TWI426059B - Method for disassembling brittle material substrates - Google Patents

Description

Method for breaking brittle material substrate

The present invention relates to a method of breaking for breaking along a scribe line formed on a substrate of a brittle material. Here, the brittle material substrate includes glass, ceramics (low-temperature calcined ceramics and high-temperature calcined ceramics), semiconductor materials such as tantalum, sapphire, and the like. Further, the form of the substrate to be separated is not only a single plate but also a bonded substrate on which two substrates are bonded.

Fig. 8 is a view showing an example of a method of forming a glass substrate having a functional film by using a break lever to cut a panel product or the like. First, the substrate G is placed on the table of the scribing device, and the scribing line S is formed along the predetermined line of the first surface using the cutter wheel W (Fig. 8(a)). Next, the substrate G is placed on the elastic table of the breaking device, and the disconnecting rod F is applied against the second surface of the opposite side from the first surface against the broken rod F, and the load is applied. This bending force is applied to the left and right symmetry and is broken (Fig. 8(b)) (refer to Patent Document 1).

In the case where the disconnecting rod is broken, since one scribing S is divided by one load with a large load, the load applied to the substrate is increased, the sectional section is easily broken, and it is easy to become difficult to strengthen the end surface. strength.

Further, as another method of breaking the glass substrate which has been performed from the past, there is also a method of using a break roller. For example, as shown in FIG. 9, when the unit substrates on which the two substrates G1 and G2 are bonded are separated, the scribe lines S1 are formed on the outer surfaces (the first surface and the second surface) on both sides of the unit substrate. And S2, and a method of breaking the load by applying the pressure roller 64 along the scribe lines S1 and S2. The roller 64 uses a roller 64 formed with a groove 63 so as not to directly contact the scribe lines S1, S2. Therefore, the roller 64 presses the right and left sides of the scribe lines S1 and S2 substantially uniformly (see Patent Document 2). In the case of the roller disconnection, since the substrate is sequentially pressed from one end side to the other end side of the scribing line, and the crack is extended corresponding to the movement of the pressing portion, the substrate can be separated by a load smaller than that in the case of using the disconnecting rod. And the load applied to the substrate is also smaller than that of the break bar.

Thus, regardless of whether the board is a single board or a bonded substrate, the scribe line is formed in the first step when the board is separated, and the scribe line is broken in the second step.

Furthermore, the first step of scribing generally involves mechanical scribing by forming a scribing wheel by rolling the scissor wheel, or using a difference in stress generated by heating of the laser irradiation and subsequent cooling to form a scribing laser. Engraved.

[Previous Technical Literature] [Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open Publication No. 2004-131341

[Patent Document 2] International Publication WO2006/129563

In recent years, in order to reduce the weight of the glass substrate for a flat panel, the thinning and hardening of the substrate material are gradually progressing. Therefore, when the substrate is broken after the scribe line is formed, the score cross section is easily broken and debris is generated due to the influence of the hardening of the substrate, and it is difficult to obtain the desired end face strength. Further, even in the case of a conventional glass substrate having a thick plate thickness (for example, 1 mm or more), it is necessary to press the break bar with a large load at the time of disconnection, so that chipping is still likely to occur.

Accordingly, it is an object of the present invention to provide a disconnecting method which uses a method of breaking a roller and which is capable of making the end face strength stronger than ever.

In order to solve the above problems, the present invention describes a technical means as shown below. That is, the method of breaking the brittle material substrate of the present invention comprises the steps of forming a scribe line on the substrate of the brittle material, and the step of breaking off along the scribe line, and in the step of breaking, the breaking roller is The vicinity of the scribe line is rolled and crimped along a position separated from the scribe line on one side, thereby applying a load to the brittle material substrate placed on the table.

Here, the step of forming the scribing may be mechanical scribing of the crimping cutter wheel, or laser scribing using thermal stress of laser irradiation.

According to the present invention, in the scribing step, not only the breaking load imparted by the breaking roller is equally applied to the left and right sides of the scribing line, but also the breaking load is applied to only one side of the scribing line in the vicinity of the scribing line. Disconnect in a bent manner.

The cross-section obtained in this way can make the end face strength superior to the conventional cross-section in which the load is equally applied to the left and right.

