CN209567996U - Base plate processing device - Google Patents
Base plate processing device Download PDFInfo
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- CN209567996U CN209567996U CN201821912428.3U CN201821912428U CN209567996U CN 209567996 U CN209567996 U CN 209567996U CN 201821912428 U CN201821912428 U CN 201821912428U CN 209567996 U CN209567996 U CN 209567996U
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- substrate
- scribing line
- base plate
- scribing
- processing device
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/76—Making of isolation regions between components
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
Abstract
Base plate processing device in the utility model embodiment, comprising: scribing unit, it is used to form the first scribing line and the second scribing line, first scribing line is extended to form along the boundary line between the live part and dummy portions of substrate, and second scribing line is formed in the dummy portions from the center of the substrate with radiated entend；And sliver unit, pressurize the multiple cutting parts divided by second scribing line respectively, and the dummy portions are separated from the live part.
Description
Technical field
The utility model relates to a kind of for processing the device of substrate.
Background technique
It is commonly used for the liquid crystal display panel, organic EL display panel, inorganic EL of flat-panel monitor
Display pannel, transmission projection substrate, reflective projection substrate etc. use unit glass panel (hereinafter referred to as " substrate "), the list
First glass panel is obtained by the way that such as glass brittleness mother glass panel to be cut to predetermine sizes.
There can be the non-active area (hereinafter referred to as " dummy portions ") that will not be actually used in product on the periphery of substrate.It is special
It is not, using substrate as display in use, dummy portions can become the principal element for determining frame (bezel) size.Therefore,
In order to minimize dummy portions in substrate manufacture process, the process for removing dummy portions can be executed.
The process that dummy portions are removed in conventional art generally includes: using the periphery of grinder grinding base plate come from substrate
The process for removing dummy portions, and the process for removing the position of dummy portions is cleaned with cleaning agent.
But subparticle can be generated in the process using grinder grinding base plate periphery, to there is pollution substrate
And the problem of substrate periphery.
And it is further desired that the process of cleaning base plate, therefore there is also take needed for substrate manufacturing procedure complexity, substrate processing
The problem of with increasing.Especially when substrate is oled panel, the cleaning agent for cleaning base plate may bring substrate bad
It influences.
Utility model content
In order to solve the problems, such as above-mentioned conventional art, the purpose of this utility model is to provide one kind can be from base
Plate effectively removes the base plate processing device of dummy portions.
In order to achieve the above object, the utility model provides a kind of base plate processing device comprising: scribing unit is used
In the scribing line of formation first and the second scribing line, first scribing line is prolonged along the boundary line between the live part and dummy portions of substrate
It stretches to be formed, second scribing line is formed in the dummy portions from the center of the substrate with radiated entend；And sliver list
Member, be used to pressurize respectively the multiple cutting parts divided by second scribing line, by the dummy portions from the live part
Separation.
First scribing line includes straight line portion and curve part, and the second scribing line is formed on the outside of the curve part of the first scribing line.
Second scribing line is ruled off with first and to be formed with the first scribing line connection or the second scribing line.
First scribing line is formed and irradiating laser beam in substrate, and the second scribing line is by being pressurizeed with score wheel in substrate
And keeps score wheel mobile relative to substrate and formed.
Sliver unit includes: workbench, has the substrate placement section for placing substrate；Pressing member comprising add
Splenium, the pressurization part have the pressurized plane of the dummy portions for the substrate that pressurizes；And mobile module, described it will add
Splenium part is moved to the substrate for being placed in the workbench.
Workbench has the support portion for the dummy portions for being used to support substrate.
Support portion corresponds to some point setting in the second scribing line.
Pressing member includes multiple pressurization parts, and multiple pressurization parts separate configuration between each other, across support portion, in support portion
Two opposite sides pressurize the dummy portions of the support portion two sides.
Pressing member includes multiple pressurization parts, and the pressurized plane of multiple pressurization parts is different relative to the position of substrate.
Base plate processing device in the utility model embodiment further includes substrate transfer unit, the substrate transfer unit
It is configured between the scribing unit and the sliver unit, the first scribing line and the second scribing line will be formed by the scribing unit
Substrate be transferred to the sliver unit from the scribing unit.
Base plate processing device in the utility model embodiment further includes base plate alignment unit, and the base plate alignment unit is set
It is placed in the side of the scribing unit, the base plate alignment unit includes multiple compression modules, and the multiple compression module is to institute
The position of the substrate is pressurizeed and is aligned when stating more than two among of substrate.
