The end material removal device 40 may be disposed between the first transfer unit 10 and the second transfer unit 20. The end material removal device 40 may be disposed between the first support plate 15 and the second support plate 25.

The end material removal device 40 includes a support 41 extending in the X-axis direction, a clamp module 50 disposed on the support 41, and the support 41 to the central axis of the support 41 (X-axis direction and A rotation module 43 that rotates about a parallel axis), a horizontal movement module 44 that moves the support 41 in the Y-axis direction, and a vertical movement module that moves the support 41 in the Z-axis direction ( 45) may be included.

The rotation module 43 may be composed of a rotation motor connected to the rotation center axis of the support member 41 through a rotation axis. The rotation module 43 may include a power transmission mechanism such as a link or a belt provided between the rotation shaft of the rotation motor and the support 41. As the support 41 is rotated about the X axis by the rotation module 43, the clamp module 50 may be disposed to face the first transfer unit 10 (first support plate 15) or It may be disposed toward the 2 transfer unit (second support plate 25). Accordingly, the clamp module 50 is disposed to face the first support plate 15 while the leading end of the substrate S is positioned on the first support plate 15, so that the end material ( D) can be removed. In addition, the clamp module 50 is disposed to face the second support plate 25 while the trailing end of the substrate S is positioned on the second support plate 25 so that the end material ( D) can be removed.

The horizontal movement module 44 may be configured as an actuator using pneumatic or hydraulic pressure, a linear motor operated by electromagnetic interaction, or a linear movement mechanism such as a ball screw mechanism. As the support 41 is moved horizontally by the horizontal movement module 44, the clamp module 50 may be moved horizontally. Accordingly, the clamp module 50 may be horizontally moved by the horizontal movement module 44 and positioned to face the end of the substrate S. In addition, the clamp module 50 may be moved in a direction away from the substrate S by the horizontal movement module 44 while the end material D is maintained, and accordingly, the end material D is the substrate S Can be separated/removed/transferred from

The vertical movement module 45 may be configured as an actuator using pneumatic or hydraulic pressure, a linear motor operated by electromagnetic interaction, or a linear movement mechanism such as a ball screw mechanism. As the support 41 is moved vertically by the vertical movement module 45, the clamp module 50 may be moved vertically. In the process of removing the end material D, the clamp module 50 may be raised by the vertical movement module 45 to be positioned opposite to the end of the substrate S. During the transfer of the substrate S, the clamp module 50 may be lowered by the vertical movement module 45 so as not to interfere with the transfer of the substrate S. In addition, the clamp module 50 may be moved in a direction away from the substrate S by the vertical movement module 45 while holding the end material D, and accordingly, the end material D is the substrate S Can be separated/removed/transferred from

3 shows a configuration in which a rotation module 43, a horizontal movement module 44, and a vertical movement module 45 are provided on both sides of the support member 41, respectively. However, the present invention is not limited thereto, and the rotation module 43, the horizontal movement module 44, and the vertical movement module 45 are provided on one side of the support 41 and the support 41 on the other side of the support 41 A configuration in which a guiding means for guiding the rotation, horizontal movement and vertical movement of the device may be applied.

For example, the clamp module 50 may be provided in plural. In this case, the plurality of clamp modules 50 may be disposed along the support 41 in the X-axis direction. The clamp module 50 may be installed to be movable in the X-axis direction along the guide 411 extended along the support 41. To this end, between the clamp module 50 and the guide 411, an actuator using pneumatic or hydraulic pressure, a linear motor operated by electromagnetic interaction, or a linear movement mechanism such as a ball screw mechanism may be provided. Accordingly, as the plurality of clamp modules 50 are moved in the X-axis direction by the linear movement mechanism, the spacing between the plurality of clamp modules 50 may be adjusted. Accordingly, the plurality of clamp modules 50 are disposed to suitably correspond to the width of the substrate S in the X-axis direction, so that the substrate S can be stably held.

Meanwhile, the present invention is not limited to a configuration in which a plurality of clamp modules 50 are provided, and a configuration provided in one clamp module 50 having a length corresponding to the width in the X-axis direction of the substrate S The present invention can be applied.

As shown in FIG. 4, the clamp module 50 is partitioned by a scribing line L formed on the first panel P1 (the first surface), and is a single material that becomes a part of the first panel P1 ( D) is configured to remove.

For example, of the first panel P1 and the second panel P2 constituting the substrate S, the first panel P1 is positioned above and below the second panel P2.