One of the reasons can be inferred that the influence of the vibration applied to the cross-section of the substrate becomes small at the time of the rolling of the breaking roller, and further, since the edge of the breaking roller is spaced apart from the scribe line in the horizontal direction, Even in the case where the same load is applied, the amount of deflection of the substrate is increased as compared with the case where the load is applied directly from the scribe line as before, and therefore, the deflection deformation equivalent to the previous method can be generated with a low load.

Furthermore, it has been thought in the past that if the position at which the load is applied is separated from the scribe line, the position at which the load is applied at the time of scribe will deviate from the scribe line and be biased to one side, so that the section is not perpendicular and becomes inclined (thus The load is applied directly above to make the section into a vertical direction. However, in fact, as a result of the division, it is found that obtaining a nearly vertical section is not a problem.

In the above invention, the distance from the pressure contact surface end of the breaking roller to the scribe line is preferably 0.5 mm or more and 2 mm or less.

By dropping the distance from the crimping end of the breaking roller to the scribe line within the above range, it is possible to perform the breaking and the breaking of the previous lower load, and the strength of the end face can be enhanced.

In the above invention, a table containing an elastomer layer may also be used in the breaking step.

Thereby, when the breaking load is applied, since the amount of deflection of the substrate can be increased, it is possible to perform the breaking with a load lower than that of the table using the non-elastic layer, and the sectional portion can be imparted. The load is reduced, so that the end face strength can be further enhanced.

In the above invention, when the brittle material is formed with the product region on one side of the scribe line and the end material region is formed on one side of the other side of the scribe line, the break roller is rolled on the side of the end material region. .

By performing the rolling of the breaking roller on the side of the end material region, it is possible to reduce the occurrence of defective products due to the crimping force generated by the rolling of the breaking roller.

The details of the disconnection method of the present invention will be described in detail below based on the drawings.

(disconnect device)

Fig. 1 is a view showing the overall configuration of a breaking device 10 used when the breaking method of the present invention is carried out. A stage 12 on which the substrate G is placed is provided on the base 11 . The table 12 includes a Y-axis drive mechanism 13 that moves in the Y direction, and a table rotation mechanism 14 that is mounted below the table 12 and that rotates the table 12. A rubber 12a is laid on the top of the table 12 to facilitate the deflection of the substrate when a load is applied to the substrate G from above.

The Y-axis drive mechanism 13 includes a Y stage 15 that supports the table 12 via the table rotation mechanism 14, a linear motor 16 that drives the Y stage 15 in the Y direction, and a linear slide 17 that guides the movement in the Y direction.

The table rotation mechanism 14 is attached to the Y stage 15, and the table 12 can be rotated in a horizontal plane by a motor (not shown).

Further, the base stage 11 is provided with an X stage 21 and an X-axis drive mechanism 22 for moving in the X direction. The X-axis drive mechanism 22 includes a bridge rail 24 disposed across the table 12 and a support post 23 therefor. The bridge rail 24 includes a linear motor (not shown) that drives the X stage 21 in the X direction, and a linear slide 25 that guides the movement in the X direction.

Next, the X stage 21 will be described. Fig. 2 is a view showing the configuration of the X stage 21. 1 shows a state in which a cover covering the outer side of the X stage 21 is attached, but FIG. 2 shows a case where the cover is detached and the internal mechanism can be seen.

A bottom plate 31 guided by a linear slide rail 25 is provided in the X stage 21, and a Z-axis drive mechanism 33 for moving the roller 32 in the Z direction is provided on the bottom plate 31.

The Z-axis drive mechanism 33 includes a Z stage 34, a ball screw mechanism 35 that drives the Z stage 34 in the Z direction, and a linear slide 36 that guides the movement of the Z stage 34 in the Z direction.

A load applying cylinder 37 of a pressurizing mechanism for pressing the roller 32 against the substrate G is attached to the Z stage 34, and a roller head 40 is attached to the link 37a of the load applying cylinder 37 via a vibration actuator 38. . Specifically, the load applying cylinder 37 can use a cylinder, a servo motor, a voice coil motor, or the like.

The vibration actuator 38 houses a super-magnetic element and is used to impart vibration to the user as needed, and is installed as an optional device. By operating the vibration actuator 38, the breaking load is vibrated, so that a stronger disconnection can be performed.

After the load applying cylinder 37 adjusts the height of the roller 32 by the Z-axis driving mechanism 33, the load for pressing the roller 32 against the substrate G can be adjusted.

