KR20090114866A - Glass cutting system - Google Patents

Abstract

PURPOSE: A glass cutting system is provided to mainly heat a desired scribe line region in order to get rid of existing problems that a whole substrate has to be heated unnecessarily. CONSTITUTION: A glass cutting system comprises a loading unit(100), substrate transferring unit(200), scribing unit(300), clamp unit(400), and break unit(500). The loading unit loads a raw substrate which is to be cut into plural unit substrates. The substrate transferring unit transfers the raw substrate. The scribing unit is located on one side of the substrate transferring unit and forms scribe lines on the raw substrate. The clamp unit clamps the raw substrate which moves toward the scribing unit. The break unit heats the raw substrate such that it is divided into plural unit substrates.

Description

Substrate Cutting System

The present invention relates to a substrate cutting system, and more particularly, since it is possible to concentrate and heat a substantially desired scribe line region, it is possible to solve the inefficiency of heating the entire base substrate unnecessarily as in the prior art. Furthermore, the present invention relates to a substrate cutting system capable of improving productivity by improving cutting efficiency even with less power than before.

Recently, the flat panel display (FPD) has begun to emerge as the electronic display industry is rapidly developing among the semiconductor industry.

The flat panel display is used as a display device of a TV or a computer monitor or a device such as a mobile phone, a PDA or a digital camera. Types of flat panel displays include liquid crystal display (LCD) substrates, plasma display panel (PDP) substrates, and organic light emitting diodes (OLED) substrates.

On the other hand, the LCD substrate as a typical flat panel display is a glass top plate (CF, Color Filter) and the bottom plate (TFT, Thin Film Transistor) and the upper and lower plates Each of the upper and lower polarizers is coupled to the exposed surface to impart optical characteristics at the corresponding position.

The upper plate forming the image of the color is formed smaller in area than the lower plate. Therefore, after the upper plate and the lower plate are bonded, a pad portion that is a portion where the upper plate does not overlap is provided on the upper surface of the lower plate. The pad portion is combined with an IC driver for controlling the unit board, and an FPC for connecting the IC driver to the printed circuit board.

LCD substrates currently on the market are available in various sizes, including 17 inches, 21 inches, and 50 inches, and these LCD substrates are formed by joining the upper and lower plates together and cutting the large-area original substrate with a large area. After cutting into several to tens of equal parts through the unit substrate, the IC driver is mounted on the pad portion of the unit substrate in the module process and released as a single finished product.

At this time, the cutting process of cutting the original substrate into a plurality of unit substrates is carried out through a separate cutting system, that is, a substrate cutting system also called a scriber or scribe device.

Such a substrate cutting system includes a scribe unit for forming a scribe line, which is a reference line of cutting on a base substrate, and a brake unit for substantially cutting the base substrate along a scribe line to form a plurality of unit substrates. break unit) may be provided.

In connection with the brake unit, a heating fluid having a temperature for expanding the substrate is sprayed onto the substrate on which the scribe line is formed by the scribe unit, thereby spreading vertical cracks extending from the scribe line in the thickness direction of the substrate to substantially cut the substrate. The brake unit is known.

However, in such a substrate cutting system, since the brake unit has a structure injecting a heating fluid to the scribe line of the substrate in order to cut the substrate, foreign matters such as moisture remain in the substrate where the cutting operation is completed. There is a problem in that the structure of the system is complicated because it must have a somewhat complicated piping structure for injecting the fluid.

In view of this problem, although not yet disclosed, there is a patent application for a substrate cutting system having a brake unit which is movable to a stage but is equipped with a substrate heating unit having a heater. This substrate cutting system has a structure in which the entire unit body portion including the substrate heating portion moves with respect to the substrate or heats the entire area of the substrate while the substrate moves to the substrate heating portion.

By the way, in these techniques of spreading a crack in the thickness direction of a board | substrate from the scribe line formed in the board | substrate, and spraying the heating fluid which cut | disconnects a board | substrate, or heating it with the heating part provided with a heater, the whole area | region of a base board is heated, or the whole area | region is carried out. Since the heating fluid is sprayed, there is a disadvantage in that only the scribe line cannot be heated intensively or the heating fluid is not sprayed, so that the crack cannot be efficiently advanced to the scribe line. In other words, by concentrating only on the part where the scribe line is formed to advance the crack and not heating the part unnecessarily to the part where the scribe line is not formed, the cutting efficiency is lowered and power loss is generated, thereby improving the structure. Is required.

An object of the present invention is that the desired scribe line region can be heated in a concentrated manner, thereby eliminating the inefficiency of heating the entire area of the original substrate unnecessarily as in the prior art, and furthermore, cutting efficiency with less power than before. It is to provide a substrate cutting system that can improve the productivity by improving.

The object is, according to the present invention, a scribe unit for forming a scribe line on a base substrate; And a break unit that heats the base substrate such that the base substrate on which the scribe line is formed can be cut into a plurality of unit substrates along the scribe line, wherein the break unit comprises: the scribe on the base substrate; By a substrate cutting system comprising at least one hot air nozzle that is individually movable in at least one of the X, Y and Z axes to heat the line region individually. Is achieved.

The at least one individual hot air nozzle may be a plurality of individual hot air nozzles, and the plurality of individual hot air nozzles may collectively move in at least one of the X, Y, and Z axes. It may be arranged in the work line is a cutting operation for the base substrate.

The plurality of individual hot air nozzles may be individually coupled to each of the plurality of nozzle heads.

The plurality of individual hot air nozzles and the plurality of nozzle heads may be arranged along the X-axis direction, which is a horizontal direction, on a work line in which a cutting operation for the substrate is performed.

The brake unit may include an X-axis moving unit for moving the X-axis of the plurality of individual hot air nozzles; A Y-axis moving unit for moving the Y-axis of the plurality of individual hot air nozzles; And a Z-axis moving unit for moving the Z-axis of the plurality of individual hot air nozzles.

The plurality of individual hot air nozzles may be respectively connected to the X-axis moving unit so as to be individually movable on the X-axis.

The X-axis moving unit may be two rows of X-axis moving units disposed along the Y axis, and a plurality of individual hot air nozzles respectively connected to the two rows of X-axis moving units are moved to the Y axis by the Y-axis moving unit. To move miraculously, the X-axis moving parts of the two rows may be coupled to the Y-axis moving parts.

The X-axis moving unit may be coupled to the Z-axis moving unit such that a plurality of individual hot air nozzles respectively connected to the X-axis moving unit are individually moved to the Z-axis by the Z-axis moving unit.

The X-axis moving unit may be a linear pulse motor unit, the Y-axis moving unit may be a driving unit, and the Z-axis moving unit may be an air cylinder.

The apparatus may further include a controller configured to control movement of the X-axis moving unit, the Y-axis moving unit, and the Z-axis moving unit.

On the other hand, the above object, according to the present invention, a scribe unit (scribe unit) for forming a scribe line (scribe line) on the base substrate; And a break unit that heats the base substrate so that the base substrate on which the scribe line is formed along the scribe line can be cut into a plurality of unit substrates, wherein the break unit is fixedly disposed at a predetermined position. It is also achieved by a substrate cutting system comprising a plurality of individual hot air nozzles to heat the scribe line region separately on the base substrate.

According to the present invention, since the desired scribe line area can be concentrated and heated, the inefficiency of heating the entire area of the substrate unnecessarily as in the past can be eliminated, and the cutting efficiency is improved even with less power than before. To improve productivity.

1 is a schematic perspective view of a substrate cutting system according to an embodiment of the present invention.

2 is a configuration diagram schematically showing the configuration of the scribe unit.

3 is an enlarged view illustrating main parts of the clamp unit.

4 is an enlarged perspective view of the brake unit region.

5 is a schematic side view of FIG. 4.

FIG. 6 is a schematic diagram illustrating a process of cutting the original substrate into eight unit substrates by the brake unit. Referring to FIG.

FIG. 7 is a schematic diagram illustrating a process in which a base board is cut into 45 unit boards by a brake unit.

* Explanation of symbols for the main parts of the drawings

G1: Original board G2: Unit board

100: loading unit 200: substrate transfer unit

300: scribe unit 400: clamp unit

500: Brake unit 510a, 510b: Individual hot air nozzle

520a, 520b: nozzle head 530a, 530b: X axis moving part

540: Y-axis moving part 550: Z-axis moving part

In order to fully understand the present invention, the operational advantages of the present invention, and the objects achieved by the practice of the present invention, reference should be made to the accompanying drawings which illustrate preferred embodiments of the present invention and the contents described in the accompanying drawings.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings. Like reference numerals in the drawings denote like elements.

For reference, the substrate to be described below refers to a flat panel display (FPD) including a liquid crystal display (LCD) substrate, a plasma display panel (PDP) substrate, an organic light emitting diodes (OLED) substrate, and the like. For the convenience of description, these will be referred to as substrates without being divided.

Figure 1 is a schematic perspective view of a substrate cutting system according to an embodiment of the present invention, Figure 2 is a schematic diagram showing the configuration of the scribe unit, Figure 3 is an enlarged view of the main portion for the clamp unit. The schematic structure of the substrate cutting system will be described with reference to these drawings.

The substrate cutting system according to the present embodiment includes a loading unit 100 on which a substrate G1 to be cut into a plurality of unit substrates G2 is loaded, and a work line in which cutting operations on the substrate G1 are performed. A substrate transfer unit 200 for forming a scribe line, a scribe unit 300 for forming a scribe line on a base substrate G1, and a scribe unit provided in one region of the substrate transfer unit 200. Clamp unit 400 for clamping the base plate G1 directed to the unit 300 and the scribing unit 300 are provided at the rear of the scribe unit 300 along the direction in which the base plate G1 is transferred, but move along the work line. It is possible to include a break unit 500 for heating the base plate G1 so that the base plate G1 can be cut into the plurality of unit substrates G2 along the scribe line.

The loading unit 100 is a portion where the original substrate G1 to be cut is first placed. The base plate G1 may be loaded onto the loading unit 100 by a separate robot. Since the substrate G1 loaded in the loading unit 100 is substantially cut after being transferred to the substrate transfer unit 200, the structure of the loading unit 100 may be, for example, a simple roller conveyor type. have.

However, in this embodiment, the loading unit 100 is applied as a timing belt type to accurately transfer the substrate G1 to the substrate transfer unit 200. That is, although not shown in detail, the loading unit 100 is provided with a plurality of belt conveyor (not shown) serves to transfer the substrate (G1) transmitted from the robot to the substrate transfer unit 200. However, when the base plate G1 is transferred from the robot, the base plate G1 may not be in contact with the belt as it is, so that the loading unit 100 may further include a plurality of lift pins (not shown). have. That is, when the base plate G1 is transferred from the robot to the loading unit 100, the lift pins are raised to support the base plate G1, and when the robot is taken out, the lift pins are lowered while the base plate G1 is formed by a plurality of plates. Make sure that it can be contacted and supported by the belt conveyor.

In addition, the loading unit 100 may be further provided with an alignment unit 110 for aligning the loaded substrate G1. The alignment unit 110 serves to align the base substrate G1 by supporting the corner regions of the base substrate G1 that are provided at both corner regions of the base substrate G1. For reference, since the base plate G1 is made of glass, the internal structure of the loading unit 100 should be partially seen through the base plate G1, but the internal structure of the loading unit 100 is omitted in FIG. 1. Doing.

The substrate transfer unit 200 occupies most of the area of the present substrate cutting system as a portion for transferring the substrate G1. That is, in FIG. 1, except for the loading unit 100, all the portions in which the original substrate G1 is transferred or the unit substrate G2 is finally placed are the substrate transfer unit 200.

Since the substrate transfer unit 200 serves to move the substrate G1 in the Y-axis direction of FIG. 1, the substrate transfer unit 200 may be applied to a belt conveyor type or may be applied to a roller type. If necessary, a stage type may be applied, but in this embodiment, a belt conveyor type is used. That is, the substrate conveying unit 200 is provided by arranging a plurality of belt conveyor units 210 in the plate direction and assembling them on the conveyor frame structure 220. At the lower end of the conveyor frame structure 220, a plurality of height adjustment foot members 221 are provided to support the conveyor frame structure 220 with respect to the ground and to adjust the height of the conveyor frame structure 220 with respect to the ground. In addition, the inside of the conveyor frame structure 220 is provided with a rotary driving unit (not shown) for rotating the plurality of belt conveyor unit 210.

In assembling the belt conveyor units 210 on the conveyor frame structure 220, most of the belt conveyor units 210 are arranged such that a coupling line in the X-axis direction is approximately straight (-).

However, the conveyor units 210 positioned between the scribe unit 300 and the brake unit 500 are arranged to have a zigzag shape such that the coupling lines in the X-axis direction are staggered from each other. That is, the conveyor unit 210 is to be continued in the Y-axis direction when the length is long is divided and connected in the Y-axis direction, this time the coupling line in the X-axis direction is arranged in a zigzag pattern. This is a space between the conveyor units 210, although the glass fragments or dummy glass cut off from the base plate G1 should be collected and discharged to the discharge unit (not shown) of the post-process. This is to solve the disadvantages such as falling particles at intervals between the () to generate particles (particles) or difficult to clean.

As such, by arranging the conveyor units 210 such that the bond lines in the X-axis direction formed by the conveyor units 210 cross each other, the glass fragments or dummy substrates cut out from the original substrate G1 are conveyed to the conveyor units 210. It can be transported to a post process and finally collected and collected without falling into the spaced intervals therebetween.

In order to collect and collect the glass fragments or the dummy substrate, a discharge unit (not shown) through which the glass fragments or the dummy substrate is discharged may be provided in the rear region of the conveyor unit 210 along the Y-axis direction. The discharge part may further include a crushing part (not shown) for crushing the substrate. As the base substrate G1 is transferred by the substrate transfer unit 200 and finally cut into a plurality of unit substrates G2, an in-line of the base substrate G1 can be constructed, so the tact can be constructed. Tact Time can be reduced. Therefore, there is an advantage that can improve productivity.

The scribe unit 300 is a part which forms the scribe line used as the reference line of cutting | disconnection on the base substrate G1. As shown in FIG. 2, the scribe unit 300 is disposed on an upper region of the base substrate G1 with the base substrate G1 interposed therebetween and formed on the top plate CF that forms the upper surface of the base substrate G1. An upper scribe head 310 for forming a scribe line, and a lower scribe head for forming a scribe line on a lower region (TFT, Thin Film Transistor) formed on a lower region of the base substrate G1 to form a lower surface of the base substrate G1 ( 320).

As such, the upper and lower scribe lines may be formed on the upper and lower surfaces of the substrate G1 due to the upper and lower scribe heads 310 and 320 provided to face each other with the substrate G1 interposed therebetween. In this case, before scribing is started on the surface of the base plate G1, the upper scribe head 310 and the lower scribe head 320 move to the load cells 311 and 321 provided correspondingly, respectively, to lower (the upper scribe head). In the case of 310a) and the pressure in the case of the lower scribe head 320, the pressure may be measured and adjusted to a preset reference pressure by a separate control signal.

As described above, forming the scribe lines on the upper and lower surfaces of the base substrate G1 with the upper and lower scribe heads 310 and 320, respectively, is a bonding in which two substrates are bonded together as in the LCD substrate which is the substrate G1 of the present embodiment. It can be usefully applied in the case of a substrate. That is, in the case of a bonded substrate, if one surface is scribed with one scribe head, the inverted substrate is inverted, and the other surface is scribed again with the same scribe head, so that a process time is long and a device (inverter) for inverting the bonded substrate is required. However, if the scribe lines are formed on the upper and lower surfaces of the base substrate G1 as the bonding substrate by the two upper and lower scribe heads 310 and 320, the work process time is reduced and a separate reversing device is unnecessary. .

The upper and lower scribe heads 310 and 320 are coupled to the upper and lower horizontal axes 310a and 320a disposed in the X-axis direction of FIG. 1, respectively. The upper and lower scribe heads 310 and 320 are provided to be moved in the X-axis direction on the upper and lower scribe heads 310 and 320, respectively. Accordingly, the substrate transfer unit 200 transfers the substrate G1 to the upper and lower surfaces of the substrate G1 by fixing the upper and lower scribe heads 310 and 320 to the upper and lower horizontal axes 310a and 320a. The upper and lower scribe lines can be formed in the Y-axis direction, respectively, and the upper and lower scribe heads 310 and 320 are moved along the upper and lower horizontal axes 310a and 320a while the substrate transfer unit 200 is stopped. Upper and lower scribe lines in the X-axis direction may be formed on the upper and lower surfaces of the base substrate G1, respectively.

Meanwhile, in forming the upper and lower scribe lines, it is necessary to determine the positions of the upper and lower scribe lines, which are performed by upper and lower cameras (not shown) provided close to the upper and lower scribe heads 310 and 320. Can be. That is, the position of the upper scribe head 310 on the upper horizontal axis 310a and the position of the lower scribe head 320 on the lower horizontal axis 320a may be determined through control based on the images observed by the upper and lower cameras. .

The clamp unit 400 serves to clamp the substrate G1 directed to the scribe unit 300. When a scribe line is formed on the substrate G1 by the scribe unit 300 on the substrate transfer unit 200, if there is no means for clamping (grabbing) the substrate G1 on the substrate transfer unit 200. The base plate G1 may be shaken. If the base plate G1 is shaken, an accurate scribe line cannot be formed on the base plate G1. In order to prevent this phenomenon, the clamp unit 400 is provided.

The clamp unit 400 is a clamp unit main body 410 disposed in the X-axis direction in the upper region of the substrate transfer unit 200, and is provided on the clamp unit main body 410 and is substantially an area of the original substrate G1. The clamp 420 for clamping the clamp unit, and the clamp unit moving unit 430 for moving the clamp unit main body 410 in the Y-axis direction.

As shown in FIGS. 1 and 3, the clamp unit body 410 is a portion in which a plurality of clamps 420 that clamp a region of the base substrate G1 are detachably coupled to each other. The clamp unit main body 410 is disposed long in the X-axis direction of FIG. 1, and is connected to the clamp unit moving part 430.

A plurality of clamps 420 are coupled to the clamp unit body 410 so as to be spaced apart from each other. The clamp 420 serves to substantially clamp a region of the base plate G1 by a pair of chucks 421 and 422 having a tong-shaped engagement structure. That is, as the rotation chuck 422 approaches and is spaced about the rotation shaft 422a with respect to the fixed chuck 421, the base plate G1 is clamped between the fixed chuck 421 and the rotation chuck 422. Can be. At this time, the rotation chuck 422 is rotated by the rotation chuck driver 423 coupled to the rotation chuck 422. In addition, the fixed chuck 421, the rotating chuck 422, and the like, including the rotation chuck driver 423, may be driven up and down by the clamp lift driver 424.

Accordingly, the clamp raising and lowering driving unit 424 is operated by a separate control signal to lower the fixed chuck 421 and the rotating chuck 422 including the rotating chuck driving unit 423. The position where the fixed chuck 421 and the rotating chuck 422 are lowered becomes a position at which the fixed chuck 421 and the rotating chuck 422 can clamp a region of the base plate G1. When this position is reached, the operation of the clamp lowering drive unit 424 is stopped, and the rotation chuck drive unit 423 is operated to rotate the rotation chuck 422 around the rotation shaft 422a. As the rotation chuck 422 rotates as described above, an area of the base plate G1 may be clamped between the fixed chuck 421 and the rotation chuck 422.

On the other hand, since one region of the base plate G1 is clamped by a pair of chucks 421 and 422 having a tong-shaped engagement structure, at least the rotation chuck 422 is located in a lower region lower than the surface of the conveyor unit 210. Should be. Only then, when the rotating chuck 422 rotates, an area of the base plate G1 may be clamped together with the fixed chuck 421. Therefore, in the present embodiment, at least the fixed chuck 421 and the rotating chuck 422 are arranged at a spaced interval between the conveyor units 210 as shown in FIG. 1. In FIG. 1, seven conveyor units 210 are arranged in a lateral direction. In this case, a total of six clamps 420 are provided, and a fixed chuck 421 and a rotating chuck (each provided in the six clamps 420) are provided. 422 is disposed one by one in the separation interval between the conveyor units (210).

The clamp unit moving part 430 serves to move the clamp 420 clamped on the base plate G1 in the Y-axis direction. In this embodiment, the clamp unit moving unit 430 is implemented as a linear motor. However, the scope of the present invention is not limited thereto. The clamp unit moving part 430 is controlled in series with the speed of the substrate transfer unit 200 and the like.

In this way, the scribe line is formed on the base plate G1 while the base plate G1 is clamped by the clamp unit 400, thereby preventing the base plate G1 from being shaken and being placed on the base plate G1. It is possible to form an accurate scribe line. In particular, in the present embodiment, the clamp unit 400 is provided in the upper region of the substrate transfer unit 200 and not only clamps the substrate G1 at the corresponding position, but also attaches and detaches the clamp 420 to the clamp unit body 410. Due to the structural feature that is possibly coupled there is an advantage that can facilitate the overall flatness maintenance work for the clamp unit 400, and also maintenance work and setting work.

On the other hand, in order to cut the base plate G1 along the scribe line, press the scribe line region or heat the portion where the scribe line is formed so that vertical cracks are diffused in the thickness direction of the base plate G1. Unit 500 is provided.

The brake unit 500 of the present embodiment serves to substantially heat the original substrate G1 so that the original substrate G1 may be cut along the scribe line and formed into a plurality of unit substrates G2. Unlike this, it concentrates only on the part where the scribe line is formed. As described above, the conventional brake units (not shown) are configured to heat the entire area of the base plate G1, so that only the scribe lines cannot be heated intensively as in the present embodiment, so that the cracks are efficiently moved to the scribe lines. There is a disadvantage that can not be. In more detail, by concentrating only on the portion where the scribe line is formed, heating is performed unnecessarily and other parts of the substrate where the scribe line is not formed, thereby lowering cutting efficiency and causing power loss. Therefore, in this embodiment, the problem of the related art is solved by proposing the brake unit 500 having the following structure.

FIG. 4 is an enlarged perspective view of the brake unit region, FIG. 5 is a schematic side view of FIG. 4, and FIG. 6 is a schematic configuration diagram illustrating a process of cutting the original substrate into eight unit substrates by the brake unit.

As shown in these figures, the brake unit 500 provided in the substrate cutting system of the present embodiment includes a plurality of individual hot air nozzles 510a, 510b, which individually heat the scribe line region on the substrate G1 and heat them individually. Hot Air Nozzle).

Many of the individual hot air nozzles 510a and 510b are super hot heaters that allow the maximum temperature of hot air to reach approximately 800 degrees Celsius, as well as rapid heating and accurate temperature control in seconds. Can be applied. However, the scope of the present invention is not limited thereto.

These multiple hot air nozzles 510a and 510b are all individually coupled to each of the multiple nozzle heads 520a and 520b. The nozzle heads 520a and 520b support the individual hot air nozzles 510a and 510b, and the above-described super hot heaters may be installed.

As can be seen from FIG. 4, in the present embodiment, ten individual hot air nozzles 510a and 510b and ten nozzle heads 520a and 520b are provided, which are cutting operations for the base plate G1. It is arranged along the X-axis direction which is a horizontal direction in this progressing work line. However, the scope of the present invention is not necessarily limited to the number and arrangement direction thereof.

In the present embodiment, ten individual hot air nozzles 510a and 510b individually coupled to the ten nozzle heads 520a and 520b, respectively, are individually or in the X, Y and Z axes shown in FIG. Collective movement is possible.

Of course, although the individual hot air nozzles 510a and 510b may be implemented to be individually or collectively moved to only one of the X, Y, and Z axes, the individual hot air nozzles 510a, All of the 510b) can be individually or collectively moved in the X-axis, Y-axis, and Z-axis to increase cutting efficiency of the original substrate G1.

The brake unit 500 includes a separate hot air nozzle including nozzle heads 520a and 520b such that all of the individual hot air nozzles 510a and 510b can individually or collectively move in the X, Y and Z axes. X-axis moving parts 530a and 530b for the X-axis movement of the 510a and 510b, and Y-axis moving parts for the Y-axis movement of the individual hot air nozzles 510a and 510b including the nozzle heads 520a and 520b. 540 and a Z-axis moving unit 550 for Z-axis movement of the individual hot air nozzles 510a and 510b including the nozzle heads 520a and 520b are further provided.

Individual or collective movement of the individual hot air nozzles 510a and 510b by the X-axis moving units 530a and 530b, the Y-axis moving unit 540 and the Z-axis moving unit 550 along the X, Y and Z axes. May be controlled by a controller (not shown).

That is, the controller controls the X-axis moving parts 530a and 530b, the Y-axis moving part 540, and the Z-axis moving part 550 so that only the scribe line formed on the base plate G1 can be heated in a substantially concentrated manner. The control ultimately controls the individual or collective movement in the X, Y and Z axes of the individual hot air nozzles 510a and 510b.

The X-axis moving parts 530a and 530b are provided in two rows parallel to each other along the Y axis. Five separate hot air nozzles 510a and 510b are provided in the X-axis moving parts 530a and 530b provided in two rows, respectively. Of course, since this is only one embodiment, the X-axis moving units 530a and 530b may be implemented in one column, and in some cases, three or more columns may be provided in parallel with each other along the axis.

Since the X-axis moving parts 530a and 530b are provided in two rows, the individual hot air nozzles 510a and 510b provided in the two rows of X-axis moving parts 530a and 530b are provided by the Y-axis moving parts 540. It can be moved synchronously to the Y axis. Five individual hot air nozzles 510a in a row may be moved together in a group along the Y axis, and five individual hot air nozzles 510b in two rows may be moved together in a group along the Y axis.

Referring to the X-axis movement of the individual hot air nozzles 510a and 510b, the individual hot air nozzles 510a and 510b may be individually moved along the X axis on the X-axis moving parts 530a and 530b.

In addition, referring to the Z-axis movement of the individual hot air nozzles 510a and 510b, the individual hot air nozzles 510a and 510b may be moved along the Z-axis by the Z-axis moving unit 550 on the X-axis moving units 530a and 530b. They can be moved separately from each other.

In the present embodiment, the X-axis moving parts 530a and 530b are linear pulse motor units, the Y-axis moving parts 540 are driving units, and the Z-axis moving parts 550. ) May be applied to an air cylinder, but the scope of the present invention is not necessarily limited thereto.

Referring to the operation of the substrate cutting system having such a configuration as follows.

First, the substrate G1 of the cutting target object is transferred onto the loading unit 100 by the robot. As such, when the substrate G1 is transferred to the loading unit 100 by the robot, lift pins are raised to support the substrate G1, and when the robot is taken out, lift pins are first lowered to the loading unit 100. The pre-align operation on the substrate G1 is performed by the provided alignment unit 110.

After completion of the pre-alignment, the substrate G1 is transferred onto the substrate transfer unit 200 by the rotation of the belt conveyor after the lift pins are secondly lowered to be supported by a plurality of belt conveyors. The original substrate G1 supported on the substrate transfer unit 200 moves in the Y-axis direction of FIG. 1 by the rotation of the substrate transfer unit 200 to face the scribe unit 300. Then, the upper and lower scribe lines are formed on the surface of the base substrate G1 by the interaction between the substrate transfer unit 200 and the scribe unit 300.

In detail, before the scribing starts on the surface of the base plate G1, the upper scribe head 310 and the lower scribe head 320 move to the load cells 311 and 321 provided to correspond to the lower portion (the upper scribe). In the case of the head 310a) pressure and the rising (in the case of the lower scribe head 320) pressure are measured and adjusted to a preset reference pressure by a separate control signal.

Next, when the upper and lower scribe heads are to be formed on the upper and lower surfaces of the substrate G1 by the upper and lower scribe heads 310 and 320, the upper and lower scribe lines are disposed on the upper and lower horizontal axes 310a and 320a. The substrate transfer unit 200 may transfer the substrate G1 while the 310 and 320 are fixed to form upper and lower scribe lines in the Y-axis direction on the upper and lower surfaces of the substrate G1, respectively. And to form upper and lower scribe lines in the X-axis direction on the upper and lower surfaces of the substrate (G1), respectively, the upper and lower along the upper and lower horizontal axis (310a, 320a) while the substrate transfer unit 200 is stopped As the lower scribe heads 310 and 320 are moved, upper and lower scribe lines in the X-axis direction may be formed on the upper and lower surfaces of the base substrate G1, respectively.

As such, when the upper and lower scribe lines are formed on the upper and lower surfaces of the base plate G1, the fixing chuck 421 and the rotating chuck 422 of the clamp unit 400 are prevented to prevent the base plate G1 from shaking. It proceeds in the state which clamped one area | region of the base board G1 by the tong method. As a result, the scribe line for the substrate G1 can be formed by the mutual organic mechanism of the substrate transfer unit 200, the scribe unit 300, and the clamp unit 400.

Next, the base substrate G1 having both scribe lines formed on both surfaces thereof continues to move in the Y-axis direction along the operation of the substrate transfer unit 200 to reach the brake unit 500 region, and is caused by the brake unit 500. The scribe line is intensively heated. Hereinafter, the cutting of one sheet of substrate G1 into eight unit substrates G2 will be described with reference to FIG. 6.

In order to cut a single substrate G1 into a total of eight unit substrates G2, as illustrated in FIG. 6, the primary substrate G1 must be cut by intensive heating along the Y-axis and X-axis scribe lines.

First, referring to the concentrated heating operation for the Y-axis scribe line, the X-axis moving parts 530a and 530b on which the individual hot air nozzles 510a and 510b are supported are moved to the Y axis by the Y-axis moving part 540. It moves synchronously and is placed in the designated position. Then, the individual hot air nozzles 510a and 510b are simultaneously moved on the X-axis on the X-axis moving parts 530a and 530b, and are disposed at the designated positions. In this state, the individual hot air nozzles 510a and 510b are moved down to the Z axis by the Z axis moving unit.

When the positions of the individual hot air nozzles 510a and 510b are determined, the individual hot air nozzles 510a and 510b are operated to generate hot air from the individual hot air nozzles 510a and 510b, and at the same time, the Y-axis moving unit ( The individual hot air nozzles 510a and 510b are simultaneously moved to the Y-axis by 540, thereby intensively heating the Y-axis scribe line. When the concentrated heating operation on the Y-axis scribe line is completed, the operation of the individual hot air nozzles 510a and 510b and the operation of the Y-axis moving unit 540 are stopped, and then the individual hot air nozzles (by the Z-axis moving unit) are stopped. The 510a and 510b are raised up to their original positions. The concentrated heating operation for this series of Y-axis scribe lines can be performed twice, but this is not necessarily the case.

Next, referring to the concentrated heating operation for the X-axis scribe line, first, the X-axis moving parts 530a and 530b on which the individual hot air nozzles 510a and 510b are supported are moved by the Y-axis moving part 540. It moves synchronously to the axis and is placed in the designated position. Then, the individual hot air nozzles 510a and 510b are simultaneously moved on the X-axis on the X-axis moving parts 530a and 530b, and are disposed at the designated positions. In this state, the individual hot air nozzles 510a and 510b are moved down to the Z axis by the Z axis moving unit.

When the positions of the individual hot air nozzles 510a and 510b are determined, the individual hot air nozzles 510a and 510b are operated to generate hot air from the individual hot air nozzles 510a and 510b, and at the same time, the X-axis moving unit ( The individual hot air nozzles 510a and 510b are simultaneously moved to the X-axis by 530a and 530b to concentrate and heat the X-axis scribe line. When the concentrated heating operation for the X-axis scribe line is completed, the operation of the individual hot air nozzles 510a and 510b and the operation of the X-axis moving units 530a and 530b are stopped, and then the individual hot air is moved by the Z-axis moving unit. The nozzles 510a and 510b are up. The concentrated heating operation for this series of X-axis scribe lines can be performed twice, but this is not necessarily the case.

After the base plate G1 is intensively heated along the Y-axis and X-axis scribe lines in this manner, vertical cracks are formed in the thickness direction of the base plate G1 on the Y-axis and X-axis scribe lines by the brittleness of the glass material. As it is diffused, the base substrate G1 is cut to form a total of eight unit substrates G2 as shown in FIG. 6.

For reference, FIG. 7 is a schematic configuration diagram illustrating a process of cutting the original substrate G1 into 45 unit substrates G2 by the brake unit 500. The operation of FIG. 7 is also related to FIG. 6. Since the same operation as described above, a separate description with respect to FIG. 7 will be omitted.

As described above, according to the present embodiment, since the desired scribe line region can be concentrated and heated, the inefficiency of heating the entire area of the substrate G1 unnecessarily as in the past can be eliminated, and furthermore, It is possible to improve productivity by improving cutting efficiency even with power.

Although the description is omitted in the above-described embodiment, in order to concentrate and heat the desired scribe line area substantially, as described above, it is necessary to move a plurality of individual hot air nozzles in the X-axis, Y-axis, and Z-axis directions. There is no need. That is, after placing and positioning a plurality of individual hot air nozzles at a predetermined position, the concentrated heating of the scribe line region due to the individual hot air nozzles may be induced based on the movement of the conveyor unit supporting the base plate. will be.

As described above, the present invention is not limited to the described embodiments, and various modifications and changes can be made without departing from the spirit and scope of the present invention, which will be apparent to those skilled in the art. Therefore, such modifications or variations will have to be belong to the claims of the present invention.

Claims (11)

A scribe unit forming a scribe line on the base substrate; And It includes a break unit for heating the substrate so that the base plate on which the scribe line is formed can be cut into a plurality of unit substrates along the scribe line, The brake unit may include at least one hot air nozzle that is individually movable in at least one of X, Y, and Z axes so as to individually heat the scribe line region on the base plate. Substrate cutting system comprising a. The method of claim 1, The at least one individual hot air nozzle is a plurality of individual hot air nozzles, The plurality of individual hot air nozzles are substrate cutting, characterized in that arranged on the work line for the cutting operation on the base plate to move collectively to at least one axis of the X-axis, the Y-axis and the Z-axis system. The method of claim 2, And the plurality of individual hot air nozzles are individually coupled to each of the plurality of nozzle heads. The method of claim 3, And the plurality of individual hot air nozzles and the plurality of nozzle heads are arranged along the X-axis direction in a transverse direction to a work line on which the cutting operation for the substrate is performed. The method of claim 3, The brake unit, An X-axis moving unit for moving the X-axis of the plurality of individual hot air nozzles; A Y-axis moving unit for moving the Y-axis of the plurality of individual hot air nozzles; And And a Z axis moving part for moving the Z axis of the plurality of individual hot air nozzles. The method of claim 5, And the plurality of individual hot air nozzles are respectively connected to the X-axis moving parts so as to be individually movable on the X-axis. The method of claim 6, The X-axis moving part is two rows of X-axis moving parts arranged along the Y axis, The two rows of X axis moving parts are coupled to the Y axis moving parts such that a plurality of individual hot air nozzles respectively connected to the two rows of X axis moving parts are moved synchronously to the Y axis by the Y axis moving parts. Substrate cutting system, characterized in that. The method of claim 7, wherein The X-axis moving unit is coupled to the Z-axis moving unit such that a plurality of individual hot air nozzles respectively connected to the X-axis moving unit are individually moved to the Z-axis by the Z-axis moving unit. system. The method of claim 5, The X-axis moving unit is a linear pulse motor unit, the Y-axis moving unit is a driving unit, and the Z-axis moving unit is an air cylinder. The method of claim 5, And a control unit for controlling movement of the X-axis moving unit, the Y-axis moving unit, and the Z-axis moving unit. A scribe unit forming a scribe line on the base substrate; And A break unit for heating the base substrate such that the base substrate on which the scribe line is formed along the scribe line can be cut into a plurality of unit substrates, The brake unit includes a plurality of individual hot air nozzles fixedly disposed at a predetermined position to individually heat the scribe line region on the base substrate.