The clamp module 50 is movably installed on the base member 51 and the base member 51 and is configured to press the end of the first panel P1, and a scribing line formed on the first panel P1 A first pressing member 52 having a first adsorption portion 521 for adsorbing the end material D partitioned by (L), and a second panel P2 that is movably installed on the base member 51 The second pressurizing member 53 is configured to press the end of the second panel P2 and has a second adsorption unit 531 for adsorbing the end of the second panel P2, and the first pressurizing member ( 52) and a drive mechanism 54 connected to the second pressing member 53 to move the first pressing member 52 and the second pressing member 53 to be adjacent or spaced apart from each other, and installed on the base member 51 And it may include a rotation mechanism 57 for rotating the first pressing member 52 and the second pressing member 53 about a central axis parallel to the X axis.

The base member 51 may be detachably fixed to the support 41. As the base member 51 is fixed to the support 41, the clamp module 50 may be supported on the support 41.

As shown in Fig. 5, the first pressing member 52 and the second pressing member 53 are moved adjacent to each other by the driving mechanism 54 with the end of the substrate S interposed therebetween, so that the substrate The end of (S) may be pressed by the first pressing member 52 and the second pressing member 53. The first pressing member 52 serves to support the end of the first panel P1 by being in contact with the end of the first panel P1. Similarly, the second pressing member 53 serves to support the end of the second panel P2 by being in contact with the end of the second panel P2.

The first adsorption part 521 of the first pressing member 52 serves to adsorb the end material D at the end of the first panel P1. The first adsorption unit 521 may have a size (area) corresponding to the size (area) of the end material (D). The first adsorption part 521 may be configured as a part of the first pressing member 52. The first adsorption unit 521 may be configured to pressurize the end material D. As an example, the first adsorption unit 521 may be configured as an adsorption pad having at least one hole connected to the negative pressure source 58. As another example, the first adsorption unit 521 may be configured as an adsorption pad made of a porous material connected to the negative pressure source 58.

The second adsorption part 531 of the second pressing member 53 serves to adsorb the second surface of the end of the second panel P2. The second adsorption unit 531 may be configured as a part of the second pressing member 53. The second adsorption unit 531 may be configured to press the end of the second panel P2. As an example, the second adsorption unit 531 may be configured as an adsorption pad having at least one hole connected to the negative pressure source 58. As another example, the second adsorption unit 531 may be configured as an adsorption pad made of a porous material connected to the negative pressure source 58.

According to this configuration, when the first pressing member 52 and the second pressing member 53 press the end of the substrate S (see FIG. 5) and then rotate and bend the end of the substrate S ( 6), the first adsorption unit 521 may adsorb the end material D, and the second adsorption unit 531 may adsorb the end of the second panel P2.

Meanwhile, the first adsorption unit 521 and the second adsorption unit 531 may be connected to a gas supplier 59 that supplies gas. The first adsorption unit 521 may be configured to eject the gas supplied from the gas supplier 59 to release the end material D adsorbed on the first adsorption unit 521. The end material D adsorbed to the first adsorption unit 521 by the gas ejected from the first adsorption unit 521 may be easily separated from the first adsorption unit 521.

Similarly, the second adsorption unit 531 may be configured to release the end of the second panel P2 adsorbed by the second adsorption unit 531 by ejecting gas supplied from the gas supplier 59. The end of the second panel P2 adsorbed to the second adsorption unit 531 by the gas ejected from the second adsorption unit 531 may be easily separated from the second adsorption unit 531.

Meanwhile, the present invention is not limited to a configuration in which the first adsorption unit 521 and the second adsorption unit 531 respectively use negative pressure to adsorb the ends of the end material D and the second panel P2. As another example, the first adsorption unit 521 and the second adsorption unit 531 may be configured to adsorb the ends of the end material D and the second panel P2, respectively, made of a member formed of an adhesive material. have.

The drive mechanism 54 may be configured as an actuator using pneumatic or hydraulic pressure, a linear motor operated by electromagnetic interaction, or a linear movement mechanism such as a ball screw mechanism. The driving mechanism 54 may be connected to the first pressing member 52 and the second pressing member 53 to move the first pressing member 52 and the second pressing member 53 to be adjacent to or spaced apart from each other. Further, the driving mechanism 54 can move only the first pressing member 52 to be adjacent to or spaced apart from the second pressing member 53 while the second pressing member 53 is stopped.

