CN109824261A - Cutter for substrate and method for dividing substrate - Google Patents

Cutter for substrate and method for dividing substrate Download PDF

Info

Publication number
CN109824261A
CN109824261A CN201811404723.2A CN201811404723A CN109824261A CN 109824261 A CN109824261 A CN 109824261A CN 201811404723 A CN201811404723 A CN 201811404723A CN 109824261 A CN109824261 A CN 109824261A
Authority
CN
China
Prior art keywords
substrate
plate
cutting wheel
module
cutter
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN201811404723.2A
Other languages
Chinese (zh)
Other versions
CN109824261B (en
Inventor
郑下震
朴智雄
赵晋完
郑在晳
金东明
金范锡
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Top Engineering Co Ltd
Original Assignee
Top Engineering Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Top Engineering Co Ltd filed Critical Top Engineering Co Ltd
Publication of CN109824261A publication Critical patent/CN109824261A/en
Application granted granted Critical
Publication of CN109824261B publication Critical patent/CN109824261B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/682—Mask-wafer alignment
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P40/00—Technologies relating to the processing of minerals
    • Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
    • Y02P40/57—Improving the yield, e-g- reduction of reject rates

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

Cutter for substrate and method for dividing substrate in the embodiment of the present invention comprising: cutting wheel module has cutting wheel；First plate and the second plate, first plate and the second plate are respectively arranged at the two sides of the cutting wheel module；And plate declines module, in the base plate transfer to first plate and the second plate, the plate decline module declines second plate in the Z-axis direction relative to first plate.

