201144243 六、發明說明： 【發明所屬之技術領域】 本發明係關於用於沿著形成於脆性材料基板上之劃線進 行分斷之斷開方法。此處所謂之脆性材料基板包含玻璃、 ' 陶瓷（低溫煅燒陶瓷及高溫煅燒陶瓷）、矽等之半導體材 -料、藍寶石等。又’所要分斷之基板之形態不僅為單板， 亦包含貼合2 >J基板之貼合基板。 【先前技術】 圖8係顯示從先前以來所進行之使用斷開桿分斷面板製 品等之形成有功能膜之玻璃基板之方法之一例的圖。首 先’將基板G載置於劃線裝置之工作台上，使用切割刀輪 W沿著第一面之分斷預定線形成劃線s(圖8(a))。其次，將 基板G載置於斷開裝置之彈性工作台上，從與第一面為相 反側之第二面沿著劃線S之正背面抵住斷開桿F而施加斷開 負荷，藉此左右對稱地施加彎折力矩而斷開（圖8(b))(參照 專利文獻1)。 以斷開桿進行分斷之情形，由於係以較大之負荷將^条 劃線S—舉分斷，故對基板施加之負荷增大，分斷面容易 1 被破壞，且容易變得難以強化端面強度。 _ 又，作為從先前以來所進行之玻璃基板之其他分斷方 法，亦有使用斷開輥之方法。例如如圖9所示，已有在分 斷貼合有2片基板Gl、G2之單元基板之際，預先於單元夷 板之兩側之外側面（第一面及第二面）形成劃線S1、，並 沿著劃線SI、S2壓接輥64而施加斷開負荷之方法。輥μ係 153888.doc 201144243 使用形成有槽63之輥64，以免直接接觸到劃線S1、S2。因 此，輥64係大致均等地按壓劃線S1、S2之左右兩側（參照 專利文獻2)。在輥斷開中，由於係從劃線之一端側向另一 端側依序按壓基板，並對應於按壓部位之移動使龜裂伸 展，故可以較使用斷開桿之情形小之負荷分斷基板，且對 基板施加之負荷亦較斷開桿為小。 如此，無論疋單板還是貼合基板，在分斷基板時均在第 一步驟中形成劃線’在第二步驟中進行斷開。 再者’第一步驟之劃刻一般係進行藉由滾動刀輪而形成 劃線之機械劃刻，或利用雷射照射之加熱與其後之冷卻所 產生之應力差而形成劃線之雷射劃刻等。 [先前技術文獻] [專利文獻] [專利文獻1]曰本特開2004-13 1341號公報 [專利文獻2]國際公開WO2006/129563號公報 【發明内容】 [發明所欲解決之問題] 近年來’為使平面面板用之玻璃基板輕量化，基板材料 之薄板化、硬質化正逐步發展。因此，在劃線形成後將基 板斷開之際，因基板之硬質化之影響會使得分斷面容易被 破壞並產生碎屑’而難以獲得期望之端面強度。又，即使 是普通之玻璃基板，在其板厚較厚（例如1 mm以上）之情形 時，於斷開之際必須以較大之負荷壓抵住斷開桿，故仍舊 容易產生碎屑。 153888.doc 201144243 因此，本發明之其目的在於提供一種使用棍斷開之斷開 方法，且能夠使端面強度較以往更強之斷開方法。 [解決問題之技術手段] 為解決上述問題，本發明講述一種如下所示之技術手 段。即，本發明之脆性材料基板之斷開方法係包含於脆性 材料基板上形成劃線之步驟，與沿著劃線斷開之斷開步驟 者，且在斷開步驟中，使斷開輥在劃線附近沿著在單側與 劃線隔開之位置滾動並壓接，藉此對載置於工作台上之脆 性材料基板施加負荷。 此處，形成劃線之步驟可為壓接切割刀輪之機械劃刻， 亦可為利用雷射照射之熱應力之雷射劃刻。 [發明之效果] 根據本發明’在劃刻步驟t，不僅對劃線之左右兩側均 等地施^斷_所賦予之斷開負冑，亦在劃線之附近僅對 劃線之早側施加斷開負荷’而以弯折的方式進行斷開。 大如此獲件之分斷面反而能夠使端面強度優於以往左右均 等地施加負荷進行分斷之分斷面。 、由之可推淪是由於在斷開輥滾動之際對基板之分 :面施加之振動之影響變小，再者，因斷開輥之邊端與劃 線於水平方向上隔開，㈣使是施加相同之負荷之情形， :板：撓曲量仍較先前般從劃線正上方施加負荷之情形增 可以低負#產生與先前方法同等之撓曲變形。 μ〜過去認為若使施加負荷之位置與劃線隔開，於劃 刻時知加負荷之位置會與劃線偏離而偏向—側，使得分斷 I53888.doc 201144243 T非垂直而成為傾斜（因而對劃線之正方施加負荷以使 刀斷面成為垂直）’然而實際上就分斷之結果發現，要獲 得幾乎垂直之分斷面並不成問題。 在上述發明中’從斷開輥之壓接面端至劃線之距離較佳 為0.5 mm以上2 mm以下。 藉由使從斷開輥之壓接面端至劃線之距離落在上述範圍 内可以較先刖低之負荷及進行分斷，並且可強化端面強 度。 在上述發明中，在斷開步驟中亦可使用含有彈性體層之 工作台。 藉此，在施加斷開負荷時，由於可使基板之撓曲量增 大，從而可以較使用無彈性體層之工作台之情形更低之負 荷進行分斷，並且可使對分斷面所賦予之負荷變小，故可 進一步強化端面強度。 上述發明中亦可為，當脆性材料於劃線之單側形成有製 品區域、而於劃線之另一方之單側形成有端材區域之情形 時，使斷開輥在端材區域側滾動。 藉由在端材區域側進行斷開輥之滾動，可減少因斷開親 之滾動而產生之壓接力導致之製品不良之情形發生。 【實施方式】 以下基於圖式’詳細說明本發明之斷開方法之詳細情 況。 (斷開裝置） 圖1係顯示實施本發明之斷開方法之時所使用之斷開裝 153888.doc •6- 201144243 置丨〇的整體構成圖。於基台丨丨上設置有載置基板G之工作 台12。工作台丨2具備於Y方向移動之γ軸驅動機構13，與 安裝於工作台之了方且旋轉工作台12之工作台旋轉機構 14。於工作台12之上面鋪設有橡膠12a，以便於從上對基 板G施加負荷時使基板容易撓曲。 Y軸驅動機構13包含經由工作台旋轉機構14支撐工作台 12之Y載物台15 ;使γ載物台15於丫方向驅動之線性馬達 16 ;及引導Y方向之運動之線性滑軌丨7。 工作台旋轉機構14係安裝於γ載物台15上’可藉由馬達 (未圖示）於水平面内使工作台丨2旋轉。 又，於基台11上設置有X載物台21及用於使其於X方向 移動之X轴驅動機構22。X軸驅動機構22包含以橫跨工作 台12的方式配置之橋接導執24，與支持其之支柱23。橋接 導軌24具備使X載物台21於X方向驅動之線性馬達（未圖 示）’與引導X方向之運動之線性滑轨25。 其次’說明X載物台21。圖2係顯示X載物台21之構成之 圖。再者，在圖1中雖顯示安裝有覆蓋X載物台21之外側之 外罩的狀態’但在圖2中顯示將外罩拆卸而可看到内部機 " 構之情形。 • 於X載物台21中設置有由線性滑軌25引導之底板3 1，而 於底板31上設置有用於使輥32於z方向移動之z轴驅動機構 33 〇 z轴驅動機構33包含：z載物台34 ;使Z載物台34於Z方 向驅動之滾珠螺桿機構35 ;及引導Z載物台34之Z方向之運 153888.doc 201144243 動之線性滑軌36。 於Z載物台34上安裝有將輥32按壓於基板〇時之加壓機 構的負荷施加汽缸37，而於負荷施加汽缸37之連桿37a上 經由振動致動器38而安裝有輥頭4〇。具體而言，負荷施加 >飞缸37可使用氣缸、伺服馬達、音圈馬達等。 振動致動器38内藏有超磁歪元件，且用於因應需要而賦 予振動者’其作為選用配備而安裝。藉由使振動致動器38 運作’使斷開負荷振動，從而可進行更強之斷開。 負荷施加汽紅37在藉由Z軸驅動機構33調整輥32之高度 後’可調整使輥32按壓基板G之負荷。 圖3係支撐輥32且將振動致動器38之振動傳達至輥32之 輥頭40之剖面圖。輥頭40具有固定振動致動器38之本體部 41 ;自由旋轉地保持輥32之固持器42;將來自振動致動器 38之振動傳達至固持器42之軸43 ;及引導軸43之運動之滑 軌44。