The rotation mechanism 57 serves to rotate the first pressing member 52 and the second pressing member 53 about a central axis parallel to the X axis. The rotation mechanism 57 may be composed of a rotation motor installed on the base member 51. As shown in FIG. 6, the first pressing member 52 and the second pressing member 53 are in a state in which the first pressing member 52 and the second pressing member 53 hold the ends of the substrate S. By being rotated by the rotation mechanism 57, the end of the substrate S can be bent. Here, the rotation mechanism 57 can rotate the first pressing member 52 and the second pressing member 53 so that the end of the substrate S is bent downward. Accordingly, the crack progresses in the scribing line L between the end material D and the end of the first panel P1, and the end material D may be divided from the end of the first panel P1.

Meanwhile, the end material removing apparatus 40 may further include a pressing member 19 for pressing the first surface of the substrate S supported by the first support plate 15. The pressing member 19 serves to support the substrate S by pressing the first surface of the substrate S supported on the first support plate 15. In the process of bending the end of the substrate S, the pressing member 19 presses the first surface of the substrate S to support the substrate S, so that the end of the substrate S is the first support plate 15 ) From moving (exciting). The pressing member 19 may be connected to a pressing member lifting mechanism (not shown) and moved in a Z-axis direction (a direction toward the first panel P1 or a direction separated from the first panel P1). The pressing member lifting mechanism may be configured as an actuator using pneumatic or hydraulic pressure, a linear motor operated by electromagnetic interaction, or a linear movement mechanism such as a ball screw mechanism. Meanwhile, if the first support plate 15 can sufficiently support the substrate S by adsorbing the second surface of the substrate S, the pressing member 19 may be omitted.

Hereinafter, a process of removing the end material D from the substrate S by using the end material removal apparatus 40 according to an embodiment of the present invention will be described with reference to FIGS. 4 to 7.

First, while the substrate S is supported by a plurality of belts 11, the gripping member 12 grips the trailing end of the substrate S, and then the support bar 13 is Y along the guide rail 14. As it is moved in the axial direction and the plurality of belts 11 rotate with this, the substrate S may be transferred to the scribing unit 30.

At this time, the substrate S is transferred to the scribing unit 30 by the first transfer unit 10 in a state in which the end material D at the leading end of the substrate S is not removed. In this case, the substrate S may be lifted from the first support plate 15 by the gas injected from the first support plate 15.

In addition, when the substrate S is placed on the first support plate 15, the substrate S is adsorbed on the first support plate 15. At this time, as the scribing wheel 351 of the first scribing head 32 contacts the first surface of the first panel P1 and moves in the X-axis direction, the first panel P1 A scribing line L for partitioning the end material D is formed.

And, as shown in FIG. 4, the clamp module 50 of the end material removal device 40 is moved to the end material D partitioned by the scribing line L.

At this time, as shown in FIG. 5, the first pressing member 52 and the second pressing member 53 are moved adjacent to each other, and accordingly, the end of the substrate S is the first pressing member 52 and It is pressed by the second pressing member 53. Simultaneously or sequentially, the ends of the substrate S are adsorbed to the first adsorption part 521 and the second adsorption part 531 by the negative pressure applied by the negative pressure source 58.

In this state, as shown in FIG. 6, the first pressing member 52 and the second pressing member 53 are rotated by the rotation mechanism 57 so that the end of the substrate S is bent downward. Accordingly, cracks may proceed from the scribing line L to the inside of the first panel P1. In addition, as the crack progresses inside the first panel P1, the end material D partitioned by the scribing line L may be divided from the end of the substrate S. Accordingly, the end material D is in a state in which it can be immediately separated from the end of the substrate S.

On the other hand, in the process of rotating the first pressing member 52 and the second pressing member 53 so that the end of the substrate S is bent downward, the clamp module 50 may slightly descend by the vertical movement module 45. Accordingly, the end of the substrate S may be smoothly bent downward.

In this state, as shown in FIG. 7, the first pressing member 52 and the second pressing member 53 are moved to be spaced apart from each other. In this case, the first pressing member 52 may be moved upward relative to the second pressing member 53. That is, only the first pressing member 52 can be moved upward when the second pressing member 53 is stopped (a state in which the end of the second panel P2 is adsorbed). At this time, since the end of the second panel P2 is adsorbed by the second adsorption unit 531, the state in which the end of the substrate S is bent downward is maintained as it is. And, since the end material D is in a state adsorbed by the first adsorption unit 521, the end material D is approximately diagonally moved by the upward movement of the first pressing member 52 with respect to the second pressing member 53. It may be separated from the end of the first panel P1.