Description

Cutter for substrate and method for dividing substrate
Technical field
The present invention relates to a kind of cutter for substrate and method for dividing substrate, are used for cutting substrate.
Background technique
It is commonly used for the liquid crystal display panel, organic EL display panel, inorganic EL of flat-panel monitor Display pannel, transmission projection substrate, reflective projection substrate etc. use unit glass panel (hereinafter referred to as " unit substrate "), institute Stating unit glass panel is by will such as glass brittleness mother glass panel (hereinafter referred to as " substrate ") be cut to predetermine sizes And it obtains.
The process of cutting substrate includes: dicing processes and sliver process, and the dicing processes are along desire cutting substrate Preset lines, which are pressed and moved by the score wheel as made of the materials such as diamond, forms scribing line, and the sliver process be by along Scribing line pressing substrate carrys out cutting substrate with obtaining unit substrate.
It as a result, for cutting substrate, needs to be individually performed dicing processes and sliver process, asks there is process is increased Topic.Thus, it is desirable to which a kind of cutter for substrate, can also hold it is not necessary that the sliver process for carrying out press perpendicular to substrate is individually performed It changes places substrate cut and separates.And it is further desired that a kind of scheme, can during substrate is separated by cutting, Prevent the support plate of substrate and supporting substrate from clashing.
Existing technical literature
Patent document
KR published patent the 10-2007-0070824th (2007.07.04)
Summary of the invention
In order to solve above-mentioned the problems of the prior art, it is an object of that present invention to provide a kind of cutter for substrate and substrates The support plate of cutting method, the leading end and supporting substrate that prevent substrate clashes, it may thereby be ensured that substrate is not damaged.
In order to achieve the above object, the present invention provides a kind of cutter for substrate comprising: cutting wheel module has Cutting wheel；First plate and the second plate, first plate and the second plate are respectively arranged at the two sides of the cutting wheel module；And plate Decline module, in base plate transfer to first plate and the second plate, the plate decline module makes second plate relative to institute The first plate is stated to decline in the Z-axis direction.
In the base plate transfer to first plate and second plate, first plate and second plate are to described Substrate injection gas floats the substrate, adsorbs the substrate when the cutting wheel presses to the substrate.
The present invention provides a kind of cutter for substrate, further includes: mobile device is connected to second plate, makes described Second plate is relative to first plate along the y axis far from mobile.
The present invention provides a kind of cutter for substrate, further includes: guide rail extends, the mobile device along the Y direction It is moved along the guide rail.
Cutter for substrate in the embodiment of the present invention, comprising: aligned units determine the position for the substrate being externally entering It sets；First cutter unit comprising the cutting wheel module, first cutter unit is in the first face of the substrate and second Face is respectively formed the first X-axis cutting line and the second X-axis cutting line for being parallel to X-direction；Second cutter unit, in the substrate The first face be formed in parallel with the first Y-axis cutting line of Y direction；Substrate roll-over unit forms the cutting of the first Y-axis for overturning The substrate of line；And third cutter unit, the second Y-axis cutting of Y direction is formed in parallel with for the second face in the substrate Line.
The aligned units include: multiple conveyer belts, are extended to the Y direction and in the X-direction with predetermined Interval is spaced apart；Conveyer belt lifting device goes up and down the multiple conveyer belt；Multiple flotation gears are set to the multiple For floating the substrate between conveyer belt；Multiple pressurizing devices, be used to pressurize the institute floated by the multiple flotation gear State the side of substrate.
First cutter unit includes: to extended first framework of the X-direction；At least a pair of first head, It can movably be set to first framework to X-direction, and be oppositely arranged in the Z-axis direction, it is described at least first a pair of Portion includes: the first cutting wheel and the second cutting wheel, and first cutting wheel is separated in the Z-axis direction with second cutting wheel and set It sets, and has cutting wheel respectively；First roller module and the second roller module, first roller module and second roller Module is spaced apart in the Z-axis direction, and has roller respectively, the cutting wheel of the first cutting wheel module and second roller The roller of submodule is mutually aligned setting, the roller phase of the cutting wheel of the second cutting wheel module and first roller module Mutually alignment setting.
The cutting wheel of the cutting wheel of the first cutting wheel module and the second cutting wheel module in the Y-axis direction every It opens.
Method for dividing substrate in the embodiment of the present invention, comprising: base plate transfer step, by base plate transfer to being provided adjacent to First plate and the second plate；Cutting line forming step is moved on substrate by cutting wheel module, forms cutting line on substrate； In the base plate transfer to first plate and the second plate, make second plate relative to first plate under Z-direction The step of drop.
Method for dividing substrate in the embodiment of the present invention, further includes: substrate floating steps, in base plate transfer to described first When plate and second plate, float the substrate；And substrate adsorption step, when the cutting wheel presses to the substrate Adsorb the substrate.
Invention effect
Cutter for substrate and method for dividing substrate in embodiment present invention as described above, substrate to the first plate and When second plate is mobile, module is declined by plate, declines the second plate in Z-direction relative to the first plate, thus it can be prevented that base The leading end of plate and the front end of the second plate clash, and can also prevent the breakage of substrate as a result,.
Detailed description of the invention
Fig. 1 is the module map that cutter for substrate in the embodiment of the present invention is outlined.
Fig. 2 is the generalized schematic for indicating the substrate cut by the cutter for substrate in the embodiment of the present invention.
Fig. 3 is the side view that the aligned units of cutter for substrate in the embodiment of the present invention are outlined.
Fig. 4 is the top view that the aligned units of cutter for substrate in the embodiment of the present invention are outlined.
Fig. 5 is the side view that the aligned units of cutter for substrate in the embodiment of the present invention are outlined.
Fig. 6 be the first transfer unit that cutter for substrate in the embodiment of the present invention is outlined, the first cutter unit and The top view of second transfer unit.
Fig. 7 and Fig. 8 is the first transfer unit that cutter for substrate in the embodiment of the present invention is outlined, the first cutting list The side view of member and the second transfer unit.
Fig. 9 is the side view that the presser unit of the first transfer unit of cutter for substrate in the embodiment of the present invention is outlined Figure.
Figure 10 to Figure 13 is the signal that the first plate and the second plate of cutter for substrate in the embodiment of the present invention is outlined Figure.
Figure 14 is the control module figure for the cutter for substrate being outlined in the embodiment of the present invention.
Figure 15 to Figure 25 is successively to indicate the first transfer unit of cutter for substrate in the embodiment of the present invention, the first cutting The schematic diagram of the operational process of unit and the second transfer unit.
Figure 26 is the second transfer unit and the second cutter unit that cutter for substrate in the embodiment of the present invention is outlined Side view.
Figure 27 to 29 is that the second transfer unit of the cutter for substrate from the embodiment of the present invention is outlined to cut to second Cut the schematic diagram of the process of unit transferring substrates.
Figure 30 is the top view that the second cutter unit of cutter for substrate in the embodiment of the present invention is outlined.
Figure 31 is the second cutter unit and substrate roll-over unit that cutter for substrate in the embodiment of the present invention is outlined Side view.
Figure 32 to Figure 37 is that the operation of the substrate roll-over unit of cutter for substrate in the embodiment of the present invention illustrates schematic diagram.
Figure 38 is the substrate roll-over unit and third cutter unit that cutter for substrate in the embodiment of the present invention is outlined Side view.
Figure 39 is the top view that the third cutter unit of cutter for substrate in the embodiment of the present invention is outlined.
Figure 40 is the side view that third transfer unit in the embodiment of the present invention is outlined.
Figure 41 is the schematic diagram that third transfer unit in the embodiment of the present invention is outlined.
Figure 42 is the control module figure of third transfer unit in the embodiment of the present invention.
Appended drawing reference:
100: 200: the first cutter unit of aligned units
300: the second cutter units 400: substrate roll-over unit
500: 600: the first transfer unit of third cutter unit
700: the second transfer units 800: third transfer unit
900: illusory removal unit S: substrate
S1: the first the S2: the second face of face
Specific embodiment
Hereinafter, being illustrated referring to attached drawing to the cutter for substrate in the embodiment of the present invention.
The object of cutter for substrate cutting according to an embodiment of the present invention is that first substrate and the second substrate are bonded to be formed Adhesive substrates.For example, first substrate may include thin film transistor (TFT), the second substrate may include colour filter, be also possible to phase Antistructure.Hereinafter, adhesive substrates are referred to as substrate, the surface of first substrate exposed to the outside is known as the first face, it will be sudden and violent The surface for being exposed to external the second substrate is known as the second face.Wherein, substrate has defined flexibility.
Also, the transfer direction for executing the substrate of substrate cut process is defined as Y direction to see, with base plate transfer direction The direction definition that (Y direction) intersects is X-direction.Also, the direction definition that will be perpendicular to place the X-Y plane of substrate is Z Axis direction.
As shown in Figures 1 and 2, cutter for substrate includes: aligned units 100 in the embodiment of the present invention, is determined from outer The position for the substrate that portion enters；First cutter unit 200 is respectively formed in parallel in the first face S1 and the second face S2 of substrate S In the first X-axis cutting line XL1 and the second X-axis cutting line XL2 of X-direction；Second cutter unit 300, the first of substrate S Face S1 is formed in parallel with the first Y-axis cutting line YL1 of Y direction；Substrate roll-over unit 400 is formed with the first Y-axis for overturning The substrate S of cutting line YL1；Third cutter unit 500 is formed in parallel with the second Y-axis of Y direction in the second face S2 of substrate S Cutting line YL2；First transfer unit 600 is set between aligned units 100 and the first cutter unit 200, by substrate from right Quasi- unit 100 is transferred to the first cutter unit 200；Second transfer unit 700 is set to the first cutter unit 200 and second Between cutter unit 300, substrate is transferred to the second cutter unit 300 from the first cutter unit 200；Third transfer unit 800, The substrate cut by third cutter unit 500 is sent to outside by it；Control unit 1000 is used for control base board cutter device Structural elements operation.
Aligned units 100, the first cutter unit 200, the second cutter unit 300, substrate roll-over unit 400, third cutting Unit 500 is parallel to surface water level land and is arranged in a row.Therefore, substrate S is along aligned units 100, the first cutter unit 200, Two cutter units 300, substrate roll-over unit 400, the transfer of 500 horizontal continuity of third cutter unit, substrate S is cut in the process It cuts.
As shown in Fig. 2, the cutter for substrate in the embodiment of the present invention is distinguished in the first face S1 and the second face S2 of substrate S The first X-axis cutting line XL1 and the second X-axis cutting line XL2 is formed, forms the first Y-axis cutting line YL1 in the first face S1 of substrate S Afterwards, substrate S is overturn centered on X-axis, the second Y-axis cutting line YL2 is formed in the second face S2 of substrate S, so that substrate S be cut For unit substrate.But the present invention is not limited to cutting line forming methods as shown in Figure 2, and as an example, as shown in Figure 2 the Two X-axis cutting line XL2 can be formed in the either side of the first X-axis cutting line XL1 in the Y-axis direction.
As shown in Figures 3 to 5, aligned units 100 include: multiple belts 110, the direction (Y-axis transferred to substrate S Direction) extend, and be spaced apart at a predetermined interval in the X-axis direction；Belt lifting device 120, for going up and down multiple belts 110；Multiple flotation gears 130 are set between multiple belts 110, for floating substrate S；Multiple pressurizing devices 140 are used In the side for the substrate S that pressurization is floated by multiple flotation gears 130.
