CN209567995U - Base plate processing device - Google Patents
Base plate processing device Download PDFInfo
- Publication number
- CN209567995U CN209567995U CN201821911678.5U CN201821911678U CN209567995U CN 209567995 U CN209567995 U CN 209567995U CN 201821911678 U CN201821911678 U CN 201821911678U CN 209567995 U CN209567995 U CN 209567995U
- Authority
- CN
- China
- Prior art keywords
- substrate
- cutting part
- scribing line
- base plate
- processing device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
Abstract
Base plate processing device in the utility model embodiment, it includes scribing unit and sliver unit, scribing unit is used to form the first scribing line and multiple second scribing line, first scribing line extends along the boundary line between the live part and dummy portions of substrate and the notch including being formed to the central concave of the substrate, and the multiple second scribing line is inside the notch from the center radiated entend of the substrate；Sliver unit is pressurizeed respectively by multiple cutting parts of the second scribing line division, and the dummy portions in the notch are separated from the live part.
Description
Technical field
The utility model relates to a kind of for processing the device of substrate.
Background technique
It is commonly used for the liquid crystal display panel, organic EL display panel, inorganic EL of flat-panel monitor
Display pannel, transmission projection substrate, reflective projection substrate etc. use unit glass panel (hereinafter referred to as " substrate "), the list
First glass panel is obtained by the way that such as glass brittleness mother glass panel to be cut to predetermine sizes.
There can be the non-active area (hereinafter referred to as " dummy portions ") that will not be actually used in product in substrate periphery.Especially
It is, using substrate as display in use, dummy portions can become the principal element for determining frame (bezel) size.Therefore, In
In order to minimize dummy portions in substrate manufacture process, the process for removing dummy portions can be executed.
The process that dummy portions are removed in conventional art generally includes: using the periphery of grinder grinding base plate come from substrate
The process for removing dummy portions, and the process for removing the position of dummy portions is cleaned with cleaning agent.
But subparticle can be generated in the process using grinder grinding base plate periphery, to there is pollution substrate
And the problem of substrate periphery.
And it is further desired that the process of cleaning base plate, therefore there is also take needed for substrate manufacturing procedure complexity, substrate processing
The problem of with increasing.Especially when substrate is oled panel, the cleaning agent for cleaning base plate may bring not substrate
Benefit influences.
Utility model content
It, can be from the purpose of this utility model is to provide one kind in order to solve the problems, such as above-mentioned conventional art point
Substrate effectively removes the base plate processing device of dummy portions.
In order to achieve the above object, the utility model provides a kind of base plate processing device comprising: scribing unit is used
In the scribing line of formation first and multiple second scribing line, first scribing line is along the boundary between the live part and dummy portions of substrate
Line extends and the notch including the central concave to the substrate, and the multiple second scribing line is inside the notch from described
The center of substrate is with radiated entend；And sliver unit, be used to pressurize respectively multiple points divided by second scribing line
Portion is cut, the dummy portions in the notch are separated from the live part.
In the notch, first scribing line includes multiple curve parts, in the notch, second scribing line and institute
The multiple curve parts for stating the first scribing line are correspondingly formed, and the dummy portions in the notch divide into the by the multiple second scribing line
One cutting part, a pair of second cutting part and multiple third cutting parts, first cutting part are set in the notch
The heart；The pair of second cutting part is set to the two sides of first cutting part；The multiple third cutting part is set to described
The outside of a pair of second cutting part.
Sliver unit includes: workbench, has the substrate placement section for placing the substrate；Pressing member, packet
Multiple pressurization parts are included, the multiple pressurization part is configured to pressurize first cutting part, second cutting part and institute
State third cutting part；And mobile module, keep the pressing member mobile to the substrate for being placed in the workbench.
The pressurized plane of multiple pressurization parts is not identical relative to the position of the substrate, described to pressurize in a predetermined sequence
First cutting part, second cutting part and the third cutting part.
First cutting part is formed with crosses by least one third of center radiated entend of the substrate, and described first
Cutting part is divided into the first sub- cutting part for being set to the open center by the third and is set to first son
The sub- cutting part of a pair second of cutting part two sides.