於滑軌44與軸43之間配置有鋼珠（未圖示），從而可 使軸43相對於滑軌44平滑地運動》振動致動器38之連桿 38a在連結部45處與轴43螺合》軸43之下端從本體部41突 出而螺合於固持器。 固持器42之下端係被分成2股，藉由支撐輥32之旋轉軸 而自由旋轉地支撐輥32。 圖4係輥32之正視圖及側視圖。輥32成圓柱形狀，且用 以穿過支轴之孔61形成於旋轉中心。輥32之具體尺寸可在 外徑2 mm〜50 mm、厚度0.5 mm〜10 mm之範圍内選擇，且 作為材質為不易對與基板之接觸面造成損傷，故使用聚縮 lS3888.doc 201144243 醛、聚胺基甲酸酯橡膠等之橡膠硬度出為2〇。〜9〇。之 料。 斷開裝置ίο係以電腦系統（未圖㈤予以控制，藉由電腦 系統啟動X軸驅動機構22、Y軸驅動機構13、Z軸驅動機構 33、工作台旋轉機構14 ,進行裝置各部之操作。 (斷開方法） 其次，使用圖式說明使用斷開裝置1〇之斷開方法之—實 施形態。-般而言，將基板於χγ方向斷開之情形時，採 用以下加工順序之任一者：（1)最初進行於X方向與γ方向 形成劃線之交叉劃刻’其後，於χ方向、γ方向進行斷 開；及（2)於X方向形成劃線，其次，進行χ方向之斷開， 將基板分斷成短條狀後，進行γ方向之劃刻，最後進行Υ 方向之斷開。此處’為便於說明，就後者即⑺之加工順序 中X方向之劃刻步驟及斷開步驟進行說明，然而其後之γ 方向之分斷亦是以相同之順序進行斷開。又，（1)之進行交 叉劃刻之情形亦是採用與斷開步驟相同之順序。 圖5係形成有成為所要分斷之面板製品ρι〜ρ6之區域之玻 璃基板Μ(母板）加工前之平面圖及Α·Α，剖面圖。再者，圖 示時為方便起見，將鄰接之面板製品彼此之間之端材區域 描繪成較實際寬度為寬。 玻璃基板Μ具有貼合基板G1與基板G2之構造，且各面板 區域Ρ1〜Ρ6含有成為端子τ之區域。 圖ό係顯示於圖5之玻璃基板]VI上形成劃線時之狀態之平 面圖及Β-Β’剖面圖。為從玻璃基板μ切出面板！》!〜!^，針 153888.doc 201144243 對基板G1側，於成為各面板之端邊之位置形成劃線 S卜S6 〇 劃線Si〜S6可藉由例如使刀輪沿著各面板之端邊移動而 形成。其次，與基板G1相同，亦於基板02形成劃線 S7〜S12。此時，劃線S1與劃線S7、劃線S3與劃線s9、劃 線S5與劃線SI 1係以偏移僅端子τ之寬度位置的方式形成， 以便露出端子τ。再者，劃線S2與劃線S8、劃線S4與劃線 S10、劃線S6與劃線S12係以對向的方式形成。 圖7係顯示使斷開輥32(參照圖1}壓接於圖6中形成有劃 線之玻璃基板Μ時之狀態的平面圖及c_c，剖面圖。 使報32依序壓接於形成有劃線S1〜S6之基板gi ^首先， 在對劃線s 1進行斷開之情形時，將.壓接輥32之位置設為隔 著劃線S1而與面板P1側（圖i中S1之右側）相反側之端材區 域側（圖1中S1之左側），使輥32端來到劃線S1之附近與劃 線S1相隔僅1 mm之距離之位置⑴處。再者，與劃線“之 距離只要為0.5 mm~2 mm左右即可。然後，使輥32平行地 壓接於劃線S1並滾動。藉此，對劃線s丨施加使其彎折分斷 之力。且’由於劃線S1與輥32端之距離相隔1 mm左右（0.5 mm〜2 mm)，故會施加較如先前般於劃線s 1上壓接時更大 之彎折力矩。因此’可以較小之負荷進行分斷，且端面強 度亦提高。 其次’進行對劃線S2斷開時之壓接輥32之位置係設為隔 著劃線S2而與面板P1側（圖1中S2之左側）相反侧之端材區 域側（圖1之S2之右側），使輥32端來到劃線S1之附近與劃 153888.doc •10. 201144243 線S1相隔僅1 mm之距離之位置32處。該情形亦同，與劃 線S2之距離只要為〇·5 mni〜2 mm左右即可。 以下，同樣地，亦使輥32端來到在各端材區域側與劃線 S3〜S6相隔1 mm左右之位置B3〜B6處而對劃線以〜^壓 接。 藉此，可將基板G1沿著劃線s 1〜S6以較先前低之負荷分 斷。 其次，對於基板G2之劃線S7〜S12亦同樣的，使輥32以 低負荷按壓於與面板相反侧且分別與劃線相隔丨mm左右之 位置B7〜B12處。藉此，形成基板⑺、G2兩側之端面。由 於以此方式可使斷開時所施加之斷開負荷變小，故抑制對 端面施加之負荷，於是使得端面強度增強。 又，由於輥32之振動會施加於與劃線隔開之位置，即與 面板側遠離之位置，故抑制振動之影響，於是使得端面強 度增強。 且’進行X方向之斷開後，其次，對於γ方向亦進行相 同之劃刻與斷開，藉此分斷成各面板ρι〜ρ6β 在上述實施形態中，雖已就貼合基板(31與(32之基板進 行說明’但對於單板構造亦同樣可適用本發明。土 [產業上之可利用性] 本發明之斷開方法可使用於將包含玻璃等之脆性材料之 基板沿著劃線進行斷開之際。 【圖式簡單說明】 圖1係顯示用於實施本發明之一實施形態之斷開方法之 153888.doc •11 · 201144243 斷開裝置的整體構成圖。 圖2係顯示圖1之X載物台21之構成之圖。 圖3係圖2之親頭40之剖面圖。 圖4(a)、（b)係顯示圖丄之斷開輥之輥部分之 圖叫、_顯示分斷對象之玻璃基 ^圖。 側之圖 態之 法之 法之 a)、（）係顯示於圖5之基板形成劃線時之狀 圖。 圖7(a)、（b)係顯示劃刻圖6之基板時之狀態之圖。 圖8(a)、（b)係顯示以斷開輥分斷玻璃基板之先前方 一例之圖。 圖9(a) (b)係顯示以斷開輥分斷玻璃基板之先前方 一例之圖。 【主要元件符號說明】 10 斷開裝置 12 工作台 13 Y軸驅動機構 14 工作台旋轉機構 21 X載物台 22 X軸驅動機構 32 輥 33 Z軸驅動機構 37 負荷施加汽紅 38 振動致動器 40 輥頭 153888.doc 201144243 43 軸 44 滑軌 G 基板 S 劃線 153888.doc -13201144243 VI. Description of the Invention: TECHNICAL FIELD OF THE INVENTION The present invention relates to a breaking method for breaking along a scribe line formed on a substrate of a brittle material. Here, the brittle material substrate includes glass, 'ceramics (low-temperature calcined ceramics and high-temperature calcined ceramics), semiconductor materials such as tantalum, sapphire, and the like. Further, the form of the substrate to be separated is not only a single plate but also a bonded substrate to which a 2 > J substrate is bonded. [Prior Art] Fig. 8 is a view showing an example of a method of forming a glass substrate having a functional film formed