Multiple belts 110 are supported by multiple belt wheels 111 respectively.At least one of multiple belt wheels 111, which are to provide, to be used for Rotate the driving pulley of the driving force of belt 110.
Belt lifting device 120 can be actuator, the root run by pneumatics or oil pressure connecting with multiple belt wheels 111 According to the linear motor or ball screw device isoline mobile device of electromagnetic interaction operation.
Multiple flotation gears 130 may include the multiple gas nozzles 131 connecting with gas supply source (not shown).It is multiple Gas nozzle 131 is spaced apart at a predetermined interval in the Y-axis direction.
Pressurizing device 140 may be configured as two or more, be directed at substrate S on an x-y plane by pressurization, more than two Pressurizing device 140 is in X-direction or Y direction setting opposite to one another.Each pressurizing device 140 includes: pressing member 141, is used for The side of pressurization substrate S；Pressing member mobile device 142, by pressing member 141 to the direction towards substrate S or far from base The direction of plate S is mobile.Multiple pressurizing devices 140 respectively include pressing member 141, and multiple pressing members 141 are configured to add Press at least two sides of substrate S.Pressing member 141 has shape corresponding with the side of substrate S, in order to the substrate S that presses Side.Another example, pressing member 141 can have shape corresponding with the corner of substrate S, in order to press substrate S's Corner.
According to structure as above, as shown in figure 3, during substrate S is fed through aligned units 100 from outside, multiple bands Son 110 maintains the state risen compared to multiple flotation gears 130.Also, with the rotation of multiple belts 110, substrate S can It is moved to the predetermined position between multiple pressing members 141.
Also, as shown in Figures 4 and 5, when substrate S is moved to the predetermined position on multiple belts 110, then multiple belts While 110 decline, gas is sprayed from gas nozzle 131 to substrate S, substrate S is floated under the action of spraying gas.
Also, in the state that substrate S is floated, under the operating of pressing member mobile device 142, pressing member 141 The side of pressurization substrate S, substrate S is translated or is rotated and determined position and the posture of substrate S as a result,.
After the position of substrate S and posture determine, interrupts from gas nozzle 131 and spray gas, and on multiple belts 110 It rises, therefore, substrate S can be supported in the state that its position determines by multiple belts 110.
In addition, substrate S is sent out from aligned units 100 according to the rotation of multiple belts 110, and at the same time, the first sheet Member 600 runs and substrate S is transferred to the first cutter unit 200.
As shown in Figures 6 to 9, the first transfer unit 600 includes: multiple belts 610, is used to support substrate S；Shuttle unit 620, it is set to and is adsorbed between aligned units 100 and the first cutter unit 200 and transfer substrate S；First holding unit 630, For holding the rear row end for the substrate S being supported on multiple belts 610；First guide rail 640 connects with the first holding unit 630 It connects and extends to Y direction；Presser unit 650, when substrate S is fed through on multiple belts 610, the rear row end for the substrate S that pressurizes And it is directed at substrate S；First plate 660 is adjacent to the setting of the first cutter unit 200, the branch support group for floating or sorbing substrate S Plate S.
The separated from each other setting in the X-axis direction of multiple belts 610.Each belt 610 is supported by multiple belt wheels 611, more At least one of a belt wheel 611 can be to provide the driving pulley of the driving force of rotation belt 610.
Multiple belts 610 of first transfer unit 600 are adjacent to multiple belts 110 of aligned units 100 and are set to same In one plane, substrate S can be transferred directly to multiple bands of the first transfer unit 600 from multiple belts 110 of aligned units 100 Son 610.
As shown in fig. 6, shuttle unit 620 includes to the extended guide rail 621 of Y direction, can wear along what guide rail 621 moved Shuttle component 622, the shuttle component lifting device 623 for going up and down shuttle component 622 to Z-direction.
It is can be set between shuttle component 622 and guide rail 621 by pneumatics or the actuator of oil pressure operation, according to electromagnetism phase The linear motor or ball screw device isoline mobile device of interaction operation.As an example, the linear movement equipment can To be connected to shuttle component 622 and/or guide rail 621.Shuttle component 622 can be by linear movement equipment along guide rail as a result, 621 is mobile to Y direction.
Guide rail 621 extends to aligned units 100, and shuttle component 622 can be moved to first from aligned units 100 as a result, Transfer unit 600.
Shuttle component 622 is connect with vacuum source carrys out sorbing substrate S.As a result, as shuttle component 622 is sorbing substrate S's Mobile to Y direction under state, substrate S can be mobile to Y direction.
Shuttle component 622 moves back and forth in aligned units 100 and the first transfer unit 600, executes substrate S from alignment Unit 100 is transferred to the effect of the first transfer unit 600.
Shuttle component lifting device 623 may include the cause run by pneumatics or oil pressure connecting with shuttle component 622 Move device, according to the linear motor or ball screw device isoline mobile device of electromagnetic interaction operation.In transfer substrate S When, shuttle component lifting device 623 rises shuttle component 622 and makes 622 sorbing substrate S of shuttle component.Also, substrate S is worn After shuttle component 622 is transferred to the first transfer unit 600, shuttle component lifting device 623 declines shuttle component 622 to prevent from shuttling Component 622 and substrate S, propeller 652 and the first holding unit 630 interfere with each other.
Can be set between first holding unit 630 and the first guide rail 640 by pneumatics or oil pressure operation actuator, According to the linear motor or ball screw device isoline mobile device of electromagnetic interaction operation.As an example, above-mentioned straight line Mobile device is connected to the first holding unit 630 and/or the first guide rail 640.
Therefore, in the state that the first holding unit 630 holds substrate S, the first holding unit 630 is set by linear movement Standby mobile to Y direction, substrate S can be transferred to Y direction.At this point, multiple belts 610 are with the first holding unit 630 It moves and rotates together with, so as to steadily supporting substrate S.
First holding unit 630 includes extending and being connected to the support rod 631 of the first guide rail 640 and to X-direction with more A holding component 632 for being set to support rod 631 and holding substrate S.Holding component 632 can be pressurization and is able to maintain that substrate The fixture of the posture of S.Another example, holding component 632 can have the vacuum hole connecting with vacuum source and carry out sorbing substrate S.
Presser unit 650 include to the extended guide rail 651 of Y direction, can along the propeller 652 that guide rail 651 moves and The propeller lifting device 653 that propeller 652 is gone up and down to Z-direction.
It is can be set between propeller 652 and guide rail 651 by pneumatics or the actuator of oil pressure operation, according to electromagnetism phase The linear motor or ball screw device isoline mobile device of interaction operation.Propeller 652 can be moved by straight line as a result, Dynamic device is moved along guide rail 651 to Y direction.
Propeller lifting device 653 may include actuator, the root run by pneumatics or oil pressure connecting with propeller 652 According to the linear motor or ball screw device isoline mobile device of electromagnetic interaction operation.Propeller lifting device 653 makes Propeller 652 rises, so that propeller 652 can press to the rear row end of substrate S, propeller 652 applies the rear row end of substrate S After pressure, 653 descent propulsion device 652 of propeller lifting device, to prevent propeller 652 and substrate S, shuttle component 622 and the One holding unit 630 interferes.
In the state that substrate S is located on multiple belts 610, presser unit 650 promotes the rear row end of substrate S, so that base Plate S is located at accurate position P.
As another example, 622 sorbing substrate S of shuttle component hold in advance transferred to Y direction during, substrate S Rear row end when passing through propeller 652, propeller 652 is mobile with the speed fast compared to the movement speed of substrate S and is contacted with Behind the rear row end of substrate S, propeller 652 can be synchronous with the movement speed of substrate S driven by shuttle component 622, with substrate S Identical speed is mobile.
As another example, during substrate S is transferred according to the rotation of multiple belts 610 to Y direction, propeller After 652 are contacted with the rear row end of substrate S with the movement speed fast compared to the movement speed of substrate S, propeller 652 and substrate S Movement speed it is synchronous, it is mobile with speed identical with substrate S.
By propeller 652 as described above, substrate S can be located at accurate position without moving reelingly on belt 610 It sets.
First plate 660 can float or sorbing substrate S.For example, could be formed with can be with gas on the surface of the first plate 660 Source of supply and multiple groove portions of vacuum source connection.When gas is supplied to multiple groove portions of the first plate 660 from gas supply source, base Plate S can be floated from the first plate 660.Also, gas is sucked into multiple groove portions of the first plate 660 under the action of vacuum source When, substrate S is adsorbed by the first plate 660.
In the state that substrate S is floated from the first plate 660, substrate S can be with the first plate 660 without frictionally moving.Also, During the first face S1 of substrate S and the second face S2 forms the first X-axis cutting line XL1 and the second X-axis cutting line XL2, base Plate S is adsorbed and is fixed on the first plate 660.
Such as Fig. 6 to Fig. 8, the first cutter unit 200 is respectively formed the first X-axis in the first face S1 and the second face S2 of substrate S Cutting line XL1 and the second X-axis cutting line XL2.
First cutter unit 200 includes that can be arranged to X-direction to extended first framework 210 of X-direction and movably In the first head 220 of the first framework 210.
Also, a pair of first head 220 is set to the first framework 210 opposite to each other in the Z-axis direction.
A pair of first head 220 includes: the first cutting wheel module and the second cutting wheel module 221, the first cutting wheel module And second cutting wheel module 221 be spaced apart in the Z-axis direction, and have cutting wheel 225 respectively；First roller module and second Roller module 222, the first roller module and the second roller module 222 are spaced apart in Z-direction, and have roller 229 respectively.
The cutting wheel 225 of first cutting wheel module 221 is aligned setting with the roller 229 of the second roller module 222, and second cuts The cutting wheel 225 for cutting wheel module 221 is aligned setting with the roller 229 of the first roller module 222.
The cutting wheel 225 of first cutting wheel module 221 and the roller 229 of the first roller module can apply pressure to the first face S1, the cutting wheel 225 of the second cutting wheel module 222 and the roller 229 of the second roller module can apply pressure to the second face S2.
Therefore, the state of the first face S1 and the second face S2 is applied pressure to respectively in multiple cutting wheels 225 and multiple rollers 229 Under, the first head 220 is mobile to X-direction relative to substrate S, so that being respectively formed the first X in the first face S1 and the second face S2 Axis cutting line XL1 and the second X-axis cutting line XL2.
Also, the cutting wheel 225 of the cutting wheel 225 of the first cutting wheel module 221 and the second cutting wheel module 221 can be It is separated in Y direction, the roller 229 of the roller 229 of the first roller module 222 and the second roller module 222 can be in Y direction On separate.The first X-axis cutting line XL1 and the second X-axis cutting line XL2 can be formed with being spaced from each other in the Y-axis direction as a result,.
As a result, as shown in Fig. 2, can form Y-axis stepped part YS after substrate S is cut, the Y-axis stepped part has phase When in the first X-axis cutting line XL1 and the second X-axis cutting line XL2 distance spaced apart from each other in the Y-axis direction, this Y-axis stepped part YS could be formed with wiring and/or the electrode etc. with wiring connection.
First cutting wheel module and the second cutting wheel module 221 can respectively include wheel mobile module 230, the wheel movement Module 230 is in order to make cutting wheel 225 pressurize to substrate S, to the mobile cutting wheel 225 of Z-direction.Cutting wheel 225 can pass through wheel Mobile module 230 is contacted with the surface of substrate S, and the surface of substrate S can be stressed on predetermined plus-pressure.For example, wheel movement Module 230 can be mobile to vertical (Z axis) direction by cutting wheel module 221 relative to substrate S so that cutting wheel 225 relative to Substrate S is vertically moved.Wheel mobile module 230 plays the role of adjusting position of the cutting wheel 225 relative to substrate S.