Sliver unit includes: workbench, has the substrate placement section for placing the substrate；Pressing member, packet
Include multiple pressurization parts, the multiple pressurization part be configured to pressurize the described first sub- cutting part, the second sub- cutting part,
Second cutting part and the third cutting part；And mobile module, make the pressing member to being placed in the work
The substrate of platform is mobile.
The pressurized plane of multiple pressurization parts is not identical relative to the position of the substrate, described to pressurize in a predetermined sequence
First sub- cutting part, the second sub- cutting part, second cutting part and the third cutting part.
Workbench can have the support portion for the dummy portions for being used to support the substrate.
Support portion can correspond to the setting of the certain point in the scribing line.
Multiple pressurization parts can separate configuration between each other, can be in the opposite of the support portion across the support portion
Pressurize the dummy portions of the support portion two sides for two sides.
The base plate processing device of the utility model further includes substrate transfer unit, and the substrate transfer unit is configured at described
Between scribing unit and the sliver unit, the base of the first scribing line and the second scribing line can will be formed with by the scribing unit
Plate is transferred to the sliver unit from the scribing unit.
Utility model effect
According to the base plate processing device in the utility model embodiment, along the live part of substrate and the boundary of dummy portions
Line forms first scribing line with straight line portion and curve part, the outside of the curve part of the first scribing line formed from the center of substrate with
Second scribing line of radiated entend, in the state that support portion corresponds to the second scribing position, in the two opposite sides point of support portion
The multiple cutting parts that Jia Ya not be divided by the second scribing line, thus in the case where avoiding the slight crack of live part of substrate or breakage
Smoothly dummy portions effectively are removed from the live part of substrate.
Also, according to the base plate processing device in the utility model embodiment, without the need for needed for removal dummy portions
Grinding and cleaning process.Thus, it is possible to prevent the problems of the prior art brought by grinding process and cleaning process.
Also, it is cut to form notch in substrate in composition according to the base plate processing device in the utility model embodiment
Dummy portions inside mouthful are additionally formed multiple third scribing line, successively pressurize and are removed by multiple thirds from open center to two sides
Multiple sub- cutting parts that scribing line divides, so as to easily form notch in substrate.
Detailed description of the invention
Fig. 1 is the generalized schematic of the substrate to be processed of base plate processing device in the utility model embodiment.
Fig. 2 is the generalized schematic of base plate processing device in the utility model embodiment.
Fig. 3 and Fig. 4 is to be formed on substrate using the scribing unit of the base plate processing device in the utility model embodiment
The generalized schematic of the state of scribing line.
Fig. 5 and Fig. 6 is the generalized schematic of the sliver unit of the base plate processing device in the utility model embodiment.
Fig. 7 is to show to be formed on substrate using the scribing unit of base plate processing device in the utility model embodiment to draw
Line, the support zone formed on the workbench for being formed in sliver unit are illustrated in the outline of the state of position corresponding with scribing line
Figure.
Fig. 8 and Fig. 9 is for illustrating to be formed in cutting for substrate by the base plate processing device in the utility model embodiment
The skeleton diagram of mouth.
Figure 10 is the notch for illustrating to be formed in substrate by the base plate processing device in the utility model embodiment
Another exemplary skeleton diagram.
Figure 11 and Figure 12 is for illustrating to exist using the sliver unit of the base plate processing device in the utility model embodiment
The skeleton diagram of the structure of notch is formed on substrate.
Appended drawing reference:
10: the first scribing line
20: the second scribing line
21: third scribing line
30: cutting part
40: base plate alignment unit
50: scribing unit
60: sliver unit
70: substrate transfer unit
80: unloading unit
S: substrate
S1: live part
S2: dummy portions
Specific embodiment
Hereinafter, being illustrated referring to attached drawing to the base plate processing device in the utility model embodiment.
The transfer direction for the substrate that will carry out substrate manufacturing procedure is defined as Y direction, will be perpendicular to base plate transfer side
It is X-direction to the direction definition of (Y direction).Also, the direction definition that will be perpendicular to place the X-Y plane of substrate is Z axis
Direction.
As shown in Figure 1, including: by the substrate S that the base plate processing device in the utility model embodiment will be processed
Live part S1, for the effective coverage for actual product；And dummy portions S2, it is present in the week of live part S1
Side is without using in the non-active area of actual product.For example, substrate S can be rigidity (rigid) oled panel.
