CN101488474B

CN101488474B - System and method for scribing substrate

Info

Publication number: CN101488474B
Application number: CN200910009502XA
Authority: CN
Inventors: 金龙云; 姜判锡; 金贤虎; 金学东; 吴昌益; 金星根
Original assignee: SFA Engineering Corp
Current assignee: SFA Engineering Corp
Priority date: 2006-07-18
Filing date: 2007-07-17
Publication date: 2011-04-20
Anticipated expiration: 2027-07-17
Also published as: CN101110391A; KR20080007834A; KR100821185B1; CN101110391B; CN101488474A

Abstract

A system for scribing substrate comprises a plurality of transporters forming an operating line, for cutting through combining an upper panel and a lower panel in the operating line, and forming a scheduled external series gap from at least one area; a cutting module, mounted in the external series gap, forming a scheduled cutting line on the upper surface and the lower surface of the substrate, and forming a plurality of first unit substrates cutting the substrate along the cutting line; and a pseudo-cutting module, arranged behind the cutting module along the operating line, for cutting and removing the pseudo part left in the first substrate.

Description

Be used to cut the system and method for substrate

The application is that application number is 200710129466.1 divides an application.

Technical field

The present invention relates to a kind of substrate diced system and method, and or rather, increase, can more effectively cut substrate along with the increase of system height and make substrate cutting work carry out reducing the production time, and can improve the substrate diced system of productivity ratio thereby relate to a kind of size of preventing locking system, and a kind ofly be used to cut substrate approach with online mode.

Background technology

Substrate comprise Semiconductor substrate and as the flat-panel monitor of image display device (flat paneldisplays, FPD).The FPD substrate comprises LCD (liquid crystal display, LCD) substrate, Plasmia indicating panel (plasma display panel, PDP) substrate and Organic Light Emitting Diode (organic light emitting diode, OLED) substrate.

The LCD substrate is made by inject liquid crystal between two sheet glass.There is shortcoming in the LCD substrate, and for example its response speed is slow and cost is higher relatively.Yet the LCD substrate has favorable characteristics aspect resolution, because it is made with semiconductor technology.Therefore, in recent years the LCD substrate as the display unit of future generation of mobile phone, computer monitor and television set and come into one's own.

Fig. 1 is the perspective view of general LCD substrate (unit substrate).Fig. 2 and Fig. 3 are the plane graphs in order to the large tracts of land initial substrates of the unit substrate that forms Fig. 1.Arrive Fig. 3 referring to Fig. 1, the LCD substrate of Fig. 1 comprises: top panel 8a (or colored filter (color filter) CF) and lower panel 8b (or thin-film transistor TFT), the two forms by glass, and partly is in contact with one another when injecting liquid crystal betwixt, from and combine; Last light polarizing film (upper polarizer film) reaches light polarizing film (lower polarizer film) (not shown) down, and it is coupled to the exposed surface of top panel 8a and lower panel 8b respectively, and provides optical characteristics in the relevant position.

The top panel 8a that is formed with color image forms less than lower panel 8b.Therefore, have liner part P on the upper surface of plate 8b below, it does not cover top panel 8a.As the IC driver of the member that is used to control a plurality of units substrate 8 with the IC driver is connected to printed circuit board (PCB) (printedcircuit board, (flexible printed circuit FPC) is coupled to liner part P to flexible print circuit PCB).

When top panel 1a and lower panel 1b combination with one another, form unit substrate 8, as shown in Figures 2 and 3.Unit substrate 8 shown in Figure 1 forms to the dozens of part by large tracts of land initial substrates 1 being cut into several.Single finished product is by to make among the liner part P of module process with the IC driver unit of being installed in substrate 8.Therefore, the technology of manufacturing substrate comprises 1 cutting of large tracts of land initial substrates or cuts into several cutting steps to the dozens of part.

Exactly, when coming the unit substrate 8 of shop drawings 1 by the single initial substrates 1 of cutting drawing 2 and Fig. 3, because the top panel 8a of unit substrate 8 and the area of lower panel 8b differ from one another, so on the top panel 1a of large tracts of land initial substrates 1 and lower panel 1b, form line of cut, cut described top panel 1a and lower panel 1b along described line of cut.Therefore, line of cut need be subjected to accurate control.For the purpose of reference, the position that the mostly position that is cut of the top panel 1a of solid line (some with dotted line overlapping and show) indication large tracts of land initial substrates 1, and dotted line indicates the lower panel 1b of large tracts of land initial substrates 1 to be cut.

The cutting step of large tracts of land initial substrates 1 is to carry out by separate payment (that is the diced system that, is called cutter or cutting equipment).Decide according to the type that supports large tracts of land initial substrates 1, known so far diced system comprises belt conveyer type (belt conveyor type) and flatbed (stage type).

The belt conveyer type has short advantage of production time, but it can't directly discharge the substrate (hereinafter being called pseudo-substrate (dummysubstrate) 3a-3d) that cuts away from large tracts of land initial substrates 1 because of reasons in structure.Pseudo-substrate 3a-3d is meant the part of not marking shade among Fig. 2 and Fig. 3.

Therefore, in belt conveyer type diced system, large tracts of land initial substrates 1 be hemisect rather than cutting fully, need to carry out the heating and cooling step and form and breaks.Then, large tracts of land initial substrates 1 is finally cut, thereby forms unit substrate 8.

On the contrary, according to Platform Type, when mobile large tracts of land initial substrates 1 at will partly locate to form line of cut, because there is not the problem of discharging pseudo-substrate 3a-3d in it.Large tracts of land initial substrates 1 is fitly cut fully along line of cut, thereby forms unit substrate 8.

Yet as mentioned above, because being top panel 1a and the lower panel 1b by combination with one another, large tracts of land initial substrates 1 forms, and the top panel 1a and the lower panel 1b that are formed on large tracts of land initial substrates 1 upward differ from one another with the line of cut by the cutting unit of formation substrate 8, so the flatbed diced system needs a kind of member, it is used for whole large tracts of land initial substrates 1 being rotated or overturning 180 °, with the top panel 1a of cutting large tracts of land initial substrates 1 and any one among the lower panel 1b, then cut other one.

Yet, in the flatbed diced system, as mentioned above, need provide corresponding with it turner or inversion structures, so that reverse whole large tracts of land initial substrates 1, with the top panel 1a of cutting large tracts of land initial substrates 1 and each among the lower panel 1b.In addition, because the minimum space of the large tracts of land initial substrates 1 that need be used to reverse,, make the corresponding increase of size of system so system height can increase.

Simultaneously, in belt conveyer type diced system, as mentioned above, large tracts of land initial substrates 1 is not cut but hemisect fully, and experience heating and cooling step forms and break, and large tracts of land initial substrates 1 just finally is cut like this.Therefore, though pseudo-substrate 3a-3d need be transmitted continuously by being attached to large tracts of land initial substrates 1, and cut fully after the heating and cooling step, pseudo-substrate 3a-3d is cutting in advance during transmitting.Therefore, unit substrate 8 will might be damaged during transmission large tracts of land initial substrates 1 in order to the liner part P that the IC driver is installed very much.

Can cut into preliminary dimension by installation circuit in substrate and with substrate, and will be used for the flat board of chip and flat display devices as the substrate of electronic unit material.Substrate can be the wafer that is used to form semiconductor chip and is used for the flat board (for example, LCD panel, PDP panel and oled panel) of flat display devices.Exactly, because the LCD substrate drives by inject liquid crystal between two substrates, so with combination with one another about two substrates, and then it is cut and makes its fracture.

In general substrate, on substrate surface, form line of cut, and the temperature that change to form the substrate part at line of cut place is broken with formation, and substrate ruptures along line of cut, so just can obtain to have the semiconductor chip of the size of wanting and the flat board of flat display devices.

Yet when forming line of cut on substrate surface, when the line of cut degree of depth was more shallow, substrate was difficult to fracture, even and substrate cracking, break surface is also not too neat.In order to solve described problem, when cutting head forms line of cut on substrate surface, for example use equipment such as servo motor, cam and gear to push substrate surface with predetermined pressure, therefore the described line of cut of cutting under this state increases the line of cut degree of depth.Yet the complex structure of described equipment for the response variation of change in torque, and is difficult to it is controlled, so the performance and the degradation of substrate cutting.

In addition, in as mechanical components such as cam or gears, foreign material and dust be can produce, and a large amount of mechanical parts, for example retainer (stopper), spring and gear needed.Therefore, operational environment is unclean, and the degraded accuracy in the substrate cutting step.

Summary of the invention

In order to solve above and/or other problems, the invention provides a kind of substrate diced system and method, thereby it can prevent that the size of locking system increases, can more effectively cut substrate and makes substrate cutting work carry out to reduce the production time, also can improve productivity ratio with online mode along with the increase of system height.

The invention provides a kind of substrate diced system and method, it can prevent to be damaged in order to the liner part that the IC driver is installed in the substrate, thereby makes substrate cutting work carry out with the minimizing production time with online mode, and can improve productivity ratio.

The invention provides a kind of substrate diced system and method, its available cutting head cuts substrate with default constant cutting pressure, response and the easy control to the change in torque that are better than prior art is provided, and improves the substrate cutting performance.

According to an aspect of the present invention, the substrate diced system comprises: a plurality of conveyers, it forms active line, in described active line the initial substrates that forms by combination top panel and lower panel is carried out cutting work, and forms predetermined external series gap by separating with at least one zone; Cutting module, it is installed in the described external series gap, and forms the predetermined cuts line on the upper and lower surface of cutting module, and by forming a plurality of first unit substrates along described line of cut cutting initial substrates; And pseudo-cutting module, it is arranged in the back of cutting module along active line, and cuts and remove pseudo-part remaining in each first unit substrate.

Description of drawings

By describing the preferred embodiments of the present invention in detail referring to accompanying drawing, above other feature and advantage that reach of the present invention will become more apparent, in the drawings:

Fig. 1 is the perspective view of general LCD substrate (unit substrate).

Fig. 2 and Fig. 3 are the plane graphs in order to the large tracts of land initial substrates of the unit substrate that forms Fig. 1.

Fig. 4 is the perspective view according to the substrate cutting equipment of first embodiment of the invention.

Fig. 5 is the plane graph of the substrate cutting equipment of Fig. 1.

Fig. 6 illustrates the operation in cutting module zone.

Fig. 7 illustrates down the operation of cutting module region.

Fig. 8 is the flow chart that is used to explain according to the substrate cutting method of first embodiment of the invention.

Fig. 9 is the perspective view according to the substrate cutting equipment of second embodiment of the invention.

Figure 10 is the plane graph of the substrate cutting equipment of Fig. 9.

Figure 11 illustrates the operation in cutting module zone.

Figure 12 illustrates the operation in pseudo-cutting module zone.

Figure 13 is the flow chart that is used to explain according to the substrate cutting method of second embodiment of the invention.

Figure 14 is the perspective view according to the substrate cutting equipment of third embodiment of the invention.

Figure 15 is the plane graph of the substrate cutting equipment of Figure 14.

Figure 16 illustrates the operation in the first cutting module zone.

Figure 17 illustrates the operation in the second cutting module zone.

Figure 18 is the flow chart that is used to explain according to the substrate cutting method of third embodiment of the invention.

Figure 19 is the perspective view according to the substrate cutting equipment of fourth embodiment of the invention.

Figure 20 is the plane graph of the substrate cutting equipment of Figure 19.

Figure 21 illustrates the operation in the first cutting module zone.

Figure 22 illustrates the operation in the second cutting module zone.

Figure 23 is the flow chart that is used to explain according to the substrate cutting method of fourth embodiment of the invention.

Figure 24 is the structure according to the substrate diced system of fifth embodiment of the invention.

Figure 25 is the side of the substrate cutting equipment of Figure 24.

Figure 26 illustrates the cutting operation of the substrate diced system of Figure 24, and wherein cutting head moves in dynamometer (load cell) top.

Figure 27 illustrates the cutting operation of the substrate diced system of Figure 24, and wherein carriage is pushed dynamometer.

Figure 28 illustrates the cutting operation of the substrate diced system of Figure 24, wherein cutting head cutting substrate.

Figure 29 illustrates the substrate that the substrate diced system of Figure 24 is cut.

Figure 30 is the flow chart of substrate cutting method that illustrates the substrate diced system of Figure 24 in regular turn.

Figure 31 explanation is according to the structure of the substrate diced system of sixth embodiment of the invention.

Embodiment

With reference to the accompanying drawing that is used to illustrate the preferred embodiments of the present invention, fully understand so that obtain the present invention, advantage of the present invention and implement the attainable target of the present invention.Hereinafter, will describe the present invention in detail by explain the preferred embodiments of the present invention referring to accompanying drawing.Reference numeral identical among the figure refers to similar elements.

For the purpose of reference, substrate hereinafter described is meant flat-panel monitor (FPD), wherein comprise LCD (liquid crystal display, LCD), Plasmia indicating panel (plasma displaypanel, PDP) and Organic Light Emitting Diode (organic light emitting diode, OLED).Yet,, these are referred to as substrate for the ease of explaining.In addition, as mentioned above, in the following description, Fig. 1 unit of concentrating on substrate 8, and Fig. 2 concentrates on large tracts of land initial substrates 1.

Fig. 4 is the perspective view according to the substrate cutting equipment of first embodiment of the invention.Fig. 5 is the plane graph of the substrate cutting equipment of Fig. 1.Fig. 6 illustrates the operation in cutting module zone.Fig. 7 illustrates down the operation of cutting module region.Fig. 8 is the flow chart that is used to explain according to the substrate cutting method of first embodiment of the invention.

Arrive Fig. 8 referring to Fig. 4, mainly referring to Fig. 4 and Fig. 5, substrate cutting equipment according to the embodiment of the invention comprises: first lower platform 110, upper mounting plate 130 and second lower platform 160, described platform all is provided on first to the 4th active line W1-W4, and described active line is along the direction layout parallel to each other of large tracts of land initial substrates 1 being carried out cutting work; And distributor 170, cross drive device 175, inversion device 185 and discharge conveyer 190, it is arranged in substrate cutting equipment back.

The substrate cutting equipment comprises: go up cutting module 120, it is provided at first lower platform, 110 tops; Following cutting module 140, it is provided at upper mounting plate 130 belows; And discharge section 150, it is provided at down cutting module 140 belows, to discharge the pseudo-substrate 3a-3d that cuts away from large tracts of land initial substrates 1.

Above element can carry out a series of activities, and the large tracts of land initial substrates 1 that wherein comprises Fig. 2 is input to first lower platform 110; Carry out predetermined cuts work to form the unit substrate 8 of Fig. 1; And be discharged to and discharge conveyer 190.Therefore, because large tracts of land initial substrates 1 can be based upon Wiring technology (inline proces s), so can reduce the production time and can boost productivity in addition.And,,, can prevent that so just system dimension from increasing so can reduce system height because the substrate cutting equipment need not to be used to the structure of whole large tracts of land initial substrates 1 of reversing or overturn.

The large tracts of land initial substrates 1 of Fig. 2, the unit substrate 8 of Fig. 1 and the moving direction of cut direction or platform 110,130 and 160 are at first described.The large tracts of land initial substrates 1 of Fig. 2 is the parent that is used for forming the unit substrate 8 of Fig. 1.Therefore, in the present embodiment, the unit substrate 8 of 12 dash area indicator diagrams 1 of the large tracts of land initial substrates 1 of Fig. 2.

In addition, the top panel 1a of the most of solid line that illustrates among Fig. 2 (some is because of showing with dotted line is overlapping) indication large tracts of land initial substrates 1 is by the position of last cutting module 120 cuttings, and the lower panel 1b of dotted line indication large tracts of land initial substrates 1 is by the position of cutting module 140 cuttings down.The remainder indication that does not add shade is discharged to the pseudo-substrate 3a-3d of discharge section 150.

The same with unit substrate 8, large tracts of land initial substrates 1 comprises top panel 1a and lower panel 1b, and described top panel 1a and lower panel 1b are made by the glass of two combinations with one another.Face up and under the ventricumbent state of lower panel 8b as thin-film transistor TFT, unit substrate 8 finally is placed on discharges on the conveyer 190 as shown in Figure 1 at top panel 8a, and then unit substrate 8 is discharged for reprocessing as colored filter CF.

Yet, before cutting step, be entered into the first active line W1 mutually on the contrary by large tracts of land initial substrates 1 being inverted to unit substrate 8.That is to say, face up as the top panel 1a of TFT, and face down as the lower panel 1b of CF.In this state, large tracts of land initial substrates 1 is input to the first active line W1, and carries out a series of cutting steps.