Wheel mobile module 230 can be to connect with cutting wheel module 221 and be cut by oil pressure or pneumatics to Z-direction is mobile Take turns the actuator of module 221.But the present invention is not limited to this structure, wheel mobile module 230 can be mutual by electromagnetism Act on the linear motor of operation or the linear moving apparatus such as ball screw.
Also, as shown in Figure 15 to Figure 25, the cutter for substrate in the embodiment of the present invention further includes illusory removal unit 900, hold the dummy portions (cullet (cullet), that is, do not make of the leading end margin or rear row end margin positioned at substrate S It is used for unit substrate, but the non-active area discarded after dicing), to remove dummy portions from substrate S.
Illusory removal unit 900 can be set between the first transfer unit 600 and the second transfer unit 700.
Illusory removal unit 900 includes: fixture 910, is used to hold the non-active area of substrate S；Fixture driving device 920, vertically and horizontally fixture 910, and using X-axis or Z axis as center rolling clamp 910.
Fixture 910 may include a pair of of the clamp member moved with moving or be spaced from each other with adjoining each other.Pass through a pair Clamp member is adjacent to each otherly mobile across substrate S, and substrate S is held by clamp member.
For example, fixture driving device 920 can be the multi-spindle machining hand of multiple arms including connecting with fixture 910.
As shown in Fig. 6 to Figure 25, the second transfer unit 700 includes: the second plate 760, is adjacent to the first cutter unit 200 Setting, and so that substrate S is floated or is adsorbed and carry out supporting substrate S；Belt 710 is connected to the second plate 760；Mobile device 730, For moving back and forth the second plate 760 and belt 710 in the Y-axis direction.
Also, the second transfer unit 700 may include the lifting device 740 for going up and down belt 710.
Second plate 760 can be mobile with a Y direction in the same direction with belt 710.That is, the second plate 760 can be together with belt 710 To being parallel to, the direction (Y direction) that substrate S is transferred is mobile.
The first face S1 and the second face S2 by the first cutter unit 200 in substrate S are respectively formed the first X-axis cutting line When XL1 and the second X-axis cutting line XL2, the second plate 760 is mobile to the first plate 660, and the first head 220 can be located at the first plate 660 Between the second plate 760.The first face S1 and the second face S2 by the first cutter unit 200 in substrate S are respectively formed the first X-axis When cutting line XL1 and the second X-axis cutting line XL2, the second plate 760 is mobile to the first plate 660, and substrate S is by the first plate 660 and second Plate 760 is supported.
Belt 710 can be multiple, and multiple belts 710 can be provided spaced in the X-axis direction.Each belt 710 It is supported by multiple belt wheels 711, at least one in multiple belt wheels 711 can be to provide the driving of the driving force of rotation belt 710 Belt wheel.
Second plate 760 can float or sorbing substrate S.For example, 760 surface of the second plate could be formed with and gas supply source And multiple groove portions of vacuum source connection.When gas is supplied to multiple groove portions of the second plate 760 from gas supply source, substrate S can be with It is floated from the second plate 760.Also, under vacuum source effect, when sucking air from multiple groove portions of the second plate 760, substrate S can be with It is adsorbed in the second plate 760.
During substrate S is transferred to the second plate 760, gas is supplied to the groove portion of the second plate 760, as a result, substrate S It can be with the second plate 760 without frictionally being moved.
The mistake of the first X-axis cutting line XL1 and the second X-axis cutting line XL2 is formed in the first face S1 and the second face S2 of substrate S Journey
In, substrate S is adsorbed and be fixed by the second plate 760.
During substrate S is moved to subsequent handling from the second plate 760, gas is supplied to the groove portion of the second plate 760, by This, substrate S can be with the second plate 760 without frictionally being moved.
Also, the second transfer unit 700 further includes going up and down module 750 for going up and down the plate of the second plate 760.Plate goes up and down module 750 are set to the lower section to the extended guide rail 720 of Y direction, for going up and down the second plate 760 and belt 710 together.But this Invent without being limited thereto, plate lifting module 750, which can connect, goes up and down the second plate 760 in the second plate 760.Implement according to the present invention Example can go up and down module 750 by a plate to go up and down the second plate 760.But the invention is not limited thereto, and plate goes up and down module 750, It also may include that the plate decline module 751 for declining the second plate 760 and the plate for rising the second plate 760 rise module 752.
Plate lifting module 750, plate decline module 751 or plate rise module 752 can be by pneumatics or oil pressure operation Actuator, according to electromagnetic interaction operation linear motor or ball screw device isoline mobile device.
As shown in Figure 10, during substrate S is transferred to the second plate 760 from the first plate 660, the second plate 760 passes through plate Decline module 751 and declines preset distance.Thus, it is possible to prevent from entering the top Shi Yu of the second plate 760 at the leading end of substrate S The phenomenon that front end conflict of two plates 760.
Also, during as shown in figure 11, mobile from the first plate 660 in the second plate 760 and substrate S is separated, second Plate 760 rises module 752 by plate and rises preset distance.Thus, it is possible to along the first X-axis cutting line XL1 for being formed in substrate S And the second X-axis cutting line XL2 concentrated stress, substrate S can be along the first X-axis cutting line XL1 and the second X-axis cutting line as a result, XL2 is smoothly separated.
Or if there is the plate lifting module 750 for going up and down the second plate 760, in the process of separating base plate S In, the second plate 760 can go up and down module 750 by plate and rise or fall preset distance.The rising and decline of second plate 760 can be with Pre-determined number repeatedly.Stress is collected along the first X-axis cutting line XL1 and the second X-axis cutting line XL2 for being formed in substrate S as a result, In, substrate S can smoothly be separated along the first X-axis cutting line XL1 and the second X-axis cutting line XL2 as a result,.
Said effect not only can the generation when substrate S is separated into unit substrate, from substrate S remove dummy portions when It can similarly generate.
Or as shown in figure 12, the first plate 660 can A1 be obliquely installed at a predetermined angle in the transfer direction of substrate S. In the same manner, the second plate 760 is also tilted by a predetermined angle on the transfer direction of substrate S A2 and is arranged.That is, the first plate 660 and second Plate 760 can have the surface being tilted by a predetermined angle relative to substrate S.
In embodiments of the present invention, the first plate 660 and the second plate 760 can be tilted all.At this point, the first plate 660 and second Plate 760 can be to inclined.But the present invention is not limited thereto, is also possible in the first plate 660 or the second plate 760 Only one inclination.I.e., the first plate 660 and the second plate 760 are obliquely arranged with different directions towards each other.
In addition, the first plate 660 and the second plate 760 are arranged with angle tilt different from each other.
In addition, the inclined angle of the first plate 660 and the inclined angle of the second plate 760 are unspecified angle in 0 to 45 degree.
For example, the first plate 660 can A1 be tilted down at a predetermined angle towards the transfer direction of substrate S.Another example, first Plate 660 can A1 be tilted upwards at a predetermined angle towards the transfer direction of substrate S.
Or second plate 760 can A2 tilts down setting at a predetermined angle towards the transfer direction of substrate S.It is another Example, the second plate 760 can A2 be obliquely installed upwards at a predetermined angle towards the transfer direction of substrate S.
In the embodiment of the present invention, towards the transfer direction of substrate S, A1 tilts down setting to the first plate 660 at a predetermined angle, Towards the transfer direction of substrate S, A2 tilts down setting to second plate 760 at a predetermined angle.
It is as shown in figure 13, mobile far from the first plate 660 in the second plate 760 according to above structure, and cut along the first X-axis During secant XL1 and the second X-axis cutting line XL2 separating base plate S, the end of separated two unit substrates can be prevented Sliding (friction) between P1, P2.Thus, it is possible to prevent the cunning between end P1, P2 because of two unit substrates separated The breakage of substrate S caused by dynamic (friction), and the substrate S's because of caused by scratch or electrostatic etc. caused by sliding (friction) are broken Damage.
The said effect not only generation when substrate S is separated into unit substrate, when the dummy portions of substrate S are eliminated Can equally it occur.
The effect of mobile device 730 is: by making the second plate 760 and belt 710 along the extended guide rail 720 of Y direction It is moved back and forth to Y direction.Mobile device 730 can be by pneumatics or the actuator of oil pressure operation, according to electromagnetism phase interaction With the linear motor or ball screw device isoline mobile device of operation.
As shown in figure 22, it after substrate S forms the first X-axis cutting line XL1 and the second X-axis cutting line XL2, is inhaled in substrate S In the state of investing the first plate 660 and the second plate 760, the second plate 760 by mobile device 730 far from the first plate 660, then substrate S can be separated along the first X-axis cutting line XL1 and the second X-axis cutting line XL2.
As shown in figure 14, mobile device 730 is connect with control unit 1000, and controlled unit 1000 is controlled.Mobile dress Set 730 load measurement modules 1100 for being connected with load for measuring mobile device 730.
For example, the load of mobile device 730 can if mobile device 730 is the linear moving apparatus for including rotating electric machine To be torque.In order to which along the first X-axis cutting line XL1 and the second X-axis cutting line XL2 separating base plate S, mobile device 730 is mobile During second plate 760, the load of mobile device 730 may be will increase.Also, in substrate S by mobile dress of isolated time point Setting 730 load may reduce.
For separating base plate S, the load of the mobile device 730 of mobile second plate 760 can pressurize according to cutting wheel 225 In the plus-pressure of substrate S and it is different.For example, the depth of cut of cutting wheel 225 also can if the plus-pressure of cutting wheel 225 reduces Reduce and be difficult to separating base plate S, the load for the mobile device 730 that substrate S is measured when being separated will increase.On the contrary, cutting wheel When 225 plus-pressure increases, the depth of cut of cutting wheel 225 also be will increase, and the separation of substrate S becomes easy, therefore, substrate S The load of the mobile device 730 measured when being separated can reduce.
As a result, on the basis of the load of the mobile device 730 measured when separating base plate S, adjustable cutting wheel 225 applies In the plus-pressure of substrate S.
For example, cutting wheel 225 may be ground when the usage amount of Reusability cutting wheel 225 and cutting wheel 225 increases Damage.As cutting wheel 225 is worn, the diameter of cutting wheel 225 can become smaller, and the depth of cut of cutting wheel 225 also reduces.As a result, Cutting wheel 225 applies pressure to the plus-pressure of substrate S and reduces, therefore the load of the mobile device 730 measured in separating base plate S can It can will increase.In this case, the plus-pressure for being applied to substrate S by increasing cutting wheel 225, is worn in cutting wheel 225 In the case where can also maintain evenly the shape by cutting line for being formed in substrate S.Also, it is applied to increase cutting wheel 225 It is added on the plus-pressure of substrate S, wheel mobile module 230 can be further mobile to substrate S by cutting wheel 225.
Load measurement module 1100 is used to measure the load of the mobile device 730 when substrate S is separated.Control unit 1000 Cutting wheel 225 is adjusted on the basis of the load for the mobile device 730 that can be measured by load measurement module 1100 is applied to substrate S Plus-pressure.For this purpose, the plus-pressure that can carry out making to be applied to substrate S in advance changes and measures when substrate S is separated The experiment or simulation of the load of mobile device 730.By above-mentioned experiment or simulation, it can obtain and be stressed on according to cutting wheel 225 The relevant data of load variations of the mobile device 730 of the stressed variation of substrate S.
Also, the load of the mobile device 730 when appropriate separating base plate S can be preset as reference load.This benchmark is negative Lotus can be different according to the characteristic of the substrates S such as thickness, the material of substrate S.Thus, it is possible to by experiment or simulation, it can be pre- If according to multiple reference loads of the characteristic of substrate S.
Control unit 1000 compares the load and reference load of the mobile device 730 measured when substrate S is separated, thus It can determine whether the plus-pressure appropriate that whether pressurizes on substrate S.
