CN109824254A - Cutter for substrate - Google Patents
Cutter for substrate Download PDFInfo
- Publication number
- CN109824254A CN109824254A CN201811390303.3A CN201811390303A CN109824254A CN 109824254 A CN109824254 A CN 109824254A CN 201811390303 A CN201811390303 A CN 201811390303A CN 109824254 A CN109824254 A CN 109824254A
- Authority
- CN
- China
- Prior art keywords
- substrate
- clamp member
- module
- pair
- cutter
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 240
- 238000004140 cleaning Methods 0.000 claims abstract description 30
- 238000005259 measurement Methods 0.000 description 21
- 238000012546 transfer Methods 0.000 description 21
- 238000000034 method Methods 0.000 description 17
- IYLGZMTXKJYONK-ACLXAEORSA-N (12s,15r)-15-hydroxy-11,16-dioxo-15,20-dihydrosenecionan-12-yl acetate Chemical compound O1C(=O)[C@](CC)(O)C[C@@H](C)[C@](C)(OC(C)=O)C(=O)OCC2=CCN3[C@H]2[C@H]1CC3 IYLGZMTXKJYONK-ACLXAEORSA-N 0.000 description 7
- 230000003993 interaction Effects 0.000 description 7
- IYLGZMTXKJYONK-UHFFFAOYSA-N ruwenine Natural products O1C(=O)C(CC)(O)CC(C)C(C)(OC(C)=O)C(=O)OCC2=CCN3C2C1CC3 IYLGZMTXKJYONK-UHFFFAOYSA-N 0.000 description 7
- 230000000694 effects Effects 0.000 description 6
- 239000012634 fragment Substances 0.000 description 6
- 238000002474 experimental method Methods 0.000 description 5
- 239000011521 glass Substances 0.000 description 5
- 238000004088 simulation Methods 0.000 description 5
- 239000006063 cullet Substances 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 238000006073 displacement reaction Methods 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- KXDHJXZQYSOELW-UHFFFAOYSA-M Carbamate Chemical compound NC([O-])=O KXDHJXZQYSOELW-UHFFFAOYSA-M 0.000 description 1
- 240000002853 Nelumbo nucifera Species 0.000 description 1
- 235000006508 Nelumbo nucifera Nutrition 0.000 description 1
- 235000006510 Nelumbo pentapetala Nutrition 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 235000013399 edible fruits Nutrition 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 238000004020 luminiscence type Methods 0.000 description 1
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical group C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000011218 segmentation Effects 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 230000001360 synchronised effect Effects 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
- C03B33/033—Apparatus for opening score lines in glass sheets
-
- B08B1/12—
-
- B08B1/32—
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
- C03B33/03—Glass cutting tables; Apparatus for transporting or handling sheet glass during the cutting or breaking operations
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P40/00—Technologies relating to the processing of minerals
- Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
- Y02P40/57—Improving the yield, e-g- reduction of reject rates
Abstract
The present invention provides a kind of cutter for substrate, wherein includes: scribing unit, crosses for being formed in substrate；Illusory removal unit comprising hold the clamp member of the dummy portions, divided the dummy portions from the substrate with the scribing line along the dummy portions for being formed in the substrate by scribing unit；And cleaning unit, it is used to remove the foreign matter for being attached to the clamp member.
Description
Technical field
The present invention relates to a kind of cutter for substrate, are used for cutting substrate.
Background technique
It is commonly used for the liquid crystal display panel, organic EL display panel, inorganic EL of flat-panel monitor
Display pannel, transmission projection substrate, reflective projection substrate etc. use unit glass panel (hereinafter referred to as " unit substrate "), institute
Stating unit glass panel is by will such as glass brittleness mother glass panel (hereinafter referred to as " substrate ") be cut to predetermine sizes
And it obtains.
The process of cutting substrate includes dicing processes, and the dicing processes are pressed simultaneously along the preset lines for being intended to cutting substrate
Movement is formed scribing line by the score wheel as made of the materials such as diamond.
By in process of the substrate cut at unit substrate, unit substrate needs to remove dummy portions (cullet
(cullet), that is, used not as unit substrate, the non-active area discarded after dicing).
As an example, in KR published patent the 10-2003-0069195th, using wheel sharp (wheel tip) in glass
After substrate forms scribing line, the cutting sheet of liquid crystal parent substrate is held using the chuck assembly for being mounted on support device, to separate
And discarded cutting sheet.
But the problem of existing in the existing structure, is, there is no the tools sufficiently disclosed for removing dummy portions
The apparatus structure of body, also there is no the structures for disclosing effective control card disk device.
[existing technical literature]
[patent document]
KR published patent the 10-2003-0069195th
Summary of the invention
In order to solve the existing problems, it is an object of that present invention to provide a kind of cutter for substrate, to effectively remove substrate
Dummy portions.
In order to achieve the above object, the present invention provides a kind of cutter for substrate, wherein includes: scribing unit, in base
Plate forms scribing line；Illusory removal unit comprising the clamp member of dummy portions is held, with along passing through the scribing unit shape
The scribing line of the dummy portions of substrate described in Cheng Yu divides the dummy portions from the substrate；And cleaning unit, it uses
The foreign matter of the clamp member is attached in removal.
The cleaning unit includes: brush, can be arranged close to the clamp member；Brush-driven device, for driving
The brush；And convolution module, for the brush that circles round.
The cleaning unit further include: horizontal drive module, for the brush is mobile to horizontal direction；And vertically
Drive module, for the brush is mobile to vertical direction.
Cleaning unit further include: shell is formed around the brush, and is had so that the exposed opening of the brush；
And gas supply module, it is connected to the shell and supplies gas to the shell.
Cleaning unit further include: shell forms around the brush, and has the opening for keeping the brush exposed；And
Vacuum source, with the cage connection.
Filter is provided between shell and vacuum source.
Illusory removal unit includes: clamp module comprising the clamp member；Support frame is used to support the clamping
Module；Rotary module, the central axis of support frame as described above of being subject to rotate support frame as described above；Module is moved horizontally, for level
Mobile support frame as described above；And module is vertically moved, for vertically moving support frame as described above.
Clamp module is provided with multiple in support frame as described above, and the multiple clamp module can be in the length side of support frame as described above
It is movably arranged at support frame as described above upwards, so that the interval between the multiple clamp module is adjusted.