Utility model effect
According to the utility model embodiment base plate processing device, along the live part and dummy portions of substrate
Boundary line forms first scribing line with straight line portion and curve part, is formed in the outside of the curve part of the first scribing line from the center of substrate
With the second scribing line of radiated entend, in the state that support portion corresponds to the second scribing position, in the two opposite sides of support portion
Pressurize respectively by second scribing line divide multiple cutting parts, thus the live part S1 for avoiding substrate S slight crack or breakage
In the case of smoothly effectively from the live part of substrate S remove dummy portions.
Also, according to the base plate processing device in the utility model embodiment, without the need for needed for removal dummy portions
Grinding and cleaning process.Thus, it is possible to prevent the problems of the prior art brought by grinding process and cleaning process.
Also, it is cut to form notch in substrate in composition according to the base plate processing device in the utility model embodiment
Mouthful internal dummy portions are additionally formed multiple thirds and cross, and successively pressurize and remove by multiple the to two sides from the center notch N
Multiple sub- cutting parts that three scribing line divide, so as to easily form notch in substrate.
Detailed description of the invention
Fig. 1 is the generalized schematic of the substrate to be processed of base plate processing device in the utility model embodiment.
Fig. 2 is the generalized schematic of base plate processing device in the utility model embodiment.
Fig. 3 and Fig. 4 is to be formed on substrate using the scribing unit of the base plate processing device in the utility model embodiment
The generalized schematic of the state of scribing line.
Fig. 5 and Fig. 6 is the generalized schematic of the sliver unit of the base plate processing device in the utility model embodiment.
Fig. 7 is to show to be formed on substrate using the scribing unit of base plate processing device in the utility model embodiment to draw
Line, the support zone formed on the workbench for being formed in sliver unit are illustrated in the outline of the state of position corresponding with scribing line
Figure.
Fig. 8 and Fig. 9 is for illustrating to be formed in cutting for substrate by the base plate processing device in the utility model embodiment
The skeleton diagram of mouth.
Figure 10 is the notch for illustrating to be formed in substrate by the base plate processing device in the utility model embodiment
Another exemplary skeleton diagram.
Figure 11 and Figure 12 is for illustrating to exist using the sliver unit of the base plate processing device in the utility model embodiment
The skeleton diagram of the structure of notch is formed on substrate.
Appended drawing reference:
10: the first scribing line
20: the second scribing line
21: third scribing line
30: cutting part
40: base plate alignment unit
50: scribing unit
60: sliver unit
70: substrate transfer unit
80: unloading unit
S: substrate
S1: live part
S2: dummy portions
Specific embodiment
Hereinafter, being illustrated referring to attached drawing to the base plate processing device in the utility model embodiment.
The transfer direction for the substrate that will carry out substrate manufacturing procedure is defined as Y direction, will be perpendicular to base plate transfer side
It is X-direction to the direction definition of (Y direction).Also, the direction definition that will be perpendicular to place the X-Y plane of substrate is Z axis
Direction.
As shown in Figure 1, including: by the substrate S that the base plate processing device in the utility model embodiment will be processed
Live part S1, for the effective coverage for actual product；And dummy portions S2, it is present in the week of live part S1
Side is without using in the non-active area of actual product.For example, substrate S can be rigidity (rigid) oled panel.
The live part S1 of substrate S has the notch N being recessed towards the center of substrate S with preset width.In substrate S
When being used in the display of smart phone etc., notch N can be used as the position of the various parts such as setting camera module.
Base plate processing device in the utility model embodiment, which has from the live part S1 of substrate S removal, is present in substrate
The function of the dummy portions S2 on the periphery of the live part S1 of S.
As shown in Figures 2 and 3, the base plate processing device in the utility model embodiment includes: scribing unit 50, is used for
Scribing line 10,20 is formed in substrate S；And sliver unit 60, it is used for along the scribing line 10,20 formed by scribing unit 50 from having
It imitates part S1 and separates dummy portions S2.
Scribing unit 50 includes being mounted with the loading stage 51 of substrate S and being formed in the substrate S for being loaded into loading stage 51 to draw
The scribe head 52 of line 10,20.