In this way, in a state in which the end of the substrate S is bent downwardly, the end material D in the state divided by the growth of the crack is approximately diagonal in a direction away from the end of the substrate S. Is moved to. Accordingly, interference (friction) between the cut surface of the end of the first panel P1 and the cut surface of the end material D is prevented. Accordingly, damage, such as scratches, of the end of the substrate S (ie, the end of the first panel P1) can be prevented.

In addition, since the end material D can be separated from the end of the substrate S while being adsorbed to the first adsorption unit 521, the end material D can be more reliably separated from the end of the substrate S. . In addition, even after the end material D is separated from the end of the substrate S, since the end material D remains adsorbed to the first adsorption unit 521, the end material D separated from the end of the substrate S ) Is prevented from falling into unintended places.

On the other hand, after the end material D is separated from the end of the substrate S, as the negative pressure applied to the second adsorption unit 531 is released (and in some cases, the gas supplied from the gas supplier 59 is removed). 2 As it is ejected to the outside through the adsorption unit 531), the end of the second panel P2 is separated from the second adsorption unit 531, so that the end of the substrate S may return to a horizontal state. .

And, after the cut material D is separated from the end of the substrate S, the clamp module 50 is a horizontal moving module 44 and/or the vertical moving module 45 to a predetermined cut material collection location (for example, , The cut material storage container), and as the negative pressure applied to the first adsorption unit 521 at the cut material collection location is released (and, in some cases, the gas supplied from the gas supply unit 59 is the first adsorption unit) As it is ejected to the outside through 521), the cut material D may be separated from the clamp module 50 and discarded in the collection place.

At this time, the clamp module 50 may be inclined at a predetermined angle by the rotation module 43 so that the end material D can be easily separated from the first adsorption unit 521 to the collection location.

Meanwhile, the process of separating the end material D from the trailing end of the substrate S may be performed in the same manner as the process of separating the end material D from the leading end of the substrate S.

According to the end material removal device 40 according to the first embodiment of the present invention, the clamp module 50 includes a first adsorption part 521 configured to adsorb the end material D, which is a part of the first panel P1. A second pressing member 53 having a first pressing member 52 and a second suctioning portion 531 configured to suck an end portion of the second panel P2, and a first pressing member 52 And rotating the first pressing member 52 and the second pressing member 53 in a state in which the second pressing member 53 presses the end of the first panel P1 and the end of the second panel P2, respectively. It includes a rotation mechanism 57 which bends the end of the substrate S to divide the end material D from the substrate S. And, in the state where the bent state of the end of the substrate S is maintained by the second adsorption unit 531, the end material D is moved by the movement of the first pressing member 52 with respect to the second pressing member 53. ) May be separated from the first panel P1. That is, in a state in which the end of the substrate S bent downward is maintained as it is, the end material D may be separated from the end of the substrate S in a substantially diagonal direction. Therefore, in the process of removing the end material D from the end of the substrate S in order to form a step at the end of the substrate S, the interference between the end material D and the end of the substrate S is minimized. Since friction between (D) and the end of the substrate S can be prevented, damage such as scratches on the substrate S can be prevented.

Hereinafter, with reference to Figures 8 to 11, a description will be given of the end material removal device 40 according to the second embodiment of the present invention. The same reference numerals are assigned to the same components as those described in the first embodiment, and detailed descriptions thereof will be omitted.

As shown in FIG. 8, the clamp module 50 of the end material removal device 40 according to the second embodiment of the present invention includes a first panel corresponding to the scribing line L formed on the first panel P1. 2 It may further include a braking member 55 configured to press the corresponding surface of the panel (P2).

The braking member 55 is integrally connected with the second pressing member 53 and may be moved together with the second pressing member 53. For example, the braking member 55 may be installed on the second pressing member 53.

For example, the braking member 55 may be installed to be movable in the Z-axis direction with respect to the second pressing member 53. Accordingly, the position of the braking member 55 in the Z-axis direction can be adjusted, and accordingly, the braking member 55 is appropriate for the corresponding surface of the second panel P2 corresponding to the scribing line L. It can be pressurized by pressing force. Meanwhile, the position of the braking member 55 in the Z-axis direction may be automatically adjusted. To this end, the second pressing member 53 may be provided with a braking member driving mechanism 56 configured to move the braking member 55 toward the corresponding surface of the second panel P2 in the Z-axis direction. For example, the braking member drive mechanism 56 may be composed of a pneumatic or hydraulic actuator, a linear motor operated by electromagnetic interaction, or a linear movement mechanism such as a ball screw mechanism.