In the present embodiment, by diced system the large tracts of land initial substrates 1 of Fig. 2 is cut into 12 unit substrates 8 altogether.First to the 4th active line W1-W4 is a Y direction with respect to the direction that the moving direction of cut direction or platform 110,130 and 160 is formed parallel to each other, and is X-direction perpendicular to the direction of first to the 4th active line W1-W4.

In the structure of formation according to each element of the substrate cutting equipment of present embodiment, first lower platform 110 supports the large tracts of land initial substrates of being imported 1 and also is coupled to the first active line W1, so that can move on Y direction along the first active line W1.Can use linear movement accurately to control moving of first lower platform 110.

First lower platform 110 is from the described large tracts of land initial substrates 1 of lower support of the large tracts of land initial substrates 1 that is input to the first active line W1.Therefore, when large tracts of land initial substrates 1 being placed on first lower platform 110, the lower panel 1b of large tracts of land initial substrates 1 is contained in the upper surface of first lower platform 110 and thus and supports.

Though explanation large tracts of land initial substrates 1 will be by on the upper surface that is contained in first lower platform 110 and supported among the figure, the operation of lip-deep a plurality of lifter pins (lift pin) (not shown) that large tracts of land initial substrates 1 also can be by being provided at first lower platform 110 is contained on the upper surface of first lower platform 110.

That is to say that when independent manipulator (not shown) was loaded in large tracts of land initial substrates 1 on the upper surface of first lower platform 110, lifter pin rose the lower surface with the lower panel 1b that supports large tracts of land initial substrates 1.Then, lifter pin descends, thereby large tracts of land initial substrates 1 is contained on the upper surface of first lower platform 110 and supports thus.

When large tracts of land initial substrates 1 is contained on the upper surface of first lower platform 110 and supports thus, be contained on the upper surface of first lower platform 110 and the large tracts of land initial substrates 1 that supports thus by the independent vacuum line absorption on the upper surface of first lower platform 110.Therefore, large tracts of land initial substrates 1 is fixed on fixing position, and can not move arbitrarily on the upper surface of first lower platform 110.On the contrary, when discharging large tracts of land initial substrates 1 from the upper surface of first lower platform 110, lifter pin rises, so that large tracts of land initial substrates 1 is risen to predetermined altitude.

Because the structure of lifter pin and operation not only are applicable to first lower platform 110, and similarly are applicable to second lower platform 160 and upper mounting plate 130, so will omit it are described further.Yet, absorption (absorption) operation to large tracts of land initial substrates 1 will be described in appropriate section in more detail.

Last cutting module 120 is provided in the upper area of first lower platform 110, and by forms on the upper surface 1a of the large tracts of land initial substrates 1 that supports by first lower platform 110 be scheduled on line of cut cut large tracts of land initial substrates 1 (please referring to Fig. 6).Last cutting module 120 comprises: cross tube (uppercross bar) 121, and it is fixed in the zone of location first lower platform 110 along the direction perpendicular to the length direction of the first active line W1; And a plurality of cutters 123 of going up, it is coupled to cross tube 121 1 sides.

Though first lower platform 110 is moving on the first active line W1 on the Y direction, cross tube 121 is fixed on the corresponding position and only is coupled to the last cutter 123 of cross tube 121 removable.Further the opposite side at cross tube 121 provides the upper lines of observing line of cut to observe part 125.Can be by determining to go up the position of cutter 123 on cross tube 121 based on the control of observing part 125 observed images by upper lines.

Last cutter 123 comprises: go up holder 123a, it is coupled to cross tube 121; And on cut tool 123b, it forms line of cut on the top panel 1a of large tracts of land initial substrates 1, described large tracts of land initial substrates 1 moves by being supported by first lower platform 110.Last holder 123a can relatively move on cross tube 121.

Therefore, when forming line of cut on the top panel 1a in the large tracts of land initial substrates 1 of Fig. 2 with the large tracts of land initial substrates 1 that is of uniform thickness thick of cutting and top panel 1a, along with first lower platform 110 with respect to moving of the last cutter 123 that is fixed in a certain position and the cutting work on the execution Y direction.When first lower platform fixedly the time, along with last cutter 123 when mobile, is being carried out the cutting work on the X-direction on the X-direction on cross tube 121.Therefore, with the top panel 1a execution cutting work of said method to large tracts of land initial substrates 1.

As shown in Figure 6, even when the top panel 1a of large tracts of land initial substrates 1 being carried out cutting work and produce the pseudo-substrate 3b in pseudo-substrate 3a and end in the above among the plate 1a, because large tracts of land initial substrates 1 is supported by first lower platform 110, so pseudo-substrate 3a can't separate from large tracts of land initial substrates 1 with the pseudo-substrate 3b in end.By the operation of the following cutting module 140 of description after a while, pseudo-substrate 3a is separated from large tracts of land initial substrates 1 with the pseudo-substrate 3d in end with the pseudo-substrate 3c that produces from lower panel 1b with 3b.

Upper mounting plate 130 is by supporting large tracts of land initial substrates 1 from top absorption large tracts of land initial substrates 1, wherein used cutting module 120 to finish cutting work to the top panel 1a of large tracts of land initial substrates 1.That is to say that different with first lower platform 110, the top panel 1a of upper mounting plate 130 absorption large tracts of land initial substrates 1 is to promote large tracts of land initial substrates 1.Therefore, upper mounting plate 130 is arranged to be higher than first lower platform 110, and is designed to be able to relatively move with respect to first lower platform 110.

In order to make the top panel 1a of upper mounting plate 130 absorption and lifting large tracts of land initial substrates 1, upper mounting plate 130 comprises a plurality of lifter pins (not shown) as first lower platform 110.Yet, different with first lower platform 110, preferably form vacuum line (not shown) in each lifter pin in being provided in upper mounting plate 130 in order to absorption large tracts of land initial substrates 1.

Therefore, when the lifter pin of first lower platform 110 be raised with large tracts of land initial substrates 1 when first lower platform 110 rises to predetermined altitude, the lifter pin of the upper mounting plate 130 that moves above first lower platform 110 is lowered, with the upper surface of the top panel 1a of contact large tracts of land initial substrates 1.When forming vacuum by vacuum line (vacuum line), large tracts of land initial substrates 1 is adsorbed.When large tracts of land initial substrates 1 was adsorbed, the lifter pin of upper mounting plate 130 can be raised, and made the top panel 1a of large tracts of land initial substrates 1 can contact the lower surface of upper mounting plate 130 and support thus.

Except the structure of lifter pin and vacuum line, can use electrode electrostatic chuck (electrodestatic chuck) to replace upper mounting plate 130, described electrode electrostatic chuck makes the electricity consumption friction adsorb large tracts of land initial substrates 1.Large tracts of land initial substrates 1 is being moved to the process of upper mounting plate 130 from first lower platform 110, and upper mounting plate 130 moves towards first lower platform 110, and perhaps first lower platform 110 moves towards upper mounting plate 130.

Following cutting module 140 by form on the lower panel 1b of the large tracts of land initial substrates 1 adsorbed by upper mounting plate 130 predetermined on line of cut cut large tracts of land initial substrates 1 (please referring to Fig. 7).Following cutting module 140 comprises: sheer pole 141, and it is fixed in the zone of location upper mounting plate 130 along the direction perpendicular to the length direction of the second active line W2; And a plurality of cutters 143 down, it is coupled to sheer pole 141 1 sides.

Though upper mounting plate 130 is moving on the second active line W2 on the Y direction, sheer pole 141 is fixed on the relevant position and only is coupled to the following cutter 143 of sheer pole 141 removable.Further the opposite side at sheer pole 141 provides the lower line of line of cut under the observation to observe part 145.Can be by determining the position of cutter 143 on sheer pole 141 down based on the control of observing part 145 observed images by lower line.

Following cutter 143 comprises: following holder 143a, and it is coupled to sheer pole 141; And incision tool 143b, it is line of cut under forming on the lower panel 1b of large tracts of land initial substrates 1, and described large tracts of land initial substrates 1 moves by being supported by upper mounting plate 130.Following holder 143a can relatively move on sheer pole 141.

Therefore, when line of cut is with the large tracts of land initial substrates 1 that is of uniform thickness thick of cutting and lower panel 1b under forming on the lower panel 1b in the large tracts of land initial substrates 1 of Fig. 2, along with upper mounting plate 130 is carried out cutting work on the Y direction with respect to moving of the following cutter 143 that is fixed in a certain position.When upper mounting plate 130 fixedly the time, along with cutter 143 down when mobile, is being carried out the cutting work on the X-direction on the X-direction on sheer pole 141.Therefore, with the lower panel 1b execution cutting work of said method to large tracts of land initial substrates 1.

As shown in Figure 7, during the lower panel 1b of cutting module 140 cutting instantly and the large tracts of land initial substrates 1 that is of uniform thickness thick of lower panel 1b, produce the pseudo-substrate 3d in pseudo-substrate 3c and end below among the plate 1b, wherein pseudo-substrate 3c partly covers the pseudo-substrate 3a that is formed on the top panel 1a, and the pseudo-substrate 3d in end covers the pseudo-substrate 3b in the end that is formed on the top panel 1a.These pseudo-substrate 3a-3d fall by own wt or the independent unit of removing.Provide discharge section 150 can not be scattered to help pseudo-substrate 3a-3d to fall to being discharged to a zone.

In the lower area of following cutting module 140, provide discharge section 150, so that discharge the pseudo-substrate 3a-3d that from large tracts of land initial substrates 1, cuts away.Discharge section 150 has funnel shaped (hoppershape), makes that inlet is bigger, and the volume distad of discharge section 150 branch reduces gradually.

When large tracts of land initial substrates 1 stands to add man-hour in the zone of last cutting module 120, discharge section 150 need not to move closer to down the lower area of cutting module 140.Therefore, discharge section 150 preferably can be in the relevant position near following cutting module 140 or from cutting module 140 withdrawals down.Can easily implement this kind structure by the combination of cylinder or motor and ball screw (ball screw).

In addition, because the pseudo-substrate 3a-3d that cuts away all has predetermined length and area, so in order to reuse by pulverizing into fine powder, discharge section 150 further comprises breaking portion 152, it makes pseudo-substrate 3a-3d fracture.

Second lower platform, 160 support organization's substrates 8, unit substrate 8 forms by using last cutting module 120 and following cutting module 140 to cut large tracts of land initial substrates 1 one by one.Second lower platform 160 can also move on Y direction on the 3rd active line W3, and the 3rd active line W3 forms identical axis with the first active line W1.

Move to second lower platform, 160, the second lower platforms 160 and move towards upper mounting plate 130 in order to be formed at unit substrate 8 on the upper mounting plate 130, perhaps upper mounting plate 130 moves towards second lower platform 160.Yet, referring to accompanying drawing because distributor 170 is installed in second lower platform, 160 tops, so when upper mounting plate 130 when second lower platform 160 moves, 170 pairs of upper mounting plates 130 of distributor are checked, make the mobile of upper mounting plate 130 be restricted.Therefore, in the present embodiment, second lower platform 160 is by moving the unit's of admittance substrate 8 along the 3rd active line W3 towards upper mounting plate 130.

Distributor 170 is coupled to the top of the 3rd active line W3, that is to say, be coupled to the 4th active line W4 that forms same axis with the second active line W2, and move, be assigned to cross drive device 175 one by one with the unit substrate 8 that will finish cutting work along the 4th active line W4.That is to say, because the unit substrate 8 that forms by cutting large tracts of land initial substrates 1 is individual management in reprocessing, so distributor 170 moves to cross drive device 175 with per unit substrate 8 one by one.

Distributor 170 comprises: carriage release lever 171, and it is coupled to the 4th active line W4, and can move along the 4th active line W4 on Y direction; And a plurality of dispensing heads 172, it not only is coupled to carriage release lever 171 and can moves along carriage release lever 171, but also with respect to carriage release lever 171 counterrotating absorption simultaneously or grasp unit substrate 8, so that unit substrate 8 is moved to cross drive device 175.

As mentioned above, owing to unit substrate 8 is managed one by one, so when in diced system, providing a cross drive device 175, in carriage release lever 171, provide a dispensing head 172 just enough according to present embodiment.Yet,, provide two dispensing heads 172 at carriage release lever 171 places owing to providing two cross drive devices in order to improve productivity ratio in the present embodiment.Can change its number according to design.

Simultaneously, under the ventricumbent state of lower panel 1b owing to facing up as CF at the top panel 1a as TFT of large tracts of land initial substrates 1, on first to the 4th active line W1-W4, carry out cutting work, so distribute and the top panel 8a as CF that is placed on the unit substrate 8 on the cross drive device 175 faces down and faces up as the lower panel 8b of TFT by distributor 170.

Yet in order to carry out process management, the top panel 8a as CF of the unit substrate 8 that finally produces faces up, and faces down as the lower panel 8b of TFT.For this purpose, provide inversion device 185, the upper surface and the lower surface of its counter-rotating per unit substrate 8 in the back of cross drive device 175.

Inversion device 185 comprises reversing shaft 186 and a pair of counter-rotating conveyer 187, and described counter-rotating conveyer 187 can be around the upper surface and the lower surface of reversing shaft 186 counter-rotatings and absorption per unit substrate 8, and the unit's of making substrate 8 can insert wherein.Therefore, after unit substrate 8 inserted between the counter-rotating conveyer 187, counter-rotating conveyer 187 made the upper surface of per unit substrate 8 and the position of lower surface easily to reverse around 180 ° of reversing shaft 186 counter-rotatings.That is to say, as required, unit substrate 8 is arranged to that top panel 8a as CF faces up and faces down as the lower panel 8b of TFT.

Provide in inversion device 185 back and to discharge conveyer 190, wherein be loaded in top through the final unit substrate 8 of inversion device 185 counter-rotatings upper surface and lower surface and be discharged from for reprocessing.Discharging conveyer 190 provides with similar number and on identical axis with cross drive device 175.

Hereinafter will be referring to Fig. 4, the 5 and 8 simple methods of describing the substrate diced system of use configuration in the above described manner with large tracts of land initial substrates 1 unit's of cutting into substrate 8.At first, large tracts of land initial substrates 1 is input to the first active line W1 (S111) and placing it on the upper surface of first lower platform 110.The lifter pin of first lower platform 110 rises to admit large tracts of land initial substrates 1, descends so that large tracts of land initial substrates 1 can be accommodated on the upper surface of first lower platform 110 then.

When large tracts of land initial substrates 1 was contained on the upper surface of first lower platform 110, the last cutting module 120 and first lower platform 110 can be driven, and the top panel 1a of large tracts of land initial substrates 1 is carried out cutting work (S112).That is to say, when the last cutter 123 that is equivalent to fix when first lower platform 110 moves, carry out the cutting work on the Y direction.When last cutter 123 under the fixing state of first lower platform 110 when on X-direction, moving on the cross tube 121, carry out the cutting work on the X-direction.

When the cutting work of the top panel 1a of large tracts of land initial substrates 1 was finished, upper mounting plate 130 moved along the second active line W2, and is arranged in first lower platform, 110 tops.

When the lifter pin of first lower platform 110 is raised, with large tracts of land initial substrates 1 when first lower platform 110 rises to predetermined altitude, the lifter pin that moves to the upper mounting plate 130 of first lower platform 110 reduces, with the top panel 1a of contact large tracts of land initial substrates 1.Therefore, form vacuum with absorption large tracts of land initial substrates 1 by vacuum line.

When large tracts of land initial substrates 1 was adsorbed, the lifter pin of the upper mounting plate 130 that raises once more made the top panel 1a of large tracts of land initial substrates 1 can contact the lower surface of upper mounting plate 130.Turn back to the home position from the upper mounting plate 130 of top absorption large tracts of land initial substrates 1 according to the second active line W2.

When large tracts of land initial substrates 1 was adsorbed by upper mounting plate 130, following cutting module 140 and upper mounting plate 130 can be driven, so that the lower panel 1b of large tracts of land initial substrates 1 is carried out cutting work (S113).That is to say, when upper mounting plate 130 moves with respect to fixing following cutter 143, can carry out the cutting work on the Y direction.Instantly cutter 143 is carried out the cutting work on the X-direction when moving under the state that upper mounting plate 130 is fixed on sheer pole 141.The pseudo-substrate 3a-3d that separates from large tracts of land initial substrates 1 falls and discharges by discharge section 150.