by breaking a rod-breaking panel product or the like from the prior art. First, the substrate G is placed on a table of the scribing device, and a scribe line s is formed along the predetermined line of the first surface by using the cutter wheel W (Fig. 8(a)). Next, the substrate G is placed on the elastic table of the breaking device, and the disconnecting rod F is applied against the second surface of the opposite side from the first surface against the broken rod F, and the load is applied. This bending force is applied to the left and right symmetry and is broken (Fig. 8(b)) (refer to Patent Document 1). In the case of breaking the rod, the load applied to the substrate is increased due to the large load, so that the load applied to the substrate is increased, the sectional portion is easily broken, and it is easy to become difficult. Strengthen the end face strength. Further, as another method of breaking the glass substrate which has been carried out from the past, there is also a method of using a breaking roller. For example, as shown in FIG. 9, when the unit substrates on which the two substrates G1 and G2 are bonded are separated, the side lines (the first surface and the second surface) on the both sides of the unit panel are formed in advance. S1, and a method of breaking the load by applying a pressure roller 60 along the scribe lines S1 and S2. Roller μ 153888.doc 201144243 The roller 64 formed with the groove 63 is used to avoid direct contact with the scribe lines S1, S2. Therefore, the roller 64 presses the right and left sides of the scribe lines S1 and S2 substantially uniformly (see Patent Document 2). In the case of the roller disconnection, since the substrate is sequentially pressed from one end side to the other end side of the scribing line, and the crack is extended corresponding to the movement of the pressing portion, the substrate can be separated by a load smaller than that in the case of using the disconnecting rod. And the load applied to the substrate is also smaller than that of the break bar. Thus, regardless of whether the substrate is a single substrate or a bonded substrate, the scribe line is formed in the first step when the substrate is separated, and is broken in the second step. Furthermore, the first step of scribing generally involves mechanical scribing by forming a scribing wheel by rolling a scissor wheel, or by using a difference in stress generated by heating of the laser irradiation and subsequent cooling to form a scribing laser. Engraved. [PRIOR ART DOCUMENT] [Patent Document 1] [Patent Document 1] JP-A-2004-13 1341 [Patent Document 2] International Publication No. WO2006/129563 [Summary of the Invention] [Problems to be Solved by the Invention] In order to reduce the weight of the glass substrate for the flat panel, the thinning and hardening of the substrate material are gradually progressing. Therefore, when the substrate is broken after the scribing is formed, the influence of the hardening of the substrate causes the score cross section to be easily broken and debris to be generated, and it is difficult to obtain the desired end face strength. Further, even in the case of a conventional glass substrate, when the thickness is thick (e.g., 1 mm or more), it is necessary to press the break lever with a large load at the time of disconnection, so that chipping is still likely to occur. 