The braking member 55 may be moved toward the substrate S together with the second pressing member 53 by the driving mechanism 54. As shown in Fig. 9, by moving the braking member 55 and the first pressing member 52 adjacent to each other by the drive mechanism 54 with the substrate S interposed therebetween, the end material D is removed. The partitioning scribing line L may be pressed.

The braking member 55 may be formed in a bar shape extending along the scribing line L in the X-axis direction. The braking member 55 presses the second surface (corresponding surface) of the second panel P2 corresponding to the first surface of the first panel P1 on which the scribing line L is formed to press the scribing line ( It plays a role in advancing the crack formed by L). In order to minimize the area in which the braking member 55 contacts the corresponding surface to maximize the pressing force of the braking member 55 applied to the corresponding surface, the braking member 55 has a wedge shape whose width decreases toward the corresponding surface. It is preferably made. The tip of the braking member 55 in contact with the second surface of the second panel P2 may be made of an elastic material such as urethane resin, and accordingly, the tip of the braking member 55 is attached to the second panel P2. Even in contact, it is possible to prevent damage to the second panel P2.

When the braking member 55 presses the corresponding surface, the first pressing member 52 comes into contact with the first panel P1, so that the part where the scribing line L is formed and the scribing line L It plays a role of supporting the single material (D) partitioned by it.

As shown in Fig. 9, when the first pressing member 52 and the second pressing member 53 are moved adjacent to each other by the driving mechanism 54, the end of the substrate S is moved to the first pressing member 52. ) And the second pressing member 53 and adsorbed to the first adsorption unit 521 and the second adsorption unit 531, and at the same time, the second panel P2 corresponding to the scribing line L ), the braking member 55 presses the corresponding surface. Accordingly, cracks may proceed in a direction perpendicular to the first surface of the first panel P1 from the scribing line L inside the first panel P1. In this way, since the crack proceeds in a direction perpendicular to the first surface of the first panel P1, the cut surface of the substrate S may be uniform in the vertical direction.

Hereinafter, a process of removing the end material D from the substrate S using the end material removal apparatus 40 according to the second embodiment of the present invention will be described with reference to FIGS. 9 to 11. The same contents as those described in the first embodiment will be omitted.

As shown in FIG. 9, when the clamp module 50 of the end material removal device 40 is moved to the end material D partitioned by the scribing line L, the first pressing member 52 and the second The pressing members 53 are moved adjacent to each other. Accordingly, the end of the substrate S is pressed by the first pressing member 52 and the second pressing member 53. Simultaneously or sequentially, the ends of the substrate S are adsorbed to the first adsorption part 521 and the second adsorption part 531 by the negative pressure applied by the negative pressure source 58. Further, the corresponding surface of the second panel P2 corresponding to the scribing line L formed on the first panel P1 is pressed by the braking member 55.

As the braking member 55 presses the corresponding surface, a crack proceeds in a direction perpendicular to the first surface of the first panel P1 from the scribing line L inside the first panel P1. As described above, since the crack proceeds in a direction perpendicular to the first surface of the first panel P1 by the braking member 55, the cut surface of the end of the first panel P1 may be uniform in the vertical direction. In addition, as the crack progresses inside the first panel P1, the end material D partitioned by the scribing line L may be divided from the end of the substrate S. Accordingly, the end material D may be in a state in which it can be immediately separated from the end of the substrate S.

In this state, as shown in FIG. 10, the first pressing member 52 and the second pressing member 53 are rotated by the rotation mechanism 57 so that the end of the substrate S is bent downward.

Then, as shown in FIG. 11, the first pressing member 52 and the second pressing member 53 are moved to be spaced apart from each other. In this case, the first pressing member 52 may be moved upward relative to the second pressing member 53. That is, the first pressing member 52 may be moved upward while the second pressing member 53 is stopped. At this time, since the end of the second panel P2 is adsorbed by the second adsorption unit 531, the state where the end of the substrate S is bent downward is maintained as it is. And, since the end material D is in a state adsorbed by the first adsorption unit 521, the end material D is approximately diagonally moved by the upward movement of the first pressing member 52 with respect to the second pressing member 53. It may be separated from the end of the first panel P1.