The live part S1 of substrate S has the notch N being recessed towards the center of substrate S with preset width.In substrate S
When being used in the display of smart phone etc., notch N can be used as the position of the various parts such as setting camera module.
Base plate processing device in the utility model embodiment, which has from the live part S1 of substrate S removal, is present in substrate
The function of the dummy portions S2 on the periphery of the live part S1 of S.
As shown in Figures 2 and 3, the base plate processing device in the utility model embodiment includes: scribing unit 50, is used for
Scribing line 10,20 is formed in substrate S；And sliver unit 60, it is used for along the scribing line 10,20 formed by scribing unit 50 from having
It imitates part S1 and separates dummy portions S2.
Scribing unit 50 includes being mounted with the loading stage 51 of substrate S and being formed in the substrate S for being loaded into loading stage 51 to draw
The scribe head 52 of line 10,20.
Loading stage 51 is set on the guide rail 53 that the direction (Y direction) of transfer substrate S extends, and can be along guide rail
53 is mobile to Y direction.Loading stage 51 moves and is located at the lower section of scribe head 52 to Y direction along guide rail 53, is putting as a result,
The substrate S being placed on loading stage 51 forms scribing line 10,20.
The opposite side of the side towards scribe head 52 of loading stage 51 has base plate alignment unit 40, the base plate alignment list
Member 40 is for being directed at the substrate S for being placed in loading stage 51 in the position and rotation position of X-direction and Y direction.
Apply pressure when base plate alignment unit 40 is to more than two among of substrate S to be directed at substrate S in X-axis side
To and Y direction on position and rotation position.Base plate alignment unit 40 includes multiple compression modules 41, the compression module 41
It is correspondingly arranged with each side of substrate S, each side for the substrate S that pressurizes.
After substrate S is transferred to loading stage 51, loading stage 51 moves along guide rail 53 and between multiple compression module 41.
At this point, more than two sides of substrate S are pressurizeed by multiple compression modules 41, so as to be directed at substrate S in X-direction and Y-axis
Position and rotation position on direction.After the position alignment of substrate S, loading stage 51 is located under scribe head 52 along guide rail 53
Side, thus, it is possible to form scribing line 10,20 in the substrate S being loaded on loading stage 51.
Scribe head 52 is movably arranged at supporting table 56 in the X-axis direction, and the supporting table 56 with substrate S to transferring
The direction (X-direction) that direction (Y direction) is directly handed over is extended.
For example, it is mobile to Y direction by loading stage 51, the scribing line 10,20 of Y direction is formed on substrate S.Also, it is logical
It crosses scribe head 52 to move to X-direction, forms the scribing line 10,20 of X-direction on substrate S.Furthermore by loading stage 51 to Y-axis
Scribe head 52 is mobile to X-direction while direction is mobile, is formed on substrate S relative to X-direction and Y direction inclination or curved
The scribing line 10,20 of bent predetermined angular.
As shown in Figures 3 and 4, the scribing line 10,20 of substrate S is formed in along live part S1 and void by scribing unit 50
If boundary (that is, along profile of live part S1) between the S2 of part and extend, the scribing line include: have straight line portion 11 and
First scribing line 10 of curve part 12；And second scribing line 20, first scribing line 10 curve part 12 outside dummy portions
S2 is formed from the center of substrate S with radiated entend.
First scribing line 10 for distinguishing the live part S1 and dummy portions S2 of substrate S, can along live part S1 and
The boundary line of dummy portions S2 extends.First scribing line 10 includes multiple straight line portions 11 and multiple curve parts 12.Multiple 11 Hes of straight line portion
Multiple curve parts 12 can be alternatively formed.
The score wheel (not shown) for being installed on scribe head 52 is applied pressure to substrate S upper side in the state of, by scribing
Wheel and/or substrate S level relatively move and form the first scribing line 10.But the first scribing line 10 includes multiple curve parts 12, because
This, multiple curve parts 12 are critically processed in order to finer, and laser is preferably used to be formed in the first scribing line 10.At this point,
Laser beam can be irradiated from scribe head 52 to substrate S, so that the spot of laser beam is located at the inside of substrate S, and by that will cross
First 52 and/or substrate S level relative movement and formed first scribing line 10.