Clamp module includes: base member；Ontology is movably disposed relative to the base member, and is provided with
The clamp member；And position-regulation portion, relative to the mobile ontology of the base member.
The face against the substrate of clamp member is provided with contact plate.
Invention effect
Cutter for substrate in the embodiment of the present invention, when illusory removal unit removes dummy portions from substrate, attachment
It can be removed by cleaning unit in foreign matters such as the substrate fragments of clamp member.It thus it can be prevented that substrate or its circumferential component by base
The foreign substance pollutions such as the fragment of plate.
Detailed description of the invention
Fig. 1 and Fig. 2 is the schematic diagram for the cutter for substrate being outlined in the embodiment of the present invention.
Fig. 3 is the schematic diagram of the illusory removal unit for the cutter for substrate being outlined in the embodiment of the present invention.
Fig. 4 and Fig. 5 be outlined the present invention implement in the clamp module of illusory removal unit of cutter for substrate show
It is intended to.
Fig. 6 is the clamp module signal that the illusory removal unit of cutter for substrate in the embodiment of the present invention is outlined
Figure.
The schematic diagram of the cleaning unit of cutter for substrate in the embodiment of the present invention is outlined in Fig. 7 and Fig. 8.
Fig. 9 to Figure 15 be successively indicate the first transfer unit of cutter for substrate in the embodiment of the present invention, scribing unit,
The operational process of illusory removal unit and the second transfer unit.
Appended drawing reference:
10: the first transfer units
20: the second transfer units
30: scribing unit
40: illusory removal unit
50: interval measurement unit
60: cleaning unit
90: control unit
Specific embodiment
Hereinafter, being illustrated referring to attached drawing to the cutter for substrate in the embodiment of the present invention.
It can be by the object that the cutter for substrate in the embodiment of the present invention is cut by first substrate and the second substrate patch
Adhesive substrates made of conjunction.For example, first substrate has thin film transistor (TFT), the second substrate can have colour filter.In contrast,
First substrate can have colour filter, and the second substrate can have thin film transistor (TFT).
Hereinafter, adhesive substrates are referred to as substrate, the surface of first substrate exposed to the outside is known as the first face, it will be sudden and violent
The surface for being exposed to external the second substrate is known as the second face.
Also, the transfer direction for the substrate that will carry out cutting action is defined as Y direction, will be perpendicular to base plate transfer side
It is X-direction to the direction definition of (Y direction).Also, the direction definition that will be perpendicular to place the X-Y plane of substrate is Z axis
Direction.
As shown in Figures 1 and 2, the cutter for substrate in the embodiment of the present invention includes: scribing unit 30；First sheet
Member 10, is transferred to scribing unit 30 for substrate S；Substrate S is transferred to from scribing unit 30 subsequent by the second transfer unit 20
Process；Illusory removal unit 40 is arranged adjacent to scribing unit 30；Control unit 90, the composition of control base board cutter device
The operation of element (referring to Fig. 4 and Fig. 5).
Scribing unit 30 is respectively formed the scribing line of X-direction in the first face of substrate S and the second face.
Scribing unit 30 includes: the first framework 31, is extended to X-direction；First scribe head 32, can be to X-direction
Movably it is set to the first framework 31；Second framework 33, in the lower section of the first framework 31 and the first framework 31 in parallel to X-axis
Direction extends；Second scribe head 34 can movably be set to second framework 33 to X-direction.
First framework 31 is provided with multiple first scribe heads 32 in the X-axis direction, and second framework 33 is arranged in the X-axis direction
There are multiple second scribe heads 34.The space that substrate S passes through is formed between first framework 31 and second framework 33.First framework
31 and second framework 33 can make and assemble respectively, or it is integrally formed.
First scribe head 32 and the second scribe head 34 are arranged oppositely mutually in Z-direction.
First scribe head 32 and the second scribe head 34 are additionally provided with the score wheel support sector 35 for maintaining score wheel 351.
It is set to the score wheel 351 of the first scribe head 32 and the score wheel 351 for being set to the second scribe head 34 is mutually opposite in Z-direction
Setting.
A pair of of score wheel 351 stresses on the first face and the second face of substrate S respectively.It pressurizes respectively in a pair of of score wheel 351
In the state of the first face and the second face of substrate S, the first scribe head 32 and the second scribe head 34 are relative to substrate S to X-axis side
To movement, cross so as to be formed in the first face of substrate S and second towards X-direction.
Also, the first scribe head 32 and the second scribe head 34 respectively can be to Z relative to the first framework 31 and second framework 33
Axis direction is mobile.For this purpose, can be between the first scribe head 32 and the first framework 31, between the second scribe head 34 and second framework 33
The actuator for being provided with pneumatics or oil pressure operation, the linear motor or ball screw device run according to electromagnetic interaction
Isoline mobile device.
With the first scribe head 32 and the second scribe head 34 relative to the first framework 31 and second framework 33 respectively to Z axis side
To movement, a pair of of score wheel 351 stresses on substrate S or far from substrate S.And it is possible to by adjusting the first scribe head 32 and
Second scribe head 34 adjusts the plus-pressure that a pair of of score wheel 351 is applied to substrate S to the mobile degree of Z-direction.Also, it is logical
It is mobile deep to the cutting of substrate S to adjust a pair of of score wheel 351 to Z-direction to cross the first scribe head 32 and the second scribe head 34
Degree.
First transfer unit 10 includes: multiple conveyer belts 11, is used to support substrate S；Component 12 is held, is propped up for holding
It supports in the rear row end of the substrate S on multiple conveyer belts 11；Support rod 13 connect with holding component 12 and extends to X-direction；
First guide rail 14 connect with support rod 13 and extends to Y direction；First plate 15 is arranged adjacent to scribing unit 30 and is floated
Floating foundation plate S or absorption and supporting substrate S.
Multiple conveyer belts 11 can be provided spaced in the X-axis direction.Each conveyer belt 11 is by multiple belt wheels 111
Support, at least one of multiple belt wheels 111 can be to provide the belt wheel of the driving force for carousel 11.
It is can be set between support rod 13 and the first guide rail 14 by pneumatics or the actuator of oil pressure operation, according to electromagnetism
Interact the linear motor run or ball screw device isoline mobile device.As an example, the linear movement equipment
It can be set in support rod 13 and/or the first guide rail 14.As a result, with hold component 12 hold substrate S in the state of, support
Bar 13 is mobile to Y direction by linear moving apparatus, and substrate S can be transferred to Y direction.At this point, multiple conveyer belts 11 with
It holds the mobile synchronization of component 12 and rotates, it can steadily supporting substrate S.