According to the end material removal apparatus 40 according to the second embodiment of the present invention, the clamp module 50 is formed of the second panel P2 corresponding to the scribing line L formed on the first panel P1. It is configured to further include a braking member 55 configured to press the corresponding surface. In addition, the breaking member 55 presses the corresponding surface in a direction perpendicular to the corresponding surface so that the crack advances in a direction perpendicular to the corresponding surface inside the first panel P1, so that the end material D is transferred to the substrate S It can be divided from the end of ). In this way, since the crack proceeds in a direction perpendicular to the first surface of the first panel P1, the cut surface of the substrate S may be uniform in the vertical direction.

Hereinafter, with reference to Figs. 12 and 13, a description will be given of an end material removal device 40 according to a third embodiment of the present invention. The same reference numerals are assigned to the same components as those described in the first and second embodiments, and detailed descriptions thereof will be omitted.

12 and 13, the clamp module 50 of the end material removal device 40 according to the third embodiment of the present invention is configured to move the first pressing member 52 in the Y-axis direction. It may further include a pressing member driving mechanism (523). For example, the pressurizing member drive mechanism 523 may be composed of an actuator using pneumatic or hydraulic pressure, a linear motor operated by electromagnetic interaction, or a linear movement mechanism such as a ball screw mechanism.

As the first pressing member 52 is moved in the Y-axis direction by the pressing member driving mechanism 523, the first adsorption unit 521 may be moved in the Y-axis direction.

Accordingly, as shown in FIG. 13, in the process of separating the end material D from the end of the substrate S, the first pressing member 52 is along an axis inclined with respect to the Z axis by the driving mechanism 54. At the same time as it is moved, it can be moved along an axis inclined with respect to the Y axis by the pressing member driving mechanism 523. As a result, the first adsorption unit 521 of the first pressing member 52 may move approximately along the Y-axis direction (horizontal direction), and accordingly, the end material D moves in the approximately horizontal direction, and the substrate S ) Can be separated from the end. Therefore, in the process of removing the end material (D) from the end of the substrate (S), by minimizing the interference between the end material (D) and the end of the substrate (S), between the end material (D) and the end of the substrate (S) Since friction can be prevented, damage such as scratches on the substrate S can be prevented.

Meanwhile, as shown in FIG. 1, the substrate cutting apparatus may further include an end material removal device 60 for removing end materials located at both ends of the substrate S in the X-axis direction. The end material removal device 60 may be disposed on at least one of both sides or both sides of the second transfer unit 20 in the X-axis direction. The end material removing device 60 is configured to remove the end material partitioned by a scribing line extending in the Y axis direction from an end portion of the substrate S in the X axis direction to form a step portion. The end material removal device 60 may have the same configuration as the end material removal device 40 described above.

Although preferred embodiments of the present invention have been described exemplarily, the scope of the present invention is not limited to such specific embodiments, and may be appropriately changed within the scope described in the claims.

10: first transfer unit
20: second transfer unit
30: scribing unit
40: single material removal device
50: clamp module
60: single material removal device

Claims (6)

In the end material removal apparatus for removing the end material partitioned by a scribing line formed at the end of the first panel of a substrate formed by bonding a first panel and a second panel,
A first adsorption unit configured to adsorb the cut material;
A second adsorption unit configured to adsorb an end portion of the second panel; And
A rotation mechanism for rotating the first adsorption unit and the second adsorption unit to bend the end of the substrate to divide the end material along the scribing line,
In a state in which the first adsorption unit and the second adsorption unit are rotated so that the end material is adsorbed to the first adsorption unit, the end of the second panel is adsorbed to the second adsorption unit, and the end of the substrate is bent. The cut-off material removal device, characterized in that the cut-off material is separated from the substrate by the first adsorption part being spaced apart from the second adsorption part. The method according to claim 1,
End material removal device further comprising a pressing member for pressing and supporting one surface of the first panel. The method according to claim 1,
The end material removal apparatus further comprising a braking member configured to press the corresponding surface of the second panel corresponding to the scribing line. The method of claim 3,
End material removal apparatus further comprising a braking member driving mechanism for moving the braking member toward the corresponding surface of the second panel. The method according to claim 1,
The first adsorption unit and the second adsorption unit are connected to a negative pressure source and are configured to adsorb the ends of the end material and the second panel by negative pressure acting by the negative pressure source,
The first adsorption unit and the second adsorption unit is connected to a gas supply and is configured to eject gas supplied from the gas supply to release the ends of the end material and the second panel, respectively. The method according to claim 1,
The end material removal apparatus further comprising at least one moving mechanism configured to move the first adsorption unit to be spaced apart from the end of the substrate while moving the first adsorption unit to be spaced apart from the second adsorption unit.

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