For this purpose, base plate processing device may include laser beam irradiation unit (not shown), it is used to irradiate on substrate S and swashs
Light beam and form the first scribing line 10.
Second scribing line 20 can be used score wheel and be formed, and laser beam also can be used and formed.First scribing line 10 and second stroke
Line 20 is all formed using score wheel or using laser beam come when being formed, scribing unit 50 can have a type of scribe head
52.First scribing line 10 is formed using laser beam, and the second scribing line 20 is using score wheel come when being formed, scribing unit 50 can have
Two kinds of scribe heads 52.
For this purpose, base plate processing device may include score wheel (not shown), be configured as stressing on substrate S and relative to
Substrate is mobile and forms the second scribing line 20.
As shown in Figures 3 and 4, the second scribing line 20 can be formed at the illusory of 12 outside of curve part of the first scribing line 10
In a part of part S2.The center that substrate S is subject in second scribing line 20, substantially extends to form in radial direction (radial).
For example, the second scribing line 20 can extend from the center of the curve part 12 of the first scribing line 10 towards outer radius direction.Second scribing line
20 connect with the curve part 12 of the first scribing line 10.
As another example, the second scribing line 20 can be spaced apart preset space length with the curve part 12 of the first scribing line 10.Second stroke
Line 20 and the curve part 12 of the first scribing line 10 are spaced when being arranged, when the second scribing line 20 of being subject to disconnects substrate S, the disconnection of substrate S
Influencing to the first 10 brings of scribing line can be smaller.
Multiple second scribing line 20 can correspond respectively to multiple curve parts 12 of the first scribing line 10 and be formed.That is, second stroke
The quantity of line 20 can be identical as the quantity of curve part 12 of the first scribing line 10.
Dummy portions S2 can be divided into multiple cutting parts 30 by multiple second scribing line 20.That is, multiple cutting parts 30 can
Being divided by multiple second scribing line 20.Multiple cutting parts 30 can be configured along the direction that the first scribing line 10 extends.
Fig. 2 is referred again to, sliver unit 60 includes: workbench 61, for loading substrate S；And polishing head 62 comprising logical
It is overpressurized the dummy portions S2 for being loaded into the substrate S of workbench 61 and by dummy portions S2 from live part S1 separation/removal
Pressing member 65.
Workbench 61 is arranged in towards on the guide rail 63 of transfer direction (Y direction) extension of substrate S, and can be along leading
Rail 63 is mobile to Y direction.Workbench 61 can move and be located at the lower section of polishing head 62 to Y direction along guide rail 63, by
This, the dummy portions S2 for being installed on the substrate S of workbench 61 is pressurized the pressurization of component 65 and is removed.
The opposite side of the side towards polishing head 62 of workbench 61 has substrate transfer unit 70.Substrate transfer unit 70
Play the role of the transferring substrates S between the loading stage 51 of scribing unit 50 and the workbench 61 of sliver unit 60.Substrate transmitting
Unit 70 includes: the framework 71 extended to X-direction；And pick-up head 72, framework can be movably set to X-direction
71, for clamping or vacuum suction substrate S.Substrate transfer unit 70, which plays, to be formed with scribing line 10,20 by scribing unit 50
Substrate be transferred to from the loading stage 51 of scribing unit 50 sliver unit 60 workbench 61 effect.
According to the base plate processing device in the utility model embodiment, scribing unit 50, sliver unit 60 and substrate are passed
Passing unit 70 can be set on a device, so as to complete to form the work of scribing line 10,20 in substrate S on one device
Sequence and the process for dividing substrate S along scribing line 10,20.
In addition, having unloading unit 80 in opposite side of the workbench 61 towards the side of polishing head 62, the unloading is single
Member 80 is eliminated the substrate S of dummy portions S2 to external removal by sliver unit 60.
As shown in Figs. 5 to 7, workbench 61 includes: ontology 611；Protrude from ontology 611 and the substrate for placing substrate S
Placement section 612；And support portion 613, it is configured at the outer periphery of substrate placement section 612, and protrude with correspondence from ontology 611
It is arranged in the certain point in the second scribing line 20.
Substrate placement section 612 can have size corresponding with the size of the live part S1 of substrate S and area and area.
Substrate S can be placed in substrate placement section 612 and live part S1 is made to correspond to substrate placement section 612.It is placed in substrate S
In the state of substrate placement section 612, the dummy portions S2 of substrate S can protrude outward from the side of substrate placement section 612.