3 is a cross-sectional view of the roller head 40 that supports the roller 32 and transmits the vibration of the vibration actuator 38 to the roller 32. The roller head 40 has a body portion 41 that fixes the vibration actuator 38; a holder 42 that rotatably holds the roller 32; a shaft 43 that transmits vibration from the vibration actuator 38 to the holder 42; and movement of the guide shaft 43 Slide rail 44. A steel ball (not shown) is disposed between the slide rail 44 and the shaft 43, so that the shaft 43 can be smoothly moved relative to the slide rail 44. The link 38a of the vibration actuator 38 is screwed to the shaft 43 at the joint portion 45. The lower end of the shaft 43 protrudes from the body portion 41 and is screwed to the holder.

The lower end of the holder 42 is divided into two, and the roller 32 is rotatably supported by the rotation shaft of the support roller 32.

4 is a front view and a side view of the roller 32. The roller 32 has a cylindrical shape and is formed at a center of rotation through a hole 61 through the fulcrum. The specific size of the roller 32 can be selected from the range of 2 mm to 50 mm in outer diameter and 0.5 mm to 10 mm in thickness, and the material is not easy to damage the contact surface with the substrate, so polyacetal or polyurethane is used. A rubber such as an ester rubber has a hardness Hs of 20° to 90°.

The disconnecting device 10 is controlled by a computer system (not shown), and the X-axis driving mechanism 22, the Y-axis driving mechanism 13, the Z-axis driving mechanism 33, and the table rotating mechanism 14 are activated by the computer system to perform operations of the respective devices. .

(disconnection method)

Next, an embodiment of the disconnection method using the disconnecting device 10 will be described using a schematic diagram. In general, when the substrate is broken in the XY direction, any of the following processing sequences is employed: (1) initially, a cross-hatching is formed in the X direction and the Y direction, and thereafter, in the X direction, The Y direction is broken; and (2) the scribe line is formed in the X direction, and then the X direction is broken, the substrate is divided into short strips, the Y direction is scribed, and finally the Y direction is broken. . Here, for convenience of explanation, the latter will be described in the X-direction scribing step and the disconnecting step in the processing sequence of (2), but the subsequent Y-direction breaking is also performed in the same order. Further, the case where the cross-cut is performed in (1) is also in the same order as the disconnection step.

Fig. 5 is a plan view and a cross-sectional view taken along line A-A' of the glass substrate M (motherboard) on which the panel products P1 to P6 to be cut are formed. Further, for convenience, the end plate regions of adjacent panel products are depicted as being wider than the actual width for convenience.

The glass substrate M has a structure in which the substrate G1 and the substrate G2 are bonded, and each of the panel regions P1 to P6 includes a region to be the terminal T.

Fig. 6 is a plan view and a BB' cross-sectional view showing a state in which a scribe line is formed on the glass substrate M of Fig. 5. In order to cut out the panels P1 to P6 from the glass substrate M, the scribe lines S1 to S6 are formed on the substrate G1 side at the positions of the end sides of the respective panels.

The scribe lines S1 to S6 can be formed by, for example, moving the cutter wheel along the end sides of the respective panels. Next, similarly to the substrate G1, the scribe lines S7 to S12 are also formed on the substrate G2. At this time, the scribe line S1 and the scribe line S7, the scribe line S3 and the scribe line S9, the scribe line S5, and the scribe line S11 are formed so as to be offset from the width position of only the terminal T so as to expose the terminal T. Further, the scribe line S2 and the scribe line S8, the scribe line S4 and the scribe line S10, and the scribe line S6 and the scribe line S12 are formed to face each other.

Fig. 7 is a plan view and a cross-sectional view taken along line C-C' showing a state in which the breaking roller 32 (see Fig. 1) is pressure-bonded to the glass substrate M on which the scribe line is formed in Fig. 6.

The roller 32 is sequentially pressed against the substrate G1 on which the scribe lines S1 to S6 are formed. First, when the scribe line S1 is broken, the position of the pressure roller 32 is the side of the end material region on the side opposite to the panel P1 side (the right side of S1 in Fig. 1) via the scribe line S1 (Fig. 1 on the left side of S1), the end of the roller 32 is brought to a position B1 at a distance of only 1 mm from the scribe line S1 in the vicinity of the scribe line S1. Furthermore, the distance from the scribe line S1 may be about 0.5 mm to 2 mm. Then, the roller 32 is pressed in parallel to the scribe line S1 and rolled. Thereby, the line S1 is applied with a force to break it. Further, since the distance between the scribe line S1 and the end of the roller 32 is about 1 mm (0.5 mm to 2 mm), a bending moment larger than that when previously crimped on the scribe line S1 is applied. Therefore, the breaking can be performed with a small load, and the end face strength is also improved.

Next, the position of the pressure roller 32 when the scribe line S2 is broken is the side of the end material region on the side opposite to the side of the panel P1 (the left side of S2 in Fig. 1) via the scribe line S2 (S2 of Fig. 1) On the right side), the end of the roller 32 is brought to a position B2 at a distance of only 1 mm from the scribe line S1 in the vicinity of the scribe line S1. In this case, the distance from the scribing line S2 may be about 0.5 mm to 2 mm.

Similarly, in the same manner, the end of the roller 32 is brought into pressure at the positions B3 to B6 which are spaced apart from the scribe lines S3 to S6 by about 1 mm on the respective end material region sides, and is pressed against the scribe lines S3 to S6.

Thereby, the substrate G1 can be broken along the scribe lines S1 to S6 with a lower load than before.

Next, similarly to the scribe lines S7 to S12 of the substrate G2, the roller 32 is pressed at a position B7 to B12 which is opposite to the panel and spaced apart from the scribe line by about 1 mm with a low load. Thereby, the end faces on both sides of the substrates G1 and G2 are formed. Since the breaking load applied at the time of disconnection can be made small in this way, the load applied to the end faces is suppressed, so that the end face strength is enhanced.

Further, since the vibration of the roller 32 is applied to a position spaced apart from the scribe line, that is, a position away from the panel side, the influence of the vibration is suppressed, so that the end surface strength is enhanced.

Then, after the X direction is turned off, the Y direction is also similarly scribed and broken, thereby dividing into the panels P1 to P6.

In the above embodiment, the substrate to which the substrates G1 and G2 are bonded is described. However, the present invention is also applicable to the single-plate structure.

[Industrial availability]

The breaking method of the present invention can be used to break a substrate containing a brittle material such as glass along a scribe line.

10. . . Disconnect device

12. . . Workbench

13. . . Y-axis drive mechanism

14. . . Table rotation mechanism

twenty one. . . X stage

twenty two. . . X-axis drive mechanism

32. . . Roll

33. . . Z-axis drive mechanism

37. . . Load application cylinder

38. . . Vibration actuator

40. . . Roll head

43. . . axis

44. . . Slide rail

G. . . Substrate

S. . . Cross-line

Fig. 1 is a view showing the overall configuration of a breaking device for carrying out a breaking method according to an embodiment of the present invention.

Fig. 2 is a view showing the configuration of the X stage 21 of Fig. 1.

Figure 3 is a cross-sectional view of the roller head 40 of Figure 2.

4(a) and 4(b) are views showing the configuration of the roller portion of the breaking roller of Fig. 1.

5(a) and 5(b) are views showing one side of the glass substrate of the object to be separated.

6(a) and 6(b) are views showing a state in which the substrate of Fig. 5 is formed with a scribe line.

7(a) and 7(b) are views showing a state in which the substrate of Fig. 6 is scribed.

8(a) and 8(b) are views showing an example of a prior art method of dividing a glass substrate by a break roller.

Fig. 9 (a) and (b) are views showing an example of a prior art method of dividing a glass substrate by a break roller.

32. . . Roll

G1, G2. . . Substrate

S1~S12. . . Cross-line

Claims (4)

A method for breaking a substrate of a brittle material, characterized in that it comprises a step of forming a scribe line on a substrate of a brittle material, and a step of breaking off along the scribe line, and in the step of disconnecting, breaking The opening roller is rolled and crimped at a position separated from the scribe line on one side in the vicinity of the scribe line, thereby applying a load to the brittle material substrate placed on the table. The breaking method of the brittle material substrate according to claim 1, wherein the distance between the pressing surface of the breaking roller and the scribe line is 0.5 mm or more and 2 mm or less. A method of breaking a brittle material substrate according to claim 1 or 2, which uses a table containing an elastomer layer in the above-described breaking step. The method for breaking a brittle material substrate according to claim 1, wherein when the brittle material is formed with a product region on one side of the scribe line and an end material region is formed on one side of the other side of the scribe line, The open roll rolls on the side of the end material area.