If the load that substrate S is measured when being separated within the scope of reference load, control unit 1000 may determine that for Pressed plus-pressure needed for appropriate separating base plate S on substrate S.Also, if the load of measurement exceeds reference load range, control Unit 1000 processed is judged as the excessive or too small plus-pressure that pressed to substrate S.
If the load for the mobile device 730 that substrate S is measured when being separated is less than reference load, control unit 1000 is sentenced Break to be applied on substrate S and exceeding appropriate stressed plus-pressure, by control wheel mobile module 230 make cutting wheel 225 to Direction far from substrate S is mobile.Reduced as a result, by the plus-pressure that cutting wheel 225 is applied to substrate S, needed for separating base plate S The load of mobile device 730 increases.
Also, the load of the mobile device 730 measured when separating base plate S is more than reference load, then control unit 1000 It is judged as that is pressed on substrate S is less than appropriate stressed plus-pressure, by control wheel mobile module 230, so that cutting wheel 225 is mobile to substrate S.The plus-pressure that cutting wheel 225 is applied to substrate S as a result, increases, mobile device needed for separating base plate S 730 load can reduce.
As described above, adjustment is cut if the load of the mobile device 730 when separating base plate S exceeds reference load range The plus-pressure that wheel 225 is applied to substrate S is cut, the load of mobile device 730 is maintained within the scope of reference load.It moves as a result, Separating base plate S in the case that device 730 can be run in optimal criteria load range.And it is possible to prevent mobile device 730 Load be excessively increased or reduce.
Furthermore in the plus-pressure for being applied to substrate S according to the abrasion of cutting wheel 225 without simultaneously, with mobile device 730 Come control wheel mobile module 230, the plus-pressure of adjust automatically cutting wheel 225 on the basis of load.It is ground as a result, in cutting wheel 225 Cutting wheel 225 can also be steadily maintained to apply pressure to the degree of substrate S in the case where damage, thus, it is possible to be formed uniformly in substrate S Smooth cutting line.
In addition, when smaller because of the plus-pressure that the reasons such as bad of cutting wheel 225 are applied to substrate S, mobile device 730 it is negative Lotus is possible to be excessively increased.At this point, such case may be judged as the failure of cutter for substrate by control unit 1000, It is possible that interrupting the operation of cutter for substrate.
Hereinafter, with reference to such as Figure 15 to Figure 25, to the first transfer unit 600, the first cutter unit 200 and the second transfer unit 700 operation is illustrated.
As shown in figure 15, substrate S is transferred to the first cutter unit in the state that its dummy portions held in advance is not removed 200.At this point, substrate S can be floated under the action of the gas sprayed from the first plate 660 from the first plate 660.
Also, when substrate S is located on the first plate 660, substrate S is adsorbed by the first plate 660.At this point, the first cutting wheel model After the cutting wheel 225 of block 221 and the second cutting wheel module 222 is contacted with substrate S respectively, cutting wheel 225 is mobile to X-direction, The first X-axis cutting line XL1 and the second X-axis cutting line XL2 is formed in the dummy portions of substrate S as a result,.
Also, as shown in FIG. 16 and 17, the fixture 910 of illusory removal unit 900, which is moved to, is formed with the cutting of the first X-axis The dummy portions of the substrate S of line XL1 and the second X-axis cutting line XL2.Also, fixture 910 is held after the dummy portions of substrate S It is rotated centered on X-axis or is moved along the y axis, so that dummy portions be removed from substrate S.Remove the fixture of dummy portions 910 revert to the raw bits for not interfering the movement of the cutting wheel 225 of the first cutting wheel module 221 and the second cutting wheel module 222 It sets.
Also, as shown in figure 18, in the state that the first plate 660 is fixed, the second plate 760 is towards the first plate 660 to Y-axis side To movement.The interval between the first plate 660 and the second plate 760 reduces as a result, and substrate S is by 760 institute of the first plate 660 and the second plate Support.
In addition, as shown in figure 19, substrate S is transferred to the second transfer unit 700.At this point, substrate S is being supplied to the first plate 660 and second plate 760 gas under the action of, floated from the first plate 660 and the second plate 760.
Also, as shown in figure 20, when substrate S is located on the first plate 660 and the second plate 760, substrate S is by the first plate 660 And second plate 760 adsorbed.At this point, the cutting wheel 225 of the first cutting wheel module 221 and the second cutting wheel module 222 connects respectively It touches after substrate S, cutting wheel 225 is mobile to X-direction, forms the first X-axis cutting line XL1 and the second X-axis in substrate S as a result, Cutting line XL2.
Also, as shown in Figure 21 and Figure 22, the first X-axis cutting line XL1 and the second X-axis cutting line XL2 is formed in substrate S Afterwards, the cutting wheel 225 of the first cutting wheel module 221 and the second cutting wheel module 222 is mobile and leaves substrate S.Also, in substrate S by the state of the first plate 660 and the absorption of the second plate 760, the second plate 760 it is mobile and far from the first plate 660, then substrate S along First X-axis cutting line XL1 and the second X-axis cutting line XL2 are separated.
Also, it as shown in figure 23, behind the middle section of separating base plate S, is not removed with the dummy portions at row end after substrate S State, substrate S is transferred to the first cutter unit 200.At this point, under the action of the gas sprayed from the second plate 760, substrate It can be floated from the second plate 760.
Furthermore when substrate S is located at the second plate 760, substrate S is adsorbed by the second plate 760.At this point, the first cutting wheel model After the cutting wheel 225 of block 221 and the second cutting wheel module 222 is contacted with substrate S respectively, cutting wheel 225 is mobile to X-direction, The first X-axis cutting line XL1 and the second X-axis cutting line XL2 is formed in the dummy portions of substrate S as a result,.
Also, as shown in Figure 24 and Figure 25, the fixture 910 of illusory removal unit 900, which is moved to, is formed with the cutting of the first X-axis The dummy portions of the substrate S of line XL1 and the second X-axis cutting line XL2.Also, after fixture 910 holds the dummy portions of substrate S, rotation Turn or moves horizontally and remove dummy portions from substrate S.The fixture 910 for removing dummy portions restores to original position without hindering the The movement of the cutting wheel 225 of one cutting wheel model block 221 and the second cutting wheel module 222.
In addition, as shown in figure 26, passing through along the substrate S that the first X-axis cutting line XL1 and the second X-axis cutting line XL2 is separated The rotation of multiple belts 710 is transferred to the second cutter unit 300.
At this point, as shown in figure 27, the second transfer unit 700 and the second cutter unit 300 are arranged in sustained height, substrate S It can be transferred directly to the second cutter unit 300.At this point, substrate S is from second under the influence of the gas supplied from the second plate 760 Plate 760 floats.
Another example between the second transfer unit 700 and the second cutter unit 300 is provided with liftable and moves horizontally Substrate S is transferred to the second cutter unit 300 from the second transfer unit 700 by pickup unit (not shown).Such as Figure 28 and Figure 29 institute Show, the second transfer unit 700 can be set in the position than the low predetermined altitude H of the second cutter unit 300.At this point, belt 710 is logical It crosses belt lifting device 740 and rises predetermined altitude H, so that belt 710 is located at height identical with the second cutter unit 300.This When, when belt 710 is risen by belt lifting device 740, substrate S it is mobile and far from the second plate 760.As described above, passing through lifting Device 740, belt 710 rise relative to the second plate 760, so that substrate S is far from the second plate 760.As a result, without base in order to prevent Friction between plate S and the second plate 760 floats substrate S from the second plate 760.
As shown in Figure 30 and Figure 31, the second cutter unit 300 forms the first Y-axis cutting line in the first face S1 of substrate S YL1。
Second cutter unit 300 includes: second framework 310, can extend to X-direction and move along Y direction； Second head 320 can movably be set to second framework 310 to X-direction, and have cutting wheel 321；Second guiding rail 330, for guiding the movement of second framework 310；Belt 340, supporting substrate S；Support plate 350, can be mobile to Z-direction Ground is set to the lower section of belt 340, belt 340 is supported when cutting wheel 321 applies pressure to substrate S, thus supporting substrate S；Support Plate lifting device 360 goes up and down support plate 350 to Z-direction.
Second framework 310 is provided with multiple second heads 320 in the X-axis direction.
Can be set between second framework 310 and the second guiding rail 330 by pneumatics or oil pressure operation actuator, According to the linear motor or ball screw device isoline mobile device of electromagnetic interaction operation.As an example, above-mentioned straight line Mobile device can be set in second framework 310 and/or the second guiding rail 330.It applies pressure to as a result, in cutting wheel 321 In the state of substrate S, second framework 310 is moved along the second guiding rail 330 to Y direction, and the first face S1 of substrate S is formed First Y-axis cutting line YL1.
Belt 340 is supported by multiple belt wheels 341, and at least one of multiple belt wheels 341 can be to provide for rotating The driving pulley of the driving force of belt 340.Belt 340 is preferably the undivided one-piece type belt for multiple portions, with uniform The integral face of ground supporting substrate S and transfer substrate S.
The rotation of belt 340 and when substrate S mobile, support plate 350 decline under the action of support plate lifting device 360 and with Belt 340 separates, so that belt 340 can be between support plate 350 without successfully moving in the case where friction.Also, When substrate S forms the first Y-axis cutting line YL1, support plate 350 is supported plate lifting device 360 and rises and support belt 340 Bottom surface, thus supporting substrate S.For example, support plate 350 can have the vacuum hole connecting with vacuum source, by belt 340 Fine holes and sorbing substrate S.
During the first face S1 of substrate S forms the first Y-axis cutting line YL1, it is provided with and has the of cutting wheel 321 The second framework 310 on two heads 320 can move, and substrate S is supported the support of plate 350, and therefore, cutting wheel 321 may be with biggish Pressure pressing is in substrate S, so as to easily cutting substrate S.
Also, substrate S is supported the support of plate 350, and there is no need to be used to support the roller of cutting wheel 321.Thus, it is possible to subtract The width on the second head 320 of the small space size for corresponding to removal roller, so as to reduce multiple second heads 320 recently Ground adjacent to when multiple second heads 320 cutting wheel 321 between interval.It is formed it is possible thereby to reduce by cutting wheel 320 Interval between first Y-axis cutting line YL1.
As shown in figure 31, the substrate S for being formed with the first Y-axis cutting line YL1 is single from the second cutting by the rotation of belt 340 Member 300 is transferred to roll-over unit 400.Another example, the pickup unit (not shown) that can be moved horizontally while lifting are set to It is single for substrate S to be transferred to overturning from the second cutter unit 300 between second cutter unit 300 and substrate roll-over unit 400 Member 400.
As shown in Figure 31 to Figure 38, substrate roll-over unit 400 includes: multiple belts 410, in the X-axis direction mutually every It opens up and sets；Supporting table 420 extends to Z-direction；First adsorption plate 430 has the first adsorption nozzle 431；Second absorption Plate 440 has the second adsorption nozzle 441；Adsorption plate lifting device 450 moves to Z-direction along supporting table 420 One adsorption plate 430 and the second adsorption plate 440；Adsorption plate rotating device 460 is used to rotate the first adsorption plate 430 and second and inhales Attached plate 440.
Belt 410 is supported by multiple belt wheels 411, at least one in multiple belt wheels 411 can be to provide rotation belt 410 The driving pulley of driving force.
Adsorption plate lifting device 450 may include the actuator run by pneumatics or oil pressure, according to electromagnetic interaction The linear motor or ball screw device isoline mobile device of operation.
Adsorption plate rotating device 460 may include motor.
First adsorption plate 430 and the second adsorption plate 440 are provided spaced so that substrate S to be arranged in-between.First absorption First adsorption nozzle 431 of plate 430 can be arranged mutually opposite to each other with the second adsorption nozzle 441 of the second adsorption plate 440.
Hereinafter, being illustrated to the movement of overturning substrate S.For ease of description, it is located at second with the first adsorption plate 430 to inhale It is illustrated subject to the state of 440 top of attached plate.