Next, second lower platform 160 moves below upper mounting plate 130 along the 3rd active line W3, and the unit substrate 8 that separates with upper mounting plate 130 of admittance, and turns back to the home position.After turning back to the home position, the unit substrate 8 that is placed on second lower platform 160 by the distributor 170 that moves along the 4th active line W4 is assigned to cross drive device 175 (S114) one by one.

Then, the per unit substrate 8 that is placed on the cross drive device 175 is inserted between the counter-rotating conveyer 187.When counter-rotating conveyer 187 during around 180 ° of reversing shaft 186 counter-rotatings, the upper surface of per unit substrate 8 and the position change of lower surface (S115).

Therefore, upper surface and lower surface position can be discharged from for reprocessing (S116) by being loaded in to discharge on the conveyer 190 through the unit substrate 8 of inversion device 185 counter-rotatings.

According to present embodiment, the structure owing to need not in order to the counter-rotating or the whole large tracts of land initial substrates 1 of overturning increases because of the increase of system height so can prevent size.In addition, can more effectively cut large tracts of land initial substrates 1, the cutting work of large tracts of land initial substrates 1 can online mode be made and can reduce the production time, and can further improve productivity ratio.

Fig. 9 is the perspective view according to the substrate cutting equipment of second embodiment of the invention.Figure 10 is the plane graph of the substrate cutting equipment of Fig. 9.Figure 11 illustrates the operation in cutting module zone.Figure 12 illustrates the operation in pseudo-cutting module zone.Figure 13 is the flow chart that is used to explain according to the substrate cutting method of second embodiment of the invention.

To Figure 13, mainly referring to Fig. 9 and Figure 10, substrate cutting equipment according to the present invention comprises referring to Fig. 9: a plurality of belt conveyers (belt conveyor) 210a-210d, and it forms in order to large tracts of land initial substrates 1 is carried out the active line of cutting work; And cutting module 220, fracture module 260 and pseudo-cutting module 265, it is all arranged successively along the active line of belt conveyer 210a-210d.

The substrate cutting equipment further comprises: a pair of

discharge section

250a and 250b, and it is positioned at the predetermined lower area place of belt conveyer 210a-210d; Distributor 270, it is provided at the back of pseudo-cutting module 265; Cross drive device 275; Inversion device 285; And discharge conveyer 290.

By said structure the large tracts of land initial substrates 1 of Fig. 2 of being input to active line is carried out predetermined cuts work.Therefore, form the unit substrate 8 (hereinafter being called the second unit substrate) of Fig. 1 and it is discharged to discharges conveyer 290.

Therefore, work online owing to can set up to large tracts of land initial substrates 1, thus can reduce the production time, and can further improve productivity ratio.Exactly, substrate diced system according to the foundation present embodiment, the liner part P (please referring to Fig. 1) that can prevent from will install in the second unit substrate 8 the IC driver is damaged, and large tracts of land initial substrates 1 can be cut into several to the dozens of second unit substrate 8.

The large tracts of land initial substrates 1 of Fig. 2, the second unit substrate 8 of Fig. 1 and the moving direction of cut direction or belt conveyer 210a-210d will at first be described below.

The large tracts of land initial substrates 1 of Fig. 2 is the parent that is used for forming the second unit substrate 8 of Fig. 1.Therefore, in the present embodiment, 12 dash areas of the large tracts of land initial substrates 1 of Fig. 2 are the second unit substrate 8 of indicator diagram 1 individually.

In addition, the top panel 1a of the most of solid line that illustrates among Fig. 2 (some is because of showing with dotted line is overlapping) indication large tracts of land initial substrates 1 is by the position of last cutting module 230 cuttings, and the lower panel 1b of dotted line indication large tracts of land initial substrates 1 is by the position of cutting module 240 cuttings down.The remainder indication that does not add shade is discharged to the pseudo-substrate 3a-3d of discharge section 250.For the purpose of reference, the part 3e of Figure 12 indicates pseudo-substrate, but the service position of cutting or method and other pseudo-substrate 3a-3d's is different.Therefore, part 3e is called pseudo-part so that make a distinction with other pseudo-substrate 3a-3d, and reference in a different manner.Pseudo-part is indicated from panel one sidesway of the CF that forms the first unit substrate 8 ' and is removed, to form the pseudo-glass of colored filter (CF) of the liner part P that the IC driver will be installed.

The same with the second unit substrate 8, large tracts of land initial substrates 1 comprises top panel 1a and lower panel 1b, and described panel is formed by two sheet glass.Face up and after facing down as the lower panel 8b of TFT, discharge for reprocessing at top panel 8a finally being placed on the second unit substrate 8 of discharging on the conveyer 290 as CF.

Yet, before cutting technique,, be entered into the belt conveyer 210a-210d that forms active line large tracts of land initial substrates 1 being inverted under the state opposite with the second unit substrate 8.That is to say, face up and under the ventricumbent state of lower panel 1b as CF at top panel 1a as TFT, with 1 input of large tracts of land initial substrates to carry out a series of cutting work.

In the present embodiment, the single large tracts of land initial substrates 1 with Fig. 2 cuts into 12 second unit substrates 8 altogether by diced system.Herein, about the moving direction of cut direction or belt conveyer 210a-210d, the direction that belt conveyer 210a-210d is arranged is called Y direction, and will be called X-direction perpendicular to the direction of Y direction.Each element of substrate cutting equipment is described below successively.

Belt conveyer 210a-210d is the part of the cutting active line of formation large tracts of land initial substrates 1.Because large tracts of land initial substrates 1 can be transmitted under situation about not being damaged, so belt conveyer 210a-210d is better than platform.Aspect the position, belt conveyer 210a-210d is divided into first to four-tape formula conveyer 210a-210d on Y direction, wherein discharges as a plurality of second unit substrates 8 with 1 input of large tracts of land initial substrates and with it.

Therefore, between first to four-tape formula conveyer 210a-210d, form a plurality of predetermined isolated gap 212a-212c.Though any ad hoc structure is not provided in

external series gap

212a and 212c, cutting module 220 is provided in external series gap 212b.First to four-tape formula conveyer 210a-210d is on just (+) of Y-axis or negative (-) direction in its position and rotates, to transmit the large tracts of land initial substrates 1 that is contained on its upper surface or the second unit substrate 8 on the respective direction with execution work.Use linear movement accurately to control first to four-tape formula conveyer 210a-210d move.

Cutting module 220 is installed, to form line of cut and following line of cut on the two among the external series gap 212b between the second belt conveyer 210b and the 3rd belt conveyer 210c at the top panel 1a of large tracts of land initial substrates 1 and lower panel 1b.Last line of cut on the top panel 1a that is formed at large tracts of land initial substrates 1 and the lower panel 1b and following line of cut form with Figure 11 in the same line that illustrates.

Cutting module 220 comprises: go up cutting module 230, it is provided in external series gap 212b above the second belt conveyer 210b and the 3rd belt conveyer 210c, and forms line of cut on the top panel 1a of large tracts of land initial substrates 1; With following cutting module 240, it is provided in external series gap 212b below the second belt conveyer 210b and the 3rd belt conveyer 210c, and under forming on the lower panel 1b of large tracts of land initial substrates 1 line of cut.

Last cutting module 230 comprises: cross tube 231, and it provides on the direction (X-direction) perpendicular to the length direction (Y direction) of active line regularly; And a plurality of cutters 233 of going up, its coupling cross tube 231 1 sides.Though be positioned near the cutting module 230 the second belt conveyer 210b and the 3rd belt conveyer 210c on Y direction when mobile, but cross tube 231 is fixed on the corresponding position, and the last cutter 233 that only is coupled to cross tube 231 just can move on X-direction.

Further the opposite side at cross tube 231 provides the upper lines of line of cut in the observation to observe part (not shown).Can be by determining to go up the position of cutter 233 on cross tube 231 based on the control of observing the observed image of part by upper lines.

Last cutter 233 comprises: go up holder 233a, it is coupled to cross tube 231; And on cut tool 233b, it forms line of cut on the top panel 1a of large tracts of land initial substrates 1, described large tracts of land initial substrates 1 moves by being supported by the second belt conveyer 210b and the 3rd belt conveyer 210c.Last holder 233a is coupled into and can relatively moves on cross tube 231.

Therefore, in order on the top panel 1a of the large tracts of land initial substrates 1 of Fig. 2, to form line of cut, when the second belt conveyer 210b and the 3rd belt conveyer 210c move with respect to fixing last cutter 233, the line of cut formation work on the execution Y direction.As the second belt conveyer 210b and the 3rd belt conveyer 210c fixedly the time, along with last cutter 233 when mobile, is being carried out the line of cut formation work on the X-direction on the X-direction on cross tube 231.With the method, can on the top panel 1a of large tracts of land initial substrates 1, form line of cut.

The structure of the structure of following cutting module 240 and last cutting module 230 much at one.That is to say that following cutting module 204 is included in perpendicular to sheer pole 241 fixing on the direction of the length direction of active line, and a plurality of cutters 243 down that are coupled to sheer pole 241 1 sides.

Though being positioned at down, near the cutting module 240 second belt conveyer 210b and the 3rd belt conveyer 210c can move on Y direction, but sheer pole 241 is fixed on the corresponding position, and the following cutter 243 that only is coupled to sheer pole 241 just can move on X-direction.

The observation part (not shown) that rolls off the production line of line of cut under the observation further is provided at the opposite side of sheer pole 241.Can be by determine the position of cutter 243 on sheer pole 241 down based on the control of observing the observed image of part by rolling off the production line.

Following cutter 243 comprises: following holder 243a, and it is coupled to sheer pole 241; And incision tool 243b, it is line of cut under forming on the lower panel 1b of large tracts of land initial substrates 1, and described large tracts of land initial substrates 1 moves by being supported by the second belt conveyer 210b and the 3rd belt conveyer 210c.Following holder 243a is coupled into and can relatively moves on sheer pole 241.

Therefore, for line of cut under forming on the lower panel 1b of the large tracts of land initial substrates 1 of Fig. 2, when the second belt conveyer 210b and the 3rd belt conveyer 210c move with respect to fixing following cutter 243, carry out the line of cut formation work on the Y direction.As the second belt conveyer 210b and the 3rd belt conveyer 210c fixedly the time, along with cutter 243 down when mobile, is being carried out the line of cut formation work on the X-direction on the X-direction on sheer pole 241.With the method, can on the lower panel 1b of large tracts of land initial substrates 1, form line of cut.

As mentioned above, be formed at top panel 1a and the last line of cut on the lower panel 1b and the following line of cut formation same axis (please referring to Figure 11) of large tracts of land initial substrates 1 respectively herein.For this purpose, cross tube 231 and sheer pole 241 are connected to each other by predetermined coupling part 225, and therefore upward cutter 233 and following cutter 243 are driven together.

Even when forming line of cut and following line of cut by cutting module 220 on the top panel 1a of large tracts of land initial substrates 1 and lower panel 1b, large tracts of land initial substrates 1 is not cut yet.In order to cut large tracts of land initial substrates 1 along line of cut to form the second unit substrate 8, need be in order to the unit of cutting large tracts of land initial substrates 1.

Fracture module 260 is arranged in cutting module 220 back along active line, and cuts large tracts of land initial substrates 1 to form the second unit substrate along line of cut.Fracture module 260 comprises: a pair of first rail portion 261, and it is arranged with certain-length in the 3rd belt conveyer 210c both sides on Y direction; And removable heating/cooling segment 262, it is coupled to first rail portion 261, so that can move along first rail portion 261.

Removable heating/cooling segment 262 is when first rail portion 261 moves, by heating and cooling between first rail portion 261 large tracts of land initial substrates 1 and along line of cut cutting large tracts of land initial substrates 1, wherein in the above plate 1a and lower panel 1b the two go up the formation line of cut.

For the purpose of reference, in order to cut large tracts of land initial substrates 1 along line of cut, to exert pressure to cutting line area or to heat the method that the part that forms line of cut is cooled off described part then rapidly, use the thermal stress of friable material to cut large tracts of land initial substrates 1.

Therefore, need one to be used for exerting pressure or the unit of heating and cooling large tracts of land initial substrates 1 to large tracts of land initial substrates 1.In the present embodiment, fracture module 260 is used for described purpose.Exactly, in the present embodiment, removable heating/cooling segment 262 uses the thermal stress of friable material to cut large tracts of land initial substrates 1 with the method for heating and cooling large tracts of land initial substrates 1.Yet, a kind of pressing method before alternately using.In the case, can compressed air be installed in fracture module 260 injects part and replaces removable heating/cooling segment 262.

Even when on large tracts of land initial substrates 1, forming line of cut by cutting module 220 and large tracts of land initial substrates 1 being cut into a plurality of first unit substrate 8 ', do not obtain the final second unit substrate 8 shown in Fig. 8 yet by fracture module 260.That is to say, as mentioned above, in order to obtain the final second unit substrate 8, owing to form less than the lower panel 8b of conduct, so need to cut the part that is called pseudo-part 3e among the top panel 8a in order to the CF of formation liner part P as the top panel 8a of TFT.Owing to can't cut or remove pseudo-part 3e by cutting module 220 or fracture module 260, so need remove pseudo-part 3e with pseudo-cutting module 265.

Pseudo-cutting module 265 is used for cutting and being divided into each first unit substrate 8 ' of polylith.Yet,, therefore form the first unit substrate 8 ' owing to facing up at top panel 1a and importing large tracts of land initial substrates 1 under as the ventricumbent state of lower panel 1b of CF as TFT.The first unit substrate 8 ' is advanced towards pseudo-cutting module 265 under all ventricumbent state of panel of feasible formation CF.Therefore, the cutting and the work of carrying out by 265 couples of pseudo-part 3e of pseudo-cutting module that removes is carried out to upside from downside.

Pseudo-cutting module 265 comprises: vaccum bench (vacuum table) 266, and it is from the unit platforms of the lower support first unit substrate 8 ' (cell stage); Pseudo-cutter 267, it is from the pseudo-part 3e of following cutting of the first unit substrate 8 ' that supported by vaccum bench 266; And back-up roller (supportroller) 268, it is arranged in the opposition side of pseudo-cutter 267 with respect to the first unit substrate 8 ', and supports the first unit substrate 8 '.

Different with the above-mentioned cutter 233 of going up with following cutter 243, think that pseudo-cutter 267 has a series of structures, described structure can form line of cut cutting pseudo-part 3e, and exerts pressure or heat and cool off described part rapidly to described part.In the present embodiment, provide vaccum bench 266 as unit platforms.Yet, alternately use any support organization that can support the first unit substrate 8 '.

Vaccum bench 266 is in order to use vacuum to support the first unit substrate 8 ' that is contained on the upper surface.Method outside can vacuum method supports the first unit substrate 8 '.In addition, vaccum bench 266 can be divided into two parts, and vaccum bench can be on Y direction or the X-direction in the relevant position mobile.

Carry out the work that the first unit substrate 8 ' is moved to vaccum bench 266 by distributor 270.That is to say that the first unit substrate 8 ' that distributor 270 will form by fracture module 260 is assigned to vaccum bench 266 from large tracts of land initial substrates 1.

Distributor 270 comprises: a pair of second rail portion 271, and it is arranged with certain-length in four-tape formula conveyer 210d both sides; Movable bar 272, it is coupled to second rail portion 271, moving along second rail portion 271; And dispensing head 273, it can move and be coupled to movable bar 272 along movable bar 272, can rotate relatively with respect to movable bar 272, and the first unit substrate 8 ' of cutting work has been finished in absorption.

As mentioned above, when vaccum bench 266 self was rotatable, the first unit substrate 8 ' that is contained on its upper surface can rotate according to the rotation of vaccum bench 266.Yet,, can on vaccum bench 266, change the direction of the first unit substrate 8 ' by dispensing head 273 when vaccum bench 266 fixedly the time.

Pseudo-substrate 3a-3d by the cutting of fracture module 260 and the pseudo-part 3e by pseudo-cutting module 265 cuttings since own wt or the independent unit of removing

fall.Discharge section

250a and 250b are provided, make pseudo-substrate 3a-3d and pseudo-part 3e discharge and can not be scattered position.

In the present embodiment, below fracture module 260 and pseudo-cutting module 265, provide

discharge section

250a and 250b respectively, and discharge pseudo-substrate 3a-3d and pseudo-part 3e in the whereabouts, corresponding position.In order to prevent that pseudo-substrate 3a-3d and pseudo-part 3e are scattered,

discharge section

250a and 250b have funnel shaped, make that inlet is bigger, and its volume distad branch reduces gradually.