153888.doc 201144243 Accordingly, it is an object of the present invention to provide a disconnecting method using a disconnecting method of a stick and capable of making the end face strength stronger than ever. [Technical means for solving the problem] In order to solve the above problems, the present invention describes a technical means as shown below. That is, the method of breaking the brittle material substrate of the present invention comprises the steps of forming a scribe line on the substrate of the brittle material, and the step of breaking off along the scribe line, and in the step of breaking, the breaking roller is The vicinity of the scribe line is rolled and crimped along a position separated from the scribe line on one side, thereby applying a load to the brittle material substrate placed on the table. Here, the step of forming the scribing may be mechanical scribing of the crimping cutter wheel, or laser scribing using thermal stress of laser irradiation. [Effects of the Invention] According to the present invention, in the scribing step t, not only the disconnection 赋予 given by the _ is equally applied to the left and right sides of the scribe line, but also the vicinity of the scribe line only on the early side of the scribe line The breaking load is applied and the opening is performed in a bent manner. In contrast, the cross-section of the obtained piece can make the end face strength superior to that of the conventionally divided load applied to the load. It can be pushed out because the influence of the vibration applied to the surface of the substrate when the roller is broken is small, and the edge of the breaking roller is separated from the scribe line in the horizontal direction, (4) In the case where the same load is applied, the plate: the amount of deflection is still increased as compared with the case where the load is applied directly from the upper side of the scribe line, which may be equivalent to the deflection of the previous method. μ~ In the past, it was considered that if the position where the load was applied was separated from the scribe line, the position at which the load was applied at the time of scribing would deviate from the scribe line and be biased to the side, so that the division was not vertical and became inclined (thus Applying a load to the square of the scribe line to make the section of the knives vertical) However, in fact, as a result of the division, it was found that obtaining a nearly vertical section was not a problem. In the above invention, the distance from the crimping surface end of the breaking roller to the scribing line is preferably 0.5 mm or more and 2 mm or less. By lowering the distance from the crimping end of the breaking roller to the scribe line within the above range, the load can be reduced and the breaking can be performed first, and the end face strength can be