Firstly, as shown in figure 32, when substrate S is not located at belt 410, the first adsorption plate 430 and the second adsorption plate 440 are located at Space between belt 410.Also, as shown in figure 33, when substrate S is sent to belt 410, substrate S is located at the first adsorption plate 430 And second between adsorption plate 440.
Also, as shown in figure 34, as the first adsorption plate 430 and the second adsorption plate 440 rise, the absorption of substrate S and second Second adsorption nozzle 441 of plate 440 contacts.Also, as the first adsorption plate 430 and the second adsorption plate 440 continue to rise, substrate S is risen with the state for being contacted with the second adsorption nozzle 441 of the second adsorption plate 440.At this point, substrate S is to be inhaled by gravity by second Attached nozzle 441 is supported, therefore can also maintain the posture of substrate S even if not applying adsorption capacity in the second adsorption nozzle 441.
In addition, adsorption force is when the first adsorption nozzle 431 or the second adsorption nozzle 441, in order to by its strong adsorption force Degree increase to can appropriate sorbing substrate S size, need the scheduled time.In the present invention, the first suction within the predetermined time During the adsorption capacity of attached nozzle 431 or the second adsorption nozzle 441 is increased, substrate S can also be supported in by gravity One adsorption nozzle 431 or the second adsorption nozzle 441, to rise substrate S.Thus, it is possible to prevent from increasing in adsorption capacity intensity The phenomenon that can not rising substrate S and wait in a period of the intensity of appropriate sorbing substrate S.That is, it is possible to reduce Time needed for rising substrate S.
The 441 sorbing substrate S of the second adsorption nozzle of the second adsorption plate 440 during substrate S rises, then such as Figure 35 institute It states, the second adsorption plate 430 and the second adsorption plate 440 are rotated by adsorption plate rotating device 460.
Also, under as shown in figure 36, substrate S by the second adsorption nozzle 441 of the second adsorption plate 440 in the state of being adsorbed Drop.
Furthermore as shown in figure 37, when the second adsorption plate 430 is inserted into the space between belt 410, then substrate S is located at band 410 top of son is simultaneously separated from the second adsorption nozzle 441.In this state, the first adsorption plate 430 can be located at the second adsorption plate 440 lower section, so as to be immediately performed the movement of subsequent overturning substrate S, it is possible thereby to shorten the time needed for process.
In this state, as shown in figure 38, the substrate S of overturning is by the rotation of belt 410 from substrate roll-over unit 400 It is transferred to third cutter unit 500.Another example, liftable and the pickup unit moved horizontally setting (not shown) are overturn in substrate Between unit 400 and third cutter unit 500, for substrate S to be transferred to third cutter unit from substrate roll-over unit 400 500。
As shown in Figure 38 and Figure 39, third cutter unit 500 forms the second Y-axis cutting line in the second face S2 of substrate S YL2。
Third cutter unit 500 includes: third framework 510, extends to X-direction and can move to Y direction；Third Head 520 can movably be set to third framework 510 to X-direction and have cutting wheel 521；Third guiding rail 530, It is used to guide the movement of third framework 510；Belt 540 is used to support substrate S；Support plate 550, can be to Z-direction It is movably set to the lower section of belt 540, belt 540 and supporting substrate S are supported when cutting wheel 521 applies pressure to substrate S；Support Plate lifting device 560 increases in the Z-axis direction descending branch fagging 550.
Third framework 510 can have multiple third heads 520 in the X-axis direction.
Actuator, the basis of pneumatics or oil pressure operation are provided between third framework 510 and third guiding rail 530 The linear motor or ball screw device isoline mobile device of electromagnetic interaction operation.As a result, in cutting wheel 521 by substrate In the state of S pressure, third framework 510 is moved along third guiding rail 530 to Y direction, thus in the second face of substrate S S2 forms the second Y-axis cutting line YL2.
Belt 540 is supported by multiple belt wheels 541, and at least one of multiple belt wheels 541 can be to provide for rotating The driving pulley of the driving force of belt 540.Belt 540 is not separated into the one-piece type belt of multiple portions preferably, with equably Supporting substrate S integral face simultaneously transfers substrate.
The rotation of belt 540 and when moving substrate S mobile, support plate 550 is supported plate lifting device 560 and declines and separate Belt 540, so that belt 540 is smoothly moved in the case where not rubbing with support plate 550.Also, second is formed in substrate S When Y-axis cutting line YL2, support plate 550 is supported the bottom surface that plate lifting device 560 rises and supports belt 540, thus branch support group Plate S.For example, support plate 550 has the vacuum hole connecting with vacuum source, support plate 550 is adsorbed by the micropore on belt Substrate S.
During the second face S2 of substrate S forms the second Y-axis cutting line YL2, it is provided with the with cutting wheel 521 The third framework 510 on three heads 520 can move, and substrate S is supported plate 550 and is supported, therefore cutting wheel 521 can be with bigger Pressure pressing is in substrate S, thus substrate S easy to cut.
Also, substrate S is supported plate 550 and is supported, and there is no need for support the roller of cutting wheel 521.As a result, may be used It is the width on third head 520 corresponding to the space size of removal roller to reduce, thus, it is possible to shorten multiple third heads 520 recently abut when multiple third heads 520 cutting wheel 521 between interval.Pass through cutting wheel so as to shorten Interval between 520 the second Y-axis cutting line YL2 formed.
As the second face S2 in substrate S forms the second Y-axis cutting line YL2, substrate S can be along the first Y-axis cutting line YL1 and the second Y-axis cutting line YL2 separation.
As a result, after substrate S is cut, X-axis stepped part XS can be formed, has and is equivalent to the first Y-axis cutting line The width of YL2 and the second Y-axis cutting line YL2 distance spaced apart from each other in the X-axis direction, the X-axis stepped part XS can be formed There are wiring and/or the electrode etc. with wiring connection.
The substrate S cut can be transferred to third transfer unit from third cutter unit 500 by the rotation of belt 540 800。
As shown in Figure 40 and Figure 42, third transfer unit 800 includes: belt 810, for accommodating from third cutter unit The substrate S of 500 transmitting；Pickup model 820 is used to hold and transfer substrate S；Support frame 830 can be moved to Y direction Pickup model 820 is supported dynamicly；Mobile module 840 moves pickup model 820 along support frame 830；Module 850 is gone up and down, It is used for the mobile pickup model 820 of Z-direction.
Belt 810 is supported by multiple belt wheels 811, and at least one of multiple belt wheels 811 can be to provide for rotating The driving pulley of the driving force of belt 810.The belt 810 of third transfer unit 800 can be with the belt of third cutter unit 500 540 are formed with identical height, so that substrate S is from third cutter unit 500 to the horizontal transmitting of third transfer unit 800.
Mobile module 840 and lifting module 850 can be the actuator, mutual according to electromagnetism by pneumatics or oil pressure operation Act on the linear motor or ball screw device isoline mobile device of operation.
Pickup model 820 may include: multiple adsorption plates 821, be connect by vacuum line 861 with vacuum source 860；Plate is high Degree adjustment device 822, connect with multiple adsorption plates 821 respectively and goes up and down adsorption plate 821；Pressure sensor 823, respectively with Multiple adsorption plates 821 connect and measure the pressure in adsorption plate 821.
Plate height adjusting device 822 can allow user to manually adjust the height of multiple adsorption plates 821.Also, plate height Adjustment device 822 can be by pneumatics or oil pressure operation actuator, according to electromagnetic interaction operation linear motor or Ball screw device isoline mobile device, so that the highly automated adjustment of multiple adsorption plates 821.
Another example, multiple plate height adjusting devices 822 are not connected to multiple adsorption plates 821, but by two with Upper adsorption plate 821 specifies multiple groups of adsorption plate 821 as a group, and adjusts the height of each group of adsorption plate 821.
At this moment, control unit 1000 can according to the pressure change in the adsorption plate 821 measured by pressure sensor 823 come Plate height adjusting device 822 is controlled, to go up and down multiple adsorption plates 821.
When substrate S is transferred to the belt 810 of third transfer unit 800, then substrate S is picked the absorption of module 820, by picking up Modulus block 820 vertically moving and moving horizontally, and substrate S is transferred to subsequent handling.
In the process, need substrate S uniform adsorption in multiple adsorption plates 821 of pickup model 820.But because the Flatness variation, the multiple absorption of pickup model 820 of substrate S caused by the height change of the belt 810 of three transfer units 800 The upright position of plate 821 changes, and substrate S is possible to equably be adsorbed in multiple adsorption plates 821 of pickup model 820.? The non-uniform adsorption of substrate S in the state of multiple adsorption plates 821 pickup model 820 vertically and horizontally when, it is possible to occur Substrate S is detached from the problem of multiple adsorption plate 821.
As a result, in the third transfer unit 800 in the embodiment of the present invention, before the complete sorbing substrate S of pickup model 820 Pickup model 820 is gradually mobile to substrate S, the pressure in multiple adsorption plates 821 is measured by pressure sensor 823.
With pickup model 820 is gradually mobile to substrate S, substrate S is adsorbed the absorption of plate 821, flat as substrate S Spend uniform, multiple adsorption plates 821 upright position it is uniform when, when substrate S is adsorbed by multiple adsorption plates 821, multiple adsorption plates Pressure in 821 changes simultaneously.
But if the flatness of substrate S is uneven or the upright position of multiple adsorption plates 821 is uneven, only base A part of plate S is adsorbed by the partial adsorbates plate 821 in multiple adsorption plates 821, and the rest part of substrate S is not adsorbed in absorption Plate 821.At this point, the partial pressure in multiple adsorption plates 821 can generate variation, but the pressure of the adsorption plate 821 of unadsorbed substrate S It will not change.
It follows that existing between the unchanged adsorption plate 821 of the adsorption plate 821 and pressure of pressure change relative to substrate The relative height differential of S, by adjusting the height of the unchanged adsorption plate 821 of height or pressure of the adsorption plate 821 of pressure change Above-mentioned relative height differential can be eliminated.
According to the pressure of the multiple adsorption plates 821 measured by multiple pressure sensors 823, (pressure becomes control unit 1000 Change) plate height adjusting device 822 is controlled, it is so as to adjust the height or pressure of the adsorption plate 821 of pressure change unchanged The height of adsorption plate 821.
Thus, it is possible to the relative height differential relative to substrate S between multiple adsorption plates 821 be eliminated, so that substrate S's is whole Dignity can be adsorbed equably by multiple adsorption plates 821.
According to structure as described above, the integral face of substrate S can be adsorbed equably by multiple adsorption plates 821, therefore, base Plate S can be picked module 820 and steadily be transferred to subsequent handling.
Cutter for substrate in embodiment present invention as described above, multiple cutting lines, i.e. the first X-axis cutting line XL1 And to pass through the first cutting set gradually single by the second X-axis cutting line XL2, the first Y-axis cutting line YL1, the second Y-axis cutting line YL2 First 200, second cutter unit 300 and third cutter unit 400 sequentially form, thus cutting substrate S.Therefore, and in order to cut Substrate and the prior art of dicing processes and sliver process is individually performed compared to process number is reduced, so as to improve cutting The efficiency of substrate.
Although illustrating the preferred embodiment of the present invention, the scope of the present invention is not limited to such specific reality Example is applied, can be suitably changed in the range recorded in claims.
Method for dividing substrate in the embodiment of the present invention, comprising: in order to achieve the above object, the present invention provides a kind of substrate Cutting method comprising: base plate transfer step, by base plate transfer to the first plate and the second plate being provided adjacent to；Cutting line is formed Step is moved on substrate by cutting wheel module, forms cutting line on substrate；Plate declines step, in the base plate transfer When to first plate and the second plate, make second plate relative to first plate the Z-direction decline the step of.
It can also include: substrate floating steps, in base plate transfer to first plate and institute in plate lifting step When stating the second plate, float the substrate；And substrate adsorption step, institute is adsorbed when the cutting wheel presses to the substrate State substrate.