For the purpose of efficient,

discharge section

250a and 250b are provided as and can withdraw near fracture module 260 and pseudo-cutting module 265 with from the two.Can easily implement this kind structure by the combination of cylinder or motor and ball screw.

Because the pseudo-substrate 3a-3d and the pseudo-part 3e that are cut off all have constant length and size, so in order to reuse by fragmenting into fritter, can further provide in

discharge section

250a and 250b and pulverize part (crushing portion) 252a and 252b, it is used to pulverize pseudo-substrate 3a-3d and pseudo-part 3e.

Provide cross drive device 275 along active line in vaccum bench 266 back.Substrate transfer part 280 is installed above cross drive device 275.Substrate transfer part 280 is coupled to the 3rd rail portion 281, and moves along the length direction of the 3rd rail portion 281.

Because the final second unit substrate 8 that forms is individual management one by one in reprocessing by cutting from large tracts of land initial substrates 1, so substrate transfer part 280 moves along the 3rd rail portion 281, and the second unit substrate 8 that final pseudo-part 3e has cut moved to cross drive device 275 from vaccum bench 266.

When single cross drive device 275 is provided in the present embodiment, only in the 3rd rail portion 281, provide a substrate transfer part 280 in diced system.Yet, in the present embodiment,, can provide two cross drive devices 275 in order to boost productivity, making provides two substrate transfer parts 280 in the 3rd rail portion 281.Can adjust these numbers according to design.

Because to the cutting work of large tracts of land initial substrates 1 is to face up and carry out under the ventricumbent state of lower panel 1b as CF at the top panel 1a as TFT, the lower panel 8b so be placed on finally that the second unit substrate 8 on the cross drive device 275 is arranged such that top panel 8a as CF faces down as TFT faces up.

Yet for the purpose of process management, the top panel 8a as CF of the second unit substrate 8 that finally produces shown in Figure 1 faces up, and faces down as the lower panel 8b of TFT.For this purpose, further provide inversion device 285, the upside and the downside of its second unit substrate 8 that reverses in the back of cross drive device 275.

Inversion device 285 comprises reversing shaft 286 and a pair of counter-rotating conveyer 287, and described counter-rotating conveyer 287 can center on reversing shaft 286 counter-rotatings and adsorb the upper surface and the lower surface of the second unit substrate 8, makes the second unit substrate 8 to insert wherein.Therefore, the second unit substrate 8 on being placed on cross drive device 275 inserts between the counter-rotating conveyers 287 and the conveyer 287 that then reverses during around 180 ° of reversing shaft 286 counter-rotatings, and the upside of the second unit substrate 8 and downside can easily change.That is to say, as required, the second unit substrate 8 is arranged to that top panel 8a as CF faces up and faces down as the lower panel 8b of TFT.

Discharge conveyer 290 is provided in inversion device 285 back, and it discharges upside and downside has used inversion device 285 counter-rotatings and loaded the superincumbent second unit substrate 8 for reprocessing.Discharging conveyer 290 provides with similar number and on identical axis with cross drive device 275.

Hereinafter will the method that substrate diced system that use disposes in the above described manner cuts into large tracts of land initial substrates 1 a plurality of second unit substrates 8 simply be described referring to Fig. 9, Figure 10 and Figure 13.

At first, when large tracts of land initial substrates 1 being input to the first belt conveyer 210a (S211), large tracts of land initial substrates 1 is advanced towards the second belt conveyer 210b and the 3rd belt conveyer 210c because of moving of the first belt conveyer 210a.Then, by cutting module 220 among the external series gap 212b between the second belt conveyer 210b and the 3rd belt conveyer 210c and the interaction between the second and the 3rd belt conveyer 210b and the 210c, on the top panel 1a of large tracts of land initial substrates 1 and lower panel 1b, form line of cut and following line of cut (S212).

That is to say, when the second belt conveyer 210b and the 3rd belt conveyer 210c move with respect to fixing last cutter 233 and following cutter 243, execution on Y direction to each line of cut formation work among the top panel 1a of large tracts of land initial substrates 1 and the lower panel 1b.When under the fixing state of the second belt conveyer 210b and the 3rd belt conveyer 210c, last cutter 233 and following cutter 243 on cross tube 231 and the sheer pole 241 on X-direction when mobile, the line of cut formation work of execution X-direction.With the method, on the top panel 1a of large tracts of land initial substrates 1 and lower panel 1b, form line of cut and following line of cut respectively.The described line of cut of going up is formed on the same axis with following line of cut.

When forming line of cut on large tracts of land initial substrates 1, large tracts of land initial substrates 1 moves towards fracture module 260 along four-tape formula conveyer 210d.When large tracts of land initial substrates 1 arrived fracture module 260, the removable heating/cooling segment 262 that moves along first rail portion 261 cut large tracts of land initial substrates 1 (S213) with the method for using the removable heating/cooling segment 262 heating and cooling large tracts of land initial substrates 1 that move along first rail portion 261 with the thermal stress of friable material.Then, along line of cut cutting large tracts of land initial substrates 1, thereby form a plurality of first unit substrates 8 '.Pseudo-substrate 3a-3d discharges by discharge section 250a.

Next, with the fixed position the first unit substrate 8 ' is assigned to vaccum bench 266 one by one by driving distributor 270.When the pseudo-cutting module 265 of operation, cut and remove the pseudo-part 3e (S214) that is formed at the first unit substrate 8 '.That is to say, when back-up roller 268 supports the upper surface of the first unit substrate 8 ', cut pseudo-part 3e by location pseudo-cutter 267 thereunder.The pseudo-part 3e of cutting discharges by discharge section 250b.

Then, the substrate transfer part 280 second unit substrate 8 (that is, shown in Figure 1 the second unit substrate 8) that will have through the pseudo-part 3e of cutting is delivered to cross drive device 275 one by one.The second unit substrate 8 that is placed on the cross drive device 275 inserts between the counter-rotating conveyer 287.Counter-rotating conveyer 287 is around 180 ° of reversing shaft 286 counter-rotatings, makes the upper surface of the second unit substrate 8 and the position change of lower surface (S215).Upper surface and lower surface are discharged for reprocessing (S216) under the state that is loaded on the discharge conveyer 290 through the final second unit substrate 8 of inversion device 285 counter-rotatings.

According to present embodiment, can prevent that the liner part P that the IC driver will be installed in the second unit substrate 8 is damaged.In addition, owing to can make the cutting work of large tracts of land initial substrates 1 is carried out with online form, institute and can further improve productivity ratio so that the production time can reduce.

Figure 14 is the perspective view according to the substrate cutting equipment of third embodiment of the invention.Figure 15 is the plane graph of the substrate cutting equipment of Figure 14.Figure 16 illustrates the operation in the first cutting module zone.Figure 17 illustrates the operation in the second cutting module zone.Figure 18 is the flow chart that is used to explain according to the substrate cutting method of third embodiment of the invention.

,, comprise to Figure 18 referring to Figure 14 according to the substrate cutting equipment of present embodiment mainly referring to Figure 14 and Figure 15: a plurality of belt conveyer 310a-310g, it forms the active line of large tracts of land initial substrates 1 being carried out cutting work; And first cutting module 320, transmitting portions 340 and second cutting module 350, it is all arranged successively along belt conveyer 310a-310g.

In addition, the substrate cutting equipment further comprises:

discharge section

370a and 370b, and it is positioned at first cutting module 320 and second cutting module, 350 belows; And distributor 380, cross drive device 384, inversion device 385 and discharge conveyer 390, it all is provided at the back of second cutting module 350.

In above structure, carry out following a series of activities: the large tracts of land initial substrates 1 that will be input to Fig. 3 of active line cuts into the intermediate substrate 5 of Fig. 3 by first cutting module 320, cut into the unit substrate 8 of Fig. 1 by second cutting module 350, and be discharged to discharge conveyer 390.

Therefore, since can set up large tracts of land initial substrates 1 at Wiring technology, so can reduce the production time and can further improve productivity ratio.Exactly, according to the substrate diced system of present embodiment, when the liner part P that Fig. 1 of IC driver will be installed is damaged, large tracts of land initial substrates 1 can be cut into several in the unit's of preventing substrate 8 to dozens of unit's substrate 8.

Large tracts of land initial substrates 1 and intermediate substrate 5, the unit substrate 8 of Fig. 1 and the moving direction of cut direction or belt conveyer 310a-310g of Fig. 3 are at first described.

The large tracts of land initial substrates 1 of Fig. 3 is the parent that is used for forming the unit substrate 8 of Fig. 1.Therefore, in the present embodiment, 12 dash areas in the large tracts of land initial substrates 1 of Fig. 3 are the unit substrate 8 of indicator diagram 1 one by one.In addition, as mentioned above, the unit substrate 8 that does not cut into one group of four unit arranging under the state of the unit substrate 8 among Fig. 3 as yet on Y direction is called intermediate substrate 5.

Referring to Fig. 3, the sum of unit substrate 8 is 12, and the number of intermediate substrate 5 is three, and other parts indication of not putting on shade is discharged to the pseudo-substrate 3a-3d of discharge section 370a and 370b.For the purpose of reference, further there is the pseudo-part in the end of cutting away with pseudo-substrate 3a-3d, omit its Reference numeral herein for ease of explanation.

Large tracts of land initial substrates 1 and substrate 8 the same top panel 1a and the lower panel 1b that form by two sheet glass that comprise of unit.Be placed on finally that the unit substrate 8 of discharging on the conveyer 390 is arranged such that top panel 8a as CF faces up and face down, as shown in Figure 1, and be discharged from for reprocessing subsequently as the lower panel 8b of TFT.

Yet, before cutting technique,, be entered into the belt conveyer 310a-310g that forms active line large tracts of land initial substrates 1 being inverted under the state opposite with unit substrate 8.That is to say, large tracts of land initial substrates 1 the top panel 1a as TFT face up and under as the ventricumbent state of lower panel 1b of CF the input to carry out a series of cutting work.In addition, with intermediate substrate 5 and large tracts of land initial substrates 1 the same layout.

In the present embodiment, the large tracts of land initial substrates 1 of Fig. 3 cuts into the intermediate substrate 5 of three units by diced system, and cuts into the unit substrate 8 of twelve once more.Herein, about the moving direction of cut direction or belt conveyer 310a-310g, the orientation of belt conveyer 310a-310g is a Y direction, and is X-direction perpendicular to the direction of Y direction.

Structure according to the substrate cutting equipment of present embodiment will be described below successively.At first, belt conveyer 310a-310g forms the cutting active line of large tracts of land initial substrates 1.Because large tracts of land initial substrates 1, intermediate substrate 5 and unit substrate 8 can transmit under situation about not being damaged, so belt conveyer 310a-310g is better than platform.Use linear movement accurately to control moving of belt conveyer 310a-310g.

Aspect the position, belt conveyer 310a-310g is divided into first to the 7th belt conveyer 310a-310g.The first belt conveyer 310a is the part of originally loading large tracts of land initial substrates 1.The second belt conveyer 310b and the 3rd belt conveyer 310c are used to use first cutting module 320 large tracts of land initial substrates 1 to be cut into the part of intermediate substrate 5.Four-tape formula conveyer 310d and the 5th belt conveyer 310e are the parts of arranging and transmit intermediate substrate 5 one by one.The 6th belt conveyer 310f and the 7th belt conveyer 310g are with the part of intermediate substrate 5 unit's of cutting into substrates 8 by the interaction between second cutting module 350 and the 4th and the 5th belt conveyer 310d and the 310e.

Between first to the 7th belt conveyer 310a-310g, form predetermined external series gap.External series gap is used for carrying out cutting work in the relevant position, perhaps promotes

substrate

1,5 and 8 to move.In the present embodiment, form a plurality of external series gaps as shown in Figure 3.The external series gap of location first cutting module 320 between the second belt conveyer 310b and the 3rd belt conveyer 310c is called the first external series gap 312a, and between four-tape formula conveyer 310d and the 5th belt conveyer 310e and the 6th belt conveyer 310f and the 7th belt conveyer 310g between the external series gap of location second cutting module 350 be called the second external series gap 312b.

In the present embodiment, belt conveyer 310a-310g the corresponding position stop or just (+) direction in as shown by arrows Y-axis on drive.Though belt conveyer 310a-310g drives on negative (-) direction of the Y direction opposite with the direction shown in the arrow and interact with first cutting module 320 and second cutting module 350, will be no longer described herein.

First cutting module 320 has and large tracts of land initial substrates 1 is cut into the structure of intermediate substrate 5 and is installed among the first external series gap 312a.First cutting module 320 comprises: first cutting part 321 (please referring to Figure 10), and it is arranged in the first external series gap 312a, and it forms line of cut along X-direction on the upper surface of large tracts of land initial substrates 1 and lower surface; And first breaking portion 323, its be installed in first cutting part, 321 fronts and by heating and cooling large tracts of land initial substrates 1 the line of cut cutting large tracts of land initial substrates 1 on the X-direction to form a plurality of intermediate substrate 5.

First cutting part 321 comprises: cutting part 325 on first, it is provided among the first external series gap 312a, above the second belt conveyer 312b and the 3rd belt conveyer 312c, and in the top panel 1a of large tracts of land initial substrates 1, forming line of cut on the X-direction; And first time cutting part 328, it is provided in first external series gap, below the second belt conveyer 312b and the 3rd belt conveyer 312c, and on the lower panel 1b of large tracts of land initial substrates 1 under forming on the X-direction line of cut.

At first, cutting part 325 comprises on first: first cross tube 326, and it is fixed on the direction perpendicular to the length direction of active line; And cutter 327 on a plurality of first, it is coupled to first cross tube, 326 1 sides.Near the second belt conveyer 310b and the 3rd belt conveyer 310c the cutting part 325 can move on Y direction on first though be positioned at, but first cross tube 326 is fixed on the corresponding position, and only be coupled to first cross tube 326 first on cutter 327 on X-direction, move.

Further provide first upper lines to observe part (not shown) at first cross tube, 326 opposite side places, it observes the last line of cut on the X-direction.Can be by determining the position of cutter 327 on first cross tube 326 on first based on the control of observing the observed image of part by first upper lines.

Cutter 327 comprises on first: holder 327a on first, and it is coupled to first cross tube 326; And cut tool 327b on first, and it is forming line of cut on X-direction on the top panel 1a of large tracts of land initial substrates 1, and described large tracts of land initial substrates 1 moves by being supported by the second belt conveyer 310b and the 3rd belt conveyer 310c.Holder 327a is coupled into and can relatively moves on first cross tube 326 on first.

Next, first time cutting part 328 comprises: first sheer pole 329, and it is fixing on perpendicular to the direction of the length direction of active line; And a plurality of first time cutter 330, it is coupled to first sheer pole, 329 1 sides.Though being positioned near the first time second belt conveyer 310b and the 3rd belt conveyer 310c the cutting part 328 can move on Y direction, but first sheer pole 329 is fixed on the corresponding position, and the first time cutter 330 that only is coupled to first sheer pole 329 moves on X-direction.

Further the opposite side at first sheer pole 329 provides first lower line of observing the following line of cut on the X-direction to observe part (not shown).Can be by determining the position of cutter 330 on first sheer pole 329 first time based on the control of observing the observed image of part by first lower line.

First time cutter 330 comprises: first time holder 330a, and it is coupled to first sheer pole 329; And the first incision tool 330b, its on the lower panel 1b of large tracts of land initial substrates 1 under forming on the X-direction line of cut, described large tracts of land initial substrates 1 moves by being supported by the second belt conveyer 310b and the 3rd belt conveyer 310c.First time holder 330a is coupled into and can relatively moves on first sheer pole 329.

When on the top panel 1a of large tracts of land initial substrates 1 and lower panel 1b, form based on the operation of first cutting part 321 and as shown in figure 14 on the X-direction on when line of cut and line of cut following, described work is in the second belt conveyer 310b and the 3rd belt conveyer 310c execution when being fixed on that cutter 327 and first time cutter 330 move on first on first cross tube 326 and first sheer pole 329 on X-direction.First cross tube 326 and first sheer pole 329 are connected to each other by the first pontes 335.

Need one along the unit of line of cut cutting large tracts of land initial substrates 1 with the intermediate substrate 5 that forms three units.In the present embodiment, first breaking portion 323 serves as described unit.First breaking portion 323 can be positioned first cutting part, 321 back.Yet in the present embodiment, first breaking portion 323 is positioned at first cutting part, 321 fronts.