Loading stage 51 is set on the guide rail 53 that the direction (Y direction) of transfer substrate S extends, and can be along guide rail
53 is mobile to Y direction.Loading stage 51 moves and is located at the lower section of scribe head 52 to Y direction along guide rail 53, is putting as a result,
The substrate S being placed on loading stage 51 forms scribing line 10,20.
The opposite side of the side towards scribe head 52 of loading stage 51 has base plate alignment unit 40, the base plate alignment list
Member 40 is for being directed at the substrate S for being placed in loading stage 51 in the position and rotation position of X-direction and Y direction.
Apply pressure when base plate alignment unit 40 is to more than two among of substrate S to be directed at substrate S in X-axis side
To and Y direction on position and rotation position.Base plate alignment unit 40 includes multiple compression modules 41, the compression module 41
It is correspondingly arranged with each side of substrate S, each side for the substrate S that pressurizes.
After substrate S is transferred to loading stage 51, loading stage 51 moves along guide rail 53 and between multiple compression module 41.
At this point, more than two sides of substrate S are pressurizeed by multiple compression modules 41, so as to be directed at substrate S in X-direction and Y-axis
Position and rotation position on direction.After the position alignment of substrate S, loading stage 51 is located under scribe head 52 along guide rail 53
Side, thus, it is possible to form scribing line 10,20 in the substrate S being loaded on loading stage 51.
Scribe head 52 is movably arranged at supporting table 56, and the supporting table 56 is to direction (the Y-axis side transferred with substrate S
To) direction (X-direction) directly handed over is extended.
For example, it is mobile to Y direction by loading stage 51, the scribing line 10,20 of Y direction can be formed on substrate S.And
And it is mobile to X-direction by scribe head 52, the scribing line 10,20 of X-direction can be formed on substrate S.Furthermore pass through loading
Scribe head 52 is mobile to X-direction while platform 51 is mobile to Y direction, can be formed on substrate S relative to X-direction and Y
Axis direction inclination or the scribing line 10,20 of bending predetermined angular.
As shown in Figures 3 and 4, the scribing line 10,20 of substrate S is formed in along live part S1 and void by scribing unit 50
If boundary (that is, along profile of live part S1) between the S2 of part and extend, the scribing line 10,20 includes: the first scribing line
10, have straight line portion 11 and curve part 12；And second scribing line 20, first scribing line 10 curve part 12 outside void
If part S2 is formed from the center of substrate S with radiated entend.
First scribing line 10 for distinguishing the live part S1 and dummy portions S2 of substrate S, can along live part S1 and
The boundary line part of dummy portions S2 extends.First scribing line 10 includes multiple straight line portions 11 and multiple curve parts 12.Multiple straight line portions
11 and multiple curve parts 12 can be alternatively formed.
By the score wheel (not shown) for being installed on scribe head 52 apply pressure to the upper surface of substrate S in the state of, make score wheel
And/or substrate S level relatively moves and forms the first scribing line 10.But the first scribing line 10 includes multiple curve parts 12, therefore,
Multiple curve parts 12 are critically processed in order to finer, laser is preferably used to be formed in the first scribing line 10.At this point it is possible to
Laser beam is irradiated from scribe head 52 to substrate S, so that the spot of laser beam is located at the inside of substrate S, and by by scribe head 52
And/or substrate S level relatively moves and forms the first scribing line 10.
For this purpose, base plate processing device may include laser beam irradiation unit (not shown), it is used to irradiate on substrate S and swashs
Light beam and form the first scribing line 10.
Second scribing line 20 can be used score wheel and be formed, and laser beam also can be used and formed.First scribing line 10 and second stroke
Line 20 is all formed using score wheel or using laser beam come when being formed, scribing unit 50 can have a type of scribe head
52.First scribing line 10 is formed using laser beam, and the second scribing line 20 is using score wheel come when being formed, scribing unit 50 can have
Two kinds of scribe heads 52.
For this purpose, base plate processing device may include score wheel (not shown), be configured as stressing on substrate S and relative to
Substrate is mobile and forms the second scribing line 20.
As shown in Figures 3 and 4, the second scribing line 20 can be formed at the void in the outside of the curve part 12 of the first scribing line 10
If in a part of part S2.The center that substrate S is subject in second scribing line 20, substantially in (radial) the extension shape of radial direction
At.For example, the second scribing line 20 can extend from the center of the curve part 12 of the first scribing line 10 towards outer radius direction.Second stroke
Line 20 is connect with the curve part 12 of the first scribing line 10.