Claims (10)

1. a kind of cutter for substrate comprising:
Cutting wheel module, has cutting wheel；
First plate and the second plate, first plate and the second plate are respectively arranged at the two sides of the cutting wheel module；And
Plate declines module, and in base plate transfer to first plate and the second plate, the plate decline module makes the second plate phase First plate is declined in Z-direction.
2. cutter for substrate according to claim 1, wherein
In the base plate transfer to first plate and second plate, first plate and second plate are to the substrate Injection gas floats the substrate, adsorbs the substrate when the cutting wheel presses to the substrate.
3. cutter for substrate according to claim 1 or 2, wherein further include:
Mobile device is connected to second plate, makes second plate relative to first plate along the y axis far from shifting It is dynamic.
4. cutter for substrate according to claim 1 or 2, wherein further include:
Guide rail, extends along the Y direction, and the mobile device is moved along the guide rail.
5. cutter for substrate according to claim 1 or 2, wherein include:
Aligned units determine the position for the substrate being externally entering；
First cutter unit comprising the cutting wheel module, first cutter unit is in the first face of the substrate and Two faces are respectively formed the first X-axis cutting line and the second X-axis cutting line for being parallel to X-direction；
Second cutter unit is formed in parallel with the first Y-axis cutting line of Y direction in the first face of the substrate；
Substrate roll-over unit, for overturning the substrate for forming the first Y-axis cutting line；And
Third cutter unit is formed in parallel with the second Y-axis cutting line of Y direction for the second face in the substrate.
6. cutter for substrate according to claim 5, wherein the aligned units include:
Multiple conveyer belts extend to the Y direction and are spaced apart at a predetermined interval in the X-direction；
Conveyer belt lifting device goes up and down the multiple conveyer belt；
Multiple flotation gears are set between the multiple conveyer belt for floating the substrate；
Multiple pressurizing devices, the side for the substrate floated by the multiple flotation gear that is used to pressurize.
7. cutter for substrate according to claim 5, wherein
First cutter unit includes:
To extended first framework of the X-direction；At least a pair of first head, can movably be set to institute to X-direction The first framework is stated, and is oppositely arranged in the Z-axis direction,
At least a pair of first head includes: the first cutting wheel and the second cutting wheel, first cutting wheel and described second Cutting wheel is spaced apart in the Z-axis direction, and has cutting wheel respectively；First roller module and the second roller module, described One roller module is spaced apart in the Z-axis direction with second roller module, and has roller respectively,
The roller of the cutting wheel of the first cutting wheel module and second roller module is mutually aligned setting, and described second cuts The roller of the cutting wheel and first roller module of cutting wheel module is mutually aligned setting.
8. cutter for substrate according to claim 7, wherein
The cutting wheel of the cutting wheel of the first cutting wheel module and the second cutting wheel module separates in the Y-axis direction.
9. a kind of method for dividing substrate, wherein include:
Base plate transfer step, by base plate transfer to the first plate and the second plate being provided adjacent to；
Cutting line forming step is moved on substrate by cutting wheel module, forms cutting line on substrate；
In the base plate transfer to first plate and the second plate, make second plate relative to first plate in Z axis side To the step of decline.
10. method for dividing substrate according to claim 9, wherein further include:
Substrate floating steps float the substrate in base plate transfer to first plate and second plate；And
Substrate adsorption step adsorbs the substrate when the cutting wheel presses to the substrate.
CN201811404723.2A 2017-11-23 2018-11-23 Substrate cutting device and substrate cutting method Active CN109824261B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2017-0157312 2017-11-23
KR1020170157312A KR102067987B1 (en) 2017-11-23 2017-11-23 Apparatus for cutting substrate