First breaking portion 323 cuts large tracts of land initial substrates 1 in the following manner: will form on plate 1a and the lower panel 1b in the above by first cutting part 321 on the X-direction on the position heating large tracts of land initial substrates 1 of line of cut and following line of cut, and in case just inject cold air along corresponding line of cut formation line of cut.For the purpose of reference, in order to cut large tracts of land initial substrates 1 along line of cut, cool off the method for described part then rapidly with the part of exerting pressure to cutting line area or add the thermosetting line of cut, use the thermal stress of friable material to cut large tracts of land initial substrates 1.

Therefore, need one to be used for exerting pressure or the unit of heating and cooling large tracts of land initial substrates 1 to large tracts of land initial substrates 1.In the present embodiment, first breaking portion 323 serves as described unit.Though in the present embodiment, first breaking portion 323 uses the thermal stress of friable material to cut large tracts of land initial substrates 1 with the method for heating and cooling large tracts of land initial substrates 1, can use the method for exerting pressure.In the case, compressed air injection part can be installed and substitute first breaking portion 323.

Therefore, can be based on first cutting part of carrying out as shown in Figure 16 321 and the interaction between first breaking portion 323, and the large tracts of land initial substrates 1 that will advance to first cutting module 320 cuts into the intermediate substrate 5 of three units.In this process, can produce the pseudo-part in pseudo-substrate 3a and 3b and end, it can fall and be discharged to discharge section 370a, and is as mentioned below.

The intermediate substrate 5 of three units by the cutting of first cutting module 320 is positioned on the 3rd belt conveyer 310c, and is delivered to the four-tape formula conveyer 310d and the 5th belt conveyer 310e of the 3rd belt conveyer back one by one.Therefore, in the present embodiment, the intermediate substrate 5 that transmitting portions 340 will be positioned at three units on the 3rd belt conveyer 310c is delivered to four-tape formula conveyer 310d and the 5th belt conveyer 310e one by one.

Transmitting portions 340 comprises: a pair of first rail portion 341, it is arranged with certain-length on Y direction at four-tape formula conveyer 310d and the 5th belt conveyer 310e both sides, the separated from one another and transmission intermediate substrate 5 of described four-tape formula conveyer 310d and the 5th belt conveyer 310e; Movable bar 343, two end are coupled to each first rail portion 341 and can move on Y direction; And grasping head (grip head) 345, it is coupled to movable bar 343.

Grasp 345 and be coupled to movable bar 343, and not only can be to movable bar 343 rotations, and can on the length direction of movable bar 343, move.Grasp 345 and grasp the intermediate substrate 5 on the 3rd belt conveyer 310c one by one and change direction, and then intermediate substrate 5 is moved to four-tape formula conveyer 310d and the 5th belt conveyer 310e.

Second cutting module 350 has in order to the structure with intermediate substrate 5 unit's of cutting into substrates 8, and is installed in the second external series gap 312b that is arranged in transmitting portions 340 back.The structure of second cutting module 350 is identical in fact with the structure of first cutting module 320, below will be described.

Second cutting module 350 comprises: second cutting part 351 (please referring to Figure 17), and it is arranged in the second external series gap 312b, forms line of cut along X-direction on the upper surface of intermediate substrate 5 and lower surface; And second breaking portion 353, it is installed in second cutting part, 351 fronts, and by heating and cooling intermediate substrate 5 the line of cut cutting intermediate substrate 5 on the X-direction, to form a plurality of units substrate 8.

Second cutting part 351 comprises: cutting part 355 on second, and it is provided among the second external series gap 312b, above corresponding belt conveyer 312d-312g, and forming line of cut on the X-direction in the top panel (not shown) of intermediate substrate 5; And second time cutting part 358, it is provided among the second external series gap 312b, below corresponding belt conveyer 312d-312g, and goes up line of cut under forming on the X-direction at the lower panel (not shown) of intermediate substrate 5.

At first, cutting part 355 comprises on second: second cross tube 356, and it is fixed on the direction perpendicular to the length direction of active line; And cutter 357 on a plurality of second, it is coupled to second cross tube, 356 1 sides.Near the corresponding belt conveyer 312d-312g the cutting part 355 can move on Y direction on second though be positioned at, but second cross tube 356 is fixed on the corresponding position, and only be coupled to second cross tube 356 second on cutter 357 on X-direction, move.

Further the opposite side of second cross tube 356 provide observe on the X-direction on second upper lines of line of cut observe part (not shown).Can be by determining the position of cutter 357 on second cross tube 356 on second based on the control of observing the observed image of part by second upper lines.

Cutter 357 comprises on second: holder 357a on second, and it is coupled to second cross tube 356; And cut tool 357b on second, and it is forming line of cut on top panel of intermediate substrate 5 on X-direction, and described intermediate substrate 5 moves by being supported by corresponding belt conveyer 312d-312g.Holder 357a is coupled into and can relatively moves on second cross tube 356 on second.

Next, second time cutting part 358 comprises: second sheer pole 359, and it is fixing on perpendicular to the direction of the length direction of active line; And a plurality of second time cutter 360, it is coupled to second sheer pole, 359 1 sides.Though being positioned near second time corresponding belt conveyer 312d-312g the cutting part 358 can move on Y direction, but second sheer pole 359 is fixed on the corresponding position, and the second time cutter 360 that only is coupled to second sheer pole 359 moves on X-direction.

Further the opposite side at second sheer pole 359 provides second lower line of observing the following line of cut on the X-direction to observe part (not shown).Can be by determining the position of cutter 360 on second sheer pole 359 second time based on the control of observing the observed image of part by second lower line.

Second time cutter 360 comprises: second time holder 360a, and it is coupled to second sheer pole 359; And the second incision tool 360b, its on the lower panel of intermediate substrate 5 under forming on the X-direction line of cut, described intermediate substrate 5 supports by corresponding belt conveyer 312d-312g and moves.Second time holder 360a is coupled into and can relatively moves on second sheer pole 359.

When on the top panel of intermediate substrate 5 and lower panel, form based on the operation of second cutting part 351 and as shown in figure 14 X-direction on when line of cut and line of cut following, described work is in corresponding belt conveyer 312d-312g execution when being fixed on that cutter 357 and second time cutter 360 move on second on second cross tube 356 and second sheer pole 359 on X-direction.Second cross tube 356 and second sheer pole 359 are connected to each other by second coupling part 365.

Need one can cut intermediate substrate 5 to form the unit of a plurality of units substrate 8 along line of cut.In the present embodiment, second breaking portion 353 serves as described unit.Second breaking portion 353 can be positioned on second cutting part, 351 back.Yet in the present embodiment, second breaking portion 353 is positioned at second cutting part, 351 fronts.Because the operation of second breaking portion 353 is identical with the operation of above-mentioned first breaking portion 323, so will no longer be described in greater detail herein.

Therefore, can be based on second cutting part of carrying out as shown in Figure 17 351 and the interaction between second breaking portion 353, and will advance to intermediate substrate 5 unit's of cutting into substrates 8 of second cutting module 350.That is to say, in the present embodiment, from the intermediate substrate 5 of single unit, produce four unit substrates 8 altogether.In this process, can produce the pseudo-part in pseudo-substrate 3c and 3d and end, it can fall and be discharged to discharge section 370b, and is as mentioned below.

In first cutting module 320, from large tracts of land initial substrates 1, cut away the pseudo-part in pseudo-substrate 3a and 3b and end, and cut away the pseudo-part in pseudo-substrate 3c and 3d and end in second cutting module 350 from middle substrate 5, the pseudo-part in these pseudo-substrates and end falls owing to own wt or the independent unit of removing.The pseudo-part in pseudo-substrate 3a-3d and end provides

discharge section

370a and 370b so that can be discharged a position and can not be scattered.

In the present embodiment, below first cutting module 320 and second cutting module 350, provide

discharge section

370a and 370b respectively, with the pseudo-part of pseudo-substrate 3a-3d and end of discharging in the whereabouts, corresponding position.Partly be scattered in order to prevent that pseudo-substrate 3a-3d and end are pseudo-,

discharge section

370a and 370b have funnel shaped, make that inlet is bigger, and its volume distad branch reduces gradually.

For the purpose of efficient,

discharge section

370a and 370b are provided as and can withdraw near first cutting module 320 and second cutting module 350 with from the two.Can easily implement this kind structure by the combination of cylinder or motor and ball screw.

Because the pseudo-part in pseudo-substrate 3a-3d that is cut off and end all has constant length and size, so in order to reuse by fragmenting into fritter, can further provide in

discharge section

370a and 370b and pulverize

part

372a and 372b, it is used to pulverize the pseudo-part of pseudo-substrate 3a-3d and end.

Provide cross drive device 384 at the 6th belt conveyer 310f and the 7th belt conveyer 310g back, described cross drive device 384 forms identical line with the 6th belt conveyer 310f and the 7th belt conveyer 310g.Distributor 380 is provided around cross drive device 384.

The distributor 380 unit substrate 8 of cutting fully is assigned to cross drive device 384 one by one.That is to say that the final unit substrate of making 8 is to manage one by one individually in reprocessing, the unit substrate 8 that distributor 380 will be placed on the 6th belt conveyer 310f and the 7th belt conveyer 310g is delivered to cross drive device 384.

Distributor 380 comprises: a pair of second rail portion 381, and it is arranged with certain-length in cross drive device 384 both sides; And dispensing head 382, it can move along second rail portion 381, and is coupled to second rail portion 381, can rotate relatively with respect to second rail portion 381, and the unit substrate 8 of cutting work has been finished in absorption.

If the cross drive device 384 of single unit is provided in the diced system according to present embodiment, as long as just then provide the dispensing head 382 of a unit of distributor 380 enough.Yet, in the present embodiment, owing to cross drive device 384, so the dispensing head 382 of two units is provided in order to provide productivity ratio that two units are provided.Can change these numbers according to design.

Because large tracts of land initial substrates 1 is to face up and cut into the intermediate substrate 5 of three units under the ventricumbent initial condition of lower panel 1b as CF at the top panel 1a as TFT, and the then unit's of forming substrate 8, so be placed on finally that unit substrate 8 on the cross drive device 384 is arranged such that top panel 8a as CF faces down and face up as the lower panel 8b of TFT.

Yet in order to carry out process management, the top panel 8a as CF of the unit substrate 8 that finally produces shown in Figure 1 faces up, and faces down as the lower panel 8b of TFT.For this purpose, further provide inversion device 385, the upside and the downside of its counter-rotating unit substrate 8 in the back of cross drive device 384.

Inversion device 385 comprises reversing shaft 386 and a pair of counter-rotating conveyer 387, and described counter-rotating conveyer 387 can be around the upper surface and the lower surface of reversing shaft 386 counter-rotatings and absorption unit substrate 8, and the unit's of making substrate 8 can insert wherein.Therefore, the second unit substrate 8 on being placed on cross drive device 384 inserts between the counter-rotating conveyers 387 and the conveyer 387 that then reverses during around 180 ° of reversing shaft 386 counter-rotatings, and the upside and the downside of unit substrate 8 easily change.That is to say, as required, unit substrate 8 is arranged to that top panel 8a as CF faces up and faces down as the lower panel 8b of TFT.

Discharge conveyer 390 is provided in inversion device 385 back, and it has used upside and downside inversion device 385 counter-rotatings and has loaded 8 discharges of superincumbent unit substrate for reprocessing.Discharging conveyer 390 and cross drive device 384 provides on same axis with similar number.

Hereinafter will simply describe the substrate diced system that use disposes in the above described manner referring to Figure 14, Figure 15 and Figure 18 cuts into large tracts of land initial substrates 1 intermediate substrate 5 of three units and then cuts into the method for the unit substrate 8 of twelve altogether.

At first, when large tracts of land initial substrates 1 being input to the first belt conveyer 310a (S311), large tracts of land initial substrates 1 is delivered to the second belt conveyer 310b and the 3rd belt conveyer 310c by moving of the first belt conveyer 310a.Then, by first cutting module 320 among the external series gap 312a between the second and the

3rd belt conveyer

310b and 310c and the interaction between the second and the 3rd belt conveyer 310b and the 310c, form on the top panel 1a of large tracts of land initial substrates 1 and the lower panel 1b on the X-direction on line of cut and following line of cut to be used for cutting (S312).

That is to say, can be based on first cutting part 321 of carrying out operation as shown in Figure 16 and the interaction between first breaking portion 323, and the large tracts of land initial substrates 1 that will advance to first cutting module 320 cuts into the intermediate substrate 5 of three units.In this process, can produce the pseudo-part in pseudo-substrate 3a and 3b and end, it can fall and be discharged to discharge section 370a.

Next, be placed on that in the intermediate substrate 5 of three units on the 3rd belt conveyer 310c each grasps by transmitting portions 340 and half-twist to be delivered to four-tape formula conveyer 310d and the 5th belt conveyer 310e (S313).The length direction that is delivered to the intermediate substrate 5 of four-tape formula conveyer 310d and the 5th belt conveyer 310e is a Y direction.

When middle substrate 5 is passed to four-tape formula conveyer 310d and the 5th belt conveyer 310e and when four-tape formula conveyer 310d and the 5th belt conveyer 310e advance to second cutting module 350, by the interaction between second cutting module 350 and the corresponding belt conveyer 310d-310g form on the top panel of intermediate substrate 5 and the lower panel on the X-direction on line of cut and following line of cut to be used for cutting (S314).

That is to say, can be based on second cutting part 351 of carrying out operation as shown in Figure 17 and the interaction between second breaking portion 353, and the intermediate substrate 5 that will advance to second cutting module 350 cuts into a plurality of units substrate 8.In this process, can produce the pseudo-part in pseudo-substrate 3c and 3d and end, it can fall and be discharged to discharge section 370b.

Next, will be delivered to cross drive device 384 by 350 cuttings of second cutting module and the per unit substrate 8 that is placed on the 6th belt conveyer 310f and the 7th belt conveyer 310g.Then, the unit substrate 8 that is placed on the cross drive device 384 is inserted between the counter-rotating conveyers 387, and counter-rotating conveyer 387 is around reversing shaft 386 Rotate 180s °, makes the upper surface of per unit substrate 8 and the position change of lower surface (S315).

Be loaded under the state of discharging on the conveyer 390 through the final unit substrate 8 of inversion device 385 counter-rotatings at upper surface and lower surface, it is discharged for reprocessing (S316).

According to present embodiment, the liner part P that the IC driver will be installed in can the unit's of preventing substrate 8 is damaged.In addition, owing to can make the cutting work of large tracts of land initial substrates 1 is carried out with online form, institute and can further improve productivity ratio so that the production time can reduce.

Figure 19 is the perspective view according to the substrate cutting equipment of fourth embodiment of the invention.Figure 20 is the plane graph of the substrate cutting equipment of Figure 19.Figure 21 illustrates the operation in the first cutting module zone.Figure 22 illustrates the operation in the second cutting module zone.Figure 23 is the flow chart that is used to explain according to the substrate cutting method of fourth embodiment of the invention.

Arrive Figure 23 referring to Figure 19, mainly referring to Figure 19 and Figure 20, substrate cutting equipment according to present embodiment comprises: a plurality of belt conveyer 410a-410g, and it forms first and second active lines intersected with each other, and wherein carries out the cutting work to large tracts of land initial substrates 1; First cutting module 420, it is provided at the first active line place, and large tracts of land initial substrates 1 is cut into the intermediate substrate 5 of three units; Transmitting portions 440, it is delivered to second active line with intermediate substrate 5; And second cutting module 450, it is provided at the second active line place, and intermediate substrate 5 is cut into a plurality of units substrate 8.

In addition, the substrate cutting equipment further comprises:

discharge section

470a and 470b, and it is positioned at first cutting module 420 and second cutting module, 450 belows; And distributor 480, cross drive device 484, inversion device 485 and discharge conveyer 490, it all is provided at second cutting module, 450 back.

In said structure, carry out following a series of activities: the large tracts of land initial substrates 1 that will be input to Fig. 3 of first active line cuts into the intermediate substrate 5 of Fig. 3 by first cutting module 420, cut into the unit substrate 8 of Fig. 1 by second cutting module 450, and be discharged to discharge conveyer 490.

Large tracts of land initial substrates 1 and intermediate substrate 5, the unit substrate 8 of Fig. 1 and the moving direction of cut direction or belt conveyer 410a-410g of Fig. 3 are at first described.

The large tracts of land initial substrates 1 of Fig. 3 is the parent that is used for forming the unit substrate 8 of Fig. 1.In the present embodiment, the unit substrate 8 of indicator diagram 1 one by one of 12 dash areas in the large tracts of land initial substrates 1 of Fig. 3.In addition, as mentioned above, the unit substrate 8 that does not cut into one group of four unit arranging under the state of the unit substrate 8 among Fig. 3 as yet on Y direction is called intermediate substrate 5.