As another example, the second scribing line 20 can be spaced apart preset space length with the curve part 12 of the first scribing line 10.Second stroke
Line 20 and the curve part 12 of the first scribing line 10 are spaced when being arranged, when the second scribing line 20 of being subject to disconnects substrate S, the disconnection of substrate S
Influencing to the first 10 brings of scribing line can be smaller.
Multiple second scribing line 20 can correspond respectively to multiple curve parts 12 of the first scribing line 10 and be formed.That is, second stroke
The quantity of line 20 can be identical as the quantity of curve part 12 of the first scribing line 10.
Dummy portions S2 can be divided into multiple cutting parts 30 by multiple second scribing line 20.That is, multiple cutting parts 30 can
To be divided by multiple second scribing line 20.Multiple cutting parts 30 can be configured along the direction that the first scribing line 10 extends.
Fig. 2 is referred again to, sliver unit 60 includes: workbench 61, for loading substrate S；And polishing head 62 comprising logical
It is overpressurized the dummy portions S2 for being loaded into the substrate S of workbench 61 and by dummy portions S2 from live part S1 separation/removal
Pressing member 65.
Workbench 61 is arranged on the guide rail 63 that the direction (Y direction) of transfer substrate S extends, and can be along guide rail
63 is mobile to Y direction.Workbench 61 can move and be located at the lower section of polishing head 62 to Y direction along guide rail 63, as a result,
The dummy portions S2 for being installed on the substrate S of workbench 61 is pressurized the pressurization of component 65 and is removed.
The opposite side of the side towards polishing head 62 of workbench 61 has substrate transfer unit 70.Substrate transfer unit 70
Play the role of the transferring substrates S between the loading stage 51 of scribing unit 50 and the workbench 61 of sliver unit 60.Substrate transmitting
Unit 70 includes: the framework 71 extended along X-direction；And pick-up head 72, framework can be movably set to X-direction
71, for clamping or vacuum suction substrate S.Substrate transfer unit 70, which plays, to form scribing line 10,20 by scribing unit 50
Substrate is transferred to the effect of the workbench 61 of sliver unit 60 from the loading stage 51 of scribing unit 50.
According to the base plate processing device in the utility model embodiment, scribing unit 50, sliver unit 60 and substrate are passed
It passs unit 70 to be set on a device, so as to complete to form the work of scribing line 10,20 in substrate S on one device together
Sequence and the process for dividing substrate S along scribing line 10,20.
In addition, workbench 61 is towards having unloading unit 80, the unloading unit in the opposite side of the side of polishing head 62
80 are eliminated the substrate S of dummy portions S2 to external removal by sliver unit 60.
As shown in Figures 5 to 7, workbench 61 includes: ontology 611；Protrude from ontology 611 and the base for placing substrate S
Plate placement section 612；And support portion 613, it is configured at the outer periphery of substrate placement section 612, and protrude with right from ontology 611
It should be arranged in the certain point in the second scribing line 20.
Substrate placement section 612 can have size corresponding with the size of the live part S1 of substrate S and area and area.
Substrate S can be placed in substrate placement section 612 and live part S1 is made to correspond to substrate placement section 612.It is placed in substrate S
In the state of substrate placement section 612, the dummy portions S2 of substrate S can protrude outward from the side of substrate placement section 612.
That is, the upper surface of dummy portions S2 and the ontology 611 of workbench 61 can be spaced apart.Therefore, substrate placement section is placed in substrate S
In the state of 612, by being pressurizeed dummy portions S2 by pressing member 65, dummy portions S2 can be along scribing line 10,20 from effective
Part S1 separation.
Such as Fig. 6 and Fig. 7, multiple support portions 613 can be configured at corresponding with the position for forming multiple second scribing line 20
Position.Support portion 613 can be formed as pin-shaped shape.But the utility model is not limited by 613 shape of support portion.For example, branch
Support part 613 can be formed as the cleat shape extended along the extending direction of the second scribing line 20.The branch contacted with the surface of substrate S
It the surface (upper end of support portion 613) of support part 613 can be with surface (the substrate placement for the substrate placement section 612 for being placed with substrate S
The upper side in portion 612) it is same plane.As a result, when substrate S is placed in substrate placement section 612, substrate S can steadily be connect
It touches in support portion 613.