enhanced. In the above invention, a table containing an elastomer layer may also be used in the breaking step. Thereby, when the breaking load is applied, since the amount of deflection of the substrate can be increased, it is possible to perform the breaking with a load lower than that of the table using the non-elastic layer, and the sectional portion can be imparted. The load is reduced, so that the end face strength can be further enhanced. In the above invention, when the brittle material is formed with the product region on one side of the scribe line and the end material region is formed on one side of the other side of the scribe line, the break roller is rolled on the side of the end material region. . By performing the rolling of the breaking roller on the side of the end material region, it is possible to reduce the occurrence of defective products due to the crimping force generated by the rolling of the parental contact. [Embodiment] The details of the disconnection method of the present invention will be described in detail below based on the drawings. (Disconnection device) Fig. 1 is a view showing the overall configuration of the disconnecting device 153888.doc • 6- 201144243 which is used when the disconnecting method of the present invention is implemented. A table 12 on which the substrate G is placed is provided on the base. The table 2 includes a γ-axis drive mechanism 13 that moves in the Y direction, and a table rotation mechanism 14 that is attached to the table and rotates the table 12. A rubber 12a is laid on the top of the table 12 to facilitate the deflection of the substrate when a load is applied to the substrate G from above. The Y-axis drive mechanism 13 includes a Y stage 15 that supports the table 12 via the table rotation mechanism 14, a linear motor 16 that drives the gamma stage 15 in the 丫 direction, and a linear slide 丨 7 that guides the movement in the Y direction. . The table rotating mechanism 14 is attached to the gamma stage 15'. The table 丨 2 can be rotated in the horizontal plane by a motor (not shown). Further, the base 11 is provided with an X stage 21 and an X-axis driving mechanism 22 for moving in the X direction. The X-axis drive mechanism 22 includes a bridge guide 24 disposed across the table 12, and a support post 23 therefor. The bridge rail 24 is provided with a linear motor (not shown) that drives the X stage 21 in the X direction and a linear slide 25 that guides the movement in the X direction. Next, the X stage 21 will be described. Fig. 2 is a view showing the configuration of the X stage 21. Further, in Fig. 1, the state in which the outer cover covering the outer side of the X stage 21 is attached is shown. However, in Fig. 2, the case where the outer cover is removed and the internal mechanism is visible is shown. • A bottom plate 3 1 guided by a linear slide rail 25 is disposed in the X stage 21, and a z-axis drive mechanism 33 for moving the roller 32 in the z direction is disposed on the bottom plate 31. The z-axis drive mechanism 33 includes: z stage 34; a ball screw mechanism 35 that drives the Z stage 34 in the Z direction; and a