That is, the upper side of the ontology 611 of dummy portions S2 and workbench 61 can be spaced apart.Therefore, substrate is placed in substrate S to place
In the state of portion 612, by being pressurizeed dummy portions S2 by pressing member 65, dummy portions S2 can be along scribing line 10,20 from having
Imitate part S1 separation.
Such as Fig. 6 and Fig. 7, multiple support portions 613 can be configured at corresponding with the position for forming multiple second scribing line 20
Position.Support portion 613 can be formed as pin-shaped shape.But the utility model is not limited by 613 shape of support portion.For example, branch
Support part 613 can be formed as the cleat shape extended along the extending direction of the second scribing line 20.The branch contacted with the surface of substrate S
It the surface (upper end of support portion 613) of support part 613 can be with surface (the substrate placement for the substrate placement section 612 for being placed with substrate S
The upper side in portion 612) it is same plane.As a result, when substrate S is placed in substrate placement section 612, substrate S can steadily be connect
It touches in support portion 613.
Polishing head 62 includes mobile module 67, and the mobile module 67 is connect by connecting component 66 with pressing member 65,
Pressing member 65 is mobile to vertical direction (Z-direction) relative to substrate S.Mobile module 67 can be through pneumatics or oil
Press the actuator, the linear motor by electromagnetic interaction operating or ball screw isoline mobile mechanism of operating.
As shown in Fig. 5 to Figure 11, pressing member 65 include ontology 651 and pressurization part 652, the pressurization part 652 with it is illusory
Partial shape, which is accordingly protruded from ontology 651, to be formed.
Pressurization part 652 can have the pressurized plane contacted with the surface of dummy portions S2.Pressurization part 652 is around ontology 651
Center is formed in peripheral direction.
Pressurization part 652 is integrally formed with the shape corresponding to dummy portions S2.For example, although it is not shown, when without in base
When plate S forms notch N, the dummy portions S2 of substrate S is formed about the substantially quadrangle ring-shaped of live part S1, pressurization part
652 may be formed integrally as the quadrangle ring-shaped of the shape corresponding to dummy portions S2.
As another example, multiple pressurization parts 652 can be separated on the peripheral direction of substrate S and be formed.
In particular, needing as shown in Fig. 6 and Figure 12 when substrate S forms notch N, corresponding to the position of the notch N of substrate S
Setting can separate to form multiple pressurization parts 652 on the peripheral direction of substrate S.That is, multiple pressurization parts 652 can be set in void
If each section of part S2.
Also, multiple pressurization parts 652 can separate preset space length between each other.Multiple pressurization parts 652 separate between each other
When predetermined space, interval can be greater than the size (diameter, width) of 613 upper end of support portion of workbench 61.Therefore, adjacent
A pair of of pressurization part 652) it is intermediate across a support portion 613, in two opposite sides pressurization 613 two sides of support portion of support portion 613
Dummy portions S2.
The multiple cutting parts 30 divided by multiple second scribing line 20 at this point, multiple pressurization parts 652 can pressurize respectively.It is multiple
Pressurization part 652 can correspond respectively to be configured by multiple cutting parts 30 that multiple second scribing line 20 divide.Therefore, a pair of of pressurization
Portion 652 can pressurize a pair of of cutting part across second 20 (that is, across support portions 613) of scribing line in the two opposite sides of support portion 613
30, as a result, a pair of of cutting part 30 by between it the second scribing line 20 and support portion 613 bend and be easy to be disconnected.
Also, according to the characteristic of substrate S (that is, the width of the length of the straight line portion of the first scribing line and curve part, dummy portions
And/or length, width, size, the shape etc. of length, multiple cutting parts 30 respectively) come set the multiple cutting parts 30 of pressurization and from
The sequence of live part S1 removal.
As an example, multiple pressurization parts 652 can be pressurizeed simultaneously by multiple cutting parts 30 of multiple second scribing line, 20 divisions,
To which multiple cutting parts 30 be separated from live part S1 simultaneously.
Another example, multiple pressurization parts 652 successively pressurize by it is multiple second scribing line 20 divide multiple cutting parts 30, so as to
Successively multiple cutting parts 30 to be separated from live part S1.
For this purpose, in multiple second pressurization parts 652 pressurized plane of each pressurization part and the interval substrate S can be different set
It sets.It is formed that is, multiple second pressurization parts 652 can be protruded from ontology 651 differently.
Structure as above can be adapted for being formed towards the center of substrate S on substrate S with the notch N of preset width indent
Process in.
It as can be seen from figures 8 and 9, can be with curved more towards mutually opposite direction in order to form notch N in substrate S
A curve part 12 forms the first scribing line 10 with alternateing configuration.Also, multiple the can be formed by corresponding to multiple curve parts 12
Two scribing line 20.Dummy portions S2 is divided according to multiple second scribing line 20 as a result, are as follows: the first cutting part positioned at the center of notch N
31；It is configured at the second cutting part 32 of the two sides of the first cutting part 31；And multiple third cutting parts 33, it is located at a pair second
The outside of cutting part 32.
As another example, as shown in Figure 10, multiple curve parts 12 can be configured, allow to be formed four third segmentations
Portion 33.
First cutting part 31 is set to the center of notch N.It is separated to make the first cutting part 31 be easy disconnection, first
The inside of cutting part 31 is also formed with third scribing line 21.The center that substrate S is subject in third scribing line 21, substantially with radial direction
It is (radial) to extend.The quantity for being formed in the third scribing line 21 inside the first cutting part 31 can be according to the width of the first cutting part 31
Degree and/or length and determine.If the width and/or length of the first cutting part 31 are larger, it is formed in inside the first cutting part 31
Third scribing line 21 quantity will increase.
Second cutting part 32 is the part being disposed adjacent with a pair of of curve part 12, therefore, when the second cutting part 32 is pressurized
When plus-pressure be not easy to be transmitted to the second cutting part 32, the second cutting part 32 is not easy to be disconnected.Also, the second cutting part 32 exists
It is contacted respectively between first cutting part 31 and third cutting part 33 with the first cutting part 31 and third cutting part 33, therefore second point
Portion 32 is cut to be not easy to be disconnected.As a result, in order in the continuously configuration of the first cutting part 31, the second cutting part 32, third cutting part 33
Structure in effectively remove the first cutting part 31, the second cutting part 32, third cutting part 33, it is preferable that finally remove second point
Cut portion 32.
As an example, the first cutting part 31 and third cutting part 33 can be pressurized simultaneously and remove.And then pressurization is gone
Except the second cutting part 32.For this purpose, as shown in figure 11, locating for the pressurized plane of the pressurization part 652 for first cutting part 31 that pressurizes
Plane A1 locating for pressurized plane of the plane A1 with the pressurization part 652 for the third cutting part 33 that pressurizes can be generally aligned in the same plane.
Also, for pressurize the first cutting part 31 and third cutting part 33 pressurization part 652 pressurized plane locating for plane A1 compared to
Plane A3 locating for the pressurized plane of pressurization part 652 for second cutting part 32 that pressurizes is closer to substrate S.
As another example, can first pressurize after removing third cutting part 33, pressurization the first cutting part 31 of removal, pressurization removal
Repressurization removes the second pressurization part 32 after first cutting part 31.For this purpose, as shown in figure 12, for adding for the third cutting part 33 that pressurizes
Locating for pressurized plane of the plane A1 locating for the pressurized plane of splenium 652 compared to the pressurization part 652 for first cutting part 31 that pressurizes
Plane A2 closer to substrate S.Also, plane A2 locating for the pressurized plane of the pressurization part 652 for first cutting part 31 that pressurizes
Plane A3 locating for pressurized plane compared to the pressurization part 652 for second cutting part 32 that pressurizes is closer to substrate S.
Furthermore when forming multiple third scribing line 21 inside the first cutting part 31, the first cutting part 31 is drawn by multiple thirds
Line 21 is divided into multiple sub- cutting parts 311,312.Also, multiple sub- cutting parts 311,312 include the center for being configured at notch N
First sub- cutting part 311 and the second sub- cutting part 312 for being configured at the first sub- 311 two sides of cutting part.At this point, in order to effectively add
Pressure the first cutting part 31 of removal, it is preferable that after the first sub- cutting part 311 of first pressurization removal, then repressurization removes the second son
Cutting part 312.That is, the multiple sub- cutting parts 311,312 divided by multiple thirds scribing line 21 inside the first cutting part 31 are from cutting
The center of mouth N is successively pressurized removal to two side directions of notch N.For this purpose, corresponding respectively to the first sub- cutting part 311 and second
The pressurized plane of the pressurization part 652 of sub- cutting part 312 can be different relative to the position of substrate S.