Polishing head 62 includes mobile module 67, and the mobile module is connect by connecting component 66 with pressing member 65, will
Pressing member 65 is mobile to vertical direction (Z-direction) relative to substrate S.Mobile module 67 can be through pneumatics or oil pressure
The actuator of operating, the linear motor by electromagnetic interaction operating or ball screw isoline mobile mechanism.
As shown in Fig. 5 to Figure 11, pressing member 65 includes ontology 651 and pressurization part 652, and the pressurization part 652 is from ontology
651 protrusions are formed with corresponding with the shape of dummy portions.
Pressurization part 652 can have the pressurized plane contacted with the surface of dummy portions S2.Pressurization part 652 is around ontology 651
Center is formed in peripheral direction.
Pressurization part 652 is integrally formed with the shape corresponding to dummy portions S2.For example, although it is not shown, when without in base
When plate S forms notch N, the dummy portions S2 of substrate S is formed about the substantially quadrangle ring-shaped of live part S1, pressurization part
652 may be formed integrally as the quadrangle ring-shaped of the shape corresponding to dummy portions S2.
As another example, multiple pressurization parts 652 can be separated on the peripheral direction of substrate S and be formed.
In particular, needing as shown in Fig. 6 and Figure 12 when substrate S forms notch N, corresponding to the position of the notch N of substrate S
Setting can separate to form multiple pressurization parts 652 on the peripheral direction of substrate S.That is, multiple pressurization parts 652 can be set in void
If each section of part S2.
In addition, multiple pressurization parts 652 can separate preset space length between each other.Multiple pressurization parts 652 separate between each other
When predetermined space, interval can be greater than the size (diameter, width) of 613 upper end of support portion of workbench 61.Therefore, adjacent
Void across a support portion 613 among a pair of of pressurization part 652, in two opposite sides pressurization 613 two sides of support portion of support portion 613
If part S2.
The multiple cutting parts 30 divided by multiple second scribing line 20 at this point, multiple pressurization parts 652 can pressurize respectively.It is multiple
Pressurization part 652 can correspond respectively to be configured by multiple cutting parts 30 that multiple second scribing line 20 divide.Therefore, a pair of of pressurization
Portion 652 can pressurize a pair of of cutting part across second 20 (that is, across support portions 613) of scribing line in the two opposite sides of support portion 613
30, as a result, a pair of of cutting part 30 by between it the second scribing line 20 and support portion 613 bend and be easy to be disconnected.
Also, according to the characteristic of substrate S (that is, the width of the length of the straight line portion of the first scribing line and curve part, dummy portions
And/or length, the respective length of multiple cutting parts 30, width, size, shape etc.) come set the multiple cutting parts 30 of pressurization and from
The sequence of live part S1 removal cutting part 30.
As an example, multiple pressurization parts 652 can be pressurizeed simultaneously by multiple cutting parts 30 of multiple second scribing line, 20 divisions,
To which multiple cutting parts 30 be separated from live part S1 simultaneously.
As another example, multiple pressurization parts 652 successively pressurize by it is multiple second scribing line 20 divide multiple cutting parts 30, from
And multiple cutting parts 30 successively can be separated from live part S1.
For this purpose, the pressurized plane of each pressurization part and the interval of substrate S can be different in multiple second pressurization parts 652
Setting.That is, multiple second pressurization parts 652 can be protruded with different distance from ontology 651.
Structure as above can be adapted for being formed towards the center of substrate S on substrate S with the notch N's of preset width indent
In process.
It as can be seen from figures 8 and 9, can be with curved more towards mutually opposite direction in order to form notch N in substrate S
The mode that a curve part 12 alternates configuration forms the first scribing line 10.And it is possible to form multiple second scribing line 20 with correspondence
In multiple curve parts 12.Dummy portions S2 is divided according to multiple second scribing line 20 as a result, are as follows: positioned at the first of the center of notch N
Cutting part 31；It is configured at the second cutting part 32 of the two sides of the first cutting part 31；And positioned at the outer of a pair of second cutting part 32
Multiple third cutting parts 33 of side.
As another example, as shown in Figure 10, multiple curve parts 12 can be configured, allow to be formed four third segmentations
Portion 33.