Holding component 12 can be the fixture that substrate S is maintained by pressure.Another example, hold component 12 can have with
Vacuum source connection vacuum hole and sorbing substrate S.
First plate 15 can float or sorbing substrate S.It is supplied for example, could be formed on the surface of the first plate 15 with gas
Source and multiple holes of vacuum source connection.When gas is supplied from gas supply source to multiple holes of the first plate 15, substrate S can be from first
Plate 15 floats.Also, when gas is inhaled by the negative pressure formed by vacuum source by multiple holes of the first plate 15, base
Plate S can be adsorbed on the first plate 15.
In the state that substrate S is floated from the first plate 15, substrate S can be with the first plate 15 without frictionally moving.Also,
During the first face of substrate S and the second face form scribing line, substrate S, which is adsorbed, is fixed on the first plate 15.
Second transfer unit 20 includes: the second plate 25, is adjacent to scribing unit 30 and is arranged, for float substrate S or
It adsorbs and supporting substrate S；Conveyer belt 21 is transferred, is provided adjacent to the second plate 25；Mobile device 26, be used for the second plate 25 and
Conveyer belt 21 is transferred to move back and forth to Y direction.The effect of mobile device 26 is, along to extended second guide rail of Y direction
24 move back and forth the second plate 25 and transfer conveyer belt 21 to Y direction.It can be applicable in as mobile device 26 through pneumatics or oil
Press the actuator of operation, according to the linear motor or ball screw device isoline mobile device of electromagnetic interaction operation.
Second plate 25 can be mobile with a Y direction in the same direction with transfer conveyer belt 21.That is, the second plate 25 and transfer conveyer belt 21
The direction (Y direction) for the transfer direction that substrate S can be parallel in the same direction with one is mobile.
Through scribing unit 30 when the first face of substrate S and the second face are respectively formed scribing line, the second plate 25 can be to
One plate 15 is mobile, and the first scribe head 32 and the second scribe head 34 can be between the first plate 15 and the second plates 25.Pass through scribing line
For unit 30 when the first face of substrate S and the second face are respectively formed scribing line, the second plate 25 is mobile to the first plate 15, so that substrate S
Steadily supported by the first plate 15 and the second plate 25.
Transfer conveyer belt 21 can be multiple, and multiple transfer conveyer belts 21 can be spaced apart in the X-axis direction.Each shifting
Conveyer belt 21 is sent to be supported by multiple belt wheels 211, at least one of multiple belt wheels 211 are to provide for rotating transfer conveyer belt
The driving pulley of 21 driving force.
Second plate 25 can float or sorbing substrate S.It is supplied for example, could be formed on the surface of the second plate 25 with gas
Source and multiple holes of vacuum source connection.When gas is supplied from gas supply source to multiple holes of the second plate 25, substrate S can be from second
Plate 25 floats.Also, when gas is inhaled by the negative pressure formed by vacuum source by multiple holes of the second plate 25, substrate
S can be adsorbed on the second plate 25.
During substrate S is transferred to the second plate 25, gas is provided to the hole of the second plate 25, and substrate S can be with as a result,
Relative to the second plate 25 without frictionally moving.
Also, during the first face of substrate S and the second face form scribing line, substrate S, which can be adsorbed, is fixed on the
Two plates 25.
Also, after the first face of substrate S and the second face are respectively formed scribing line, the first plate 15 and are adsorbed in substrate S
In the state of two plates 25, the second plate 25 is moved far from the first plate 15, and substrate S can be subject to cross and be divided as a result,.
Furthermore during substrate S is transferred to subsequent handling from the second plate 25, gas is supplied to the hole of the second plate 25,
Substrate S can be relative to the second plate 25 without frictionally moving as a result,.
As shown in Figures 3 to 5, the effect of illusory removal unit 40 be hold dummy portions (cullet (cullet), that is,
Used not as unit substrate, after dicing discarded non-active area) and removed from substrate S, the dummy portions are located at base
The edge at row end behind edge and substrate S that plate S is held in advance.
Illusory removal unit 40 can be set between the first transfer unit 10 and the second transfer unit 20.
Illusory removal unit 40 includes: support frame 41, is extended to X-direction；Clamp module 42, is set to support frame
41；Rotary module 43, with the central axis (axis for being parallel to X-direction) of support frame 41 for center rotating support 41；It is horizontal
Mobile module 44, to Y direction movable supporting frame 41；Module 45 is vertically moved, to Z-direction movable supporting frame 41.
Rotary module 43 may include the rotating electric machine of the rotation center axis connection by rotary shaft Yu support frame 41.Rotation
Module 43 may include being set to the power such as linking between the rotary shaft of rotating electric machine and supporting table 41, conveyer belt transmitting dress
It sets.
Moving horizontally module 44 or vertically moving module 45 can be by pneumatics or the actuator of oil pressure operation, according to electricity
The linear motor or ball screw device isoline mobile device of magnetic interaction operation.
Fig. 3, which illustrates rotary module 43, moves horizontally module 44 and vertically moves module 45, is respectively arranged at support frame 41
Two sides structure.But the present invention is not limited thereto, rotary module 43 moves horizontally module 44 and vertically moves module 45
It can be set in the side of support frame 41, the rotation of guidance support frame 41, horizontal shifting can be set in the other side of support frame 41
Guide device that is dynamic and vertically moving.
Multiple clamp modules 42 can be arranged along support frame 41 to X-direction.Clamp module 42 can be along support
The extended guide part 411 of frame 41 is mobile to X-direction.Pass through for this purpose, can be set between clamp module 42 and guide part 411
Pneumatics or the actuator of oil pressure operation, the linear motor according to electromagnetic interaction operation or the movement of ball screw device isoline
Equipment.As an example, the linear movement equipment can be set in clamp module 42 and/or guide part 411.As a result, with more
A clamp module 42 is mobile to X-direction by linear moving apparatus, the interval between adjustable multiple clamp modules 42.Cause
This, multiple clamp modules 42 correspond to the width of substrate S and are appropriately arranged with, so as to steadily hold substrate S.
Clamp module 42 includes: base member 421, is separably incorporated into support frame 41；Ontology 423 moves
Ground is set to base member 421；A pair of of clamp member 424, is set to ontology 423, close to each other or be moved away from；Driving
Device 427, for driving a pair of of clamp member 424.
Base member 421 is separately fixed to support frame 41, and clamp module 42 can be supported the support of frame 41 as a result,.
A pair of of clamp member 424 is closely moved across substrate S in-between, and the dummy portions of substrate S can be by
A pair of of clamp member 424 is held.As shown in Figures 4 and 5, a pair of of clamp member 424 is revolved by being subject to respective central axis
It transfers close to each other or is moved away from.The driving force that driving device 427 generates is transformed to a pair of of folder for this purpose, can be set
Tool component 424 rotates the device of required rotary force.But the present invention is not limited to this structures, a pair of of clamp member 424 can
It is mobile with linear type.The driving force that driving device 427 generates is transformed to a pair of of 424 straight line of clamp member for this purpose, can be set
The device of the mobile required driving force of type.
The face of the mutual opposite direction of a pair of of clamp member 424, i.e., the illusory portion against substrate S of a pair of of clamp member 424
Contact plate 425 can be set on the face divided.Contact plate 425 can be the flexible material such as carbamate.Contact plate 425 can
To absorb the impact generated when a pair of of clamp member 424 holds the dummy portions of substrate S, to prevent a pair of of clamp member 424
Or the breakage of substrate S.Also, contact plate 425 enables a pair of of clamp member 424 to hold substrate S's with uniform plus-pressure
Dummy portions.
Ontology 423 can be mobile relative to base member 421.Thus, it is possible to adjust ontology 423 relative to base member
421 position.Position by adjusting ontology 423 relative to base member 421, can be with the position of fine adjustment clamp member 424
It sets.For example, ontology 423 can be mobile to X-direction, Y direction and/or Z-direction relative to base member 421.Therefore, may be used
To adjust position of the ontology 423 relative to the X-direction of base member 421, Y direction and/or Z-direction, thus, it is possible to adjust
Save position of a pair of of clamp member 424 in X-direction, Y direction and/or Z-direction.
In order to adjust position of the ontology 423 relative to base member 421, in base member 421 and/or ontology 423, pedestal
Position-regulation portion 422 can be set between component 421 and ontology 423.For example, position-regulation portion 422 may include screw and
Device for rotary screw.It is rotated as a result, by screw by rotating device, ontology 423 can be moved relative to base member 421
It is dynamic, thus, it is possible to adjust the position of a pair of of clamp member 424.The screw of position-regulation portion 422 can be grasped manually by staff
Make.
In particular, passing through the position-regulation portion 422 of multiple clamp modules 42 when support frame 41 has multiple clamp modules 42
The position of adjustable respective a pair of of the clamp member 424 of multiple clamp modules 42, multiple clamp modules 42 can be uniform as a result,
The dummy portions of ground holding substrate S.Since multiple clamp modules 42 equably hold the dummy portions of substrate S, from base
It can prevent warpage of substrate S etc. from deforming during plate S removal dummy portions.
Driving device 427 can be motor, especially servo motor.Another example, driving device 427, which can be, passes through pneumatics
Or oil pressure operation actuator, according to electromagnetic interaction operation linear motor or ball screw device isoline movement set
It is standby.The effect of driving device 427 is the electric power using supply to driving device 427 to drive a pair of of clamp member 424.
A pair of of clamp member 424 hold the dummy portions of substrate S plus-pressure can according to the load of driving device 427 and
It is different.With the dummy portions of a pair of of clamp member 424 pressurization substrate S, the load of driving device 427 can increase.If base
The thickness of the dummy portions of plate S becomes larger, then the load of driving device 427 increases, so that a pair of of clamp member 424 suitably holds base
The dummy portions of plate S.For example, the load of driving device 427 can be torque when driving device 427 is rotation motor.
Driving device 427 is connect with control unit 90 and controlled unit 90 is controlled.Control unit 90 includes for surveying
Measure the load measurement module 91 of the load of driving device 427.
A pair of of clamp member 424 with predetermined plus-pressure pressure substrate S dummy portions when, predetermined load act on driving dress
Set 427.Load is measured by driving device 427 as a result, base is applied to by a pair of of clamp member 424 so as to measure
The plus-pressure of the dummy portions of plate S.
Load measurement module 91 can be with the load of real-time measurement driving device 427.Control unit passes through load measurement with 90
The dummy portions that a pair of of clamp member 424 is applied to substrate S are calculated subject to the load for the driving device 427 that module 91 measures
Plus-pressure.
For this purpose, increase the plus-pressure of a pair of of clamp member 424 by the load for increasing driving device 427, meanwhile, it can be with
Measure the experiment or simulation of the plus-pressure variation of a pair of of clamp member 424, the plus-pressure variation of the pair of clamp member
It is to be changed according to the variation of the load of driving device 427.It is available according to driving device by this experiment or simulation
The plus-pressure of a pair of of clamp member 424 of the variation of 427 load changes relevant data.Control unit 90 can be based on above-mentioned
The load of the driving device 427 of data and real-time measurement calculates the plus-pressure of a pair of of clamp member 424.
And it is possible on the basis of plus-pressure when a pair of of clamp member 424 is suitably held the dummy portions of substrate S is preset
Plus-pressure.This benchmark plus-pressure can be different according to the characteristic of the substrates S such as thickness, the material of substrate S.Pass through reality as a result,
Test or simulate the multiple benchmark plus-pressures that can preset the characteristic according to substrate S.
Control unit 90 judges whether a pair of of clamp member 424 suitably holds substrate S's based on this benchmark plus-pressure
Dummy portions.Control unit 90 is subject to the load of the driving device 427 that is measured by load measurement module 91 and calculates a pair of of folder
Tool component 424 is applied to the plus-pressure of the dummy portions of substrate S.
Also, control unit 90 compares the calculated plus-pressure and benchmark plus-pressure of a pair of of clamp member 424, if one
To the calculated plus-pressure of clamp member 424 within the scope of benchmark plus-pressure, it can be determined that be a pair of of clamp member 424 with suitable
When plus-pressure hold substrate S dummy portions.Also, control unit 90 compares the calculated of a pair of of clamp member 424 and adds
Pressure and benchmark plus-pressure judge if the calculated plus-pressure of a pair of of clamp member 424 exceeds benchmark plus-pressure range
Fail the dummy portions that substrate S is held with plus-pressure appropriate for a pair of of clamp member 424.
If the calculated plus-pressure of a pair of of clamp member 424 is greater than benchmark plus-pressure, control unit 90 can subtract
The load of small driving device 427 controls if the calculated plus-pressure of a pair of of clamp member 424 is less than benchmark plus-pressure
Unit 90 can increase the load of driving device 427.It executes and is adjusted by the load that control unit 90 adjusts driving device 427
After the stressed process of a pair of of clamp member 424, the work that dummy portions are removed by a pair of of clamp member 424 can be executed
Sequence.
Cutter for substrate according to an embodiment of the present invention as a result, a pair of of clamp member 424 is with plus-pressure appropriate holding
The dummy portions of substrate S, so as to easily remove the dummy portions of substrate S from substrate S.
Also, as another example, whether control unit 90 is based on this benchmark plus-pressure may determine that dummy portions from base
Plate S removal.It has executed using a pair of of clamp member 424 by dummy portions after the process that substrate S is removed, control unit 90 is by one
It is placed in the position where original dummy portions to clamp member 424, and runs a pair of of clamp member 424.At this point, if illusory portion
Divide and removed from substrate S, then can not hold the dummy portions of substrate S a pair of clamp member 424 closely moves, because
This, the load of driving device 427 do not exceed a pair of of clamp member 424 correspond to the stressed reference load of benchmark.On the contrary,
If dummy portions are not removed from substrate S, the dummy portions not being removed are held by a pair of of clamp member 424, therefore, are driven
The load of dynamic device 427 can be greater than a pair of of clamp member 424 and correspond to the stressed reference load of benchmark.
Control unit 90 judges whether by the load for the driving device 427 that load measurement module 91 measures be more than base as a result,
Quasi- load, take this as the standard judge dummy portions whether from substrate S remove.
Furthermore as shown in Figures 4 to 6, illusory control unit 40 may include interval measurement unit 50, the interval measurement
Unit is set to clamp module 42, for measuring the interval of a pair of of clamp member 424.
A pair of of clamp member 424 is subject to respective central axis when rotating respectively, and interval measurement unit 50 passes through measurement one
The interval of a pair of of clamp member 424 is measured the rotation amount of clamp member 424.Another example, a pair of of clamp member 424 is straight line
When the composition of type movement, interval measurement unit 50 is to measure a pair by measuring the linear movement amount of a pair of of clamp member 424
The interval of clamp member 424.
For example, as shown in fig. 6, interval measurement unit 50 includes that the reference component 51 of ontology 423 is arranged in and is set to one
To the sensing part 52 in any one in clamp member 424.Another example, reference component 51 can be set in a pair of of clamp portion
One of part 424, sensing part 52 can be set in ontology 423.Another example, reference component 51 can be set to be pressed from both sides in a pair
Have one of component 424, sensing part 52 can be set a pair of of clamp member 424 another.Another example again, reference component
51 can be set in ontology 423, and a pair of of sensing part 52 can be separately positioned on a pair of of clamp member 424.Another example, detecting part
Part 52 can be set in ontology 423, and a pair of of reference component 51 can be respectively arranged at a pair of of clamp member 424.
Interval measurement unit 50 measures a pair of of clamp member using the interaction of reference component 51 and sensing part 52
424 displacement, to measure the interval between a pair of of clamp member 424.
As an example, reference component 51 may include the scale of predetermined graduated, and sensing part 52 may include shooting scale
Camera.At this moment, be subject to the scale shot by sensing part 52 image come measuring basis component 51 and sensing part 52
Between relative position, be subject to measured relative position to measure the displacement of a pair of of clamp member 424.
Another example, reference component 51 can include the reflecting surface of reflection angle variation according to position, and sensing part 52 can be with
Including the luminescence sensor to reflection surface launching light and receive by the receipts optical sensor of the light of reflective surface.At this point, passing through survey
It measures by the reflection angle of the light of reflective surface come the relative position between measuring basis component 51 and sensing part 52, with tested
The relative position of amount is the displacement of locating tab assembly a pair of clamp member 424.
According to structure as above, in order to hold the dummy portions of substrate S, when a pair of of clamp member 424 closely moves,
Relative position between reference component 51 and sensing part 52 can change, and the variation based on this relative position can measure a pair
Interval between clamp member 424.
Interval measurement unit 50 can be with the interval of real-time measurement a pair of clamp member 424, and the interval of measurement is sent to
Control unit 90.
Control unit 90, which is subject to by the interval for a pair of of clamp member 424 that interval measurement unit 50 measures, judges a pair
Whether clamp member 424 suitably holds the dummy portions of substrate S.
For this purpose, can measure according to a pair of of clamp member 424 of the interval variation between a pair of of clamp member 424
The experiment or simulation of plus-pressure variation.It can obtain and be spaced according between a pair of of clamp member 424 by this experiment or simulation
The plus-pressure of a pair of of clamp member 424 of variation changes relevant data.
And it is possible on the basis of plus-pressure when a pair of of clamp member 424 is suitably held the dummy portions of substrate S is preset
Plus-pressure.This benchmark plus-pressure can be different according to the characteristic of the substrates S such as thickness, the material of substrate S.Therefore, Ke Yitong
Multiple benchmark plus-pressures of the characteristic according to substrate S can be preset by crossing experiment or simulation.
Control unit 90 is subject to said reference plus-pressure and may determine that whether a pair of of clamp member 424 suitably holds base
The dummy portions of plate S.Control unit 90 is subject to the interval between a pair of of the clamp member 424 measured by interval measurement unit 50
Calculate the plus-pressure that a pair of of clamp member 424 is applied to the dummy portions of substrate S.
Also, control unit 90 compares the calculated plus-pressure and benchmark plus-pressure of a pair of of clamp member 424, if one
To the calculated plus-pressure of clamp member 424 within the scope of benchmark plus-pressure, then may determine that for a pair of of clamp member 424 with
Plus-pressure appropriate holds substrate S.Also, control unit 90 compares the calculated plus-pressure and base of a pair of of clamp member 424
Quasi- plus-pressure is judged as a pair of of folder if the calculated plus-pressure of a pair of of clamp member 424 exceeds benchmark plus-pressure range
Tool component 424 fails the dummy portions that substrate S is held with plus-pressure appropriate.
If the calculated plus-pressure of a pair of of clamp member 424 is greater than benchmark plus-pressure, the control of control unit 90 is driven
It moves device 427 and increases the interval between a pair of of clamp member 424.Also, if the calculated of a pair of of clamp member 424 adds
Pressure is less than benchmark plus-pressure, then control unit 90 is reduced between a pair of of clamp member 424 by control driving device 427
Interval.The pressurization that a pair of of clamp member 424 is adjusted by the interval that control unit 90 adjusts a pair of of clamp member 424 is executed
After the process of power, the process that dummy portions are removed by a pair of of clamp member 424 can be carried out.
Therefore, cutter for substrate according to an embodiment of the present invention, a pair of of clamp member 424 is with plus-pressure appropriate holding
The dummy portions of substrate S easily remove the dummy portions of substrate S from substrate S.
Furthermore another example, control unit 90 can be subject to said reference plus-pressure and judge whether dummy portions go from substrate S
It removes.It has executed using a pair of of clamp member 424 by dummy portions after the process that substrate S is removed, control unit 90 presss from both sides a pair
Tool component 424 is placed in the position where original dummy portions, and runs a pair of of clamp member 424.At this point, if dummy portions from
Substrate S removal can not then hold the dummy portions of substrate S a pair of clamp member 424 closely moves, therefore,
The interval of driving device 427 do not exceed a pair of of clamp member 424 correspond to the stressed base interval of benchmark.On the contrary, such as
Fruit dummy portions are not removed from substrate S, then the dummy portions not being removed are held by a pair of of clamp member 424, therefore, driving
The interval of device 427 can be greater than a pair of of clamp member 424 and correspond to the stressed base interval of benchmark.
Control unit 90 may determine that the interval of a pair of of the clamp member 424 measured by interval measurement unit 50 as a result,
Whether exceed base interval, take this as the standard judge dummy portions whether from substrate S remove.
As shown in Figures 7 and 8, the cutter for substrate in the embodiment of the present invention further includes for cleaning illusory removal unit
40 cleaning unit 60.
Cleaning unit 60 can be close to illusory control unit 40.Also, illusory removal unit 40 can also be single close to cleaning
Member 60.
Cleaning unit 60 includes: brush 61, can be close to a pair of of 424 ground of clamp member setting；Brush-driven device 62,
For driving brush 61；Convolution module 63, be used to circle round brush 61；Horizontal drive module 64, by brush 61 to level side
It is mobile to (X-direction and/or Y direction)；Module 65 is vertically driven, brush 61 is mobile to vertical direction (Z-direction).
Brush-driven device 62 is for rotating brush 61.Another example, brush-driven device 62 can in the horizontal direction and/or
Brush 61 is vibrated in vertical direction.Brush 61 will be attached to clamp member 424 by the movement of brush-driven device 62 as a result,
Foreign matter is separated from clamp member 424.
The convolution convolution brush 61 of module 63 makes brush 61 easily close to clamp member 424.Convolution module 63 can be
The rotating electric machine being connect by brush 61 with connecting rod.Module 63 of circling round may include being set between rotating electric machine and brush 61
The power transmissions such as link, conveyer belt.
Horizontal drive module 64 or perpendicular drive module 65 can be by pneumatics or the actuator of oil pressure operation, according to electricity
The linear motor or ball screw device isoline mobile device of magnetic interaction operation.
After the substrate S of predetermined quantity removal dummy portions or after the predetermined time, cleaning unit 60 is utilized to execute
The cleaning process of illusory removal unit 40.
At this point, the brush 61 of cleaning unit 60 is by horizontal drive module 64 and/or perpendicular drive module 65 close to illusory
Removal unit 40.Also, brush 61 by brush-driven device 62 drive in the state of, brush 61 by convolution module 63 circle round and
Contact clamp member 424.To which the foreign matter for being attached to clamp member 424 is separated by brush 61.
Therefore, the substrate of clamp member 424 may be attached to when illusory removal unit 40 removes dummy portions from substrate S
The foreign matters such as the fragment of S can be removed by cleaning unit 60.Thus, it is possible to prevent substrate S or circumferential component by the broken of substrate S
The foreign substance pollutions such as piece.
In addition, cleaning unit 60 includes: shell 66, formed, and had so that brush 61 is exposed around brush 61
Opening；Gas supply module 67 is connected to shell 66 to shell 66 and supplies gas.It is supplied as a result, from gas supply module 67
Gas to shell 66 is sprayed by the opening of shell 66.
In the process for cleaning illusory removal unit 40, the opening of shell 66 can towards clamp member 424, as a result, from
The gas that gas supply module 67 is supplied is sprayed by the opening of shell 66 to clamp member 424.As above, shell 66 can play
Spray the effect of the nozzle of gas.As a result, by the driving of brush 61 and from the gas of the opening injection of shell 66, and from clamp portion
Part 424 removes the foreign matter for being attached to clamp member 424.Clamp member 424 is attached to so as to more efficiently carry out removal
The process of foreign matter.
Also, cleaning unit 60 may include the vacuum source 69 connecting with shell 66.Because of the influence shell 66 of vacuum source 69
It will receive suction function.Therefore, under the action of acting on the negative pressure of shell 66 by vacuum source 69,66 open circumferential of shell
Air can be drawn into shell 66.It will not be splashed to surrounding from the isolated foreign matter of clamp member 424 using brush 61 as a result,
It can flow into shell 66.Also it therefore can prevent the week that cleaning unit 60 will not be splashed to from the isolated foreign matter of clamp member 424
Side and the periphery for polluting cleaning unit 60.
In addition, being can be set between shell 66 and vacuum source 69 for filtering the foreign matter removed from clamp member 424
Filter 68.
Gas supply module 67 and vacuum source 69 can be set along in cleaning unit 60.At this moment, gas supply module 67
And vacuum source 69 is alternateed or is successively run.
Hereinafter, being illustrated referring to Fig. 9 to Figure 15 to the operation of the cutter for substrate in the embodiment of the present invention.
As shown in figure 9, substrate S is by the first transfer unit in the state that the dummy portions that substrate S is held in advance are not removed
10 are transferred to scribing unit 30.At this point, substrate S is floated by the gas sprayed from the first plate 15 from the first plate 15.
Also, if substrate S is located on the first plate 15, substrate S is adsorbed by the first plate 15.At this point, the first scribe head 32
And second scribe head 34 score wheel 351 be contacted with after substrate S respectively it is mobile to X-direction, therewith in the dummy portions of substrate S
Form cutting line.
Also, as shown in Figure 10, the clamp module 42 of illusory removal unit 40 is moved to the substrate S's for being formed with cutting line
Dummy portions.Later, the rotation of support frame 41 or horizontal in the state that a pair of of clamp member 424 holds the dummy portions of substrate S
And/or vertical (X-direction, Y direction and/or Z-direction) is mobile, so as to remove dummy portions from substrate S.Removal is empty
If partial clamp module 42 is returned to the original for not interfering the movement of score wheel 351 of the first scribe head 32, the second scribe head 34
Position.
In addition, as shown in figure 11, in the state that the first plate 15 is fixed, the second plate 25 is towards the first plate 15 in Y direction
Upper movement.The interval between the first plate 15 and the second plate 25 is reduced as a result, and substrate S stablizes branch by the first plate 15 and the second plate 25
Support.
Later, substrate S is transferred to scribing unit 30.At this point, substrate S is in the gas supplied to the first plate 15 and the second plate 25
Under the action of floated from the first plate 15 and the second plate 25.
Also, as shown in figure 12, substrate S is located on the first plate 15 and the second plate 25, then substrate S is by the first plate 15 and second
Plate 25 adsorbs.At this point, the score wheel 351 of the first scribe head 32, the score wheel 351 of the second scribe head be contacted with respectively substrate S it
Backward X-direction is mobile, to form X-axis cutting line in substrate S.
Furthermore after as shown in figure 13, forming X-axis cutting line on substrate S, 351, second strokes of the score wheel of the first scribe head 32
The score wheel 351 of the end of a thread moves and separate substrate S.Later, in the state that substrate S is adsorbed by the first plate 15 and the second plate 25,
Second plate 25 is moved far from the first plate 15, then substrate S is divided along X-axis cutting line.
Furthermore behind the middle section for as shown in figure 14, dividing substrate S, the dummy portions at the rear row end of substrate S are not gone
In the state of removing, substrate S is transferred to scribing unit 30.At this point, substrate is under the action of the gas sprayed from the second plate 25
The floating of two plates 25.
Later, substrate S is placed on the second plate 25, then substrate S is adsorbed by the second plate 25.At this point, the first scribe head 32 is drawn
Piece wheel 351, the second scribe head score wheel 351 be contacted with after substrate S respectively it is mobile to X-direction, thus in the illusory of substrate S
Part forms X-axis cutting line.
Furthermore as shown in figure 15, the clamp module 42 of illusory removal unit 40 is moved to the substrate for being formed with X-axis cutting line
The dummy portions of S.Later, the rotation of support frame 41 or water in the state that a pair of of clamp member 424 holds the dummy portions of substrate S
Flat and/or vertical (X-direction, Y direction and/or Z-direction) is mobile, so that dummy portions be removed from substrate S.Removal is empty
If partial clamp module 42 is returned to the score wheel 351 of the score wheel 351, the second scribe head that do not interfere the first scribe head 32
Mobile original position.
In addition, the substrate S along the segmentation of X-axis cutting line can be transferred to subsequent handling by transferring conveyer belt 21.
Cutter for substrate in the embodiment of the present invention, with the negative of the driving device 427 of a pair of of clamp member 424 of operation
The plus-pressure that a pair of of clamp member 424 is calculated subject to lotus adjusts calculated plus-pressure compared with benchmark plus-pressure
The plus-pressure of a pair of of clamp member 424.To so that a pair of of clamp member 424 holds substrate S's with scheduled benchmark plus-pressure
Dummy portions.Therefore, the dummy portions of substrate S can be steadily held, successfully remove dummy portions from substrate S.
Furthermore the cutter for substrate in the embodiment of the present invention is counted on the basis of the interval between a pair of of clamp member 424
The plus-pressure for calculating a pair of of clamp member 424, by calculated plus-pressure compared with benchmark plus-pressure, so as to adjust a pair
The plus-pressure of clamp member 424.To so that a pair of of clamp member 424 holds the illusory of substrate S with scheduled benchmark plus-pressure
Part.Therefore, the dummy portions of substrate S can be steadily held, successfully remove dummy portions from substrate S.
In particular, a pair of of clamp member 424 of each clamp module is when support frame 41 has multiple clamp modules 42 with appropriate
Plus-pressure hold substrate S dummy portions.Multiple clamp modules 42 are relatively synchronized as a result, steadily hold substrate S's
Dummy portions can prevent substrate S during removing dummy portions from substrate S from sticking up to remove the dummy portions of substrate S
Bent or damaged problem.Following problem can be prevented, i.e., in multiple clamp modules 42 fails relatively to synchronize, but with not
The deformation of the substrate S occurred when the dummy portions of same plus-pressure holding substrate S, the broken of substrate S, the broken of substrate S cause
Fragment generation etc..
The improper change of plus-pressure in multiple clamp modules 42 can be confirmed in cutter for substrate in the embodiment of the present invention
The clamp module 42 of change can check or replace at this time the clamp module 42 of plus-pressure irregular change.So as to prevent from
Substrate S removes the unfavorable condition occurred when dummy portions.
Cutter for substrate in the embodiment of the present invention, to run the load of the driving device 427 of a pair of of clamp member 424
Subject to calculate the plus-pressure of a pair of of clamp member 424, be subject to calculated plus-pressure to judge dummy portions whether from substrate S
Removal.So as to perform effectively the process from substrate S removal dummy portions.
Cutter for substrate in the embodiment of the present invention, being subject to the interval of a pair of of clamp member 424 calculates a pair of of fixture
The plus-pressure of component 424, be subject to calculated plus-pressure judge dummy portions whether from substrate S remove.So as to have
Effect executes the process from substrate S removal dummy portions.
So as to prevent from failing because of dummy portions suitably removing from substrate S, from substrate S during substrate S transfer
Separate or fall and pollute cutter for substrate periphery or damaged substrate cutter device periphery component or substrate S the problem of.
Furthermore the cutter for substrate in the embodiment of the present invention removes dummy portions from substrate S in illusory removal unit 40
When, being attached to the foreign matters such as the fragment of substrate S of clamp member 424 can be removed by cleaning unit 60.It thus it can be prevented that substrate S
Or its circumferential component is by foreign substance pollutions such as the fragments of substrate S.
Although illustrating the preferred embodiment of the present invention, the scope of the present invention is not limited to such specific reality
Example is applied, can be suitably changed in the range recorded in claims.
Claims (10)
1. a kind of cutter for substrate, wherein include:
Scribing unit is crossed for being formed in substrate；
Illusory removal unit comprising the clamp member of dummy portions is held, to be formed in institute along by the scribing unit
The scribing line for stating the dummy portions of substrate divides the dummy portions from the substrate；And
Cleaning unit is used to remove the foreign matter for being attached to the clamp member.
2. cutter for substrate according to claim 1, wherein
The cleaning unit includes:
Brush can be arranged close to the clamp member；
Brush-driven device, for driving the brush；And
Convolution module, for the brush that circles round.
3. cutter for substrate according to claim 2, wherein
The cleaning unit further include:
Horizontal drive module, for the brush is mobile to horizontal direction；And
Module is vertically driven, for the brush is mobile to vertical direction.
4. cutter for substrate according to claim 2, wherein
The cleaning unit further include:
Shell forms around the brush, and has the opening for keeping the brush exposed；And
Gas supply module is connected to the shell and supplies gas to the shell.
5. cutter for substrate according to claim 2, wherein
The cleaning unit further include:
Shell forms around the brush, and has the opening for keeping the brush exposed；And
Vacuum source, with the cage connection.
6. cutter for substrate according to claim 5, wherein
Filter is provided between the shell and the vacuum source.
7. the cutter for substrate according to any one of claims 1 to 6, wherein the illusory removal unit includes:
Clamp module comprising the clamp member；
Support frame is used to support the clamp module；
Rotary module, the central axis of support frame as described above of being subject to rotate support frame as described above；
Module is moved horizontally, for moving horizontally support frame as described above；And
Module is vertically moved, for vertically moving support frame as described above.
8. cutter for substrate according to claim 7, wherein
The clamp module is provided with multiple, length direction of the multiple clamp module in support frame as described above in support frame as described above
On be movably arranged at support frame as described above, so that the interval between the multiple clamp module is adjusted.
9. cutter for substrate according to claim 7, wherein
The clamp module includes:
Base member；
Ontology is movably disposed relative to the base member, and is provided with the clamp member；And
Position-regulation portion, relative to the mobile ontology of the base member.
10. cutter for substrate according to claim 1, wherein
The face against the substrate of the clamp member is provided with contact plate.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2017-0157305 | 2017-11-23 | ||
| KR1020170157305A KR102067982B1 (en) | 2017-11-23 | 2017-11-23 | Apparatus for cutting substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109824254A true CN109824254A (en) | 2019-05-31 |
Family
ID=66657006
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811390303.3A Pending CN109824254A (en) | 2017-11-23 | 2018-11-21 | Cutter for substrate |
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| Country | Link |
|---|---|
| KR (1) | KR102067982B1 (en) |
| CN (1) | CN109824254A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110340960A (en) * | 2019-07-30 | 2019-10-18 | 徐州托普新材料有限公司 | Cutting device is used in a kind of production of plastic plate |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102304576B1 (en) * | 2019-08-27 | 2021-09-24 | 주식회사 탑 엔지니어링 | Dummy removing unit and scribe apparatus including the same |
| KR102304578B1 (en) * | 2019-12-20 | 2021-09-27 | 주식회사 탑 엔지니어링 | Scribing appatus |
| KR102353205B1 (en) * | 2019-12-20 | 2022-01-21 | 주식회사 탑 엔지니어링 | Scribing apparatus |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1486285A (en) * | 2001-01-17 | 2004-03-31 | 三星宝石工业株式会社 | Scribing and breaking apparatus, system therefor, and scribing and breaking method |
| CN1692083A (en) * | 2001-11-08 | 2005-11-02 | 夏普株式会社 | Method and device for parting glass substrate, liquid crystal panel, and liquid crystal panel manufacturing device |
| KR20090114866A (en) * | 2008-04-30 | 2009-11-04 | 주식회사 에스에프에이 | Glass cutting system |
| CN103764004A (en) * | 2011-08-23 | 2014-04-30 | 皇家飞利浦有限公司 | Cleaning device for cleaning a surface comprising a brush and a squeegee element |
| CN105058603A (en) * | 2015-08-12 | 2015-11-18 | 深圳市华星光电技术有限公司 | Cutoff device |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5058451B2 (en) * | 2005-06-02 | 2012-10-24 | コーニングジャパン株式会社 | Sheet material cutting unit, cutting device having this cutting unit, and cutting equipment having this cutting device |
| JP4960405B2 (en) * | 2009-04-28 | 2012-06-27 | 川崎重工業株式会社 | Sheet material cutting unit |
| KR101210248B1 (en) | 2012-01-11 | 2012-12-11 | 주식회사 톱텍 | A auto removal apparatus for dummy of stick |
| JP2017177452A (en) * | 2016-03-29 | 2017-10-05 | 三星ダイヤモンド工業株式会社 | End material removal device and end material removal method |
-
2017
- 2017-11-23 KR KR1020170157305A patent/KR102067982B1/en active IP Right Grant
-
2018
- 2018-11-21 CN CN201811390303.3A patent/CN109824254A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1486285A (en) * | 2001-01-17 | 2004-03-31 | 三星宝石工业株式会社 | Scribing and breaking apparatus, system therefor, and scribing and breaking method |
| CN1692083A (en) * | 2001-11-08 | 2005-11-02 | 夏普株式会社 | Method and device for parting glass substrate, liquid crystal panel, and liquid crystal panel manufacturing device |
| KR20090114866A (en) * | 2008-04-30 | 2009-11-04 | 주식회사 에스에프에이 | Glass cutting system |
| CN103764004A (en) * | 2011-08-23 | 2014-04-30 | 皇家飞利浦有限公司 | Cleaning device for cleaning a surface comprising a brush and a squeegee element |
| CN105058603A (en) * | 2015-08-12 | 2015-11-18 | 深圳市华星光电技术有限公司 | Cutoff device |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110340960A (en) * | 2019-07-30 | 2019-10-18 | 徐州托普新材料有限公司 | Cutting device is used in a kind of production of plastic plate |
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| Publication number | Publication date |
|---|---|
| KR102067982B1 (en) | 2020-01-20 |
| KR20190059570A (en) | 2019-05-31 |
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