linear slide 36 that guides the Z stage of the Z stage 34. A load applying cylinder 37 of a pressurizing mechanism for pressing the roller 32 against the substrate 安装 is attached to the Z stage 34, and a roller head 4 is attached to the link 37a of the load applying cylinder 37 via a vibration actuator 38. Hey. Specifically, the load application > the flying cylinder 37 can use an air cylinder, a servo motor, a voice coil motor, or the like. The vibration actuator 38 incorporates a super-magnetic element and is used to impart vibration to the user as needed. By causing the vibration actuator 38 to operate to cause the breaking load to vibrate, a stronger disconnection can be performed. The load application steam red 37 adjusts the load of the roller 32 against the substrate G after the height of the roller 32 is adjusted by the Z-axis drive mechanism 33. 3 is a cross-sectional view of the roller head 40 which supports the roller 32 and transmits the vibration of the vibration actuator 38 to the roller 32. The roller head 40 has a body portion 41 that fixes the vibration actuator 38; a holder 42 that rotatably holds the roller 32; a shaft 43 that transmits vibration from the vibration actuator 38 to the holder 42; and movement of the guide shaft 43 Slide rail 44. A steel ball (not shown) is disposed between the slide rail 44 and the shaft 43, so that the shaft 43 can be smoothly moved relative to the slide rail 44. The link 38a of the vibration actuator 38 is screwed to the shaft 43 at the joint portion 45. The lower end of the shaft 43 protrudes from the body portion 41 and is screwed to the holder. The lower end of the holder 42 is divided into two, and the roller 32 is rotatably supported by the rotation shaft of the support roller 32. 4 is a front view and a side view of the roller 32. The roller 32 has a cylindrical shape and is formed at the center of rotation by a hole 61 passing through the fulcrum. The specific size of the roller 32 can be selected within an outer diameter of 2 mm to 50 mm and a thickness of 0.5 mm to 10 mm, and the material is not easy to damage the contact surface with the substrate, so the polycondensation is used. The rubber hardness of the urethane rubber or the like is 2 Å. ~9〇. The material. The disconnecting device ίο is controlled by a computer system (not shown in Fig. 5), and the X-axis driving mechanism 22, the Y-axis driving mechanism 13, the Z-axis driving mechanism 33, and the table rotating mechanism 14 are activated by the computer system to operate the respective parts of the apparatus. (Disconnection method) Next, an embodiment in which the breaking method of the breaking device 1 is used will be described with reference to the drawings. In general, when the substrate is disconnected in the χγ direction, any of the following processing sequences is employed. (1) initially intersecting the scribe line in the X direction and the γ direction, and then breaking in the χ direction and the γ direction; and (2) forming a scribe line in the X direction, and secondly, performing the χ direction After breaking, the substrate is divided into short strips, and then the γ direction is scribed, and finally the Υ direction is broken. Here, for convenience of explanation, the latter is the step of engraving in the X direction in the processing sequence of (7) and The disconnection step is explained, but the subsequent division of the γ direction is also performed in the same order. Further, the case of cross-cutting in (1) is also in the same order as the disconnection step. Formed into a panel to be broken Plane and Α·Α, cross-sectional view of the glass substrate 母 (motherboard) in the area of the product ρι to ρ6. Further, for the sake of convenience, the end material regions of the adjacent panel products are depicted for convenience. The glass substrate Μ has a structure in which the substrate G1 and the substrate G2 are bonded, and each of the panel regions Ρ1 to Ρ6 includes a region to be the terminal τ. The figure is shown on the glass substrate of FIG. The plan view of the state of the line and the Β-Β' section view. The panel is cut out from the glass substrate μ!!!~!^, pin 153888.doc 201144243 On the side of the substrate G1, the position is formed at the end of each panel. The line Sb S6 〇 SiSi to S6 can be formed by, for example, moving the cutter wheel along the edge of each panel. Secondly, similarly to the substrate G1, the scribe lines S7 to S12 are also formed on the substrate 02. The line S1 and the scribe line S7, the scribe line S3 and the scribe line s9, the scribe line S5, and the scribe line SI1 are formed so as to be offset from the width position of only the terminal τ so as to expose the terminal τ. Further, the scribe line S2 and the scribe line S2 The line S8, the scribe line S4, the scribe line S10, the scribe line S6, and the scribe line S12 are formed to face each other. A plan view and a c_c cross-sectional view showing a state in which the break roller 32 (see Fig. 1) is pressed against the glass substrate 形成 in which the scribe line is formed in Fig. 6 is shown. The report 32 is sequentially pressed against the scribe line S1. Substrate gi ^ of S6 ^ First, when the scribe line s 1 is broken, the position of the pressure roller 32 is opposite to the side of the panel P1 (the right side of S1 in Fig. i) via the scribe line S1 On the side of the side end region (on the left side of S1 in Fig. 1), the end of the roller 32 is brought to a position (1) at a distance of only 1 mm from the scribe line S1 in the vicinity of the scribe line S1. Further, the distance from the scribe line It suffices to be about 0.5 mm to 2 mm. Then, the roller 32 is pressed in parallel to the scribe line S1 and rolled. Thereby, the force of the bending and breaking is applied to the scribe line s. And since the distance between the scribe line S1 and the end of the roller 32 is about 1 mm (0.5 mm to 2 mm), a bending moment larger than that when the pressure is applied to the scribe line 1 as before is applied. Therefore, the breaking can be performed with a small load, and the end face strength is also increased. Next, the position of the pressure roller 32 when the scribe line S2 is broken is the side of the end material region on the side opposite to the panel P1 side (the left side of S2 in Fig. 1) via the scribe line S2 (S2 of Fig. 1). On the right side, the end of the roller 32 is brought to the vicinity of the scribe line S1 at a position 32 apart from the line 153888.doc •10. 201144243 line S1 by a distance of only 1 mm. In this case, the distance from the line S2 may be about m·5 mni to 2 mm. Similarly, in the same manner, the end of the roller 32 is brought to a position B3 to B6 which is spaced apart from the scribe lines S3 to S6 by about 1 mm on each side of the end material region, and the scribe line is pressed by 〜. Thereby, the substrate G1 can be divided along the scribe lines s 1 to S6 at a lower load than before. Next, similarly to the scribe lines S7 to S12 of the substrate G2, the roller 32 is pressed at a position B7 to B12 which is opposite to the panel and spaced apart from the scribe line by about 丨mm with a low load. Thereby, the end faces on both sides of the substrate (7) and G2 are formed. Since the breaking load applied at the time of disconnection can be made small in this way, the load applied to the end face is suppressed, so that the end face strength is enhanced. Further, since the vibration of the roller 32 is applied to a position spaced apart from the scribe line, i.e., away from the panel side, the influence of the vibration is suppressed, so that the end face strength is enhanced. And after the X-direction is turned off, the γ direction is also scribed and broken in the same manner, thereby dividing into the respective panels ρι to ρ6β. In the above embodiment, the substrate (31 and (The substrate of 32 is explained. However, the present invention is also applicable to the single-plate structure. Soil [Industrial Applicability] The breaking method of the present invention can be used to scribe a substrate containing a brittle material such as glass. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a view showing the overall configuration of a disconnecting device for performing a disconnecting method according to an embodiment of the present invention. Fig. 2 is a view showing the structure of the disconnecting device. Fig. 3 is a cross-sectional view of the pro-head 40 of Fig. 2. Fig. 4(a) and (b) are diagrams showing the roller portion of the breaking roller of Fig. 2, _ The glass base of the object to be cut is displayed. The method of the method of the side view is a), () is shown in the figure when the substrate of FIG. 5 is formed by scribing. Fig. 7 (a), (b) shows A diagram showing the state of the substrate of Fig. 6. Fig. 8 (a) and (b) show an example of the prior art in which the glass substrate is separated by a break roller. Fig. 9(a) and Fig. 9(b) are diagrams showing an example of the prior art in which the glass substrate is broken by the breaking roller. [Description of main components] 10 Disconnecting device 12 Table 13 Y-axis driving mechanism 14 Table rotating mechanism 21 X stage 22 X-axis drive mechanism 32 Roller 33 Z-axis drive mechanism 37 Load application of steam red 38 Vibration actuator 40 Roller head 153888.doc 201144243 43 Shaft 44 Slide rail G Substrate S Line 153888.doc -13