First cutting part 31 is set to the center of notch N.It is separated to make the first cutting part 31 be easy disconnection, first
The inside of cutting part 31 is also formed with third scribing line 21.The center that substrate S is subject in third scribing line 21, substantially with radial direction
It is (radial) to extend.The quantity for being formed in the third scribing line 21 inside the first cutting part 31 can be according to the width of the first cutting part 31
Degree and/or length and determine.If the width and/or length of the first cutting part 31 are larger, it is formed in inside the first cutting part 31
Third scribing line 21 quantity will increase.
Second cutting part 32 is the part being disposed adjacent with a pair of of curve part 12, therefore, when the second cutting part 32 is pressurized
When plus-pressure be not easy to be transmitted to the second cutting part 32, the second cutting part 32 is not easy to be disconnected.Also, the second cutting part 32 exists
It is contacted respectively between first cutting part 31 and third cutting part 33 with the first cutting part 31 and third cutting part 33, therefore second point
Portion 32 is cut to be not easy to be disconnected.As a result, in order in the continuously configuration of the first cutting part 31, the second cutting part 32, third cutting part 33
Structure in effectively remove the first cutting part 31, the second cutting part 32, third cutting part 33, it is preferable that finally remove second point
Cut portion 32.
As an example, the first cutting part 31 and third cutting part 33 can be pressurized simultaneously and remove.And then pressurization is gone
Except the second cutting part 32.For this purpose, as shown in figure 11, locating for the pressurized plane of the pressurization part 652 for first cutting part 31 that pressurizes
Plane A1 locating for pressurized plane of the plane A1 with the pressurization part 652 for the third cutting part 33 that pressurizes can be generally aligned in the same plane.
Also, for pressurize the first cutting part 31 and third cutting part 33 pressurization part 652 pressurized plane locating for plane A1 compared to
Plane A3 locating for the pressurized plane of pressurization part 652 for second cutting part 32 that pressurizes is closer to substrate S.
As another example, can first pressurize after removing third cutting part 33, pressurization the first cutting part 31 of removal, pressurization removal
Repressurization removes the second pressurization part 32 after first cutting part 31.For this purpose, as shown in figure 12, for adding for the third cutting part 33 that pressurizes
Locating for pressurized plane of the plane A1 locating for the pressurized plane of splenium 652 compared to the pressurization part 652 for first cutting part 31 that pressurizes
Plane A2 closer to substrate S.Also, plane A2 locating for the pressurized plane of the pressurization part 652 for first cutting part 31 that pressurizes
Plane A3 locating for pressurized plane compared to the pressurization part 652 for second cutting part 32 that pressurizes is closer to substrate S.
Furthermore when forming multiple third scribing line 21 inside the first cutting part 31, the first cutting part 31 is drawn by multiple thirds
Line 21 is divided into multiple sub- cutting parts 311,312.Also, multiple sub- cutting parts 311,312 include the center for being configured at notch N
First sub- cutting part 311 and the second sub- cutting part 312 for being configured at the first sub- 311 two sides of cutting part.At this point, in order to effectively add
Pressure the first cutting part 31 of removal, it is preferable that after the first sub- cutting part 311 of first pressurization removal, then repressurization removes the second son
Cutting part 312.That is, the multiple sub- cutting parts 311,312 divided by multiple thirds scribing line 21 inside the first cutting part 31 are from cutting
The center of mouth N is successively pressurized removal to two side directions of notch N.For this purpose, corresponding respectively to the first sub- cutting part 311 and second
The pressurized plane of the pressurization part 652 of sub- cutting part 312 can be different relative to the position of substrate S.
According to the base plate processing device in the utility model embodiment, along the live part S1 and dummy portions of substrate S
The boundary line of S2 forms the first scribing line 10 for having straight line portion 11 and curve part 12, in the outside shape of the curve part 12 of the first scribing line 10
At from the center of substrate S, with the second scribing line 20 of radiated entend, 20 position of the second scribing line is positioned corresponding in support portion 613
Under state, pressurizeed respectively in the two opposite sides of support portion 613 by multiple cutting parts 30 of 20 division of the second scribing line, so as to keep away
Exempt from that slight crack or breakage occurs in the live part S1 of substrate S, can smoothly effectively be removed from the live part S1 of substrate S illusory
Part S2.
Also, according to the base plate processing device in the utility model embodiment, it is not necessary that carry out for removing illusory portion
Divide the grinding and cleaning of S2.Thus, it is possible to prevent because of the problems in conventional art brought by grinding process and cleaning process.