Referring to Fig. 3, the sum of unit substrate 8 is 12, and the number of intermediate substrate 5 is three, and other parts indication of not putting on shade is discharged to the pseudo-substrate 3a-3d of discharge section 470a and 470b.For the purpose of reference, further there is the pseudo-part in the end of cutting away with pseudo-substrate 3a-3d, omit its Reference numeral herein for ease of explanation.

Large tracts of land initial substrates 1 and substrate 8 the same top panel 1a and the lower panel 1b that form by two sheet glass that comprise of unit.Be placed on finally that the unit substrate 8 of discharging on the conveyer 490 is arranged such that top panel 8a as CF faces up and face down, as shown in Figure 1, and then be discharged from for reprocessing as the lower panel 8b of TFT.

Yet, before cutting technique,, be entered into the belt conveyer 410a-410g that forms first and second active lines large tracts of land initial substrates 1 being inverted under the state opposite with unit substrate 8.That is to say, large tracts of land initial substrates 1 the top panel 1a as TFT face up and under as the ventricumbent state of lower panel 1b of CF the input to carry out a series of cutting work.In addition, with intermediate substrate 5 and large tracts of land initial substrates 1 the same layout.

In the present embodiment, the large tracts of land initial substrates 1 of Fig. 3 cuts into the intermediate substrate 5 of three units by diced system, and cuts into the unit substrate 8 of twelve once more.Herein, about the moving direction of cut direction or belt conveyer 410a-410g, the orientation of first to the 3rd belt conveyer 410a-410c is the first line Y direction, and is the first line X-direction perpendicular to the direction of Y direction.The direction that four-tape formula conveyer 410d and the 6th belt conveyer 410f and the 5th belt conveyer 410e and the 7th belt conveyer 410g arrange is the second line Y direction, and is the second line X-direction perpendicular to the direction of Y direction.

Structure according to the substrate cutting equipment of present embodiment will be described below successively.At first, belt conveyer 410a-410g forms first and second active lines of work that large tracts of land initial substrates 1 is cut.Because large tracts of land initial substrates 1, intermediate substrate 5 and unit substrate 8 can transmit under situation about not being damaged, so belt conveyer 410a-410g is better than platform.Use linear movement accurately to control moving of belt conveyer 410a-410g.

As mentioned above, belt conveyer 410a-410g has first active line and second active line intersected with each other with respect to the intersection region.First to the 3rd belt conveyer 410a-410c that forms first active line relates to large tracts of land initial substrates 1 is cut into intermediate substrate 5.The the 4th to the 7th belt conveyer 410d-410g that forms second active line relates to intermediate substrate 5 unit's of cutting into substrates 8.

Specifically, the first belt conveyer 410a is the part of originally loading large tracts of land initial substrates 1, and the second belt conveyer 410b and the 3rd belt conveyer 410c are the parts that is used for by first cutting module 420 large tracts of land initial substrates 1 being cut into intermediate substrate 5.Four-tape formula conveyer 410d and the 5th belt conveyer 410e are the parts of arranging and transmit each intermediate substrate 5 in the above.The 6th belt conveyer 410f and the 7th belt conveyer 410g be in order to by the interaction between the 4th and the 5th belt conveyer 410d and the 410e and second cutting module 450 with the part of intermediate substrate 5 unit's of cutting into substrates 8.

Between first to the 7th belt conveyer 410a-410g, form predetermined external series gap.External series gap is to be used for carrying out cutting work in the corresponding position, perhaps promotes

substrate

1,5 and 8 to move.In the present embodiment, form a plurality of external series gaps as shown in figure 19.The external series gap of location first cutting module 420 between the second belt conveyer 410b and the 3rd belt conveyer 410c is called the first external series gap 412a, and between four-tape formula conveyer 410d and the 5th belt conveyer 410e and the 6th belt conveyer 410f and the 7th belt conveyer 410g between the external series gap of location second cutting module 450 be called the second external series gap 412b.

In the present embodiment, first to the 3rd belt conveyer 410a-410c that forms first active line stops in the corresponding position or drives on the first line Y-axis.The the 4th to the 7th belt conveyer 410d-410g that forms second active line stops in the corresponding position or drives on the second line Y-axis.

First cutting module 420 has and large tracts of land initial substrates 1 is cut into the structure of intermediate substrate 5 and is installed among the first external series gap 412a.First cutting module 420 comprises: first cutting part 421 (please referring to Figure 21), and it is arranged in the first external series gap 412a, forms line of cut along the first line X-direction on the upper surface of large tracts of land initial substrates 1 and lower surface; And first breaking portion 423, it is installed in first cutting part, 421 fronts and the line of cut on the first line X-direction cuts into intermediate substrate 5 with large tracts of land initial substrates 1 by heating and cooling large tracts of land initial substrates 1.

First cutting part 421 comprises: cutting part 425 on first, it is provided among the first external series gap 412a, above the second belt conveyer 412b and the 3rd belt conveyer 412c, and in the top panel 1a of large tracts of land initial substrates 1, on the first line X-direction, form line of cut; And first time cutting part 428, it is provided among the first external series gap 412a, below the second belt conveyer 412b and the 3rd belt conveyer 412c, and in the lower panel 1b of large tracts of land initial substrates 1 under forming on the X-direction line of cut.

At first, cutting part 425 comprises on first: first cross tube 426, and it is fixing on the first line X-direction; And cutter 427 on a plurality of first, it is coupled to first cross tube, 426 1 sides.Near the second belt conveyer 410b and the 3rd belt conveyer 410c the cutting part 425 can move on the first line Y direction on first though be positioned at, but first cross tube 426 is fixed on the corresponding position, and only be coupled to first cross tube 426 first on cutter 427 on X-direction, move.

Further provide first upper lines to observe part (not shown) at first cross tube, 426 opposite sides, it observes the last line of cut on the first line X-direction.Can be by determining the position of cutter 427 on first cross tube 426 on first based on the control of observing the observed image of part by first upper lines.

Cutter 427 comprises on first: holder 427a on first, and it is coupled to first cross tube 426; And cut tool 427b on first, and it is forming line of cut on top panel 1a of large tracts of land initial substrates 1 on the first line X-direction, and described large tracts of land initial substrates 1 moves by being supported by the second belt conveyer 410b and the 3rd belt conveyer 410c.Holder 427a is coupled into and can relatively moves on first cross tube 426 on first.

Next, first time cutting part 428 comprises: first sheer pole 429, and it is positioned at first cross tube, 426 belows, and is fixed in the first line X-direction; And a plurality of first time cutter 430, it is coupled to first sheer pole, 429 1 sides.Though being positioned near the first time second belt conveyer 410b and the 3rd belt conveyer 410c the cutting part 428 can move on the first line X-direction, but first sheer pole 429 is fixed on the corresponding position, and the first time cutter 430 that only is coupled to first sheer pole 429 moves on X-direction.

Further the opposite side at first sheer pole 429 provides first lower line of observing the following line of cut on the first line X-direction to observe part (not shown).Can be by determining the position of cutter 430 on first sheer pole 429 first time based on the control of observing the observed image of part by first lower line.

First time cutter 430 comprises: first time holder 430a, and it is coupled to first sheer pole 429; And the first incision tool 430b, its on the lower panel 1b of large tracts of land initial substrates 1 under forming on the first line X-direction line of cut, described large tracts of land initial substrates 1 moves by being supported by the second belt conveyer 410b and the 3rd belt conveyer 410c.First time holder 430a is coupled into and can relatively moves on first sheer pole 429.

When on the top panel 1a of large tracts of land initial substrates 1 and lower panel 1b, form based on the operation of first cutting part 421 and as shown in Figure 3 on the first line X-direction on when line of cut and line of cut following, described work is in the second belt conveyer 410b and the 3rd belt conveyer 410c execution when being fixed on that cutter 427 and first time cutter 430 move on first on first cross tube 426 and first sheer pole 429.First cross tube 426 and first sheer pole 429 are connected to each other by the first pontes 435.

Need one can cut the unit of large tracts of land initial substrates 1 along line of cut with the intermediate substrate 5 that forms three units.In the present embodiment, first breaking portion 423 serves as described unit.First breaking portion 423 can be positioned first cutting part, 421 back.Yet in the present embodiment, first breaking portion 423 is positioned at first cutting part, 421 fronts.

First breaking portion 423 cuts large tracts of land initial substrates 1 in the following manner: will form on plate 1a and the lower panel 1b in the above by first cutting part 421 on the first line X-direction on the position heating large tracts of land initial substrates 1 of line of cut and following line of cut, and in case just inject cold air along corresponding line of cut formation line of cut.For the purpose of reference, in order to cut large tracts of land initial substrates 1 along line of cut, to exert pressure to cutting line area or to add the part of thermosetting line of cut and the then rapid method of cooling off described part, use the thermal stress of friable material to cut large tracts of land initial substrates 1.

Therefore, need one to be used for exerting pressure or the unit of the described large tracts of land initial substrates 1 of heating and cooling to large tracts of land initial substrates 1.In the present embodiment, first breaking portion 423 serves as described unit.Though in the present embodiment, first breaking portion 423 uses the thermal stress of friable material to cut large tracts of land initial substrates 1 with the method for heating and cooling large tracts of land initial substrates 1, can use the method for exerting pressure.In the case, compressed air injection part can be installed and replace first breaking portion 423.

Therefore, can be based on first cutting part of carrying out as shown in Figure 21 421 and the interaction between first breaking portion 423, and the large tracts of land initial substrates 1 that will advance to first cutting module 420 cuts into the intermediate substrate 5 of three units.In this process, can produce the pseudo-part in pseudo-substrate 3a and 3b and end, it can fall and be discharged to discharge section 470a, and is as mentioned below.

The intermediate substrate 5 of three units by the cutting of first cutting module 420 is positioned on the 3rd belt conveyer 410c, and is delivered to the four-tape formula conveyer 410d and the 5th belt conveyer 410e of the 3rd belt conveyer back one by one.Therefore, in the present embodiment, the intermediate substrate 5 that transmitting portions 440 will be positioned at three units on the 3rd belt conveyer 410c is delivered to four-tape formula conveyer 410d and the 5th belt conveyer 410e one by one.

Transmitting portions 440 comprises: a pair of first rail portion 441, and it is arranged in the belt conveyer 410a-410c both sides that form first active line that passes the intersection region; Movable bar 443, two end are coupled to each first rail portion 441 and can move along first rail portion 441; And grasp 445, and it is coupled to movable bar 443, and it can move on the length direction of movable bar 443, and grasps intermediate substrate 5 one by one to be delivered to four-tape formula conveyer 410d and the 5th belt conveyer 410e.

Grasp 445 along movable bar 443 linear moving, and grasp the intermediate substrate 5 of three units on the 3rd belt conveyer 410c one by one, intermediate substrate 5 is moved to four-tape formula conveyer 410d and the 5th belt conveyer 410e.Therefore, carry out linear movement by transmitting portions 440 from the intermediate substrate 5 that the 3rd belt conveyer 410c is delivered to four-tape formula conveyer 410d and the 5th belt conveyer 410e.When middle substrate 5 is carried out linear movement and is passed to the relevant position, owing to need not to provide mechanism in order to rotation intermediate substrate 5, so the structure of equipment is simplified, and can farthest prevent to produce the error that may produce during the transmission intermediate substrate 5.

Second cutting module 450 has in order to the structure with intermediate substrate 5 unit's of cutting into substrates 8, and is installed in the second external series gap 412b that is arranged in the second active line side.The structure of second cutting module 450 is identical in fact with the structure of first cutting module 420, below will be described.

Second cutting module 450 comprises: second cutting part 451 (please referring to Figure 22), and it is arranged in the second external series gap 412b, forms line of cut along the second line X-direction on the upper surface of intermediate substrate 5 and lower surface; And second breaking portion 453, it is installed in second cutting part, 451 fronts, and by heating and cooling intermediate substrate 5 the line of cut cutting intermediate substrate 5 on the second line X-direction, to form a plurality of units substrate 8.

Second cutting part 451 comprises: cutting part 455 on second, it is provided among the second external series gap 412b, above corresponding belt conveyer 412d-412g, and in the top panel (not shown) of intermediate substrate 5, on the second line X-direction, form line of cut; And second time cutting part 458, it is provided among the second external series gap 412b, below corresponding belt conveyer 412d-412g, and in the lower panel (not shown) of intermediate substrate 5 under forming on the second line X-direction line of cut.

At first, cutting part 455 comprises on second: second cross tube 456, and it is fixed on the first line X-direction; And cutter 457 on a plurality of second, it is coupled to second cross tube, 456 1 sides.Though near the corresponding belt conveyer 412d-412g that are positioned at the cutting part on second 455 can move on the second line Y direction, second cross tube 456 is fixed on the corresponding position, and only be coupled to second cross tube 456 second on cutter 457 move.

Further the opposite side of second cross tube 456 provide observe on the second line X-direction on second upper lines of line of cut observe part (not shown).Can be by determining the position of cutter 457 on second cross tube 456 on second based on the control of observing the observed image of part by second upper lines.

Cutter 457 comprises on second: holder 457a on second, and it is coupled to second cross tube 456; And cut tool 457b on second, and it is forming line of cut on top panel of intermediate substrate 5 on the second line X-direction, and described intermediate substrate 5 moves by being supported by corresponding belt conveyer 412d-412g.Holder 457a is coupled into and can relatively moves on second cross tube 456 on second.

Next, second time cutting part 458 comprises: second sheer pole 459, and it is positioned at second cross tube, 429 belows, and is fixed on the second line X-direction; And a plurality of second time cutter 460, it is coupled to second sheer pole, 459 1 sides.Though being positioned near second time corresponding belt conveyer 412d-412g the cutting part 458 can move on the second line Y direction, but second sheer pole 459 is fixed on the corresponding position, and the second time cutter 460 that only is coupled to second sheer pole 459 moves on X-direction.

Further the opposite side at second sheer pole 459 provides second lower line of observing the following line of cut on the second line X-direction to observe part (not shown).Can be by determining the position of cutter 460 on second sheer pole 459 second time based on the control of observing the observed image of part by second lower line.

Second time cutter 460 comprises: second time holder 460a, and it is coupled to second sheer pole 459; And the second incision tool 460b, its on the lower panel of intermediate substrate 5 under forming on the second line X-direction line of cut, described intermediate substrate 5 supports by corresponding belt conveyer 412d-412g and moves.Second time holder 460a is coupled into and can relatively moves on second sheer pole 459.

When on the top panel of intermediate substrate 5 and lower panel, form based on the operation of second cutting part 451 and as shown in Figure 3 on the second line X-direction on when line of cut and line of cut following, described work is in corresponding belt conveyer 412d-412g execution when being fixed on that cutter 457 and second time cutter 460 move on second on second cross tube 456 and second sheer pole 459.Second cross tube 456 and second sheer pole 459 are connected to each other by second coupling part 465.

Need one can cut intermediate substrate 5 to form the unit of a plurality of units substrate 8 along line of cut.In the present embodiment, second breaking portion 453 serves as described unit.Second breaking portion 453 can be positioned second cutting part, 451 back.Yet in the present embodiment, second breaking portion 453 is positioned at second cutting part, 451 fronts.Because the operation of second breaking portion 453 is identical with the operation of above-mentioned first breaking portion 423, so will no longer be described in greater detail herein.

Therefore, can be based on second cutting part of carrying out as shown in Figure 22 451 and the interaction between second breaking portion 453, and will advance to intermediate substrate 5 unit's of cutting into substrates 8 of second cutting module 450.That is to say, in the present embodiment, from the intermediate substrate 5 of single unit, produce four unit substrates 8 altogether.In this process, can produce the pseudo-part in pseudo-substrate 3c and 3d and end, it can fall and be discharged to discharge section 470b, and is as mentioned below.

In first cutting module 420, from large tracts of land initial substrates 1, cut away the pseudo-part in pseudo-substrate 3a and 3b and end, and cut away the pseudo-part in pseudo-substrate 3c and 3d and end in second cutting module 450 from middle substrate 5, the pseudo-part in these pseudo-substrates and end falls owing to own wt or the independent unit of removing.The pseudo-part in pseudo-substrate 3a-3d and end provides

discharge section

470a and 470b so that can be discharged a position and can not be scattered.

In the present embodiment, below first cutting module 420 and second cutting module 450, provide

discharge section

470a and 470b respectively, with the pseudo-part of pseudo-substrate 3a-3d and end of discharging in the whereabouts, corresponding position.Partly be scattered in order to prevent that pseudo-substrate 3a-3d and end are pseudo-,

discharge section

470a and 470b have funnel shaped, make that inlet is bigger, and its volume distad branch reduces gradually.

For the purpose of efficient,

discharge section

470a and 470b are provided as and can withdraw near first cutting module 420 and second cutting module 450 with from the two.Can easily implement this kind structure by the combination of cylinder or motor and ball screw.

discharge section

470a and 470b and pulverize

part

472a and 472b, it is used to pulverize the pseudo-part of pseudo-substrate 3a-3d and end.

Provide cross drive device 484 at the 6th belt conveyer 410f and the 7th belt conveyer 410g back, described cross drive device 484 forms identical line with the 6th belt conveyer 410f and the 7th belt conveyer 410g.Distributor 480 is provided around cross drive device 484.

The distributor 480 unit substrate 8 of cutting fully is assigned to cross drive device 484 one by one.That is to say that the final unit substrate of making 8 is to manage one by one individually in reprocessing, the unit substrate 8 that distributor 480 will be placed on the 6th belt conveyer 410f and the 7th belt conveyer 410g is delivered to cross drive device 484.

Distributor 480 comprises: a pair of second rail portion 481, and it is arranged along second active line in cross drive device 484 both sides; And dispensing head 482, it can move along second rail portion 481, and is coupled to second rail portion 481, can rotate relatively with respect to second rail portion 481, and the unit substrate 8 of cutting work has been finished in absorption.

If the cross drive device 484 of single unit is provided in the diced system according to present embodiment, as long as just then provide the dispensing head 482 of a unit of distributor 480 enough.Yet, in the present embodiment, owing to the cross drive device 484 that two units are provided in order to boost productivity, so the dispensing head 482 of two units is provided.Can change these numbers according to design.

Because large tracts of land initial substrates 1 is to face up and cut into the intermediate substrate 5 of three units and the then unit's of forming substrate 8 under the ventricumbent initial condition of lower panel 1b as CF at the top panel 1a as TFT, so be placed on finally that unit substrate 8 on the cross drive device 484 is arranged such that top panel 8a as CF faces down and face up as the lower panel 8b of TFT.

Yet in order to carry out process management, the top panel 8a as CF of the unit substrate 8 that finally produces shown in Figure 1 faces up, and faces down as the lower panel 8b of TFT.For this purpose, further provide inversion device 485, the upside and the downside of its counter-rotating unit substrate 8 in the back of cross drive device 484.

Inversion device 485 comprises reversing shaft 486 and a pair of counter-rotating conveyer 487, and described counter-rotating conveyer 487 can be around the upper surface and the lower surface of reversing shaft 486 counter-rotatings and absorption unit substrate 8, and the unit's of making substrate 8 can insert wherein.Therefore, the second unit substrate 8 on being placed on cross drive device 484 inserts between the counter-rotating conveyers 487 and the conveyer 487 that then reverses during around 180 ° of reversing shaft 486 counter-rotatings, and the upside and the downside of unit substrate 8 easily change.That is to say, as required, unit substrate 8 is arranged to that top panel 8a as CF faces up and faces down as the lower panel 8b of TFT.

Discharge conveyer 490 is provided in inversion device 485 back, and it has used upside and downside inversion device 485 counter-rotatings and has loaded 8 discharges of superincumbent unit substrate for reprocessing.Discharging conveyer 490 provides with similar number and on same axis with cross drive device 484.

Hereinafter will simply describe the substrate diced system that use disposes in the above described manner referring to Figure 19, Figure 20 and Figure 23 cuts into large tracts of land initial substrates 1 intermediate substrate 5 of three units and then cuts into the method for the unit substrate 8 of twelve altogether.

At first, when large tracts of land initial substrates 1 being input to the first belt conveyer 410a (S411), large tracts of land initial substrates 1 is delivered to the second belt conveyer 410b and the 3rd belt conveyer 410c by moving of the first belt conveyer 410a.Then, by first cutting module 420 among the external series gap 412a between the second belt conveyer 410b and the 3rd belt conveyer 410c, form on the top panel 1a of large tracts of land initial substrates 1 and the lower panel 1b on the first line X-direction on line of cut and following line of cut to be used for cutting (S412).

That is to say, can be based on first cutting part 421 of carrying out operation as shown in Figure 21 and the interaction between first breaking portion 423, and the large tracts of land initial substrates 1 that will advance to first cutting module 420 cuts into the intermediate substrate 5 of three units.In this process, can produce the pseudo-part in pseudo-substrate 3a and 3b and end, it can fall and be discharged to discharge section 470a.

Next, each that is placed in the intermediate substrate 5 of three units on the 3rd belt conveyer 410c is grasped and is delivered to four-tape formula conveyer 410d and the 5th belt conveyer 410e (S413) by transmitting portions 440.The length direction that is delivered to the intermediate substrate 5 of four-tape formula conveyer 410d and the 5th belt conveyer 410e is the second line Y direction.

When middle substrate 5 is passed to four-tape formula conveyer 410d and the 5th belt conveyer 410e and when four-tape formula conveyer 410d and the 5th belt conveyer 410e advance to second cutting module 450, form last line of cut on the second line X-direction and following line of cut on top panel that operates in intermediate substrate 5 by second cutting module 450 and the lower panel to be used for cutting (S414).

That is to say, can be based on second cutting part 451 of carrying out operation as shown in Figure 17 and the interaction between second breaking portion 453, and the intermediate substrate 5 that will advance to second cutting module 450 cuts into a plurality of units substrate 8.In this process, can produce the pseudo-part in pseudo-substrate 4c and 4d and end, it can fall and be discharged to discharge section 470b.

Next, will be delivered to cross drive device 484 by 450 cuttings of second cutting module and the per unit substrate 8 that is placed on the 6th belt conveyer 410f and the 7th belt conveyer 410g.Then, the unit substrate 8 that is placed on the cross drive device 484 is inserted between the counter-rotating conveyers 487, and counter-rotating conveyer 487 is around reversing shaft 486 Rotate 180s °, makes the upper surface of per unit substrate 8 and the position change of lower surface (S415).

The position of upper surface and lower surface can be discharged for reprocessing (S416) under the state that is loaded into discharge conveyer 490 through the final unit substrate 8 of inversion device 485 counter-rotatings.

Therefore, be damaged, can be large tracts of land initial substrates 1 and be based upon Wiring technology,, and can further improve productivity ratio so the production time can reduce because the liner part P of IC driver will be installed in can the unit's of preventing substrate 8.

Figure 24 explanation is according to the structure of the substrate diced system of fifth embodiment of the invention.Figure 25 illustrates the side of the substrate cutting equipment of Figure 24.

Referring to Figure 24 and Figure 25, substrate diced system 500 comprises: cutting head 510, and its cutting substrate 1 is to form line of cut on substrate 1; Linear motor 520, it raises cutting head 510; Cutting head transmitting portions 530, it transmits cutting head 510 on X-direction; Substrate transfer part 540, it transmits substrate 1 on Y direction; Measure portion 550, it measures the cutting pressure of cutting head 510; And controller 560, it controls above-mentioned parts with electric mode and mechanical system.

Cutting head 510 forms line of cut on the surface of substrate 1, and comprises: raise guider (elevation guide) 511, it is coupled to rod (rod) 511a, and guiding cutting head 510 moves up and down; Tip holder strutting piece 512, it is coupled to raises guider 511, and it can rotate relatively; Tip holder 513, it is connected to tip holder strutting piece 512, and restriction cuts most advanced and sophisticated (the cutter wheel tip) 514 of tool wheel, and the described tool wheel most advanced and sophisticated 514 cut is coupled to tip holder 513 in rotatable mode, and forms line of cut on substrate 1 surface; And carriage 515, it is from raising the side-prominent of guider 511, and uses and following the dynamometer of describing (load cell) 551 is measured cutting pressures.

Raise guider 511 cutting head 510 that when raising, leads and move up and down, hereinafter will describe linear motor 520 by linear motor 520.Therefore, can use normally used linear steering device to implement to raise guider 511.

Tip holder strutting piece 512 supports the tip holder 513 of its below, and is coupled to the lower part of raising guider 511, and described strutting piece can rotate relatively.Therefore, when when forming line of cut on the surface of substrate 1 on X-direction, the blade of cutting tool wheel most advanced and sophisticated 514 points to X-direction.When forming line of cut on the surface of substrate 1 on Y direction, the blade half-twist of cutting tool wheel most advanced and sophisticated 514 is to point to Y direction.

Cut most advanced and sophisticated 514 the surfaces of tool wheel and form line of cut, and be coupled to tip holder 513 in rotatable mode by direct contact substrate 1.That is to say, when cutting tool wheel most advanced and sophisticated 514 and rotate in contact, on the surface of substrate 1, form line of cut by mobile cutting head 510 on surface with substrate 1.

Cut the directly surfaces of contact substrates 1 of tool wheel most advanced and sophisticated 514, make the contact surface generation plastic deformation of substrate 1.When surpassing the critical point of plastic deformation, the direction of pushing at the blade of cutting tool wheel most advanced and sophisticated 514 or on the thickness direction of substrate 1, form the crack.Yet when the power of the blade of cutting tool wheel most advanced and sophisticated 514 of pushing substrate 1 was excessive, the crack can reach capacity, thereby forms on undesirable direction, rather than forms on the thickness direction of substrate 1.That is to say, because the crack is inwardly to form in substrate 1 rather than form on the thickness direction of substrate 1, so the Performance And Reliability of the flat board of semiconductor chip or panel display apparatus can be degenerated.On the contrary, when the power of the blade of cutting tool wheel most advanced and sophisticated 514 of pushing substrate 1 was too small, the crack formed fully inadequately, made and suitably cut in fracture process, thereby make the quality degradation of cutting performance and substrate 1.Therefore, the pressure of cutting tool wheel most advanced and sophisticated 514 by control among the substrate cutting method S500 of Miao Shuing makes it constantly be default reference pressure hereinafter, even also like this during substrate 1 in uneven thickness, make the line of cut degree of depth even, make on the thickness direction of substrate 1, accurately to form line of cut.

Provide carriage 515 in cutting head 510 1 sides, and carriage 515 is along with cutting head 510 moves up and down.Exactly, carriage 515 directly contacts the dynamometer of describing after a while 551, makes dynamometer 551 can measure the falling pressure of cutting head 510.Therefore, as shown in figure 25, carriage 515 is preferably outstanding from cutting head 510, and is arranged in dynamometer 551 tops.In addition, be defined as the cutting pressure of cutting head 510 owing to therefore will push the pressure of the carriage 515 of dynamometer 551, thus carriage 515 must be connected to cutting head 510 by rigid body, and carriage 515 is preferably formed by the material with less strain.

In Figure 24 and Figure 25, carriage 515 is illustrated as to be provided at and raises guider 511 fronts.Yet coupling position is not limited to this, and any position all is possible, as long as carriage 515 raises integratedly with cutting head 510 and the cutting pressure of cutting head 510 is passed to dynamometer 551.

Linear motor 520 is raised cutting head 510 on vertical direction (being Z-direction).That is to say, consider it is in clean room, to make the high-tech equipment that needs high cleanliness and accuracy, so as the assembly that is used on vertical direction (being Z-direction), raising cutting head 510, preferably use linear motor particularly the linear voice coil motor (voice coil motor, VCM).VCM is that a kind of electric power produces equipment (power generating apparatus), and it uses electromagnetic force that motor is moved with linear mode, and described electromagnetic force is to produce by the interaction between the electric current that flows in magnetic force that is produced by magnet and the voice coil loudspeaker voice coil.

When using VCM, can significantly reduce the possibility that produces noise and dust, response speed accelerates, and control becomes easily, and has simplified mechanical structure.Exactly, when the linear motor 520 of raising cutting head 510 is when being formed by VCM, only by the electric current that flows in VCM is controlled, just can be easily and accurately control the cutting pressure of cutting head 510.In addition, because response is very fast, so can accurately form the thickness of line of cut.

Cutting head transmitting portions 530 is transmitted cutting head 510 on X-direction, and can form by driving unit, and described driving unit for example is the linear motor that produces electric power on X-direction.Cutting head transmitting portions 530 is appropriately controlled by controller 560 with substrate transfer part 540 (hereinafter will describe).Therefore, can form on the surface of substrate 1 on the X-direction line of cut and with X-direction on the Y direction of cuts intersect on line of cut.

Substrate transfer part 540 is transmitted substrate 1 on Y direction, and can be by forming by rotating the transfer cylinder 540 of transmitting substrate 1 contiguously with substrate 1.In Figure 24, transfer cylinder only is illustrated as to be provided below the substrate 1.Yet transfer cylinder 540 can be provided at the top and the below of substrate 1, to contact with each other through pushing and to rotate, transmits substrate 1.Yet the present invention is not limited to this, and substrate transfer part 540 can be formed by normally used belt conveyer.

In addition, substrate transfer part 540 can further comprise substrate and grasp unit (not shown), is used to grasp substrate 1, with prevent substrate 1 transmit substrate 1 or in substrate 1, form line of cut during twined or shaken.Substrate grasps unit and is formed by clamp (clamp), and described clamp clamps between substrate 1 or insertion substrate 1 and the transfer cylinder 540 and uses vacuum to grasp the vacuum adsorption plate of substrate 1.Yet this aspect is not limited to this.

Measure portion 550 is measured the cutting pressure of the cutting head of being pushed by linear motor 520 510 downwards, and the cutting pressure of measuring is passed to controller 560.Therefore, measure portion 550 comprises: dynamometer 551, and it is arranged on the descent path of carriage 515 of cutting head 510 with contact carriage 515, and measures the cutting pressure of cutting head 510; And strutting piece 552, it is arranged on the descent path of carriage 551, and supports dynamometer 551.

Measure portion 550 preferably is mounted to the cutting path of substrate 1 spaced a predetermined distance from.That is to say, earlier cutting head 510 is delivered to measure portion 550, and measures and adjust the cutting pressure of cutting head 510 before the cutting work beginning substrate 1 carried out.Then, cutting head 510 is delivered to the cutting path of substrate 1 to begin cutting work.When measure portion 550 being mounted to the cutting path of substrate 1 when spaced a predetermined distance from, the structure of substrate transfer part 540 is also uncomplicated, and measure portion 550 can not disturbed the cutting work of cutting head 510.

Dynamometer 551 contact carriages 515, and the cutting pressure of measurement cutting head 510, and the value that will measure passes to controller 560.Dynamometer 551 is Weight-measuring devices of making in the following manner: (strain gauge) is attached on the metallic elastic body with straingauge, and exports elastomeric deformation rate according to the load of elastomer signal.Therefore, along with cutting head 510 descends, the carriage 515 that is attached to cutting head 510 is pushed the dynamometer 551 that is arranged on the descent path.Then, the elastomeric deformation rate of dynamometer 551 is detected as the signal of telecommunication, and the signal of telecommunication is passed to controller 560 by transducer with the form of analog signal.Because controller 560 comprises the database according to the calculated value in advance of the cutting pressure that detects the signal of telecommunication, so can be by also accurately know the cutting pressure of cutting head 510 fast from dynamometer 551 electrical signal delivered.

The machinery of the above-mentioned parts of controller 560 control and electricity operation, and can be digital signal processor (digital signal processor, DSP), microprocessor, microcontroller or comprise the computer of all described parts.Perhaps, controller 560 can be the software of carrying out substrate cutting method S500 described below, the perhaps recording medium of recording firmware.In addition, controller 560 can be interpreted as notion widely, comprise and to become the analog to digital (analog-to-digital of digital signal from the electrical signal conversion of dynamometer 551 transmission, AD) transducer, perhaps digital signal is converted to digital-to-analog (digital-to-analog, DA) transducer of the signal of telecommunication that is applied to VCM.

To provide detailed description by describing the substrate cutting method S500 of substrate diced system 500 according to another embodiment of the present invention about controller 560.

Figure 26 illustrates the cutting operation of the substrate diced system of Figure 24, and wherein cutting head moves above dynamometer.Figure 27 illustrates the cutting operation of the substrate diced system of Figure 24, and wherein carriage is pushed dynamometer.Figure 28 illustrates the cutting operation of the substrate diced system of Figure 24, wherein cutting head cutting substrate.Figure 29 illustrates the substrate that the substrate diced system of Figure 24 is cut.Figure 30 is the flow chart of substrate cutting method that illustrates the substrate diced system of Figure 24 in regular turn.

Referring to Figure 26 to Figure 30, cutting head transmitting portions 530 (+X) transmit cutting head 510 on the direction of principal axis, make carriage 515 arrive the top of dynamometers 551.When carriage 515 arrives the top of dynamometer 551, apply electric current (S510) to VCM 520.

When VCM 520 applies electric current, cutting head 510 is because the electromagnetic force that is produced by the interaction of magnet and voice coil loudspeaker voice coil descends.When cutting head 510 descends,, make the cutting pressure of cutting head 510 be delivered to dynamometer 551 from the outstanding forward carriage 515 contact dynamometers 551 of cutting head 510.

When carriage 515 when dynamometer 551 is exerted pressure, dynamometer 551 is measured the cutting pressure (S520) of cutting heads 510.That is to say that the elastomer of dynamometer 551 is out of shape because of the pressure of carriage 515, and deformation rate is detected and be delivered to controller 560 as the signal of telecommunication.

Controller 560 searches out from the database of preparing in advance according to the signal of telecommunication corresponding to the cutting pressure value by the dynamometer 551 detected signals of telecommunication, and cutting pressure that searches and the reference pressure of presetting are compared (S530).

When controller 560 compares and find cutting pressure less than reference pressure (N) with the cutting pressure of cutting head 510 and default reference pressure, will be applied to VCM 520 (S540) greater than the electric current of initial current.Improve the cutting pressure of cutting heads 510 greater than the VCM 520 of the electric current of initial current by reception.Dynamometer 551 detects the cutting pressure (S520) that improves once more by carriage 515.Control section 560 compares (S530) with the cutting pressure that remeasures and the reference pressure of cutting head 510.Repeat above-mentioned steps till cutting pressure is identical with reference pressure (Y).

When controller 560 compares and find cutting pressure greater than reference pressure (N) with the cutting pressure of cutting head 510 and default reference pressure, will be applied to VCM 520 (S540) less than the electric current of initial current.Repeat above-mentioned steps, till cutting pressure is identical with reference pressure (Y).

When controller 560 compares and finds that with the cutting pressure of cutting head 510 cutting pressure and reference pressure (Y) are identical with preset reference pressure, controller 560 is stored (S550) with electric current as finally applying electric current, and applies the described electric current that applies to VCM 520 in cutting technique.

After finding to be applied to the electric current of VCM 520, begin to carry out cutting technique about substrate 1 by above-mentioned steps.At first, forming on X-direction on the substrate 1 in the step of cutting, cutting head transmitting portions 530 (X) is being delivered to the top (S560) of cutting initial point 1a (please referring to Figure 29) open of substrate 1 with cutting head 510 from measure portion 550 on the direction of principal axis.Simultaneously, substrate transfer part 540 (Y) is being transmitted substrate 1, is being made the initial point 1a that cuts open of substrate 1 be positioned at cutting head 510 belows on the direction of principal axis.

When cutting head 510 be positioned at substrate 1 cut initial point 1a place open the time, apply electric current (S570) to what VCM 520 applied controller 560 storage.When VCM 520 applies electric current, cutting head 510 descends, and cuts the surface of the most advanced and sophisticated 514 contact substrates 1 of tool wheel.Along with cutting head 510 (X) is moving the surface (S580) of cutting substrate 1 by cutting head transmitting portions 530 on the direction of principal axis.Generally speaking, in the case, cutting head 510 cuts several times repeatedly with identical line of cut, so that accurately form the line of cut of the degree of depth of wanting.X-axis and Y-axis be interpolation in its operation.

When on substrate 1, forming line of cut on the X-direction, substrate transfer part 540 with substrate 1 (+Y) transmit preset distance on the direction of principal axis.Then, cutting head 510 forms new line of cut on the X-axis of substrate 1.

When by repeating above-mentioned steps successively when in X-direction, forming a plurality of line of cut on the substrate 1, form the line of cut on the Y direction with the cuts intersect of X-direction.That is to say that cutting head transmitting portions 530 is transmitted cutting head 510 on X-direction, make it be positioned the new initial point 1b top (S560) of cutting open of substrate 1.Simultaneously, substrate transfer part 540 (Y) is being transmitted substrate 1, is being made the initial point 1b that cuts open of substrate 1 be positioned at cutting head 510 belows on the direction of principal axis.

In the case, tip holder strutting piece 512 makes the blade of cutting tool wheel most advanced and sophisticated 514 point to the direction that is parallel to Y-axis with respect to raising guider 511 half-twists.Then, apply electric current (S570) to what VCM 520 applied that controller 560 stored.

When VCM 520 applies electric current, cutting head 510 descends, and makes to cut the surface that tool wheel most advanced and sophisticated 514 contacts substrates 1.Therefore, substrate transfer part 540 (+Y) transmit substrate 1 on the direction of principal axis, make that the surface of substrate 1 is cut (S580).X-axis and Y-axis be interpolation in its operation.

When the line of cut on the Y-axis that forms substrate 1, cutting head transmitting portions 530 (X) is being transmitted preset distance on the direction of principal axis.Then, when substrate transfer part 540 (+Y) transmit on the direction of principal axis when cutting the substrate 1 that tool wheel most advanced and sophisticated 514 contacted, on the Y-axis of substrate 1, form new line of cut.

When forming a plurality of line of cut by repeating above-mentioned steps successively on the Y-axis of substrate 1, the substrate 1 that is formed with line of cut enters the fracture step, and fragments into a plurality of chips or panel along line of cut.

According to present embodiment,,, make successive substrates fracture step become easily, and can improve the performance and the quality of the fracture of substrate 1 so the degree of depth of the line of cut that forms on the substrate 1 increases because the cutting pressure of cutting head 510 accurately mates default reference pressure.

In addition, because the linear moment of torsion of VCM 520 is directly transferred to cutting head 510, so very fast to the response of linear change in torque.In addition, owing to can be applied to the cutting pressure that electric current is easily controlled cutting head that applies of VCM 520 by control, so can improve the performance of the fracture of substrate 1 largely.

In the above-described embodiments, use single cutting head 510 on the upper surface of substrate 1, to form line of cut.Yet the present invention is not limited to this.Substrate diced system according to another embodiment of the present invention hereinafter will be described.

Figure 31 explanation is according to the structure of the substrate diced system of sixth embodiment of the invention.As shown in figure 31, the difference of present embodiment and the foregoing description is that cutting head 510, cutting head transmitting portions 530 and measure portion 550 all are two two to be provided, and faces each other with respect to substrate 1.That is to say, be provided as two the cutting head 510a and the 510b that face each other with respect to substrate 1 and can on the upper surface of substrate 1 and lower surface, form line of cut.In the case, with the same among the 5th embodiment, before beginning cutting on the surface of substrate 1, the dynamometer 551a and the 551b that provide corresponding with it is provided for last cutting head 510a and following cutting head 510b, and can measures the unlifting pressure of the falling pressure of cutting head 510a and following cutting head 510b and described pressure is controlled to default reference pressure by controller 560.

Use two cutting head 510a and 510b on the upper surface of substrate 1 and lower surface, to form line of cut and can be used for, for example the LCD substrate by making up the combined substrate that two substrates form.That is to say that for combined substrate, when the surperficial and identical cutting head of cutting head cutting cut another surface by the described combined substrate of reversing, the course of work time can prolong, and needs the specific installation (inversion apparatus) of counter-rotating combined substrate.Yet, when using two cutting head 510a and 510b on the upper surface of substrate 1 and lower surface, to carry out cutting work, course of work time decreased, and need not independent inversion apparatus.

In above-mentioned the 3rd embodiment, single large tracts of land initial substrates 1 is cut into three intermediate substrate 5, and each intermediate substrate is cut into four unit substrates 8, thereby form twelve substrate 8 altogether.Yet the present invention is not limited to these numbers, so can suitably adjust intermediate substrate number that passes through the acquisition of cutting large tracts of land initial substrates and the number that passes through the unit substrate 8 of cutting intermediate substrate acquisition according to designing.

In above-mentioned the 3rd embodiment, first cutting module 320 cuts large tracts of land initial substrates 1 on X-direction.Yet first cutting module 320 cuts large tracts of land initial substrates 1 on Y direction be possible.In the case, transmitting portions 340 can be delivered to the intermediate substrate of cutting four-tape formula conveyer 310d and the 5th belt conveyer 310e on X-direction, and need not to rotate under the state that grasps the intermediate substrate through cutting.

In above-mentioned the 4th embodiment, single large tracts of land initial substrates 1 is cut into three intermediate substrate 5, and each intermediate substrate is cut into four unit substrates 8, thereby form twelve substrate 8 altogether.Yet the present invention is not limited to these numbers, so can suitably adjust intermediate substrate number that passes through the acquisition of cutting large tracts of land initial substrates and the number that passes through the unit substrate 8 of cutting intermediate substrate acquisition according to designing.

In above-mentioned the 4th embodiment, first cutting module 420 cuts large tracts of land initial substrates 1 on X-direction.Yet first cutting module 420 cuts large tracts of land initial substrates 1 on Y direction be possible.In the case, transmitting portions 440 can be by rotating grasping under the state of intermediate substrate, and intermediate substrate is delivered to four-tape formula conveyer 410d and the 5th belt conveyer 410e.

Though specifically showed with reference to the preferred embodiments of the present invention and described the present invention, but be understood by those skilled in the art that, can under the situation of the spirit and scope of the present invention that do not depart from appended claims and defined, make the change on various forms and the details therein.

As mentioned above, according to the present invention, can prevent to cause size to increase, and can cut substrate more effectively because of system height increases.In addition, the cutting work of substrate is carried out with online form, therefore can reduce the production time and can further improve productivity ratio.

In addition, according to the present invention, can prevent that the liner part that the IC driver will be installed in the substrate is damaged.In addition, the cutting work of substrate is carried out with online form, therefore can reduce the production time and can further improve productivity ratio.

In addition, according to the present invention, cutting head can cut substrate with default constant cutting pressure, and feasible response to change in torque is better than routine techniques, and its control is easier to, and can improve the execution of substrate cutting.

Claims

1. substrate diced system is characterized in that it comprises:

A plurality of conveyers, it forms active line, in described active line the initial substrates that forms by combination top panel and lower panel is carried out cutting work, and forms predetermined external series gap by separating with at least one zone;

Cutting module, it is installed in the described external series gap, and forms the predetermined cuts line on the described upper surface of described initial substrates and lower surface, and forms a plurality of first unit substrates by cut described initial substrates along described line of cut; And

Pseudo-cutting module, it is arranged in the back of described cutting module along described active line, and cuts and remove pseudo-part remaining in each described first unit substrate;

Wherein said conveyer is that belt conveyer and described cutting module comprise:

Last cutting module, it is provided in the described external series gap above described belt conveyer, and forms line of cut on the described top panel of described initial substrates; And

Following cutting module, it is provided in the described external series gap below described belt conveyer, and under forming on the described lower panel of described initial substrates line of cut.

2. substrate diced system according to claim 1 is characterized in that the wherein said cutting module of going up comprises:

Cross tube, it is fixed along the direction perpendicular to the length direction of described active line; And

Cutter at least one, it is coupled to described cross tube one side, form line of cut on the described top panel of described initial substrates, described initial substrates supports by described belt conveyer and moves, and the described cutter of going up can relatively move on described cross tube.

3. substrate diced system according to claim 2 is characterized in that wherein said cutting module down comprises:

Sheer pole, it is fixed along the direction perpendicular to the length direction of described active line; And

At least one is cutter down, it is coupled to described sheer pole one side, line of cut under forming on the described lower panel of described initial substrates, described initial substrates moves by being supported by described belt conveyer, and described cutter down can relatively move on described sheer pole.

4. substrate diced system according to claim 3, it is characterized in that wherein said cross tube and sheer pole are connected to each other by predetermined coupling part, and by described go up cutter and following cutter respectively form on the described top panel of described initial substrates and the lower panel described on line of cut form identical axis with following line of cut.

5. substrate diced system according to claim 1 is characterized in that it further comprises the fracture module, and it comprises:

A pair of first rail portion, it is arranged in described active line both sides along described active line; And

Heating/cooling segment movably, it is coupled to described first rail portion in a movable manner, and when described active line moves, by heating and cooling between described first rail portion described initial substrates and cut described initial substrates along described line of cut.

6. substrate diced system according to claim 5, it is characterized in that the described pseudo-part of wherein being cut and being removed by described pseudo-cutting module is the pseudo-glass of colored filter (CF), the pseudo-glass of described colored filter (CF) divided by forming the liner part that predetermined IC driver is installed, and is carried out cutting work to upside to described pseudo-part from the downside of the described first unit substrate from unit substrate one sidesway of the formation colored filter (CF) of the described first unit substrate.

7. substrate diced system according to claim 6 is characterized in that wherein said pseudo-cutting module comprises:

Unit platforms, it is from the described first unit substrate of supported underneath, and wherein the top panel as colored filter (CF) is arranged in the bottom, and is arranged in top as the lower panel of thin-film transistor (TFT);

Pseudo-cutter, described pseudo-part is cut in its described bottom from the described first unit substrate that supported by described unit platforms; And

Back-up roller, it is with respect to the opposition side of the described first unit substrate arrangement at described pseudo-cutter, and supports the described first unit substrate.

8. substrate diced system according to claim 6, it is characterized in that it further comprises discharge section, described discharge section is provided at each the below in described fracture module and the described pseudo-cutting module, and can with respect in described fracture module and the described pseudo-cutting module each near and withdrawal, and discharge pseudo-substrate and the described pseudo-part from described initial substrates, cut away.

9. substrate diced system according to claim 7, it is characterized in that it further comprises distributor, described distributor distributes the described first unit substrate that is formed by described fracture module from described initial substrates, and can change the direction of the described first unit substrate on the described unit platforms

Wherein said distributor comprises:

A pair of second rail portion, it is arranged in described active line both sides along described active line;

Movable bar, it is coupled to described second rail portion, and can move along described active line; And

At least one dispensing head, it can move along described movable bar, and described dispensing head is coupled to described movable bar and can rotates relatively with respect to described movable bar, and the described first unit substrate of cutting work is finished in absorption.

10. substrate diced system according to claim 9, it is characterized in that it further comprises the substrate transfer part, described substrate transfer part is provided at described distributor back along described active line, and with described pseudo-part through one second unit substrate transfer of cutting to a cross drive device.

11. substrate diced system according to claim 10 is characterized in that it further comprises inversion device, described inversion device will be delivered to the position counter-rotating of the upper surface of the described second unit substrate and the lower surface of described cross drive device,

Wherein said inversion device comprises:

Reversing shaft; And

A pair of counter-rotating conveyer, it can reverse around described reversing shaft, and adsorbs the described upper surface and the lower surface of the described second unit substrate.

12. substrate diced system according to claim 11 is characterized in that it further comprises the discharge conveyer, described discharge conveyer loads and discharges the described second unit substrate of being finished counter-rotating work by described inversion device.

13. substrate diced system according to claim 12, the described top panel and the lower panel that it is characterized in that wherein originally being input to the described initial substrates of described active line are respectively thin-film transistor (TFT) and colored filter (CF), and are inverted when being discharged by described discharge conveyer.

14. a method that is used to cut substrate is characterized in that described method comprises:

Initial substrates is input to predetermined active line, and described initial substrates forms by combination top panel and lower panel and stands cutting work;

On the described top panel of described initial substrates of input and lower panel, on same axis, form line of cut;

Along described line of cut described initial substrates is cut into a plurality of first unit substrates; And

Cut on each described first unit substrate remaining predetermined pseudo-partly to form the second unit substrate;

Wherein when when on same axis, forming line of cut on the described top panel of described initial substrates of input and the lower panel, be respectively formed at the described top panel of described initial substrates and form identical axis with following line of cut with last line of cut on the lower panel,

When cutting on each described first unit substrate remaining predetermined pseudo-part to upside described pseudo-part is carried out cutting work from the downside of the described first unit substrate when forming the second unit substrate; And

When cutting on each described first unit substrate remaining predetermined pseudo-part when forming the second unit substrate, described pseudo-part is the pseudo-glass of colored filter (CF), the pseudo-glass of described colored filter will be installed the liner part of predetermined IC driver divided by formation from a sidesway of the described first unit substrate

Wherein said method further comprises:

Remaining predetermined pseudo-on each described first unit substrate of cutting partly with after forming the second unit substrate, the position of the upper surface and the lower surface of the described second unit substrate that reverses; And

Discharge the described second unit substrate that the position of described upper surface and lower surface is inverted.