According to the base plate processing device in the utility model embodiment, along the live part S1 and dummy portions of substrate S
The boundary line of S2 forms the first scribing line 10 for having straight line portion 11 and curve part 12, in the outside shape of the curve part 12 of the first scribing line 10
, with the second scribing line 20 of radiated entend, correspond to the state of the second 20 positions of scribing line in support portion 613 at from the center of substrate S
Under, it is pressurizeed respectively in the two opposite sides of support portion 613 by multiple cutting parts 30 of 20 division of the second scribing line, so as to avoid
Slight crack or breakage occur for the live part S1 of substrate S, smoothly effectively can remove dummy portions from the live part S1 of substrate S
S2。
Also, according to the base plate processing device in the utility model embodiment, it is not necessary that carry out for removing illusory portion
Divide the grinding and cleaning of S2.Thus, it is possible to prevent the problems of the prior art brought by grinding process and cleaning process.
Also, it is being constituted according to the base plate processing device in the utility model embodiment in order to form notch N in substrate S
Dummy portions S2 inside notch N is additionally formed multiple third scribing line 21, successively pressurizes from the center notch N to two sides and removes quilt
Multiple sub- cutting parts 311,312 that multiple third scribing line 21 divide, so as to easily form notch N in substrate S.
Although illustrating the preferred embodiment of the utility model, the scope of the utility model is not limited to above-mentioned
Specific embodiment can be suitably changed in the range recorded in claims.
Claims (11)
1. a kind of base plate processing device, wherein the base plate processing device includes:
Scribing unit is used to form the first scribing line and multiple second scribing line, the described first live part crossed along substrate
And the boundary line between dummy portions extends and the notch including the central concave to the substrate, the multiple second scribing line exists
From the center of the substrate with radiated entend inside the notch；And
Sliver unit, be used to pressurize respectively the multiple cutting parts divided by second scribing line, will be illusory in the notch
Part is separated from the live part.
2. base plate processing device according to claim 1, wherein
In the notch, first scribing line includes multiple curve parts,
In the notch, multiple curve parts of the multiple second scribing line respectively with first scribing line are correspondingly formed,
Dummy portions in the notch by the multiple second scribing line divide into the first cutting part, a pair of second cutting part and
Multiple third cutting parts, first cutting part are set to the center of the notch；The pair of second cutting part is set to institute
State the two sides of the first cutting part；The multiple third cutting part is set to the outside of the pair of second cutting part.
3. base plate processing device according to claim 2, wherein the sliver unit includes:
Workbench has the substrate placement section for placing the substrate；
Pressing member comprising multiple pressurization parts, the multiple pressurization part are configured to pressurize first cutting part, institute
State the second cutting part and the third cutting part；And
Mobile module keeps the pressing member mobile to the substrate for being placed in the workbench.
4. base plate processing device according to claim 3, wherein
The pressurized plane of the multiple pressurization part is not identical relative to the position of the substrate, described to pressurize in a predefined order
First cutting part, second cutting part and the third cutting part.
5. base plate processing device according to claim 2, wherein
First cutting part is formed with crosses by least one third of center radiated entend of the substrate,
First cutting part is divided into the first sub- cutting part for being set to the open center and setting by the third
The sub- cutting part of a pair second in the described first sub- cutting part two sides.
6. base plate processing device according to claim 5, wherein the sliver unit includes:
Workbench has the substrate placement section for placing the substrate；
Pressing member comprising multiple pressurization parts, the multiple pressurization part be configured to pressurize the described first sub- cutting part,
The second sub- cutting part, second cutting part and the third cutting part；And
Mobile module keeps the pressing member mobile to the substrate for being placed in the workbench.
7. base plate processing device according to claim 6, wherein
The pressurized plane of the multiple pressurization part is not identical relative to the position of the substrate, described to pressurize in a predefined order
First sub- cutting part, the second sub- cutting part, second cutting part and the third cutting part.
8. the base plate processing device according to claim 3 or 6, wherein
The workbench has the support portion for the dummy portions for being used to support the substrate.
9. base plate processing device according to claim 8, wherein
The support portion corresponds to the certain point setting in the scribing line.
10. base plate processing device according to claim 8, wherein
The multiple pressurization part is spaced from each other configuration, across the support portion, described in the two opposite sides pressurization of the support portion
The dummy portions of support portion two sides.
11. base plate processing device according to claim 1, wherein the base plate processing device further include:
Substrate transfer unit, the substrate transfer unit are configured between the scribing unit and the sliver unit, will pass through
The scribing unit forms the first scribing line and the substrate of the second scribing line is transferred to the sliver unit from the scribing unit.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020180059112A KR102114028B1 (en) | 2018-05-24 | 2018-05-24 | Substrate processing apparatus |
| KR10-2018-0059112 | 2018-05-24 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209567995U true CN209567995U (en) | 2019-11-01 |
Family
ID=68320675
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821911678.5U Expired - Fee Related CN209567995U (en) | 2018-05-24 | 2018-11-20 | Base plate processing device |
Country Status (2)
| Country | Link |
|---|---|
| KR (1) | KR102114028B1 (en) |
| CN (1) | CN209567995U (en) |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004217492A (en) * | 2003-01-17 | 2004-08-05 | Murakami Corp | Method of cutting out glass plate |
| KR101094284B1 (en) * | 2009-09-02 | 2011-12-19 | 삼성모바일디스플레이주식회사 | Substrate cutting appartus and method for cutting substrate using the same |
| KR101195601B1 (en) * | 2010-07-07 | 2012-10-29 | 주식회사 이오테크닉스 | Lasercutting method and breaking apparatus |
| KR101195600B1 (en) * | 2010-07-07 | 2012-10-29 | 주식회사 이오테크닉스 | Laser breaking method |
| JP5988043B2 (en) * | 2013-06-27 | 2016-09-07 | 日本電気硝子株式会社 | Scribing method of tempered glass sheet |
-
2018
- 2018-05-24 KR KR1020180059112A patent/KR102114028B1/en active IP Right Grant
- 2018-11-20 CN CN201821911678.5U patent/CN209567995U/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| KR102114028B1 (en) | 2020-05-25 |
| KR20190134008A (en) | 2019-12-04 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2000007146A (en) | Glass substrate holding tool | |
| CN101284709B (en) | A scribing unit and an apparatus scribing a panel with the unit, and a scribing method and a method manufacturing substrates | |
| KR101887655B1 (en) | Horizontal Type PCB Bonding Equipment | |
| KR20070103354A (en) | Substrate holder for substrate inspecting apparatus, and substrate inspecting apparatus | |
| KR20050115450A (en) | Mount head and transfer head | |
| CN109824259A (en) | Cutter for substrate and method for dividing substrate | |
| CN209567995U (en) | Base plate processing device | |
| CN113319699B (en) | Horizontal grinder of high accuracy probe | |
| KR101084970B1 (en) | Method for inspecting edge of plate | |
| CN209567996U (en) | Base plate processing device | |
| KR20060090905A (en) | Glass cutting apparatus for flat display | |
| KR20110111820A (en) | The small size glass polishing system that contain washing and drying instrument | |
| CN109824261A (en) | Cutter for substrate and method for dividing substrate | |
| CN209568002U (en) | Substrate breaking apparatus | |
| CN109574484A (en) | Cutter for substrate | |
| KR20090132226A (en) | Apparatus and method for manufacturing plate | |
| WO2018016038A1 (en) | Cutting device and cutting method | |
| US20080251557A1 (en) | Scribing unit and apparatus for scribing panel with the scribing unit, and scribing method and method for manufacutring substrate | |
| CN108218215A (en) | Cutter for substrate | |
| JP3892992B2 (en) | Eyeglass lens centering device | |
| CN112094048A (en) | Rim charge removing device | |
| CN108218214A (en) | Substrate holding unit and the scribing equipment with the substrate holding unit | |
| JP3366515B2 (en) | Positioning device | |
| CN109384377A (en) | Scribing equipment | |
| JP2008273006A (en) | Material removing apparatus and material removing method |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20191101 Termination date: 20211120 |