Publications (2)

Publication Number Publication Date
CN109824261A true CN109824261A (en) 2019-05-31
CN109824261B CN109824261B (en) 2022-12-02

Family

ID=66657311

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201811404723.2A Active CN109824261B (en) 2017-11-23 2018-11-23 Substrate cutting device and substrate cutting method

Country Status (2)

Country Link
KR (1) KR102067987B1 (en)
CN (1) CN109824261B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112103228A (en) * 2019-06-17 2020-12-18 塔工程有限公司 Substrate transfer head

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102353208B1 (en) * 2020-01-29 2022-01-24 주식회사 탑 엔지니어링 Method of controlling substrate cutting apparatus

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1856392A (en) * 2003-09-24 2006-11-01 三星钻石工业株式会社 Substrate dicing system, substrate manufacturing apparatus, and substrate dicing method
JP2008024574A (en) * 2006-07-25 2008-02-07 Optrex Corp Method of cutting substrate
CN101970363A (en) * 2008-01-23 2011-02-09 三星宝石工业株式会社 Scribing device and scribing method
CN102083760A (en) * 2008-06-25 2011-06-01 三星宝石工业株式会社 Scribing apparatus
CN102152414A (en) * 2010-02-09 2011-08-17 三星钻石工业股份有限公司 Substrate separation device

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7131562B2 (en) * 2001-01-17 2006-11-07 Mitsuboshi Diamond Industrial Co., Ltd. Scribing and breaking apparatus, system therefor, and scribing and breaking method
KR100753162B1 (en) 2005-12-29 2007-08-30 주식회사 탑 엔지니어링 Method for Detecting Position of Substrate Using Position Error of Motor And Scriber Using The Same
KR100824253B1 (en) * 2006-07-18 2008-04-24 주식회사 에스에프에이 System and method for Scribing substrate
KR101089172B1 (en) * 2008-04-21 2011-12-02 주식회사 탑 엔지니어링 Step scribing method of assembling substrates and control system thereof
KR101236805B1 (en) * 2011-11-16 2013-02-25 세메스 주식회사 Substrate cutting apparatus and method
KR102605917B1 (en) * 2016-04-07 2023-11-27 주식회사 탑 엔지니어링 Scribing apparatus

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1856392A (en) * 2003-09-24 2006-11-01 三星钻石工业株式会社 Substrate dicing system, substrate manufacturing apparatus, and substrate dicing method
JP2008024574A (en) * 2006-07-25 2008-02-07 Optrex Corp Method of cutting substrate
CN101970363A (en) * 2008-01-23 2011-02-09 三星宝石工业株式会社 Scribing device and scribing method
CN102083760A (en) * 2008-06-25 2011-06-01 三星宝石工业株式会社 Scribing apparatus
CN102152414A (en) * 2010-02-09 2011-08-17 三星钻石工业股份有限公司 Substrate separation device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112103228A (en) * 2019-06-17 2020-12-18 塔工程有限公司 Substrate transfer head
CN112103228B (en) * 2019-06-17 2023-12-29 塔工程有限公司 Substrate transfer head

Also Published As

Publication number Publication date
KR102067987B1 (en) 2020-01-20
KR20190059577A (en) 2019-05-31
CN109824261B (en) 2022-12-02

Similar Documents

Publication Publication Date Title
CN109824259A (en) Cutter for substrate and method for dividing substrate
CN101144920B (en) Substrate detecting device
KR20060123211A (en) Substrate machining method, substrate machining device, substrate carrying method, and substrate carrying mechanism
CN109824261A (en) Cutter for substrate and method for dividing substrate
JP6364789B2 (en) Scribing equipment
CN109824254A (en) Cutter for substrate
KR102593614B1 (en) Substrate cutting apparatus
CN109574484A (en) Cutter for substrate
CN109824255A (en) Cutter for substrate
CN209567999U (en) Cutter for substrate
KR102593615B1 (en) Substrate cutting apparatus
CN109824260A (en) Cutter for substrate and method for dividing substrate
CN108218215A (en) Cutter for substrate
CN209619190U (en) Cutter for substrate
CN100529873C (en) System and method for removing blank glass from panel
CN108218213A (en) Cutter for substrate
KR102353203B1 (en) Dummy removing unit
WO2018016038A1 (en) Cutting device and cutting method
KR20200144167A (en) Dummy removing unit
KR20200088928A (en) Unit and method for removing dummy
CN209567995U (en) Base plate processing device
CN209567996U (en) Base plate processing device
CN209567998U (en) Cutter for substrate
US20240190752A1 (en) Glass plate processing system
KR20200096434A (en) Dummy removing unit

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant