KR100788199B1 - System and method for scribing substrate - Google Patents

Abstract

A wafer cutting system is provided to realize in-line cutting work while inhibiting damages on the pad portion of a wafer to which an IC driver is mounted, thereby reducing a tact time and improving the productivity. A wafer cutting system comprises: a plurality of conveyors(10a-10d) forming a cutting work line on an original wafer formed by an upper wafer laminated with a lower wafer and separated from each other in at least one region to provide a predetermined spacing interval; a scribe module(20) disposed in the spacing interval to form a predetermined scribe line on the top and bottom surfaces of the original wafer; a break module(60) disposed in the rear of the scribe module along the work line for cutting the original wafer along the scribe line, thereby providing a plurality of primary unit wafers; and a dummy cutting module(65) disposed in the rear of the scribe module along the work line for cutting a predetermined dummy portion remaining on each primary unit wafer.

Description

Substrate cutting system and its method {System and method for Scribing substrate}

1 is a schematic perspective view of a general LCD substrate (unit substrate).

FIG. 2 is a plan view of a large-area original substrate for forming the unit substrate of FIG. 1.

3 is a perspective view of a substrate cutting apparatus according to an embodiment of the present invention.

4 is a plan view of FIG. 3.

5 is a view illustrating an operation of a scribe module region.

6 is a view illustrating an operation of a dummy cutting module region.

7 is a flow chart of a substrate cutting method according to an embodiment of the present invention.

* Explanation of symbols for the main parts of the drawings

1: Original board 3a ~ 3d: Dummy board

3e: dummy part 8: unit board

10 belt conveyor 20 scribe module

30: upper scribe module 31: upper horizontal axis

33: upper scriber 40: lower scribe module

41: lower horizontal axis 43: lower scriber

50a, 50b: discharge part 60: brake module

62: movable heating / cooling unit 65: dummy cutting module

66: batch table 67: dummy cutting scriber

68: support roller 70: distributor

75: trans conveyor 80: substrate transfer unit

85: inverter 86: inverted axis

87: reverse conveyor 90: takeout conveyor

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate cutting system and a method thereof, and more particularly, to cutting a substrate in a cutting operation while preventing the pad portion of the substrate on which the IC driver or the like is to be damaged. The present invention relates to a substrate cutting system and a method for reducing the tact time and further improving productivity.

The substrate includes a flat panel display (FPD) used as an image display device including a semiconductor substrate. FPD substrates include liquid crystal display (LCD) substrates, plasma display panel (PDP) substrates, and organic light emitting diodes (OLED) substrates.

Among them, the LCD substrate refers to a liquid crystal (Liquid Crystal) is injected between the two glass (Glass). Although LCD substrates have the disadvantage of slow response speed and relatively high cost, LCD substrates have advantages over PDP substrates in terms of resolution because they are produced by semiconductor processes. Therefore, it is recently attracting attention as a next generation display device such as a mobile phone, a computer monitor, and a television.

The LCD substrate will be described in more detail with reference to FIGS. 1 and 2 as follows.

1 is a schematic perspective view of a general LCD substrate (unit substrate), Figure 2 is a plan view of a large area substrate for forming the unit substrate of FIG.

As shown in these drawings, one LCD substrate (hereinafter referred to as unit substrate 8) shown in FIG. 1 is a glass top plate which is bonded by partially contacting each other in a state where liquid crystal is injected therein ( 8a, CF, Color Filter) and lower plate (8b, TFT, Thin Film Transistor), and upper and lower polarizers that are coupled to the exposed surface of the upper plate (8a) and the lower plate (8b), respectively, to impart optical characteristics at the corresponding positions ( Polarizer Film, not shown).

The upper plate 8a forming the image of the color is formed smaller in area than the lower plate 8b. Therefore, a pad portion P (Pad Portion), which is a portion where the upper plate 8a does not overlap, is present on the upper surface of the lower plate 8b. The pad portion P is combined with an IC driver as a means for controlling the unit substrate 8, and a flexible printed circuit (FPC) for connecting the IC driver to a printed circuit board (PCB).

As shown in FIG. 2, the unit substrate 8 is generally formed in a state where the upper plate 1a and the lower plate 1b are joined together, and the large-area original substrate 1 having a large area is divided into several tens of equal parts. After cutting to make the unit substrate 8 of the form as shown in Figure 1, by mounting the IC driver or the like on the pad portion (P) of the unit substrate 8 in the module process is released as a finished product.

Therefore, the manufacturing process of the substrate includes a cutting process for cutting (or scribing) the large-area original substrate 1 into several to several tens of unit substrates 8.

In particular, when the one substrate 1 as shown in FIG. 2 is cut and manufactured as the unit board 8 as shown in FIG. The scribe line formed on the upper plate 1a and the lower plate 1b of the base plate 1 and cut is inevitably different, and these need to be precisely controlled. For reference, a portion (not shown overlapping with a dotted line) in the solid line in FIG. 2 indicates a position where the upper plate 1a of the base plate 1 is cut, and the portion shown by the dotted line is a portion of the base plate 1. The position at which the lower plate 1b is cut is shown.

The cutting process for the base plate 1 is carried out through a separate system, usually through a cutting system, also called a scriber or scribe device (Scribe Apparatus).

Cutting systems known to date are largely divided into stage types and belt conveyor types according to the type supporting the base plate 1.

Since the stage type does not have a big problem in discharging the dummy substrates 3a to 3d, a scribe line is formed at a desired portion while transferring the original substrate 1, and based on this, the plurality of unit substrates 8 are completely cut in sequence. ) To form.

However, as described above, the base plate 1 is composed of the upper plate (1a) and the lower plate (1b) bonded to each other, the upper plate (1a) of the base plate 1 for the formation of the unit substrate (8) Since the scribe lines formed and cut on the lower plate 1b are different from each other, in the cutting system to which the stage type is applied, any one of the upper plate 1a and the lower plate 1b of the base plate 1 is cut and then the upper plate ( Means are further required for inverting (turning) the original substrate 1 by 180 degrees in order to cut the other one of the 1a) and the lower plate 1b, so that the height of the cutting system is inevitably increased.

In contrast, the belt conveyor type has a short tact time, but due to its structure, a substrate cut out from the large-area original substrate 1 (hereinafter, referred to as a dummy substrate (3a-3d, Dummy Substrate)) is directly used. It cannot be discharged. The dummy substrates 3a to 3d refer to portions not hatched in FIG. 2.

Therefore, in the cutting system to which the belt conveyor type is applied, the first substrate is not cut completely but only half is cut first, and then the original substrate 1 is finally cut while advancing a crack through heating and cooling processes. In this way, a plurality of unit substrates 8 are formed.

By the way, in the cutting system to which the belt conveyor type is applied, as described above, the base plate 1 is not cut completely, but only half is cut first and then the crack is advanced through the heating and cooling process. Since the base substrate 1 is being cut, the dummy substrates 3a to 3d are continuously transported in a state of being attached to each other without falling off from the large-area original substrate 1, and must be completely cut after the heating and cooling process, but are cut in advance. The phenomenon occurs and there is a high possibility that the pad portion P of the unit substrate 8 on which the IC driver or the like will be mounted is damaged during the transfer of the base substrate 1.

An object of the present invention is to prevent the damage to the pad portion of the substrate on which the IC driver or the like is to be damaged while cutting the substrate in-line, thereby reducing the tact time. It is possible to provide a substrate cutting system and a method thereof, which can reduce and further improve productivity.

According to the present invention, a plurality of conveyors forming a work line for cutting operation on the base plate formed by joining the upper plate and the lower plate, but separated from at least one region to form a predetermined spacing interval (Conveyor) ; A scribe module installed at the spacing intervals to form a predetermined scribe line on the upper and lower surfaces of the substrate; A brake module disposed behind the scribe module along the work line to cut the substrate along the scribe line to form a plurality of primary unit substrates; And a dummy cutting module disposed at the rear of the scribe module along the work line, and configured to cut and remove a predetermined dummy portion remaining on each of the primary unit substrates. Achieved by the system.

Here, the conveyor may be a belt conveyor (Belt Conveyor), the scribe module, the upper scribe module is provided in the upper region of the belt conveyor at the separation interval to form an upper scribe line on the upper plate of the base plate; And a lower scribe module provided in the lower region of the belt conveyor at the separation interval to form a lower scribe line on the lower plate of the original substrate.

The upper scribe module, the upper horizontal axis fixed in the horizontal direction in the longitudinal direction of the work line; And at least one upper scriber coupled to one side of the upper horizontal axis to form the upper scribe line on the upper plate of the base plate supported and moving on the belt conveyor, and relatively movable on the upper horizontal axis. It may include.

The lower scribe module may include: a lower horizontal axis fixed along a horizontal direction in a length direction of the work line; And at least one lower scriber coupled to one side of the lower horizontal axis to form the lower scribe line on a lower plate of the original substrate supported and moved by the belt conveyor, wherein the lower scriber is relatively movable on the lower horizontal axis. It may include.

The upper and lower horizontal axes may be interconnected by a predetermined connection, and the upper and lower scribe lines respectively formed on the upper and lower plates of the base plate by the upper and lower scribers may form the same axis. .

The brake module may include a pair of first rail parts disposed at both sides of the work line along the work line; And a circle coupled to the pair of first rails, the circle being located along the scribe line by heating and cooling the base plate positioned between the pair of first rails while moving along the work line. It may include a mobile heating / cooling unit for cutting the substrate.

The dummy part, which is cut and removed by the dummy cutting module, forms a color filter (CF) of the primary unit substrate to form a pad portion on which a predetermined IC driver or the like is mounted. It may be a color filter (CF) dummy glass removed from the, the cutting operation for the dummy portion may proceed toward the upper side from the lower side of the primary unit substrate.

The dummy cutting module may include a cell stage configured to support the primary unit substrate on which a top plate, which is a color filter (CF), is disposed downward, and a bottom plate, which is a TFT, thin film transistor (TFT), is disposed upward. Cell Stage; A dummy cutting scriber for cutting the dummy part from the lower portion of the primary unit substrate supported by the cell stage; And a support roller disposed on an opposite side of the dummy cutting scriber with the primary unit substrate interposed therebetween to support the primary unit substrate.

Each of the brake module and the dummy cutting module may further include a dummy substrate cut out from the substrate and a discharge part for discharging the dummy part.

The discharge portion is accessible and spaced apart from the brake module and the dummy cutting module, respectively, at the corresponding position.

The discharge part may further include a crushing part for crushing the dummy substrate and the dummy part.

The apparatus may further include a distributor configured to distribute the plurality of primary unit substrates formed from the original substrate by the brake module to the cell stage.

The distributor may include a pair of second rail units disposed on both sides of the work line along the work line; A moving bar coupled to the pair of second rail parts and movable along the work line; And at least one distribution head movable along the movement bar and adsorbing the primary unit substrates coupled to the movement bar so as to be rotatable relative to the movement bar and the cutting operation is completed.

By the distributor, the primary unit substrate is changeable in the cell stage.

The apparatus may further include a substrate transfer unit provided at a rear side of the distributor along the work line and transferring the secondary unit substrate from which the dummy portion is cut to a trans conveyor.

It may further include an inverter for inverting the upper and lower positions of the secondary unit substrate transferred to the trans conveyor.

The inverter, the inverting axis; And a pair of reverse conveyors that are invertible based on the inversion axis and adsorb the upper and lower surfaces of the secondary unit substrate so that the secondary unit substrate can be inserted therein.

The apparatus may further include a take-out conveyor in which the secondary unit substrate inverted by the inverter is loaded and taken out.

The upper and lower plates of the original substrate first introduced into the work line may be TFT, thin film transistors, and color filters, respectively, and may be reversed when taken out by the take-out conveyor. have.

The substrate may be a flat panel display (FPD) of any one of a liquid crystal display (LCD), a plasma display panel (PDP), and an organic light emitting diode (OLED).

On the other hand, according to the present invention, a) a step of bringing the base plate of the cutting target object formed by the upper plate and the lower plate is joined to a predetermined work line; b) forming a scribe line on the same axis on both the upper plate and the lower plate of the imported base plate; c) cutting the substrate along the scribe line to form the substrate as a plurality of primary unit substrates; And d) cutting a predetermined dummy portion remaining on each of the primary unit substrates to form a secondary unit substrate.

Here, in the step b), the upper and lower scribe lines respectively formed on the upper and lower plates of the original substrate may form the same axis.

In step d), the cutting operation of the dummy part may be performed from the lower side of the primary unit substrate toward the upper side.

e) after the step d), inverting the top and bottom positions of the secondary unit substrate; And f) taking out the secondary unit substrate having its upper and lower positions reversed.

In the step d), the dummy part is removed from a plate forming a color filter (CF) of the primary unit substrate so as to form a pad portion on which a predetermined IC driver or the like is mounted. (CF) It may be a dummy glass.

In order to fully understand the present invention, the operational advantages of the present invention, and the objects achieved by the practice of the present invention, reference should be made to the accompanying drawings which illustrate preferred embodiments of the present invention and the contents described in the accompanying drawings.

Hereinafter, the present invention will be described in detail by explaining preferred embodiments of the present invention with reference to the accompanying drawings. Like reference numerals in the drawings denote like elements.

For reference, the substrate to be described below refers to a flat panel display (FPD) substrate including a liquid crystal display (LCD), a plasma display panel (PDP), organic light emitting diodes (OLED), and the like, for convenience of description. For the sake of brevity, these will be referred to as substrates.

3 is a perspective view of a substrate cutting apparatus according to an embodiment of the present invention, FIG. 4 is a plan view of FIG. 3, FIG. 5 is a view illustrating an operation of a scribe module region, and FIG. 6 is an operation of a dummy cutting module region. 7 is a flowchart of a substrate cutting method according to an embodiment of the present invention.

Referring to these drawings, mainly referring to Figures 3 and 4, the substrate cutting apparatus according to an embodiment of the present invention, the belt conveyor (1) to form a working line for the cutting operation proceeds to the substrate (1) ( 10a ~ 10d, Belt Conveyor, Scribe Module (20, Scribe Module), Break Module (60, Break Module) and dummy cutting module 65 arranged in sequence along the work line of the belt conveyor (10a ~ 10d) Equipped.

In addition, the substrate cutting device of the present embodiment, the discharge unit 50a, 50b located in a predetermined lower region of the belt conveyor (10a ~ 10d), and the distributor 70, the transformer provided in the rear of the dummy cutting module 65, trans The conveyor 75, the inverter 85 and the take-out conveyor 90 is further provided.

Through these configurations, the original substrate 1 of FIG. 2 carried into the work line is formed as a unit substrate 8 (hereinafter, referred to as a secondary unit substrate for convenience of description) of FIG. Next, a series of operations to be taken out to the takeout conveyor 90 is performed.

Therefore, since the in-line of the substrate 1 can be constructed, the tact time can be reduced, and further, the productivity can be improved. In particular, according to the substrate cutting system of this embodiment, the original substrate 1 can be removed while preventing the pad portion (P, Pad Portion, see FIG. 1) of the secondary unit substrate 8 on which the IC driver or the like is to be damaged. It is possible to form a cut to the dozens of secondary unit substrate (8).

Prior to the description, the original substrate 1 shown in FIG. 2, the secondary unit substrate 8 shown in FIG. 1, and the cutting direction or the moving direction of the belt conveyors 10a to 10d are described.

The base substrate 1 shown in FIG. 2 is a matrix for forming the secondary unit substrate 8 shown in FIG. Therefore, in this embodiment, twelve parts hatched from the original substrate 1 shown in FIG. 2 represent one secondary unit substrate 8 shown in FIG.

In addition, most of the solid lines shown in FIG. 2 (which may not overlap with some dotted lines) indicate positions at which the upper plate 1a of the base plate 1 is cut by the upper scribe module 30. The lower scribe module 40 shows the position at which the lower plate 1b of the base plate 1 is cut. And the remaining parts without hatching represents the dummy substrates (3a ~ 3d) discharged to the discharge unit (50). For reference, the portion shown by reference numeral 3e in FIG. 6 is also a dummy substrate similar to the others, but differs from the other dummy substrates 3a to 3d in the working position or method of cutting. Therefore, in order to distinguish the part shown by the reference numeral 3e from the dummy substrates 3a to 3d, the dummy part is referred to as a dummy part. Here, the dummy part is a pile of color filters CF removed from one side plate forming a color filter CF of the primary unit substrate 8 'to form a pad portion P on which an IC driver or the like is mounted. It is glass.

Like the secondary unit substrate 8, the original substrate 1 includes an upper plate 1a and a lower plate 1b on which two sheets of glass are bonded.

Usually, in the secondary unit substrate 8 finally placed on the take-out conveyor 90, as shown in FIG. 1, the upper plate 8a, which is a color filter CF, faces upward, and the TFT The lower plate 8b, which is a thin film transistor, faces downward, and is taken out in a later step.

However, before the cutting process, the substrate 1 is carried in the belt conveyors 10a to 10d forming a work line in an inverted state as opposed to the secondary unit substrate 8. That is, the upper plate 1a, which is a TFT (thin film transistor), is brought upward, and the lower plate 1b, which is a color filter (CF, Color Filter), is brought in a state where it is disposed to face downward, thereby performing a series of cutting operations. Proceed.

In this embodiment, an example in which one substrate 1 shown in FIG. 2 is cut into a total of twelve secondary unit substrates 8 through a cutting system is shown. A direction perpendicular to the Y-axis direction and a direction orthogonal to the Y-axis direction will be described as a direction in which the belt conveyors 10a to 10d line up with respect to the moving direction of the conveyors 10a to 10d.

Then, hereinafter, the respective components provided in the substrate cutting device will be described sequentially.

The belt conveyors 10a-10d are the parts which form the line of the cutting operation | work with respect to the base board 1. Since the base substrate 1 can be transported without being damaged, it is preferable to be used compared to a stage or the like. Looking at these belt conveyors (10a ~ 10d) by position, the first to fourth belt conveyors (10a ~ 10d) along the Y-axis direction that the substrate 1 is carried in and taken out to the plurality of secondary unit substrates (8) Are separated by).

Therefore, a predetermined spacing 12a-12c is formed between the first to fourth belt conveyors 10a to 10d. Although no separate configuration is provided in the spacing shown by reference numerals 12a and 12c, the scribe module 20 is provided in the spacing shown by reference 12b. These first to fourth belt conveyors (10a ~ 10d) are rotated in the positive (+) direction or negative (-) direction of the Y axis at the corresponding position with each other, the base substrate (1) or the secondary unit substrate seated on the upper surface Proceed with work by moving (8) in the corresponding direction. Movement of the first to fourth belt conveyors 10a to 10d may be precisely controlled by linear motion or the like.

The scribe module 20 is installed in the spaced intervals 12b formed between the second and third belt conveyors 10b and 10c so that the scribe module 20 is upper and lower on both the upper plate 1a and the lower plate 1b of the base plate 1. A scribe line is formed. The upper and lower scribe lines respectively formed on the upper plate 1a and the lower plate 1b of the base substrate 1 form the same axis with each other, as shown in FIG.

The scribe module 20 is provided in the upper region of the second and third belt conveyors (10b, 10c) at a spaced interval 12b to form an upper scribe line on the upper plate (1a) of the base plate (1) The lower scribe module (30) is formed in the lower regions of the second and third belt conveyors (10b, 10c) at the separation interval (12b) to form a lower scribe line on the lower plate (1b) of the base substrate (1) 40).

The upper scribe module 30 includes an upper horizontal axis 31 fixed along the horizontal direction in the longitudinal direction of the work line, and a plurality of upper scribers 33 coupled to one side of the upper horizontal axis 31. .

While the second and third belt conveyors 10b and 10c located close to the upper scribe module 30 can be moved in the Y-axis direction, the upper horizontal axis 31 is fixed at the corresponding position and is connected to the upper horizontal axis 31. Only the combined upper scriber 33 is moved in the X-axis direction.

The other side of the upper horizontal axis 31 may be further provided with an upper line observer (not shown) for observing the upper scribe line. The position of the upper scriber 33 on the upper horizontal axis 31 may be determined through control based on the image observed by the upper line observer.

The upper scriber 33 is attached to the upper holder 33a coupled to the upper horizontal shaft 31 and to the upper plate 1a of the base plate 1, which is supported and moved by the second and third belt conveyors 10b and 10c. An upper cutter 33b forming an upper scribe line. The upper holder 33a is relatively movable on the upper horizontal axis 31.

Therefore, when the upper scribe line is to be formed on the upper plate 1a of the base plate 1 shown in FIG. And the third belt conveyors 10b and 10c are moved, and the scribe line forming operation in the X-axis direction is performed when the upper scriber 33 is fixed while the second and third belt conveyors 10b and 10c are fixed. It proceeds while moving in the X-axis direction on the upper horizontal axis (31). In this way, a scribe line for the top plate 1a of the base substrate 1 can be formed.

The lower scribe module 40 is also similar to the configuration of the upper scribe module 30. That is, the lower scribe module 40 includes a lower horizontal axis 41 fixed along the horizontal direction in the longitudinal direction of the work line, and a plurality of lower scribers 43 coupled to one side of the lower horizontal axis 41. Equipped.

While the second and third belt conveyors 10b and 10c located close to the lower scribe module 40 can be moved in the Y-axis direction, the lower horizontal axis 41 is fixed at the corresponding position and is connected to the lower horizontal axis 41. Only the combined lower scriber 43 is moved in the X-axis direction.

The other side of the lower horizontal axis 41 may be further provided with a lower line observer (not shown) for observing the lower scribe line. The position of the lower scriber 43 on the lower horizontal axis 41 may be determined through the control based on the image observed by the lower line observer.

The lower scriber 43 is attached to the lower holder 43a coupled to the lower horizontal axis 41 and to the lower plate 1b of the base plate 1, which is supported and moved by the second and third belt conveyors 10b and 10c. And a lower cutter 43b forming a lower scribe line. The lower holder 43a is relatively movably coupled to the lower horizontal axis 41.

Therefore, when the lower scribe line is to be formed on the lower plate 1b of the original substrate 1 shown in FIG. 2, the scribe line forming operation in the Y-axis direction is performed by the second scriber 43 with respect to the fixed lower scriber 43. And the third belt conveyors 10b and 10c are moved, and the scribe line forming operation in the X-axis direction is performed when the lower scriber 43 is fixed while the second and third belt conveyors 10b and 10c are fixed. Proceeding while moving in the X-axis direction on the lower horizontal axis (41). In this way, a scribe line for the lower plate 1b of the base plate 1 can be formed.

At this time, as described above, the upper and lower scribe lines formed on the upper plate 1a and the lower plate 1b of the base plate 1 respectively form the same axis line (see FIG. 5). To this end, the upper and lower horizontal axes 31 and 41 are connected to each other by a predetermined connection portion 25, thereby driving the upper and lower scribers 33 and 43 together.

On the other hand, even if upper and lower scribe lines are formed on the upper plate 1a and the lower plate 1b of the base plate 1 by the scribe module 20, the base plate 1 is not cut yet. Means for cutting the base substrate 1 are required in order for the base substrate 1 to be cut along the scribe line and formed into a plurality of secondary unit substrates 8. This is the brake module 60.

The brake module 60 is disposed at the rear of the scribe module 20 along the work line to cut the original substrate 1 along the scribe line to form a plurality of secondary unit substrates 8.

The brake module 60 is coupled to a pair of first rail portions 61 and a pair of first rail portions 61 arranged long on both sides of the third belt conveyor 10c along the Y-axis direction. And a movable heating / cooling portion 62 which is movable along the first rail portion 61.

The movable heating / cooling part 62 moves along the first rail part 61 and is located between the base substrate 1, that is, the upper plate 1a and the lower plate 1b, positioned between the pair of first rail portions 61. It serves to cut the base plate 1 along the scribe line by heating and cooling the base plate 1 on which all the scribe lines are already formed.

For reference, in order to cut the substrate 1 along the scribe line, pressure is applied to the scribe line region, or a portion of the substrate is formed by using a thermal stress of the brittle material by heating and rapidly cooling a portion where the scribe line is formed. (1) must be cut.

Therefore, a means for applying pressure to the base plate 1 or for heating and cooling the base plate 1 is required. The brake module 60 is responsible for this. In particular, in the present embodiment, the mobile heating / cooling unit 62 cuts the base plate 1 by using the thermal stress of the brittle material by using the method of heating and cooling the base plate 1, A pressurization method may be applied. In this case, the brake module 60 may be provided with a compressed air injection unit instead of the movable heating / cooling unit 62.

On the other hand, even if the scribe line is formed on the base substrate 1 by the scribe module 20, the base substrate 1 is cut by the brake module 60 to form a plurality of primary unit substrates 8 '. However, it is not yet the final secondary unit substrate 8 as shown in FIG. That is, as described above, when looking at the final secondary unit substrate 8, the top plate 8a, which is a TFT (thin film transistor) for forming the pad portion P, is the color filter CF, Color. Since the area is formed smaller than that of the lower plate 8b which is a filter, it is necessary to cut one area of the upper plate 8a (this is called the dummy portion 3e).

Since the dummy part 3e could not be cut and removed by the scribe module 20 or the brake module 60, the dummy cutting module 65 is further provided to remove the dummy part 3e.

The dummy cutting module 65 is performed on each of the plurality of primary unit substrates 8 'which are already cut and separated. However, the base plate 1 is carried in the state in which the upper plate 1a, which is a TFT (thin film transistor), is disposed upward, and the lower plate 1b, which is a color filter (CF, Color), is disposed downward. And formed into a plurality of primary unit substrates 8 ', and as they were, turned to the dummy cutting module 65 as it is, the primary unit substrates 8' all formed color filters (CF). One side plate to face downward. Therefore, the cutting and removing operations of the dummy portion 3e by the dummy cutting module 65 proceed from the lower side to the upper side.

The dummy cutting module 65 includes a vacuum table 66, which is a cell stage that supports the primary unit substrate 8 'from the bottom, and a primary unit supported by the vacuum table 66. The dummy cutting scriber 67 which cuts the dummy part 3e in the lower part of the board | substrate 8 ', and the dummy unit scriber 67 are arrange | positioned on the opposite side across the primary unit board 8'. And a support roller 68 for supporting the primary unit substrate 8 '.

Here, unlike the upper and lower scribers 33 and 43 described above, the dummy cutting scriber 67 forms a scribe line for cutting the dummy portion 3e and applies pressure to this region or this region. It is assumed that a series of constitutions capable of cutting the dummy portion 3e by heating and rapidly cooling them. In this embodiment, the cell stage is provided as a backing table 66, but may be other supporting means if it can support the primary unit substrate 8 '.

The backing table 66 is a part for supporting the primary unit substrate 8 'which is seated on the upper surface by using the backing. The backing table 66 may support the primary unit substrate 8' in a manner other than the backing. In addition, as shown, the table 66 may be divided into two divided parts and may be moved in the Y-axis or X-axis direction at the corresponding position.

The operation of moving the primary unit substrate 8 'to the placement table 66 is performed by the distributor 70. That is, the distributor 70 serves to distribute the plurality of primary unit substrates 8 'formed from the original substrate 1 by the brake module 60 to the distribution table 66.

The distributor 70 is coupled to the pair of second rail portions 71 and the pair of second rail portions 71 that are disposed to both sides of the fourth belt conveyor 10d to form a second rail portion ( 71. The first movement of the cutting bar 72 is movable and the movable bar 72 is movable along the moving bar 72 and coupled to the moving bar 72 so as to be rotatable relative to the moving bar 72. A dispensing head 73 for adsorbing the unit substrate 8 'is provided.

As described above, if the vacuum table 66 itself can rotate, the primary unit substrate 8 ′ mounted on the upper surface thereof may also rotate in accordance with the rotation of the vacuum table 66. However, if the placement table 66 is fixed, the primary unit substrate 8 ′ may be switched on the placement table 66 by the distribution head 73.

On the other hand, the dummy substrates 3a to 3d cut by the brake module 60 described above and the dummy part 3e cut by the dummy cutting module 65 fall downward by their own weight or by separate removal means. do. The discharge substrates 50a and 50b are provided so that the falling dummy substrates 3a to 3d and the dummy portion 3e can be discharged to one place without being scattered.

In the present embodiment, the discharge parts 50a and 50b are provided in the lower regions of the brake module 60 and the dummy cutting module 65, respectively, and the dummy substrates 3a to 3d and the dummy part 3e falling at the corresponding positions. Discharge it. The discharge parts 50a and 50b form a hopper shape in which the inlet is large and the volume gradually decreases toward the rear end so that the falling dummy substrates 3a to 3d and the dummy part 3e are not scattered.

The discharge parts 50a and 50b are provided to be accessible and spaced apart from the brake module 60 and the dummy cutting module 65 for the efficiency thereof. Such a structure can be easily realized by a cylinder or a combination of a motor and a ball screw.

In addition, the dummy substrates 3a to 3d and the dummy parts 3e, which are cut out, have all of a predetermined length and area, so that the dummy boards 3a to 3d are disposed on the discharge parts 50a and 50b for reuse. Crushing portions 52a and 52b for crushing the field and the dummy portion 3e may be further provided.

A trans conveyor 75 is provided at the rear of the backing table 66 along the work line, and a substrate transfer unit 80 is provided at the upper portion of the trans conveyor 75. The substrate transfer part 80 is coupled to the third rail part 81 and moves along the longitudinal direction of the third rail part 81.

Since the final secondary unit substrates 8 formed by cutting from the original substrate 1 are individually managed one by one in a later process, the substrate transfer part 80 moves along the third rail part 81 while the dummy part ( The final secondary unit substrate 8 having 3e) cut off is transferred from the batch table 66 to the trans conveyor 75.

At this time, if one trans conveyor 75 is provided in the cutting system of the present embodiment, it is sufficient that one substrate transfer unit 80 is also provided in the third rail unit 81. However, in the present embodiment, since two transformer conveyors 75 are provided to improve productivity, two substrate transfer units 80 are also provided in the third rail unit 81. Their number can be adjusted by design.

On the other hand, in the beginning, the base plate 1 is a state in which the top plate 1a, which is a TFT (thin film transistor), is disposed upward, and the bottom plate 1b, which is a color filter CF, is downward. Since the cutting operation was performed at, the secondary unit substrates 8 finally placed on the trans conveyor 75, the upper plate 8a, which is a color filter CF, faces downward, and the TFT, The lower plate 8b, which is a thin film transistor, faces upward.

However, for the process control, the second unit substrate 8 finally produced, as shown in FIG. 1, the upper plate 8a, which is a color filter CF, faces upward, and the TFT The lower plate 8b, which is a thin film transistor, should face downward.

To this end, the rear of the trans conveyor 75 is further provided with an inverter 85 for reversing the upper and lower positions of the secondary unit substrate (8).

The inverter 85 is invertible based on the inversion shaft 86 and the inversion shaft 86, and absorbs the upper and lower surfaces of the secondary unit substrate 8 so that the secondary unit substrate 8 can be inserted therein. A pair of reverse conveyors 87 are provided.

Accordingly, after the secondary unit substrate 8 placed on the trans conveyor 75 is inserted between the pair of reverse conveyors 87, the pair of reverse conveyors 87 are arranged with the inverted shaft 86 as the axis. When reversed by 180 degrees, the position of the secondary unit substrate 8 can be easily changed. That is, as desired, the secondary unit substrate 8 has an upper plate 8a, which is a color filter (CF), facing upward, and a lower plate 8b, which is a TFT, thin film transistor, facing downward. Is arranged to.

At the rear of the inverter 85 is provided a take-out conveyor 90 in which the final secondary unit substrate 8 whose top and bottom positions are reversed through the inverter 85 is loaded and taken out in a post process. The take-out conveyor 90 is also provided in the same number on the same axis as the trans conveyor 75. FIG.

A cutting method of cutting the base plate 1 into a plurality of secondary cut plates 8 using a substrate cutting system having such a configuration will be briefly described with reference to FIGS. 3, 4, and 7. Same as

First, when the base plate 1 is carried in the 1st belt conveyor path 10a (S11), by the movement of the 1st belt conveyor path 10a, the base board 1 is moved to the 2nd and 3rd belt conveyor. Head to 10b and 10c. After that, the scribe module 20 located at the separation distance 12b between the second and third belt conveyors 10b and 10c and the mutually organic of the second and third belt conveyors 10b and 10c. By the operation, upper and lower scribe lines are formed on the upper plate 1a and the lower plate 1b of the base plate 1, respectively (S12).

That is, the scribe line forming operation in the Y-axis direction for each of the upper plate 1a and the lower plate 1b of the base plate 1 is carried out in the second and the first and the lower scribers 33 and 43, respectively. The three-belt conveyors 10b and 10c are moved while the scribe line forming operation in the X-axis direction is performed while the upper and lower scribers 33 and 43 are fixed while the second and third belt conveyors 10b and 10c are fixed. ) Is moved in the X-axis direction on the upper and lower horizontal axes 31 and 41. In this manner, upper and lower scribe lines are formed on the upper plate 1a and the lower plate 1b of the base plate 1, respectively. At this time, the upper and lower scribe lines are formed on the same axis.

After the scribe line is formed on the base plate 1, the base plate 1 moves along the fourth belt conveyor 10d to the brake module 60. When the brake module 60 is reached, the mobile heating / cooling part 62 moving along the first rail part 61 heats and cools the substrate 1 by using the thermal stress of the brittle material. The base plate 1 is cut (S13). Then, the substrate 1 is cut along the scribe line to form a plurality of primary unit substrates 8 '. At this time, the dummy substrates 3a to 3d are discharged through the discharge unit 50a.

Next, the primary unit substrates 8 'are distributed one by one to the distribution table 66 by the driving of the distributor 70, and the positions thereof are fixed. Then, the dummy cutting module 65 operates to operate the primary unit substrate 8'. The dummy part 3e formed in the cuts is cut and removed (S14). That is, the dummy part 3e is cut | disconnected by the dummy cutting scriber 67 located under the support roller 68 supporting the upper surface of the primary unit board 8 '. The cut dummy part 3e is discharged through the discharge part 50b.

Then, the substrate transfer unit 80, the secondary unit substrate 8, the dummy unit 3e is cut, that is, the secondary unit substrate 8 as shown in Figure 1 one by one on the trans conveyor 75. Transfer it accordingly. Subsequently, the secondary unit substrate 8 placed on the trans conveyor 75 is inserted between the pair of reverse conveyors 87, and then the pair of reverse conveyors 87 have the inverted shaft 86 as the axis. By reversing 180 degrees, the position of the upper and lower surfaces of the secondary unit substrate 8 is changed (S15).

As such, the final secondary unit substrate 8 having the upper and lower positions reversed through the inverter 85 may be taken out in a post process while being loaded on the takeout conveyor 90 (S16).

As described above, according to the present embodiment, the cutting operation on the original substrate 1 is inlined while preventing the pad portion P of the secondary unit substrate 8 on which the IC driver or the like is mounted from being damaged (In-Line). The Tact Time can be reduced, and the productivity can be improved further.

As described above, the present invention is not limited to the described embodiments, and various modifications and changes can be made without departing from the spirit and scope of the present invention, which will be apparent to those skilled in the art. Therefore, such modifications or variations will have to be belong to the claims of the present invention.

As described above, according to the present invention, the cutting operation on the substrate can be in-lined while preventing the pad portion of the substrate on which the IC driver or the like is mounted from being damaged. Tact time can be reduced and productivity can be improved further.

Claims (25)

A plurality of conveyors forming a work line through which a cutting operation on the base plate formed by joining the upper plate and the lower plate is performed, the plurality of conveyors being separated from at least one region to form a predetermined spacing interval; A scribe module installed at the spacing intervals to form a predetermined scribe line on the upper and lower surfaces of the substrate; A brake module disposed behind the scribe module along the work line to cut the substrate along the scribe line to form a plurality of primary unit substrates; And And a dummy cutting module disposed at the rear of the scribe module along the work line, and configured to cut and remove a predetermined dummy portion remaining on each of the primary unit substrates. . The method of claim 1, The conveyor is a belt conveyor (Belt Conveyor), The scribe module, An upper scribe module provided in an upper region of the belt conveyor at the intervals to form an upper scribe line on an upper plate of the base plate; And And a lower scribe module provided in the lower region of the belt conveyor at the separation interval to form a lower scribe line on the lower plate of the original substrate. The method of claim 2, The upper scribe module, An upper horizontal axis fixed along the transverse direction in the longitudinal direction of the work line; And The upper scribe line is coupled to one side of the upper horizontal axis, the upper scribe line is formed on the upper plate of the base plate which is supported and moved to the belt conveyor, and includes at least one upper scriber relatively movable on the upper horizontal axis. Substrate cutting system, characterized in that. The method of claim 3, The lower scribe module, A lower horizontal axis fixed in the horizontal direction in the longitudinal direction of the work line; And The lower scribe line is coupled to one side of the lower horizontal axis, the lower scribe line is formed on the lower plate of the base plate which is supported and moves on the belt conveyor, and includes at least one lower scriber relatively movable on the lower horizontal axis. Substrate cutting system, characterized in that. The method of claim 4, wherein The upper and lower horizontal axes are interconnected by a predetermined connection, And the upper and lower scribe lines formed on the upper and lower plates of the original substrate by the upper and lower scribers respectively form the same axis. The method of claim 1, The brake module, A pair of first rail portions disposed on both sides of the work line along the work line; And The base plate is movably coupled to the pair of first rail portions, and moves along the work line to heat and cool the base substrate positioned between the pair of first rail portions, thereby along the scribe line. Substrate cutting system comprising a removable heating / cooling unit for cutting. The method of claim 1, The dummy part, which is cut and removed by the dummy cutting module, is formed from a plate that forms a color filter (CF) of the primary unit substrate to form a pad portion on which a predetermined IC driver is mounted. Removed color filter (CF) dummy glass, The cutting operation for the dummy portion is a substrate cutting system, characterized in that proceeding from the lower side of the primary unit substrate toward the upper side. The method of claim 7, wherein The dummy cutting module, A cell stage (Cell Stage) for supporting the primary unit substrate having a color filter (CF), the upper plate is disposed on the lower side, the lower plate, which is a TFT (TFT, Thin Film Transistor) is placed on the upper side; A dummy cutting scriber for cutting the dummy part from the lower portion of the primary unit substrate supported by the cell stage; And And a support roller disposed on an opposite side of the dummy cutting scriber with the primary unit substrate interposed therebetween to support the primary unit substrate. The method of claim 7, wherein The substrate cutting system further comprises a dummy substrate (Dummy Substrate) and a discharge portion for discharging the dummy portion provided in the lower region of the brake module and the dummy cutting module, respectively. The method of claim 9, And the discharge part is accessible and spaced apart from the brake module and the dummy cutting module, respectively, at a corresponding position. The method of claim 10, And a shredding part for crushing the dummy substrate and the dummy part in the discharge part. The method of claim 8, And a divider for distributing the plurality of primary unit substrates formed from the original substrate by the brake module to the cell stage. The method of claim 12, The distributor, A pair of second rail portions disposed on both sides of the work line along the work line; A moving bar coupled to the pair of second rail parts and movable along the work line; And At least one distribution head which is movable along the movement bar and is coupled to the movement bar to be rotatable relative to the movement bar to adsorb the primary unit substrates on which the cutting operation is completed. system. The method of claim 13, The substrate cutting system, characterized in that by the distributor, the primary unit substrate is switchable in the cell stage. The method of claim 13, And a substrate transfer unit provided at a rear of the distributor along the work line and transferring the secondary unit substrate, on which the dummy portion is cut, to a trans conveyor. The method of claim 15, And a reverser for reversing the upper and lower positions of the secondary unit substrates transferred to the trans conveyor. The method of claim 16, The inverter, Inverted axis; And A substrate cutting system including a pair of reverse conveyors that are invertible based on the inversion axis and adsorb the upper and lower surfaces of the secondary unit substrate so that the secondary unit substrate can be inserted therein. . The method of claim 17, And a take-out conveyor for loading and taking out the secondary unit substrate inverted by the inverter. The method of claim 18, The upper and lower plates of the original substrate first brought into the work line are TFT, Thin Film Transistor, and Color Filter, respectively. Substrate cutting system, characterized in that the reversed when taken out by the take-out conveyor. The method of claim 1, The substrate is a substrate cutting system, characterized in that the flat panel display (FPD) of any one of a liquid crystal display (LCD), a plasma display panel (PDP) and organic light emitting diodes (OLED). a) bringing the original substrate of the cutting target object formed by joining the upper and lower plates to a predetermined work line; b) forming a scribe line on the same axis on both the upper plate and the lower plate of the imported base plate; c) cutting the substrate along the scribe line to form the plurality of primary unit substrates; And d) cutting a predetermined dummy portion remaining in each of the primary unit substrates to form a secondary unit substrate. The method of claim 21, In the step b), the upper and lower scribe lines respectively formed on the upper plate and the lower plate of the base substrate, characterized in that forming the same axis with each other. The method of claim 21, The cutting operation of the dummy portion in the step d) is characterized in that the substrate proceeds from the lower side of the primary unit substrate toward the upper side. The method of claim 21, e) after the step d), inverting the top and bottom positions of the secondary unit substrate; And and f) taking out the secondary unit substrate having its upper and lower positions reversed. The method of claim 21, In the step d), the dummy part may include a color filter which is removed from one side of the plate forming a color filter (CF) of the primary unit substrate to form a pad portion on which a predetermined IC driver is mounted. CF) substrate cutting method characterized in that the dummy glass.

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