Also, it is being constituted according to the base plate processing device in the utility model embodiment in order to form notch N in substrate S
Dummy portions S2 inside notch N is additionally formed multiple third scribing line 21, successively pressurizes and removes to two sides from the center of notch N
The multiple sub- cutting parts 311,312 divided by multiple thirds scribing line 21, so as to easily form notch N in substrate S.
Although illustrating the preferred embodiment of the utility model, the scope of the utility model is not limited to above-mentioned
Specific embodiment can be suitably changed in the range recorded in claim.
Claims (11)
1. a kind of base plate processing device, wherein the base plate processing device includes:
Scribing unit is used to form the first scribing line and the second scribing line, the described first live part and void crossed along substrate
If the boundary line between part extends to form, second scribing line is prolonged in the dummy portions from the center of the substrate with radial
It stretches to be formed；And
Sliver unit, be used to pressurize respectively the multiple cutting parts divided by second scribing line, by the dummy portions from institute
State live part separation.
2. base plate processing device according to claim 1, wherein first scribing line includes straight line portion and curve part, institute
The second scribing line is stated to be formed on the outside of the curve part of first scribing line.
3. base plate processing device according to claim 1, wherein it is described second scribing line with it is described first scribing line connection or
Second scribing line is spaced apart with first scribing line.
4. base plate processing device according to claim 1, further includes:
Laser beam irradiation unit is used to irradiate laser beam on substrate and form first scribing line, and
Score wheel is configured as stressing on the substrate and forms second scribing line relative to the substrate movement.
5. base plate processing device according to claim 1, wherein the sliver unit includes:
Workbench has the substrate placement section for placing the substrate；
Pressing member comprising pressurization part, the pressurization part have the pressurized plane of the dummy portions for the substrate that pressurizes；With
And
The pressing member is moved to the substrate for being placed in the workbench by mobile module.
6. base plate processing device according to claim 5, wherein the workbench has the void for being used to support the substrate
If partial support portion.
7. base plate processing device according to claim 6, wherein the support portion corresponds to certain in second scribing line
One point setting.
8. base plate processing device according to claim 7, wherein
The pressing member includes multiple pressurization parts, and the multiple pressurization part separates configuration between each other, across the support portion,
It pressurizes the dummy portions of the support portion two sides in the two opposite sides of the support portion.
9. base plate processing device according to claim 5, wherein
The pressing member includes multiple pressurization parts, the pressurized plane of the multiple pressurization part relative to the substrate position not
Together.
10. base plate processing device according to claim 1, wherein further include substrate transfer unit, the substrate transmitting is single
Member is configured between the scribing unit and the sliver unit, and the first scribing line and second stroke will be formed by the scribing unit
The substrate of line is transferred to the sliver unit from the scribing unit.
11. base plate processing device according to claim 1, wherein it further include base plate alignment unit, the base plate alignment list
Member is set to the side of the scribing unit, and including multiple compression modules, and the multiple compression module pressurizes the substrate
When more than two among and it is directed at the position of the substrate.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2018-0059111 | 2018-05-24 | ||
| KR1020180059111A KR102147129B1 (en) | 2018-05-24 | 2018-05-24 | Substrate processing apparatus |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209567996U true CN209567996U (en) | 2019-11-01 |
Family
ID=68321001
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821912428.3U Expired - Fee Related CN209567996U (en) | 2018-05-24 | 2018-11-20 | Base plate processing device |
Country Status (2)
| Country | Link |
|---|---|
| KR (1) | KR102147129B1 (en) |
| CN (1) | CN209567996U (en) |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004217492A (en) * | 2003-01-17 | 2004-08-05 | Murakami Corp | Method of cutting out glass plate |
| KR101195600B1 (en) * | 2010-07-07 | 2012-10-29 | 주식회사 이오테크닉스 | Laser breaking method |
| KR101195601B1 (en) * | 2010-07-07 | 2012-10-29 | 주식회사 이오테크닉스 | Lasercutting method and breaking apparatus |
| KR101297556B1 (en) * | 2010-10-08 | 2013-08-14 | 주식회사 로보스타 | Cutting equipment of glass substrate |
-
2018
- 2018-05-24 KR KR1020180059111A patent/KR102147129B1/en active IP Right Grant
- 2018-11-20 CN CN201821912428.3U patent/CN209567996U/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| KR20190134007A (en) | 2019-12-04 |
| KR102147129B1 (en) | 2020-08-25 |
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